Optical sensor, optical detection method and storage medium

Abstract

The embodiments of the present application relate to the technical field of optical detection, and disclose an optical sensor, an optical detection method and a storage medium. The optical sensor provided in the embodiments of the present application comprises an optical signal processing layer and an optical signal transmission layer; the optical signal processing layer and the optical signal transmission layer are in hermetic contact with each other so as to form a closed space, an optical signal processing assembly being fixedly arranged in the closed space; the optical signal transmission layer is a silicon photonic chip, a first detection sensor, a second detection sensor and a third detection sensor being fixed in the silicon photonic chip. The present application computes covering information by means of all information detected by the three designed sensors in different time periods, and outputs an optical detection result according to the covering information and an electric signal obtained by means of a conversion, thereby removing the effect of coverings on detection and further improving optical detection stability and accuracy.

Description

Optical sensor, optical detection method and storage medium Technical Field

[0001] The present application relates to the field of optical detection technology, and in particular to an optical sensor, an optical detection method, and a storage medium. Background Art

[0002] With the development of silicon photonics technology, originally bulky optical instruments such as optical sensors can be reduced to the size of a chip, making it possible to place optical sensors in tiny environments. For example, they can be implanted in the human body to detect blood sugar, lactate, or ketones. However, due to the characteristics of silicon-based materials, optical sensors using silicon-based materials have poor detection stability and low accuracy due to their extremely high sensitivity. Conventional sensor design solutions can improve detection stability and accuracy by resolving short-term signal interference, but it is difficult to overcome the impact of long-term, slow environmental changes caused by covering the detection, and its detection stability and accuracy remain low.

[0003] Application Contents

[0004] In view of this, one of the objects of this application is to provide an optical sensor, an optical detection method and a computer-readable storage medium that can solve at least some of the above-mentioned technical problems.

[0005] In a first aspect, an embodiment of the present application provides an optical sensor, comprising an optical signal processing layer and an optical signal transmission layer, wherein the optical signal processing layer and the optical signal transmission layer are in sealed contact to form a confined space, wherein an optical signal processing component is fixedly placed in the confined space, wherein the optical signal transmission layer is a silicon photonic chip, and wherein a first detection sensor, a second detection sensor, and a third detection sensor are fixed in the silicon photonic chip; wherein,

[0006] The first detection sensor and the second detection sensor are separated by a first preset distance and are used to detect first environmental information and information about an object to be detected and output a first optical signal, wherein the first environmental information is environmental information of a gas environment or a liquid environment in which the optical sensor is placed, and the information about the object to be detected includes information about the target object and information about a covering;

[0007] The second detection sensor and the third detection sensor are separated by a second preset distance and are configured to detect the first environmental information and output a second optical signal;

[0008] The third detection sensor is used to detect second environmental information, where the second environmental information is environmental information in the confined space;

[0009] The optical signal processing component is detachably fixed to the side of the silicon photonic chip, and is used to calculate the covering information based on all information detected by the first detection sensor, the second detection sensor, and the third detection sensor in different time periods, to convert the first optical signal and the second optical signal into electrical signals, and to output optical detection results based on the first optical signal, the second optical signal, and the covering information.

[0010] In one possible embodiment, the optical signal processing component includes a photoelectric converter, a light source module and a main controller, and the photoelectric converter and the light source module are electrically connected to the main controller, wherein the photoelectric converter is used to convert the first optical signal and the second optical signal into the electrical signal, and the light source module is used to transmit the generated light waves to the silicon photonic chip.

[0011] In a possible implementation, the optical signal transmission layer further includes a light pipe, which is embedded in the silicon photonic chip and is used to transmit the light wave to the first detection sensor, the second detection sensor, and the third detection sensor. The light pipe, the first detection sensor, the second detection sensor, and the third detection sensor are all located at the same height and on the same horizontal line in the silicon photonic chip, and the horizontal line is parallel to the side surface.

[0012] A first groove is provided in the area of ​​the side that is not in contact with the confined space, the first detection sensor is embedded in the first groove, and a filter film is provided on the surface of the first groove, and the filter film is used to pass the target detection object corresponding to the information of the target detection object; a second groove is provided in the area of ​​the side that is in contact with the confined space, the third detection sensor is embedded in the groove, and a filter film is provided on the surface of the first groove.

[0013] In a possible embodiment, the optical signal transmission layer also includes a grating component, which is embedded in the silicon photonic chip. A grating path is formed between the light guide tube and the photoelectric converter through the grating component. The light guide tube is used to transmit the first optical signal and the second optical signal to the photoelectric converter through the grating path.

[0014] In a possible embodiment, except for the side surface contacting the enclosed space, the other outer edges of the optical signal processing layer and the optical signal transmission layer are wrapped with a protective coating, and the outer edges of the side surface close to the first detection sensor and the second detection sensor are not wrapped with the protective coating.

[0015] In a possible implementation, the optical signal processing layer further includes a power supply, a temperature sensor, and a humidity sensor. The photoelectric converter, the temperature sensor, and the humidity sensor are all electrically connected to the main controller, and the main controller is electrically connected to the power supply.

[0016] The main controller is also used to generate a power-off instruction when it detects that the temperature collected by the temperature sensor is greater than a preset temperature threshold, or when it detects that the humidity collected by the humidity sensor is greater than a preset humidity threshold. The power-off instruction is used to disconnect the electrical connection between the main controller and the power supply.

