Circuit module

Abstract

The present invention is a circuit module (1) comprising a substrate (10) having one main surface (10a) and the other main surface (10b), a first resin layer (20) disposed on the one main surface (10a) side of the substrate (10) and having a first main surface (20a) on the substrate (10) side and a second main surface (20b) on the opposite side from the substrate (10), and a connection terminal (30) disposed in the first resin layer (20), the circuit module (1) being characterized in that: a first electrode (11) is provided on the one main surface (10a) of the substrate (10); the connection terminal (30) includes a first connection terminal (31) connected to the first electrode (11), and a second connection terminal (33) connected to the first connection terminal and exposed on the second main surface (20b) of the first resin layer (20); and the cross-sectional area (S31) of the first connection terminal (31) is smaller than the cross-sectional area (S33) of the second connection terminal (33) in a direction orthogonal to the thickness direction.

Description

Circuit Module

[0001] The present invention relates to a circuit module.

[0002] 2. Description of the Related Art Components mounted in electronic devices include circuit modules in which electronic components are mounted on a substrate such as an LTCC substrate and sealed with resin.

[0003] When mounting a circuit module having electronic components mounted on both sides of the substrate on another substrate (mounting substrate) such as a motherboard, electrodes (external connection terminals or connection terminals) that penetrate the resin layer in the thickness direction are required to connect the circuit module substrate to the mounting substrate.

[0004] For example, Patent Document 1 discloses a circuit module including a substrate having a first electrode and a second electrode provided on one main surface thereof, a first electronic component connected to the first electrode, and a first resin layer provided on one main surface of the substrate, in which the second electrode is composed of a second electrode base connected to the substrate, a metal pillar made of sintered metal powder and having one end directly connected to the second electrode base and the other end located inside the outer surface of the first resin layer, a plating layer covering the second electrode base and the side surfaces of the metal pillar, and a covering portion having one main surface connected to the other end of the metal pillar and the plating layer and the other main surface located outside the outer surface of the first resin layer.

[0005] Patent No. 6791352

[0006] In recent years, there has been an increasing demand for miniaturization and high reliability of electronic components. However, due to miniaturization, cracks are more likely to occur at the interface between the metal posts and the substrate due to thermal cycles and impacts when the housing is dropped.

[0007] Patent Document 1 discloses that a plating film is provided at the interface between the metal post, which is the connection terminal, and the resin layer to improve adhesion between the metal post and the resin layer, but does not disclose anything about suppressing cracks that occur between the substrate and metal post that constitute the circuit module.

[0008] Generally, in heterogeneous joints such as those between a ceramic substrate and a metal pillar, it is possible to suppress thermal stress by reducing the size of the metal pillar, which has a large thermal expansion coefficient. However, the area, shape, position, etc. of the connection terminal (metal pillar) on the mounting surface are determined by the specifications of the mounting destination (customer).

[0009] The mounting specifications include the position and shape of the connection terminals for the circuit module on the mounting board on which the circuit module is mounted. When mounting the circuit module on the mounting board, the position and shape of the metal posts that connect to the mounting board must match the position and shape of the connection terminals on the mounting board. Therefore, once the area, shape, position, etc. of the connection terminals (metal posts) have been determined as the mounting specifications, they cannot be changed for the circuit module's convenience in order to improve thermal cycle characteristics or connection reliability.

[0010] For these reasons, there has been a demand for improved thermal cycle characteristics and connection reliability without being affected by the specifications of the mounting destination.

[0011] The present invention has been made to solve the above problems, and aims to provide a circuit module that can improve thermal cycle characteristics and connection reliability without being affected by the specifications of the mounting destination.

[0012] The circuit module of the present invention is a circuit module comprising: a substrate having one main surface and another main surface; a first resin layer disposed on the one main surface side of the substrate, the first resin layer having a first main surface on the substrate side and a second main surface opposite the substrate; and a connection terminal disposed within the first resin layer, wherein a first electrode is provided on the one main surface of the substrate, and the connection terminal has a first connection terminal connected to the first electrode, and a second connection terminal connected to the first connection terminal and exposed on the second main surface of the first resin layer, and wherein the cross-sectional area of ​​the first connection terminal is smaller than the cross-sectional area of ​​the second connection terminal in a direction perpendicular to the thickness direction.

[0013] According to the present invention, it is possible to improve the thermal cycle characteristics and connection reliability without being affected by the specifications of the mounting destination.

