Automatic silicon wafer lapping system and lapping method

Abstract

An automatic silicon wafer lapping system, comprising: a loop wire saw cut-off machine, configured to cut a monocrystalline silicon rod so as to obtain a sample wafer to be lapped; an automatic silicon wafer lapping apparatus, comprising: a bottom frame (10), a workbench (1) being provided on the bottom frame (10), and the workbench (1) being provided with a sample wafer slot (3) configured to hold said sample wafer; a first linear moving assembly, in transmission connection with the workbench so as to drive the workbench to move in a first direction; and a second linear moving assembly, comprising two driving devices provided on two sides of a moving trajectory of the workbench (1), outputting ends of the two driving devices being respectively provided with lapping heads (8), and the two driving devices being configured to drive the lapping heads (8) to be close to / away from said sample wafer, so as to lap one or two surfaces of said sample wafer; and a carbon-oxygen measuring machine, configured to measure a sample which is lapped and processed by the automatic silicon wafer lapping apparatus. The present disclosure can automatically complete sample wafer cutting, and then perform lapping treatment and carbon-oxygen measurement on the sample wafer, thus achieving unmanned sample wafer measurement. Further provided is an automatic silicon wafer lapping method.

Description

Silicon wafer automatic grinding system and grinding method

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 1, 2023, with application number 202311443807.8 and application name “Automatic Silicon Wafer Grinding System and Grinding Method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to, but is not limited to, the field of semiconductor silicon wafer processing technology, and in particular to a system and a grinding method capable of realizing automatic loading, unloading, and automatic grinding. Background Art

[0003] In the field of solar monocrystalline silicon rod production and testing, the oxygen and carbon content index is directly related to the efficiency and fragmentation rate of the downstream factory cells, so it has become an important standard for many cell manufacturers when purchasing silicon rods and silicon wafers. The higher the oxygen content in the silicon material, the lower the conversion efficiency of the cell, and the higher the carbon content, the greater the stress and the easier it is to fragment. In order to control the oxygen and carbon content parameters of the single crystal, samples need to be cut at the head and tail of the long crystal rod when the single crystal is cut. The oxygen and carbon content is obtained by analysis using an oxygen and carbon tester, and the single crystal is graded and sorted. The samples used for oxygen and carbon testing need to be polished and prepared at designated locations. Since the oxygen and carbon tester has high requirements for the integrity, thickness, and polishing brightness of the samples, it has been difficult to break through the sample grinding and polishing technology.

[0004] Conventional polishing methods rely on manual preparation using handheld equipment, resulting in high labor costs and low polishing efficiency. This impacts product turnover, restricts production capacity, and fails to meet the demands of automated production lines. Introducing large-scale polishing equipment also presents challenges such as high procurement costs and high maintenance costs. Application Contents

[0005] According to an embodiment of the present disclosure, a silicon wafer automatic grinding system and grinding method are provided, which can automatically complete sample cutting, and then grind the sample and perform carbon and oxygen detection, thereby realizing unmanned sample detection.

[0006] According to an embodiment of the present disclosure, there is provided a silicon wafer automatic grinding system, comprising:

[0007] A loop cutter is configured to cut the single crystal silicon rod into samples to be ground;

[0008] Automatic silicon wafer grinding equipment, including:

[0009] chassis;

[0010] A workbench is provided on the base frame, wherein the workbench is provided with a sample slot configured to hold the sample to be ground;

[0011] a first linear motion assembly, drivingly connected to the workbench to drive the workbench to move in a first direction;

[0012] a second linear motion assembly, comprising two drive devices disposed on either side of the worktable's motion track, wherein the output ends of the two drive devices are respectively provided with grinding heads, and the two drive devices are configured to drive the grinding heads toward or away from the sample to be ground, so as to grind one or both sides of the sample to be ground;

[0013] The carbon and oxygen detector is configured to detect samples after being ground by the silicon wafer automatic grinding equipment.

[0014] According to some embodiments of the present disclosure, the automatic silicon wafer grinding system further includes:

[0015] A conveyor line is provided between the loop cutter and the automatic silicon wafer grinding device, and the conveyor line is configured to transfer the sample to be ground to the automatic silicon wafer grinding device.

