Fan module and electronic device

Abstract

Provided in the embodiments of the present application are a fan module and an electronic device, which are used for ameliorating the problem in the related art of an electronic device having an excessive thickness. The electronic device comprises a housing, a fan shell and a fan body. The housing comprises a first structural member and a second structural member, the second structural member surrounding the edge of the first structural member. The fan shell is fitted over outside of the fan body; a first part of the fan shell and the first structural member jointly form a flat plate structure, and the flat plate structure and the second structural member jointly enclose a mounting space, the fan body being located in the mounting space. The first part of the fan shell comprises a first surface, and the first structural member comprises a second surface; the first surface and the second surface are both located on the side of an appearance flat plate away from the mounting space, and the second surface and the first surface are located in the same plane, thus helping reduce the assembly distance between the fan shell and the first structural member, and thereby reducing the thickness of the electronic device.

Description

Fan modules and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on December 8, 2023, with application number 202311692885.1 and application name “Fan module and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the technical field of electronic products, and in particular to a fan module and an electronic device. Background Art

[0003] With the advancement of technology, electronic devices are now developing towards multi-functionality, high speed, and small size. The integration of some chips in electronic devices, such as system-on-chips (SoCs), is becoming increasingly higher, and the amount of computation required in the data processing process is also increasing. This results in a significant increase in the operating heat generated per unit area by the processor, making it a high-heat-generating component. The operating heat of this high-heat-generating component can affect the performance and lifespan of the processor and other components in the electronic device.

[0004] Currently, the main heat dissipation technology used in electronic devices is an air-cooled heat dissipation device that combines a heat dissipation component and a fan. This can improve the heat dissipation capacity of the entire device. However, electronic devices using air-cooled heat dissipation devices are relatively thick, which is not conducive to achieving lightweight and thin electronic devices.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a fan module and an electronic device, which are used to improve the problem in the related art that the electronic device is relatively thick, which is not conducive to achieving a thinner and lighter electronic device.

[0007] To achieve the above objectives, the present invention provides the following solutions:

[0008] On the one hand, a fan module is provided, comprising a shell, a fan casing and a fan body. The shell comprises a first structural member and a second structural member, and the second structural member is arranged around the edge of the first structural member. The fan casing is arranged on the outside of the fan body, and the fan casing comprises a first part and a second part, and the first part and the first structural member together constitute a flat plate structure, and the flat plate structure and the second structural member together enclose an installation space, and the fan body and the second part are located in the installation space. Here, the "flat plate structure" can serve as the host appearance panel of the electronic device, or as part of the host middle frame. Here, "the first part can constitute a flat plate structure together with the first structural member" can be understood as that the first part and the first structural member are integrally formed, and the integrally formed structure is a flat plate structure, or the first part is connected to the first structural member so that the first part and the first structural member connected together constitute a flat plate structure, wherein there can be a certain assembly gap or assembly step difference between the first part and the first structural member.

[0009] The first portion includes a first surface, and the first structural member includes a second surface. The first surface and the second surface are both located on the side of the external surface facing away from the installation space, and the second surface and the first surface are located in the same plane. Here, "plane" can be understood as having an absolutely flat surface or a nearly flat surface, wherein the nearly flat surface may have slight undulations, and the acceptable deviation range of the nearly flat surface may be, for example, a deviation of less than 5%. Through the above arrangement, the first portion and the first structural member form a flat structure, which is conducive to reducing the assembly spacing between the fan housing and the first structural member, as well as the space occupied by the fan housing within the installation space, thereby helping to reduce the thickness of the electronic device and facilitate the realization of a lightweight and thin electronic device.

[0010] In some implementations, the fan body includes a shaft seat, fan blades, and a stator assembly, wherein the shaft seat is connected to the first portion, the stator assembly is connected to the shaft seat, and the fan blades are rotatably connected to the shaft seat, and the fan blades include magnetic elements. The fan housing also includes a communication hole, and the electronic device also includes a circuit board, which is located within the installation space, extends into the fan housing through the communication hole, and is electrically connected to the stator assembly. Through this arrangement, the mainboard can control the circuit board to supply power to the stator coil, and when the stator coil is energized, a rotating electromagnetic field is generated.

[0011] In some implementations, the first portion has a raised structure on a side proximal to the mounting space. The raised structure also has a first sub-surface on the side proximal to the mounting space. The first sub-surface is disposed opposite the first surface, and the first sub-surface is recessed on the side proximal to the first surface to form a mounting groove, within which the shaft seat is mounted. This arrangement allows the fan body to be mounted on the first portion via the raised structure, and by partially increasing the thickness of the first portion, the connection strength of the fan body is improved.

[0012] In some implementations, the first sub-surface is parallel to the first surface and perpendicular to the rotation axis of the fan blade. This arrangement prevents the fan blade from interfering with the first sub-surface during rotation, thereby improving the phenomenon of the fan blade being scratched.

[0013] In some implementations, the first portion further includes a second sub-surface adjacent to the raised structure, the second sub-surface being disposed opposite the first surface, parallel to the first surface, and perpendicular to the rotation axis of the fan blade. This arrangement prevents interference between the fan blade and the first sub-surface during rotation, thereby reducing the risk of blade scratches. Furthermore, this arrangement helps to maintain the volume of the installation space enclosed by the first portion, the first structural member, and the second structural member, thereby increasing the installation space.

[0014] In some implementations, the first structural member has a third sub-surface on a side adjacent to the installation space. The third sub-surface is disposed opposite the second surface, and at least a portion of the third sub-surface and at least a portion of the second sub-surface are coplanar. This arrangement improves the regularity of the first structural member, further ensuring the volume of the installation space enclosed by the first portion, the first structural member, and the second structural member, thereby increasing the installation space.

[0015] In some implementations, the circuit board includes a first plate portion, a second plate portion, and a bend portion. The first plate portion is connected to the first sub-surface, the second plate portion is connected to the second sub-surface, and is disposed within the communication hole. The bend portion is connected between the first plate portion and the second plate portion. This arrangement allows the circuit board to be mounted on the first portion and reduces the space occupied by the circuit board within the installation space. Furthermore, the second plate portion can be disposed within the communication hole, allowing it to extend outside the fan housing through the communication hole and electrically connect to the mainboard of the electronic device.

[0016] In some implementations, the first portion and the first structural member are an integral structure. Providing the first portion and the first structural member with an integral structure is beneficial for improving the connection strength between the first portion and the first structural member bracket.

[0017] In some implementations, the second portion includes a frame and a cover plate, with the frame positioned between the first portion and the cover plate, surrounding the edges of the first portion and the cover plate, and forming an integral structure with the frame and cover plate. This integral structure of the frame and cover plate improves the connection strength between the frame and cover plate, thereby increasing the overall structural strength of the second portion. Furthermore, the integral structure of the frame and cover plate improves the sealing between the frame and cover plate, facilitating the formation of a sealed air outlet channel between the second portion and a portion of the first portion, preventing air backflow and improving the heat dissipation capacity of the fan assembly.

[0018] In some implementations, the frame is removably connected to a side of the first structural member proximate to the mounting space; the fan module further includes a sealing structure positioned between the first portion and the frame. This arrangement facilitates forming a sealed air outlet passage between the second portion and a portion of the first portion, preventing air backflow and improving the heat dissipation capability of the fan assembly.

