Saw-toothed electroplated diamond grinding tool

Through the design of serrated electroplated diamond abrasives, the problems of deterioration of sharpness and difficulty in processing complex shapes of existing abrasives are solved, and efficient and long-lasting grinding performance and optimized cooling chip removal effects are achieved.

WO2025044793A1PCT designated stage expired Publication Date: 2025-03-06GUILIN GRIND-ACAD MATERIAL TECH CO LTD +1
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Patent Information

Application Number
PCT/CN2024/112628
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-08-28
Filing Date
2024-08-16
Publication Date
2025-03-06

AI Technical Summary

Technical Problem

The sharpness of existing electroplated diamond abrasives decreases during use, requiring increased pressure to maintain efficiency, but this will increase the power requirements of the equipment and workpiece strength requirements, and the brazing process in complex shapes is difficult to achieve.

Method used

The serrated electroplated diamond abrasives are adopted to improve the self-sharpness and life of the abrasives through the design of the serrated matrix and a single-layer diamond layer, and internal cooling and optimize chip removal are achieved through the water tank through the teeth.

Benefits of technology

It improves the sharpness and life of the abrasive tool, optimizes the cooling effect and chip removal performance during grinding, reduces manufacturing costs, and is suitable for processing in complex shapes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the technical field of diamond cutting grinding tools, and in particular to a saw-toothed electroplated diamond grinding tool, comprising: a grinding tool body and a holding member. The grinding tool body is mounted on the holding member; the grinding tool body is formed by at least one saw-toothed base body; the saw-toothed surfaces of each base body are inclined surfaces; the inclined surfaces are plated with diamond layers; the diamond layers are single layers in the normal direction of the inclined surfaces; the areas, where diamond particles are to be plated, on the inclined surfaces are electroplated layers; the diamond particles in the diamond layers are coated and plated in the electroplated layers; a groove is formed between every two adjacent sawteeth on each base body, and the plurality of grooves in each layer of base body and the plurality of grooves in an adjacent layer of base body are assembled and communicated to form a tooth sheet water passing groove. According to the present invention, grinding tools can be prefabricated, and meet different requirements by means of combination and assembly, the process of manufacturing grinding tools by electroplating is simplified, and some of brazing process diamond grinding tools and powder metallurgy process diamond grinding tools are replaced.
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Description

A serrated electroplated diamond grinding tool Technical Field

[0001] The invention relates to the technical field of diamond cutting abrasive tools, in particular to a serrated electroplated diamond abrasive tool. Background Art

[0002] Electroplated diamond abrasives are typically single-layer surface-mounted (characterized by the diamond working layer, where all diamonds are located on the same rotating working surface, working together). This means the thickness of the electroplated metal layer is smaller than the diamond particle size, with the diamond particles being less than half the particle size located on the same rotating working surface. Initially, the sharpness of the diamond particles is extremely high due to their sharp corners. However, as the diamond particles wear and become blunt, the contact surface between the diamond particles and the workpiece increases exponentially. At this point, the pressure required to grind and engrave the workpiece material increases significantly. Otherwise, the required pressure decreases significantly, resulting in a quadratic decrease in the sharpness of the abrasive. However, increasing the pressure requires increased equipment power and sufficient workpiece strength; otherwise, the abrasive will fail. Brazed single-layer diamond tools also face similar issues, and the brazing process is complex for complex shapes. Diamond abrasives made from powder metallurgy sintering are unlikely to surpass electroplated diamond tools in sharpness.

[0003] Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a serrated electroplated diamond grinding tool to solve the above problems.

[0005] The technical solution of the present invention to solve the above technical problems is as follows: a serrated electroplated diamond grinding tool, comprising: a grinding tool body and a holding piece, the grinding tool body is installed on the holding piece, the grinding tool body is composed of at least one serrated substrate, the serrated surface of the substrate is a bevel, the bevel is plated with a diamond layer, the diamond layer is arranged in a single layer in the normal direction of the bevel, the area on the bevel where diamond particles are to be plated is an electroplating layer, the diamond particles in the diamond layer are wrapped and plated in the electroplating layer, and in the normal direction of the bevel, the thickness of the electroplating layer is greater than the particle size of the diamond particles; when the grinding tool body is composed of a plurality of the substrates stacked together, a groove is formed between two adjacent serrations on the substrate, and the plurality of grooves on each layer of the substrate are spliced ​​and connected with the plurality of grooves on the adjacent layer of the substrate to form a tooth plate water trough.