[0016] According to some embodiments of the present disclosure, the automatic silicon wafer grinding system further includes:

[0017] A robot arm is arranged adjacent to the automatic silicon wafer grinding device, and is configured to grab and transfer the sample to be ground or the sample after grinding.

[0018] According to some embodiments of the present disclosure, the conveyor line is an electric monorail transmission device suspended in the air.

[0019] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment also includes a clamping assembly, which includes sample clamping parts arranged on both sides of the workbench movement track, and the two sample clamping parts can move toward / backward synchronously to clamp or release the sample to be ground.

[0020] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes:

[0021] A cooling water pipe, with a water outlet arranged above the base frame and facing the grinding processing area, is configured to water-cool the sample during the grinding process.

[0022] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes:

[0023] An air knife is arranged on the base frame and is adjacent to the upper / lower material port of the automatic silicon wafer grinding equipment. The air knife is configured to blow dry the sample after the grinding operation is completed.

[0024] According to some embodiments of the present disclosure, the grinding head includes:

[0025] a bottom plate connected to the output end of the driving device; and

[0026] A plurality of abrasives are arranged in an array on the bottom plate, wherein a sewage drain is provided between two adjacent abrasives and is configured to discharge wastewater and grinding debris generated by grinding.

[0027] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes:

[0028] A processing flow collection device is provided adjacent to the third driving device, and the processing flow collection device is configured to obtain the grinding process information.

[0029] According to another aspect of the present disclosure, a method for automatically polishing a silicon wafer is provided. The method uses the aforementioned automatic polishing system for silicon wafers. The method includes:

[0030] Cutting the single crystal silicon rod to obtain samples to be ground;

[0031] transporting the sample to be ground to an automatic silicon wafer grinding device;

[0032] Check the quality of the grinding head and move the sample to be ground to the processing area if it meets the preset requirements;

[0033] Clamping and fixing the sample to be ground, and grinding one or both sides of the sample to be ground using a grinding head;

[0034] Blow dry the polished samples;

[0035] The dried samples are transported to the carbon oxygen detector for testing; and

[0036] Record data, sort samples and return materials. Beneficial effects

[0037] According to the silicon wafer automatic grinding system and grinding method of the embodiment of the present invention, the single crystal silicon rod is cut by a loop cutter to obtain the sample to be ground, the silicon wafer automatic grinding equipment grinds the sample to be ground, and the carbon oxygen detection machine performs carbon oxygen detection on the ground sample. It can reduce manual intervention, standardize maintenance and operations, stabilize the polishing effect, improve detection accuracy, open up the whole process automation process, realize unmanned sample detection, and eliminate labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] 1 is a schematic structural diagram of a silicon wafer automatic grinding device in a grinding state of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure;

[0039] 2 is a schematic structural diagram of a non-grinding state of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure;

[0040] 3 is a schematic structural diagram of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure from another perspective;

[0041] 4 is an enlarged schematic diagram of a polishing surface of a polishing head of a silicon wafer automatic polishing device of a silicon wafer automatic polishing system according to an exemplary embodiment of the present disclosure; and

[0042] FIG5 is a schematic flow chart of a method for automatically polishing a silicon wafer according to an exemplary embodiment of the present disclosure.

[0043] In the above drawings, the meanings of the reference numerals are as follows:

[0044] 1- Workbench;

[0045] 2-sample;

[0046] 3- sample slot;

[0047] 4-first driving device;

[0048] 5- Sample top fastener;

[0049] 7- second driving device;

[0050] 8- grinding head;

[0051] 9- third driving device;

[0052] 10- bottom frame;

[0053] 11-Cooling water pipe;

[0054] 12-working cabin;

[0055] 13-upper / lower feed port;

[0056] 14- Wind Knife;

[0057] 15-flexible pad;

[0058] 16-Grinding motor;

[0059] 17- Abrasives; and

[0060] 18-Sewage drain. Implementation Methods of the Application

[0061] The present disclosure will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0062] However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known technologies are omitted to avoid unnecessarily confusing the concepts of the present disclosure.

[0063] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The term "comprising" used herein indicates the presence of features, steps, operations, but does not exclude the presence or addition of one or more other features.