[0019] In some implementations, the first portion further comprises a recessed structure on a side adjacent to the mounting space. The recessed structure and the frame together define a communication hole. A portion of the sealing structure is located within the communication hole, and the circuit board is located between the sealing structure and the recessed structure. This arrangement improves the sealing effect between the circuit board and the frame. Furthermore, compared to placing the circuit board between the sealing structure and the frame, placing the circuit board between the sealing structure and the recessed structure helps prevent damage to the circuit board from the frame.

[0020] In some implementations, the first structural member has a mounting opening extending therethrough, with at least a portion of the first portion located within the mounting opening. This arrangement allows the first structural member and the first portion to form a common flat plate structure, thereby reducing the assembly spacing between the fan housing and the first structural member, as well as the thickness of a portion of the first structural member, thereby further reducing the thickness of the electronic device and facilitating a thinner and lighter electronic device.

[0021] In some implementations, the first structural member includes a base plate and a bridging block. The base plate has a mounting opening extending therethrough. The base plate has a second surface on a side facing away from the mounting space. The base plate further has a side surface adjacent to the second surface, the side surface enclosing the mounting opening. The bridging block is connected to a side of the base plate proximate to the mounting space. The bridging block extends beyond the side surface in a direction parallel to the second surface and directed from the side surface toward the rotational axis of the fan blade. The surface where the bridging block and the side surface meet constitutes a bridging surface, and the bridging surface contacts a side of the first portion proximate to the mounting space.

[0022] In some implementations, a portion of the base plate and a portion of the first portion together constitute a welding block, and the welding block has a third surface on a side facing away from the installation space, with at least a portion of the third surface, at least a portion of the first surface, and at least a portion of the second surface lying in the same plane. Through this arrangement, the overlapping block can limit the first portion, preventing it from moving toward the installation space. Furthermore, because the overlapping block is connected to the side of the base plate near the installation space, when the fan housing is installed, the fan housing can be extended from the outside of the housing into the installation space, with the first portion contacting the overlapping surface, thereby facilitating secure installation of the fan housing.

[0023] In some implementations, the second portion includes a frame and a cover plate, with the frame positioned between the first portion and the cover plate. The frame surrounds the edge of the cover plate and has a predetermined distance from the side surface in a direction parallel to the second surface and directed from the side surface toward the rotation axis of the fan blade. This arrangement helps ensure a sufficient distance between the welding position and the frame, prevents high temperatures from affecting the frame during welding, and improves the structural reliability of the frame.

[0024] In some implementations, the fan module may further include a decorative layer located on the side of the base plate and first portion facing away from the mounting space. The decorative layer enhances the aesthetics of the electronic device. In embodiments where a portion of the base plate and a portion of the first portion together form a soldering pad, the decorative layer also covers the soldering pad to prevent exposure, further enhancing the aesthetics of the electronic device.

[0025] On the one hand, an electronic device is provided, comprising a mainboard and a fan module according to any of the above embodiments, wherein the mainboard is connected to a fan body of the fan module. The electronic device provided in the embodiment of the present application includes the fan module as described above, and thus has all the above-mentioned beneficial effects, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a cross-sectional view of an electronic device in some embodiments;

[0027] FIG2 is a structural diagram of a fan module in some embodiments;

[0028] FIG3 is a cross-sectional view of an electronic device provided in an embodiment of the present application;

[0029] FIG4 is a cross-sectional view of a fan module provided in an embodiment of the present application;

[0030] FIG5 is a cross-sectional view of a flat panel structure in the electronic device in FIG4 ;

[0031] FIG6 is a partial enlarged view of point A in the electronic device in FIG4 ;

[0032] FIG7 is a cross-sectional view of another electronic device provided in an embodiment of the present application;

[0033] FIG8 is a cross-sectional view of another fan module provided in an embodiment of the present application;

[0034] FIG9 is a cross-sectional view of a first structural member in the electronic device in FIG8 ;

[0035] FIG10 is a cross-sectional view of a first portion of the electronic device in FIG8 ;

[0036] FIG11 is a cross-sectional view of a first structural member provided in an embodiment of the present application before welding;

[0037] FIG12 is a cross-sectional view of a first portion after being overlapped with a first structural member according to an embodiment of the present application;

[0038] FIG13 is a cross-sectional view of a first portion and a first structural member after welding according to an embodiment of the present application;

[0039] FIG14 is a cross-sectional view of a first portion and a first structural member after grinding according to an embodiment of the present application;

[0040] FIG15 is a cross-sectional view of a first portion and a first structural member provided in an embodiment of the present application after a decorative layer is sprayed on the surface. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0042] In the following, the terms "first," "second," etc., are used for descriptive convenience only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0043] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0044] In the embodiments of the present application, directional indications such as up, down, left, right, front, and back, used to explain the structure and movement of various components of the present application are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0045] Here, "parallel" and "perpendicular" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximately parallelism, wherein the acceptable deviation range of approximately parallelism can be, for example, a deviation within 5%; similarly, "perpendicular" includes absolute perpendicularity and approximately perpendicularity, wherein the acceptable deviation range of approximately perpendicularity can be, for example, a deviation within 5%.

[0046] The present application provides an electronic device. The electronic device may be a mobile phone, a tablet computer, a television, a smart wearable device (e.g., a smartwatch, a smart bracelet), an in-vehicle computer, or other terminal product. The present application does not impose any particular restrictions on the specific form of the electronic device.

[0047] In some embodiments, the electronic device may be a 2-in-1 computer, that is, the electronic device may be used as both an ordinary tablet computer and a laptop computer, thereby meeting different usage requirements. FIG1 is a cross-sectional view of an electronic device 1' in some embodiments. As shown in FIG1 , the electronic device 1' may include a housing 11, and the housing 11 may include, for example, a first structural member 111 and a second structural member 112, and the second structural member 112 may be arranged around the edge of the first structural member 111. For example, the first structural member 111 may be a roughly rectangular flat plate, and the second structural member 112 may be a flat plate structure arranged along the edge of the rectangular flat plate, and the first structural member 111 and the second structural member 112 may be arranged to form a box structure.

[0048] In some embodiments of the present application, the first structural member 111 and the second structural member 112 may be an integral structure and together constitute the housing of the electronic device 1'. For example, the material of the first structural member 111 and the second structural member 112 may include metal, such as magnesium alloy, stainless steel, etc., and the first structural member 111 and the second structural member 112 may be formed integrally through a stamping process. In addition, the material of the first structural member 111 and the second structural member 112 may also include plastic, glass, ceramic, etc., and the embodiments of the present application do not specifically limit the materials of the first structural member 111 and the second structural member 112.

[0049] In some embodiments, the electronic device 1' may further include a display module 20 mounted on the second structural member 112. The display module 20 is configured to display images. The display module 20 has a display surface for displaying images and a back surface facing away from the display panel. The back surface of the display module 20 may face the first structural member 111.

[0050] In some embodiments of the present application, the display module 20 may be a liquid crystal display module. In this case, the display module 20 includes a liquid crystal display (LCD) and a backlight unit (BLU) located on the back of the LCD (away from the side surface b1 of the LCD used to display the image). The BLU can provide a light source to the LCD so that each sub-pixel in the LCD can emit light to display an image. Alternatively, in other embodiments of the present application, the display module 20 may be an organic light emitting diode (OLED) display. Since an electroluminescent layer is provided in each sub-pixel in the OLED display, the OLED display can be self-luminous after receiving an operating voltage. In this case, the above-mentioned BLU does not need to be provided in the display module 20 having the OLED display.

