Display apparatus and method of manufacturing same

Abstract

In a method of manufacturing a display apparatus in which a plurality of display modules are arranged, according to one embodiment of the present disclosure, a method of manufacturing each of the plurality of display modules may comprise: forming a light-emitting layer on a base substrate; arranging, on the light-emitting layer, a mask pattern with an opening; etching the light-emitting layer through the opening so as to form a plurality of inorganic light-emitting elements; forming a reflective layer on the mask pattern and the plurality of inorganic light-emitting elements; removing the mask pattern arranged on the plurality of inorganic light-emitting elements; and removing the reflective layer formed on the mask pattern.

Description

Display device and manufacturing method thereof

[0001] The present disclosure relates to a display device including an inorganic light-emitting element and a method for manufacturing the same.

[0002] A display device is a type of output device that visually displays data information such as characters, shapes, and images.

[0003] Liquid crystal panels (LCDs), which require backlights, and organic light-emitting diode (OLED) panels, which are made of films of organic compounds that emit light on their own in response to current, have been mainly used as display devices. However, liquid crystal panels have slow response times, consume a lot of power, and are not self-luminous, requiring a backlight, making them difficult to compact. Furthermore, OLED panels do not require a backlight because they are self-luminous, and can be made thin. However, if the same screen is displayed for a long time, it is vulnerable to burn-in (deterioration), where certain parts of the previous screen remain even when the screen is changed as the subpixels reach their lifespan. Accordingly, research is being conducted on micro light-emitting diode (microLED or μLED) panels, which mount inorganic light-emitting elements on a substrate and use the inorganic light-emitting elements themselves as pixels as new panels to replace them.

[0004] A micro light-emitting diode display panel (hereinafter, micro LED panel) is one type of flat panel display panel and is composed of a plurality of inorganic light-emitting diodes (inorganic LEDs), each of which is 100 micrometers or less in size.

[0005] These LED panels are also self-luminous elements, but as they are inorganic light-emitting elements, they do not suffer from the burn-in phenomenon of OLEDs and have excellent brightness, resolution, power consumption, and durability.

[0006] Compared to liquid crystal display (LCD) panels, which require backlighting, microLED display panels offer better contrast, response time, and energy efficiency. Both organic light-emitting diodes (OLEDs) and inorganic light-emitting diodes (MLEDs) are energy efficient, but MLEDs offer brightness, luminous efficacy, and a longer lifespan than OLEDs.

[0007] In addition, by arranging LEDs on a circuit board in pixel units, display modularization can be produced on a board-by-board basis, and it is easy to produce various resolutions and screen sizes to suit consumer orders.

[0008] One aspect of the present disclosure provides a display device with improved optical characteristics and a method for manufacturing the same.

[0009] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0010] In a method for manufacturing a display device having a plurality of display modules arranged according to one embodiment of the present disclosure, the method for manufacturing each of the plurality of display modules may include forming a light-emitting layer on a base substrate, arranging a mask pattern having an opening on the light-emitting layer, etching the light-emitting layer through the opening to form a plurality of inorganic light-emitting elements, forming a reflective layer on the mask pattern and the plurality of inorganic light-emitting elements, and removing the mask pattern arranged on the plurality of inorganic light-emitting elements and removing the reflective layer formed on the mask pattern.

[0011] In a display device including a display module array in which a plurality of display modules are arranged according to one embodiment of the present disclosure, each of the plurality of display modules may include a substrate, an inorganic light-emitting element mounted on the substrate and including both side surfaces, a color layer disposed in front of the inorganic light-emitting element so that light emitted from the inorganic light-emitting element passes therethrough, the color layer including quantum dots so that light passing through the color layer is color-converted, and a reflective film disposed on both side surfaces of the inorganic light-emitting element so as to reflect light emitted from the inorganic light-emitting element.

[0012] In a method for manufacturing a display device including a plurality of display modules according to one embodiment of the present disclosure, the method for manufacturing each of the plurality of display modules may include forming a light-emitting layer on a base substrate, disposing a photoresist having an opening on the light-emitting layer, etching the light-emitting layer through the opening of the photoresist to form a plurality of inorganic light-emitting structures, forming a reflective layer on a surface of the photoresist forming the opening and on surfaces of the plurality of inorganic light-emitting structures, and dry etching the photoresist disposed on upper surfaces of the plurality of inorganic light-emitting structures to remove the reflective layer formed on the photoresist.

[0013] FIG. 1 is a perspective view of a display device according to one embodiment of the present disclosure.

[0014] FIG. 2 is an exploded perspective view of the main components of a display device according to one embodiment of the present disclosure.

[0015] FIG. 3 is a rear perspective view of one display module of a display device according to one embodiment of the present disclosure.

[0016] FIG. 4 is a perspective view of a part of a display module in a display device according to one embodiment of the present disclosure.

[0017] FIG. 5 is an enlarged cross-sectional view of a portion of a display module in a display device according to one embodiment of the present disclosure.

[0018] FIG. 6 is an enlarged cross-sectional view of a portion of a display module in a display device according to one embodiment of the present disclosure.

[0019] FIG. 7 is an enlarged cross-sectional view of a portion of a display module in a display device according to one embodiment of the present disclosure.

[0020] FIG. 8 is a flowchart illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0021] FIG. 9 is a flowchart illustrating a manufacturing process of a color layer of a display module in a display device according to one embodiment of the present disclosure.

[0022] FIG. 10 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0023] FIG. 11 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0024] FIG. 12 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0025] FIG. 13 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0026] FIG. 14 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0027] FIG. 15 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0028] FIG. 16 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0029] FIG. 17 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0030] FIG. 18 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0031] The embodiments described in this disclosure and the configurations illustrated in the drawings are merely preferred examples of the disclosure, and there may be various modified examples that can replace the embodiments and drawings of the disclosure at the time of filing of this application.

[0032] Additionally, the same reference numbers or symbols presented in each drawing of the present disclosure represent parts or components that perform substantially the same function.

[0033] In addition, the terminology used in this disclosure is used to describe embodiments and is not intended to limit and / or restrict the disclosure. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this disclosure, terms such as "comprise" or "have" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the disclosure, but do not preemptively exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0034] Additionally, in the present disclosure, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof.

[0035] Additionally, the term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0036] Additionally, terms including ordinal numbers such as "first," "second," etc., used in this disclosure may be used to describe various components, but the components are not limited by the terms, and the terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present disclosure, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term "and / or" includes any combination of a plurality of related listed items or any item among a plurality of related listed items.

[0037] Furthermore, the meaning of "identical" in this disclosure includes having similar properties or being similar within a certain range. Furthermore, "identical" means "substantially identical." "Substantially identical" should be understood to include values ​​that fall within the manufacturing error range or values ​​that differ from a reference value within a range that has no significance.

[0038] Meanwhile, the terms “front,” “rear,” “left,” and “right” used in the description below are defined based on the drawing, and the shape and position of each component are not limited by these terms.

[0039] Hereinafter, embodiments according to the present disclosure will be described in detail with reference to the attached drawings.

[0040] FIG. 1 is a perspective view of a display device according to one embodiment of the present disclosure. FIG. 2 is an exploded perspective view of the main components of a display device according to one embodiment of the present disclosure. FIG. 3 is a rear perspective view of one display module of a display device according to one embodiment of the present disclosure. FIG. 4 is a perspective view of a portion of a display module of a display device according to one embodiment of the present disclosure. FIG. 5 is an enlarged cross-sectional view of a portion of a display module of a display device according to one embodiment of the present disclosure.

[0041] Some components of the display device (1), including a plurality of inorganic light-emitting elements (50) illustrated in the drawing, are micro-unit components having a size of several μm to several hundred μm, and for convenience of explanation, the scale of some components (such as a plurality of inorganic light-emitting elements (50)) is exaggerated.

[0042] A display device (1) is a device that displays information, data, and other information in the form of characters, shapes, graphs, images, etc., and a TV, PC, mobile, digital signage, etc. can be implemented as a display device (1).

[0043] Referring to FIGS. 1 and 2, according to an embodiment of the present disclosure, a display device (1) may include a display panel (20) for displaying an image, a power supply device (not shown) for supplying power to the display panel (20), a main board (25) for controlling the overall operation of the display panel (20), a frame (15) for supporting the display panel (20), and a rear cover (10) for covering the rear of the frame (21).

[0044] The display panel (20) may include a plurality of display modules (30A-30P), a driving board (not shown) that drives each of the display modules (30A-30P), and a TCON board (Timing controller board) that generates a timing signal required for controlling each of the display modules (30A-30P).

[0045] The rear cover (10) can support the display panel (20). The rear cover (10) can be installed on the floor via a stand (not shown), or can be installed on a wall via a hanger (not shown).

[0046] A plurality of display modules (30A-30P) can be arranged vertically, horizontally, and horizontally so as to be adjacent to each other. A plurality of display modules (30A-30P) can be arranged in a matrix form of M * N. In the present embodiment, 16 display modules (30A-30P) are provided and arranged in a matrix form of 4 * 4, but there is no limitation on the number and arrangement method of the plurality of display modules (30A-30P).

[0047] A plurality of display modules (30A-30P) can be installed on the frame (15). The plurality of display modules (30A-30P) can be installed on the frame (15) using various known methods, such as magnetic force using a magnet or a mechanical fitting structure. A rear cover (10) is coupled to the rear of the frame (15), and the rear cover (10) can form the rear exterior of the display device (1).

[0048] The rear cover (10) may include a metal material. Accordingly, heat generated from the plurality of display modules (30A-30P) and the frame (15) can be easily conducted to the rear cover (10), thereby increasing the heat dissipation efficiency of the display device (1).

[0049] In this way, the display device (1) according to the embodiment of the present disclosure can implement a large screen by tiling a plurality of display modules (30A-30P).

[0050] Unlike the embodiment of the present disclosure, each of the plurality of display modules (30A-30P) may be applied to a display device. For example, the display module (30A-30P) may be installed and applied as a single unit in a wearable device, a portable device, a handheld device, and various electronic products or battlefields requiring a display, and may be applied to a display device such as a monitor for a personal computer (PC), a high-resolution TV, and signage, an electronic display, etc. through a plurality of assembly arrangements in a matrix type as in the embodiment of the present disclosure.