[0064] When expressions such as “at least one of A, B, and C, etc.” are used, they should generally be interpreted in accordance with the meaning commonly understood by those skilled in the art (for example, “a system having at least one of A, B, and C” should include but is not limited to systems having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, and C, etc.). When expressions such as “at least one of A, B, or C, etc.” are used, they should generally be interpreted in accordance with the meaning commonly understood by those skilled in the art (for example, “a system having at least one of A, B, or C” should include but is not limited to systems having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, and C, etc.).

[0065] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0066] Figure 1 is a structural schematic diagram of the grinding state of the silicon wafer automatic grinding device of the silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure; Figure 2 is a structural schematic diagram of the non-grinding state of the silicon wafer automatic grinding device of the silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure; Figure 3 is a structural schematic diagram of the silicon wafer automatic grinding device of the silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure from another perspective.

[0067] According to an embodiment of one aspect of the present disclosure, a silicon wafer automatic lapping system is provided, comprising: a loop cutter, an automatic silicon wafer lapping device, and a carbon and oxygen detector. The loop cutter is configured to cut single crystal silicon rods into samples to be lapped. The automatic silicon wafer lapping device is configured to automatically lap the samples to be lapped. The carbon and oxygen detector is configured to inspect samples lapped by the automatic silicon wafer lapping device.

[0068] In this embodiment, the single crystal silicon rod is cut by a circular cutting machine to obtain the sample to be ground, the silicon wafer automatic grinding equipment grinds the sample to be ground, and the carbon oxygen detection machine performs carbon oxygen detection on the ground sample. This can reduce manual intervention, standardize maintenance and operations, stabilize the polishing effect, improve detection accuracy, open up the entire process automation process, realize unmanned sample detection, and eliminate labor costs.

[0069] According to some embodiments of the present disclosure, as shown in FIG. 1 to FIG. 3 , an automatic silicon wafer polishing device includes: a base frame 10 , a workbench 1 , a first linear motion assembly, and a second linear motion assembly.

[0070] According to some embodiments of the present disclosure, the base frame 10 is a supporting structure of the automatic silicon wafer grinding equipment, such as a frame structure, a box structure, etc., which provides support and installation positions for other functional components.

[0071] According to some embodiments of the present disclosure, a workbench 1 is disposed on a base frame 10 , and a sample slot 3 configured to hold a sample 2 to be ground is provided on the workbench 1 .

[0072] According to some embodiments of the present disclosure, the workbench 1 is in the shape of a cube, a cuboid, or a cylinder.

[0073] According to some embodiments of the present disclosure, a sample slot 3 is provided in the middle of the workbench 1 along a first direction. Optionally, the sample slot 3 is an arc-shaped slot, the curvature of which is adapted to the sample to be ground. Furthermore, a flared guide portion is provided at the top of the sample slot 3 to facilitate the insertion of the sample to be ground.

[0074] According to some embodiments of the present disclosure, the first linear motion assembly is in transmission connection with the workbench 1 to drive the workbench 1 to move in the first direction. Optionally, the first linear motion assembly includes a first drive device 4 including an electric cylinder, a pneumatic cylinder, a hydraulic cylinder, a linear motor, etc.

[0075] According to some embodiments of the present disclosure, the workbench 1 includes two working areas: a grinding processing area and a loading and unloading area. The first drive device 4 drives the workbench 1 to move between the two areas, wherein the grinding processing area is configured to grind the samples loaded on the workbench 1, and the loading and unloading area is configured to place the samples to be ground into the sample slot 3 through a loading and unloading device (for example, a robot), or to take the ground samples out of the sample slot 3 and enter the next process.

[0076] According to some optional embodiments of the present disclosure, the first linear motion assembly includes a rodless cylinder, which is arranged on the base frame 10. The rodless cylinder includes a slide that can move along the first direction, wherein the workbench 1 is installed on the slide.

[0077] According to some embodiments of the present disclosure, the second linear motion assembly includes two driving devices (for example, a second driving device 7 and a third driving device 9) arranged on both sides of the moving track of the workbench 1, and the output ends of the two driving devices are respectively provided with grinding heads 8. The two driving devices are configured to drive the grinding heads 8 close to / away from the sample 2 to be ground, so as to facilitate grinding one or both sides of the sample 2 to be ground.