[0017] In a second aspect, an embodiment of the present application provides an optical sensor, comprising an optical signal processing layer and an optical signal transmission layer, wherein the optical signal processing layer and the optical signal transmission layer are in sealed contact to form a confined space, wherein an optical signal processing component is fixedly placed in the confined space, wherein the optical signal transmission layer is a silicon photonic chip, wherein a first detection sensor, a second detection sensor, a third detection sensor, and a fourth detection sensor are fixed in the silicon photonic chip; wherein,

[0018] The first detection sensor and the second detection sensor are separated by a first preset distance and are used to detect first environmental information and information about an object to be detected and output a first optical signal, wherein the first environmental information is environmental information of a gas environment or a liquid environment in which the optical sensor is placed, and the information about the object to be detected includes information about the target object and information about a covering;

[0019] The second detection sensor and the third detection sensor are separated by a second preset distance and are configured to detect the first environmental information and output a second optical signal;

[0020] The third detection sensor and the fourth detection sensor are separated by a third preset distance and are used to detect second environmental information, where the second environmental information is environmental information in the confined space;

[0021] The fourth detection sensor is used to detect the first environmental information and output a third optical signal, wherein the first detection sensor and the fourth detection sensor have different operating bands;

[0022] The optical signal processing component is detachably fixed to the side of the silicon photonic chip, and is used to calculate the cover information based on all information detected by the first detection sensor, the second detection sensor, the third detection sensor and the fourth detection sensor in different time periods, and is used to convert the first optical signal, the second optical signal and the third optical signal into electrical signals, and is also used to output optical detection results based on the first optical signal, the second optical signal and the cover information, or is used to output optical detection results based on the second optical signal, the third optical signal and the cover information.

[0023] In a third aspect, an embodiment of the present application provides an optical detection method, which is applied to the optical sensor of the first aspect, the method comprising: acquiring a first optical signal output by the first detection sensor and a second optical signal output by the second detection sensor;

[0024] Calculating covering information based on all information detected by the first detection sensor, the second detection sensor, and the third detection sensor in different time periods;

[0025] The first optical signal and the second optical signal are converted into electrical signals, and an optical detection result is calculated based on the first optical signal and the second optical signal according to the cover information.

[0026] In a fourth aspect, an embodiment of the present application provides an optical detection method, applied to the optical sensor of the second aspect, the method comprising: acquiring a first optical signal output by the first detection sensor, a second optical signal output by the second detection sensor, and a third optical signal output by the fourth detection sensor;

[0027] Calculating covering information based on all information detected by the first detection sensor, the second detection sensor, the third detection sensor, and the fourth detection sensor in different time periods;

[0028] The first optical signal, the second optical signal, and the third optical signal are converted into electrical signals, and an optical detection result is calculated based on the first optical signal, the second optical signal, and the cover information, or an optical detection result is calculated based on the second optical signal, the fourth optical signal, and the cover information.

[0029] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by one or more processors, it implements the method provided in the third aspect or the fourth aspect.

[0030] An optical sensor provided by an embodiment of the present application includes an optical signal processing layer and an optical signal transmission layer, the optical signal processing layer and the optical signal transmission layer are sealed and contacted to form a closed space, an optical signal processing component is fixedly placed in the closed space, the optical signal transmission layer is a silicon photonic chip, a first detection sensor, a second detection sensor and a third detection sensor are fixed in the silicon photonic chip; the first detection sensor and the second detection sensor are separated by a first preset distance, and are used to detect first environmental information and information of an object to be detected and output a first optical signal, wherein the first environmental information is environmental information of a gas environment or liquid environment for placing the optical sensor, and the information of the object to be detected is outputted by the optical sensor. The information includes target detection object information and covering object information; the second detection sensor and the third detection sensor are separated by a second preset distance, and are used to detect the first environmental information and output a second optical signal; the third detection sensor is used to detect the second environmental information, and the second environmental information is the environmental information in a confined space; the optical signal processing component is detachably fixed to the side of the silicon photonic chip, and is used to calculate the covering object information based on all the information detected by the first detection sensor, the second detection sensor and the third detection sensor in different time periods, and is used to convert the first optical signal and the second optical signal into an electrical signal, and is also used to output the optical detection result based on the first optical signal, the second optical signal and the covering object information. The three sensors designed in this application calculate the covering object information through all the information detected by the three sensors in different time periods, and output the optical detection result based on the covering information and the converted electrical signal, which can eliminate the influence of the covering on the detection, thereby improving the stability and accuracy of the optical detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0032] in:

[0033] FIG1 is a structural diagram of a first optical sensor provided in an embodiment of the present application;

[0034] FIG2 is a schematic diagram of a method for connecting a grating assembly included in a first optical sensor provided in an embodiment of the present application;

[0035] FIG3 is an absorption spectrum of the first optical sensor provided in an embodiment of the present application;

[0036] FIG4 is a structural diagram of a second optical sensor provided in an embodiment of the present application;

[0037] FIG5 is a characteristic spectrum of the second optical sensor provided in an embodiment of the present application;

[0038] FIG6 is a flow chart of a first optical detection method provided in an embodiment of the present application;

[0039] FIG7 is a flow chart of a second optical detection method provided in an embodiment of the present application.

