Polishing device and polishing method

Abstract

[Problem] To provide a polishing device which makes it possible to reduce a process that is manually carried out by an operator and in which an increase in size and cost is prevented as much as possible. [Solution] The present invention provides a polishing device for polishing a polishing target attached to a holder, said polishing device comprising: a polishing mechanism which polishes the polishing target by being driven so as to be rotated in a state where a polishing board is disposed on an upper surface of a turntable; a washing mechanism which washes the polishing target; a holder moving mechanism which moves the holder; a polishing board moving mechanism which moves the polishing board; and a controlling mechanism which controls the position of the holder and the position of the polishing board with respect to the polishing mechanism, wherein the holder and the polishing board are moved in synchronization with each other at least in a prescribed axial direction.

Description

Polishing apparatus and polishing method

[0001] The present invention relates to a polishing apparatus and a polishing method used for polishing optical fibers and samples.

[0002] Conventionally, when polishing an object to be polished, such as an optical fiber, using a polishing machine, it is common for the operator to perform all steps except for polishing the object itself. For example, the steps of placing the polishing disk on the turntable of the polishing machine and cleaning the object to be polished mounted on the holder after polishing are basically performed manually. As a result, the operator cannot leave the polishing machine at all times, which results in poor work efficiency.

[0003] To solve the above-mentioned problems, Patent Document 1 discloses a polishing apparatus for polishing optical fibers, which automatically performs the steps of placing a polishing disk on a turntable and cleaning the optical fiber. However, the mechanism for moving the polishing disk to the turntable and the mechanism for moving the holder to the cleaning position are installed independently. This inevitably leads to an increase in the size and cost of the apparatus.

[0004] Japanese Patent Application Laid-Open No. 2000-42891

[0005] The present invention provides a polishing apparatus and a polishing method that can reduce the number of manual steps performed by an operator and avoid an increase in the size and cost of the apparatus.

[0006] The polishing apparatus of the present invention is a polishing apparatus for polishing a workpiece mounted on a holder, and includes a polishing mechanism that polishes the workpiece by rotating a polishing disk placed on the upper surface of a turntable, a cleaning mechanism that cleans the workpiece, a holder moving mechanism that moves the holder, a polishing disk moving mechanism that moves the polishing disk, and a control mechanism that controls the position of the holder and the position of the polishing disk relative to the polishing mechanism, wherein the holder and the polishing disk are configured to move in conjunction with each other at least in a predetermined axial direction. The polishing apparatus configured as described above is provided with a holder moving mechanism that moves the holder and a polishing disk moving mechanism that moves the polishing disk, and wherein the holder and the polishing disk are configured to move in conjunction with each other at least in the predetermined axial direction.

[0007] In the above configuration, the holder moving mechanism is configured to move the holder between at least a polishing position where the polishing mechanism polishes the workpiece and a cleaning position where the cleaning mechanism cleans the workpiece, and the predetermined axial direction is a direction in which the holder is moved between the polishing position and the cleaning position. In the polishing apparatus configured as described above, the holder is configured to move between the polishing position and the cleaning position, and the polishing table is also configured to move in conjunction with the holder in the moving direction of the holder.

[0008] In the above configuration, the polishing disk moving mechanism is configured to move the polishing disk between a polishing disk holding position where the polishing disk stored in at least a storage location is held by the polishing disk moving mechanism and a polishing disk placement position where the polishing disk held by the polishing disk moving mechanism is placed on the upper surface of the polishing mechanism, and the predetermined axial direction is the direction in which the polishing disk is moved between the polishing disk holding position and the polishing disk placement position. In the polishing apparatus configured as described above, the polishing disk is configured to move between the polishing disk holding position and the polishing disk placement position, and the holder is also configured to move in conjunction with the polishing disk in the movement direction of the polishing disk.

[0009] In the above configuration, when the holder is located at the polishing position, the polishing disk stored in the storage location is held by the polishing disk moving mechanism, and when the holder is located at the cleaning position, the polishing disk held by the polishing disk moving mechanism is placed on the upper surface of the turntable of the polishing mechanism. In the polishing apparatus configured as described above, when the holder is located at the polishing position, the polishing disk moving mechanism is located at the polishing disk holding position, and when the holder is located at the cleaning position, the polishing disk moving mechanism is located at the polishing disk placement position. In other words, the polishing disk is held by the polishing disk moving mechanism while the object to be polished is being polished, and the polishing disk is placed on the upper surface of the turntable while the object to be polished is being cleaned.

[0010] In the above configuration, the polishing apparatus may further include a cleaning mechanism for cleaning the polishing disk and a cleaning mechanism moving mechanism for moving the cleaning mechanism, wherein the control mechanism controls the position of the cleaning mechanism relative to the polishing mechanism, and the cleaning mechanism moves in conjunction with the holder and the polishing disk at least in the predetermined axial direction. In the polishing apparatus configured as described above, a cleaning mechanism moving mechanism for moving the cleaning mechanism is provided, and the cleaning mechanism, the holder, and the polishing disk are configured to move in conjunction with each other at least in the predetermined axial direction.

[0011] In the above configuration, the polishing disk moving mechanism can hold two or more polishing disks simultaneously, and the polishing disk moving mechanism may be configured to have a polishing disk replacement mechanism that exchanges the positions of the two or more polishing disks in the predetermined axial direction. In the polishing apparatus configured as described above, two or more polishing disks, for example, a polishing disk before use and a polishing disk after use, can be held simultaneously and their positions exchanged.

[0012] In the above-described configuration, the control mechanism may be configured to move the stop position of the turntable to a predetermined position after polishing the workpiece. In the polishing apparatus configured as described above, the stop position of the turntable is always fixed at a predetermined position.

[0013] In the above configuration, the polishing apparatus may further include a fixation switching mechanism that switches between a fixed state in which the holder is fixed to the polishing apparatus and a released state in which the holder is released from the polishing apparatus, and the control mechanism is configured to switch between the fixed state and the released state. In the polishing apparatus configured as described above, the fixation switching mechanism switches the holder between the fixed state and the released state when the holder is attached to or detached from the polishing apparatus.

[0014] In the above-described configuration, in the fixed state, the holder may be fixed in a state in which it can be separated from the holder movement mechanism by a predetermined distance in the vertical direction. In the polishing apparatus configured as described above, the holder is configured to be separated from the holder movement mechanism when attached to the polishing mechanism.

[0015] In the above configuration, the polishing apparatus may further include a polishing liquid supply mechanism that supplies a polishing liquid to the polishing table, and the control mechanism may be configured to control the supply of the polishing liquid from the polishing liquid supply mechanism to the polishing table. In the polishing apparatus configured as described above, the supply of the polishing liquid to the polishing table is also controlled by the control mechanism.

[0016] In the above configuration, the cleaning mechanism may include an air blower that cleans the workpiece by spraying air, and the air blower may be configured to spray air in both one direction and the other direction relative to the vertical direction. In the polishing apparatus configured as described above, the workpiece is cleaned and dried by spraying air.

