Cold plate heat dissipation system having air-liquid composite architecture, motherboard, and server

Abstract

The present application relates to the technical field of servers, discloses a cold plate heat dissipation system having an air-liquid composite architecture, a motherboard, and a server, and aims to solve the problems of a small total heat exchange area and the waste of cooling capacity. The system comprises heat exchange cavities, a water inlet pipe, and a water outlet pipe, wherein the bottom surfaces of the heat exchange cavities are used for abutting against heating elements. The system further comprises a heat dissipation assembly and a heat conduction assembly. The heat dissipation assembly comprises at least one heat dissipation fin, wherein the bottoms of the heat dissipation fins are connected to the bottom surfaces of the heat exchange cavities, and the water inlet pipe and the water outlet pipe are respectively located at two ends of the heat dissipation fins in the length direction. The bottom of the heat conduction assembly is connected to the bottom surfaces of the heat exchange cavities, and the top of the heat conduction assembly is connected to the tops of the heat dissipation fins, so as to transfer part of heat absorbed by the heat exchange cavities to the tops of the heat dissipation fins. The present application can increase the total heat exchange area between cooling liquid and the heating elements, reduce the waste of cooling capacity of the cooling liquid at a top layer as much as possible, optimize the heat dissipation performance and temperature uniformity, and improve heat dissipation efficiency of the cold plate liquid cooling technology.

Description

An air-liquid composite cold plate cooling system, motherboard and server

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on November 15, 2023, with application number 202311517910.2, entitled "A wind-liquid composite architecture cold plate cooling system, motherboard and server", all contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of server technology, and in particular to an air-liquid composite cold plate cooling system, a motherboard, and a server. Background Art

[0004] Servers are a crucial component of electronic devices, primarily used to provide computing services. Depending on the type of service they provide, servers are categorized as file servers, database servers, application servers, and web servers. The primary components of a server include a chassis, motherboard, CPU (Central Processing Unit), GPU (Graphic Processing Unit), hard drive, memory, power supply, and heat sink, similar to the architecture of a typical computer.

[0005] In recent years, server performance has become increasingly higher, and the amount of heat generated has also increased. Traditional server air cooling can no longer meet the heat dissipation requirements. Furthermore, air cooling is energy-intensive and noisy, and has been gradually phased out, replaced by liquid cooling technology. Within the industry, liquid cooling technologies are primarily categorized as direct and indirect.

[0006] Among these, direct liquid cooling technologies are primarily immersion cooling, which completely immerses servers in an insulating coolant, relying on the circulating coolant to remove heat generated by the servers. However, immersion cooling has strict environmental requirements, low computer room space utilization, and significant costs for configuration, maintenance, and reconstruction. Furthermore, the risk of coolant corrosive effects on servers remains unclear. These shortcomings have prevented direct liquid cooling from becoming mainstream, and its application is typically limited to ultra-high-density data centers.

[0007] At present, indirect liquid cooling technology is a widely used liquid cooling technology. Indirect liquid cooling technology is mainly based on cold plate liquid cooling technology. This technology uses a working fluid (such as coolant, low-temperature gas, etc.) as a medium for heat transfer, allowing the working fluid to flow in the cold plate, and then absorbs the heat of the heating elements (such as CPU, etc.) in the server through the cold plate, and finally transfers the heat to the working fluid, which is then transferred to a distant place for cooling. During this period, the working fluid is separated from the heating element and does not directly contact the heating element. Instead, the cold plate is used as a heat transfer component between the two, and the heat-absorbing materials such as thermal grease coated on the cold plate can quickly transfer the heat of the heating element to the working fluid.

[0008] In related technologies, the liquid cooling plate in cold plate liquid cooling technology generally uses a metal plate such as a copper plate, and the inside of the metal plate is hollowed out to form a heat exchange cavity that can hold a certain amount of coolant. Then, water inlet and outlet pipes are inserted at both ends of the metal sheet respectively, and finally connected to the CDU (Cooling Dispensing Unit) to realize the circulation of the coolant in the heat exchange cavity of the metal sheet. However, on the one hand, since the size of heat-generating components such as the central processing unit and the graphics processing unit is generally small and the exposed area is small, the heat generation power is very high, resulting in a very limited contact area between the liquid cooling plate and the heat-generating components, and a small total heat exchange area between the coolant and the heat-generating components; on the other hand, due to the laminar flow characteristics of the coolant and the influence of its own weight, when the coolant enters the heat exchange cavity of the metal plate from the water inlet pipe, the coolant on the bottom layer can always fully absorb the heat of the heat-generating components, while the coolant on the top layer is not easy to fully absorb the heat of the heat-generating components. In addition, due to the pumping drive action in the cooling distribution unit, the flow rate of the coolant is very fast, resulting in the coolant on the top layer often flowing out of the heat exchange cavity directly before fully absorbing the heat, resulting in poor heat dissipation uniformity and waste of cooling capacity of some coolant.

[0009] Summary of the Invention

[0010] The present application provides an air-liquid composite cold plate heat dissipation system, comprising a heat exchange cavity, a water inlet pipe and a water outlet pipe connected to the heat exchange cavity, the interior of the heat exchange cavity being used to contain coolant, and the bottom surface of the heat exchange cavity being used to abut against a heating element, and the air-liquid composite cold plate heat dissipation system further comprising a heat dissipation component and a heat conduction component installed in the heat exchange cavity;

[0011] The heat dissipation assembly includes at least one heat dissipation fin, the bottom of the heat dissipation fin is connected to the bottom surface of the heat exchange cavity and extends along the height direction of the heat exchange cavity, and the water outlet of the water inlet pipe and the water inlet of the water outlet pipe are respectively located at the two ends of the length direction of the heat dissipation fin; and

[0012] The bottom of the heat conducting component is connected to the bottom surface of the heat exchange cavity, and the top of the heat conducting component is connected to the top of the heat dissipation fin to transfer part of the heat absorbed by the heat exchange cavity to the top of the heat dissipation fin.

[0013] In some embodiments, the water outlet of the water inlet pipe and the water inlet of the water outlet pipe are both connected to the top of the heat exchange cavity and are respectively located at both ends of the heat exchange cavity in the longitudinal direction.

[0014] In some embodiments, the water outlet of the water inlet pipe is connected to the top of the heat exchange cavity, the water inlet of the water outlet pipe is connected to the bottom of the side wall of the heat exchange cavity, and the water outlet of the water inlet pipe and the water inlet of the water outlet pipe are respectively located at the two ends of the length direction of the heat exchange cavity.

[0015] In some embodiments, the top wall of the heat exchange cavity is a vapor chamber, the top of the heat sink fins extends to connect to the vapor chamber, and the vapor chamber is used to naturally exchange part of the heat of the heat sink fins with the outside air.

