Imaging device

Abstract

The purpose of the present invention is to effectively suppress any increase in the temperature of an imaging element using a minimal component configuration. An imaging device (1) comprises an imaging substrate (7) on which an imaging element (8) is mounted, a housing (2, 3) that accommodates the imaging substrate (7), and heat dissipation fins (41) provided to the housing (2, 3). The housing (2, 3) has a rear plate (31) facing the rear, which is the opposite direction from the imaging direction (D1) of the imaging element (8). The rear plate (31) is spaced rearward from the imaging substrate (7) and forms a space (S) between the rear plate (31) and the imaging substrate (7). The heat dissipation fins (41) are provided so as to protrude rearward from the rear plate (31).

Description

Imaging device

[0001] The present invention relates to an imaging device.

[0002] Imaging devices installed inside a vehicle, such as monocular cameras or stereo cameras, are often installed near the top of the windshield (front glass) facing the front of the vehicle, causing temperature rises due to exposure to sunlight. In addition, as imaging devices become more powerful and more compact, the heat generated by the mounted components and the heat density of the camera module are increasing, posing a problem of temperature rise inside the device (especially the imaging element).

[0003] Some imaging devices use heat transfer members or cooling fans to dissipate heat in order to suppress temperature increases in the imaging element, but these have issues such as increased costs due to an increased number of parts, larger product sizes, and the driving noise of the cooling fans.From the perspectives of cost reduction, miniaturization, and quietness, imaging devices are required to have highly efficient natural cooling.

[0004] In the imaging device disclosed in Patent Document 1, in order to address the issues of temperature rise and miniaturization, heat generated on a sensor board 126 on which an imaging element 124 is mounted is thermally conducted to a heat sink cover 128 via a heat conducting member 127 such as heat dissipating rubber provided on the back surface of the board 126, and the heat is then dissipated to the outside from heat dissipation fins 128c of the cover 128.

[0005] Japanese Patent Application Laid-Open No. 2021-69006

[0006] However, the imaging device disclosed in Patent Document 1 inevitably increases costs due to the increased number of parts because a heat-conducting member 127 such as heat-dissipating rubber is provided on the back surface (rear surface) of the sensor substrate 126. The provision of the heat-conducting member 127 not only increases the direct material cost, but also increases the cost of assembly equipment and the number of assembly steps, which significantly increases costs.

[0007] The present invention has been made in view of the above, and has as its object to effectively suppress a temperature rise in an imaging element with a minimum number of components.

[0008] In order to solve the above problem, the imaging device of the present invention comprises an imaging board on which an imaging element is mounted, a housing that houses the imaging board, and heat dissipation fins that are provided on the housing, wherein the housing has a rear plate that faces rearward, which is the opposite direction to the imaging direction of the imaging element, and the rear plate is positioned rearward and spaced apart from the imaging board to form a space between it and the imaging board, and the heat dissipation fins are provided to protrude rearward from the rear plate.

[0009] According to the present invention, it is possible to effectively suppress a temperature rise in an imaging element with a minimum number of components. Problems, components, and effects other than those described above will become apparent from the following description of the embodiments.

[0010] 2 is a front view of an imaging device; an exploded perspective view of the imaging device shown in Figure 1; an exploded perspective view of the imaging device viewed from a direction different from that of Figure 2; a cross-sectional view of the imaging device taken along line AA shown in Figure 1; a rear view of the imaging device shown in Figure 1; a top view illustrating an example of installation of the imaging device shown in Figure 1 in a vehicle; and a side view illustrating an example of installation of the imaging device shown in Figure 1 in a vehicle.

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that components with the same reference numerals in each embodiment have similar components in each embodiment unless otherwise specified, and description thereof will be omitted.

[0012] In this embodiment, the imaging direction D1 of the imaging device 1 is also referred to as the "forward" direction of the imaging device 1, and the direction opposite to the imaging direction D1 is also referred to as the "rearward" direction of the imaging device 1. The imaging direction D1 is the direction in which the light receiving surface 81 of the imaging element 8 provided in the imaging device 1 faces. In this embodiment, the upward, downward, left, and right directions when viewing the imaging device 1 from the "rear" to the "forward" direction are also referred to as the "upward," "downward," "left," and "right" directions of the imaging device 1, respectively. When the imaging device 1 is installed facing the front of a vehicle, the directions of the imaging device 1 defined in this manner also correspond to the directions of the vehicle. Furthermore, "forward" corresponds to the positive direction of the X-axis in the XYZ Cartesian coordinate system shown in the drawings. "Left" corresponds to the positive direction of the Y-axis in the XYZ Cartesian coordinate system shown in the drawings. "Upward" corresponds to the positive direction of the Z-axis in the XYZ Cartesian coordinate system shown in the drawings.