[0017] In the above configuration, the polishing mechanism may be configured to apply a polishing pressure to the workpiece by moving the turntable from below to above. In the polishing apparatus configured as described above, the polishing pressure is applied from below the turntable. In other words, no device for applying pressure is disposed above the turntable.

[0018] According to the present invention, it is possible to provide a polishing apparatus and a polishing method that can reduce the number of manual steps performed by an operator and avoid an increase in the size and cost of the apparatus.

[0019] 1 is a perspective view of the front side of the optical fiber polishing apparatus; FIG. 2 is a perspective view of the rear side of the optical fiber polishing apparatus; FIG. 3 is a perspective view of an optical fiber polishing holder attached to a polishing machine; FIG. 4 is a partial cross-sectional view of the upper part of the polishing machine with an optical fiber polishing holder attached to the polishing machine; FIG. 5 is a front view of the internal structure of a clamp post; FIG. 6 is a schematic cross-sectional view of the internal structure of the polishing machine; FIG. 7 is a perspective view of an optical fiber cleaning mechanism; FIG. 8 is a schematic cross-sectional view of an air blower cut along the X-axis direction; FIG. 9 is a perspective view of a polishing disk cleaning mechanism; FIG. 10 is a perspective view of a polishing liquid supply mechanism; FIG. 11 is a perspective view of a polishing disk stocker as seen from the rear side; FIG. 12 is a perspective view of a polishing disk moving mechanism; FIG. 13 is a perspective view of a polishing disk gripping mechanism gripping a polishing disk placed on the top surface of a turntable; FIG. 14 is a front view of a holder fixed to a clamp post by a holder moving mechanism; FIG. 15 is a flowchart showing the operation of the polishing apparatus of the present invention; FIG. 16 is a perspective view of a holder with a sample attached attached to it attached to a polishing machine.

[0020] An embodiment of the present invention will be described below with reference to the drawings, which are examples. In this embodiment, an apparatus for polishing an optical fiber as an object to be polished will be described as an example. FIG. 1 is a front perspective view of an optical fiber polishing apparatus 1 (hereinafter referred to as the polishing apparatus 1). FIG. 2 is a rear perspective view of the polishing apparatus 1. As shown in FIGS. 1 and 2, the polishing apparatus 1 includes a polishing machine (polishing mechanism) 10, an optical fiber cleaning mechanism 20 (hereinafter referred to as the cleaning mechanism 20), a polishing disk cleaning mechanism 30 (hereinafter referred to as the cleaning mechanism 30), a polishing liquid supply mechanism 40, a polishing disk stocker 50, a polishing disk moving mechanism 60, a holder moving mechanism 70, an operation unit 80, and a control mechanism 90. The left-right direction in FIG. 1, i.e., the direction in which the polishing disk stocker 50, the polishing machine 10, and the cleaning mechanism 20 are aligned, is defined as the X-axis direction. The front-to-rear direction (depth direction) when the polishing machine 10 is viewed from above is defined as the Y-axis direction, and the height direction (vertical direction) of the polishing machine 10 is defined as the Z-axis direction.

[0021] The polishing apparatus 1 has a pedestal 2 on which the polishing machine 10, cleaning mechanism 20, polishing disk stocker 50, etc. are placed. Above the pedestal 2, a polishing disk moving mechanism 60, a holder moving mechanism 70, the polishing machine 10, the cleaning mechanism 20, and a polishing liquid supply mechanism 40 (including a tank for supplying the polishing liquid, etc.) are arranged. The polishing machine 10 is arranged near the center in the X-axis direction, with the cleaning mechanism 20 on one side of the polishing machine 10 and the polishing disk stocker 50 on the other side in the X-axis direction. In other words, the polishing machine 10 is arranged between the cleaning mechanism 20 and the polishing disk stocker 50 in the X-axis direction. The polishing liquid supply mechanism 40 is arranged adjacent to the polishing machine 10. Below the pedestal 2, a control mechanism 90, a device for circulating and purifying the liquid used in the cleaning mechanism 20 from a storage tank through a filter using a pump, etc. are housed.

[0022] As shown in FIG. 2 , an X-axis rail 3A extending in the X-axis direction and an X-axis drive mechanism 3B are fixed to the upper surface of the base 2. An X-axis movement mechanism 4, which is movable along the X-axis rail 3A, is mounted on the X-axis rail 3A. The X-axis movement mechanism 4 is configured to move along the X-axis rail 3A in the X-axis direction by the X-axis drive mechanism 3B. A plate 5, which has flat surfaces in the X-axis and Z-axis directions, is fixed to the X-axis movement mechanism 4. The polishing disk movement mechanism 60, the holder movement mechanism 70, and the cleaning mechanism 30 are fixed to the plate 5 and are configured to move integrally with the X-axis movement mechanism 4 fixed to the plate 5 at least in the X-axis direction. In other words, the X-axis movement mechanism 4 has the function of moving the polishing disk, holder, and cleaning mechanism in the X-axis direction, and can be said to perform some of the functions of the polishing disk movement mechanism, the holder movement mechanism, and the cleaning mechanism movement mechanism. The cleaning mechanism 30 is fixed to the plate 5 and is positioned above the polishing machine 10. A control mechanism 90 controls the overall operation of the polishing apparatus 1. For example, the control mechanism 90 controls the polishing operation of the polishing machine 10 and the positions and speeds of the polishing disk moving mechanism 60, holder moving mechanism 70, and cleaning mechanism 30 when they are moved in each axial direction by the operator operating the operating unit 80.

[0023] A cable holder 6 is installed on a frame disposed above the base 2. By hanging the optical fiber cable on the cable holder 6, the cable can be held by the cable holder 6 so as not to interfere with the operation of the polishing apparatus 1. The cable holder 6 is fixed to the frame above the base 2 via an X-axis slide rail 7 installed facing the X-axis direction and a Y-axis slide rail 8 installed facing the Y-axis direction. The cable holder 6 is configured to be slidable in the X-axis direction along the X-axis slide rail 7 and in the Y-axis direction along the Y-axis slide rail 8. When the tip end of an optical fiber attached to an optical fiber polishing holder 11 (hereinafter referred to as holder 11), which will be described later, moves, the cable holder 6 is configured to be able to move simultaneously in the X-axis and Y-axis directions in accordance with the movement of the tip end of the optical fiber.