[0051] Multiple display modules (30A-30P) may have identical configurations. Therefore, the description of any one display module described below may be applied equally to all other display modules.

[0052] In the following, all of the plurality of display modules (30A-30P) are formed identically, and each of the plurality of display modules (30A-30P) will be described based on the first display module (30A).

[0053] For example, to avoid redundant description, the configuration of multiple display modules (30A-30P) is described as a display module (30), a substrate (40), and a front cover (70).

[0054] In addition, a description is given of a first display module (30A) among a plurality of display modules (30A-30P) as needed, a second display module (30E) arranged adjacent to the first display module (30A) in the second direction (Y), or a third display module (30B) arranged adjacent to the first display module (30A) in the third direction (Z).

[0055] Among the plurality of display modules (30A-30P), the first display module (30A) may be formed in a quadrangle type, for example. The first display module (30A) may be formed in a rectangular (rectangle type) shape or a square (square type) shape.

[0056] Accordingly, the first display module (30A) may include edges (31, 32, 33, 34) formed in the up, down, left, and right directions based on the first direction (X) that is the front.

[0057] For example, it can be assumed that the first direction (X) facing the front of the display device (1) is orthogonal to the first direction (X), the left-right direction of the display device (1) is orthogonal to the second direction (Y), the first direction (X) and the second direction (Y), and the up-down direction of the display device (1) is orthogonal to the third direction (Z).

[0058] Referring to FIGS. 3 and 4, the side wiring (46) can extend along the third direction (Z) to the chamfer portion (49) of the substrate (40) and the side (45) to the back surface (43) of the substrate (40).

[0059] However, without being limited thereto, the wiring (46) may extend along the second direction (Y) to the chamfered portion (49) and the side (45) of the substrate (40) in the second direction (Y) to the back surface (43) of the substrate (40).

[0060] According to one embodiment of the present disclosure, the side wiring (46) may be arranged to extend along one edge (E) of the substrate (40) corresponding to the upper edge (32) and lower edge (34) of the first display module (30A).

[0061] However, without being limited thereto, the side wiring (46) may extend along the edge (E) of the substrate (40) corresponding to at least two of the four edges (31, 32, 33, 34) of the first display module (30A).

[0062] The upper wiring layer (not shown) can be connected to the side wiring (46) by the upper connection pad (not shown) formed on the edge (E) side of the substrate (40).

[0063] The side wiring (46) can extend along the side (45) of the substrate (40) and be connected to the rear wiring layer (43b) formed on the back surface (43).

[0064] An insulating layer (43c) covering the rear wiring layer (43b) can be formed on the rear wiring layer (43b) in the direction in which the rear surface of the substrate (40) faces.

[0065] The display device may include a plurality of inorganic light-emitting elements (50). The plurality of inorganic light-emitting elements (50) may be sequentially electrically connected to a top wiring layer (not shown), a side wiring layer (46), and a rear wiring layer (43b).

[0066] In addition, the display module (30A) may include a driving circuit board (80) provided to electrically control a plurality of inorganic light-emitting elements (50) mounted on the mounting surface (41). The driving circuit board (80) may be formed as a printed circuit board. The driving circuit board (80) may be disposed on the back surface (43) of the substrate (40) in the first direction (X). It may be disposed on a metal plate (60) adhered to the back surface (43) of the substrate (40).

[0067] The display module (30A) may include a flexible film (81) that connects the driving circuit board (80) and the rear wiring layer (43b) so that the driving circuit board (80) is electrically connected to a plurality of inorganic light-emitting elements (50).

[0068] In detail, one end of the flexible film (81) can be placed on the back surface (43) of the substrate (40) and connected to a rear connection pad (43d) that is electrically connected to a plurality of inorganic light-emitting elements (50).

[0069] The rear connection pad (43d) can be electrically connected to the rear wiring layer (43b). Accordingly, the rear connection pad (43d) can electrically connect the rear wiring layer (43b) and the flexible film (81).

[0070] The flexible film (81) can transmit power and electrical signals from the driving circuit board (80) to a plurality of inorganic light-emitting elements (50) by being electrically connected to the rear connection pad (43d).

[0071] The flexible film (81) can be formed as an FFC (Flexible Flat Cable) or COF (Chip On Film).

[0072] The flexible film (81) may include a first flexible film (81a) and a second flexible film (81b) which are respectively arranged in the up-down direction with respect to the first forward direction (X).

[0073] The first and second flexible films (81a, 81b) are not limited thereto and may be arranged in the left and right directions with respect to the first direction (X), or may be arranged in at least two directions from the up, down, left, and right directions, respectively.

[0074] The second flexible film (81b) may be provided in multiple pieces. However, the present invention is not limited thereto, and the second flexible film (81b) may be provided in single pieces, and the first flexible film (81a) may also be provided in multiple pieces.

[0075] The first flexible film (81a) can transmit a data signal from the driving circuit board (80) to the substrate (40). The first flexible film (81a) can be formed of a COF.

[0076] The second flexible film (81b) can transmit power from the driving circuit board (80) to the substrate (40). The second flexible film (81b) can be provided as an FFC.

[0077] However, it is not limited to this, and the first and second flexible films (81a, 81b) may be formed opposite to each other.

[0078] The driving circuit board (80) may be electrically connected to the main board (25, see FIG. 2), although not shown in the drawing. The main board (25) may be placed on the rear side of the frame (15), and the main board (25) may be connected to the driving circuit board (80) via a cable (not shown) at the rear of the frame (15).

[0079] The metal plate (60) may be arranged to be in contact with the substrate (40). The metal plate (60) and the substrate (40) may be bonded by a rear adhesive tape (61) placed between the back surface (43) of the substrate (40) and the metal plate (60) (see FIG. 5).

[0080] The metal plate (60) may be formed of a metal material with high thermal conductivity. For example, the metal plate (60) may be formed of aluminum.

[0081] Heat generated from a plurality of inorganic light-emitting elements (50) and TFT layers (44) mounted on a substrate (40) can be transferred to a metal plate (60) through a rear adhesive tape (61) along the back surface (43) of the substrate (40).

[0082] Accordingly, heat generated from the substrate (40) can be easily transferred to the metal plate (60), and the substrate (40) can be prevented from rising above a certain temperature.

[0083] A plurality of display modules (30A-30P) can be arranged in various positions in a matrix form of M * N, respectively. Each of the display modules (30A-30P) is provided to be individually movable. At this time, each of the display modules (30A-30P) includes a metal plate (60) individually, so that each of the display modules (30A-30P) can maintain a constant level of heat dissipation performance regardless of the position in which it is arranged.

[0084] A plurality of display modules (30A-30P) can form screens of various sizes of the display device (1) in a matrix form of various M * N. Accordingly, rather than heat dissipation through a single metal plate provided for heat dissipation, as in one embodiment of the present disclosure, each of the display modules (30A-30P) includes an independent metal plate (60) so that each of the display modules (30A-30P) individually dissipates heat, thereby improving the heat dissipation performance of the entire display device (1).

[0085] When a single metal plate is placed inside a display device (1), some of the metal plate may not be placed at a position corresponding to a position where some display modules are placed based on the front-back direction, and the metal plate may be placed at a position where no display module is placed, which may lower the heat dissipation efficiency of the display device (1).

[0086] Through the metal plate (60) placed on each display module (30A-30P), all display modules (30A-30P) can dissipate heat independently through each metal plate (60), regardless of where each display module (30A-30P) is placed, thereby improving the heat dissipation performance of the entire display device (1).

[0087] The metal plate (60) can be provided in a rectangular shape that roughly corresponds to the shape of the substrate (40).

[0088] The area of ​​the substrate (40) may be provided to be at least equal to or larger than the area of ​​the metal plate (60). When the substrate (40) and the metal plate (60) are arranged in parallel in the first direction (X), the four edges of the rectangular substrate (40) based on the centers of the substrate (40) and the metal plate (60) may be formed to correspond to the four edges of the metal plate (60), or may be arranged to be arranged further outward based on the centers of the substrate (40) and the metal plate (60) than the four edges of the metal plate (60).

[0089] The four edges (E) of the substrate (40) may be arranged to be positioned outside the four edges of the metal plate (60). For example, the area of ​​the substrate (40) may be arranged to be larger than the area of ​​the metal plate (60).

[0090] When heat is transferred to each display module (30A-30P), the substrate (40) and the metal plate (60) may undergo thermal expansion. Since the metal plate (60) has a higher thermal expansion coefficient than the substrate (40), the expansion value of the metal plate (60) is higher than the expansion value of the substrate (40).

[0091] At this time, when the four edges (E) of the substrate (40) correspond to or are positioned further inside the four edges of the metal plate (60), the edges of the metal plate (60) may protrude outside the substrate (40).

[0092] Accordingly, the gap length formed between each display module (30A-30P) may be formed irregularly due to thermal expansion of the metal plate (60) of each module (30A-30P), and as a result, the recognition of some of the cores may increase, thereby reducing the sense of unity of the screen of the display panel (20).

[0093] However, when the four edges (E) of the substrate (40) are arranged to be placed outside the four edges of the metal plate (60), even if the substrate (40) and the metal plate (60) undergo thermal expansion, the metal plate (60) does not protrude outside the four edges (E) of the substrate (40), and accordingly, the gap length formed between each of the display modules (30A-30P) can be maintained constant.

[0094] Additionally, in order to maintain a constant gap length between each of the display modules (30A-30P), the frame (15) supporting each of the display modules (30A-30P) may include a front surface having material properties similar to those of the substrate (40). For example, the front surface of the frame (15) may be provided so that each of the display modules (30A-30P) is adhered to it.

[0095] According to one embodiment of the present disclosure, the area of ​​the substrate (40) and the area of ​​the metal plate (60) may be arranged to roughly correspond. Accordingly, heat generated from the substrate (40) may be uniformly dissipated throughout the entire area of ​​the substrate (40) without being isolated in a certain area.

[0096] The metal plate (60) may be arranged to be adhered to the back surface (43) of the substrate (40) by a rear adhesive tape (61).