[0013] Fig. 1 is a front view of the imaging device 1. Fig. 2 is an exploded perspective view of the imaging device 1 shown in Fig. 1. Fig. 3 is an exploded perspective view of the imaging device 1 viewed from a different direction than that shown in Fig. 2. Fig. 4 is a cross-sectional view of the imaging device 1 taken along line A-A shown in Fig. 1. Fig. 5 is a rear view of the imaging device 1 shown in Fig. 1.

[0014] The imaging device 1 is an imaging device such as a monocular camera or a stereo camera that is installed inside the vehicle cabin. In this embodiment, the imaging device 1 will be described using an example of a stereo camera that is installed inside the vehicle cabin facing the front of the vehicle. The imaging device 1 captures images of subjects such as a road, a preceding vehicle, an oncoming vehicle, a pedestrian, or an obstacle. The imaging device 1 simultaneously captures images of the subjects using a pair of camera modules 5. The imaging device 1 calculates parallax from the pair of acquired images and measures the distance to the subject, the relative speed, etc. The imaging device 1 transmits the measurement results to a control device of the vehicle. The control device of the vehicle controls the acceleration, braking, steering, etc. of the vehicle based on the measurement results transmitted from the imaging device 1.

[0015] The imaging device 1 includes housings 2 and 3, a pair of camera modules 5 for capturing an image of a subject, and a processing board 10 for processing output signals from a pair of imaging boards 7 included in the pair of camera modules 5.

[0016] 2 and 3, the housings 2 and 3 house a pair of camera modules 5 and a processing board 10. The housings 2 and 3 include a housing main body 2 that houses the pair of camera modules 5 and the processing board 10, and a housing cover 3 that covers the pair of camera modules 5 and the processing board 10 housed in the housing main body 2 and is fastened to the housing main body 2.

[0017] The housing body 2 is formed in a box shape that is long in the left-right direction. The housing body 2 is made of metal and is manufactured by, for example, aluminum die-casting. A pair of camera housing sections 21 that house a pair of camera modules 5 are provided at both left-right ends of the housing body 2. Each of the pair of camera housing sections 21 is formed in a rectangular box shape. A through-hole 22 is provided in the front of each of the pair of camera housing sections 21, into which the lens 6 of the camera module 5 is inserted. An intermediate housing section 23 that houses the processing board 10 is provided between the pair of camera housing sections 21. The housing body 2 has a first opening 24 that opens to the rear of the housing body 2, and a second opening 25 that opens to the bottom of the housing body 2.

[0018] The housing cover 3 is formed in an L-shape to cover the housing main body 2 from the rear and below. The housing cover 3 is made of a metal plate such as an aluminum plate. The housing cover 3 includes a rear plate 31 facing rearward of the housings 2, 3, which is the opposite direction to the imaging direction D1 of the imaging element 8, and a lower plate 32 facing downward of the housings 2, 3. The rear plate 31 and the lower plate 32 are integrally formed.

[0019] The housing cover 3 is fastened to the housing body 2 by fastening members 33 such as screws. The fastening points of the lower plate 32 constituting the housing cover 3 to the housing body 2 are located at the front of the lower plate 32. The fastening points 312 of the rear plate 31 constituting the housing cover 3 to the housing body 2 are located at the top of the rear plate 31. The housing cover 3 fastened to the housing body 2 closes the first opening 24 of the housing body 2 by the rear plate 31, and closes the second opening 25 of the housing body 2 by the lower plate 32.

[0020] 4, the rear plate 31 of the housing cover 3 is disposed rearward and spaced apart from the imaging board 7 of the camera module 5, forming a space S between it and the imaging board 7. That is, the imaging board 7 and the housing cover 3 are not in direct contact with each other, and are not in indirect contact with each other via a heat transfer member such as heat dissipation grease or a heat dissipation sheet.