[0024] FIG. 3 is a perspective view of the polishing machine 10 with the holder 11 attached. FIG. 4 is a partial cross-sectional view of the upper portion of the polishing machine 10 with the holder 11 attached. A plurality of fixing jigs 12 are provided on the upper surface of the holder 11. An optical fiber ferrule 9 (hereinafter, referred to as a ferrule 9) or an optical connector is attached to each fixing jig 12 by an operator in advance. A polishing disk 14 is placed on the upper surface of the turntable 13 of the polishing machine 10 by a polishing disk moving mechanism 60. The polishing disk 14 moves in the X-axis direction by the X-axis moving mechanism 4 and in the Z-axis direction by the polishing disk moving mechanism 60. The movement of the polishing disk 14 will be described in detail later. The polishing disk 14 is composed of a polishing pad 14A made of an elastic material, glass, metal, ceramic, or the like, and a polishing film 14B attached to the upper surface of the polishing pad 14A. The polishing pad 14A has a disc shape that fits into a circular recess formed on the upper surface of the turntable 13. The surface of the polishing film 14B is coated with an abrasive. The polishing roughness can be changed by changing the type of film (type of abrasive) attached to the polishing pad 14A. When the ferrule 9 is attached to the holder 11, the end face of the ferrule 9 protrudes downward from the bottom surface of the holder 11. In this state, the turntable 13 is moved from bottom to top, and polishing pressure is applied while the turntable 13 is rotated, whereby the end face of the ferrule 9 is polished by the polishing film 14B on the polishing disc 14.

[0025] Clamp posts 15 are installed near the four corners of the top surface of the grinder 10 to mount and secure the holder 11. FIG. 5 is a front view showing the internal structure of the clamp post 15. The clamp post 15 includes a holder mounting surface 15A, an actuator 15B, a lock lever 15C, a clamp member 15D, and a support shaft 15E. When the actuator 15B is driven to move upward with the holder 11 placed on the holder mounting surface 15A, the lock lever 15C rotates around the support shaft 15E formed on the clamp member 15D. As a result, the tip of the lock lever 15C presses the holder 11 downward, thereby securing the holder 11 to the grinder 10. When the actuator 15B is driven to move downward from this state, the lock lever 15C rotates so that the tip of the lock lever 15C moves upward. This releases the holder 11 from the grinder 10, allowing the holder 11 to be lifted upward. This allows the holder 11 to be switched between a fixed state in which it is fixed to the grinding machine 10 and a released state in which it is released from the grinding machine 10. The clamp post 15 corresponds to the fixation switching mechanism of the present invention. The control mechanism 90 switches the holder 11 between the fixed state and the released state by controlling the driving of the actuator 15B.

[0026] FIG. 6 is a schematic cross-sectional view showing the internal structure of the grinding machine 10. The turntable 13 is driven to revolve around the revolution shaft 16 by a revolution motor 16A and rotate around the rotation shaft 17 by a rotation motor 17A. A resin bushing 16B is provided between the turntable 13 and the revolution shaft 16. In other words, the turntable 13 is supported on the revolution shaft 16 via the resin bushing 16B. The resin bushing 16B allows the turntable 13 to rotate around the revolution shaft 16 relative to the revolution shaft 16 and to move axially relative to the revolution shaft 16. The underside of the turntable 13 is movably supported on a base plate 19 via a thrust ring 18 and a spline (not shown). The thrust ring 18 and the spline (not shown) are configured to be movable up and down in the vertical direction by an air cylinder (not shown). The turntable 13 is placed on the horizontal surface above the thrust ring 18 and moves vertically in conjunction with the up and down movement of the thrust ring 18. When polishing the end face of the ferrule 9, the turntable 13 is moved from below to above, so that polishing pressure is applied to the end face of the ferrule 9 via the polishing disc 14.

[0027] FIG. 7 is a perspective view of the cleaning mechanism 20. The cleaning mechanism 20 is composed of an ultrasonic cleaner 21 and an air blower 22. The ultrasonic cleaner 21 has a storage tank 21A large enough to accommodate the holder 11 therein and an ultrasonic generator (not shown) installed within the storage tank 21A. A cleaning liquid (water) is poured into the storage tank 21A. After the polishing operation, the holder 11 is moved into the storage tank 21A with the ferrule 9 still attached. In this state, ultrasonic vibrations are generated in the cleaning liquid by the ultrasonic generator, thereby cleaning the polished ferrule 9 attached to the holder 11. The temperature of the cleaning liquid in the storage tank 21A may be controlled by a heating device or the like. The cleaning liquid in the storage tank 21A is purified by circulating it to the outside of the storage tank using a pump (not shown). A control mechanism 90 controls the circulation speed of the cleaning liquid to slow down the flow of the cleaning liquid in the storage tank 21A during cleaning of the ferrule 9, and to speed up the circulation speed when the ferrule 9 is not being cleaned. When the holder 11 after polishing is moved to the ultrasonic cleaner 21 and when the holder 11 after cleaning is moved to the polishing machine 10, the holder 11 passes above the air blower 22. The air blower 22 has a plurality of air injection ports formed linearly along the Y-axis direction. When the holder 11 passes above the air blower 22, the air blower 22 injects air to clean and dry the ferrule 9 and holder 11. The holder 11 is moved in the X-axis direction by the X-axis movement mechanism 4 and in the Z-axis direction by the holder movement mechanism 70; details of the movement of the holder 11 will be described later.

[0028] 8 is a schematic cross-sectional view of the air blower 22 taken along the X-axis direction. The air blower 22 includes a first air blower 22A disposed on the polisher 10 side, a second air blower 22B disposed on the ultrasonic cleaner 21 side, and a partition plate 22C disposed between the first air blower 22A and the second air blower 22B. As shown in FIG. 8, the air injection direction of the first air blower 22A is inclined toward the polisher 10 side by a predetermined angle with respect to the vertical direction. Meanwhile, the air injection direction of the second air blower 22B is inclined toward the ultrasonic cleaner 21 side by a predetermined angle with respect to the vertical direction. In other words, the air blower 22 is configured to be able to inject air in both one direction and the other direction relative to the vertical direction. When the holder 11 after polishing is moved to the ultrasonic cleaner 21, the first air blower 22A jets air to blow away polishing debris and the like toward the polishing machine 10, thereby cleaning and drying the ferrule 9 and holder 11 while preventing the polishing debris and the like from entering the ultrasonic cleaner 21. When the holder 11 after cleaning is moved to the polishing machine 10, the second air blower 22B jets air to blow away water droplets and the like toward the ultrasonic cleaner 21, thereby cleaning and drying the ferrule 9 while preventing the water droplets and the like from entering the polishing machine 10.