[0097] The rear adhesive tape (61) may be provided in a size corresponding to that of the metal plate (60). For example, the area of ​​the rear adhesive tape (61) may be provided to correspond to that of the metal plate (60). The metal plate (60) may be provided in an approximately square shape, and the rear adhesive tape (61) may be provided in a square shape corresponding thereto.

[0098] The edges of the rectangular metal plate (60) and the edges of the rear adhesive tape (61) can be formed to correspond to each other based on the centers of the metal plate (60) and the rear adhesive tape (61).

[0099] Accordingly, the metal plate (60) and the rear adhesive tape (61) can be easily manufactured as a single combined configuration, thereby increasing the manufacturing efficiency of the entire display device (1).

[0100] For example, when a metal plate (60) is cut into units from one plate, a rear adhesive tape (61) is pre-adhered to one plate before the metal plate (60) is cut, and the rear adhesive tape (61) and the metal plate (60) are simultaneously cut into units, thereby reducing the process time.

[0101] Heat generated from the substrate (40) can be transferred to the metal plate (60) through the rear adhesive tape (61). Accordingly, the rear adhesive tape (61) can be arranged to simultaneously attach the metal plate (60) to the substrate (40) and transfer the heat generated from the substrate (40) to the metal plate (60).

[0102] Accordingly, the rear adhesive tape (61) may include a material with high heat dissipation performance.

[0103] Basically, the rear adhesive tape (61) may include a material having adhesive properties for bonding the substrate (40) and the metal plate (60).

[0104] Additionally, the rear adhesive tape (61) may include a material having higher heat dissipation performance than a material having general adhesive properties. Accordingly, heat can be efficiently transferred to each component between the substrate (40) and the metal plate (60).

[0105] Additionally, the material having the adhesive properties of the rear adhesive tape (61) can be formed of a material having higher heat dissipation performance than the adhesive material constituting the general adhesive.

[0106] Materials with high heat dissipation performance are materials that have high thermal conductivity, high thermal conductivity, and low specific heat, allowing them to effectively transfer heat.

[0107] For example, the rear adhesive tape (61) may include a graphite material. However, the present invention is not limited thereto, and the rear adhesive tape (61) may generally be made of a material having high heat dissipation performance.

[0108] The ductility of the rear adhesive tape (61) may be provided to be greater than the ductility of the substrate (40) and the ductility of the metal plate (60). Therefore, the rear adhesive tape (61) may be provided with a material that has adhesiveness and heat dissipation properties while also having high ductility. The rear adhesive tape (61) may be formed of an inorganic double-sided tape. As described above, the rear adhesive tape (61) is formed of an inorganic tape, and thus may be formed as a single layer without a substrate supporting one side and the other side between one side adhered to the substrate (40) and the other side adhered to the metal plate (60).

[0109] Since the rear adhesive tape (61) does not include a substrate, it does not include a material that interferes with heat conduction, and thus its heat dissipation performance can be improved. However, the rear adhesive tape (61) is not limited to a double-sided tape without a substrate, and may be prepared as a heat dissipation tape with better heat dissipation performance than a general double-sided tape.

[0110] The rear adhesive tape (61) may be made of a material with high ductility to absorb external force transmitted from the substrate (40) and the metal plate (60). Specifically, the ductility of the rear adhesive tape (61) may be made greater than the ductility of the substrate (40) and the ductility of the metal plate (60).

[0111] Accordingly, when heat is transferred to the substrate (40) and the metal plate (60), the external force generated from the change in the size of the substrate (40) and the metal plate (60) is transferred to the rear adhesive tape (61), and the rear adhesive tape (61) itself is deformed, thereby preventing the external force from being transferred to different configurations.

[0112] The rear adhesive tape (61) may have a predetermined thickness in the first direction (X). When heat is transferred to the metal plate (60) and it expands or contracts due to cooling, the metal plate (60) may expand or contract not only in the first direction (X) but also in a direction orthogonal to the first direction (X), and thus an external force may be transferred to the substrate (40).

[0113] As described above, the metal plate (60) is formed to have a size corresponding to that of the substrate (40) and is arranged to cover the entire back surface (43) of the substrate (40), and the fixing member (82) can be placed on the back surface of the metal plate (60).

[0114] However, without being limited thereto, the fixing member (82) may be arranged to be placed on the back surface (43) of the substrate (40). At this time, the substrate (40) may be directly bonded to the frame (15) through the fixing member (82).

[0115] Unlike one embodiment of the present disclosure, the metal plate (60) may be provided to cover only a portion of the back surface (43) of the substrate (40), and the fixing member (82) may be provided to be adhered to an area of ​​the back surface (43) of the substrate (40) that is not covered by the metal plate (60).

[0116] The fixing member (82) can be provided with, for example, double-sided tape.

[0117] Referring to FIG. 5, each of the plurality of display modules (30A-30P) may include a substrate (40) and a plurality of inorganic light-emitting elements (50) mounted on the substrate (40). The substrate (40) may be a light source substrate (40). The plurality of inorganic light-emitting elements (50) may be mounted on a mounting surface (41) of the substrate (40) facing in a first direction (X). The mounting surface (41) may be the first surface (41). In addition, the mounting surface (41) may be disposed on a first side of the substrate (40), and the metal plate (60) may be disposed on a second side of the substrate (40) opposite to the first side. In FIG. 5, the thickness of the substrate (40) in the first direction (X) is illustrated as being exaggerated for convenience of explanation. The first direction (X) may be forward.

[0118] The substrate (40) may be formed in a quadrangle type. As described above, each of the plurality of display modules (30A-30P) may be provided in a quadrangle shape, and the substrate (40) may be formed in a quadrangle type to correspond thereto.

[0119] The substrate (40) can be provided in a rectangular shape or a square shape.

[0120] Therefore, taking the first display module (30A) as an example, the substrate (40) may include four borders (E) corresponding to the borders (31, 32, 33, 34) of the first display module (30A) formed in the up, down, left, and right directions based on the first direction (X) that is the front. (See Fig. 4)

[0121] The substrate (40) may include a substrate body (42), a mounting surface (41) forming one side of the substrate body (42), a back surface (43) forming the other side of the substrate body (42) and positioned opposite the mounting surface (41), and a side surface (45) positioned between the mounting surface (41) and the back surface (43).

[0122] The side surface (45) can form the side edge of the substrate (40) in the second direction (Y) and the third direction (Z) orthogonal to the first direction (X).

[0123] The substrate (40) may include a chamfer portion (49) formed between the mounting surface (41) and the side surface (45) and between the back surface (43) and the side surface (45).

[0124] The chamfer portion (49) can prevent each substrate from colliding and being damaged when multiple display modules (30A-30P) are arranged.

[0125] The border (E) of the substrate (40) is a concept that includes a side (45) and a chamfered portion (49).

[0126] The substrate (40) may include a TFT layer (Thin Film Transistor, 44) formed on the substrate body (42) to drive the inorganic light-emitting elements (50). The substrate body (42) may include a glass substrate. For example, the substrate (40) may include a COG (Chip on Glass) type substrate. The substrate (40) may have first and second pad electrodes (44a, 44b) formed thereon to electrically connect the inorganic light-emitting elements (50) to the TFT layer (44).

[0127] The TFT (Thin Film Transistor) constituting the TFT layer (44) is not limited to a specific structure or type and may be configured in various embodiments. For example, the TFT of the TFT layer (44) according to one embodiment of the present disclosure may be implemented not only as an LTPS (Low Temperature Poly Silicon) TFT, an oxide TFT, a Si (poly silicon, or a-silicon) TFT, but also as an organic TFT, a graphene TFT, etc.

[0128] Additionally, the TFT layer (44) can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type or n-type MOSFET or p-type MOSFET transistor when the substrate body (42) of the substrate (40) is made of a silicon wafer.

[0129] The plurality of inorganic light-emitting elements (50) are formed of an inorganic material and may include inorganic light-emitting elements having a size of several μm to several tens of μm in length, width, and height, respectively. The micro inorganic light-emitting elements may have a size in which the length of a short side among the length, width, and height is 100 μm or less. For example, the inorganic light-emitting elements (50) may be picked up from a sapphire or silicon wafer and directly transferred onto a substrate (40). The plurality of inorganic light-emitting elements (50) may be picked up and transferred by an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicon as a head.

[0130] The plurality of inorganic light-emitting elements (50) may be a light-emitting structure including an n-type semiconductor (58a), an active layer (58c), and a p-type semiconductor (58b).

[0131] The display module (30) may further include a first contact electrode (57a) and a second contact electrode (57b). However, the first contact electrode (57a) and the second contact electrode (57b) may also be included in a plurality of inorganic light-emitting elements (50).

[0132] Although not shown in the drawing, one of the first contact electrodes (57a) may be electrically connected to the n-type semiconductor (58a) of the second contact electrode (57b) and the other may be electrically connected to the p-type semiconductor (58b).

[0133] The first contact electrode (57a) and the second contact electrode (57b) may be horizontally arranged and may be in the form of a flip chip arranged in the same direction (opposite to the light-emitting direction).

[0134] The inorganic light-emitting element (50) has a light-emitting surface (54) arranged toward the first direction (X) when mounted on the mounting surface (41), a side surface (55), and a bottom surface (56) arranged on the opposite side of the light-emitting surface (54), and a first contact electrode (57a) and a second contact electrode (57b) can be formed on the bottom surface (56).

[0135] For example, the contact electrodes (57a, 57b) of the inorganic light-emitting element (50) may be placed on the opposite side of the light-emitting surface (54) and thus on the opposite side of the direction in which light is irradiated.

[0136] The contact electrodes (57a, 57b) are arranged to face the mounting surface (41) and are electrically connected to the TFT layer (43), and a light-emitting surface (54) that irradiates light in a direction opposite to the direction in which the contact electrodes (57a, 57b) are arranged can be arranged.

[0137] Therefore, when light generated from the active layer (58c) is irradiated in the first direction (X) through the light-emitting surface (54), the light can be irradiated toward the first direction (X) without interference from the first contact electrode (57a) or the second contact electrode (57b).

[0138] For example, the first direction (X) can be defined as the direction in which the light-emitting surface (54) is positioned to irradiate light.

[0139] The first contact electrode (57a) and the second contact electrode (57b) can be electrically connected to the first pad electrode (44a) and the second pad electrode (44b) formed on the mounting surface (41) side of the substrate (40), respectively.