[0051] Based on the above structure, the first structural member 111, the second structural member 112 and the display module 20 can enclose an installation space 101 for accommodating electronic components, which may include sensors, cameras, microphones, batteries, etc. Of course, the electronic components in the electronic device 1' are not limited to the above examples.

[0052] In some embodiments, the electronic device 1' may further include a mainboard 80 installed in the installation space 101 and a heating element 81 installed on the mainboard 80. The heating element 81 may be a system on chip (SOC), a central processing unit (CPU) or a graphics processing unit (GPU). Among them, the mainboard 80 may be a printed circuit board (PCB). Other components, such as capacitors, etc., may also be installed on the mainboard 80, which is not limited in the embodiment of the present application. The above-mentioned mainboard 80 is electrically connected to the driving circuit on the display module 20, so that the display module 20 can be controlled by the processor on the PCB to display an image.

[0053] On this basis, in order to ensure the heat dissipation efficiency of the heating element 81 , the heat dissipation technology adopted by the electronic device 1 ′ is mainly an air-cooling heat dissipation device combining a heat dissipation component and a fan module 30 ′.

[0054] In some embodiments, a heat dissipation assembly can be provided on one side of the heating element 81. The heat dissipation assembly can include a metal heat conducting plate 82 and a heat dissipation device 83. The metal heat conducting plate 82 can be located between the heating element 81 and the heat dissipation device 83. The heat dissipation device 83 can be, for example, a Vapor Chamber (VC) heat sink. Through the above arrangement, the heat dissipation device 83 can efficiently conduct the heat of the heating element 81 to the installation space 101, thereby preventing the temperature of the heating element 81 from being too high.

[0055] In some embodiments, as shown in FIG1 , the electronic device 1 ' may further include a fan module 30 '. FIG2 is a structural diagram of the fan module 30 ' in some embodiments. As shown in FIG2 , the fan module 30 ' may include a fan housing 32 and a fan body 31. The fan housing 32 may be arranged on the outside of the fan body 31 so that the fan housing 32 can protect the fan body 31. The fan housing 32 has an air inlet opening M and an air outlet opening N. The air inlet opening M may be connected to the installation space 101, and the air outlet opening N may be connected to the external environment. Through the above arrangement, the air flow carrying heat can be carried into the fan housing 32 through the air inlet opening M of the fan housing 32, and discharged into the external space through the air outlet opening N, thereby conducting the heat from the heat dissipation component to the outside of the electronic device 1 '.

[0056] In some embodiments, the fan module 30' can be installed in the installation space 101. For example, the air inlet of the fan housing 32 can be located on a side thereof close to the display module 20, so that a certain distance exists between the fan module 30' and the display module 20 (also referred to as d2 in FIG. 1 ). Based on the above structure, the fan housing 32 can be connected to the first structural member 111 using threaded fasteners such as bolts, so that a certain assembly distance exists between the fan housing 32 and the first structural member 111 (also referred to as d4 in FIG. 1 ).

[0057] In order to ensure the heat dissipation efficiency in the electronic device 1', it is usually necessary to ensure the thickness of the fan module 30' provided in the electronic device 1' (that is, d3 in Figure 1). At the same time, it is also necessary to ensure the distance between the display module 20 and the fan module 30' (that is, d2 in Figure 1). The thickness of the electronic device 1' can include the thickness of the display module 20 (that is, d1 in Figure 1), the distance between the display module 20 and the fan module 30' (that is, d2 in Figure 1), the thickness of the fan module 30' (that is, d3 in Figure 1), the distance between the fan module 30' and the first structural member 111 (that is, d4 in Figure 1), and the thickness of the first structural member 111 (that is, d5 in Figure 1). However, in the above-mentioned installation method of the fan module 30', the thickness of the electronic device 1' is relatively large, which makes it difficult to ensure that the electronic device 1' is light and thin. Here, "thickness" can be understood as the dimension in the direction perpendicular to the display surface of the display module 20.

[0058] FIG3 is a structural diagram of an electronic device 1 provided in an embodiment of the present application. FIG4 is a cross-sectional view of a fan module 30 provided in an embodiment of the present application. Referring to FIG3 and FIG4 , in view of this, in the electronic device 1 provided in an embodiment of the present application, the fan housing 32 may include a first portion 321 and a second portion 322. The first portion 321 is connected to the first structural member 111, and the first portion 321 and the first structural member 111 together form a flat plate structure 13. Here, the "flat plate structure 13" may serve as the main body panel of the electronic device 1 or as part of the main body midframe. Here, "the first portion 321 and the first structural member 111 together form the flat plate structure 13" may be understood to mean that the first portion 321 and the first structural member 111 are integrally formed, and this integrally formed structure constitutes the flat plate structure 13, or that the first portion 321 is connected to the first structural member 111 so that the connected first portion 321 and the first structural member 111 together form the flat plate structure 13, wherein a certain assembly gap or assembly step may be provided between the first portion 321 and the first structural member 111. Exemplarily, the first portion 321 may be substantially flat, and the first structural member 111 may also be substantially flat. The two flat plates are connected together so that the first portion 321 and at least part of the first structural member 111 together constitute the flat structure 13 .

[0059] Continuing with Figure 3 , the flat plate structure 13 and the second structural member 112 can jointly enclose an installation space 101. The fan body 31 can be located within the installation space 101, and the second portion 322 can be located within the installation space 101. For example, the flat plate structure 13 and the second structural member 112 jointly enclose a groove, and the space within the groove is the installation space 101. In embodiments where the electronic device 1 further includes a display module 20, the display module 20 can block the groove, meaning that the display module 20, the flat plate structure 13, and the second structural member 112 jointly enclose the installation space 101.

[0060] Referring to Figure 4 , the first portion 321 includes a first surface a1, and the first structural member 111 includes a second surface a2. The first surface a1 and the second surface a2 are located on the side of the flat structure 13 facing away from the installation space 101, and the second surface a2 and the first surface a1 are located in the same plane. Here, "the second surface a2 and the first surface a1 are located in the same plane" can be understood to mean that a portion of the second surface a2 can be located in the same plane as the first surface a1; or a portion of the second surface a2 and a portion of the first surface a1 are located in the same plane; or the second surface a2 and a portion of the first surface a1 are located in the same plane. Here, "flat" can be understood to mean an absolutely flat surface or a nearly flat surface. A nearly flat surface may have slight undulations, and the acceptable deviation range for nearly flatness can be, for example, a deviation of less than 5%. Through the above-mentioned setting, the first part 321 and the first structural member 111 form a flat structure 13, which is conducive to reducing the assembly distance between the fan housing 32 and the first structural member 111 (that is, d4 in Figure 1), and the space occupied by the fan housing 32 in the installation space 101, thereby helping to reduce the thickness of the electronic device 1 and facilitate the realization of the lightweight and thin electronic device 1.

[0061] In the embodiment of the present application, as shown in conjunction with FIG. 2 and FIG. 4 , the second portion 322 may include a frame 3221 and a cover plate 3223, wherein the frame 3221 may be located between the first portion 321 and the cover plate 3223, and the frame 3221 is disposed around the edge of the cover plate 3223. Exemplarily, the frame 3221 may be disposed around the edge of the first portion 321, so that the first portion 321, the frame 3221, and the cover plate 3223 enclose an accommodating space 103, and the fan body 31 is located within the accommodating space 103.