[0006] The beneficial effects of the present invention are as follows: the serrated base is conducive to achieving intermittent grinding and optimizing chip removal, the single-layer diamond layer is conducive to improving the self-sharpening property of the diamond layer, the diamond particles are coated and plated in the electroplating layer, and the thickness of the electroplating layer is greater than the particle size of the diamond particles, which is conducive to ensuring the electroplating layer's grip on the diamond particles and improving the life of the diamond, and the tooth plate water groove is conducive to establishing an internal cooling method, optimizing the cooling effect during grinding, and this structure also constitutes a good chip removal effect. The present invention can prefabricate components and meet the different needs of abrasive tools and sawing tools on the market through a combined assembly method, making the abrasive tools suitable for efficient processing and optimizing processing quality. At the same time, it can partially replace brazed diamond abrasive tools and powder metallurgy diamond abrasive tools, improving sharpness and life, and reducing manufacturing costs.

[0007] On the basis of the above technical solution, the present invention can also be improved as follows.

[0008] Furthermore, on the inclined surface of a single saw tooth of the base, the difference between two points arbitrarily spaced one times the diameter of the diamond particles along the rotation direction and the consumption direction when the grinding tool is working is greater than or equal to one quarter of the diameter of the diamond particles and less than or equal to one half of the diameter of the diamond particles.

[0009] The beneficial effect of adopting the above further solution is that it is conducive to adjusting the grinding tool to have stable self-sharpening performance, life and sharpness.

[0010] Furthermore, when the grinding tool body is a substrate, the diamond particles are arranged in a single row or multiple rows or a single row cross arrangement or multiple rows cross arrangement in the axial direction of the inclined surface, and in the axial direction of the inclined surface, the axial arrangement width of the diamond particles in each row is greater than one times the particle size of the diamond particles and less than two times the particle size of the diamond particles.

[0011] The beneficial effects of adopting the above further scheme are: it is conducive to adapting to different processing conditions according to various embodiments, reducing unnecessary wear of diamond particles, reducing processing load, adjusting life, self-sharpening and sharpness performance, and is conducive to increasing the pressure of single diamond by reducing the concentration of diamond particles.

[0012] Furthermore, when the abrasive tool body is formed by stacking a plurality of the substrates, the diamond particles are arranged in a single row or in multiple rows or in a single row cross arrangement or in multiple rows cross arrangement on the inclined surface along the stacking direction of the plurality of the substrates, and the diamond particles in each row are parallel to the rotation or movement trajectory of the diamond particles, and the arrangement width of the diamond particles in each row along the stacking direction of the plurality of the substrates is greater than one times the particle size of the diamond particles and less than two times the particle size of the diamond particles.

[0013] The beneficial effects of adopting the above further scheme are: it is conducive to adapting to different processing conditions according to various embodiments, reducing unnecessary wear of diamond particles, reducing processing load, adjusting life, self-sharpening and sharpness performance, and is conducive to increasing the pressure of single diamond by reducing the concentration of diamond particles.

[0014] Furthermore, when the diamond particles are arranged in multiple rows or cross-rows on the inclined surface, the area between two adjacent rows of diamond particles that is not coated with the diamond particles is a blank coating, and the width of the blank coating is greater than zero and less than twice the diameter of the diamond particles.

[0015] The beneficial effect of adopting the above further scheme is that the blank coating will be preferentially worn to form grooves during the use of the grinding tool, and will be connected to the water trough of the tooth plate, forming a microstructured grid cooling and chip removal method, while playing a centering role, reducing the risk of edge explosion, enhancing mechanical crushing, and reducing the processing load of the grinding tool.

[0016] Furthermore, the mold body is mounted on the outer peripheral surface or end surface of the holding member. When the mold body is mounted on the outer peripheral surface of the holding member, the base is an annular structure with the inclined surface on the outer peripheral surface; when the mold body is mounted on the end surface of the holding member, the base is a sheet structure or annular structure with the inclined surface on the top.

[0017] The beneficial effects of adopting the above further scheme are: it is conducive to prefabricating components and meeting the different needs of grinding tools and sawing tools on the market through combined assembly, manufacturing end face working surface grinding tools, or peripheral working surface grinding tools, or working surface grinding tool products combined with the two, which are suitable for large-scale manufacturing and automated assembly of grinding tools of various uses, specifications and shapes.

[0018] Furthermore, when the mold body is formed by stacking a plurality of the bases, and the mold body is mounted on the outer peripheral surface of the holding member, and the outer peripheral surface of the base is provided with the inclined surface, the plurality of bases are stacked up and down to form the mold body.

[0019] The beneficial effect of adopting the above further solution is that it is conducive to stacking multiple bases into a grinding tool with the outer peripheral surface as the working surface, thereby improving the applicability of the product and allowing it to be combined and assembled into a grinding tool with a special-shaped working surface.