[0016] In some embodiments, the air-liquid composite cold plate cooling system is applied to a server, the server includes a cooling fan, and the height of the heat exchange cavity is equal to the height of the air duct formed by the cooling fan in the server.

[0017] In some embodiments, the heat dissipation component includes two heat dissipation fins at the head and tail, and the side walls on both sides of the width direction of the heat exchange cavity are heat-conducting medium walls. The head and tail heat dissipation fins are respectively tightly attached to the inner walls on both sides of the width direction of the heat exchange cavity, and air-cooled heat dissipation fins are provided on the outer walls on both sides of the width direction of the heat exchange cavity.

[0018] In some embodiments, the bottom of the heat dissipation fins is welded to the bottom surface of the heat exchange cavity, and the thickness of each heat dissipation fin is 0.2 to 0.3 mm.

[0019] In some embodiments, both sides of the heat dissipation fin are provided with protrusions and / or grooves to increase the surface area.

[0020] In some embodiments, the heat dissipation component includes multiple heat dissipation fins, and the heat conduction component includes a bottom heat pipe covering the bottom surface of the heat exchange cavity, a column heat pipe upright on the surface of the bottom heat pipe, and a top heat pipe arranged at the top of the column heat pipe; the column heat pipe extends vertically to a preset height position of the heat dissipation fins, and the top heat pipe passes through multiple heat dissipation fins in sequence.

[0021] In some embodiments, the top heat pipe vertically penetrates the heat dissipation fins, and the top heat pipe penetrates the top and / or middle of the heat dissipation fins.

[0022] In some embodiments, the heat dissipation assembly includes a plurality of heat dissipation fins, and the bottom heat pipe extends along an arrangement direction of the plurality of heat dissipation fins and is evenly distributed along a length direction of the plurality of heat dissipation fins.

[0023] In some embodiments, the heat dissipation assembly includes multiple heat dissipation fins, each heat dissipation fin is provided with a through hole for the top heat pipe to pass through, and an extension sleeve is connected between the hole walls of the through holes of two adjacent heat dissipation fins, and the extension sleeve is used to be sleeved on the top heat pipe.

[0024] In some embodiments, the gap between the outer tube wall of the top heat pipe and the inner tube wall of the extension sleeve is filled with a welded thermal conductive flux.

[0025] In some embodiments, the heat dissipation component includes multiple heat dissipation fins, and the air-liquid composite cold plate heat dissipation system also includes a water distribution pipe connected to the water outlet of the water inlet pipe. The water distribution pipe extends along the arrangement direction of the multiple heat dissipation fins, and multiple evenly distributed water outlets are provided on the water distribution pipe.

[0026] In some embodiments, the heat dissipation component includes multiple heat dissipation fins, and the air-liquid composite cold plate heat dissipation system also includes a water collecting pipe connected to the water inlet of the water outlet pipe. The water collecting pipe extends along the arrangement direction of the multiple heat dissipation fins, and multiple evenly distributed water inlets are opened on the water collecting pipe.

[0027] In some embodiments, a plurality of heat exchange cavities are provided, each heat exchange cavity is used to abut against a different heating element, and each heat exchange cavity is connected in series through a water inlet pipe and a water outlet pipe.

[0028] In some embodiments, a heat conducting plate is further provided on the bottom surface of the heat exchange cavity. The bottom surface of the heat conducting plate is a smooth plane and is used to press the top surface of the heating element and absorb its heat.

[0029] In some embodiments, the heat conducting plate is detachably connected to the heat exchange cavity so that the heat conducting plate can be replaced with a heat conducting plate having a size matching that of the heating element on the heat exchange cavity.

[0030] In some embodiments, the top surface of the heat conducting plate is provided with a snap-fit ​​groove at a fixed position;

[0031] A guide groove extending vertically is provided on the bottom surface of the heat exchange cavity, a guide slider is provided in the guide groove, a clamping piece is provided at the bottom of the guide slider, and a plug-in operation block is provided on the side wall of the guide slider. The clamping piece is used to form a clamping connection with the clamping groove, and the plug-in operation block is used to apply a vertical force to the guide slider to insert the clamping piece into the clamping groove or pull the clamping piece out of the clamping groove.

[0032] In some embodiments, the top end of the guide slider forms a magnetic connection with the top end of the guide slot, and / or the clamping member forms a magnetic connection with the clamping slot.

[0033] The present application also provides a motherboard, comprising a board body, a heating element arranged on the surface of the board body, and a heat dissipation system for dissipating heat from the heating element, wherein the heat dissipation system is any of the above-mentioned air-liquid composite structure cold plate heat dissipation systems.

[0034] The present application also provides a server, comprising a chassis, a motherboard installed in the chassis, and cooling fans arranged at both ends of the chassis, wherein the motherboard is the motherboard of the previous item.

[0035] The air-liquid composite cold plate cooling system provided in the present application mainly includes a heat exchange cavity, a water inlet pipe, a water outlet pipe, a heat dissipation component and a heat conduction component. Among them, the heat exchange cavity is the main structure of the heat dissipation system, and has a closed cavity of a specific shape inside, which can hold a certain amount of coolant. It is mainly used to install and accommodate the remaining components of the heat dissipation system, and at the same time provides an environment for heat exchange between the coolant and the heating element. The bottom surface of the heat exchange cavity is used to abut against the heating element (mainly the central processing unit, graphics processing unit and other server components with large heat generation), generally pressed against the exposed top surface of the heating element, thereby absorbing the heat generated by the heating element during operation. The water inlet pipe and the water outlet pipe are both connected to the heat exchange cavity, wherein the water inlet pipe is mainly used to introduce new coolant into the heat exchange cavity, and the water outlet pipe is mainly used to discharge the coolant that has absorbed heat in the heat exchange cavity, so as to realize the continuous circulation of the coolant in the heat exchange cavity. The heat dissipation component is one of the core components, which is installed as a whole in the heat exchange cavity and mainly includes a plurality of heat dissipation fins. The bottom of each heat sink fin is connected to the bottom surface of the heat exchange cavity, and each heat sink fin extends along its height (or vertical direction) within the heat exchange cavity. It is mainly used to gradually disperse the heat absorbed by the heat exchange cavity from the heating element to the side of the entire heat sink fin from bottom to top, so that when the coolant circulates in the heat exchange cavity, it can contact the side surfaces of each heat sink fin - the bottom coolant contacts the bottom side surfaces of the heat sink fins, and the top coolant contacts the top side surfaces of the heat sink fins, thereby absorbing the dispersed heat from the side surfaces of the heat sink fins and achieving liquid cooling. At the same time, the water outlet of the water inlet pipe and the water inlet of the water outlet pipe are respectively located at the two ends of the length direction of each heat sink fin, so that when the coolant flows in the heat exchange cavity, it is ensured that the coolant can flow into one end of the gap between two adjacent heat sink fins, and after flowing completely through the side surfaces of each heat sink fin, it can flow out from the other end of the gap. The heat conducting assembly is another core component, which is installed as a whole in the heat exchange cavity. The bottom of the heat conducting assembly is connected to the bottom surface of the heat exchange cavity, and the top of the heat conducting assembly is connected to the top of each heat dissipating fin. It is mainly used to absorb part of the heat from the heating element through the bottom surface of the heat exchange cavity, and then directly transfer it to the top position of each heat dissipating fin along the extension direction of the heat conducting assembly, so that the top of each heat dissipating fin receives heat and gradually disperses it to the side of the entire heat dissipating fin from bottom to top, so there is no need to wait for the heat to be gradually transferred upward from the bottom of each heat dissipating fin. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0037] FIG1 is a schematic diagram of the overall structure of the air-liquid composite cold plate heat dissipation system provided in an embodiment of the present application.