[0040] Description of reference numerals:

[0041] Optical signal processing layer 11, optical signal transmission layer 12, optical signal processing component 110, photoelectric converter 111, light source module 112, main controller 113, first detection sensor 120, second detection sensor 130, third detection sensor 140, light guide 150, grating component 160, protective coating 170, rectangular glass cover 180, fourth detection sensor 190. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0043] Please refer to Figure 1, which is a structural diagram of the first optical sensor provided in an embodiment of the present application. The various components of the optical sensor will be described in detail below.

[0044] The optical sensor includes an optical signal processing layer 11 and an optical signal transmission layer 12. The optical signal processing layer 11 and the optical signal transmission layer 12 are sealed and contacted to form a closed space. An optical signal processing component 110 is fixedly placed in the closed space. The optical signal transmission layer 12 is a silicon photonic chip. A first detection sensor 120, a second detection sensor 130, and a third detection sensor 140 are fixed in the silicon photonic chip.

[0045] The first detection sensor 120 and the second detection sensor 130 are separated by a first preset distance and are used to detect first environmental information and information about the object to be detected and output a first optical signal, wherein the first environmental information is environmental information of a gas environment or a liquid environment where the optical sensors are placed, and the information about the object to be detected includes information about the target object and information about the covering;

[0046] The second detection sensor 130 and the third detection sensor 140 are separated by a second preset distance and are configured to detect the first environmental information and output a second optical signal;

[0047] The third detection sensor 140 is used to detect second environmental information, where the second environmental information is environmental information in a confined space;

[0048] The optical signal processing component 110 is detachably fixed to the side of the silicon photonic chip, and is used to calculate the covering information based on all the information detected by the first detection sensor 120, the second detection sensor 130 and the third detection sensor 140 in different time periods, and is used to convert the first optical signal and the second optical signal into electrical signals. It is also used to output optical detection results based on the first optical signal, the second optical signal and the covering information.

[0049] The optical sensor of this embodiment can be used for analysis and detection within the human body, such as blood glucose detection within the human body. Therefore, the optical sensor of this embodiment can also serve as a blood glucose detector. When the optical sensor serves as a blood glucose detector, the target detection object information in this embodiment can be the concentration of blood glucose molecules, and accordingly, the target detection object is blood glucose molecules. It should be noted that the target detection object information being the concentration of blood glucose molecules is merely an example, and can also be information about other molecules in the human body, which is not limited here. However, to clearly illustrate the usefulness of the optical sensor of this embodiment, the optical sensor in this embodiment and the following embodiments will be explained with the function of detecting blood glucose molecules as the target detection object.

[0050] In this embodiment:

[0051] The optical signal processing layer 11 and the optical signal transmission layer 12 are in sealed contact. The optical signal processing layer 11 can be tightly bonded to the optical signal transmission layer 12 through a rectangular glass cover 180 with an opening on one side. The rectangular glass cover 180 with an opening on one side is tightly bonded to the optical signal transmission layer 12 to form a closed space. The closed space has good sealing performance and can ensure that the optical signal processing component 110 placed in the closed space works normally and stably.

[0052] The covering information may be information on changes in the length or thickness of the covering. It should be noted that, during the actual detection process of the optical sensor, the applicant discovered through in-depth research that after the optical sensor is placed in the human body environment for a period of time, a very thin layer of unknown covering of non-blood sugar molecules will be attached to the outer surface of the optical sensor, which will have a certain impact on the detection accuracy of the optical sensor. It is under this circumstance that the applicant proposed the optical sensor of this embodiment. The optical sensor designed through this embodiment can eliminate the impact of unknown coverings on the normal detection of the optical sensor, thereby ensuring the accuracy of the optical sensor detection.

[0053] The difference in the first environmental information is determined by the placement environment of the optical sensor. For example, when the optical sensor is placed in a liquid environment, the first environmental information is liquid environmental information, and when the optical sensor is placed in a gaseous environment, the first environmental information is gaseous environmental information. The second environmental information is environmental information in a closed environment and is not affected by the first environmental information. Under ideal conditions, the second environmental information remains relatively stable. The first environmental information may include the temperature and humidity of the optical sensor's placement environment. The second environmental information may include the temperature and humidity within the closed space.

[0054] The optical signal processing component 110 can provide a light source and can also receive the light source returned by each detection sensor, that is, receive the first light signal and the second light signal. Optionally, the optical signal processing component 110 includes a photoelectric converter 111, a light source module 112 and a main controller 113. The photoelectric converter 111 and the light source module 112 are both electrically connected to the main controller 113, wherein the photoelectric converter 111 is used to convert the first light signal and the second light signal into an electrical signal, and the light source module 112 is used to transmit the generated light waves to the silicon photonic chip. In addition, the optical signal processing component 110 and the side of the silicon photonic chip are detachably fixedly connected, which is convenient for disassembly and has good stability. Specifically, the detachable fixed connection includes connection methods such as bolt fixed connection and snap fixed connection. The appropriate detachable fixed connection method can be selected according to actual needs and is not limited here.

[0055] It should be noted that covering information, whether it's changes in covering length or thickness, cannot be directly detected by the first or second detection sensors 120, 130. Furthermore, for a short period of time, the optical sensor surface may still be covered with a covering. This embodiment calculates covering information based on the total information detected by the first, second, and third detection sensors 120, 130, and 140 during different time periods. These different time periods can be the total information detected by these three sensors at two very short moments, such as the total information detected by these three sensors during the two seconds between 00:01:01 on December 1, 2023, and 23:01:01 on December 1, 2023. Different time periods can also be all the information detected by the above three detection sensors within two different time periods, such as all the information detected by the three detection sensors within the time period from 00:01:01 on December 1, 2023 to 00:01:01 on December 2, 2023, and all the information detected by the three detection sensors within the time period from 00:01:01 on December 3, 2023 to 00:01:01 on December 4, 2023.