[0014] Fig. 1 is a top view schematically showing an example of a circuit module according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line A-A in Fig. 1. Fig. 3A is an enlarged view of a connection terminal portion of the circuit module shown in Fig. 2. Fig. 3B is an enlarged view of a connection terminal portion of the circuit module shown in Fig. 3A. ２ 3C is a cross-sectional view of the second connection terminal at the location indicated by the dashed line L in FIG. １FIG. 4 is a cross-sectional view of a first connection terminal at a location indicated by a solid line. FIG. 4 is a cross-sectional view schematically showing an example of a circuit module according to a second embodiment of the present invention. FIG. 5 is a cross-sectional view schematically showing an example of a circuit module according to a third embodiment of the present invention. FIG. 6 is a cross-sectional view schematically showing an example of a circuit module according to a fourth embodiment of the present invention. FIG. 7 is a top view schematically showing an example of a circuit module according to a fifth embodiment of the present invention. FIG. 8 is a top view schematically showing an example of a circuit module according to a sixth embodiment of the present invention. FIG. 9 is a top view schematically showing an example of a circuit module according to a seventh embodiment of the present invention. FIG. 10 is a cross-sectional view schematically showing an example of a constraining layer sheet used in manufacturing a circuit module. FIG. 11 is a cross-sectional view schematically showing a step of printing a conductive paste on the surface of the constraining layer sheet shown in FIG. 10. FIG. 12 is a cross-sectional view schematically showing a step of forming through holes in the surface of the constraining layer sheet shown in FIG. 10. FIG. 13 is a cross-sectional view schematically showing a step of filling the through holes in the constraining layer sheet shown in FIG. 12 with a conductive paste. FIG. 14 is a cross-sectional view schematically showing a step of forming through holes in the surface of the constraining layer sheet shown in FIG. 10 . FIG. 15 is a cross-sectional view schematically showing a step of filling the through holes in the constraining layer sheet shown in FIG. 14 with a conductive paste. FIG. 16 is a cross-sectional view schematically showing an example of a ceramic green sheet used in manufacturing a circuit module. FIG. 17 is a cross-sectional view schematically showing a step of printing a conductive paste on the surface of the ceramic green sheet shown in FIG. 16 . FIG. 18 is a cross-sectional view schematically showing a step of forming through holes in the surface of the ceramic green sheet shown in FIG. 16 . FIG. 19 is a cross-sectional view schematically showing a step of filling the through holes in the ceramic green sheet shown in FIG. 18 with a conductive paste. FIG. 20 is a cross-sectional view schematically showing a step of printing a conductive paste on the surface of the ceramic green sheet shown in FIG. 19 . FIG. 21 is a cross-sectional view schematically showing a step of further printing a conductive paste on the surface of the ceramic green sheet shown in FIG. 20 . FIG. 22 is a view schematically showing an example of a step of stacking prepared laminate sheets. Fig. 23 is a diagram schematically illustrating an example of a step of pressing a laminate, and Fig. 24 is a diagram schematically illustrating an example of a step of firing the pressed body.FIG. 25 is a diagram schematically showing an example of a step of removing a constraining layer. FIG. 26 is a diagram schematically showing an example of a step of forming a plating film on a substrate 10. FIG. 27 is a diagram schematically showing an example of a step of mounting an electronic component on one main surface of a substrate. FIG. 28 is a cross-sectional view schematically showing an example of a step of encapsulating an electronic component. FIG. 29 is a cross-sectional view schematically showing an example of a step of grinding the surface of the encapsulating resin. FIG. 30 is a cross-sectional view schematically showing a step of forming a plating film on the surface of a connection terminal. FIG. 31 is a cross-sectional view schematically showing a step of mounting an electronic board on the other main surface of a substrate. FIG. 32 is a cross-sectional view schematically showing an example of a step of encapsulating an electronic component. FIG. 33 is a cross-sectional view schematically showing an example of a step of grinding the surface of the encapsulating resin. FIG. 34 is a cross-sectional view schematically showing another example of a step of forming a through hole in the surface of the constraining layer sheet shown in FIG. 10. FIG. 35 is a cross-sectional view schematically showing an example of a step of filling the through hole in the constraining layer sheet shown in FIG. 34 with ceramic paste. FIG. 36 is a cross-sectional view schematically showing an example of a step of forming through holes in the filled ceramic paste shown in FIG. 35 . FIG. 37 is a cross-sectional view schematically showing an example of a step of filling the through holes in the ceramic paste shown in FIG. 36 with a conductive paste. FIG. 38 is a diagram schematically showing another example of a step of stacking prepared laminate sheets. FIG. 39 is a cross-sectional view schematically showing yet another example of a step of forming through holes in the surface of the constraining layer sheet shown in FIG. 10 . FIG. 40 is a cross-sectional view schematically showing another example of a step of filling the through holes in the constraining layer sheet shown in FIG. 39 with a ceramic paste. FIG. 41 is a cross-sectional view schematically showing another example of a step of forming through holes in the filled ceramic paste shown in FIG. 40 . FIG. 42 is a cross-sectional view schematically showing another example of a step of filling the through holes in the ceramic paste shown in FIG. 41 with a conductive paste. FIG. 43 is a diagram schematically showing yet another example of a step of stacking prepared laminate sheets. FIG. 44 is a diagram showing the results of Simulation 2. FIG. 45 is a diagram showing the results (maximum principal stress) of Simulation 3.