[0062] As shown in Figures 2 and 4 , the second portion 322 is sealedly connected to a portion of the first portion 321. The second portion 322 has an air inlet opening M. The second portion 322 and the first portion 321 enclose an air outlet opening N. For example, the first portion 321 and the cover plate 3223 may be substantially circular flat plates, and the first portion 321 and the cover plate 3223 may be disposed opposite each other. The frame 3221 may be disposed along portions of the edges of the first portion 321 and the cover plate 3223. In other words, the frame 3221, the first portion 321, and the cover plate 3223 may collectively enclose an opening, which is the air outlet opening N. The cover plate 3223 may also have an air inlet opening M. Through the above-mentioned arrangement, the gas in the installation space 101 can enter the accommodating space 103 through the air inlet opening M and be blown to the external environment through the air outlet opening N. Since the second part 322 and part of the first part 321 are sealed and connected, it is beneficial for the second part 322 and part of the first part 321 to form a closed air outlet channel, thereby preventing air backflow and improving the heat dissipation capacity of the fan assembly.

[0063] 4 , the fan body 31 may include a shaft seat 315 , blades 311 and a stator assembly 313 . The shaft seat 315 is connected to the first portion 321 , the stator assembly 313 is connected to the shaft seat 315 , and the blades 311 are rotatably connected to the shaft seat 315 .

[0064] Illustratively, the shaft seat 315 may include a mounting seat 3151, a rotating shaft 3152, and a rotating bearing 3153. The mounting seat 3151 may be mounted on the first portion 321. The mounting seat 3151 has a groove 3150 on one end facing away from the first portion 321. The rotating shaft 3152 and the rotating bearing 3153 are located within the groove 3150, with the rotating bearing 3153 connected between the rotating shaft 3152 and the walls of the groove 3150. For example, the rotating shaft 3152 may have an interference fit with the inner race of the rotating bearing 3153, and the walls of the groove 3150 may have an interference fit with the outer race of the rotating bearing 3153. This arrangement enables the rotating shaft 3152 to rotate relative to the mounting seat 3151.

[0065] In some embodiments, the shaft seat 315 may further include a wear-resistant pad 3155, which is located between the rotating shaft 3152 and the bottom of the groove 3150. The material of the wear-resistant pad 3155 may include peek (polyetheretherketone), for example. By providing the wear-resistant pad 3155, it is helpful to prevent the rotating shaft 3152 from wearing the mounting seat 3151. In some embodiments, the shaft seat 315 may further include an oil seal cover 3154, which is sealed between the rotating shaft 3152 and the mounting seat 3151. It is understandable that lubricating oil or grease is usually filled in the groove 3150 to reduce the frictional resistance during the rotation of the rotating shaft 3152. By providing the oil seal cover 3154, it is helpful to prevent the lubricating oil or grease in the groove 3150 from leaking, thereby avoiding contamination of the fan body 31.

[0066] In some embodiments, the stator assembly 313 can be, for example, a stator coil, which can be sleeved on the shaft seat 315. Accordingly, the electronic device 1 can also include a circuit board 70, which is located in the installation space 101. Accordingly, the fan housing 32 can also include a connecting hole 104, and the circuit board 70 extends into the installation space 101 through the connecting hole 104 and is electrically connected to the stator assembly 313. In addition, in conjunction with Figure 1, the circuit board 70 can also be electrically connected to the main board 80 in the electronic device 1'. Exemplarily, the circuit board 70 can be electrically connected to the stator assembly 313 through a metal lead. Through the above arrangement, the main board 80 can control the circuit board 70 to supply power to the stator coil, and the stator coil generates a rotating electromagnetic field after being energized.

[0067] Based on the above structure, the fan blade 311 can be connected to the rotating shaft 3152, and the fan blade 311 includes a magnetic element so that the fan blade 311 can rotate relative to the shaft seat 315. For example, the central axis of the rotating shaft 3152 can be the rotating axis L of the fan blade 311. Among them, the fan blade 311 can include a plurality of blades, and the blades can be forward-inclined blades, or the blades can also be backward-inclined blades. The magnetic element can be, for example, a permanent magnetic ring. When the stator coil is energized, the permanent magnetic ring and the rotating electromagnetic field repel each other and push, so that when the fan blade 311 rotates relative to the shaft seat 315, the space in the installation space 101 enters the accommodating space 103 from the air inlet opening M, and the air flow flows to the air outlet opening N under the drive of the blades and is discharged from the air outlet opening N.

[0068] It is understood that the shapes of the shaft seat 315 and the stator coil can be designed based on the actual motion requirements of the fan blades 311, and this embodiment of the application does not limit this. Furthermore, the fan body 31 can also include other structures, and the driving method of the fan blades 311 is not limited to the mutual repulsive propulsion between magnetic elements. This embodiment of the application does not limit the specific structure of the fan body 31 or the driving method of the fan blades 311.

[0069] Figure 5 is a cross-sectional view of the flat plate structure 13 in the electronic device 1 in Figure 4 . As shown in conjunction with Figures 4 and 5 , in some embodiments, the first portion 321 has a raised structure 131 on the side proximal to the installation space 101. The raised structure 131 has a first sub-surface 1311 on the side proximal to the installation space 101. The first sub-surface 1311 is disposed opposite the first surface a1 and is recessed toward the side proximal to the first surface a1 to form a mounting groove 1313. The shaft seat 315 is mounted within the mounting groove 1313. For example, the raised structure 131 can be generally cylindrical, with the upper surface of the cylindrical structure serving as the first sub-surface 1311. The shape of the mounting groove 1313 can be configured to correspond to the shape of the mounting base 3151 of the shaft seat 315, so that the mounting base 3151 of the shaft seat 315 can be mounted within the mounting groove 1313. In some examples, the mounting base 3151 can be made of a metal such as copper, aluminum, stainless steel, or the like. For example, when both the first portion 321 and the mounting base 3151 are made of metal, the mounting base 3151 can be riveted into the mounting groove 1313 of the first portion 321, and glue can be added between the mounting base 3151 and the mounting groove 1313 to further increase the connection strength between the mounting base 3151 and the first portion 321. With this arrangement, the fan body 31 can be mounted on the first portion 321 via the protrusion 131, and the connection strength of the fan body 31 can be improved by partially increasing the thickness of the first portion 321.

[0070] In some embodiments, the first sub-surface 1311 can be parallel to the first surface a1 and perpendicular to the rotation axis L of the blade 311. For example, the blade 311 can rotate relative to the rotation axis 3152, and the centerline of the rotation axis 3152 is the rotation axis L of the blade 311. The first sub-surface 1311 can be perpendicular to the centerline of the rotation axis 3152, that is, the first sub-surface 1311 can be perpendicular to the rotation axis L of the blade 311. This configuration prevents interference between the blade 311 and the first sub-surface 1311 during rotation, thereby reducing the risk of the blade 311 being scratched.

[0071] In some examples, the flatness of the first sub-surface 1311 can be less than or equal to 0.2 mm. For example, the flatness of the first sub-surface 1311 can be 0.1 mm, 0.15 mm, or 0.2 mm. Here, "flatness" can be understood as the deviation value of the concave and convex height of the actual plane of the first sub-surface 1311 relative to the ideal plane. By limiting the flatness of the first sub-surface 1311, it is beneficial to further improve the flatness effect of the first sub-surface 1311 and further avoid interference between the fan blades 311 and the first sub-surface 1311 during rotation.