[0021] The camera module 5 includes a lens 6 that forms an image of a subject on a light receiving surface 81 of an image sensor 8, and an imaging board 7, which is a circuit board on which the image sensor 8 is mounted. The camera module 5 is fixed to the camera housing portion 21 of the housing body 2 with an adhesive, screws, or the like. The pair of imaging boards 7 included in the pair of camera modules 5 are arranged at a distance from each other along a predetermined direction D2 (left-right direction) that is orthogonal to the imaging direction D1.

[0022] 2 to 4, the imaging board 7 is disposed perpendicular to the imaging direction D1. An imaging element 8 is mounted on the front surface of the imaging board 7, and the lens 6 is disposed opposite a light receiving surface 81 of the imaging element 8. The lens 6 is fixed to the imaging board 7 with an adhesive or the like. The imaging element 8 is constituted by an image sensor such as a CMOS (complementary metal oxide semiconductor) or a CCD (charge coupled device).

[0023] As shown in Figures 2 to 4, the processing board 10 is disposed between the pair of imaging boards 7 along a predetermined direction D2 (left-right direction). The processing board 10 is fixed to the intermediate housing portion 23 of the housing body 2 by fastening members 13 such as screws. As shown in Figure 4, the processing board 10 is disposed at an angle with respect to the imaging direction D1 so that its rear end is positioned higher than its front end. The processing board 10 is disposed so that its front end is positioned forward of the imaging board 7 and its rear end is positioned rearward of the imaging board 7. The processing board 10 is electrically connected to each of the pair of imaging boards 7 by flexible wiring members 14 such as FPCs (Flexible Printed Circuits) or FFCs (Flexible Flat Cables).

[0024] A plurality of circuit elements 11 that process output signals from the imaging board 7 are mounted on the upper surface of the processing board 10. The plurality of circuit elements 11 are configured with an FPGA (Field Programmable Gate Array), an MPU (Micro Processing Unit), a memory, etc. Each of the plurality of circuit elements 11 is thermally connected to a pedestal 232 that protrudes downward from the lower surface of the intermediate housing section 23 via a heat transfer member 12 such as thermal grease or a heat dissipation sheet. Note that, for the sake of simplicity, only one circuit element 11, one heat transfer member 12, and one pedestal 232 are shown in FIGS. 2 and 3 , but in reality, a plurality of heat transfer members 12 and a plurality of pedestals 232 are provided corresponding to the plurality of circuit elements 11.

[0025] The housings 2 and 3 of the imaging device 1 are provided with heat dissipation fins 41 and heat dissipation fins 43 to suppress temperature rise in the circuit elements 11 mounted on the processing board 10 and temperature rise in the imaging element 8 mounted on the imaging board 7.

[0026] As shown in FIGS. 1 to 3 , the heat dissipation fins 43 are provided on the housing body 2. The heat dissipation fins 43 are provided to protrude upward from the upper surface 231 of the intermediate housing section 23 of the housing body 2. The heat dissipation fins 43 are composed of a plurality of plate-like or rod-like protrusions arranged at intervals along a predetermined direction D2 so that air flows upward. The shape of each protrusion constituting the heat dissipation fin 43 is not particularly limited. The heat dissipation fins 43 are formed integrally with the housing body 2 using the same material as the housing body 2. Note that the heat dissipation fins 43 may be provided not only on the upper surface 231 of the intermediate housing section 23 but also on the front surface of the intermediate housing section 23 and the upper surfaces of the pair of camera housing sections 21 of the housing body 2.

[0027] The heat dissipation fins 43 form a main heat dissipation path for heat generated in the circuit elements 11 mounted on the processing board 10. That is, the heat generated in the circuit elements 11 is thermally conducted to the base portion 232 of the intermediate accommodation portion 23 of the housing main body 2 via the heat transfer member 12, and is then dissipated to the outside from the heat dissipation fins 43. The heat dissipation fins 43 function as a surface area enlarging portion that enlarges the surface area of ​​the housing main body 2.

[0028] By providing the heat dissipation fins 43 in the intermediate housing portion 23 of the housing body 2, the imaging device 1 can transfer heat generated in the circuit element 11 to the intermediate housing portion 23 by thermal conduction and effectively dissipate the heat to the outside by the heat dissipation fins 43. As a result, the imaging device 1 can suppress a temperature rise in the space S, which serves as a heat dissipation path for heat generated in the imaging element 8 as will be described later, and therefore suppress a temperature rise in the imaging element 8.