[0015] The circuit module of the present invention will be described below. However, the present invention is not limited to the following configuration, and can be modified as appropriate within the scope of the present invention. Note that a combination of two or more of the individual desirable configurations of the present invention described below also constitutes the present invention.

[0016] The drawings shown below are schematic diagrams, and the dimensions, aspect ratios, and other scales may differ from those of the actual product.

[0017] [Circuit Module] <First Embodiment> A circuit module according to a first embodiment of the present invention is a circuit module including: a substrate having one main surface and another main surface; a first resin layer disposed on the one main surface side of the substrate, the first resin layer having a first main surface on the substrate side and a second main surface opposite to the substrate; and connection terminals disposed in the first resin layer, wherein a first electrode is provided on the one main surface of the substrate, and the connection terminals include a first connection terminal connected to the first electrode, and a second connection terminal connected to the first connection terminal and exposed on the second main surface of the first resin layer, and wherein a cross-sectional area of ​​the first connection terminal is smaller than a cross-sectional area of ​​the second connection terminal in a direction perpendicular to a thickness direction.

[0018] Fig. 1 is a top view schematically showing an example of a circuit module according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line A-A in Fig. 1. As shown in Figs. 1 and 2, the circuit module 1 includes a substrate 10, a first resin layer 20, and connection terminals 30, with electronic components 40 and connection terminals 30 exposed on the main surface of the first resin layer 20 opposite the substrate 10.

[0019] As shown in Figure 2, the substrate 10 has one main surface 10a and the other main surface 10b, and has a first electrode 11 and a second electrode 13 provided on the one main surface 10a, via conductors 15 and wiring 17 provided inside, and a third electrode 19 provided on the other main surface 10b.

[0020] The first resin layer 20 is disposed on one main surface 10a of the substrate 10, and the one main surface 10a of the substrate 10 is covered with a sealing resin 26. The first resin layer 20 has a first main surface 20a on the substrate 10 side and a second main surface 20b on the opposite side to the substrate 10.

[0021] An electronic component 40 is mounted on one main surface 10a of the substrate 10. The electronic component 40 is connected to the second electrode 13 via solder 50. It can be said that the electronic component 40 is disposed in the first resin layer 20. A plating film 23 may be formed on the surface of the second electrode 13, as shown in FIG. 2 .

[0022] The connection terminal 30 is disposed on one main surface 10a of the substrate 10. One end of the connection terminal 30 is connected to the first electrode 11, and the other end is exposed on the second main surface 20b of the first resin layer 20. The shape of the connection terminal 30 is a columnar shape extending in the thickness direction of the substrate 10 (the vertical direction on the paper).

[0023] 3A is an enlarged view of the connection terminal portion of the circuit module shown in FIG. ２ 3C is a cross-sectional view of the second connection terminal taken along the dashed line L in FIG. １ 10 is a cross-sectional view of the first connection terminal at the location indicated by the arrow.

[0024] 3A, the connection terminal 30 includes a first connection terminal 31 connected to the first electrode 11 and a second connection terminal 33 exposed on the second main surface 20b of the first resin layer. ２ is the height h of the second connection terminal 33 ３３ is a line that bisects the dashed line L １ is the height h of the first connection terminal 31 ３１ is a line that divides the

[0025] The height of the first and second connection terminals is the height of the connection terminal at the center in the width direction on a cross section cut along the thickness direction at a position overlapping the center of gravity of each connection terminal.