[0038] FIG2 is a schematic structural diagram of the heat exchange cavity provided in an embodiment of the present application.

[0039] FIG3 is a schematic diagram of the internal structure of the heat exchange cavity provided in an embodiment of the present application.

[0040] FIG4 is a side view of the heat exchange cavity in FIG3 provided in an embodiment of the present application.

[0041] FIG5 is a schematic diagram of the connection structure between the heat dissipation fins and the top heat pipe provided in an embodiment of the present application.

[0042] FIG6 is a schematic structural diagram of a heat conducting assembly provided in an embodiment of the present application.

[0043] FIG7 is a schematic structural diagram of a heat conducting plate provided in an embodiment of the present application.

[0044] FIG8 is a schematic diagram of a partial structure of a heat exchange cavity provided in an embodiment of the present application;

[0045] FIG9 is a schematic diagram of the structure of a mainboard provided in an embodiment of the present application;

[0046] FIG10 is a schematic diagram of the structure of the server provided in an embodiment of the present application.

[0047] Among them, in Figures 1 to 8: heat exchange cavity - 1, water inlet pipe - 2, water outlet pipe - 3, heat dissipation component - 4, heat conduction component - 5, heat spreader - 6, air-cooled heat sink - 7, water distribution pipe - 8, water collecting pipe - 9, heat conduction plate - 10; guide slide - 11, guide slider - 12, clamping part - 13, plug-in operation block - 14; heat dissipation fin - 41, extension sleeve - 42; bottom heat pipe - 51, column heat pipe - 52, top heat pipe - 53; clamping groove - 101. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0049] Please refer to FIG1 , which is a schematic diagram of the overall structure of an air-liquid composite cold plate heat dissipation system provided in an embodiment of the present application.

[0050] In one embodiment provided in the present application, the air-liquid composite cold plate heat dissipation system mainly includes a heat exchange cavity 1, a water inlet pipe 2, a water outlet pipe 3, a heat dissipation component 4 and a heat conduction component 5.

[0051] As shown in FIG2 , FIG2 is a schematic structural diagram of the heat exchange cavity 1 provided in an embodiment of the present application.

[0052] The heat exchange cavity 1 forms the main structure of the cooling system. It contains a sealed, specifically shaped cavity capable of holding a certain amount of coolant. It primarily serves to house and accommodate the remaining components of the cooling system and provides an environment for heat exchange between the coolant and the heating element. The bottom surface of the heat exchange cavity 1 is designed to abut against the heating element (primarily server components with high heat generation, such as the central processing unit (CPU) and graphics processing unit (GPU)). It typically presses against the exposed top surface of the heating element, absorbing the heat generated during operation.

[0053] The water inlet pipe 2 and the water outlet pipe 3 are both connected to the heat exchange cavity 1, wherein the water inlet pipe 2 is mainly used to introduce new coolant into the heat exchange cavity 1, and the water outlet pipe 3 is mainly used to discharge the coolant that has absorbed heat in the heat exchange cavity 1, thereby realizing the continuous circulation of the coolant in the heat exchange cavity 1.

[0054] The heat dissipation assembly 4 is one of the core components, which is integrally installed in the heat exchange cavity 1 and mainly includes at least one heat dissipation fin 41. It should be noted that the number of heat dissipation fins 41 is not limited in this application, and the number of heat dissipation fins 41 can be determined according to actual heat dissipation requirements. The bottom of the heat dissipation fin 41 is connected to the bottom surface of the heat exchange cavity 1, and the heat dissipation fin 41 extends in the heat exchange cavity 1 along the height direction (or vertical direction) of the heat exchange cavity 1, and is mainly used to gradually disperse the heat absorbed by the heat exchange cavity 1 from the heating element to the side of the entire heat dissipation fin 41 from bottom to top, so that the coolant can contact the side surfaces of the heat dissipation fin 41 when circulating in the heat exchange cavity 1 - the bottom coolant contacts the bottom of the side surface of the heat dissipation fin 41, and the top coolant contacts the top of the side surface of the heat dissipation fin 41, thereby absorbing the dispersed heat from the side surface of the heat dissipation fin 41 to achieve liquid cooling. At the same time, the water outlet of the water inlet pipe 2 and the water inlet of the water outlet pipe 3 are respectively located at the two ends of the heat sink fin 41 in the longitudinal direction. This ensures that when the coolant flows in the heat exchange cavity 1, the coolant can flow into the heat sink fin 41 from one end of the gap, flow completely through the side of the heat sink fin 41, and then flow out from the other end of the heat sink fin 41. When the heat sink assembly 4 includes multiple heat sink fins 41, it can also ensure that the coolant can flow into the heat sink fin 41 from one end of the gap, flow completely through the side of each heat sink fin 41, and then flow out from the other end of the gap.

[0055] The heat conducting component 5 is another core component, which is installed as a whole in the heat exchange cavity 1. The bottom of the heat conducting component 5 is connected to the bottom surface of the heat exchange cavity 1, and the top of the heat conducting component 5 is connected to the top of the heat dissipation fin 41. It is mainly used to absorb part of the heat from the heating element through the bottom surface of the heat exchange cavity 1, and then directly transfer it to the top position of the heat dissipation fin 41 along the extension direction of the heat conducting component 5, so that the top of the heat dissipation fin 41 receives the heat and gradually disperses it to the side of the entire heat dissipation fin 41 from bottom to top, so there is no need to wait for the heat to be gradually transferred upward from the bottom of the heat dissipation fin 41.