[0072] In some embodiments, the first portion 321 may further include a second sub-surface 1315 adjacent to the raised structure 131, the second sub-surface 1315 being arranged opposite to the first surface a1, the second sub-surface 1315 being parallel to the first surface a1, and being perpendicular to the axis of rotation L of the fan blade 311. Exemplarily, the second sub-surface 1315 may surround the edge of the raised structure 131. The distance between the second sub-surface 1315 and the first surface a1 is less than the distance between the first sub-surface 1311 and the first surface a1. By the above arrangement, the fan blade 311 is prevented from interfering with the first sub-surface 1311 during rotation, which is conducive to improving the phenomenon of the fan blade 311 being scratched. In addition, by the above arrangement, it is also beneficial to ensure the volume of the installation space 101 enclosed by the first portion 321, the first structural member 111, and the second structural member 112, thereby increasing the installation space 101.

[0073] In some examples, the flatness of the second sub-surface 1315 can be less than or equal to 0.2 mm. For example, the flatness of the second sub-surface 1315 can be 0.1 mm, 0.15 mm, or 0.2 mm. Here, "flatness" can be understood as the deviation value of the concave and convex height of the actual plane of the second sub-surface 1315 relative to the ideal plane. By limiting the flatness of the second sub-surface 1315, it is beneficial to further improve the flatness effect of the second sub-surface 1315 and further avoid interference between the fan blades 311 and the second sub-surface 1315 during rotation.

[0074] In some embodiments, the first structural member 111 may have a third sub-surface 1321 on a side adjacent to the installation space 101. The third sub-surface 1321 is disposed opposite the second surface a2, and at least a portion of the third sub-surface 1321 and at least a portion of the second sub-surface 1315 are coplanar. Here, "at least a portion of the third sub-surface 1321 and at least a portion of the second sub-surface 1315 are coplanar" can be understood to mean that a portion of the third sub-surface 1321 and the second sub-surface 1315 are coplanar, or that a portion of the third sub-surface 1321 and a portion of the second sub-surface 1315 are coplanar, or that the third sub-surface 1321 and a portion of the second sub-surface 1315 are coplanar. Here, "flat" can be understood to mean an absolutely flat surface or a nearly flat surface. A nearly flat surface may have slight undulations, and the acceptable deviation from the nearly flat surface may be, for example, within 5%.

[0075] As described in the above embodiment, the second sub-surface 1315 can be parallel to the first surface a1. Since at least part of the third sub-surface 1321 and at least part of the second sub-surface 1315 are located in the same plane, and at least part of the first surface a1 and at least part of the second surface a2 are located in the same plane, at least part of the third sub-surface 1321 can be parallel to the second surface a2, which is beneficial to improving the regularity of the first structural member 111, and is beneficial to further ensure the volume of the installation space 101 enclosed by the first part 321, the first structural member 111 and the second structural member 112, thereby increasing the installation space 101.

[0076] In some examples, the flatness of the third sub-surface 1321 can be less than or equal to 0.2 mm. For example, the flatness of the third sub-surface 1321 can be 0.1 mm, 0.15 mm, or 0.2 mm. Here, "flatness" can be understood as the deviation of the height of the concave and convex portions of the actual plane of the third sub-surface 1321 from the ideal plane. By limiting the flatness of the third sub-surface 1321, the flatness of the third sub-surface 1321 can be further improved, thereby further improving the regularity of the first structural member 111.

[0077] Based on the above structure, the circuit board 70 may include a first plate portion 71, a second plate portion 72, and a bent portion 73. The first plate portion 71 may be connected to the first sub-surface 1311, the second plate portion 72 may be connected to the second sub-surface 1315, and the bent portion 73 may be connected between the first plate portion 71 and the second plate portion 72. For example, the circuit board 70 may be a flexible printed circuit (FPC). The first plate portion 71 may be bonded to the first sub-surface 1311, the second plate portion 72 may be bonded to the second sub-surface 1315, and the bent portion 73 may be bonded to the circumferential surface of the raised structure 131 and connected between the first plate portion 71 and the second plate portion 72. Through the above arrangement, the circuit board 70 can be mounted on the first portion 321, and the space occupied by the circuit board 70 within the installation space 101 can be reduced. Furthermore, the second plate portion 72 may be further inserted into the communication hole 104 , so that the second plate portion 72 may extend out of the fan housing 32 through the communication hole 104 and be electrically connected to the mainboard 80 of the electronic device 1 .

[0078] Continuing with FIG. 4 , in some embodiments, the first portion 321 and the first structural member 111 may be integrally formed. For example, the first portion 321 and the second structural member 112 may be formed from an integral metal plate. The metal plate may be made of, for example, magnesium alloy or stainless steel. By integrating the first portion 321 and the first structural member 111, the connection strength between the first portion 321 and the first structural member 111 bracket is enhanced.

[0079] Among them, the surface of the metal plate can be plane milled by a computer numerical control (CNC) machine. For example, the second sub-surface 1315 of the first part 321 and the third sub-surface 1321 of the first structural member 111 can be located in the same plane by plane milling, and the plane is parallel to the plane where the first surface a1 and the second surface a2 are located. At the same time, the first sub-surface 1311 of the first part 321 can also be parallel to the plane where the first surface a1 and the second surface a2 are located by plane milling, and a groove can be milled on the first sub-surface 1311 by increasing the milling depth. In some implementations, the flatness of the milled first sub-surface 1311, the second sub-surface 1315, and the third sub-surface 1321 can be adjusted by adjusting the accuracy of the plane milling.

[0080] As described in the above embodiment, with reference to FIG4 , the second portion 322 may include a frame 3221 and a cover plate 3223. Based on the above structure, the frame 3221 and the cover plate 3223 may be an integral structure. For example, the frame 3221 and the cover plate 3223 may be an integral structure formed by pressing together the same piece of metal sheet. By setting the frame 3221 and the cover plate 3223 as an integral structure, it is beneficial to improve the connection strength between the frame 3221 and the cover plate 3223, thereby improving the overall structural strength of the second portion 322. At the same time, the frame 3221 and the cover plate 3223 are an integral structure, which is also beneficial to improving the sealing between the frame 3221 and the cover plate 3223, and is beneficial to forming a closed air outlet channel between the second portion 322 and part of the first portion 321, preventing air backflow, and improving the heat dissipation capacity of the fan assembly.

[0081] Moreover, when the frame 3221 and the cover 3223 are an integrated metal structure, while ensuring the overall structural strength of the second part 322, it is also beneficial to reduce the thickness of the second part 322, thereby helping to reduce the space occupied by the fan module 30 in the electronic device 1 and improve the space utilization in the electronic device 1.

[0082] In some embodiments, the frame 3221 is detachably connected to the side of the first structural member 111 near the installation space 101. For example, as shown in Figures 4 and 5, the side of the first structural member 111 near the installation space 101 may have a mounting boss 132, and the mounting boss 132 and the frame 3221 may be threadedly connected. For example, the mounting boss 132 may be provided on the third sub-surface 1321 of the first structural member 111, and the mounting boss 132 may have a countersunk hole 1323, and the hole wall of the countersunk hole 1323 may have an internal thread. Correspondingly, the frame 3221 may also have a threaded hole arranged opposite to the countersunk hole 1323, and a threaded fastener such as a bolt may be inserted into the threaded hole and the countersunk hole 1323 to thread the mounting boss 132 and the frame 3221. Through the above arrangement, a detachable connection between the frame 3221 and the first structural member 111 can be achieved, making it easy to replace or repair the fan body 31 at any time.