[0078] In this embodiment, one grinding head 8 can be started as needed, while the other grinding head is not started and only serves as a support, so as to grind one side of the sample 2; or both grinding heads can be started as needed to grind both sides of the sample 2 at the same time.

[0079] According to some embodiments of the present disclosure, the two driving devices include an electric cylinder, a pneumatic cylinder, a hydraulic cylinder, a linear motor, etc.

[0080] According to some embodiments of the present disclosure, the automatic silicon wafer grinding device further includes a grinding motor 16 , which is disposed on the output end of the third driving device 9 . The grinding motor 16 is transmission-connected to the grinding head 8 to drive the grinding head 8 to rotate.

[0081] According to some embodiments of the present disclosure, the automatic silicon wafer grinding system further includes a conveyor line, which is arranged between the loop cutter and the automatic silicon wafer grinding equipment, and the conveyor line is configured to transfer the sample 2 to be ground to the automatic silicon wafer grinding equipment.

[0082] According to some optional embodiments of the present disclosure, the conveyor line is an electrical monorail system (EMS) suspended in the air.

[0083] According to some alternative embodiments of the present disclosure, the conveyor line is a conveyor belt transmission line.

[0084] According to some embodiments of the present disclosure, the automatic silicon wafer grinding system further includes a robot arm, which is disposed adjacent to the automatic silicon wafer grinding device and is configured to grab, transfer, and move samples to be ground or samples after grinding.

[0085] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment also includes a clamping assembly, which includes a sample clamping member 5 arranged on both sides of the workbench movement track. The two sample clamping members 5 can move toward / backward synchronously to clamp or release the sample to be ground.

[0086] According to some optional embodiments of the present disclosure, two sample clamping members 5 are connected to a linear drive device, and the two sample clamping members 5 move synchronously under the drive of the linear drive device to fix the sample 2 in the grinding processing area to prevent the sample from vibrating, shaking, and shifting during the grinding process, thereby causing the grinding process to fail.

[0087] According to some embodiments of the present disclosure, the clamping assembly includes a pneumatic clamp, which includes two pneumatic clamping parts arranged on both sides of the moving track of the workbench 1. The two pneumatic clamping parts move toward each other in response to the application of air pressure, and move back to back in response to the release of air pressure.

[0088] According to some embodiments of the present disclosure, the clamping assembly further includes a flexible pad 15 , which is disposed on two opposite clamping surfaces of the two pneumatic clamping parts to reduce damage to the sample.

[0089] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes a cooling water pipe 11, the outlet of which is arranged above the base frame 10 and toward the grinding processing area, and the cooling water pipe 11 is configured to water-cool the sample 2 during the grinding process.

[0090] According to some embodiments of the present disclosure, a drainage trough is provided on the base frame 10. When the sample is ground, the cooling water pipe 11 sprays cooling water toward the grinding area to cool it down. At the same time, the cooling water takes away the ground debris through the drainage trough.

[0091] According to some embodiments of the present disclosure, the automated silicon wafer polishing apparatus further includes a work chamber 12, which is mounted on a base frame 10 to form a sealed polishing space. This reduces the possibility of splashing polishing debris and reduces polishing noise. A loading / unloading port 13 is provided on the work chamber 12 at a location intersecting the movement trajectory of the worktable 1.

[0092] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes an air knife 14, which is disposed on the base frame 10. The air knife 14 is disposed adjacent to the upper / lower material port 13 of the automatic silicon wafer grinding equipment. The air knife 14 is configured to blow dry the sample after the grinding operation is completed.

[0093] In this embodiment, after the sample is ground in the grinding processing area, it is moved to the upper / lower material port 13 through the workbench 1, and the air knife 14 is started to blow the sample dry so as to enter the next step.

[0094] FIG. 4 is an enlarged schematic diagram of a polishing surface of a polishing head of an automatic silicon wafer polishing device of an automatic silicon wafer polishing system according to an exemplary embodiment of the present disclosure.

[0095] According to some embodiments of the present disclosure, as shown in FIG4 , a grinding head 8 includes a base plate and a plurality of abrasives 17 . The base plate is connected to the output of a drive device. The abrasives 17 are arranged in an array on the base plate, with a wastewater trough 18 disposed between adjacent abrasives 17 to drain wastewater and grinding debris generated by grinding.