[0140] The inorganic light emitting element (50) can be directly connected to the pad electrodes (44a, 44b) through a bonding configuration such as an anisotropic conductive layer (47) or solder.

[0141] An anisotropic conductive layer (47) may be formed on the substrate (40) to mediate electrical connection between the contact electrodes (57a, 57b) and the pad electrodes (44a, 44b). The anisotropic conductive layer (47) may have a structure in which an anisotropic conductive adhesive is attached on a protective film and conductive balls (47a) are dispersed in an adhesive resin. The conductive balls (47a) are conductive spheres surrounded by a thin insulating film, and when the insulating film is broken by pressure, the conductors can be electrically connected to each other.

[0142] The anisotropic conductive layer (47) may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0143] In an embodiment according to the present disclosure, the anisotropic conductive layer (47) may be formed as an anisotropic conductive film.

[0144] Accordingly, when a plurality of inorganic light-emitting elements (50) are mounted on a substrate (40), when pressure is applied to the anisotropic conductive layer (47), the insulating film of the conductive ball (47a) is broken, so that the contact electrodes (57a, 57b) of the inorganic light-emitting elements (50) and the pad electrodes (44a, 44b) of the substrate (40) can be electrically connected.

[0145] However, although not shown in the drawing, a plurality of inorganic light-emitting elements (50) may be mounted on the substrate (40) via solder (not shown) instead of the anisotropic conductive layer (47). After the inorganic light-emitting elements (50) are aligned on the substrate (40), the inorganic light-emitting elements (50) may be bonded to the substrate (40) through a reflow process.

[0146] The anisotropic conductive layer (47) may be formed in a dark color. For example, the anisotropic conductive layer (47) may enhance the contrast of the screen by absorbing external light and making the substrate (40) appear black. The anisotropic conductive layer (47) formed in a dark color may complement the light absorption layer (44c) formed entirely on the mounting surface (41) side of the substrate (40).

[0147] The display device may include a plurality of inorganic light-emitting elements (50). The plurality of inorganic light-emitting elements may include a blue light-emitting element (50). For example, the plurality of inorganic light-emitting elements (50) may all be blue inorganic light-emitting elements (50). However, the present invention is not limited thereto, and the inorganic light-emitting elements (50) may also be a red light-emitting element (50) and a green light-emitting element (50).

[0148] The inorganic light-emitting element (50) may include a first inorganic light-emitting element (51), a second inorganic light-emitting element (52), and a third inorganic light-emitting element (53). The third inorganic light-emitting element (53) may be disposed between the first inorganic light-emitting element (51) and the second inorganic light-emitting element (52). However, the name of the inorganic light-emitting element (50) is not limited to the above-described example. For example, the inorganic light-emitting element disposed between the first inorganic light-emitting element (51) and the third inorganic light-emitting element (52) may be the second inorganic light-emitting element (53). Alternatively, the inorganic light-emitting element disposed between the second inorganic light-emitting element (51) and the third inorganic light-emitting element (52) may be the first inorganic light-emitting element (53).

[0149] The first inorganic light-emitting element (51), the second inorganic light-emitting element (52), and the third inorganic light-emitting element (53) may be arranged in a row at a predetermined interval as in the embodiment of the present disclosure, or may be arranged in a different shape, such as a triangular shape.

[0150] The display device may further include a color layer (100). The color layer (100) may convert the color of light emitted from the inorganic light-emitting element (50). The color layer (100) may be disposed between the front cover (70) and the inorganic light-emitting element (50). For example, the color layer (100) may be disposed between the front cover (70) and the adhesive layer (200) along the first direction (X). The color layer (100) may be disposed in front of the inorganic light-emitting element (50).

[0151] The color layer (100) may include an optical layer (110, 120, 130). The optical layer (110, 120, 130) may diffuse light emitted forward from the inorganic light-emitting element (50). For example, the optical layer (110, 120, 130) may diffuse light emitted from the inorganic light-emitting element (50) toward the front cover (70). The optical layer (110, 120, 130) may be referred to as a light diffusion layer (110, 120, 130).

[0152] The color layer (100) may include a resin (111, 121) and a color conversion material (112, 122). The resin (111, 121) and the color conversion material (112, 122) may be in a mixed state. The resin (111, 121) may exhibit a transparent color. The resin (111, 121) or a mixture of the resin (111, 121) and the color conversion material (112, 122) may be provided in the optical layer (110, 120, 130).

[0153] Light emitted from an inorganic light-emitting element (50) may be color-converted as it passes through a color-conversion material (112, 122). For example, the color-conversion material (112, 122) may include a quantum dot (112, 122). However, the type of the color-conversion material (112, 122) is not limited to the above-described examples.

[0154] The optical layers (110, 120, 130) may include a first optical layer (110), a second optical layer (120), and a third optical layer (130). The first optical layer (110) may correspond to the first inorganic light-emitting element (51), the second optical layer (120) may correspond to the second inorganic light-emitting element (52), and the third optical layer (130) may be positioned corresponding to the third inorganic light-emitting element (53).

[0155] For example, light emitted from the first inorganic light-emitting element (51) can pass through the first optical layer (110). Light passing through the first optical layer (110) can be diffused and / or emitted forward (see FIG. 6). For example, light passing through the first optical layer (110) can exhibit a Lambertian emission pattern. The first optical layer (110) can be a first color conversion layer (110). Light passing through the first color conversion layer (110) can exhibit a first color. For example, when the inorganic light-emitting element (50) is a blue inorganic light-emitting element (50), the first color can be green. For example, the first color conversion layer (110) can be a green conversion layer.

[0156] A resin (111) and a quantum dot (112) may be arranged within the first color conversion layer (110). The quantum dot (112) may be arranged within the resin (111). The quantum dot (112) arranged within the first color conversion layer (110) may convert light passing through the first color conversion layer (110) into green light. The light passing through the first color conversion layer (110) may be absorbed by the quantum dot (112) and then emitted to exhibit a color, and may be emitted in all directions. Therefore, the light passing through the first color conversion layer (110) may exhibit a Lambertian emission pattern and may face forward. The quantum dot (112) within the first color conversion layer (110) may be the first quantum dot (112).

[0157] Also, for example, light emitted from the second inorganic light-emitting element (52) can pass through the second optical layer (120). Light passing through the second optical layer (120) can be diffused and / or emitted forward (see FIG. 6). For example, light passing through the second optical layer (120) can exhibit a Lambertian emission pattern. The second optical layer (120) can be a second color conversion layer (120). Light passing through the second color conversion layer (120) can exhibit a second color. For example, when the inorganic light-emitting element (50) is a blue inorganic light-emitting element (50), the second color can be red. For example, the second color conversion layer (120) can be a red conversion layer.

[0158] A resin (121) and a quantum dot (122) may also be arranged within the second color conversion layer (120). The quantum dot (122) may be arranged within the resin (121). The quantum dot (122) arranged within the second color conversion layer (120) may convert light passing through the second color conversion layer (120) into red light. The light passing through the second color conversion layer (120) may be absorbed by the quantum dot (122) and then emitted to exhibit a color, and may be emitted in all directions. Therefore, the light passing through the second color conversion layer (120) may exhibit a Lambertian emission pattern and may face forward. The quantum dot (122) within the second color conversion layer (120) may be a second quantum dot (122).

[0159] Additionally, for example, light emitted from the third inorganic light-emitting element (53) can pass through the third optical layer (130) (see FIG. 6). The third optical layer (130) can be a scattering layer (130). Light passing through the scattering layer (130) can be diffused and / or emitted forward. Resin can also be disposed within the scattering layer (130). Details regarding the scattering layer (130) will be described later.

[0160] The color layer (100) and the inorganic light-emitting element can form one pixel. For example, a plurality of inorganic light-emitting elements (50) and the first color conversion layer (110), the second color conversion layer (120), and the scattering layer (130) can form one pixel. At this time, the first inorganic light-emitting element (51) and the first color conversion layer (110), the second inorganic light-emitting element (52) and the second color conversion layer (120), and the third inorganic light-emitting element (53) and the scattering layer (130) can each form a sub-pixel. For example, the first inorganic light-emitting element (51) and the first color conversion layer (110) can form a green sub-pixel, the second inorganic light-emitting element (52) and the second color conversion layer (120) can form a red sub-pixel, and the third inorganic light-emitting element (53) and the scattering layer (130) can form a blue sub-pixel.

[0161] The color layer (100) may further include a position guide (140). The position guide (140) may guide the positions of the first color conversion layer (110), the second color conversion layer (120), and the scattering layer (130). Each of the first color conversion layer (110), the second color conversion layer (120), and the scattering layer (130) may be positioned at their respective positions by the position guide (140). The position guide (140) may guide the positions of the resin (111, 121, 131, see FIG. 6), the quantum dots (112, 122), and the scattering particles (132, see FIG. 6). The position guide (140) may be formed of an organic material and may include a dark color. For example, the position guide (140) may be formed of a gray color. The position guide (140) may be formed of a material having low transmittance. For example, the position guide (140) may be made of a material having high light absorption or high reflectivity. Accordingly, the position guide (140) may absorb and / or reflect light directed toward the position guide (140) among the light diffused from the first color conversion layer (110), the second color conversion layer (120), and the scattering layer (130). The position guide (140) may be referred to as a partition wall (140).

[0162] The position guide (140) may be placed between the front cover (70) and the inorganic light emitting element (50). For example, the position guide (140) may be placed between the black matrix (90) and the adhesive layer (200) along the first direction (X).

[0163] The display device may further include a black matrix (90). For example, the color layer (100) may include a black matrix (90). The black matrix (90) may absorb external light reflection and improve contrast. For example, the black matrix (90) may be arranged between the position guide (140) and the front cover (70) along the first direction (X). A color filter (150) may be arranged between the black matrices (90).

[0164] The display device may further include a color filter (150). For example, the color filter (150) may be disposed between the front cover (70) and each optical layer (110, 120), 130) along the first direction (X). The color filter (150) may be disposed between the black matrices (90) along the second direction (Y) or the third direction (Z).