[0026] As shown in FIG. 3B, the shape of the second connection terminal 33 when viewed from above is such that the diameter R ３３The cross-sectional area of ​​the second connection terminal 33 is S in FIG. ３３ As shown in FIG. 3C , the shape of the first connection terminal 31 when viewed from above is such that the diameter is R ３１ The cross-sectional area of ​​the first connection terminal 31 is S in FIG. ３１ is the area of ​​the part indicated by

[0027] As shown in FIGS. 3A, 3B, and 3C, the cross-sectional area S ３１ is the cross-sectional area S of the second connection terminal 33 ３３ The diameter R of the first connection terminal 31 is smaller than ３１ is the diameter R of the second connection terminal 33 ３３ is smaller than.

[0028] 3A , 3B, and 3C , when the connection terminal 30 is composed of a first connection terminal 31 having a relatively small cross-sectional area and a second connection terminal 33 having a relatively large cross-sectional area, it is possible to adjust the position and size of the second connection terminal to the specifications of the mounting destination, while suppressing thermal stress by reducing the volume of the first connection terminal 31. In other words, by dividing the connection terminal into the first connection terminal 31 connected to the first electrode 11 and the second connection terminal 33 exposed on the second main surface 20 b of the first resin layer 20, it is possible to suppress thermal stress by the first connection terminal 31 while conforming to the specifications of the mounting destination with the second connection terminal 33, thereby improving the thermal cycle characteristics and connection reliability of the circuit module without being affected by the specifications of the mounting destination.

[0029] 3A is covered with plating film 23, the side surface of connection terminal 30 does not have to be covered with plating film. The surface of connection terminal 30 exposed on the second main surface 20b of first resin layer 20 shown in FIG. 3A is not covered with plating film, but may be covered with plating film. This plating film may be a plating film provided integrally with the side surface of connection terminal 30, or may be a different plating film.

[0030] (Substrate) The substrate has one main surface and the other main surface.

[0031] The substrate is formed by laminating multiple insulating layers on which conductor patterns that form circuits are arranged, such as electrodes exposed on one or the other main surface of the substrate, and wiring and via conductors arranged inside the substrate.

[0032] A first electrode is provided on one main surface of the substrate, and the first electrode is an electrode to be connected to the connection terminal.

[0033] A second electrode may be provided on one main surface of the substrate. The second electrode is, for example, an electrode to be connected to an electronic component.

[0034] A third electrode may be provided on the other main surface of the substrate. The third electrode is an electrode to be connected to, for example, an electronic component.

[0035] Examples of electronic components include multilayer capacitors, multilayer inductors, filters, and ICs.

[0036] The ceramic material that constitutes the insulating layer includes a low temperature co-fired ceramic (LTCC) material.

[0037] Low-temperature co-fired ceramic materials are ceramic materials that can be fired at temperatures of 1000°C or less and can be co-fired with Au, Ag, Cu, etc., which have low resistivity. Specific examples of low-temperature co-fired ceramic materials include glass composite low-temperature co-fired ceramic materials obtained by mixing ceramic powders such as alumina, zirconia, magnesia, and forsterite with borosilicate glass; ZnO-MgO-Al ２ O ３ -SiO ２ Glass-ceramic low-temperature fired ceramic material using BaO-Al ２ O ３ -SiO ２ Ceramic powder and Al ２ O ３ -CaO-SiO ２ -MgO-B ２ O ３ Examples of suitable ceramic materials include non-glass-based low-temperature fired ceramic materials using ceramic powders.

[0038] The conductive material constituting the conductor pattern may be any material that can be co-fired with the low-temperature co-fired ceramic material, such as Cu, Ag, Au, and alloys thereof.

[0039] (First Resin Layer) The first resin layer is disposed on one main surface side of the substrate and is covered with a sealing resin.

[0040] The first resin layer has a first main surface on the substrate side and a second main surface on the opposite side to the substrate.

[0041] The sealing resin constituting the first resin layer may be either a thermosetting resin or a thermoplastic resin. Examples of thermosetting resins include phenolic resin, epoxy resin, polyester resin, silicone resin, and polyimide resin. Examples of thermoplastic resins include thermoplastic liquid crystal polymer (LCP), thermoplastic polyimide resin, polyether ether ketone resin (PEEK), and polyphenylene sulfide resin (PPS).

[0042] The sealing resin constituting the first resin layer may contain additives such as fillers, for example, glass, silica, aluminum oxide, aluminum nitride, and boron nitride.

[0043] (Connection Terminal) The connection terminal is disposed in the first resin layer. The shape of the connection terminal is not particularly limited, but it is preferable that the connection terminal has a columnar shape extending in the thickness direction of the first resin layer. The columnar connection terminal is also called a metal column.