[0056] In this way, the air-liquid composite structure cold plate heat dissipation system provided in this embodiment disperses the heat absorbed by the heat exchange cavity 1 from the heating element to the entire side surface through the heat dissipation fins 41 in the heat dissipation component 4, so that when the coolant circulates in the heat exchange cavity 1, it can not only directly absorb the heat of the heating element through the bottom surface of the heat exchange cavity 1, but also indirectly absorb the heat of the heating element through the side surface of the heat dissipation fins 41. Moreover, since the side surface area of ​​the heat dissipation fins 41 is significantly larger than the bottom area of ​​the heat exchange cavity 1, and a larger number of heat dissipation fins 41 can be arranged, and the side surface of each heat dissipation fin 41 can be in contact with the coolant, the total heat exchange area between the coolant and the heating element is greatly increased.

[0057] At the same time, when the coolant circulates in the heat exchange cavity 1, although due to the laminar flow characteristics, the bottom coolant contacts the bottom of the heat dissipating fins 41, and the top coolant contacts the top of the heat dissipating fins 41, and the heat at the bottom of the heat dissipating fins 41 is more concentrated, while the heat density dispersed to the top is lower, but under the action of the heat conducting component 5, part of the heat of the heating element can be directly transferred to the top of the heat dissipating fins 41, thereby increasing the heat received and dispersed at the top of the heat dissipating fins 41, making the heat density at the bottom and top of the heat dissipating fins 41 tend to be average, and then the top coolant can also fully absorb heat from the side top of the heat dissipating fins 41, avoiding waste of cooling capacity.

[0058] In summary, the air-liquid composite architecture cold plate cooling system provided in this embodiment integrates the characteristics of both air cooling and liquid cooling into the cold plate liquid cooling technology to form a composite architecture, which can increase the total heat exchange area between the coolant and the heating element, while minimizing the cooling waste of the top layer of coolant, optimizing the heat dissipation uniformity, and improving the heat dissipation efficiency of the cold plate liquid cooling technology.

[0059] As shown in Figures 3 and 4, Figure 3 is a schematic diagram of the internal structure of the heat exchange cavity 1 provided in an embodiment of the present application, and Figure 4 is a side view of the heat exchange cavity in Figure 3 provided in an embodiment of the present application.

[0060] In some embodiments of the heat dissipation component 4, the heat dissipation component 4 is installed as a whole in the middle position in the length direction of the heat exchange cavity 1, and the heat dissipation fins 41 extend along the length direction of the heat exchange cavity 1, thereby dividing the internal space of the heat exchange cavity 1 into three areas, namely the middle area where the heat dissipation component 4 is installed and the end areas at both ends in the length direction, and the two end areas are the water inlet area and the drainage area of ​​the coolant.

[0061] In some embodiments of the water inlet pipe 2 and the water outlet pipe 3, the water outlet of the water inlet pipe 2 and the water inlet of the water outlet pipe 3 are both connected to the top of the heat exchange chamber 1, and the water outlet of the water inlet pipe 2 and the water inlet of the water outlet pipe 3 are respectively located at the two ends of the length direction of the heat exchange chamber 1, that is, in the water inlet area and the water outlet area, respectively. With this arrangement, the coolant flows out of the water outlet of the water inlet pipe 2, falls into the water inlet area, then flows through the gaps between the heat dissipation fins 41 to the water outlet area, and finally is discharged through the water outlet pipe 3. This distribution structure of the water inlet pipe 2 and the water outlet pipe 3 reuses the traditional conventional cold plate structure, thus eliminating the need to change the piping structure on the mainboard. In addition, the water inlet pipe 2 and the water outlet pipe 3 are at the same height plane, making them easy to arrange and disassemble.

[0062] In another embodiment of the water inlet pipe 2 and the water outlet pipe 3, the water inlet pipe 2 and the water outlet pipe 3 are not located at the same height plane. Only the water outlet of the water inlet pipe 2 is connected to the top of the heat exchange chamber 1, while the water inlet of the water outlet pipe 3 is connected to the bottom of the side wall of the heat exchange chamber 1, thereby forming a high-low distribution structure of water inlet and outlet. Of course, the water outlet of the water inlet pipe 2 and the water inlet of the water outlet pipe 3 are still located at the two ends of the length direction of the heat exchange chamber 1. In this arrangement, since the top coolant absorbs slightly less heat than the bottom coolant, if the water inlet of the water outlet pipe 3 is connected to the top of the heat exchange cavity 1, the top coolant is more likely to flow out directly after absorbing the heat from the top of the heat dissipating fins 41. However, in this embodiment, after absorbing the heat from the top of the heat dissipating fins 41, the top coolant cannot flow out directly from the top, but needs to flow downward to the bottom of the heat exchange cavity 1 before it can flow out. Therefore, the fluidity of the top coolant is enhanced, so that the top coolant absorbs heat as fully as possible, maximizes the utilization of the coolant in the heat exchange cavity 1, and further reduces the waste of cooling capacity.

[0063] Taking into account that the heat dissipation fins 41 are evenly arranged along the width direction of the heat exchange cavity 1, in order to allow the coolant to enter the gap between any two adjacent heat dissipation fins 41 as evenly and synchronously as possible after entering the water inlet area, a water distribution pipe 8 is added in this embodiment. In some embodiments, the water distribution pipe 8 is arranged in the water inlet area of ​​the heat exchange cavity 1, and is connected to the water outlet of the water inlet pipe 2, and is distributed along the width direction of the heat exchange cavity 1, that is, distributed along the arrangement direction of the heat dissipation fins 41. At the same time, a plurality of water outlets are opened on the water distribution pipe 8 along its length direction. Generally, the water outlets are evenly distributed along the length direction of the water distribution pipe 8. With such an arrangement, when the coolant enters the water distribution pipe 8 through the water inlet pipe 2, it will fall from each water outlet into various positions in the water inlet area of ​​the heat exchange cavity 1 at the same time, ensuring that the coolant can enter the gap between each heat dissipation fin 41 evenly and synchronously.

[0064] Similarly, in order to ensure that the coolant can be discharged as evenly and synchronously as possible into the outlet pipe 3 after absorbing heat, a water collecting pipe 9 is further added in this embodiment. In some embodiments, the water collecting pipe 9 is arranged in the drainage area of ​​the heat exchange cavity 1, and is connected to the water inlet of the outlet pipe 3, and is distributed along the width direction of the heat exchange cavity 1, that is, along the arrangement direction of each heat dissipation fin 41. At the same time, a plurality of water inlets are provided on the water collecting pipe 9 along its length direction. Generally, each water inlet is evenly distributed along the length direction of the water collecting pipe 9. With such an arrangement, after the coolant absorbs heat and flows into the drainage area, it will simultaneously enter the outlet pipe 3 from the water inlets at various positions in the drainage area and be discharged, ensuring that the coolant can evenly and synchronously enter the gaps between each heat dissipation fin 41, thereby avoiding short-term accumulation of heat in the drainage area.