[0165] The color filter (150) can remove noise from light emitted forward from each optical layer (110, 120, 130). For example, the inorganic light-emitting element (50) can be a blue inorganic light-emitting element, and the color filter (150) can remove light among the blue light that is not converted by the color conversion layer (110, 120).

[0166] For example, the color filter (150) may include a first color filter (151), a second color filter (152), and a third color filter (153). The first color filter (151) may remove noise from light emitted forward from the first color conversion layer (110). For example, light passing through the first color conversion layer (110) may be green light having a first wavelength representing green, and the first color filter (151) may remove light having a wavelength other than the first wavelength representing green (or in a different range). The second color filter may remove noise from light emitted forward from the second color conversion layer (120). For example, light passing through the second color conversion layer (120) can be red light having a second wavelength representing red, and the second color filter (152) can remove light having a wavelength other than the second wavelength representing red (or in a different range). The third color filter (153) can remove noise of light emitted forward from the scattering layer (130). For example, light emitted from the inorganic light-emitting element (50) can be blue light having a third wavelength representing blue, and the third color filter (153) can remove light having a wavelength other than the third wavelength representing blue (or in a different range).

[0167] The substrate (40) may include a light absorbing layer (44c) to absorb external light and improve contrast. The light absorbing layer (44c) may be formed on the entire mounting surface (41) of the substrate (40). The light absorbing layer (44c) may be formed between the TFT layer (43) and the anisotropic conductive layer (47).

[0168] Each of the plurality of display modules (30A-30P) may include a front cover (70) disposed on the mounting surface (41) in the first direction (X) to cover the mounting surface (41), the inorganic light emitting element (50) and / or the color layer (100) of the plurality of display modules (30A-30P).

[0169] A front cover (70) may be provided in multiple numbers so as to be formed on each of the multiple display modules (30A-30P) in the first direction (X).

[0170] A plurality of display modules (30A-30P) can be assembled after each separate front cover (70) is placed. For example, among the plurality of display modules (30A-30P), the first display module (30A) and the second display module (30E) can have a first front cover formed on the mounting surface (41) of the first display module (30A) and a second front cover formed on the mounting surface (41) of the second display module (30E).

[0171] The front cover (70) is provided to cover the substrate (40) and can protect the substrate (40) from external force or external moisture.

[0172] The front cover (70) may be formed of a functional film having optical performance in multiple layers (not shown). For example, the front cover (70) may be a surface film.

[0173] Some of the multiple layers (not shown) of the front cover (70) may include a base layer (not shown) formed of an optical clear resin (OCR). The base layer (not shown) may be configured to support other multiple layers (not shown). The optical clear resin (OCR) may be highly transparent, having a transmittance of 90% or more.

[0174] Optically clear resins (OCRs) can enhance visibility and image quality by increasing transmittance through their low-reflection properties. For example, in structures with air gaps, light loss occurs due to differences in refractive indices between the film and air layers. However, structures utilizing OCRs reduce this difference in refractive indices, thereby reducing light loss and ultimately improving visibility and image quality.

[0175] Optically clear resin (OCR) can have advantages in terms of protecting the substrate (40) as well as improving image quality.

[0176] The display device may include an adhesive layer (200) provided so that the front cover (70) is adhered to the mounting surface (41) of the substrate (40).

[0177] Typically, the front cover (70) can be provided to have a height greater than a predetermined height in the first direction (X) toward which the mounting surface (41) or the light-emitting surface (54) faces.

[0178] When the front cover (70) is formed on the substrate (40), the gap that may be formed between the front cover (70) and the plurality of inorganic light-emitting elements (50) is sufficiently filled.

[0179] Additionally, each of the plurality of display modules (30A-30P) may include a rear adhesive tape (61) disposed between the rear surface (43) and the metal plate (60) to adhere the rear surface (43) of the substrate (40) and the metal plate (60).

[0180] The rear adhesive tape (61) may be provided as a double-sided adhesive tape, but is not limited thereto, and may be provided in the form of an adhesive layer rather than a tape shape. For example, the rear adhesive tape (61) is not limited to a tape as an example of a medium for bonding the back surface (43) of the metal plate (60) and the substrate (40), and may be provided in various medium shapes.

[0181] A plurality of inorganic light-emitting elements (50) can be electrically connected to a pixel driving wiring (not shown) formed on a mounting surface (41) and an upper wiring layer (not shown) formed by extending through a side surface (45) of a substrate (40) and the pixel driving wiring (not shown).

[0182] The upper wiring layer (not shown) may be formed on the lower side of the two-way conductive layer (47). The upper wiring layer (not shown) may be electrically connected to the side wiring (46) formed on the side surface (45) of the substrate (40). The side wiring (46) may be provided in the form of a thin film (see FIG. 4).

[0183] A reflective layer (330) may be provided, arranged, positioned, and formed on the side surfaces (55) of a plurality of inorganic light-emitting elements (50). The reflective layer (330) may be formed on each of the two side surfaces (55) of the inorganic light-emitting element (50). The reflective layer (330) may improve the characteristics of light emitted from the inorganic light-emitting element (50). For example, light emitted from the inorganic light-emitting element (50) may be reflected by the reflective layer (330) at the two side surfaces (55), thereby providing a display device in which the viewing angle and / or the orientation angle are concentrated in a certain direction. Accordingly, the light collection efficiency of the display device may be improved. The reflective layer (330) may be a reflective film. A method of manufacturing the reflective layer (330) will be described later.

[0184] FIG. 6 is an enlarged cross-sectional view of a portion of a display module in a display device according to one embodiment of the present disclosure. FIG. 6 is an enlarged view schematically illustrating a portion of the portion illustrated in FIG. 5.

[0185] Referring to FIG. 6, in a display device according to one embodiment, each display module may include an inorganic light-emitting element (50) and a color layer (100). Light emitted from the inorganic light-emitting element (50) may be directed toward the color layer (100).

[0186] The color layer (100) may include a scattering layer (130). A resin (131) and scattering particles (132) may be provided within the scattering layer (130). The resin (131) and scattering particles (132) may be mixed within the scattering layer (130). The scattering particles (132) may cause light emitted forward from the inorganic light-emitting element (50) to be scattered. For example, light emitted from the third inorganic light-emitting element (53) may collide with the scattering particles (132), thereby forming a large emission angle toward the forward direction. However, the scattering particles (132) may be omitted.

[0187] For example, light emitted from the inorganic light-emitting element (50) may be absorbed and / or reflected by the position guide (140), or the light emission pattern may be reduced for other reasons, thereby reducing the viewing angle. However, light passing through the first color conversion layer (110) and the second color conversion layer (120) may be absorbed by the quantum dots (112, 122) and then emitted in all directions. Therefore, light passing through the first color conversion layer (110) and the second color conversion layer (120) may exhibit a Lambertian emission pattern and thus have a wide viewing angle. For example, the viewing angle of light emitted from the first inorganic light-emitting element (51) and the second inorganic light-emitting element (52) may increase.

[0188] In addition, light passing through the scattering layer (130) may collide with scattering particles (132) to improve the light emission pattern. For example, a portion of the light emitted from the third inorganic light-emitting element (53) may pass through the scattering layer (130), and a portion may be absorbed and / or reflected by the position guide (140). Just as the quantum dots (112, 122) improve the light emission pattern, the scattering particles (132) may scatter the light incident on the scattering layer (130). For example, the scattering particles (132) may collide with the light incident on the scattering layer (130) to allow the light to have a wide viewing angle toward the front. For example, the viewing angle of the light emitted from the third inorganic light-emitting element (53) may increase. Accordingly, when a user views the display device, color coordinate distortion according to the viewing angle of the display device may be minimized.

[0189] The scattering particles (132) may include TiO2, ZnO, ZrO2, and Al2O3. For example, the scattering particles (132) are provided in multiple numbers, and each scattering particle (132) may be formed of TiO2, ZnO, ZrO2, and Al2O3, respectively. In addition, the multiple scattering particles (132) may include at least one of TiO2, ZnO, ZrO2, and Al2O3, and it is also possible for N / 4 of the N scattering particles (132) to be formed of TiO2, ZnO, ZrO2, and Al2O3, respectively. However, the composition of the scattering particles (132) is not limited to the above-described example.

[0190] Additionally, the scattering particles (132) can be formed to have a size of 100 to 500 nm. However, the size of the scattering particles (132) is not limited to the above-described example.

[0191] In addition, the content of the scattering particles (132) may be 2 to 10 wt%. For example, the scattering particles (132) may be mixed with the resin, and the content of the scattering particles (132) may be a value obtained by dividing the sum of the weight of the scattering particles and the weight of the resin by the weight of the scattering particles ((weight of the scattering particles) / (weight of the scattering particles+weight of the resin)=2 to 10 wt%). However, the content of the scattering particles (132) is not limited to the above-described example.

[0192] A color layer (100) including a scattering layer (130) can be manufactured with the front cover (70) positioned below and the position guide (140) positioned above. For example, the scattering layer (130) can be formed by applying a scattering particle solution in which a resin (131) and scattering particles (132) are mixed, and then curing the scattering particle solution. Thereafter, the color layer (100) including the scattering layer (130) can be rotated 180 degrees to be bonded, combined, and / or attached to the inorganic light-emitting element (50) and the anisotropic conductive layer (47) through the adhesive layer (200).

[0193] Fig. 7 is an enlarged cross-sectional view of a portion of a display module in a display device according to one embodiment of the present disclosure. Fig. 7 is an enlarged view schematically illustrating a portion of the portion illustrated in Fig. 5.

[0194] Referring to FIG. 7, a display device according to one embodiment illustrates a first color conversion layer (110) and / or a second color conversion layer (120). Alternatively, at least one of the first color conversion layer (110) and the second color conversion layer (120) is illustrated.

[0195] The color filter (150) may include a resin layer (101) in which transparent resin (111, 121) is provided, and a quantum dot layer (102) in which the resin (111, 121) and quantum dots (112, 122) are mixed.

[0196] Light emitted forward from the inorganic light-emitting element (50) may exhibit a Lambertian emission pattern by the quantum dots (121, 122) as it passes through the quantum dot layer (102). For example, light emitted from the first inorganic light-emitting element (51) and / or the second inorganic light-emitting element (52) may be absorbed by the quantum dots (121, 122) and then emitted in all directions.