[0044] The connection terminal is directly connected to the first electrode at one end, and no plating film, solder, or the like is interposed between the connection terminal and the first electrode.

[0045] The connection terminal extends along the thickness direction of the substrate, and the other end is exposed on the second main surface of the first resin layer.

[0046] The height of the connection terminals can be adjusted appropriately to match the height of the electronic components mounted on one main surface of the substrate, and can be, for example, 30 μm or more and 150 μm or less.

[0047] The connection terminals include a first connection terminal connected to the first electrode and a second connection terminal connected to the first connection terminal and exposed on the second main surface of the first resin layer, i.e., the first connection terminal is the connection terminal located closest to the substrate, and the second connection terminal is connected to the first connection terminal and located farthest from the substrate.

[0048] The first connection terminal and the second connection terminal may have any shape as long as they are columnar, and may be, for example, cylindrical or approximately cylindrical, or may be polygonal. The columnar first connection terminal is also referred to as a first metal pillar, and the columnar second connection terminal is also referred to as a second metal pillar.

[0049] The first connection terminal and / or the second connection terminal may have a tapered shape.

[0050] The cross-sectional area of ​​the first connection terminal is smaller than the cross-sectional area of ​​the second connection terminal, and the cross-sectional areas of the first connection terminal and the second connection terminal are determined at a position that divides the first connection terminal or the second connection terminal into two equal parts in the thickness direction.

[0051] Examples of materials that form the first connection terminal and the second connection terminal include Cu, Ag, Au, and alloys thereof. It is preferable that the materials that form the first connection terminal and the second connection terminal are the same.

[0052] The cross-sectional area of ​​the first connection terminal is preferably 56% or less of the cross-sectional area of ​​the second connection terminal, and is preferably 9% or more of the cross-sectional area of ​​the second connection terminal.

[0053] When the first connection terminal and the second connection terminal are cylindrical or approximately cylindrical, the diameter of the first connection terminal (first metal pillar) is preferably 75% or less of the diameter of the second connection terminal (second metal pillar). By making the diameter of the first metal pillar 75% or less of the diameter of the second metal pillar, stress on the circuit module can be reduced. Furthermore, the diameter of the first metal pillar is preferably 30% or more of the diameter of the second metal pillar. If the diameter of the first metal pillar is less than 30% of the diameter of the second metal pillar, the electrical resistance of the metal pillar may become high.

[0054] The height of the first connection terminal is preferably 25% or more and 100% or less of the height of the second connection terminal.

[0055] The volume of the first connection terminal is preferably 10% or more of the volume of the second connection terminal, and is preferably 75% or less of the volume of the second connection terminal.

[0056] The cross-sectional area of ​​the second connection terminal is 25000 μm ２ More than 50000 μm ２ It is preferable that:

[0057] The diameter of the second connection terminal is preferably 150 μm or more and 250 μm or less, and more preferably 180 μm or more and 250 μm or less.

[0058] The height of the second connection terminal is preferably 10 μm or more and 100 μm or less.

[0059] The cross-sectional area of ​​the first connection terminal is 2800 μm ２ Above, 20200μm ２ It is preferable that:

[0060] The diameter of the first connection terminal is preferably 60 μm or more and 160 μm or less.

[0061] The height of the first connection terminal is preferably 10 μm or more and 100 μm or less, and more preferably 10 μm or more and 80 μm or less.

[0062] The connection terminal may be composed of only the first and second connection terminals, or may further include a third connection terminal disposed between the first and second connection terminals. In this case, the second connection terminal is connected to the first connection terminal via the third connection terminal. The cross-sectional area of ​​the third connection terminal is preferably larger than that of the first connection terminal and smaller than that of the second connection terminal.

[0063] Second Embodiment The connecting terminals may have a portion or all of their side surfaces covered with a ceramic material. For example, the side surfaces of the first connecting terminal, the second connecting terminal, or both the first and second connecting terminals may be covered with a ceramic material. Covering the side surfaces of the connecting terminals with a ceramic material improves the mechanical strength of the connecting terminals. Furthermore, since there is no need to form a plating film on the portions of the side surfaces of the connecting terminals covered with the ceramic material, the amount of metal used can be reduced. The side surfaces of the connecting terminals refer to the outer surfaces of the external shapes of the connecting terminals when the connecting terminals are viewed in a plane perpendicular to the thickness direction of the first resin layer, which is the direction in which the connecting terminals extend.