[0029] FIG. 9 is a perspective view of the cleaning mechanism 30. The cleaning mechanism 30 includes a water-absorbent nonwoven fabric 31, a first roller 32 around which the nonwoven fabric 31 is wound before use, a second roller 33 that winds up the used nonwoven fabric 31, a third roller 34 disposed between the first roller 32 and the second roller 33 for tensioning the nonwoven fabric 31 downward, a fourth roller 35 that contacts the third roller 34 to rotate it, and an air cylinder 36 that presses the third roller 34 and the fourth roller 35 downward. In addition to the first roller 32, the second roller 33, the third roller 34, and the fourth roller 35, multiple guides are installed to adjust the path of the nonwoven fabric, increase the contact area of ​​the nonwoven fabric with the outer periphery of the third roller 34, and provide appropriate friction for feeding the nonwoven fabric. The second roller 33 is driven to rotate by a motor 37. The fourth roller 35 is driven to rotate by a motor (not shown). Because the third roller 34 is in contact with the fourth roller 35, when the fourth roller 35 rotates, the third roller 34 rotates in the opposite direction to the fourth roller 35. When the second roller 33 and the fourth roller 35 are driven to rotate by a motor, the nonwoven fabric 31 is pulled out from the first roller 32, passes through the third roller 34, and is wound onto the second roller 33. A rotary damper is built into the first roller 32, and when the nonwoven fabric 31 is pulled out, a force is applied in the opposite direction to the pulling direction. The outer peripheries of the third roller 34 and the fourth roller 35 are preferably formed from a material with elasticity and friction, such as urethane.

[0030] The cleaning mechanism 30 is moved in the X-axis direction by the X-axis movement mechanism 4. With the lower portion of the third roller 34 positioned at the starting position for cleaning the polishing disc 14, the entire cleaning mechanism 30 is moved in the X-axis direction while the air cylinder 36 presses the third roller 34 and the fourth roller 35 downward, thereby wiping the polishing debris and polishing liquid from the top surface of the polishing disc 14 after polishing with the nonwoven fabric 31. The control mechanism 90 controls the movement speed of the cleaning mechanism 30 in the X-axis direction and the rotation speed of the fourth roller 35, i.e., the feed speed of the nonwoven fabric 31, and also controls the torque of the second roller 33 to appropriately wind up the fed nonwoven fabric 31, thereby controlling the tension of the nonwoven fabric 31. From the perspective of reliably cleaning the polishing disc 14, it is preferable that the feed speed of the nonwoven fabric 31 be greater than the movement speed of the cleaning mechanism 30 in the X-axis direction. Furthermore, it is preferable that the feed speed of the nonwoven fabric 31 be approximately 1.5 times the movement speed of the cleaning mechanism 30 in the X-axis direction. The air cylinder 36 has a function of moving the third roller 34 and the nonwoven fabric 31 in the Z-axis direction, and it can be said that the air cylinder 36 performs part of the function of the cleaning mechanism moving mechanism. The moving operation of the cleaning mechanism 30 will be described in detail later.

[0031] FIG. 10 is a perspective view of the polishing liquid supply mechanism 40. The polishing liquid supply mechanism 40 includes a pump 41 that supplies polishing liquid from a tank 45, a nozzle 42 that sprays the polishing liquid supplied by the pump 41 onto the polishing disk 14, a tube 43 that connects the pump 41 and the nozzle 42, and a nozzle support mechanism 44 that supports the nozzle 42 and moves it in the X-axis and Z-axis directions. The tank 45 is replenished with polishing liquid by an operator in advance. It is also possible to replenish multiple tanks 45 with different types of polishing liquid. After the polishing disk 14 placed on the turntable 13 is replaced, the nozzle support mechanism 44 moves the nozzle 42 above the polishing disk 14. In this state, the pump 41 is driven to spray polishing liquid from the nozzle 42. At the same time, the turntable 13 rotates on its axis, and polishing liquid is supplied from the nozzle 42 to the top surface of the polishing disk 14 during one rotation of the turntable 13. A control mechanism 90 controls the position of the nozzle 42, the drive timing of the pump 41, and the like. That is, the control mechanism 90 controls the supply of the polishing liquid from the polishing liquid supply mechanism 40 to the polishing disk 14 .

[0032] FIG. 11 is a perspective view of the polishing disk stocker 50 as seen from the rear side. The polishing disk stocker 50 is divided into multiple storage spaces, and multiple polishing disks 14 are stored in each storage space by an operator in advance. In this embodiment, a polishing disk stocker 50 capable of storing a total of 16 polishing disks 14 is used, with two rows in the X-axis direction and eight rows in the Z-axis direction. The polishing disks 14 are supported by bottom plates formed on the left and right sides in the X-axis direction. Near the center in the X-axis direction, there is no bottom plate, and the polishing disks 14 are exposed downward. A polishing disk preparation mechanism 51 is disposed on the rear side (rear side) of the polishing disk stocker 50 in the Y-axis direction, and is movable in the Y-axis and Z-axis directions. Four protrusions 51A protruding upward are formed on the top surface of the polishing disk preparation mechanism 51. The polishing disk preparation mechanism 51 is moved in the Y-axis direction until the polishing disk 14 is positioned near the center of the four protrusions 51A. From that position, the polishing disk preparation mechanism 51 is moved upward in the Z-axis direction. Since there is no bottom plate near the center of the polishing disk 14, the polishing disk 14 is held by the polishing disk preparation mechanism 51. Since the protrusions 51A have a conical shape with a diameter that gradually increases downward, even if the position of the polishing disk 14 is slightly off-center, the polishing disk 14 is held in the center of the four protrusions 51A by following the conical shape. After holding the polishing disk 14, the polishing disk preparation mechanism 51 moves in the Y-axis direction and returns to the rear side of the polishing disk stocker 50. In this position, the polishing disk 14 waits until it is moved by the polishing disk moving mechanism 60. Note that used polishing disks 14 can be stored in the polishing disk stocker 50 by reversing the above-described procedure.

[0033] 12 is a perspective view showing the polishing disk moving mechanism 60. The polishing disk moving mechanism 60 is fixed to the X-axis moving mechanism 4 and is configured to move in the X-axis direction together with the X-axis moving mechanism 4. The movement range of the polishing disk moving mechanism 60 is between a polishing disk holding position where a polishing disk 14 stored in the polishing disk stocker 50 is held by a polishing disk gripping mechanism 61 (hereinafter referred to as the gripping mechanism 61) and a polishing disk placement position where the polishing disk 14 held by the gripping mechanism 61 at the polishing disk holding position is placed on the upper surface of the turntable 13 of the polishing machine 10. Strictly speaking, the polishing disk holding position is the position where the polishing disk 14 held by the polishing disk preparation mechanism 51 is held by the gripping mechanism 61. The polishing disk moving mechanism 60 moves the polishing disk 14 along the X-axis direction between the polishing disk holding position and the polishing disk placement position.

[0034] The polishing disk moving mechanism 60 has two gripping mechanisms 61 and can simultaneously hold two polishing disks 14. The two gripping mechanisms 61 are arranged along the X-axis direction and connected to each other by a connecting plate 62 arranged above. A polishing disk replacement mechanism 63 is provided at the center of the connecting plate 62. The polishing disk replacement mechanism 63 can swap the positions of the two gripping mechanisms 61 in the X-axis direction by rotating the connecting plate 62 horizontally 180 degrees. At the polishing disk placement position, one gripping mechanism 61 holds a polishing disk 14 that has not yet been used, while the other gripping mechanism 61 holds a polishing disk 14 whose top surface has been cleaned by the cleaning mechanism 30 after polishing has been completed. In this state, the polishing disk replacement mechanism 63 swaps the positions of the two gripping mechanisms 61, and the polishing disk 14 that has not yet been used is placed on the top surface of the turntable 13. Using the polishing disk replacement mechanism 63 reduces the number of times the gripping mechanism 61 moves back and forth between the polishing disk holding position and the polishing disk placement position.