[0020] Furthermore, the holding part includes: a central column, a plurality of clamping blocks and two cover plates, the plurality of clamping blocks are arranged around the outer circumference of the central column, the two cover plates are arranged one-to-one on the central column and the top and bottom ends of the clamping blocks, the mold body is arranged between the two cover plates, and a plurality of anti-rotation grooves are arranged on the inner side of the base body, the anti-rotation grooves are arc-shaped groove structures, and the plurality of anti-rotation grooves are corresponding one-to-one to the ends of the clamping blocks away from the central column, and a spiral water groove is formed between the anti-rotation groove and the clamping block, and the spiral water grooves are a plurality of arc-shaped groove structures arranged parallel to each other.

[0021] The beneficial effect of adopting the above further solution is that it is conducive to improving the holding force of the substrate and optimizing the cooling effect of the mold.

[0022] Furthermore, when the mold body is mounted on the end face of the holding piece, and the base is a sheet structure with the inclined surface at the top, multiple bases are stacked to form a mold unit, and multiple mold units are arranged around the end face of the holding piece to form the mold body.

[0023] The beneficial effect of adopting the above further solution is that it is conducive to stacking multiple bases into a grinding tool with the end surface as the working surface, thereby improving the applicability of the product.

[0024] Furthermore, when the mold body is mounted on the end surface of the holding member and the base is a ring-shaped structure with the inclined surface at the top, a plurality of bases are stacked inside and outside to form the mold body.

[0025] The beneficial effect of adopting the above further solution is that it is conducive to stacking multiple bases in the form of internal and external stacking to form a grinding tool with the end face as the working surface, thereby improving the applicability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic diagram of the overall structure provided by Embodiment 1 of the present invention;

[0027] FIG2 is a schematic structural diagram of an abrasive tool unit provided in Example 1 of the present invention;

[0028] FIG3 is an enlarged schematic diagram of the N region in the structure shown in FIG2 ;

[0029] FIG4 is a schematic diagram of a single substrate structure provided in Example 1 of the present invention;

[0030] FIG5 is a front view of a single substrate provided in Example 1 of the present invention;

[0031] FIG6 is an enlarged schematic diagram of the P region in the structure shown in FIG5 ;

[0032] FIG7 is a schematic diagram of the overall structure provided by Embodiment 2 of the present invention;

[0033] FIG8 is an enlarged schematic diagram of the R region in the structure shown in FIG7 ;

[0034] FIG9 is a schematic diagram of the internal structure provided by Embodiment 2 of the present invention;

[0035] FIG10 is an enlarged schematic diagram of the Q region in the structure shown in FIG9 ;

[0036] FIG11 is a top view of the overall structure provided by Example 2 of the present invention;

[0037] FIG12 is a schematic diagram of the structure of FIG11 after being cut along the section line AA;

[0038] FIG13 is a top view of a single substrate provided in Example 2 of the present invention;

[0039] FIG14 is a schematic diagram of the structure of FIG13 after being cut along the section line BB;

[0040] FIG15 is an enlarged schematic diagram of the S region in the structure shown in FIG14 ;

[0041] FIG16 is a schematic diagram of the overall structure provided by Embodiment 3 of the present invention;

[0042] FIG17 is a front view of the overall structure provided by Example 3 of the present invention;

[0043] FIG18 is a top view of the overall structure provided by Example 3 of the present invention;

[0044] FIG19 is a top view of the overall structure provided by Example 4 of the present invention;

[0045] FIG20 is an enlarged schematic diagram of the M region in the structure shown in FIG19 ;

[0046] FIG21 is a schematic diagram of the structure of FIG19 after being cut along the section line CC;

[0047] FIG22 is a schematic diagram of the structure of the grinding tool body provided in Example 4 of the present invention;

[0048] FIG23 is an enlarged schematic diagram of the L region in the structure shown in FIG22 ;

[0049] FIG24 is a side view of a single substrate provided in Example 5 of the present invention;

[0050] FIG25 is an enlarged schematic diagram of region I in the structure shown in FIG24 ;

[0051] FIG26 is an enlarged schematic diagram of the U region in the structure shown in FIG13 ;

[0052] FIG27 is an enlarged schematic diagram of region V in the structure shown in FIG13 ;

[0053] FIG28 is a side view of a single substrate provided in Example 6 of the present invention;

[0054] FIG29 is an enlarged schematic diagram of the T region in the structure shown in FIG28 ;

[0055] FIG30 is a side view of a single substrate provided in Example 7 of the present invention;

[0056] FIG31 is an enlarged schematic diagram of the K region in the structure shown in FIG30 ;

[0057] FIG32 is a side view of a single substrate provided in Example 8 of the present invention;

[0058] FIG33 is an enlarged schematic diagram of the O region in the structure shown in FIG32 .