[0065] In some embodiments of the heat exchange cavity 1, considering that the heat conducting assembly 5 will transfer part of the heat from the heating element directly to the top of the heat sink fins 41, thereby facilitating absorption by the top coolant, to enhance the heat dissipation efficiency at the top of the heat sink fins 41, the top wall of the heat exchange cavity 1 in this embodiment is a vapor chamber 6, and the top of each heat sink fin 41 extends to connect with the vapor chamber 6. With this arrangement, the heat at the top of the heat sink fins 41 can not only be absorbed by the top coolant, but can also be transferred to the vapor chamber 6. The vapor chamber 6 can evenly distribute the heat across the surface, thereby enabling the vapor chamber 6 to naturally exchange heat with the outside air or to undergo convective heat exchange with the cold air flow within the server chassis, thereby improving the heat exchange efficiency to a certain extent.

[0066] Furthermore, considering that the height of the traditional conventional cold plate is relatively low and there is a significant height difference with the height of the air-cooled radiator (fan, etc.) installed in the server, the cold air flow in the air duct above the cold plate causes ineffective cooling waste. In response to this, in this embodiment, the height of the heat exchange cavity 1 is increased, generally 3 to 4 times the height of the conventional cold plate, until it is consistent with the height of the air duct formed by the cooling fan in the server. With this arrangement, the height of the heat exchange cavity 1 matches the height of a specific air duct in the server chassis. When the cold air flow of the corresponding air duct passes through the heat exchange cavity 1, it will be blocked and unable to continue to pass, thereby being diverted to both sides of the heat exchange cavity 1 and finally added to the remaining air ducts to supplement cooling capacity, thereby preventing the cold air flow in the air duct from being wasted. At the same time, in traditional cold plate liquid cooling technology, it is necessary to fill the cold plate with foam to block the air duct above the cold plate, or adjust the shape and structure of the air guide cover for air cooling to divert the air duct above the cold plate through the air guide cover. In this embodiment, the height of the heat exchange cavity 1 is increased to be consistent with the height of the air duct formed by the cooling fan. This not only increases the height of the heat dissipation fins 41, thereby increasing the area of ​​the heat dissipation fins 41 and the total heat exchange area, but also rationally utilizes the original space above the cold plate. There is no need to fill with foam, saving material costs. At the same time, there is no need to adjust the shape and structure of the air guide cover, and the relevant air guide cover can be directly reused in the server. In addition, when the pressure, flow rate and other parameters of the coolant remain unchanged, the increase in the height of the heat exchange cavity 1 leads to an increase in volume, thereby reducing the pressure in the heat exchange cavity 1, thereby reducing the risk of leakage.

[0067] Similarly, in this embodiment, the heat dissipation efficiency can be enhanced not only through the top wall of the heat exchange cavity 1, but also through the side walls of the heat exchange cavity 1. In some embodiments, the side walls on both sides of the heat exchange cavity 1 in the width direction are both heat-conducting medium walls, such as metal walls such as copper, and the first and last heat dissipation fins 41 in the heat dissipation component 4 (i.e., the heat dissipation fins 41 located on both sides of the width direction of the heat exchange cavity 1) are respectively in close contact with the inner walls on both sides of the width direction of the heat exchange cavity 1. At the same time, air-cooled heat sinks 7 are also provided on the outer wall surfaces of the side walls on both sides. With such an arrangement, the first and last heat dissipation fins 41 in the heat dissipation component 4 can simultaneously transfer heat to the side walls on both sides of the heat exchange cavity 1, and then transfer the heat to the air-cooled heat sink 7. The air-cooled heat sink 7 is in contact with the cold air flow from the outside to perform air cooling and heat dissipation, thereby further improving the heat dissipation efficiency of the heating element through combined air cooling and heat dissipation. Of course, the air-cooled heat sink 7 can also be set on the front face or top face of the heat exchange cavity 1, but when the height of the heat exchange cavity 1 has reached the limit position, the air-cooled heat sink 7 may not be set on the top face.

[0068] In some embodiments of the heat sink fins 41, considering that conventional heat sinks typically require a shaving or sawtooth process for manufacturing and assembly, due to process limitations, the thickness of conventional heat sinks needs to be maintained within a range of 1 to 2 mm to achieve a good thermal conductivity. However, the width of the heat exchange cavity 1 is relatively small, and a thickness of 1 to 2 mm is too large for the heat exchange cavity 1, resulting in the inability to arrange multiple heat sinks within the heat exchange cavity 1, limiting the total heat exchange area. To address this, in this embodiment, the bottom of each heat sink fin 41 is fixed to the bottom surface of the heat exchange cavity 1 through a welding process, and the thickness of each heat sink fin 41 is 0.2 to 0.3 mm, such as 0.2 mm, 0.25 mm, 0.3 mm, etc. With this arrangement, the welded connection between each heat sink fin 41 and the bottom surface of the heat exchange chamber 1 frees the thickness of the heat sink fins 41 from the limitations of skived or serrated processes, allowing them to be thinner. This reduces the spacing between adjacent heat sink fins 41, allowing more heat sink fins 41 to be arranged within the heat exchange chamber 1, increasing the total heat exchange area. Furthermore, due to the action of the heat conduction assembly 5, some of the heat from the heating element is directly transferred to the top of the heat sink fins 41, eliminating the need for gradual dissipation from the bottom to the top of the heat sink fins 41. Therefore, the thermal conductivity efficiency is largely unaffected.

[0069] In another embodiment of the heat dissipation fins 41, in order to further increase the total heat exchange area, this embodiment provides a protrusion structure or a groove structure on both sides of each heat dissipation fin 41, or provides both a protrusion structure and a groove structure. Generally, the protrusions and grooves are arc-shaped, thereby forming tiny bumps and pits on the sides of the heat dissipation fins 41. With such a configuration, the protrusions and grooves can effectively increase the surface area of ​​the sides of the heat dissipation fins 41, thereby increasing the contact area between the coolant and the heat dissipation fins 41 when flowing through the sides of the heat dissipation fins 41, thereby improving the heat dissipation efficiency to a certain extent; and the protrusions and grooves are arc-shaped, which can form a guide effect for the coolant, avoiding obstruction of the coolant and causing a decrease in flow rate and heat accumulation.

[0070] As shown in FIG6 , FIG6 is a schematic structural diagram of the heat conducting component 5 provided in an embodiment of the present application.