[0096] According to some embodiments of the present disclosure, the automatic silicon wafer grinding apparatus further includes a process flow acquisition device, disposed adjacent to the second linear motion assembly, and configured to acquire grinding process information. The grinding process information includes determining whether the grinding surface of the grinding head 8 has defects (e.g., abnormal wear, protrusions, or a clogged sewage drain). For example, the process flow acquisition device includes an image acquisition device and an image processing device, which acquire images of the grinding surface before, during, and after grinding, and analyzes the images to determine whether they meet requirements. If so, the process proceeds to the next step. If not, a reminder is issued to facilitate replacement of the grinding head.

[0097] FIG5 is a schematic flow chart of a method for automatically polishing a silicon wafer according to an exemplary embodiment of the present disclosure.

[0098] According to another aspect of the present disclosure, an automatic silicon wafer grinding method is provided. Using the aforementioned automatic silicon wafer grinding system, as shown in FIG. 5 , the grinding method includes operations S101 to S109 .

[0099] According to some embodiments of the present disclosure, operation S101 includes: cutting a single crystal silicon rod to obtain a sample to be ground.

[0100] According to some embodiments of the present disclosure, operation S102 includes: transporting the sample to be ground to an automatic silicon wafer grinding device.

[0101] According to some embodiments of the present disclosure, operation S103 includes: detecting the quality of the grinding head, and if it meets the preset requirements, proceeding to operation S105; if it does not meet the preset requirements, proceeding to operation S104.

[0102] According to some embodiments of the present disclosure, operation S104 includes: replacing the grinding head and returning to operation S103 for re-testing.

[0103] According to some embodiments of the present disclosure, operation S105 includes: moving the sample to be ground to a processing area.

[0104] According to some embodiments of the present disclosure, operation S106 includes: clamping and fixing the sample to be ground, and grinding one side or both sides of the sample to be ground using a grinding head.

[0105] According to some embodiments of the present disclosure, operation S107 includes: performing a blow-drying operation on the ground sample.

[0106] According to some embodiments of the present disclosure, operation S108 includes: transporting the blow-dried sample to a carbon oxygen detector for detection.

[0107] According to some embodiments of the present disclosure, operation S109 includes: recording data, sorting samples and returning them.

[0108] In this embodiment, wafers are collected by a loop cutter, transported via an EMS overhead crane, and then grabbed by a robotic arm for transfer. The wafers are then joined by an automated silicon wafer lapping machine, clamped by a lapping head, and polished. The workbench is then transferred to the discharge port, where air knives blow dry the wafers. The robotic arm grabs the wafers for transfer, and the carbon-oxygen analyzer receives and tests the wafers, ultimately leading to automatic wafer removal. This process enables fully automated lapping and testing of wafers without human intervention. This embodiment meets the processing requirements for 247 / 295 wafers, with a maximum lapping thickness of less than 2mm.

[0109] According to the automatic silicon wafer grinding system and method of the disclosed embodiments, the workbench is used to manage the loading and unloading of the sample wafers, the holding assembly is used to fix the sample wafers in the grinding area, and the abutment plate is used in conjunction with the grinding head to automatically grind the sample wafers. The following technical effects are achieved:

[0110] (1) Reduce the number of people involved. Develop fully automatic grinding equipment and its supporting equipment to open up the entire process automation process, realize unmanned sample inspection, and eliminate labor costs;

[0111] (2) Standardization, reducing manual intervention, standardizing maintenance and operations, stabilizing polishing effects, and improving detection accuracy;

[0112] (3) Technological breakthrough - thin slice grinding: The minimum grinding thickness is 1.5mm, which can meet the thickness requirements of mainstream oxygen and carbon analyzers in the market, and supports various sample grinding processes such as φ295 / φ247;

[0113] (4) Technological breakthrough - grinding effect: glossiness up to 300GU, capable of continuous processing of 50 pieces.

[0114] The embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It should be noted that any implementations not depicted or described in the drawings or the main text of the specification are known to those skilled in the art and are not described in detail. Furthermore, the definitions of the various components described above are not limited to the specific structures, shapes, or methods described in the embodiments; those skilled in the art may easily modify or replace them.