[0059] Among them, the arrows in Figures 1, 11 and 19 indicate the direction of rotation of the grinding tool; the arrows in Figures 12, 15, 20 and 23 indicate the flow path of the cooling water; B in Figures 25 and 29 indicates the axial arrangement width of a single row of diamond particles; B1 in Figure 29 indicates the width of the blank coating; b in Figures 25, 26 and 27 indicates the particle size of the diamond particles; b2 in Figure 31 indicates the thickness of the saw blade substrate; R and R1 in Figure 27 indicate the radii of two points on a single sawtooth bevel of the substrate, which are arbitrarily spaced by 1 times the particle size along the rotation direction; b1 in Figure 27 indicates the thickness of the electroplating layer in the normal direction of the sawtooth bevel.

[0060] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0061] 1. Abrasive tool body; 2. Gripping piece; 11. Base; 12. Inclined surface; 13. Diamond layer; 14. Tooth water channel; 15. Spiral water channel; 16. Anti-rotation slot; 21. Center column; 22. Clamping block; 23. Cover plate; 121. Electroplating layer; 122. Blank plating layer. DETAILED DESCRIPTION

[0062] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0063] As shown in Figures 1 to 33, a serrated electroplated diamond grinding tool comprises: a grinding tool body 1 and a holding piece 2, wherein the grinding tool body 1 is mounted on the holding piece 2, and the grinding tool body 1 is composed of at least one serrated substrate 11, wherein the serrated surface of the substrate 11 is a bevel 12, and the bevel 12 is plated with a diamond layer 13, wherein the diamond layer 13 is arranged in a single layer in the normal direction of the bevel 12, and the area on the bevel 12 to be plated with diamond particles is an electroplated layer 121. The diamond particles in the diamond layer 13 are wrapped and plated in the electroplating layer 121. In the normal direction of the bevel 12, the thickness b1 of the electroplating layer 121 is greater than the particle size b of the diamond particles. When the abrasive tool body 1 is composed of a plurality of the bases 11, a groove is formed between two adjacent teeth on the base 11. The plurality of grooves on each layer of the base 11 are connected with the plurality of grooves on the adjacent layer of the base 11 to form a tooth water channel 14.

[0064] It should be noted that the diamond working layer refers to the diamond particles on the inclined surface 12 where the diamond layer 13 contacts the workpiece and all the diamond particles that participate in grinding the workpiece as they are worn during use.

[0065] When the abrasive tool body 1 is a base body 11 and uses the outer peripheral surface as the working surface, the abrasive tool body 1 works in a manner similar to a saw blade.

[0066] The beneficial effects of the present invention are as follows: the serrated base is conducive to achieving intermittent grinding and optimizing chip removal, the single-layer diamond layer is conducive to improving the self-sharpening property of the diamond layer, the diamond particles are coated and plated in the electroplating layer, and the thickness of the electroplating layer is greater than the particle size of the diamond particles, which is conducive to ensuring the electroplating layer's grip on the diamond particles and improving the life of the diamond, and the tooth plate water groove is conducive to establishing an internal cooling method, optimizing the cooling effect during grinding, and this structure also constitutes a good chip removal effect. The present invention can prefabricate components and meet the different needs of abrasive tools and sawing tools on the market through a combined assembly method, making the abrasive tools suitable for efficient processing and optimizing processing quality. At the same time, it can partially replace brazed diamond abrasive tools and powder metallurgy diamond abrasive tools, improving sharpness and life, and reducing manufacturing costs.

[0067] Preferably, as shown in Figure 27, on the inclined surface 12 of a single sawtooth of the base 11, at two points arbitrarily spaced one times the diamond particle size b along the rotation direction, the difference R-R1 along the consumption direction when the grinding tool is working is greater than or equal to one quarter of the diamond particle size b, and less than or equal to one half of the diamond particle size b.

[0068] It should be noted that the consumption direction of the mold during operation refers to the axial direction when the mold body is arranged on the end surface of the holding member; and refers to the radial direction when the mold body is arranged on the circumferential surface of the holding member.

[0069] The beneficial effect of adopting the above further solution is that it is conducive to adjusting the grinding tool to have stable self-sharpening performance, life and sharpness.

[0070] Preferably, as shown in Figures 24 to 33, when the grinding tool body 1 is a substrate 11, the diamond particles are arranged in a single row or multiple rows or a single row cross arrangement or multiple rows cross arrangement in the axial direction of the inclined surface 12, and in the axial direction of the inclined surface 12, the axial arrangement width B of the diamond particles in each row is greater than one times the particle size b of the diamond particles and less than two times the particle size b of the diamond particles.