[0197] In one embodiment, the quantum dot layer (102) may be formed at the bottom within the color conversion layer (110, 120) and / or the color layer (100). The thickness ratio of the quantum dot layer (102) to the thickness of the color conversion layer (110, 120) and / or the color layer (100) may be 0.2 to 1. Since the quantum dot layer (102) is positioned at the bottom within the color conversion layer (110, 120), a portion of the light re-emitted from the quantum dot layer (102) may be absorbed by the position guide (140), and the unabsorbed light may be radiated forward. Accordingly, the emission angle of the light radiated from the color conversion layer (110, 120) may be reduced.

[0198] Light emitted from red and green subpixels may have less luminance reduction than light scattered from blue subpixels, which may cause luminance differences and thus color coordinate distortion depending on the viewing angle.

[0199] According to one embodiment, the emission angle of light emitted from the color conversion layer (110, 120) can be reduced, so that the difference in brightness between sub-pixels can be reduced and the occurrence of color coordinate distortion can be minimized.

[0200] The color conversion layer (110, 120) according to FIG. 7 can apply a resin solution made of resin (111, 121) to the space within the color conversion layer (110, 120) so that the front cover (70) is positioned below the color layer (100). Thereafter, a process of immediately curing the resin solution is performed. After the resin solution is cured, a quantum dot solution in which the resin (111, 121) and quantum dots (112, 122) are mixed can be additionally applied. The quantum dot solution can be applied within the color conversion layer (110, 120) to have a thickness thinner than that of the final color conversion layer (110, 120). Thereafter, a process of immediately curing the quantum dot solution is performed.

[0201] Afterwards, the color layer (100) including the manufactured color conversion layer (110, 120) can be rotated 180 degrees and bonded, combined, and / or attached to the inorganic light-emitting element (50) and the anisotropic conductive layer (47) through the adhesive layer (200).

[0202] Quantum dots (112, 122) may be positioned to one side within the color conversion layer (110, 120). For example, the quantum dots (112, 122) may be positioned adjacent to the adhesive layer (200) and / or the inorganic light-emitting element (50). For example, the quantum dots (112, 122) may be positioned at the rear within the color conversion layer (110, 120). The ratio (d2 / d1) of the thickness (d2) of the quantum dot layer (102) on which the quantum dots (112, 122) are positioned and the thickness (d1) of the color conversion layer (110, 120) may be 0.2 to 1.

[0203] Within the color conversion layer (110, 120), a heterogeneous structure can be formed between a quantum dot layer (102) in which resins (111, 121) and quantum dots (112, 122) are mixed and arranged, and a resin layer in which only resins (111, 121) are arranged. The quantum dot layer (102) can be arranged at the bottom within the color conversion layer (110, 120).

[0204] As described above, a portion of the light emitted from the quantum dot layer (102) positioned below the color conversion layer (110, 120) may be absorbed by the position guide (140), and the unabsorbed light may be emitted forward. Accordingly, the emission angle of the light emitted from the color conversion layer (110, 120) may be reduced. The display device according to one embodiment may minimize color coordinate distortion according to the viewing angle by reducing the emission angle deviation of the light emitted from the red and / or green subpixels and the light emitted from the blue subpixels.

[0205] Conversely, if the red / green color filter layer is composed of a heterogeneous structure consisting of a transparent resin layer (top) and a quantum dot layer (bottom), the path of the converted light emitted from the lower quantum dot layer can be restricted. This structural change in the color filter can reduce the red / green emission angles emitted from the display.

[0206] FIG. 8 is a flowchart illustrating a process for manufacturing a display module in a display device according to an embodiment of the present disclosure. FIG. 9 is a flowchart illustrating a process for manufacturing a color layer of a display module in a display device according to an embodiment of the present disclosure. FIG. 10 is a schematic diagram illustrating a process for manufacturing a display module in a display device according to an embodiment of the present disclosure. FIG. 11 is a schematic diagram illustrating a process for manufacturing a display module in a display device according to an embodiment of the present disclosure. FIG. 12 is a schematic diagram illustrating a process for manufacturing a display module in a display device according to an embodiment of the present disclosure. FIG. 13 is a schematic diagram illustrating a process for manufacturing a display module in a display device according to an embodiment of the present disclosure. FIG. 14 is a schematic diagram illustrating a process for manufacturing a display module in a display device according to an embodiment of the present disclosure. FIG. 15 is a schematic diagram illustrating a process for manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0207] Referring to FIGS. 8 and 9, in a display device according to one embodiment, a method for manufacturing a display module may include forming (810) a light-emitting layer (310) on a base substrate (300).

[0208] The base substrate (300) may include a first surface (300a) and a second surface (300b) opposite to the first surface (300a). For example, the base substrate (300) may be positioned so that the first surface (300a) of the base substrate (300) faces upward and the second surface (300b) is supported on a flat floor or the like. For example, the base substrate (300) may be a sapphire substrate and / or a glass substrate.

[0209] The light-emitting layer (310) can be formed on the first surface (300a) of the base substrate (300). For example, the light-emitting layer (310) can be grown on the base substrate (300). For example, the second surface (310b) of the light-emitting layer (310) can be directly laminated on the first surface (300a) of the base substrate (300).

[0210] The light-emitting layer (310) may include a first surface (310a) and a second surface (310b) opposite to the first surface (310a). For example, the first surface (310a) of the light-emitting layer (310) may face upward, and the second surface (310b) may be in contact with the first surface (300a) of the base substrate (300).

[0211] The light-emitting layer (310) may include a plurality of semiconductor layers. For example, the light-emitting layer (310) may include a P-type semiconductor, an N-type semiconductor, a dielectric layer, a sub-light-emitting layer, etc. For example, the sub-light-emitting layer may be a blue light-emitting layer. However, the present invention is not limited thereto, and the sub-light-emitting layer may be a green light-emitting layer or a red light-emitting layer.

[0212] Additionally, the light-emitting layer (310) may include gallium nitride (GaN). For example, at least a portion of the light-emitting layer (310) may be formed of gallium nitride (GaN).

[0213] Referring to FIGS. 8 and 10, in a display device according to one embodiment, a method for manufacturing a display module may include placing (820) a mask pattern (320) on a light-emitting layer (310). The mask pattern (320) may include a cover covering the light-emitting layer (310).

[0214] The mask pattern (320) may be formed on the first surface (310a) of the light-emitting layer (310). For example, the mask pattern (320) may be placed on the first surface (310a) of the light-emitting layer (310).

[0215] The mask pattern (320) may include a first surface (320a) and a second surface (320b) opposite to the first surface (320a). For example, the first surface (320a) of the mask pattern (320) may face upward, and the second surface (320b) may face the first surface (310a) of the mask pattern (310).

[0216] The mask pattern (320) may include a photoresist. For example, a photoresist may be disposed on the first surface (310a) of the light-emitting layer (310).

[0217] The mask pattern (320) may include a PR mask. For example, photoresist may be applied to the first surface (310a) of the light-emitting layer (310), and a PR mask may be placed on the photoresist.

[0218] Additionally, the mask pattern (320) may include a fine metal mask (FMM). For example, a photoresist may be applied on the first surface (310a) of the light-emitting layer (310), and an FMM may be placed on the photoresist. For example, the FMM may include aluminum.

[0219] An opening (321) may be formed in the mask pattern (320). For example, when the mask pattern includes a photoresist, an opening (321) may also be formed in the photoresist through etching. In addition, for example, when the mask pattern includes a PR mask, an opening (321) is formed in the PR mask, and a portion of the light-emitting layer (310) provided under the opening (321) may be removed through etching. In addition, for example, when the mask pattern includes an FMM, an opening (321) is formed in the FMM, and a portion of the light-emitting layer (310) provided in the opening (321) may be removed through etching. The opening (321) may be a hole, a pattern, or the like.

[0220] Referring to FIGS. 8 and 11, in a display device according to one embodiment, a method for manufacturing a display module may include forming (830) a plurality of inorganic light-emitting elements (50). For example, the light-emitting layer (310) provided under the opening (321) may be exposed to light along the opening (321) and then etched and removed, thereby partitioning and / or forming the light-emitting layer (310) into a plurality of inorganic light-emitting elements (50) (Positive PR). In addition, for example, the light-emitting layer (310) not provided under the opening (321) may be exposed to light along the opening (321) and then etched and removed, thereby partitioning and / or forming the light-emitting layer (310) into a plurality of inorganic light-emitting elements (50) (Negative PR). The plurality of inorganic light-emitting elements (50) may be a plurality of light-emitting structures and / or a plurality of light-emitting layers. For example, when the mask pattern (320) includes a photoresist and a PR mask, the PR mask can be removed after the light-emitting layer (310) is divided and / or formed into a plurality of inorganic light-emitting elements (50).

[0221] As the light-emitting layer (310) is etched, a plurality of inorganic light-emitting elements (50) are formed, and the plurality of inorganic light-emitting elements (50) may include both side surfaces (310c, 310d). The side surfaces (55, see FIG. 5) of the plurality of inorganic light-emitting elements (50) may include both side surfaces (310c, 310d) of the plurality of inorganic light-emitting elements (310). The two side surfaces (310c, 310d) may include a third surface (310c) and a fourth surface (310d). The third surface (310c) and the fourth surface (310d) may be arranged on opposite sides to connect the first surface (310a) and the second surface (310b). Between the third surface (310c) and the fourth surface (310d), a hole (311) for dividing a plurality of inorganic light-emitting elements (50) may be formed by etching through an opening (321). In addition, the bottom surface (56) of the plurality of inorganic light-emitting elements (50) may include the first surface (310a) of the plurality of inorganic light-emitting elements (310).

[0222] Additionally, the mask pattern (320) may also include a third surface (320c) and a fourth surface (320d) that form an opening (321). For example, an opening (321) may be formed between the third surface (320c) and the fourth surface (320d) of the mask pattern (320). The third surface (320c) and the fourth surface (320d) may be arranged on opposite sides to connect the first surface (320a) and the second surface (320b).