[0083] Of course, in the embodiment of the present application, the frame 3221 and the cover plate 3223 can also be two independent structures, and the frame 3221 and the cover plate 3223 can be connected together by welding or bonding.

[0084] Based on the above structure, as shown in FIG4 , the fan module 30 may further include a sealing structure 34, and the sealing structure 34 may be located between the first portion 321 and the frame 3221. The sealing structure 34 may include a sealing ring, a sealant, and the like. As described in the above embodiment, the frame 3221 may be provided along a portion of the edge of the first portion 321 and the cover plate 3223. Correspondingly, the sealing structure 34 may also be provided around a portion of the edge of the first portion 321 and the frame 3221, so as to achieve a sealed connection between the frame 3221 and a portion of the first portion 321, which is beneficial for the second portion 322 and a portion of the first portion 321 to form a closed air outlet channel, prevent air backflow, and improve the heat dissipation capacity of the fan assembly.

[0085] FIG6 is a partial enlarged view of point A in the electronic device 1 in FIG4 . As shown in FIG6 , in some embodiments, the first portion 321 further has a recessed structure 135 on one side close to the installation space 101, and the recessed structure 135 and the frame 3221 together enclose a connecting hole 104. Part of the second sub-surface 1315 can be recessed in a direction close to the first surface a1 to form a recessed structure 135. For example, a groove can be machined into the part of the second sub-surface 1315 by plane milling, and the groove is the recessed structure 135. As described in the above embodiment, the second plate portion 72 of the circuit board 70 can also be bent in a direction close to the recessed structure 135 and passed through the connecting hole 104. Through the above arrangement, the circuit board 70 can extend into the fan housing 32 through the connecting hole 104 and be electrically connected to the stator assembly 313.

[0086] As described in the above embodiment, the sealing structure 34 is located between the frame 3221 and the first portion 321. A portion of the sealing structure 34 can be located between the frame 3221 and the recessed structure 135. That is, the sealing structure 34 can be located within the communication hole 104, and the circuit board 70 can be located between the sealing structure 34 and the recessed structure 135. This arrangement improves the sealing effect between the circuit board 70 and the frame 3221. Furthermore, compared to placing the circuit board 70 between the sealing structure 34 and the frame 3221, placing the circuit board 70 between the sealing structure 34 and the recessed structure 135 helps prevent the frame 3221 from damaging the circuit board 70.

[0087] In some examples, the fan module 30 may further include a sealing layer 35. The sealing layer 35 may be located between the second plate portion 72 of the circuit board 70 and the recessed structure 135, and between the second plate portion 72 of the circuit board 70 and the sealing structure 34. The sealing layer 35 may be made of, for example, foam. The provision of the sealing layer 35 further enhances the sealing effect between the circuit board 70 and the communication hole 104, facilitates the formation of a sealed air outlet channel between the second portion 322 and a portion of the first portion 321, prevents air backflow, and improves the heat dissipation capability of the fan assembly.

[0088] FIG7 is a structural diagram of another electronic device 1 provided in an embodiment of the present application. FIG8 is a structural diagram of another fan module 30 provided in an embodiment of the present application. As shown in FIG7 and FIG8, in some embodiments, the first structural member 111 may have a mounting opening 137 extending therethrough, and at least a portion of the first portion 321 may be located within the mounting opening 137. The shape of the mounting opening 137 may be configured accordingly based on the shape of the first portion 321. For example, the mounting opening 137 may be a circular opening, and accordingly, the cross-sectional shape of the first portion 321 in a plane parallel to the first surface a1 may be circular, so that at least a portion of the first portion 321 may be located within the mounting opening 137. Here, “at least part of the first part 321 can be located in the mounting opening 137” can be understood as, when the thickness of the first part 321 is less than or equal to the thickness of the first structural member 111, the first part 321 is located in the mounting opening 137; when the thickness of the first part 321 is greater than the thickness of the first structural member 111, part of the first part 321 protrudes from the mounting opening 137, and part of the first part 321 is located in the mounting opening 137.

[0089] Based on the above structure, during the installation of the fan module 30 in the embodiment of the present application, the fan body 31 can be first installed in the fan housing 32, and the fan housing 32 can be installed on the first structural member 111, with the first portion 321 positioned in the installation opening 137 of the first structural member 111, so that the first portion 321 and the first structural member 111 together form the flat plate structure 13. The first portion 321 and the first structural member 111 can be welded together, or they can be adhesively bonded together. The embodiment of the present application does not specifically limit the connection method between the first portion 321 and the first structural member 111.

[0090] To sum up, at least part of the first part 321 can be located in the mounting opening 137, so that the first structural member 111 and the first part 321 form a common flat plate structure 13, which is beneficial to reducing the assembly distance between the fan housing 32 and the first structural member 111, as well as the thickness of part of the first structural member 111, and further beneficial to reducing the thickness of the electronic device 1, thereby facilitating the realization of the lightweight and thin electronic device 1.

[0091] As shown in FIG8 , in an embodiment of the present application, the frame 3221 and cover plate 3223 in the second portion 322 can be two independent structures that can be assembled sequentially onto the first portion 321 to form the fan housing 32. For example, the frame 3221 can be formed on the first portion 321 using an injection molding process, and the frame 3221 is disposed around the edge of the first portion 321. The frame 3221 formed by the injection molding process provides good sealing and connection strength with the first portion 321. After the frame 3221 is formed, the cover plate 3223 can be bonded to the side of the frame 3221 facing away from the first portion 321, thereby forming the fan housing 32. While the frame 3221 is being formed on the first portion 321 using the injection molding process, the structure of the injection mold can be adjusted so that the formed frame 3221 has a connecting hole 104, allowing the circuit board 70 to extend into the fan housing 32 through the connecting hole 104 and be electrically connected to the stator assembly 313.

[0092] Of course, in some other implementations, the frame 3221 and the cover 3223 may also be an integrated structure, and the embodiments of the present application do not specifically limit this.

[0093] FIG9 is a cross-sectional view of the first structural member 111 in the electronic device 1 in FIG8 ; FIG10 is a cross-sectional view of the first portion 321 in the electronic device 1 in FIG8 . In conjunction with FIG8 , FIG9 and FIG10 , in some embodiments, the first structural member 111 may include a base plate 1113 and a connecting block 1115 . The base plate 1113 has a mounting opening 137 extending therethrough. The base plate 1113 has a second surface a2 on a side facing away from the mounting space 101 . The base plate 1113 further has a side surface b1 adjacent to the second surface a2 , the side surface b1 enclosing the mounting opening 137 . The connecting block 1115 is connected to a side of the base plate 1113 near the mounting space 101 . The connecting block 1115 extends beyond the side surface b1 in a direction parallel to the second surface a2 and pointing from the side surface b1 toward the rotation axis L of the fan blade 311 (e.g., the X direction in FIG9 ).