[0029] As shown in FIGS. 2 to 5 , the heat dissipation fins 41 are heat dissipation fins provided on the housing cover 3, unlike the heat dissipation fins 43. The heat dissipation fins 41 are provided to protrude rearward from the rear plate 31 of the housing cover 3. The heat dissipation fins 41 are composed of a plurality of plate- or rod-shaped protrusions arranged at intervals along a predetermined direction D2 so that air flows upward. The shape of each protrusion constituting the heat dissipation fin 41 is not particularly limited. The heat dissipation fins 41 are formed integrally with the housing cover 3 using the same material as the housing cover 3.

[0030] The heat dissipation fins 41 form a main heat dissipation path for heat generated by the imaging element 8 mounted on the imaging board 7. That is, the heat generated by the imaging element 8 is transferred to the rear plate 31 of the housing cover 3 by air convection in the space S formed between the rear plate 31 and the imaging board 7, and is also transferred to the rear plate 31 by radiation to the rear plate 31 facing the imaging board 7. The heat transferred to the rear plate 31 is dissipated to the outside from the heat dissipation fins 41. The heat dissipation fins 41 function as a surface area enlarging portion that enlarges the surface area of ​​the housing cover 3.

[0031] By providing this space S and the heat dissipation fins 41, the imaging device 1 can form a heat dissipation path for the imaging element 8 on the opposite side of the heat dissipation path for the circuit element 11. The imaging device 1 can effectively dissipate heat generated by the imaging element 8 to the outside without using a heat transfer member, thereby effectively suppressing temperature rise in the imaging element 8 with a minimum component configuration. In particular, since the imaging board 7 is positioned perpendicular to the imaging direction D1, if a heat conduction heat dissipation method is adopted, the heat transfer member in contact with the imaging board 7 or the imaging element 8 is likely to fall off, requiring additional special measures to prevent the heat transfer member from falling off. Furthermore, in this case, design limitations are likely to be imposed on the angle of the housing cover 3 relative to the vertical direction (relative to the Z axis). Since the imaging device 1 does not require a heat transfer member in contact with the imaging board 7 or the imaging element 8, it can effectively suppress temperature rise in the imaging element 8 with a minimum component configuration.

[0032] When the imaging device 1 is a stereo camera, the rear plate 31 of the housing cover 3 has a pair of fin installation areas 311, each located behind the pair of imaging boards 7, as installation areas for the heat dissipation fins 41, as shown in FIGS. 3 and 5 . The heat dissipation fins 41 are provided to protrude rearward from each of the pair of fin installation areas 311. The rear plate 31 of the housing cover 3 is located behind the processing board 10 and has a connection area 313 for connecting wiring members such as cables extending from the vehicle control device to the processing board 10. Therefore, the installation areas for the heat dissipation fins 41 are located behind each of the pair of imaging boards 7 to prevent interference with the connection area 313. Furthermore, since the area behind the processing board 10 of the rear plate 31 is far from the imaging board 7 and does not face the processing board 10, even if the heat dissipation fins 41 are installed in the area behind the processing board 10 of the rear plate 31, the cooling effect is limited. Therefore, the installation areas for the heat dissipation fins 41 are located behind each of the pair of imaging boards 7 to simplify the component configuration.

[0033] Therefore, by providing the fins protruding rearward from each of the pair of fin installation areas 311, the imaging device 1 can effectively dissipate heat generated by the imaging element 8 to the outside while preventing external interference and simplifying the component configuration. Therefore, the imaging device 1 can effectively suppress a temperature rise in the imaging element 8 with a minimum component configuration.

[0034] 4, the heat dissipation fins 41 are formed so that the protruding length from the rear plate 31 of the housing cover 3 increases from the lower portion 411 to the upper portion 412 of the heat dissipation fins 41. Since the temperature of the air circulating in the space S is higher at the upper portion of the space S than at the lower portion, the heat transfer coefficient from the space S to the heat dissipation fins 41 and the heat transfer coefficient from the heat dissipation fins 41 to the outside are both higher at the upper portion 412 than at the lower portion 411.

[0035] Therefore, by increasing the protruding length of the heat dissipation fins 41 from the lower portion 411 to the upper portion 412, the imaging device 1 can effectively dissipate heat generated by the imaging element 8 to the outside without excessively increasing the surface area of ​​the heat dissipation fins 41. Therefore, the imaging device 1 can effectively suppress a temperature rise in the imaging element 8 with a minimum component configuration.