[0071] In some embodiments of the heat-conducting component 5, the heat-conducting component 5 mainly includes a bottom heat pipe 51, a column heat pipe 52 and a top heat pipe 53. It should be noted that the number of bottom heat pipes 51 and top heat pipes 53 is not limited in this application, and the number of bottom heat pipes 51 and top heat pipes 53 can be set according to the heat conduction requirements. Among them, the bottom heat pipe 51 is arranged at the bottom of the heat exchange cavity 1 and covers the bottom surface of the heat exchange cavity 1. Generally, multiple heat pipes are arranged at the same time, mainly for absorbing heat from the heating element. The column heat pipe 52 is erected on the surface of each bottom heat pipe 51 and extends in the vertical direction (the height direction of the heat exchange cavity 1) to a preset height position of the heat dissipation fin 41, such as extending to the top position or middle position of the heat dissipation fin 41, etc., mainly for realizing heat transfer in the vertical direction. The top heat pipe 53 is installed at the top of each column heat pipe 52 and passes through each heat sink fin 41 in sequence, connecting to each heat sink fin 41. It is mainly used to transfer heat from the column heat pipe 52 to each heat sink fin 41. With this arrangement, part of the heat of the heating element can be transferred to the bottom heat pipe 51 through the bottom surface of the heat exchange cavity 1, then transferred upward through the column heat pipe 52, and finally transferred to each heat sink fin 41 through the top heat pipe 53.

[0072] Furthermore, to facilitate manufacturing, the top heat pipe 53 extends through each heat sink fin 41 in a direction perpendicular to the heat sink fins 41. At the same time, multiple top heat pipes 53 can be installed on the same column heat pipe 52, for example, two top heat pipes 53, with one top heat pipe 53 connected to the top of the column heat pipe 52 and the other top heat pipe 53 connected to the middle of the column heat pipe 52. With this arrangement, heat can be simultaneously transferred to different heights of each heat sink fin 41 through multiple top heat pipes 53 at different heights, further improving heat dissipation uniformity.

[0073] Furthermore, considering that the top surface of the heating element is usually a uniform heat-dissipating surface, in order to improve the uniformity of heat absorption of the heating element by each bottom heat pipe 51, in this embodiment, each bottom heat pipe 51 extends along the arrangement direction of each heat dissipating fin 41 and is evenly distributed along the length direction of the heat dissipating fin 41. Generally, 3 to 5 bottom heat pipes 51 can be evenly laid on the bottom surface of the heat exchange cavity 1. With this arrangement, the coverage area of ​​each bottom heat pipe 51 on the bottom surface of the heating cavity is substantially equivalent to the top surface area of ​​the heating element, thereby simultaneously absorbing heat from various positions on the top surface of the heating element, further improving the uniformity of heat dissipation.

[0074] As shown in FIG5 , FIG5 is a schematic diagram of the connection structure between the heat dissipation fins 41 and the top heat pipe 53 provided in an embodiment of the present application.

[0075] In some embodiments of the heat sink fins 41 and the top heat pipe 53, in order to facilitate the top heat pipe 53 to pass through each heat sink fin 41 in sequence, this embodiment has a through hole on each heat sink fin 41. At the same time, because the top heat pipe 53 maintains a vertical relationship with the heat sink fin 41, the contact area of ​​the top heat pipe 53 between the heat sink fins 41 is actually only the area of ​​the inner wall of one circle of the through hole, and the contact area is relatively small. To address this, in this embodiment, an extension sleeve 42 is connected between the hole walls of the through holes of two adjacent heat sink fins 41, which is equivalent to the through holes of the two adjacent heat sink fins 41 being connected as a whole through the extension sleeve 42, and when the top heat pipe 53 passes through the through hole, the extension sleeve 42 will be sleeved on the top heat pipe 53. With such a configuration, after the through holes of two adjacent heat sink fins 41 are connected by extending the sleeve 42, the through hole is equivalent to being stretched into a tubular shape along the axial direction, and contacts the top heat pipe 53 through the tubular "through hole", which can greatly increase the heat exchange area between the top heat pipe 53 and the two adjacent heat sink fins 41, thereby improving the efficiency of the top heat pipe 53 in transferring heat to the heat sink fins 41.

[0076] Furthermore, considering that after a through hole is opened on each heat sink fin 41, the top heat pipe 53 is inserted into the through hole for connection and fixation to form a through-sheet process structure, and due to manufacturing errors and installation errors, a microscopic gap is easily formed between the outer edge of the top heat pipe 53 and the inner edge of the through hole of each heat sink fin 41, or between the outer tube wall of the top heat pipe 53 and the inner tube wall of the extension sleeve 42, resulting in the top heat pipe 53 being unable to form a seamless connection with the heat sink fin 41, thereby causing the heat conduction efficiency between the two to decrease. To address this, the present embodiment also fills the gap between the outer tube wall of the top heat pipe 53 and the inner tube wall of the extension sleeve 42 with a welded thermal conductive flux, such as solder. With such an arrangement, after the top heat pipe 53 is inserted into the through-holes of each heat dissipating fin 41, a thermal welding machine can be filled in the gap between the outer tube wall of the top heat pipe 53 and the inner tube wall of the extension sleeve 42, and then the top heat pipe 53 and the heat dissipating fin 41 are subjected to welding processes such as reflow soldering, thereby eliminating the gap between the outer edge of the top heat pipe 53 and the inner edge of the through-holes of each heat dissipating fin 41, thereby improving the heat conduction efficiency between the top heat pipe 53 and the heat dissipating fin 41.

[0077] Furthermore, considering that a server motherboard may utilize dual central processing units (CPUs) or multiple graphics processing units (GPUs), resulting in multiple, high-heat-generating heating elements on the motherboard, multiple cold plates are required to dissipate heat separately. To address this, in this embodiment, multiple heat exchange cavities 1 are provided on the motherboard, and the number of heat exchange cavities 1 provided is equal to the number of heating elements on the motherboard requiring cold plate heat dissipation, thereby achieving a one-to-one correspondence. In some embodiments, each heat exchange cavity 1 is configured to abut a different heating element to absorb heat from each heating element. Furthermore, each heat exchange cavity 1 is connected in series via a water inlet pipe 2 and a water outlet pipe 3. With this configuration, the coolant output from the cold distribution unit, after entering the first heat exchange cavity 1 to absorb heat, can continue to enter the second heat exchange cavity 1 to continue absorbing heat, and this cycle continues until saturated, before flowing back into the cold distribution unit for recooling and continued circulation. This ensures full utilization of the coolant and further reduces cold waste.

[0078] Of course, for some heating elements with huge heat generation, such as some graphics processor units, the water inlet pipe 2 and the water outlet pipe 3 can also be separately connected to the corresponding heat exchange cavity 1 to perform cold plate heat dissipation on the heating element separately through the cold capacity distribution unit.