[0071] The beneficial effects of adopting the above further scheme are: it is conducive to adapting to different processing conditions according to various embodiments, reducing unnecessary wear of diamond particles, reducing processing load, adjusting life, self-sharpening and sharpness performance, and is conducive to increasing the pressure of single diamond by reducing the concentration of diamond particles.

[0072] Preferably, as shown in Figures 1 to 23, when the abrasive tool body 1 is composed of a plurality of the matrixes 11 stacked together, the diamond particles are arranged in a single row or in multiple rows or in a single row cross arrangement or in multiple rows cross arrangement on the inclined surface 12 along the stacking direction of the plurality of the matrixes 11, and the diamond particles in each row are parallel to the rotation or movement trajectory of the diamond particles, and the arrangement width B of the diamond particles in each row along the stacking direction of the plurality of the matrixes 11 is greater than one times the particle size b of the diamond particles and less than two times the particle size b of the diamond particles.

[0073] It should be noted that the rotation or motion trajectory of the diamond particles refers to the direction in which the diamond particles arranged on the inclined surface 12 move along with the rotation of the entire grinding tool when the entire grinding tool rotates, as indicated by the arrows in Figures 1, 11 and 19.

[0074] Since some diamond particles will extend out of the electroplating layer 121 when the diamond particles are plated on the electroplating layer 121, the arrangement width B of a single row of diamond particles along the stacking direction of multiple substrates 11 refers to the distance between the top of the top diamond particle and the bottom of the bottom diamond particle in a row of diamond particles formed by plating an electroplating layer 121, as shown in Figures 25 and 29.

[0075] The beneficial effects of adopting the above-mentioned preferred scheme are: it is conducive to adapting to different processing conditions according to various embodiments, reducing unnecessary wear of diamond particles, reducing processing load, adjusting life, self-sharpening and sharpness performance, and is conducive to increasing the pressure of single diamond by reducing the concentration of diamond particles.

[0076] Preferably, as shown in FIG29 , when the diamond particles are arranged in multiple rows or cross-rows on the inclined surface 12 , the area between two adjacent rows of diamond particles that is not coated with the diamond particles is a blank coating 122 , and the width B1 of the blank coating 122 is greater than zero and less than twice the particle size b of the diamond particles.

[0077] It should be noted that the width B1 of the blank coating 122 refers to the distance between the bottom end of the diamond particle in the upper row and the top end of the diamond particle in the lower row, with respect to two adjacent rows of diamond particles.

[0078] When the diamond particles are arranged in multiple rows crosswise on the inclined surface 12 along the stacking direction of the multiple substrates 11, and the number of rows is equal to two, there is no blank coating 122, as shown in Figure 31. This embodiment is a special case. For details, please refer to Example 7 below.

[0079] The beneficial effect of adopting the above-mentioned preferred scheme is that the blank coating will be preferentially worn to form grooves during the use of the grinding tool, and will be connected to the water grooves of the tooth plates, forming a microstructured grid cooling and chip removal method, while playing a centering role, reducing the risk of edge bursting, enhancing mechanical crushing, and reducing the processing load of the grinding tool.

[0080] Preferably, as shown in Figures 1 to 23, the mold body 1 is installed on the outer peripheral surface or end surface of the holding member 2. When the mold body 1 is installed on the outer peripheral surface of the holding member 2, the base 11 is an annular structure with the inclined surface 12 provided on the outer peripheral surface; when the mold body 1 is installed on the end surface of the holding member 2, the base 11 is a sheet structure or an annular structure with the inclined surface 12 provided on the top.

[0081] The beneficial effects of adopting the above-mentioned preferred scheme are: it is conducive to prefabricating components and meeting the different demands of grinding tools and sawing tools on the market through combined assembly, manufacturing end face working surface grinding tools, or peripheral working surface grinding tools, or working surface grinding tool products combined with the two, which is suitable for large-scale manufacturing and automated assembly of grinding tools of various uses, specifications and shapes.

[0082] Preferably, as shown in Figures 7 to 18, when the mold body 1 is composed of a plurality of the bases 11 stacked together, and the mold body 1 is mounted on the outer peripheral surface of the holding member 2, and the outer peripheral surface of the base 11 is provided with the inclined surface 12, the plurality of bases 11 are stacked up and down to form the mold body 1.

[0083] It should be noted that when a plurality of the bases 11 are stacked up and down to form the mold body 1, the diameters of the plurality of bases 11 can be the same, thereby forming a mold having an outer contour similar to a cylinder, as shown in FIG7 ; the diameters can also be different, thereby forming a mold having an outer contour similar to a curved column, as shown in FIG16 .