[0223] Referring to FIGS. 8 and 12, in a display device according to one embodiment, a method for manufacturing a display module may include forming (840) a reflective layer (330) on a plurality of inorganic light-emitting elements (50) and a mask pattern (320). For example, the reflective layer (330) may be deposited on side surfaces of the plurality of inorganic light-emitting elements (50) and a surface of the mask pattern (320). For example, the reflective layer (330) may be formed on the third surface (310c) and the fourth surface (310d) of the plurality of inorganic light-emitting elements (50), and the first surface (320a), the third surface (320c), and the fourth surface (320d) of the mask pattern (320). In addition, the reflective layer (330) may also be formed on the first surface (310a) of the base substrate (300).

[0224] For example, if the mask pattern (320) includes photoresist, a reflective layer (330) can be formed on the photoresist without removing the photoresist.

[0225] Additionally, for example, if the mask pattern (320) includes an FMM, a reflective layer (330) can be formed on the FMM after removing the photoresist.

[0226] The reflective layer (330) may include multiple parts. For example, the reflective layer (330) may include a first part (330a), a second part (330b), and a third part (330c). The first part (330a) may be formed on the first surface (320a) of the mask pattern (320). The second part (330b) may be formed on the third surface (320c) and the fourth surface (320d) of the mask pattern (320) and the third surface and the fourth surface of the inorganic light-emitting element (50). The third part (330c) may be formed on the first surface (310a) of the base substrate (300).

[0227] The reflective layer (330) may include an inorganic material. For example, the reflective layer (330) may include TiO2, TiN, AlN, Al2O3, SnO2, WO3, ZrO2.

[0228] Referring to FIGS. 8 and 13, in a display device according to one embodiment, a method for manufacturing a display module may include removing (840) a portion of a reflective layer (330). For example, a portion of the reflective layer (330) provided on the mask pattern (320) side may be removed. For example, the reflective layer (330) formed on the first side (320a), the third side (320c), and the fourth side (320d) of the mask pattern (320) may be removed. The removal of a portion of the reflective layer (330) may be accomplished by removing the mask pattern (320). A method for removing a portion of the reflective layer (330) and the mask pattern (320) will be described later.

[0229] When the mask pattern (320) is removed, a portion of the first portion (330a) and the second portion (330b) of the reflective layer (330) is removed, and only another portion of the second portion (330b) and the third portion (330c) remain. For example, a portion of the second portion (330b) disposed on the third surface (310c) and the fourth surface (310d) of the plurality of inorganic light-emitting elements (50) among the reflective layer (330) and the third portion (330c) disposed on the first surface (300a) of the base substrate (300) remain.

[0230] Referring to FIGS. 8 and 14, in a display device according to one embodiment, a method for manufacturing a display module may include arranging an electrode (57) on a plurality of inorganic light-emitting elements (50) (850). For example, the method for manufacturing a display module may remove a mask pattern (320) arranged on a first surface (310a) of the plurality of inorganic light-emitting elements (50), and arrange an electrode (57) on one surface of the plurality of inorganic light-emitting elements (50). For example, the electrode (57) may be arranged on the first surface (310a) of the plurality of inorganic light-emitting elements (50). The electrode (57) may be electrically connected to the inorganic light-emitting elements (50), and may allow the inorganic light-emitting elements (50) to be electrically connected to the TFT substrate (44). For example, the electrode (57) may include a first contact electrode (57a) and / or a second contact electrode (57b) (see FIG. 5).

[0231] Referring to FIGS. 8 and 15, a method for manufacturing a display module (30) in a display device according to one embodiment may further include separating (870) a base substrate (300) and a plurality of inorganic light-emitting elements (50). For example, a method for manufacturing a display device according to one embodiment may separate the base substrate (300) and the plurality of inorganic light-emitting elements (50) by irradiating a laser between the base substrate (300) and the plurality of inorganic light-emitting elements (50) using LLO (Laser Lift off). For example, a laser device (L) may be used to separate the plurality of inorganic light-emitting elements (50) from the first surface (300a) of the base substrate (300). For example, the laser may be a short-wavelength laser having a laser wavelength of 200 to 350 nm.

[0232] While the base substrate (300) and the plurality of inorganic light-emitting elements (50) are separated, the third portion (330c) of the reflective layer (330) may be removed. For example, based on the separation of the plurality of inorganic light-emitting elements (50) from the base substrate (300), the third portion (330c) of the reflective layer (330) may be torn or separated. Accordingly, only the second portion (330b) of the reflective layer (330) may remain.

[0233] The separation of the plurality of inorganic light-emitting elements (50) and the base substrate (300) can be performed on the TFT substrate (44). Based on the separation of the plurality of inorganic light-emitting elements (50) from the base substrate (300), the plurality of inorganic light-emitting elements (50) can be moved to the TFT substrate (44) on which the anisotropic conductive layer (47) is applied.

[0234] The plurality of inorganic light-emitting elements (50) may be transferred directly from the base substrate (300) to the TFT substrate (44), but the plurality of inorganic light-emitting elements (50) may be transferred from the base substrate (300) to an intermediate substrate and then transferred from the intermediate substrate to the TFT substrate (44). For example, based on the transfer of the plurality of inorganic light-emitting elements (50) from the base substrate (300) to the intermediate substrate, the electrode (57) may be disposed on the second surface (310b) of the plurality of inorganic light-emitting elements (50). In addition, the plurality of inorganic light-emitting elements (50) may be transferred to the intermediate substrate two or more times.

[0235] The method for manufacturing a display module (30) may further include electrically connecting (880) a plurality of inorganic light-emitting elements (50) to a TFT substrate (44). After the plurality of inorganic light-emitting elements (50) are moved to the TFT substrate (44) on which the anisotropic conductive layer (47) is applied, the inorganic light-emitting elements (50) may be electrically connected through electrical bonding of contact electrodes (57a, 57b) and pad electrodes (44a, 44b) (see FIG. 5).

[0236] FIG. 16 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to an embodiment of the present disclosure. FIG. 16 illustrates that a portion of a mask pattern has been removed through etching. FIG. 17 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to an embodiment of the present disclosure. FIG. 17 illustrates that a portion of a mask pattern has been removed through polishing and / or grinding.

[0237] Referring to FIG. 16, removing a portion (850) of the reflective layer (330) may include removing a photoresist (320) disposed on a first surface (310a) of a plurality of inorganic light emitting elements (50). For example, when the mask pattern (320) includes the photoresist (320), removing the mask pattern (320) may include dry etching and / or wet etching the photoresist (320).

[0238] For example, when dry etching a mask pattern (320), the photoresist (320) disposed on the upper side of the inorganic light-emitting element (50) can be removed using plasma. The photoresist (320) can be removed using plasma until the first surface (310a) of the inorganic light-emitting element (50) is exposed.

[0239] For example, when wet etching the mask pattern (320), the photoresist (320) may be melted by a chemical solvent until the first surface (310a) of the inorganic light emitting element (50) is exposed, or the photoresist (320) may be removed by spraying the photoresist (320).

[0240] Referring to FIG. 17, removing the photoresist (320) may include polishing and / or grinding the photoresist (320). For example, the photoresist (320) may be removed by wet polishing using a polishing device (350) or by dry polishing the photoresist (320). The polishing may be performed until the first surface (310a) of the inorganic light emitting element (50) is exposed.

[0241] Eventually, as the photoresist (320) is removed, only the second portion (330b) and the third portion (330c) of the reflective layer (330) may remain, and then, by separating the inorganic light-emitting element (50) from the base substrate (300), only the third portion (330c) may remain.

[0242] FIG. 18 is a schematic diagram illustrating a manufacturing process of a display module in a display device according to one embodiment of the present disclosure.

[0243] Referring to FIG. 18, removing a portion of the reflective layer (330) (850) may include removing the FMM (320) disposed on the first surface (310a) of the plurality of inorganic light-emitting elements (50). For example, when the mask pattern (320) includes the FMM (320), a photoresist may be applied on the light-emitting layer (310), and the applied photoresist may be exposed along the opening (321). Thereafter, the exposed photoresist may be etched and / or removed to form the plurality of inorganic light-emitting elements (50). Thereafter, the FMM (320) may be disposed on the first surface (310a) of the inorganic light-emitting elements (50). After the FMM (320) is placed on the inorganic light-emitting element (50), a reflective layer (330) is formed, and then the mask pattern (320) and the reflective layer (330) can be removed from the inorganic light-emitting element (50). At this time, removing the mask pattern (320) may include separating the FMM (320) from the plurality of inorganic light-emitting elements (50).

[0244] Accordingly, the FMM (320) can be separated from the inorganic light-emitting element (50) on one side of the display module. The first surface (310a) of the inorganic light-emitting element (50) and the second surface (320b) of the FMM (320) can be contact-separated.

[0245] Eventually, as the mask pattern (320) is removed, only the second portion (330b) and the third portion (330c) of the reflective layer (330) may remain, and then, by separating the inorganic light-emitting element (50) from the base substrate (300), only the third portion (330c) may remain.

[0246] According to one aspect of the present disclosure, a display device with improved optical characteristics can be provided by forming a reflective layer on both sides of an inorganic light-emitting element.

[0247] The effects according to one aspect of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0248] In one embodiment, in a method for manufacturing a display device having a plurality of display modules arranged, the method for manufacturing each of the plurality of display modules may include forming a light-emitting layer (310) on a base substrate (300) (810), arranging a mask pattern (320) having an opening (321) on the light-emitting layer (310) (820), etching the light-emitting layer through the opening to form a plurality of inorganic light-emitting elements (50) (830), forming a reflective layer (330) on the mask pattern and the plurality of inorganic light-emitting elements (840), and removing the mask pattern arranged on the plurality of inorganic light-emitting elements and removing the reflective layer formed on the mask pattern (850).

[0249] A method for manufacturing a display device, wherein the plurality of inorganic light-emitting elements include a first surface (310a) on which the mask pattern is arranged, a second surface (310b) that is in contact with the base substrate and is opposite the first surface, a third surface (310c) that connects the first surface and the second surface and is provided between the first surface and the second surface, and a fourth surface (310d) that connects the first surface and the second surface and is provided on the opposite side of the third surface between the first surface and the second surface, and forming the reflective layer includes forming a reflective layer on the third surface and the fourth surface of the plurality of inorganic light-emitting elements.