[0056] Specifically, the detection information of the first detection sensor 120 is recorded as SIG, the detection information of the second detection sensor 130 is recorded as REF, and the detection information of the third detection sensor 140 is recorded as ORG, which is expressed as follows:

[0057] SIG=t+h+cov+S,

[0058] REF=t+h,

[0059] ORG=T+H,

[0060] Among them, t represents the temperature in the first environment information, h represents the humidity in the first environment information, cov represents the covering information, S represents the target detection object information, T represents the temperature in the second environment information, and H represents the humidity in the second environment.

[0061] Among them, t, h, T and H can all be detected, but cov and S are unclear. Since the target detection object information S is exactly the information that the optical sensor needs to detect, the covering object information cov needs to be determined.

[0062] The following are examples of detection information obtained in two different time periods: the first time period and the second time period:

[0063] SIG0=t0+h0+cov0+S0,

[0064] REF0=t0+h0,

[0065] ORG0=T0+H0,

[0066] SIG1=t1+h1+cov1+S1,

[0067] REF1=t1+h1,

[0068] ORG1=T1+H1,

[0069] Among them, SIG0 represents the detection information of the first detection sensor 120 in the first time period, REF0 and ORG0 respectively represent the detection information of the second detection sensor 130 and the detection information of the third detection sensor 140 in the first time period. Correspondingly, SIG1, REF1, and ORG1 respectively represent the detection information of the first detection sensor 120, the second detection sensor 130, and the third detection sensor 140 in the second time period. Among them, taking the detection information SIG0 obtained by the first detection sensor 120 as an example, the detection information SIG0 can be the sum of all detection information obtained by the first detection sensor 120 in the first time period or the average value of all detection information. And considering that the target detection object is a substance that changes periodically, such as blood sugar, it can also be lactose and ketone substances that change periodically. If t' (t'>24h) is used to represent the first time period, then, The value of will stabilize at a constant C. Correspondingly, if t”(t'>24h) is used to represent the second period, The value of will also stabilize at the constant C, then we have:

[0070] The calculation of all detection information obtained in the first period can be calculated using formula 1 as follows:

[0071] The calculation of all detection information obtained in the second period can be calculated using Formula 2 as follows:

[0072] Among them, A0 and A1 reflect the correlation between the covering information in the first environmental information and the second environmental information in the above embodiment. The covering information can be determined by the ratio A0 and A1. Specifically, the change in the length or thickness of the covering can be expressed by calculating the absolute value of the difference between A0 and A1.

[0073] The optical signal processing component 110 is further configured to output an optical detection result based on the first optical signal, the second optical signal, and the covering material information. Specifically, the electrical signal converted from the first optical signal can be subtracted from the electrical signal converted from the second optical signal. The remaining electrical signal theoretically reflects only the target detection object information and the covering material information, and this electrical signal can be recorded as the first target electrical signal. The calculated covering material information can then be converted into an optical signal, which is then converted back into an electrical signal to obtain an electrical signal corresponding to the covering material information. This electrical signal can be recorded as the second target electrical signal. Finally, the second target electrical signal can be subtracted from the first target electrical signal to obtain an electrical signal representing the target detection object information, such as blood glucose concentration.

[0074] From the above analysis, it can be seen that an optical sensor provided by an embodiment of the present application includes an optical signal processing layer and an optical signal transmission layer, the optical signal processing layer and the optical signal transmission layer are sealed and contacted to form a closed space, an optical signal processing component is fixedly placed in the closed space, the optical signal transmission layer is a silicon photonic chip, and a first detection sensor, a second detection sensor and a third detection sensor are fixed in the silicon photonic chip; the first detection sensor and the second detection sensor are separated by a first preset distance, and are used to detect first environmental information and information of the object to be detected and output a first optical signal, wherein the first environmental information is environmental information of the gas environment or environmental information of the liquid environment for placing the optical sensor, and the object to be detected is output. The detection object information includes target detection object information and covering object information; the second detection sensor and the third detection sensor are separated by a second preset distance, and are used to detect the first environmental information and output a second optical signal; the third detection sensor is used to detect the second environmental information, and the second environmental information is the environmental information in the confined space; the optical signal processing component is detachably fixed to the side of the silicon photonic chip, and is used to calculate the covering object information based on all the information detected by the first detection sensor, the second detection sensor, and the third detection sensor in different time periods, and is used to convert the first optical signal and the second optical signal into an electrical signal, and is also used to output an optical detection result based on the first optical signal, the second optical signal, and the covering object information. The three sensors designed in this application calculate the covering object information based on all the information detected by the three sensors in different time periods, and output the optical detection result based on the covering information and the converted electrical signal, which can eliminate the influence of the covering on the detection, thereby improving the stability and accuracy of the optical detection.

[0075] Optionally, the optical signal transmission layer 12 further includes a light pipe 150, which is embedded in the silicon photonic chip and is used to transmit light waves to the first detection sensor 120, the second detection sensor 130, and the third detection sensor 140. The light pipe 150, the first detection sensor 120, the second detection sensor 130, and the third detection sensor 140 are all located at the same height and on the same horizontal line in the silicon photonic chip, and the horizontal line is parallel to the side surface.