[0084] The beneficial effect of adopting the above preferred solution is that it is conducive to stacking multiple bases into a grinding tool with the outer peripheral surface as the working surface, improving the applicability of the product, and can be combined and assembled into a grinding tool with a special-shaped working surface.

[0085] Preferably, as shown in Figures 7 to 15, the holding member 2 includes: a central column 21, a plurality of clamping blocks 22 and two cover plates 23, the plurality of clamping blocks 22 are arranged around the outer circumference of the central column 21, the two cover plates 23 are arranged one-to-one at the top and bottom ends of the central column 21 and the clamping blocks 22, the mold body 1 is arranged between the two cover plates 23, and a plurality of anti-rotation grooves 16 are provided on the inner side of the base 11, the anti-rotation grooves 16 are arc-shaped groove structures, and the plurality of anti-rotation grooves 16 are corresponding one-to-one to the ends of the plurality of clamping blocks 22 away from the central column 21, and a spiral water groove 15 is formed between the anti-rotation groove 16 and the clamping block 22, and the spiral water groove 15 is a plurality of arc-shaped groove structures arranged parallel to each other.

[0086] It should be noted that since the anti-rotation slots 16 are all arc-shaped grooves, when multiple anti-rotation slots 16 are engaged with multiple clamping blocks 22 in a one-to-one correspondence, a groove for cooling water circulation, namely the spiral water groove 15, is formed between the clamping blocks 22 and the anti-rotation slots 16. The cooling water flows as follows: cooling water is injected from the water inlet channel shown in Figure 12, enters between two adjacent clamping blocks 22, then enters the spiral water groove 15, and finally exits from the tooth plate water groove 14 between two adjacent saw teeth, as shown in Figure 15.

[0087] The beneficial effects of adopting the above preferred solution are: it is conducive to improving the holding force of the substrate and optimizing the cooling effect of the mold.

[0088] Preferably, as shown in Figures 1 to 6, the mold body 1 is installed on the end face of the holding member 2, and the base 11 is a sheet structure with the inclined surface 12 set on the top, multiple bases 11 are stacked to form a mold unit, and multiple mold units are wrapped around the end face of the holding member 2 to form the mold body 1.

[0089] The beneficial effect of adopting the above preferred solution is that it is conducive to stacking multiple bases into a grinding tool with the end surface as the working surface, thereby improving the applicability of the product.

[0090] Preferably, as shown in Figures 19 to 23, the mold body 1 is installed on the end surface of the holding member 2, and the base 11 is a ring structure with the inclined surface 12 set on the top, and multiple bases 11 are stacked inside and outside to form the mold body 1.

[0091] The beneficial effect of adopting the above preferred solution is that it is conducive to stacking multiple bases in the form of internal and external stacking to form a grinding tool with the end face as the working surface, thereby improving the applicability of the product.

[0092] The present invention will be further described below through several embodiments:

[0093] Example 1.

[0094] As shown in Figures 1 to 6, the mold body 1 is composed of multiple bases 11 stacked together, and the mold uses the end face as the working surface. The base 11 is a sheet structure. The mold body 1 is installed on the end face of the holding member 2. Multiple bases 11 are stacked to form a mold unit, and multiple mold units are wrapped around the end face of the holding member 2 to form the mold body 1.

[0095] Example 2.

[0096] As shown in Figures 7 to 15, the mold body 1 is composed of multiple bases 11 stacked together, and the mold uses the outer peripheral surface as the working surface. The base 11 is an annular structure. The mold body 1 is installed on the outer peripheral surface of the holding part 2. Multiple bases 11 are stacked up and down with the same diameter to form the mold body 1.

[0097] Example 3.

[0098] As shown in Figures 16 to 18, the mold body 1 is composed of multiple bases 11 stacked together, and the mold uses the outer peripheral surface as the working surface. The base 11 is an annular structure. The mold body 1 is installed on the outer peripheral surface of the holding part 2. Multiple bases 11 are stacked up and down according to different diameters to form the mold body 1.

[0099] Example 4.

[0100] As shown in Figures 19 to 23, the mold body 1 is composed of multiple bases 11 stacked together, and the mold uses the end face as the working surface. The base 11 is an annular structure. The mold body 1 is installed on the end face of the holding part 2. Multiple bases 11 are stacked inside and outside to form the mold body 1.

[0101] On the basis of the first to fourth embodiments, the diamond particles are arranged in a single row, multiple rows, a single row cross arrangement, or multiple rows cross arrangement on the inclined surface 12 along the stacking direction of the multiple substrates 11 .

[0102] Example 5.