[0035] FIG. 13 is a perspective view showing the gripping mechanism 61 gripping the polishing disc 14 placed on the upper surface of the turntable 13. The gripping mechanism 61 has three claw members 61A and an actuator 61B for driving the claw members 61A. Each claw member 61A has a generally L-shaped configuration extending from the actuator 61B radially outward of the polishing disc 14 and then vertically downward. The tip of the claw member 61A further has a claw portion 61A1 extending radially inward of the polishing disc 14. The claw portion 61A1 has an inclined surface whose height increases from the radially inner side to the radially outer side. As shown in FIG. 13, the actuator 61B is activated when the gripping mechanism 61 is lowered to the vicinity of the polishing disc 14. When the actuator 61B is activated, the claw portion 61A1 of the claw member 61A moves radially inward. As a result, the three claw members 61A enter below the polishing disc 14 and grip the polishing disc 14. In this state, the gripping mechanism 61 can be moved upward to remove the polishing disc 14 from the turntable 13. The operation of the gripping mechanism 61 gripping the polishing disc 14 at the polishing disc placement position has been described, but the operation of the gripping mechanism 61 gripping the polishing disc 14 at the polishing disc holding position is substantially the same.

[0036] The turntable 13 has three recesses 13A formed at positions corresponding to the three claw members 61A. This allows the claw members 61A to enter below the polishing disc 14 when they move radially inward. After the end face of the ferrule 9 has been polished and the end face of the ferrule 9 has separated from the polishing disc 14, the control mechanism 90 moves the turntable 13 to a predetermined rotation position. In other words, it moves the stop position of the turntable 13 to a predetermined position. As a result, when the gripping mechanism 61 grips the polishing disc 14, the positions of the three recesses 13A on the turntable 13 coincide with the positions of the three claw members 61A.

[0037] As described above, the holder moving mechanism 70 is fixed to the X-axis moving mechanism 4 and is configured to move in the X-axis direction together with the X-axis moving mechanism 4. The movement range of the holder moving mechanism 70 is between an optical fiber polishing position (hereinafter referred to as the polishing position) where the ferrule 9 is polished by the polisher 10 and an optical fiber cleaning position (hereinafter referred to as the cleaning position) where the ferrule 9 is cleaned by the cleaning mechanism 20. The holder moving mechanism 70 moves the holder 11 along the X-axis direction between the polishing position and the cleaning position. The holder moving mechanism 70 can also move the holder 11 in the Z-axis direction at the polishing position and the cleaning position. At the polishing position, the holder 11 is placed on the polisher 10 by moving the holder 11 downward in the Z-axis direction. At the cleaning position, the holder 11 is moved into the storage tank 21A by moving the holder 11 downward in the Z-axis direction. When the holder 11 held by the holder moving mechanism 70 is located at the polishing position, the gripping mechanism 61 of the polishing disk moving mechanism 60 holds the polishing disk 14 at the polishing disk holding position, and when the holder 11 is located at the cleaning position, the gripping mechanism 61 places the polishing disk 14 on the top surface of the turntable 13 at the polishing disk placement position before polishing begins.

[0038] FIG. 14 is a front view showing the holder 11 secured to the clamp post 15 by the holder moving mechanism 70. Note that some components are omitted in FIG. 14 for simplicity of illustration. The holder 11 has four vertically extending support posts 11A and two handles 11B extending horizontally from above the support posts 11A and connecting the two support posts 11A. An operator can carry the holder 11 and install it on the holder moving mechanism 70 by grasping the handles 11B. The holder moving mechanism 70 has a handle mounting surface 71 on which the handles 11B are placed and a fixing mechanism 72 that fixes the handles 11B of the holder 11. An operator places the handles 11B on the handle mounting surface 71 and operates the fixing mechanism 72 to attach the holder 11 to the holder moving mechanism 70. The holder 11 is fixed to the holder moving mechanism 70 with a predetermined distance of play in the vertical direction (up and down). In other words, the holder 11 is attached to the holder movement mechanism 70 in a manner that allows it to be separated from the holder movement mechanism 70 by a predetermined distance in the vertical direction. When the holder 11 is attached to the polishing machine 10 by the holder movement mechanism 70, the holder 11 descends together with the holder movement mechanism 70 and is placed on the holder mounting surface 15A of the clamp post 15, after which the handle mounting surface 71 of the holder movement mechanism 70 further descends a predetermined distance. When the holder 11 is attached to the polishing machine 10, a gap C is formed between the underside of the handle 11B of the holder 11 and the handle mounting surface 71 of the holder movement mechanism 70. This gap C is equal to the predetermined distance by which the holder 11 can move vertically relative to the holder movement mechanism 70. By forming the gap C, the holder 11 can be securely seated on the holder mounting surface 15A of the clamp post 15, preventing the holder movement mechanism 70 from affecting polishing. The predetermined distance is preferably approximately 0.1 to 5.5 mm.

[0039] The cleaning mechanism 30 is fixed to the plate 5 and configured to move in the X-axis direction integrally with the X-axis movement mechanism 4. When the holder 11 moves between the polishing position and the cleaning position, that is, when the gripping mechanism 61 moves between the polishing disc holding position and the polishing disc placement position, the cleaning mechanism 30 moves in the X-axis direction so as to pass above the turntable 13. Then, only when the holder 11 moves from the polishing position to the cleaning position after polishing the ferrule 9, does the cleaning mechanism 30 move downward in the Z-axis direction by the air cylinder 36. In this way, the polishing debris and polishing liquid remaining on the upper surface of the polishing disc 14 after polishing are wiped off by the nonwoven fabric 31.

[0040] 15 is a flowchart showing the operation of the polishing apparatus 1 of the present invention. In particular, the following describes the positions and timings at which the cleaning mechanism 30, polishing disk preparation mechanism 51, polishing disk moving mechanism 60, and holder moving mechanism 70 operate in relation to the X-axis position of the X-axis moving mechanism 4. In the following description, the position in the X-axis direction of the X-axis moving mechanism 4 when the holder 11 is in the polishing position and the gripping mechanism 61 of the polishing disk moving mechanism 60 is in the polishing disk holding position is referred to as position A, and the position in the X-axis direction of the X-axis moving mechanism 4 when the holder 11 is in the cleaning position and the gripping mechanism 61 is in the polishing disk placement position is referred to as position B.