[0076] A first groove is formed in the area of ​​the side that is not in contact with the enclosed space. The first detection sensor 120 is embedded in the first groove. A filter film is provided on the surface of the first groove. The filter film is used to pass the target detection object corresponding to the target detection object information.

[0077] A second groove is formed in the area of ​​the side that contacts the enclosed space, and the third detection sensor 140 is embedded in the groove. A filter film is provided on the surface of the first groove.

[0078] In this embodiment, the light guide 150, first detection sensor 120, second detection sensor 130, and third detection sensor 140 are all located at the same height and on the same horizontal line within the silicon photonic chip, with the horizontal line parallel to the side surface. This positioning reduces losses during optical signal transmission. The pore size of the filter membrane on the surface of the first groove allows for the passage of most blood glucose molecules and those smaller than them, while preventing other foreign molecules from directly contacting the first detection sensor 120 and thereby affecting the optical sensor's detection accuracy and reliability.

[0079] The filter membrane is represented by a dotted line in FIG1 .

[0080] In some embodiments, the light pipe 150 may also be disposed directly below the first detection sensor 120 , the second detection sensor 130 and the third detection sensor, and the light pipe 150 is parallel to the side surfaces in the above embodiments, thereby improving the transmission efficiency of the optical signal.

[0081] Optionally, the optical signal transmission layer 12 also includes a grating component 160, which is embedded in the silicon photonic chip. A grating path is formed between the light guide 150 and the photoelectric converter 111 through the grating component 160, and the light guide 150 is used to transmit the first optical signal and the second optical signal to the photoelectric converter 111 through the grating path. In this embodiment, the grating path formed by the grating component 160 can further improve the transmission efficiency of the optical signal, thereby improving the accuracy and reliability of the optical sensor detection. Among them, the grating component 160 generally includes a base and a grating plate, which is not shown in Figure 1. Reference can be made to the existing grating component 160 formed by the base and the grating plate. It is not shown in detail in this embodiment and Figure 1, but this does not affect the implementation of this embodiment. Please refer to Figure 2, which is a schematic diagram of the connection method of the grating component 160 included in the first optical sensor provided in the embodiment of the present application, in which the grating component 160 is enlarged and displayed. Furthermore, in this embodiment, the grating component 160 and the light pipe 150 are at the same height layer in the silicon photonic chip, and the raised surface of the grating component 160 and the side of the light pipe 150 close to the silicon photonic chip are at the same height.

[0082] Optionally, all outer edges of the optical signal processing layer 11 and the optical signal transmission layer 12, except for the sides in contact with the enclosed space, are coated with a protective coating 170. The outer edges of the sides adjacent to the first detection sensor 120 and the second detection sensor 130 are not coated with the protective coating 170. The protective coating 170 may be a biocompatible coating that protects the human body's internal environment from the effects of the optical sensors.

[0083] Optionally, the optical signal processing layer 11 further includes a power supply, a temperature sensor, and a humidity sensor. The photoelectric converter 111, the temperature sensor, and the humidity sensor are all electrically connected to the main controller 113, and the main controller 113 is electrically connected to the power supply.

[0084] The main controller 113 is also used to generate a power-off instruction when it detects that the temperature collected by the temperature sensor is greater than a preset temperature threshold, or when it detects that the humidity collected by the humidity sensor is greater than a preset humidity threshold. The power-off instruction is used to disconnect the electrical connection between the main controller 113 and the power supply.

[0085] This embodiment can monitor the temperature and humidity in a confined space by means of a temperature sensor and a humidity sensor arranged in the confined space, and the main controller 113 generates a power-off instruction when it detects that any parameter such as temperature or humidity exceeds a set threshold value, and the optical sensor stops working, thereby avoiding the danger of electric shock inside the body due to abnormal conditions.

[0086] In some embodiments, the optical signal processing layer 11 may further include a wireless signal transmitter, which can be used to transmit the electrical signal corresponding to the detected target detection object information to an external electronic device, and may further include a storage unit, which is electrically connected to the wireless signal transmitter and the main controller 113, respectively, for storing the electrical signal corresponding to the target detection object information. In the case where the main controller 113 generates a power-off instruction in the above embodiment, the electrical connection between the storage unit, the wireless signal transmitter and the power supply in this embodiment is not disconnected, and the power supply operates at low power at this time, which can ensure that the storage information in the storage unit is transmitted to the external electronic device via the wireless signal transmitter. Among them, the wireless signal transmitter, the power supply and the storage unit are not shown in Figure 1.

[0087] From the above analysis, it can be seen that an optical sensor provided by an embodiment of the present application includes an optical signal processing layer and an optical signal transmission layer, the optical signal processing layer and the optical signal transmission layer are sealed and contacted to form a closed space, an optical signal processing component is fixedly placed in the closed space, the optical signal transmission layer is a silicon photonic chip, and a first detection sensor, a second detection sensor and a third detection sensor are fixed in the silicon photonic chip; the first detection sensor and the second detection sensor are separated by a first preset distance, and are used to detect first environmental information and information of the object to be detected and output a first optical signal, wherein the first environmental information is environmental information of the gas environment or environmental information of the liquid environment for placing the optical sensor, and the object to be detected is output. The detection object information includes target detection object information and covering object information; the second detection sensor and the third detection sensor are separated by a second preset distance, and are used to detect the first environmental information and output a second optical signal; the third detection sensor is used to detect the second environmental information, and the second environmental information is the environmental information in the confined space; the optical signal processing component is detachably fixed to the side of the silicon photonic chip, and is used to calculate the covering object information based on all the information detected by the first detection sensor, the second detection sensor, and the third detection sensor in different time periods, and is used to convert the first optical signal and the second optical signal into an electrical signal, and is also used to output an optical detection result based on the first optical signal, the second optical signal, and the covering object information. The three sensors designed in this application calculate the covering object information based on all the information detected by the three sensors in different time periods, and output the optical detection result based on the covering information and the converted electrical signal, which can eliminate the influence of the covering on the detection, thereby improving the stability and accuracy of the optical detection.