[0103] As shown in Figures 24 and 25, the grinding tool body 1 is a base 11, and the grinding tool uses the outer peripheral surface as the working surface. The base 11 is an annular structure. The grinding tool body 1 is installed on the outer peripheral surface of the holding part 2. The diamond particles are arranged in a single row in the axial direction of the inclined surface 12, and there is no blank coating 122.

[0104] Example 6.

[0105] As shown in Figures 28 and 29, the grinding tool body 1 is a base 11, and the grinding tool uses the outer peripheral surface as the working surface. The base 11 is an annular structure. The grinding tool body 1 is installed on the outer peripheral surface of the holding part 2. The diamond particles are arranged in double rows in the axial direction of the inclined surface 12, that is, along the axial direction of the base 11, two electroplating layers 121 are arranged one by one at the upper and lower ends of the inclined surface 12 of a single sawtooth of the base 11. The middle of the two electroplating layers 121 is a non-electroplated insulating area, and there is a blank plating layer 122.

[0106] Example 7.

[0107] As shown in Figures 30 and 31, the abrasive tool body 1 comprises a base 11, and the abrasive tool uses its outer peripheral surface as a working surface. The base 11 is an annular structure, and the abrasive tool body 1 is mounted on the outer peripheral surface of the grip 2. Diamond particles are arranged in a double row crosswise along the axial direction of the bevel 12. That is, along the axial direction of the base 11, on the bevel 12 of one saw tooth of the base 11, the upper half is an electroplated layer 121, and the lower half is a non-electroplated insulating area. On the bevel 12 of an adjacent saw tooth, the lower half is an electroplated layer 121, and the upper half is a non-electroplated insulating area, with no blank plating layer 122. In this embodiment, since the electroplating layers 121 are alternately arranged on the bevel 12 of the saw teeth, when the diamond particles are plated on the electroplating layers 121, the portions of the diamond particles protruding from the electroplating layers 121 are arranged alternately around the circumference of the saw blade, thereby improving the stability of the saw blade during operation.

[0108] Embodiment 8.

[0109] As shown in Figures 32 and 33, the abrasive tool body 1 is a base 11, and the abrasive tool uses the outer peripheral surface as the working surface. The base 11 is an annular structure. The abrasive tool body 1 is mounted on the outer peripheral surface of the holding member 2. The diamond particles are arranged in multiple rows in the axial direction of the inclined surface 12. That is, along the axial direction of the base 11, a structure as shown in Example 6 is arranged on the inclined surface 12 of a saw tooth of the base 11. On the inclined surface 12 of the adjacent saw teeth, the electroplating layer 121 is arranged in the middle of the inclined surface 12. Two non-electroplated insulating areas are arranged one-to-one at the upper and lower ends of the electroplating layer 121. There is a blank plating layer 122 (not shown). In this embodiment, since the electroplating layer 121 is alternately arranged on the inclined surface 12 of the saw teeth, when the diamond particles are plated on the electroplating layer 121, the parts of the diamond particles protruding from the electroplating layer 121 are arranged alternately on the circumference of the saw blade, thereby improving the stability of the saw blade during operation.

[0110] Beneficial effects of the present invention:

[0111] The grinding effect is achieved by sawing, with high sharpness and low load; the single-layer diamond impregnation mode is achieved through the sawtooth structure (characteristic: most of the diamonds in the diamond working layer are on non-same rotating working surfaces in the wear direction, and gradually participate in the work as the wear occurs), which solves the disadvantage of the square increase of the load that is prone to occur in single-layer electroplated diamond abrasives; the structure realizes internal cooling and micro-structure grid-type chip removal and cooling, which is suitable for rough grinding of large cuts; it is conducive to the use of stamping to manufacture the base body, reducing processing costs; it is conducive to prefabrication in a simple way, and to meet the different needs of the market through combined assembly methods; it is conducive to the simplification of the process of manufacturing abrasives by electroplating process, reducing the difficulty of environmental protection; it can replace some brazing process diamond abrasives and powder metallurgy process diamond abrasives; it is suitable for automated manufacturing and processing.

[0112] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0113] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0114] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0115] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0116] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0117] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A serrated electroplated diamond grinding tool, characterized in that: include: A grinding tool body (1) and a holding piece (2), wherein the grinding tool body (1) is mounted on the holding piece (2), the grinding tool body (1) is composed of at least one sawtooth base (11), the sawtooth surface of the base (11) is an inclined surface (12), a diamond layer (13) is plated on the inclined surface (12), the diamond layer (13) is arranged in a single layer in the normal direction of the inclined surface (12), the area on the inclined surface (12) where diamond particles are to be plated is an electroplating layer (121), the diamond particles in the diamond layer (13) are wrapped and plated in the electroplating layer (121), and in the normal direction of the inclined surface (12), the thickness of the electroplating layer (121) is greater than the particle size of the diamond particles; When the abrasive tool body (1) is formed by stacking a plurality of the base bodies (11), a groove is formed between two adjacent saw teeth on the base bodies (11), and the plurality of grooves on each layer of the base bodies (11) are connected to the plurality of grooves on the adjacent layer of the base bodies (11) to form a tooth plate water channel (14).