[0064] In the circuit module according to the second embodiment of the present invention, the side surfaces of the first connection terminals are covered with a ceramic material. Furthermore, no plating film is formed on the side surfaces of the first connection terminals. Covering the side surfaces of the first connection terminals with a ceramic material improves the strength of the connection terminals. Furthermore, the ceramic material suppresses thermal expansion of the first connection terminals. As a result, the thermal temperature cycle characteristics and connection reliability are further improved. Furthermore, the amount of metal used can be reduced by the amount of plating film not formed on the side surfaces of the first connection terminals. Additionally, since the connection terminals are sintered while being surrounded by a ceramic material, shrinkage is suppressed, making it less likely for internal stress to occur in the substrate body.

[0065] 4 is a cross-sectional view schematically illustrating an example of a circuit module according to a second embodiment of the present invention. In the circuit module 2 shown in FIG. 4, a side surface 31 c of a first connection terminal 31 constituting a connection terminal 30 is covered with a ceramic material 35.

[0066] Third Embodiment In a circuit module according to a third embodiment of the present invention, both the side surfaces of the first and second connection terminals are covered with a ceramic material. Furthermore, no plating film is formed on the side surfaces of the first and second connection terminals. Covering both the side surfaces of the first and second connection terminals with a ceramic material can further improve the mechanical strength of the connection terminals compared to when only the side surface of the first or second connection terminal is covered with a ceramic material. Furthermore, since it is not necessary to cover both the side surfaces of the first and second connection terminals with a plating film, the amount of metal used can be further reduced compared to when only the side surface of the first or second connection terminal is covered with a ceramic material. Furthermore, covering both the side surfaces of the first and second connection terminals with a ceramic material means that the side surfaces of the connection terminals are covered with an insulating material, thereby reducing the risk of short-circuiting between the connection terminals and mounted components or wiring, even when the connection terminals are located close to each other.

[0067] 5 is a cross-sectional view schematically illustrating an example of a circuit module according to a third embodiment of the present invention. In the circuit module 3 shown in FIG. 5, both side surfaces 31 c of the first connection terminal 31 and side surfaces 33 c of the second connection terminal 33 that constitute the connection terminal 30 are covered with a ceramic material 35.

[0068] The ceramic material covering the side surfaces of the connection terminals is preferably a low-temperature co-fired ceramic (LTCC) material. The ceramic material covering the side surfaces of the first connection terminal and the second connection terminal may be the same or different. The ceramic material covering the side surfaces of the first connection terminal and the second connection terminal may be the same as the ceramic material constituting the substrate.

[0069] <Fourth embodiment> (Second resin layer) A second resin layer may be further disposed on the other main surface of the substrate. An electronic component may be disposed in the second resin layer. When an electronic component is disposed in the second resin layer, the electronic component is preferably connected to a third electrode disposed on the other main surface of the substrate via solder. In this case, the electronic component can be said to be mounted on the other main surface of the substrate.

[0070] The types of sealing resin and filler constituting the second resin layer may be the same as or different from those of the first resin layer.

[0071] The circuit module according to the fourth embodiment of the present invention further includes a second resin layer.

[0072] Fig. 6 is a cross-sectional view schematically illustrating an example of a circuit module according to a fourth embodiment of the present invention. The circuit module 4 illustrated in Fig. 6 is upside down compared to the circuit modules illustrated in Figs. 2, 4, and 5. The circuit module 4 illustrated in Fig. 6 includes a substrate 10, a first resin layer 20, connection terminals 30, and a second resin layer 60.

[0073] The configurations of the substrate 10, the first resin layer 20, and the connection terminals 30 are the same as those of the circuit module 1 shown in FIG.

[0074] A second resin layer 60 is disposed on the other main surface 10b side of the substrate 10, and the other main surface 10b of the substrate 10 is covered with a sealing resin 63. Electronic components 41 and 42 are disposed in the second resin layer 60. The electronic components 41 and 42 are mounted on the other main surface 10b of the substrate 10. Specifically, the electronic components 41 and 42 are connected to third electrodes 19 via solder 50, respectively.

[0075] (Shielding Film) A shielding film may be provided on the surface (top surface) and side surfaces of the second resin layer opposite the substrate, and on the side surfaces of the substrate. The shielding film can be formed by, for example, sputtering. In addition to sputtering, the shielding film can also be formed by existing methods such as coating of a conductive resin, plating, and vapor deposition.