[0088] Please refer to Figure 3, which is the absorption spectrum involved in the first optical sensor, specifically the absorption spectrum of blood glucose molecules, where the horizontal axis represents the wavelength in nm, and the vertical axis represents the absorption intensity. It can be found that the optimal detection wavelength of blood glucose molecules, i.e., Glucose in Figure 3, is 1700nm, while the optimal wavelength for detecting the covering, i.e., Protein in Figure 3, is between 1400nm and 1450nm. Because the absorption spectrum intensity of blood glucose molecules is low in this band, the changes in the substance detected at this time are not greatly affected by the concentration changes of blood glucose molecules. This is an ideal band for interference from coverings. The reason why target objects to be detected, such as blood glucose molecules, can be detected is that the absorption spectrum of blood glucose molecules has a specific change pattern within a certain spectral range, which is called a characteristic spectrum, and can be used to calculate information about blood glucose molecules, such as concentration.

[0089] In addition, considering that all sensors in the above embodiments have specific bandwidths and are not infinitely wide, there is a situation where a sensor cannot detect both the target object and the covering. It is precisely based on this consideration that the present application further provides an optical sensor. Please refer to Figure 4, which is a structural diagram of the second optical sensor provided by the present application, wherein:

[0090] The optical sensor in FIG4 includes an optical signal processing layer 11 and an optical signal transmission layer 12. The optical signal processing layer 11 and the optical signal transmission layer 12 are in sealed contact to form a closed space. An optical signal processing component 110 is fixedly placed in the closed space. The optical signal transmission layer 12 is a silicon photonic chip. A first detection sensor 120, a second detection sensor 130, a third detection sensor 140, and a fourth detection sensor 190 are fixed in the silicon photonic chip.

[0091] The first detection sensor 120 and the second detection sensor 130 are separated by a first preset distance and are used to detect first environmental information and information about the object to be detected and output a first optical signal, wherein the first environmental information is environmental information of a gas environment or a liquid environment where the optical sensors are placed, and the information about the object to be detected includes information about the target object and information about the covering;

[0092] The second detection sensor 130 and the third detection sensor 140 are separated by a second preset distance and are configured to detect the first environmental information and output a second optical signal;

[0093] The third detection sensor 140 and the fourth detection sensor 190 are separated by a third preset distance and are used to detect second environmental information, where the second environmental information is environmental information in a confined space;

[0094] The fourth detection sensor 190 is used to detect the first environmental information and output a third optical signal, wherein the first detection sensor 120 and the fourth detection sensor 190 have different operating bands;

[0095] The optical signal processing component 110 is detachably fixed to the side of the silicon photonic chip, and is used to calculate the cover information based on all information detected by the first detection sensor 120, the second detection sensor 130, the third detection sensor 140 and the fourth detection sensor 190 in different time periods, and is used to convert the first optical signal, the second optical signal and the third optical signal into electrical signals. It is also used to output optical detection results based on the first optical signal, the second optical signal and the cover information, or to output optical detection results based on the second optical signal, the third optical signal and the cover information.

[0096] This embodiment adds a fourth detection sensor 190 to the optical sensor based on Figure 1. The remaining components are identical to those of the optical sensor in Figure 1. Furthermore, a filter membrane is also provided on the side of the fourth detection sensor 190 near the silicon photonic chip, indicated by a dashed line segment. The fourth detection sensor 190 and the first detection sensor 120 operate in different wavelength bands. This means that the first sensor's operating wavelength band can be used to detect target object information, while the fourth sensor's operating wavelength band can be used to detect covering material information.

[0097] In addition, the detection method of the optical sensor in this embodiment is the same as that of the optical sensor in Figure 1 and the corresponding embodiment. The specific implementation process can refer to the detection process of the optical sensor in Figure 1 and the corresponding embodiment, which will not be repeated here.

[0098] In summary, an optical sensor provided by an embodiment of the present application includes an optical signal processing layer and an optical signal transmission layer, the optical signal processing layer and the optical signal transmission layer are in sealed contact to form a confined space, an optical signal processing component is fixedly placed in the confined space, the optical signal transmission layer is a silicon photonic chip, and a first detection sensor, a second detection sensor, a third detection sensor and a fourth detection sensor are fixed in the silicon photonic chip; the first detection sensor and the second detection sensor are separated by a first preset distance, and are used to detect first environmental information and information of an object to be detected and output a first optical signal, wherein the first environmental information is environmental information of a gas environment or an environmental information of a liquid environment for placing the optical sensor, and the information of an object to be detected includes target detection object information and covering information; the second detection sensor and the third detection sensor are separated by a second preset distance, and are used to detect the first environmental information and output The invention relates to a method for producing a second optical signal; a third detection sensor and a fourth detection sensor are separated by a third preset distance and are used to detect second environmental information, wherein the second environmental information is environmental information in a confined space; a fourth detection sensor is used to detect the first environmental information and output a third optical signal, wherein the first detection sensor and the fourth detection sensor have different operating bands; an optical signal processing component is detachably fixed to the side of the silicon photonic chip, and is used to calculate the cover information based on all the information detected by the first detection sensor, the second detection sensor, the third detection sensor, and the fourth detection sensor in different time periods, and is used to convert the first optical signal, the second optical signal, and the third optical signal into an electrical signal, and is also used to output an optical detection result based on the first optical signal, the second optical signal, and the cover information, or, is used to output an optical detection result based on the second optical signal, the third optical signal, and the cover information. The present application designs four sensors and calculates the cover information through all the information detected by the four sensors in different time periods, and outputs the optical detection result based on the cover information and the converted electrical signal, thereby eliminating the influence of the cover on the detection, and the fourth sensor has a higher operating band and can detect more cover information, thereby improving the stability and accuracy of the optical detection.