[0079] In another embodiment provided in the present application, in order to improve the heat absorption efficiency of the heat exchange cavity 1 for the heating element, the air-liquid composite cold plate heat dissipation system includes, in addition to the heat exchange cavity 1, the water inlet pipe 2, the water outlet pipe 3, the heat dissipation component 4 and the heat conduction component 5, a heat conduction plate 10. In some embodiments, the heat conduction plate 10 is arranged on the bottom surface of the heat exchange cavity 1, and the bottom surface of the heat conduction plate 10 is a smooth plane, which is mainly used to replace the heat exchange cavity 1 to be pressed against the top surface of the heating element and absorb the heat of the heating element. Generally, the materials of the components such as the heat conduction plate 10, the heat exchange cavity 1, the heat dissipation component 4, and the heat conduction component 5 are all made of materials with high thermal conductivity such as copper to improve the thermal conductivity efficiency.

[0080] As shown in FIG. 7 , FIG. 7 is a schematic structural diagram of the heat conducting plate 10 provided in an embodiment of the present application.

[0081] Furthermore, considering that different models of heating elements have different sizes and areas, such as different types of central processing units (CPUs) with different lengths and widths, and the size of a CPU unit and a graphics processing unit (GPU) is also generally different, to ensure that the heat conducting plate 10 can stably cover the top surface of heating elements of different sizes and areas, in this embodiment, the heat conducting plate 10 is detachably connected to the heat exchange cavity 1, so that a heat conducting plate 10 that matches the size and area of ​​the current heating element can be replaced on the heat exchange cavity 1, thereby achieving the versatility of the heat conducting plate 10. In some embodiments, this embodiment provides a snap-in groove 101 on the top surface of each different model of heat conducting plate 10, and the opening position of the snap-in groove 101 on each model of heat conducting plate 10 remains fixed. In this arrangement, no matter which model of heat conducting plate 10 is selected, it can always be connected to the heat exchange cavity 1 through the snap-in groove 101. Generally, multiple snap-in grooves 101 can be provided on the heat conducting plate 10 at the same time, such as 4 to 8, and are located at both sides, ends, and angles of the heat conducting plate 10.

[0082] As shown in FIG8 , FIG8 is a schematic diagram of the partial structure of the heat exchange cavity 1 provided in an embodiment of the present application.

[0083] To facilitate the removal and replacement operation between the heat exchange chamber 1 and the heat conduction plate 10, in this embodiment, a guide groove 11, a guide slider 12, a clamping member 13, and an insertion and removal operation block 14 are provided on the heat exchange chamber 1. The guide groove 11 is provided on the bottom surface of the heat exchange chamber 1 and extends in the vertical direction, that is, along the height direction of the heat exchange chamber 1. The guide slider 12 is installed in the guide groove 11 and can slide along the guide groove 11, that is, perform vertical lifting and lowering movement. The clamping member 13 is provided at the bottom of the guide slider 12 and is mainly used to form a clamping connection with the clamping groove 101 on the heat conduction plate 10, such as a clamping column, a clamping block, etc. However, it is difficult to stably clamp the clamping member 13 into the clamping groove 101 by relying solely on the gravity of the guide slider 12 and the clamping member 13. Therefore, a plugging and removal operation block 14 is also provided on the side wall of the guide slider 12. The plug-in and pull-out operation block 14 is mainly used for the staff to operate and apply force to press down and pull up the plug-in and pull-out operation block 14, thereby applying a corresponding vertical force to the guide slider 12, so that when pressed down, the clamping member 13 is inserted into the clamping groove 101 to form a stable clamping; or the clamping member 13 is pulled out from the clamping groove 101 to achieve disengagement and disassembly.

[0084] Furthermore, to enhance the stability of the snap connection between the snap member 13 and the snap slot 101, in this embodiment, the snap member 13 and the snap slot 101 are magnetic, so that when snapped together, they also achieve magnetic attraction, thereby enhancing the connection stability and preventing loosening. Similarly, the top of the guide slider 12 and the top of the guide slot 11 can also be magnetic, so that the top of the guide slider 12 can be fixed to the top of the guide slot 11 through magnetic attraction, preventing the guide slider 12 from accidentally falling.

[0085] As shown in Figure 9, this embodiment also provides a mainboard, which mainly includes a board body, a heating element arranged on the surface of the board body, and a heat dissipation system for dissipating heat from the heating element. Since the heat dissipation system adopts all the technical solutions of the above-mentioned air-liquid composite structure cold plate heat dissipation system embodiment, the mainboard provided by this embodiment also has all the technical effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0086] As shown in Figure 10, this embodiment also provides a server, which mainly includes a chassis, a motherboard installed in the chassis, and cooling fans arranged at both ends of the chassis. Since the motherboard adopts all the technical solutions of the above-mentioned motherboard embodiments, the server provided by this embodiment also has all the technical effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0087] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cold plate heat dissipation system with an air-liquid composite structure, comprising a heat exchange cavity (1), a water inlet pipe (2) and a water outlet pipe (3) connected to the heat exchange cavity (1), the interior of the heat exchange cavity (1) being used to contain cooling liquid, and the bottom surface of the heat exchange cavity (1) being used to abut against a heating element, characterized in that: The air-liquid composite cold plate heat dissipation system further comprises a heat dissipation component (4) and a heat conduction component (5) installed in the heat exchange cavity (1); The heat dissipation component (4) comprises at least one heat dissipation fin (41), the bottom of the heat dissipation fin (41) is connected to the bottom surface of the heat exchange cavity (1) and extends along the height direction of the heat exchange cavity (1), and the water outlet of the water inlet pipeline (2) and the water inlet of the water outlet pipeline (3) are respectively located at two ends of the length direction of the heat dissipation fin (41); and The bottom of the heat-conducting component (5) is connected to the bottom surface of the heat exchange cavity (1), and the top of the heat-conducting component (5) is connected to the top of the heat dissipation fin (41), so as to transfer part of the heat absorbed by the heat exchange cavity (1) to the top of the heat dissipation fin (41).

2. The cold plate heat dissipation system of the air-liquid composite structure according to claim 1 is characterized in that: The water outlet of the water inlet pipeline (2) and the water inlet of the water outlet pipeline (3) are both connected to the top of the heat exchange cavity (1) and are respectively located at two ends of the length direction of the heat exchange cavity (1).

3. The cold plate heat dissipation system of the air-liquid composite structure according to claim 1 is characterized in that: The water outlet of the water inlet pipeline (2) is in communication with the top of the heat exchange cavity (1), the water inlet of the water outlet pipeline (3) is in communication with the bottom of the side wall of the heat exchange cavity (1), and the water outlet of the water inlet pipeline (2) and the water inlet of the water outlet pipeline (3) are respectively located at two ends of the length direction of the heat exchange cavity (1).