[0036] Furthermore, in the imaging device 1, the fastening point 312 of the rear plate 31 to the housing main body 2 is located at the upper part of the rear plate 31, so that the housing main body 2 and the rear plate 31 are in a metal-to-metal state (high contact surface pressure) near the upper part of the high-temperature space S, making it possible to achieve a structure that facilitates heat transfer. This allows the imaging device 1 to efficiently transfer heat from the upper part of the high-temperature space S to the upper part 412 of the heat dissipation fins 41, which have a large surface area. Therefore, the imaging device 1 can effectively dissipate heat generated by the imaging element 8 to the outside without excessively increasing the surface area of ​​the heat dissipation fins 41. Therefore, the imaging device 1 can effectively suppress temperature rise of the imaging element 8 with a minimum component configuration.

[0037] The housings 2 and 3 of the imaging device 1 may also be provided with heat dissipation fins 42. As shown in FIGS. 3 to 5 , the heat dissipation fins 42 are different from the heat dissipation fins 41 and are provided on the lower plate 32 of the housing cover 3. The heat dissipation fins 42 protrude downward from the lower plate 32. The heat dissipation fins 42 are composed of a plurality of plate- or rod-shaped protrusions arranged at intervals along a predetermined direction D2 so that air flows in the front-to-rear direction. The shape of each protrusion constituting the heat dissipation fin 42 is not particularly limited. The heat dissipation fins 42 are formed integrally with the housing cover 3 using the same material as the housing cover 3. The heat dissipation fins 42 function as a surface area enlarging portion that enlarges the surface area of ​​the housing cover 3.

[0038] In the imaging device 1, by providing the heat dissipation fins 42 on the lower plate 32 of the housing cover 3, the surface area of ​​the housing cover 3 as a whole can be increased, thereby suppressing a rise in temperature of the imaging element 8. Note that the heat dissipation fins 41 provided on the rear plate 31 clearly have a greater cooling effect than the heat dissipation fins 42 provided on the lower plate 32.

[0039] Fig. 6 is a top view illustrating an example of installation of the imaging device 1 shown in Fig. 1 on a vehicle. Fig. 7 is a side view illustrating an example of installation of the imaging device 1 shown in Fig. 1 on a vehicle.

[0040] The imaging device 1 is installed inside the vehicle cabin facing the front of the vehicle. As shown in Figures 6 and 7, the imaging device 1 is installed near the top of the windshield W (front glass) of the vehicle (near the roof R). The imaging device 1 is installed inside the vehicle cabin covered with an interior material T (decorative cover) of the vehicle.

[0041] The heat dissipation fins 41 provided on the rear plate 31 of the housing cover 3 may be formed so that the length of their protrusion from the rear plate 31 varies along the inner surface T1 of the interior material T. For example, as shown in Fig. 6, among the heat dissipation fins 41, the protrusions 414 located on the outer side in the left-right direction have a shorter protrusion length from the rear plate 31 than the protrusions 413 located on the inner side.

[0042] As a result, the imaging device 1 can be provided with the heat dissipation fins 41 without having to change the design of the interior material T. Therefore, the imaging device 1 can effectively suppress the temperature rise of the imaging element 8 with a minimum component configuration, while increasing the selection of vehicle models in which the imaging device 1 can be installed.

[0043] 7, the interior material T has a vent T2 that communicates with the vehicle interior. The vent T2 is located below the heat dissipation fins 41 provided on the rear plate 31 of the housing cover 3. In other words, the heat dissipation fins 41 provided on the rear plate 31 are located above the vent T2.

[0044] As a result, air flows in from the vent T2 into the installation space for the imaging device 1, which is formed by the interior material T, the windshield W, and the roof R. The air flowing in from the vent T2 can cool the heat dissipation fins 41. Therefore, the imaging device 1 can increase the cooling effect of the heat dissipation fins 41, and can effectively suppress a rise in temperature of the imaging element 8 with a minimum component configuration.

[0045] The present invention is not limited to the above-described embodiments and includes various modifications. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and are not necessarily limited to those including all of the described components. Furthermore, some of the components of one embodiment can be replaced with components of another embodiment, and components of another embodiment can be added to components of one embodiment. Furthermore, some of the components of each embodiment can be added, deleted, or replaced with other components.