[0099] Please refer to Figure 5, which is a characteristic spectrum involved in the second optical sensor provided in an embodiment of the present application. The horizontal axis represents the wavelength in nm, and the vertical axis represents the absorption intensity. Among them, curves P1, P2, and P3 correspond to the characteristic spectrum corresponding to the target detection object detected by the first detection sensor 120, the characteristic spectrum corresponding to the cover detected by the second detection sensor 130, and the characteristic spectrum corresponding to the cover detected by the fourth detection sensor 190, respectively. It can be found that the characteristic spectrum of the cover with a longer wavelength can be detected by the fourth detection sensor 190. It can be understood that the fourth detection sensor can detect more cover, thereby improving the detection accuracy of the optical sensor.

[0100] Corresponding to the embodiment of the optical sensor in FIG1 , the present application further provides an optical detection method. Please refer to FIG6 , which is a flow chart of a first optical detection method provided in an embodiment of the present application. This method can be applied to the optical sensor in FIG1 , and the method includes:

[0101] S610, acquiring a first optical signal output by the first detection sensor 120 and a second optical signal output by the second detection sensor 130;

[0102] S620, calculating the covering information based on all the information detected by the first detection sensor 120, the second detection sensor 130, and the third detection sensor 140 in different time periods;

[0103] S630: Convert the first optical signal and the second optical signal into electrical signals, and calculate an optical detection result based on the cover information and the first optical signal and the second optical signal.

[0104] The specific implementation process of the method in this embodiment can be referred to FIG1 and corresponds to the implementation process of the optical sensor in the above embodiment, which will not be repeated here.

[0105] The first optical detection method provided by the embodiments of the present application obtains a first optical signal output by a first detection sensor and a second optical signal output by a second detection sensor. The method then calculates the covering object information based on the total information detected by the first, second, and third detection sensors during different time periods. Finally, the first and second optical signals are converted into electrical signals, and the optical detection results are calculated based on the covering object information. This method eliminates the influence of covering objects on detection, thereby improving the stability and accuracy of optical detection.

[0106] Corresponding to the embodiment of the first optical sensor described above, the present application further provides an optical detection method. Please refer to FIG7 , which is a flow chart of a second optical detection method provided in an embodiment of the present application. This method can be applied to the first optical sensor in FIG4 , and the method includes:

[0107] S710, acquiring a first optical signal output by the first detection sensor 120, a second optical signal output by the second detection sensor 130, and a third optical signal output by the fourth detection sensor 190;

[0108] S720, calculating the covering information based on all the information detected by the first detection sensor 120, the second detection sensor 130, the third detection sensor 140, and the fourth detection sensor 190 in different time periods;

[0109] S730: Convert the first optical signal, the second optical signal, and the third optical signal into electrical signals, and calculate an optical detection result based on the first optical signal, the second optical signal, and the cover information, or calculate an optical detection result based on the second optical signal, the fourth optical signal, and the cover information.

[0110] The specific implementation process of the method in this embodiment can be referred to the implementation process of the optical sensor in Figure 4, which will not be repeated here.

[0111] The second optical detection method provided in the embodiments of the present application obtains a first optical signal output by a first detection sensor, a second optical signal output by a second detection sensor, and a third optical signal output by a fourth detection sensor. Coverage information is then calculated based on the total information detected by the first, second, third, and fourth detection sensors during different time periods. Finally, the first, second, and third optical signals are converted into electrical signals, and an optical detection result is calculated based on the first and second optical signals and the coverage information, or based on the second and fourth optical signals and the coverage information. This method eliminates the effects of coverage on detection, thereby improving the stability and accuracy of optical detection.

[0112] An embodiment of the present application further discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the optical detection method in the method embodiment is implemented.

[0113] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program. The program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0114] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. An optical sensor, characterized in that: The optical sensor comprises an optical signal processing layer and an optical signal transmission layer, the optical signal processing layer and the optical signal transmission layer are in sealed contact to form a closed space, an optical signal processing component is fixedly placed in the closed space, the optical signal transmission layer is a silicon photonic chip, and a first detection sensor, a second detection sensor and a third detection sensor are fixed in the silicon photonic chip; wherein, The first detection sensor and the second detection sensor are separated by a first preset distance, and are used to detect first environmental information and information about an object to be detected and output a first optical signal, wherein the first environmental information is environmental information about a gas environment or a liquid environment where the optical sensor is placed, and the information about the object to be detected includes information about a target object to be detected and information about a covering object; The second detection sensor and the third detection sensor are separated by a second preset distance and are used to detect the first environmental information and output a second optical signal; The third detection sensor is used to detect second environmental information, where the second environmental information is environmental information in the confined space; The optical signal processing component is detachably fixed on the side of the silicon photonic chip, and is used to calculate the covering information based on all the information detected by the first detection sensor, the second detection sensor and the third detection sensor in different time periods, to convert the first optical signal and the second optical signal into electrical signals, and to output optical detection results based on the first optical signal, the second optical signal and the covering information.