4. The cold plate heat dissipation system of the air-liquid composite structure according to claim 1 is characterized in that: The top wall of the heat exchange cavity (1) is a heat sink (6). The top of the heat dissipation fin (41) extends to connect with the heat spreader (6), and The heat spreader (6) is used to naturally exchange part of the heat of the heat dissipation fins (41) with the outside air.

5. The air-liquid composite cold plate heat dissipation system according to claim 4 is applied to a server, wherein the server includes a heat dissipation fan, and is characterized in that: The height of the heat exchange cavity (1) is equal to the height of the air duct formed by the cooling fan in the server.

6. The cold plate heat dissipation system of the air-liquid composite structure according to claim 5 is characterized in that: The heat dissipation component (4) comprises two heat dissipation fins (41) at the front and rear ends, the side walls on both sides of the width direction of the heat exchange cavity (1) are both heat-conducting medium walls, the two heat dissipation fins (41) at the front and rear ends are respectively tightly attached to the inner walls on both sides of the width direction of the heat exchange cavity (1), and air-cooled heat dissipation fins (7) are provided on the outer walls on both sides of the width direction of the heat exchange cavity (1).

7. The cold plate heat dissipation system of the air-liquid composite structure according to claim 1 is characterized in that: The bottom of the heat dissipation fin (41) is welded to the bottom surface of the heat exchange cavity (1), and the thickness of the heat dissipation fin (41) is 0.2 to 0.3 mm.

8. The cold plate heat dissipation system of the air-liquid composite structure according to claim 7, characterized in that: Both side surfaces of the heat dissipation fin (41) are provided with protrusions and / or grooves to increase the surface area.

9. The cold plate heat dissipation system of the air-liquid composite structure according to claim 1, characterized in that: The heat dissipation component (4) comprises a plurality of heat dissipation fins (41), and the heat conduction component (5) comprises a bottom heat pipe (51) covering the bottom surface of the heat exchange cavity (1), a column heat pipe (52) vertically arranged on the surface of the bottom heat pipe (51), and a top heat pipe (53) arranged at the top end of the column heat pipe (52); The column heat pipe (52) extends vertically to a preset height position of the heat dissipation fin (41); and The top heat pipe (53) passes through the plurality of heat dissipation fins (41) in sequence.

10. The cold plate heat dissipation system of the air-liquid composite structure according to claim 9, characterized in that: The top heat pipe (53) vertically penetrates the heat dissipation fin (41), and the top heat pipe (53) penetrates the top and / or middle of the heat dissipation fin (41).

11. The cold plate heat dissipation system of the air-liquid composite structure according to claim 10, characterized in that: The heat dissipation assembly (4) comprises a plurality of heat dissipation fins (41), and the bottom heat pipe (51) extends along the arrangement direction of the plurality of heat dissipation fins (41) and is evenly distributed along the length direction of the plurality of heat dissipation fins (41).

12. The cold plate heat dissipation system of the air-liquid composite structure according to claim 9, characterized in that: The heat dissipation assembly (4) comprises a plurality of heat dissipation fins (41), each heat dissipation fin (41) is provided with a through hole for the top heat pipe (53) to pass through, an extension sleeve (42) is connected between the hole walls of the through holes of two adjacent heat dissipation fins (41), and the extension sleeve (42) is used to be sleeved on the top heat pipe (53).

13. The cold plate heat dissipation system of the air-liquid composite structure according to claim 12, characterized in that: The gap between the outer tube wall of the top heat pipe (53) and the inner tube wall of the extension sleeve (42) is filled with a heat-conducting flux formed by welding.

14. The cold plate heat dissipation system of the air-liquid composite structure according to claim 1, characterized in that: The heat dissipation component (4) comprises a plurality of heat dissipation fins (41), and the air-liquid composite cold plate heat dissipation system further comprises a water distribution pipe (8) connected to the water outlet of the water inlet pipeline (2), the water distribution pipe (8) extending along the arrangement direction of the plurality of heat dissipation fins (41), and the water distribution pipe (8) is provided with a plurality of evenly distributed water outlets.

15. The cold plate heat dissipation system of the air-liquid composite structure according to claim 14, characterized in that: The heat dissipation component (4) comprises a plurality of heat dissipation fins (41), and the air-liquid composite cold plate heat dissipation system further comprises a water collecting pipe (9) connected to the water inlet of the water outlet pipeline (3), the water collecting pipe (9) extending along the arrangement direction of the plurality of heat dissipation fins (41), and the water collecting pipe (9) is provided with a plurality of evenly distributed water inlets.

16. The cold plate heat dissipation system of the air-liquid composite structure according to claim 1, characterized in that: A plurality of the heat exchange cavities (1) are provided, each heat exchange cavity (1) is used to abut against a different heating element, and each heat exchange cavity (1) is connected in series via the water inlet pipeline (2) and the water outlet pipeline (3).

17. The cold plate heat dissipation system of the air-liquid composite structure according to any one of claims 1 to 16, characterized in that: It also comprises a heat conducting plate (10) arranged on the bottom surface of the heat exchange cavity (1); the bottom surface of the heat conducting plate (10) is a smooth plane and is used to press the top surface of the heating element and absorb its heat.

18. The cold plate heat dissipation system of the air-liquid composite structure according to claim 17, characterized in that: The heat-conducting plate (10) is detachably connected to the heat-exchange cavity (1), so that a heat-conducting plate (10) matching the size of the heating element can be replaced on the heat-exchange cavity (1).

19. The cold plate heat dissipation system of the air-liquid composite structure according to claim 18, characterized in that: The top surface of the heat conducting plate (10) is provided with a clamping groove (101) at a fixed position; The bottom surface of the heat exchange cavity (1) is provided with a guide groove (11) extending vertically. A guide sliding block (12) is arranged in the guide sliding groove (11). A clamping piece (13) is provided at the bottom of the guide slide block (12). A plugging and unplugging operation block (14) is provided on the side wall of the guide slide block (12). The clamping member (13) is used to form a clamping connection with the clamping slot (101); and The plugging and unplugging operation block (14) is used to apply a vertical force to the guide slide block (12) so as to insert the clamping member (13) into the clamping slot (101) or to pull the clamping member (13) out of the clamping slot (101).

20. The cold plate heat dissipation system of the air-liquid composite structure according to claim 19, characterized in that: The top end of the guide slider (12) forms a magnetic connection with the top end of the guide slot (11), and / or The clamping piece (13) and the clamping slot (101) form a magnetic connection.

21. A mainboard, comprising a board body, a heating element arranged on the surface of the board body, and a heat dissipation system for dissipating heat from the heating element, characterized in that: The heat dissipation system is an air-liquid composite cold plate heat dissipation system as described in any one of claims 1-20.

22. A server, comprising a chassis, a motherboard installed in the chassis, and cooling fans arranged at two ends of the chassis, characterized in that: The main board is the main board described in claim 21.

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