[0041] The polishing disk preparation mechanism 51 holds the polishing disk 14 stored in the polishing disk stocker 50 (step S1-1). Simultaneously with the operation of step S1-1, the X-axis movement mechanism 4 moves from position B to position A. The gripping mechanism 61 of the polishing disk movement mechanism 60 grips the polishing disk 14 in the polishing disk preparation mechanism 51 (step S2-1). The X-axis movement mechanism 4 moves from position A to position B. Furthermore, while the polishing disk 14 is moving, the polishing disk preparation mechanism 51 holds the next polishing disk 14 to be used from the polishing disk stocker 50 (step S1-2). The polishing disk 14 gripped by the gripping mechanism 61 is placed on the upper surface of the turntable 13 (step S2-2). The polishing liquid supply mechanism 40 supplies a polishing liquid to the polishing disk 14 placed on the turntable 13 (step S2-3). The X-axis movement mechanism 4 moves from position B to position A. The holder 11 held by the holder moving mechanism 70 is fixed to the polishing machine 10 by the clamp post 15 (step S3-1). The turntable 13 is rotated, and the polishing disk 14 polishes the end face of the ferrule 9 attached to the holder 11 (step S3-2). While the ferrule 9 is being polished, the gripping mechanism 61 of the polishing disk moving mechanism 60 grips the next polishing disk 14 to be used from the polishing disk preparation mechanism 51 (step S2-4). The X-axis moving mechanism 4 moves from position A to position B. As the X-axis moving mechanism 4 moves from position A to position B, the holder 11 passes above the first air blower 22A, and air is sprayed from the first air blower 22A to remove polishing debris and the like adhering to the ferrule 9 and holder 11 (step S3-3). Furthermore, as the X-axis moving mechanism 4 moves from position A to position B, the cleaning mechanism 30 moves downward as it passes above the turntable 13, wiping away polishing debris and polishing liquid from the upper surface of the polishing disc 14 with the nonwoven fabric 31 (step S4-1). After the X-axis moving mechanism 4 moves to position B, the holder moving mechanism 70 moves the holder 11 downward in the Z-axis direction and immerses the holder 11 in the cleaning liquid of the ultrasonic cleaner 21. The ultrasonic cleaner 21 is operated to clean the ferrule 9 attached to the holder 11 (step S3-4). The gripping mechanism 61 grips the used polishing disc 14, and the polishing disc replacement mechanism 63 swaps the positions of the two gripping mechanisms 61, so that the polishing disc 14 for the next process is placed on the upper surface of the turntable 13 (step S2-5).The polishing liquid supply mechanism 40 supplies polishing liquid to the polishing disk 14 placed on the turntable 13 (step S2-6). The X-axis movement mechanism 4 moves from position B to position A. As the holder 11 passes above the second air blower 22B while the X-axis movement mechanism 4 is moving from position B to position A, air is sprayed from the second air blower 22B to remove water and other debris adhering to the ferrule 9 and holder 11 (step S3-5). After the X-axis movement mechanism 4 moves to position A, the holder 11 held by the holder movement mechanism 70 is fixed to the polishing machine 10 by the clamp post 15 (step S3-6). The used polishing disk 14 held by the gripping mechanism 61 of the polishing disk movement mechanism 60 is placed on the polishing disk preparation mechanism 51 (step S2-7). The polishing disk preparation mechanism 51 stores the used polishing disk 14 in the polishing disk stocker 50 (step S1-3) and holds the polishing disk 14 to be used next (step S1-4). By repeating the above steps, the polishing work of the ferrule 9 is automatically performed while the polishing disk 14 is replaced.

[0042] During the above-described process, the polishing disk replacement mechanism 63 swaps the positions of the two gripping mechanisms 61 in the X-axis direction as necessary, such as while the polishing disk 14 is moving in the X-axis direction. In this embodiment, the polishing disk stocker 50 is configured to store the polishing disks 14 in two rows, left and right, in the X-axis direction. For example, if the gripping mechanism 61 grips the polishing disk 14 stored in the polishing disk stocker 50 on the left side (the side farthest from the turntable 13) in the process of step S2-1, the gripping mechanism 61 holding the polishing disk 14 should be located on the right side (the turntable side), so the polishing disk replacement mechanism 63 swaps the positions of the two gripping mechanisms 61 in the X-axis direction while the gripping mechanism 61 is moving in the X-axis direction. On the other hand, when the gripping mechanism 61 grips the polishing disk 14 housed in the polishing disk stocker 50 on the left side (the side farthest from the turntable 13) in the process of step S2-4, the gripping mechanism 61 that is not gripping a polishing disk 14 must first grip the used polishing disk 14, and then the positions of the two gripping mechanisms 61 in the X-axis direction must be swapped, so there is no need to swap the positions of the two gripping mechanisms 61 in the X-axis direction in advance. The opposite is true when the gripping mechanism 61 grips the polishing disk 14 housed in the polishing disk stocker 50 on the right side (the side closer to the turntable 13). Similarly, when a used polishing disk 14 is placed in the polishing disk stocker 50, the polishing disk replacement mechanism 63 determines whether to swap the positions of the two gripping mechanisms 61 in the X-axis direction depending on the position of the polishing disk stocker 50 that houses the polishing disk 14 in the X-axis direction.

[0043] As described above, the polishing apparatus 1 of the present invention enables the polishing disc 14 replacement and post-polishing cleaning of the ferrule 9, which were previously performed manually by an operator, to be performed automatically by machine. The polishing disc movement mechanism 60 and the holder movement mechanism 70 are integrated with the X-axis movement mechanism 4 and move in the X-axis direction in conjunction with the X-axis movement mechanism 4. By using only the X-axis movement mechanism 4 to move the polishing disc 14 in the X-axis direction without providing multiple X-axis movement mechanisms, it is possible to minimize increases in size and cost despite automating the above-mentioned operations. Furthermore, by using the cleaning mechanism 30 to clean the polishing disc 14 after polishing, it is possible to prevent polishing debris and other debris from entering the polishing machine 10 and to reuse the polishing disc 14 after use. Furthermore, by configuring the cleaning mechanism 30 to move in the X-axis direction in conjunction with the X-axis movement mechanism 4, it is possible to minimize increases in size and cost. By adopting a structure in which the polishing disk moving mechanism 60 can simultaneously hold two polishing disks 14 and the polishing disk replacement mechanism 63 can interchange the positions of the two gripping mechanisms 61, the polishing disk moving mechanism 60 is interlocked with the X-axis moving mechanism 4 while minimizing the number of X-axis movements of the polishing disk moving mechanism 60 to exchange polishing disks 14. By moving the stop position of the turntable 13 to a predetermined position after polishing the end face of the ferrule 9, the polishing disk 14 can always be gripped in a fixed position without rotating the gripping mechanism 61. By adopting a structure in which the clamp post 15 switches between a fixed state in which the holder 11 is fixed to the polishing machine 10 and a released state in which the holder 11 is released from the polishing machine 10, the attachment and detachment of the holder 11 to and from the polishing machine 10 can be automated. The holder 11 is fixed to the holder moving mechanism 70 in a manner that allows it to be separated from the holder 11 by a predetermined distance in the vertical direction, allowing the holder 11 to be securely attached to the polishing machine 10. The work of supplying polishing liquid, which was previously performed by an operator, can also be automated by supplying the polishing liquid to the polishing disc 14 using the polishing liquid supply mechanism 40. By using a first air blower 22A, which moves along the X axis from position A to position B and sprays air toward the polishing machine 10, and a second air blower 22B, which moves along the X axis from position B to position A and sprays air toward the ultrasonic cleaner 21, it is possible to blow away polishing debris, water droplets, etc. in the optimal direction.The polishing machine 10 of the present invention is configured to apply polishing pressure to the end face of the ferrule 9 by moving the turntable 13 from below to above. Since there is no need to provide a mechanism for applying polishing pressure above the turntable 13, the polishing disk moving mechanism 60 and holder moving mechanism 70 can be disposed above the turntable 13.