[0094] Exemplarily, the bottom surface of the bottom plate 1113 can be the second surface a2, the top surface of the bottom plate 1113 is the surface of the side of the bottom plate 1113 close to the installation space 101, and the bridge block 1115 can be connected to the top surface of the bottom plate 1113. The installation opening 137 can be a circular opening, that is, the side surface b1 surrounding the installation opening 137 can be an annular surface. Accordingly, the cross-sectional shape of the bridge block 1115 parallel to the second surface a2 can be annular, and the central axis of the bridge block 1115 can coincide with the central axis of the installation opening 137. Moreover, the central axis of the installation opening 137 can also coincide with the rotation axis L of the fan blade 311. In the direction parallel to the second surface a2 and pointing from the side surface b1 to the rotation axis L of the fan blade 311 (such as the X direction in Figure 9), the distance D1 between the overlap block 1115 and the rotation axis L of the fan blade 311 is smaller than the distance D2 between the side surface b1 and the rotation axis L of the fan blade 311, so that the overlap block 1115 extends beyond the side surface b1.

[0095] Based on the above configuration, the surface of the connecting block 1115 adjacent to the side surface b1 is the connecting surface b2, which contacts the side of the first portion 321 that is adjacent to the installation space 101. For example, the first portion 321 may further include a fourth sub-surface 1317. The fourth sub-surface 1317 is located on the side of the first portion 321 that is adjacent to the installation space 101 and on the side of the second sub-surface 1315 that is facing away from the first sub-surface 1311. The fourth sub-surface 1317 may be parallel to the first surface a1, and the distance D4 between the fourth sub-surface 1317 and the first surface a1 may be less than the distance D3 between the second sub-surface 1315 and the first surface a1. The fourth sub-surface 1317 may contact the connecting block 1115, thereby limiting the first portion 321 and preventing it from moving toward the installation space 101.

[0096] At the same time, since the overlapping block 1115 is connected to the side of the base plate 1113 close to the installation space 101, when the fan housing 32 is installed, the fan housing 32 can be extended from the outside of the shell 11 into the installation space 101, and the first part 321 can be in contact with the overlapping surface b2, thereby facilitating the installation and fixation of the fan housing 32.

[0097] Of course, in other embodiments, the first portion 321 may omit the fourth sub-surface 1317, and the second sub-surface 1315 of the first portion 321 may contact the connecting block 1115. Alternatively, in other embodiments, the connecting block 1115 may be connected to the second surface a2 of the bottom plate 1113, which is not specifically limited in the present embodiment.

[0098] In some embodiments, with continued reference to FIG8 , a portion of the bottom plate 1113 and a portion of the first portion 321 together constitute a welding block 139. The welding block 139 has a third surface a3 on a side facing away from the installation space 101. At least a portion of the third surface a3, at least a portion of the first surface a1, and at least a portion of the second surface a2 are located in the same plane. Exemplarily, the material of the bottom plate 1113 and the first portion 321 may include metal. A portion of the second surface a2 of the bottom plate 1113 and a portion of the first surface a1 of the first portion 321 are welded together through a welding process, so that the portion of the bottom plate 1113 and the portion of the first portion 321 together constitute the welding block 139. The above arrangement allows the bottom plate 1113 and the first portion 321 to be welded together, which helps to improve the connection strength between the bottom plate 1113 and the first portion 321. Furthermore, because the third surface a3 of the welding block 139 can be formed by welding a portion of the second surface a2 of the bottom plate 1113 and a portion of the first surface a1 of the first portion 321, the welding process can be performed outside the housing 11, thereby increasing the welding operating space and reducing the welding difficulty. Furthermore, since at least a portion of the third surface a3, at least a portion of the first surface a1, and at least a portion of the second surface a2 are located in the same plane, the flatness of the housing 11 is further improved, thereby enhancing the aesthetics of the housing 11.

[0099] In some embodiments, in a direction parallel to the second surface a2 and pointing from the side surface b1 to the rotation axis L of the fan blade 311 (such as the X direction in Figure 8), there is a preset distance H between the frame 3221 and the side surface b1. It can be understood that in the process of welding the bottom plate 1113 and the first part 321 together, the contact surface between the bottom plate 1113 and the first part 321 is usually welded. Based on the above embodiment, that is, the side surface b1 of the bottom plate 1113 and the peripheral surface of the first part 321 are welded, by adjusting the preset distance H between the frame 3221 and the side surface b1, it is beneficial to ensure the distance between the welding position and the frame 3221, avoid the high temperature during the welding process from affecting the frame 3221, and help improve the structural reliability of the frame 3221.

[0100] For example, in the direction parallel to the second surface a2 and pointing from the side surface b1 to the rotation axis L of the fan blade 311 (such as the X direction in Figure 8), the preset distance H between the frame 3221 and the side surface b1 can be greater than or equal to 10 cm. For example, the preset distance H between the frame 3221 and the side surface b1 can be 10 cm, 12 cm or 14 cm. When the preset distance H approaches 10 cm, it is beneficial to increase the volume of the fan module 30 and to ensure the heat dissipation performance of the electronic device 1. As the preset distance H increases, the welding process has less impact on the frame 3221, which is beneficial to further improve the reliability of the frame 3221; at the same time, the volume occupied by the fan module 30 in the installation space 101 is smaller, which is beneficial to improve the space utilization of the installation space 101. In some embodiments, the electronic device 1 may further include a decorative layer 60, which may be located on the side of the bottom plate 1113 and the first part 321 facing away from the installation space 101. For example, the decorative layer 60 can be a plate structure bonded to the base plate 1113 and the first portion 321, or a coating structure sprayed onto the surface of the first portion 321 of the base plate 1113. The provision of the decorative layer 60 helps enhance the aesthetics of the electronic device 1. In embodiments where a portion of the base plate 1113 and a portion of the first portion 321 together form the welding block 139, the decorative layer 60 also covers the welding block 139 to prevent exposure of the welding block 139, further enhancing the aesthetics of the electronic device 1.

[0101] 11 to 14 , the installation process between the first portion 321 of the fan housing 32 and the first structural member 111 of the housing 11 in the embodiment of the present application will be briefly described below.

[0102] Figure 11 is a cross-sectional view of a first structural member 111 before welding, according to an embodiment of the present application. As shown in Figure 11 , the bottom plate 1113 of the first structural member 111 further includes a first welding boss 1117 that protrudes toward a side facing away from the installation space 101. The first welding boss 1117 can abut against the side surface b1, and the surface of the first welding boss 1117 that faces the installation opening 137 can be coplanar with the side surface b1.

[0103] Figure 12 is a cross-sectional view of a first portion 321 provided in an embodiment of the present application after being overlapped with the first structural member 111. Accordingly, as shown in Figure 12, the first portion 321 further has a second welding boss 1319 protruding toward a side away from the installation space 101, and the second welding boss 1319 is in contact with the first welding boss 1117.

[0104] Figure 13 is a cross-sectional view of a first part 321 and a first structural member 111 after welding provided in an embodiment of the present application. As shown in Figure 13, an automated laser welding process can be used to weld the contact surfaces of the first structural member 111 and the first part 321 to connect the first structural member 111 and the first part 321 together. For example, after welding, the first welding boss 1117 and the second welding boss 1319 are recessed in the direction close to the installation space 101. Among them, the automated laser welding process has the advantages of fast welding speed, uniform welds and no cracking. During the automated laser welding process, if there is micro-deformation in the weld, the residual stress of the welding can be removed by laser engraving. Of course, in the embodiment of the present application, other welding processes can also be used to weld the first structural member 111 and the first part 321 together, and the embodiment of the present application does not specifically limit this.