2. The optical sensor according to claim 1, wherein: The optical signal processing component includes a photoelectric converter, a light source module and a main controller, wherein the photoelectric converter and the light source module are electrically connected to the main controller, wherein the photoelectric converter is used to convert the first optical signal and the second optical signal into the electrical signal, and the light source module is used to transmit the generated light waves to the silicon photonic chip.

3. The optical sensor according to claim 2, characterized in that The optical signal transmission layer further includes a light guide, which is embedded in the silicon photonic chip and used to transmit the light wave to the first detection sensor, the second detection sensor and the third detection sensor. The light guide, the first detection sensor, the second detection sensor and the third detection sensor are all located at the same height and on the same horizontal line in the silicon photonic chip, and the horizontal line is parallel to the side surface. A first groove is formed in an area of ​​the side surface that is not in contact with the enclosed space, the first detection sensor is embedded in the first groove, and a filter film is formed on the surface of the first groove, the filter film is used to pass the target detection object corresponding to the target detection object information; A second groove is formed in the area where the side surface contacts the enclosed space, the third detection sensor is embedded in the groove, and a layer of the filter film is formed on the surface of the first groove.

4. The optical sensor according to claim 3, characterized in that The optical signal transmission layer also includes a grating component, which is embedded in the silicon photonic chip. A grating path is formed between the light guide pipe and the photoelectric converter through the grating component. The light guide pipe is used to transmit the first optical signal and the second optical signal to the photoelectric converter through the grating path.

5. The optical sensor according to claim 1, wherein: Except for the side contacting the enclosed space, the other outer edges of the optical signal processing layer and the optical signal transmission layer are wrapped with a protective coating, and the outer edges of the side close to the first detection sensor and the second detection sensor are not wrapped with the protective coating.

6. The optical sensor according to claim 2, wherein: The optical signal processing layer also includes a power supply, a temperature sensor and a humidity sensor. The photoelectric converter, the temperature sensor and the humidity sensor are all electrically connected to the main controller, and the main controller is electrically connected to the power supply; wherein, The main controller is also used to generate a power-off instruction when it detects that the temperature collected by the temperature sensor is greater than a preset temperature threshold, or when it detects that the humidity collected by the humidity sensor is greater than a preset humidity threshold. The power-off instruction is used to disconnect the electrical connection between the main controller and the power supply.

7. An optical sensor, characterized in that: The optical sensor comprises an optical signal processing layer and an optical signal transmission layer, the optical signal processing layer and the optical signal transmission layer are in sealed contact to form a closed space, an optical signal processing component is fixedly placed in the closed space, the optical signal transmission layer is a silicon photonic chip, and a first detection sensor, a second detection sensor, a third detection sensor and a fourth detection sensor are fixed in the silicon photonic chip; wherein, The first detection sensor and the second detection sensor are separated by a first preset distance, and are used to detect first environmental information and information about an object to be detected and output a first optical signal, wherein the first environmental information is environmental information about a gas environment or a liquid environment where the optical sensor is placed, and the information about the object to be detected includes information about a target object to be detected and information about a covering object; The second detection sensor and the third detection sensor are separated by a second preset distance and are used to detect the first environmental information and output a second optical signal; The third detection sensor and the fourth detection sensor are separated by a third preset distance and are used to detect second environmental information, where the second environmental information is environmental information in the confined space; The fourth detection sensor is used to detect the first environmental information and output a third optical signal, wherein the first detection sensor and The fourth detection sensor has a different operating band; The optical signal processing component is detachably fixed on the side of the silicon photonic chip, and is used to calculate the covering information based on all information detected by the first detection sensor, the second detection sensor, the third detection sensor and the fourth detection sensor in different time periods, and to convert the first optical signal, the second optical signal and the third optical signal into electrical signals, and to output optical detection results based on the first optical signal, the second optical signal and the covering information, or to output optical detection results based on the second optical signal, the third optical signal and the covering information.

8. An optical detection method, characterized in that: The optical sensor according to any one of claims 1 to 6, wherein the method comprises: Acquire a first light signal output by the first detection sensor and a second light signal output by the second detection sensor; Calculate the covering information according to all the information detected by the first detection sensor, the second detection sensor and the third detection sensor in different time periods; The first optical signal and the second optical signal are converted into electrical signals, and optical detection results are calculated based on the first optical signal and the second optical signal according to the cover information.

9. An optical detection method, characterized in that: Applied to the optical sensor of claim 7, the method comprising: Acquire a first light signal output by the first detection sensor, a second light signal output by the second detection sensor, and a third light signal output by the fourth detection sensor; Calculate the covering information according to all the information detected by the first detection sensor, the second detection sensor, the third detection sensor and the fourth detection sensor in different time periods; The first optical signal, the second optical signal and the third optical signal are converted into electrical signals, and an optical detection result is calculated according to the first optical signal, the second optical signal and the covering information, or an optical detection result is calculated according to the second optical signal, the fourth optical signal and the covering information.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, which, when executed by one or more processors, implements the method of claim 8 or 9.

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