[0044] In the above embodiment, the polishing disc moving mechanism 60, the holder moving mechanism 70, and the cleaning mechanism 30 are fixed to the X-axis moving mechanism 4, and these components move together in the X-axis direction. However, these components do not necessarily have to be fixed to the X-axis moving mechanism 4. For example, a link mechanism or the like may be interposed between the X-axis moving mechanism and these components. It is sufficient that the polishing disc moving mechanism, the holder moving mechanism, and the cleaning mechanism moving mechanism (cleaning mechanism) move in the X-axis direction (a predetermined axis direction) as the X-axis moving mechanism moves in the X-axis direction. Such an operation is referred to as "moving in conjunction with each other." Furthermore, it is not necessary to distinguish between the X-axis moving mechanism and the polishing disc moving mechanism, the holder moving mechanism, and the cleaning mechanism moving mechanism. The X-axis moving mechanism may directly perform some of the functions of the polishing disc moving mechanism, the holder moving mechanism, and the cleaning mechanism moving mechanism. Furthermore, it is not necessary for all of the polishing disc moving mechanism, the holder moving mechanism, and the cleaning mechanism moving mechanism (cleaning mechanism) to move in conjunction with each other in the X-axis direction. For example, the present invention also includes a configuration in which the polishing plate moving mechanism and the holder moving mechanism move in the X-axis direction in conjunction with each other.

[0045] In the above embodiment, a structure in which the ferrule 9 is fixed to the holder 11 by the fixing jig 12 has been described, but the structure for holding the ferrule in the holder is not limited to this. It is also possible to hold the ferrule in the holder with a nut or the like without using a fixing jig, or to fix the connector directly to the holder. Furthermore, although a structure in which the ferrule is fixed to the holder has been described, the present invention is also applicable to a structure in which the optical fiber is fixed directly to the holder.

[0046] In the above embodiment, the polishing roughness is changed depending on the type of polishing film 14B. However, the polishing film may not be coated with an abrasive, and instead, the ferrule or optical fiber may be polished by replenishing the polishing liquid containing the abrasive on the upper surface of the polishing pad. In this case, the polishing roughness can be changed by changing the type of polishing liquid replenishing. By providing multiple tanks for each type of polishing liquid and configuring the control mechanism to change the type and number of tanks used, the same effect as changing the type of polishing film can be achieved.

[0047] In the above embodiment, an example has been described in which the turntable 13 is rotated by both the revolution axis 16 and the rotation axis 17, but the structure to which the present invention can be applied is not limited to this. As long as the turntable is structured to rotate in the horizontal direction, it can also be structured so that it is rotated by only one of the revolution axis or the rotation axis.

[0048] In the above embodiment, the turntable 13 is moved up and down in the vertical direction by an air cylinder, but other structures can be used as long as they move the turntable vertically. For example, a drive mechanism other than an air cylinder, such as a hydraulic cylinder or an electric motor, can also be used.

[0049] In the above embodiment, a structure was described in which the resin bushing 16B enables the turntable 13 to rotate about the axis and move in the axial direction relative to the revolution shaft 16, but it is also possible to use something other than a resin bushing. For example, it is also possible to use a ball guide or an oil-free bushing to enable relative rotation about the axis and relative movement in the axial direction relative to the revolution shaft. Furthermore, by adopting a structure in which the revolution shaft and the rotation shaft move up and down together with the turntable, it is also possible to omit parts such as a ball guide that enable relative rotation about the axis and relative movement in the axial direction relative to the revolution shaft.

[0050] In the above embodiment, a structure has been described in which the polishing disk 14 stored in the polishing disk stocker 50 is temporarily pulled out in the Y-axis direction by the polishing disk preparation mechanism 51 and then held by the polishing disk moving mechanism 60. However, it is also possible to use a storage mechanism in place of the polishing disk stocker 50 without providing the polishing disk preparation mechanism 51, and to directly hold the polishing disk 14 by the polishing disk moving mechanism 60. In either case, the position at which the polishing disk 14 is held by the polishing disk moving mechanism 60 is defined as the polishing disk holding position. The number of rows in the X-axis direction and the number of stages in the Z-axis direction of the polishing disk stocker can also be changed as appropriate.

[0051] In the above embodiment, the polishing disk moving mechanism 60 has been described as having two gripping mechanisms 61, but the number of polishing disk moving mechanisms 60 is not limited to two. For example, it is also possible to use three gripping mechanisms to arrange three polishing disks at 120° intervals, and to change the rotational positions of the three polishing disks 14 using the polishing disk changing mechanism 63. By providing two or more gripping mechanisms, it is possible to hold two or more polishing disks simultaneously, and by using the polishing disk changing mechanism to change the positions of the two or more polishing disks in the X-axis direction, it is possible to reduce the movement of the polishing disk moving mechanism in the X-axis direction.

[0052] In the above embodiment, the flow has been described in which the polishing disc 14 is replaced after the ferrule 9 has been cleaned and the next polishing operation is started, but it is also possible to add a step of cleaning the end face of the ferrule 9 with nonwoven fabric between polishing steps or after the final polishing step is completed. In this case, it is also possible to place a polishing pad 14A with nonwoven fabric attached to its upper surface on the turntable 13 instead of the polishing film 14B, and to clean the end face of the ferrule 9 by rotating the turntable 13.