[0115] It should also be noted that, in the specific embodiments of the present disclosure, unless otherwise indicated, the numerical parameters in this specification and the appended claims are approximate values ​​and can vary depending on the desired properties obtained through the content of the present disclosure. Specifically, all numbers used in the specification and claims to express the size, range conditions, etc. of the composition should be understood to be modified by the term "about" in all cases. Generally, the meaning of the expression is to include the variation of the specific quantity by ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments.

[0116] Those skilled in the art will appreciate that the features described in the various embodiments and / or claims of this disclosure may be combined and / or coupled in various ways, even if such combinations and / or couplings are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure may be combined and / or coupled in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or couplings are intended to fall within the scope of this disclosure.

[0117] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above are only specific embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the scope of protection of the present disclosure.

Claims

1. A silicon wafer automatic grinding system, comprising: A loop cutter, configured to cut the single crystal silicon rod to obtain samples to be ground; Automatic silicon wafer grinding equipment, including: chassis; A workbench, arranged on the base frame, wherein the workbench is provided with a sample slot configured to hold the sample to be ground; A first linear motion component, drivingly connected to the workbench to drive the workbench to move in a first direction; A second linear motion assembly includes two driving devices arranged on both sides of the moving track of the workbench, the output ends of the two driving devices are respectively provided with grinding heads, and the two driving devices are configured to drive the grinding heads to approach / move away from the sample to be ground, so as to grind one side or both sides of the sample to be ground; The carbon oxygen detector is configured to detect samples after being ground by the silicon wafer automatic grinding equipment.

2. The automatic silicon wafer grinding system according to claim 1, further comprising: A conveyor line is arranged between the loop wire cutting machine and the automatic silicon wafer grinding equipment, and the conveyor line is configured to transfer the sample to be ground to the automatic silicon wafer grinding equipment.

3. The automatic silicon wafer grinding system according to claim 2, further comprising: A robot arm is arranged adjacent to the automatic silicon wafer grinding device, and the robot arm is configured to grab and transfer the sample to be ground or the sample after grinding.

4. The automatic silicon wafer grinding system according to claim 2, wherein: The conveyor line is an electric monorail transmission device suspended in the air.

5. According to the silicon wafer automatic grinding system according to claim 1, the silicon wafer automatic grinding equipment also includes a clamping assembly, and the clamping assembly includes sample clamping members arranged on both sides of the moving track of the workbench, and the two sample clamping members can move toward / backward synchronously to clamp or release the sample to be ground.

6. The automatic silicon wafer grinding system according to claim 1, wherein the automatic silicon wafer grinding equipment further comprises: A cooling water pipe, with a water outlet disposed above the base frame and facing the grinding processing area, and the cooling water pipe is configured to water-cool the sample during the grinding process.

7. The automatic silicon wafer grinding system according to claim 6, wherein the automatic silicon wafer grinding equipment further comprises: The wind knife is arranged on the base frame, and the wind knife is arranged adjacent to the upper / lower material port of the automatic silicon wafer grinding equipment. The wind knife is configured to blow dry the sample after the grinding operation is completed.

8. The automatic silicon wafer grinding system according to claim 1, wherein: The grinding head comprises: a bottom plate connected to the output end of the driving device; and A plurality of abrasives are arranged in an array on the bottom plate, wherein a sewage drain is provided between two adjacent abrasives and is configured to discharge waste water and grinding debris generated by grinding.

9. The automatic silicon wafer grinding system according to claim 1, wherein the automatic silicon wafer grinding device further comprises: The processing flow collection device is arranged adjacent to the third driving device, and the processing flow collection device is configured to obtain grinding process information.

10. A method for automatically grinding a silicon wafer, using the automatic silicon wafer grinding system according to any one of claims 1 to 9, the grinding method comprising: Cutting the single crystal silicon rod to obtain samples to be ground; The sample to be ground is transported to an automatic silicon wafer grinding device; Detect the quality of the grinding head, and if the preset requirements are met, move the sample to be ground to the processing area; Clamping and fixing the sample to be ground, and grinding one side or both sides of the sample to be ground by a grinding head; Blow dry the ground samples; The dried samples are transported to the carbon oxygen detector for testing; as well as Record data, sort samples and return them.

Images