[0105] Figure 14 is a cross-sectional view of a first portion 321 and a first structural member 111 after grinding, according to an embodiment of the present application. As shown in Figure 14, after the first structural member 111 and the first portion 321 are welded together, a surface b1 of the first structural member 111 and the first portion 321 facing away from the installation space 101 can be ground to form a first surface a1, a second surface a2, and a third surface a3 located in the same plane. The first surface a1 is the surface of the first portion 321 facing away from the installation space 101, the second surface a2 is the surface of the first structural member 111 facing away from the installation space 101, and the third surface a3 is the surface of the welding block 139 facing away from the installation space 101.

[0106] In some examples, multiple grinding operations may be performed to ensure the flatness of the first surface a1, the second surface a2, and the third surface a3. For example, a first grinding operation may be performed using a coarse grinding wheel to remove oxides from the surfaces of the first welding boss 1117, the second welding boss 1319, the first structural member 111, and the first portion 321. After the first grinding operation, a second grinding operation may be performed using a fine grinding wheel to smooth the first structural member 111, the welding block 139, and the first portion 321. After the second grinding operation, a third grinding operation may be performed using a grinding wheel to polish the surface to a finer consistency.

[0107] FIG15 is a cross-sectional view of a first portion 321 and a first structural member 111 provided in an embodiment of the present application after a decorative layer 60 is sprayed on the surface. As shown in FIG15 , after grinding the surface b1 of the first structural member 111 and the first portion 321 on the side facing away from the installation space 101, a spraying process can be used to form the decorative layer 60. Multiple spraying processes can be performed to ensure the reliability of the decorative layer 60. For example, a primer coating, a mid-coat coating, and a top-coat coating can be sprayed sequentially through a three-spraying process, wherein the primer coating is used to enhance the adhesion of the decorative layer 60, the mid-coat coating is used to achieve a coloring effect, and the top-coat coating is used to provide a protective effect.

[0108] In some embodiments, with continued reference to FIG15 , during the process of assembling the first structural member 111 and the first portion 321 together, a protective cover 50 may be further provided on the fan module 30. The protective cover 50 is connected to the side of the first structural member 111 close to the installation space 101 and is provided on the outside of the second portion 322 of the fan housing 32. Exemplarily, the protective cover 50 may include a cover body having a vacuum cavity therein, and the material of the cover body may be a metal such as stainless steel. Through the above arrangement, paint splashing onto the second portion 322 can be avoided during the process of forming the decorative layer 60 using a spraying process. Furthermore, the protective cover 50 may also be used during the process of welding the first structural member 111 and the first portion 321 together using a welding process, which is beneficial for avoiding the baking temperature from affecting the performance of the second portion 322 and the fan body 31, thereby improving the reliability of the fan module 30.

[0109] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A fan module, characterized in that: include: The housing comprises a first structural member and a second structural member, wherein the second structural member is arranged around an edge of the first structural member; A fan housing and a fan body, wherein the fan housing is arranged outside the fan body, the fan housing comprises a first part and a second part, the first part and the first structural member together form a flat plate structure, the flat plate structure and the second structural member together enclose an installation space, and the fan body and the second part are located in the installation space; The first portion includes a first surface, the first structural member includes a second surface, the first surface and the second surface are both located on a side of the flat plate structure away from the installation space, and the second surface and the first surface are located in the same plane.

2. The fan module according to claim 1, characterized in that: The fan body comprises a shaft seat, a fan blade and a stator assembly, the shaft seat is connected to the first part, the stator assembly is connected to the shaft seat, the fan blade is rotatably connected to the shaft seat, and the fan blade comprises a magnetic element; The fan housing further includes a connecting hole, and the electronic device further includes a circuit board. The circuit board is located in the installation space, extends into the fan housing through the connecting hole, and is electrically connected to the stator assembly.

3. The fan module according to claim 2, characterized in that: The first part has a protruding structure on a side close to the installation space, and the protruding structure has a first sub-surface on a side close to the installation space. The first sub-surface is arranged opposite to the first surface, and the first sub-surface is recessed toward the side close to the first surface to form an installation groove, and the shaft seat is installed in the installation groove.

4. The fan module according to claim 3, characterized in that: The first sub-surface is parallel to the first surface and perpendicular to the rotation axis of the fan blade.

5. The fan module according to claim 3 or 4, characterized in that: The first portion also includes a second sub-surface adjacent to the protruding structure, the second sub-surface is arranged opposite to the first surface, the second sub-surface is parallel to the first surface, and is perpendicular to the rotation axis of the fan blade.

6. The fan module according to claim 5, characterized in that: The first structural member has a third sub-surface on one side close to the installation space. The third sub-surface is arranged opposite to the second surface, and the third sub-surface and the second sub-surface are located in the same plane.

7. The fan module according to claim 6, characterized in that: The circuit board includes a first board portion, a second board portion and a bending portion, the first board portion is connected to the first sub-surface, the second board portion is connected to the second sub-surface and is penetrated in the connecting hole, and the bending portion is connected between the first board portion and the second board portion.

8. The fan module according to any one of claims 2 to 7, characterized in that: The first portion and the first structural member are an integral structure.

9. The fan module according to claim 8, characterized in that: The second part includes a frame and a cover plate, wherein the frame is located between the first part and the cover plate, the frame is arranged around the edges of the first part and the cover plate, and the frame and the cover plate are an integral structure.

10. The fan module according to claim 9, characterized in that: The frame is detachably connected to a side of the first structural member close to the installation space; the fan module also includes a sealing structure, which is located between the first part and the frame.

11. The fan module according to claim 10, characterized in that: The first part also has a recessed structure on one side close to the installation space. The recessed structure and the frame together enclose the connecting hole. Part of the sealing structure is located in the connecting hole. The circuit board is located between the sealing structure and the recessed structure.

12. The fan module according to any one of claims 2 to 11, characterized in that: The first structural member has a penetrating installation opening, and at least a portion of the first portion is located in the installation opening.

13. The fan module according to claim 12, characterized in that: The first structural member includes a bottom plate and a bridge block, the bottom plate has the installation opening extending therethrough, the bottom plate has the second surface on a side facing away from the installation space, and the bottom plate also has a side surface adjacent to the second surface, the side surface enclosing the installation opening; The overlapping block is connected to a side of the base plate close to the installation space. In a direction parallel to the second surface and pointing from the side surface to the rotation axis of the fan blade, the overlapping block extends beyond the side surface. The surface adjacent to the side surface of the overlapping block is a overlapping surface, and the overlapping surface is in contact with a side of the first part close to the installation space.

14. The fan module according to claim 13, characterized in that: A portion of the bottom plate and a portion of the first portion together form a welding block, and a side of the welding block facing away from the installation space has a third surface, and the third surface, the first surface and the second surface are located in the same plane.

15. The fan module according to claim 14, characterized in that: The second part includes a frame and a cover plate, wherein the frame is located between the first part and the cover plate, and the frame is arranged around the edge of the cover plate. In a direction parallel to the second surface and pointing from the side surface to the rotation axis of the fan blade, there is a preset distance between the frame and the side surface.

16. The fan module according to any one of claims 13 to 15, characterized in that: The electronic device may further include a decoration layer, wherein the decoration layer is located on a side of the bottom plate and the first portion facing away from the installation space.

17. An electronic device, characterized in that: It comprises a mainboard and a fan module as described in any one of claims 1 to 16 above, wherein the mainboard is connected to a fan body of the fan module.

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