[0076] In this case, it is preferable that a ground electrode is provided so as to be exposed on the side surface of the substrate, and that the ground electrode is connected to the shielding film.

[0077] The shielding film may extend to the side surface of the first resin layer.

[0078] Fifth Embodiment A circuit module may have a plurality of connection terminals. The circuit module 1 shown in FIG.

[0079] When viewed in the thickness direction, the center of gravity of the first connection terminal and the center of gravity of the second connection terminal may be aligned or deviated from each other.

[0080] For the connection terminals arranged closest to the corners of the circuit module, it is preferable that the center of gravity of the first connection terminal is arranged closer to the center of gravity of the circuit module than the center of gravity of the second connection terminal.

[0081] The center of gravity of the first connection terminal is the center of gravity of a plan view determined based on the outer shape of the first connection terminal when viewed from the thickness direction. The center of gravity of the second connection terminal is the center of gravity of a plan view determined based on the outer shape of the second connection terminal when viewed from the thickness direction. The center of gravity of the circuit module is the center of gravity of a plan view determined based on the outer shape of the circuit module when viewed from the thickness direction.

[0082] In the circuit module according to the fifth embodiment of the present invention, for the connection terminals arranged closest to the corners of the circuit module, the center of gravity of the first connection terminal is arranged closer to the center of gravity of the circuit module than the center of gravity of the second connection terminal.

[0083] 7 is a top view schematically illustrating an example of a circuit module according to a fifth embodiment of the present invention. When the circuit module 5 is viewed from the first resin layer side in the thickness direction, twelve connection terminals 30A, 30B, and 30C are each visible exposed from the first resin layer, as shown in FIG. 7. The connection terminal 30A is the connection terminal located closest to a corner of the circuit module when viewed from the thickness direction. The connection terminal 30B is the connection terminal located closest to the midpoint of the edge connecting the corners of the circuit module when viewed from the thickness direction. The connection terminal 30C does not fall into any of the above categories and is located between the connection terminals 30A and 30B.

[0084] In the circuit module 5 shown in FIG. 7, when the positions of the centers of gravity of the first connection terminal 31A and the second connection terminal 33A that constitute the connection terminal 30A are examined, the center of gravity G １ The center of gravity G of the second connection terminal 33A constituting the same connection terminal 30A ２ Specifically, the center of gravity G of the first connection terminal 31A constituting the connection terminal 30A does not match. １ is the center of gravity G of the second connection terminal 33A constituting the same connection terminal 30A. ２ In other words, the first connection terminal 31A constituting the connection terminal 30A is located closer to the center of gravity G of the circuit module 5 than the first connection terminal 31A. １ However, the center of gravity G of the second connection terminal 33A constituting the same connection terminal 30A is ２ On the other hand, with respect to the connection terminal 30B, the center of gravity G of the first connection terminal 31B constituting the connection terminal 30B is shifted toward the inside of the circuit module 5. １ The center of gravity G of the second connection terminal 33B constituting the same connection terminal 30B ２ Similarly, for the connection terminal 30C, the center of gravity G of the first connection terminal 31C constituting the connection terminal 30C is the same as １ The center of gravity G of the second connection terminal 33C that constitutes the same connection terminal 30C as ２ When the connection terminals are arranged as described above, the stress applied to the corners of the circuit module can be reduced.

[0085] <Sixth embodiment> For connection terminals arranged at positions closest to the midpoints of sides connecting the corners of a circuit module, it is preferable that the center of gravity of the second connection terminal be arranged at a position closer to the center of gravity of the circuit module than the center of gravity of the first connection terminal.

[0086] In the circuit module of the sixth embodiment of the present invention, for the connection terminals arranged at a position closest to the midpoint of the side connecting the corners of the circuit module, the center of gravity of the second connection terminal is arranged at a position closer to the center of gravity of the circuit module than the center of gravity of the first connection terminal.

[0087] 8 is a top view schematically illustrating an example of a circuit module according to a sixth embodiment of the present invention. When the circuit module 6 is viewed from the first resin layer side in the thickness direction, twelve connection terminals 30A, 30B, and 30C are each visible exposed from the first resin layer 20, as shown in FIG. 8. The connection terminal 30A is the connection terminal located closest to a corner of the circuit module when viewed from the thickness direction. The connection terminal 30B is the connection terminal located closest to the midpoint of the edge connecting the corners of the circuit module when viewed from the thickness direction. The connection terminal 30C does not fall into any of the above categories and is located between the connection terminals 30A and 30B.