[0053] While the above examples illustrate examples of polishing optical fibers as the workpiece, the polishing apparatus of the present invention is not limited to optical fibers. It is also possible to polish objects other than optical fibers. For example, the polishing apparatus of the present invention can also be used to polish samples used for research, experiments, quality control, and other purposes. Here, the polished samples include optical microscope samples, electron microscope samples, and strength test pieces used for testing, inspection, and analysis. For example, the polishing apparatus of the present invention can be used to mirror-polish the surface of a workpiece to prepare samples for surface observation using optical microscopes or electron microscopes. Figure 16 is a perspective view of a sample polishing holder 110 (hereinafter referred to as holder 110) with a sample 100 attached thereto, mounted on a polishing machine 10. As shown in Figure 16, the sample 100 is mounted on the holder 110, and the polishing machine 10 is operated to polish the sample 100. Except for the sample 100 being mounted on the holder 110, the process is similar to polishing an optical fiber, and therefore a detailed description will be omitted. To perform polishing for various purposes, it is necessary to appropriately change the polishing conditions, polishing disk (polishing pad, polishing film), polishing liquid, holder, etc., but by changing the polishing conditions, the polishing device can be used for polishing for various purposes. Furthermore, this polishing device (this polishing machine) uses a polishing mechanism that polishes the object to be polished by rotating (rotating and revolving) the polishing disk placed on the top surface of a turntable, and the polishing holder to which the sample is attached is fixed to the polishing machine, so polishing can be performed without being affected by the size or shape of the sample, compared to polishing machines that, for example, rotate the jig (polishing holder, etc.) to which the sample is fixed.

[0054] It goes without saying that the present invention is not limited to the above-described examples. It goes without saying that a person skilled in the art would understand that the following are disclosed as embodiments of the present invention: - Applying mutually replaceable components and configurations disclosed in the above-described examples by appropriately changing their combinations; - Applying mutually replaceable components and configurations disclosed in the above-described examples by publicly known techniques that are not disclosed in the above-described examples, and applying such combinations by appropriately changing them; - Applying mutually replaceable components and configurations disclosed in the above-described examples by publicly known techniques that are not disclosed in the above-described examples, and applying such combinations by appropriately changing them.

[0055] 1...optical fiber polishing device, 2...base, 3A...X-axis rail, 3B...X-axis drive mechanism, 4...X-axis movement mechanism, 5...plate, 6...cable holder, 7...X-axis slide rail, 8...Y-axis slide rail, 9...optical fiber ferrule, 10...polishing machine, 11...optical fiber polishing holder, 12...fixing jig, 13...turntable, 14...polishing disk, 15...clamp post, 16...revolution axis, 17...rotation axis, 18...thrust ring, 19...base plate, 20...optical fiber cleaning mechanism, 21...ultrasonic cleaner, 22...air blower, 30...polishing disk cleaning mechanism, 31 ...Nonwoven fabric, 32...First roller, 33...Second roller, 34...Third roller, 35...Fourth roller, 36...Air cylinder, 37...Motor, 40...Polishing liquid supply mechanism, 41...Pump, 42...Nozzle, 43...Tube, 44...Nozzle support mechanism, 45...Tank, 50...Polishing disk stocker, 51...Polishing disk preparation mechanism, 60...Polishing disk moving mechanism, 61...Gripping mechanism, 62...Connecting plate, 63...Polishing disk replacement mechanism, 70...Holder moving mechanism, 71...Handle mounting surface, 72...Fixing mechanism, 80...Operation unit, 90...Control mechanism, 100...Sample, 110...Sample polishing holder.

Claims

1. A polishing apparatus for polishing an object to be polished that is attached to a holder, comprising: a polishing mechanism for polishing the object to be polished by rotating a polishing disk placed on the upper surface of a turntable; a cleaning mechanism for cleaning the object to be polished; a holder moving mechanism for moving the holder; a polishing disk moving mechanism for moving the polishing disk; and a control mechanism for controlling the position of the holder and the position of the polishing disk relative to the polishing mechanism, wherein the holder and the polishing disk are configured to move in conjunction with each other at least in a predetermined axial direction.

2. The polishing apparatus of claim 1, characterized in that the holder moving mechanism is configured to move the holder at least between a polishing position where the workpiece is polished by the polishing mechanism and a cleaning position where the workpiece is cleaned by the cleaning mechanism, and the specified axial direction is a direction in which the holder is moved between the polishing position and the cleaning position.

3. The polishing apparatus described in claim 1, characterized in that the polishing disk moving mechanism is configured to move the polishing disk between a polishing disk holding position in which the polishing disk stored in at least a storage location is held by the polishing disk moving mechanism and a polishing disk placement position in which the polishing disk held by the polishing disk moving mechanism is placed on the upper surface of the polishing mechanism, and the specified axial direction is a direction in which the polishing disk is moved between the polishing disk holding position and the polishing disk placement position.

4. A polishing apparatus as described in claim 3, characterized in that when the holder is located at the polishing position, the polishing disk stored in the storage location is held by the polishing disk moving mechanism, and when the holder is located at the cleaning position, the polishing disk held by the polishing disk moving mechanism is placed on the upper surface of the turntable of the polishing mechanism.

5. The polishing apparatus described in claim 1, further comprising a cleaning mechanism for cleaning the polishing plate; and a cleaning mechanism moving mechanism for moving the cleaning mechanism, wherein the control mechanism controls the position of the cleaning mechanism relative to the polishing mechanism, and the cleaning mechanism is configured to move in conjunction with the holder and the polishing plate at least in the specified axial direction.

6. The polishing apparatus according to claim 1, characterized in that the polishing disk moving mechanism is capable of holding two or more polishing disks simultaneously, and the polishing disk moving mechanism has a polishing disk replacement mechanism that switches the positions of the two or more polishing disks in the specified axial direction.

7. The polishing apparatus according to claim 1, wherein said control mechanism moves the stop position of said turntable to a predetermined position after polishing of said workpiece.

8. A polishing apparatus as described in claim 1, further comprising a fixation switching mechanism for switching between a fixed state in which the holder is fixed to the polishing apparatus and a released state in which the holder is released from the polishing apparatus, and the control mechanism is configured to switch between the fixed state and the released state.

9. A polishing apparatus according to claim 8, wherein in said fixed state, said holder is fixed in a state in which it can be separated from said holder moving mechanism by a predetermined distance in the vertical direction.

10. The polishing apparatus according to claim 1, further comprising a polishing liquid supply mechanism for supplying a polishing liquid to said polishing plate, said control mechanism controlling the supply of said polishing liquid from said polishing liquid supply mechanism to said polishing plate.

11. The polishing apparatus according to claim 1, characterized in that the cleaning mechanism includes an air blower that cleans the workpiece by spraying air, and the air blower is configured to spray air in both one direction and the other direction based on the vertical direction.

12. A polishing apparatus according to any one of claims 1 to 11, characterized in that the polishing mechanism is configured to apply a polishing pressure to the workpiece by moving the turntable from below to above.

13. A method for polishing an object to be polished that is attached to a holder, comprising the steps of: polishing the object to be polished by a polishing mechanism by rotating a polishing disk placed on the upper surface of a turntable; cleaning the object to be polished by a cleaning mechanism; moving the holder by a holder moving mechanism; and moving the polishing disk by a polishing disk moving mechanism, wherein the holder and the polishing disk are configured to move in conjunction with each other at least in a predetermined axial direction.

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