2. A serrated electroplated diamond grinding tool according to claim 1, characterized in that: On the inclined surface (12) of a single sawtooth of the base (11), the difference between two points arbitrarily spaced one time the diameter of the diamond particles in the rotation direction along the consumption direction of the grinding tool during operation is greater than or equal to one quarter of the diameter of the diamond particles and less than or equal to one half of the diameter of the diamond particles.

3. The sawtooth electroplated diamond grinding tool according to claim 1, characterized in that: When the abrasive tool body (1) is a matrix (11), the diamond particles are arranged in a single row or multiple rows or in a single row cross arrangement or in a multiple row cross arrangement in the axial direction of the inclined surface (12); in the axial direction of the inclined surface (12), the axial arrangement width of each row of the diamond particles is greater than one time the particle size of the diamond particles and less than two times the particle size of the diamond particles.

4. The sawtooth electroplated diamond grinding tool according to claim 1, characterized in that: When the abrasive tool body (1) is formed by stacking a plurality of the substrates (11), the diamond particles are arranged in a single row or in multiple rows or in a single row or in multiple rows on the inclined surface (12) along the stacking direction of the plurality of substrates (11), each row of the diamond particles is parallel to the rotation or movement trajectory of the diamond particles, and the arrangement width of each row of the diamond particles along the stacking direction of the plurality of substrates (11) is greater than one time the particle size of the diamond particles and less than two times the particle size of the diamond particles.

5. A serrated electroplated diamond grinding tool according to claim 3 or 4, characterized in that: When the diamond particles are arranged in multiple rows or multiple rows cross-arranged on the inclined surface (12), the area between two adjacent rows of diamond particles that is not coated with the diamond particles is a blank coating (122), and the width of the blank coating (122) is greater than zero and less than twice the diameter of the diamond particles.

6. The sawtooth electroplated diamond grinding tool according to claim 1, characterized in that: The mold body (1) is mounted on the outer peripheral surface or end surface of the holding member (2); when the mold body (1) is mounted on the outer peripheral surface of the holding member (2), the base (11) is an annular structure with the inclined surface (12) arranged on the outer peripheral surface; when the mold body (1) is mounted on the end surface of the holding member (2), the base (11) is a sheet structure or annular structure with the inclined surface (12) arranged on the top.

7. A serrated electroplated diamond grinding tool according to claim 6, characterized in that: When the mold body (1) is formed by stacking a plurality of the base bodies (11), and the mold body (1) is mounted on the outer peripheral surface of the holding member (2), and the outer peripheral surface of the base body (11) is provided with the inclined surface (12), the plurality of base bodies (11) are stacked up and down to form the mold body (1).

8. A serrated electroplated diamond grinding tool according to claim 7, characterized in that: The holding member (2) comprises: a central column (21), a plurality of clamping blocks (22) and two cover plates (23); the plurality of clamping blocks (22) are arranged around the outer circumference of the central column (21); the two cover plates (23) are arranged one by one at the top and bottom ends of the central column (21) and the clamping blocks (22); the mold body (1) is arranged between the two cover plates (23); a plurality of anti-rotation grooves (16) are arranged on the inner side of the base (11); the anti-rotation grooves (16) are arc-shaped groove-shaped structures; the plurality of anti-rotation grooves (16) are correspondingly connected to one end of the plurality of clamping blocks (22) away from the central column (21); a spiral water groove (15) is formed between the anti-rotation groove (16) and the clamping block (22); the spiral water grooves (15) are multiple arc-shaped groove-shaped structures arranged in parallel up and down.

9. The sawtooth electroplated diamond grinding tool according to claim 6, characterized in that: When the mold body (1) is mounted on the end surface of the holding member (2), and the base (11) is a sheet-like structure with the inclined surface (12) arranged at the top, a plurality of bases (11) are stacked to form a mold unit, and a plurality of the mold units are arranged around the end surface of the holding member (2) to form the mold body (1).

10. The sawtooth electroplated diamond grinding tool according to claim 6, characterized in that: When the mold body (1) is mounted on the end surface of the holding member (2), and the base (11) is a ring-shaped structure with the inclined surface (12) at the top, a plurality of bases (11) are stacked inside and outside to form the mold body (1).

Citation Information

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