[0046] Furthermore, the above-described components, functions, processing units, or processing means may be partially or entirely implemented in hardware, for example, by designing them as integrated circuits. The above-described components or functions may also be implemented in software, with a processor interpreting and executing a program that implements each function. Information such as the program, table, or file that implements each function can be stored in a storage device such as a memory, a hard disk, or an SSD (solid state drive), or in a storage medium such as an IC card, an SD card, or a DVD.

[0047] In addition, the control lines and information lines shown are those that are considered necessary for the explanation, and do not necessarily show all the control lines and information lines in the product. In reality, it can be assumed that almost all components are interconnected.

[0048] 1...imaging device, 2...casing body, 21...camera housing section, 23...intermediate housing section, 231...upper surface, 24...first opening, 25...second opening, 3...casing cover, 31...rear plate, 311...fin installation area, 312...fastening point, 32...lower plate, 41...heat dissipation fin, 411...lower part, 412...upper part, 42...heat dissipation fin, 43...heat dissipation fin, 7...imaging board, 8...imaging element, 10...processing board, 11...circuit element, D1...imaging direction, D2...predetermined direction, S...space, T...interior material, T1...inner surface, T2...vent

Claims

1. An imaging device comprising: an imaging substrate on which an imaging element is mounted; a housing that houses the imaging substrate; and heat radiation fins provided on the housing, wherein the housing has a rear plate facing rearward, which is the opposite direction to the imaging direction of the imaging element, the rear plate is disposed spaced apart from the imaging substrate toward the rear to form a space between the rear plate and the imaging substrate, and the heat radiation fins are provided to protrude from the rear plate toward the rear.

2. The imaging device according to claim 1, wherein the heat radiation fins are formed such that a protruding length from the rear plate increases from the lower part to the upper part of the heat radiation fins.

3. The housing includes a housing main body that houses the imaging substrate, and a housing cover that covers the imaging substrate housed in the housing main body and is fastened to the housing main body. The housing main body has an opening that opens the rear part of the housing main body. The housing cover includes the rear plate and closes the opening with the rear plate. A fastening portion of the rear plate to the housing main body is disposed at the upper part of the rear plate. The imaging device according to claim 2, characterized in that.

4. The imaging device is a stereo camera installed in a vehicle interior facing forward of the vehicle, and further includes a processing substrate that processes an output signal from the imaging substrate. The imaging substrate is composed of a pair of imaging substrates arranged at intervals along a predetermined direction orthogonal to the imaging direction. The processing substrate is disposed between the pair of imaging substrates along the predetermined direction. The rear plate has a pair of fin installation regions respectively disposed behind the pair of imaging substrates as installation regions of the heat radiation fins. The heat radiation fins are provided to protrude from the respective pair of fin installation regions toward the rear. The imaging device according to claim 1, characterized in that.

5. The housing includes a housing body that houses the imaging substrate and the processing substrate, and a housing cover that covers the imaging substrate and the processing substrate housed in the housing body and is fastened to the housing body. The housing body has a first opening that opens the rear portion of the housing body and a second opening that opens the lower portion of the housing body. The housing cover includes a lower plate facing downward of the housing and a rear plate. The rear plate closes the first opening, and the lower plate closes the second opening. The lower plate is provided with heat dissipation fins different from the heat dissipation fins provided on the rear plate, and the heat dissipation fins protrude downward from the lower plate. The imaging device according to claim 4, characterized in that.

6. The housing body has a pair of camera housing portions that respectively house the pair of imaging substrates, and an intermediate housing portion that is disposed between the pair of camera housing portions and houses the processing substrate. On the upper surface of the intermediate housing portion, heat dissipation fins different from the heat dissipation fins provided on the rear plate are provided, and the heat dissipation fins protrude upward from the upper surface of the intermediate housing portion. The imaging device according to claim 5, characterized in that.

7. The imaging device is installed in the vehicle interior in a state of being covered by an interior material of the vehicle. The heat dissipation fins provided on the rear plate are formed such that the protruding length from the rear plate changes along the inner surface of the interior material. The imaging device according to claim 4, characterized in that.

8. The interior material has a vent that communicates with the vehicle interior. The heat dissipation fins provided on the rear plate are disposed above the vent. The imaging device according to claim 7, characterized in that.

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