[0250] The mask pattern includes a first surface (310a), a second surface (310b) that contacts the first surface of the reflective layer and is provided on an opposite side of the first surface of the mask pattern, a third surface (310c) that connects the first surface of the mask pattern and the second surface of the mask pattern and is provided between the first surface of the mask pattern and the second surface of the mask pattern, and a fourth surface (310d) that connects the first surface of the mask pattern and the second surface of the mask pattern and is provided on an opposite side of the third surface of the mask pattern between the first surface of the mask pattern and the second surface of the mask pattern, and forming the reflective layer may include forming a reflective layer on the first surface of the mask pattern, the third surface of the mask pattern, and the fourth surface of the mask pattern.

[0251] The method for manufacturing the plurality of display modules may include irradiating a laser to separate the base substrate from the second surface of the plurality of inorganic light-emitting elements (870).

[0252] The method for manufacturing the plurality of display modules may further include electrically connecting the plurality of inorganic light-emitting elements to a TFT substrate (880).

[0253] The method for manufacturing the plurality of display modules further includes removing the mask pattern arranged on the first surface of the plurality of inorganic light-emitting elements, and arranging an electrode on the first surface of the plurality of inorganic light-emitting elements (860), and after the electrode is arranged on the first surface of the plurality of inorganic light-emitting elements, the plurality of inorganic light-emitting elements can be electrically connected to the TFT substrate through the electrode.

[0254] The above mask pattern includes a photoresist, and removing the mask pattern disposed on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern (850) may include removing the mask pattern through at least one of grinding, polishing, and etching.

[0255] Removing the mask pattern arranged on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern (850) may further include removing the mask pattern by at least one of dry etching and wet etching.

[0256] Removing the mask pattern arranged on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern (850) may further include removing the mask through dry etching using plasma.

[0257] Removing the mask pattern disposed on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern (850) may include at least one of mechanical polishing (Dry Polishing) and chemical polishing (Wet Polishing).

[0258] The above mask pattern includes a FMM (Fine Metal Mask), and removing the mask pattern disposed on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern (850) may include separating the FMM from the plurality of inorganic light-emitting elements.

[0259] Forming the reflective layer on the mask pattern and the plurality of inorganic light-emitting elements (840) includes forming the reflective layer using PECVD, and the reflective layer may include TiO2.

[0260] The above mask pattern may include at least one of a photoresist and an FMM.

[0261] The display device includes a front cover (70) configured to cover the plurality of inorganic light-emitting elements and a color layer (100) disposed between the front cover and the plurality of inorganic light-emitting elements, and the color layer may include a color conversion layer (110, 120) through which light emitted from the plurality of inorganic light-emitting elements passes, a scattering layer (130) through which light emitted from the plurality of inorganic light-emitting elements passes, and scattering particles (132) provided in the scattering layer to scatter light passing through the scattering layer.

[0262] The color layer (100) may further include a position guide portion (140) disposed between the first color conversion layer (110), the second color conversion layer (120), and the scattering layer (130), and each of the plurality of display modules (30) may further include a black matrix (90) disposed between the front cover and the position guide portion, and a color filter (150) disposed between the color layer and the front cover.

[0263] In one embodiment, in a display device including a display module array in which a plurality of display modules (30) are arranged, each of the plurality of display modules (30) may include a substrate (40), an inorganic light-emitting element (50) mounted on the substrate and including both side surfaces (55), a color layer (100) disposed in front of the inorganic light-emitting element so that light emitted from the inorganic light-emitting element passes therethrough, the color layer including quantum dots (112, 122) so that light passing through the color layer is converted into color, and a reflective film (330) disposed on both side surfaces of the inorganic light-emitting element so as to reflect light emitted from the inorganic light-emitting element.

[0264] The above-described inorganic light-emitting element may include a plurality of inorganic light-emitting elements, and the plurality of inorganic light-emitting elements may include a first inorganic light-emitting element (51), a second inorganic light-emitting element (52), and a third inorganic light-emitting element (53), and the color layer may include a first color conversion layer (110) through which light emitted from the first inorganic light-emitting element (51) passes and on which quantum dots (112) are arranged, a second color conversion layer (120) through which light emitted from the second inorganic light-emitting element (52) passes and on which quantum dots (122) are arranged, a scattering layer (130) through which light emitted from the third inorganic light-emitting element (53) passes, and scattering particles (132) provided in the scattering layer to scatter light emitted from the third inorganic light-emitting element (53) and passing through the scattering layer.

[0265] The above color layer (100) may further include a position guide portion disposed between the first color conversion layer (110), the second color conversion layer (120), and the scattering layer (130).

[0266] Each of the plurality of display modules (30) may further include a black matrix (90) disposed between the front cover and the position guide portion and a color filter (150) disposed between the color layer and the front cover.

[0267] In one embodiment, in a method for manufacturing a display device including a plurality of display modules, the method for manufacturing each of the plurality of display modules may include forming a light-emitting layer on a base substrate (810), disposing a photoresist having an opening on the light-emitting layer (820), etching the light-emitting layer through the opening of the photoresist to form a plurality of light-emitting structures (830), forming a reflective layer (330) on a surface of the photoresist forming the opening and on surfaces of the plurality of light-emitting structures (840), and dry-etching the photoresist disposed on upper surfaces of the plurality of inorganic light-emitting structures to remove the reflective layer formed on the photoresist (850).

[0268] The above has illustrated and described specific embodiments. However, the present invention is not limited to the above-described embodiments, and those skilled in the art will appreciate that various modifications and implementations can be made without departing from the spirit and scope of the technical ideas of the present invention as set forth in the claims below.

Claims

1. A method for manufacturing a display device having a plurality of display modules arranged, The manufacturing method of each of the above plurality of display modules is: Forming a light-emitting layer on a base substrate; A mask pattern having an opening is placed on the light-emitting layer; Etching the light-emitting layer through the above opening to form a plurality of inorganic light-emitting elements; Forming a reflective layer on the above mask pattern and the plurality of inorganic light-emitting elements, and A method for manufacturing a display device, comprising: removing the mask pattern arranged on the plurality of inorganic light-emitting elements; and removing the reflective layer formed on the mask pattern.

2. In paragraph 1, The above multiple inorganic light-emitting elements are, A first surface on which the above mask pattern is arranged; A second surface that is in contact with the base substrate and is opposite to the first surface; A third surface connecting the first surface and the second surface and provided between the first surface and the second surface; and Including a fourth side connecting the first side and the second side between the first side and the second side and provided on the opposite side of the third side; A method for manufacturing a display device, wherein forming the reflective layer includes forming a reflective layer on the third surface and the fourth surface of the plurality of inorganic light-emitting elements.

3. In paragraph 2, The above mask pattern is, Page 1; A second surface contacting the first surface of the reflective layer and provided on an opposite side of the first surface of the mask pattern; A third surface connecting the first surface of the mask pattern and the second surface of the mask pattern, and provided between the first surface of the mask pattern and the second surface of the mask pattern; and Connecting the first side of the mask pattern and the second side of the mask pattern, and including a fourth side provided on the opposite side of the third side of the mask pattern between the first side of the mask pattern and the second side of the mask pattern; A method for manufacturing a display device, wherein forming the reflective layer includes forming a reflective layer on the first surface of the mask pattern, the third surface of the mask pattern, and the fourth surface of the mask pattern.

4. In paragraph 3, The manufacturing method of the above multiple display modules is: A method for manufacturing a display device, comprising: irradiating a laser to separate the base substrate from the second surface of the plurality of inorganic light-emitting elements.

5. In paragraph 4, The manufacturing method of the above multiple display modules is: A method for manufacturing a display device, further comprising: electrically connecting the plurality of inorganic light-emitting elements to a TFT substrate.

6. In paragraph 5, The manufacturing method of the above multiple display modules is: Further comprising: removing the mask pattern arranged on the first surface of the plurality of inorganic light-emitting elements, and arranging an electrode on the first surface of the plurality of inorganic light-emitting elements; A method for manufacturing a display device, wherein the electrodes are arranged on the first surface of the plurality of inorganic light-emitting elements, and the plurality of inorganic light-emitting elements are electrically connected to the TFT substrate through the electrodes.

7. In paragraph 3, The above mask pattern includes a photoresist, Removing the mask pattern arranged on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern, A method for manufacturing a display device, comprising: removing the mask pattern through at least one of grinding, polishing, and etching.

8. In paragraph 7, Removing the mask pattern arranged on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern, A method for manufacturing a display device further comprising removing the mask pattern by at least one of dry etching and wet etching.

9. In paragraph 8, Removing the mask pattern arranged on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern, A method for manufacturing a display device further comprising removing a mask through dry etching using plasma.

10. In paragraph 7, Removing the mask pattern arranged on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern, A method for manufacturing a display device comprising at least one of mechanical polishing (dry polishing) and chemical polishing (wet polishing).

11. In paragraph 2, The above mask pattern includes a Fine Metal Mask (FMM), Removing the mask pattern arranged on the plurality of inorganic light-emitting elements and the reflective layer formed on the mask pattern, A method for manufacturing a display device, comprising separating the FMM from the plurality of inorganic light-emitting elements.

12. In paragraph 1, Forming the reflective layer on the above mask pattern and the plurality of inorganic light-emitting elements is, Comprising forming the reflective layer using PECVD, The above reflective layer is a method for manufacturing a display device including TiO2.

13. In paragraph 12, The above mask pattern is a method for manufacturing a display device including at least one of a photoresist and an FMM.

14. In paragraph 2, The above display device, A front cover configured to cover the plurality of inorganic light-emitting elements; and A color layer disposed between the front cover and the plurality of inorganic light-emitting elements; The above color layer is, A color conversion layer through which light emitted from the plurality of inorganic light-emitting elements passes; A scattering layer through which light emitted from the plurality of inorganic light-emitting elements passes; and A method for manufacturing a display device, comprising: scattering particles provided in a scattering layer to scatter light passing through the scattering layer.

15. In paragraph 14, The above color layer is, Further comprising a position guide part disposed between the first color conversion layer, the second color conversion layer, and the scattering layer; Each of the above multiple display modules, A black matrix positioned between the front cover and the position guide portion; and A method for manufacturing a display device further comprising a color filter disposed between the color layer and the front cover.

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