[0088] In the circuit module 6 shown in FIG. 8, the center of gravity G of the first connection terminal 31A constituting the connection terminal 30A １ is the center of gravity G of the second connection terminal 33A constituting the same connection terminal 30A. ２ The second connection terminal 33B of the connection terminal 30B is located closer to the center of gravity G of the circuit module 5 than the first connection terminal 33B. ２ is the center of gravity G of the first connection terminal 31B constituting the same connection terminal 30B. １ In other words, the first connection terminal 31A constituting the connection terminal 30A is located closer to the center of gravity G of the circuit module 6 than the first connection terminal 31A. １ However, the center of gravity G of the second connection terminal 33A constituting the same connection terminal 30A is ２ 3B, and the center of gravity G２ However, the center of gravity G of the first connection terminal 31B constituting the same connection terminal 30B １ The connection terminal 30C disposed between the connection terminals 30A and 30B is located closer to the center of gravity G of the first connection terminal 31C constituting the connection terminal 30C. １ The center of gravity G of the second connection terminal 33C that constitutes the same connection terminal 30C as ２ When the connection terminals are arranged as described above, the stress applied to the corners of the circuit module can be further reduced.

[0089] Seventh Embodiment It is preferable that the center of gravity of the first connection terminals be located closer to the center of gravity of the circuit module than the center of gravity of the second connection terminals for all the connection terminals.

[0090] In the circuit module according to the seventh embodiment of the present invention, the centers of gravity of the first connection terminals are arranged closer to the center of gravity of the circuit module than the centers of gravity of the second connection terminals for all of the connection terminals.

[0091] 9 is a top view schematically illustrating an example of a circuit module according to a seventh embodiment of the present invention. When the circuit module 7 shown in FIG. 9 is viewed from above, the centers of gravity G of the first connection terminals 31A, 31B, and 31C of all types of connection terminals 30A, 30B, and 30C are １ are the centers of gravity G of the second connection terminals 33A, 33B, and 33C that constitute the same connection terminals 30A, 30B, and 30C, respectively. ２ It is arranged at a position closer to the center of gravity G of the circuit module than the center of gravity G of the circuit module.

[0092] When the connection terminals are arranged as shown in Figure 9, when the laminate is fired with the circuit modules assembled, stress concentration on the substrate at the boundary between different circuit modules, which can cause cracks, can be suppressed.

[0093] [Method for Manufacturing Circuit Module] Next, an example of a method for manufacturing a circuit module according to the first embodiment of the present invention will be described with reference to the drawings. However, the order of each process, the number of layers, and the configuration of each sheet described below are not limited to the contents of the drawings. Furthermore, each process described below is a method for manufacturing a circuit module in a pre-divided state, but multiple circuit modules may be manufactured in an assembled state and then divided into individual pieces.

[0094] 10 is a cross-sectional view showing a schematic example of a constraining layer sheet used in manufacturing a circuit module. First, as shown in FIG. 10, a constraining layer sheet 130 and a carrier film 90 are laminated together to prepare a laminate. The constraining layer sheet 130 with the carrier film 90 peeled off is also referred to as a laminated sheet 100A.

[0095] The raw material for the constraining layer sheet, a hard-to-sinter ceramic material, is mixed with an organic binder and a plasticizer in any desired amounts to produce a slurry, which is then applied to the surface of a carrier film and formed into a sheet, thereby obtaining a laminate of a constraining layer sheet and a carrier film as shown in Figure 10.

[0096] Examples of the sintering-resistant ceramic material include Al ２ O ３ Examples include powders.

[0097] Fig. 11 is a cross-sectional view schematically showing a step of printing a conductive paste on the surface of the constraining layer sheet shown in Fig. 10. As shown in Fig. 11, a conductive paste 142 is printed on the surface of the constraining layer sheet 130 shown in Fig. 10. This allows a laminate sheet 100B to be obtained in which the conductive paste 142 is printed on the surface of the constraining layer sheet 130.

[0098] The conductive paste can be obtained by dispersing a conductive material, such as copper powder, in an organic binder.

[0099] The conductive paste is printed on the surface of the constraining layer sheet by a known method such as screen printing.

[0100] Fig. 12 is a cross-sectional view schematically showing a process of forming a through hole in the surface of the constraining layer sheet shown in Fig. 10. As shown in Fig. 12, a through hole 180 is formed in the constraining layer sheet 130 shown in Fig. 10. The method of forming the through hole is not particularly limited, and examples include laser irradiation and drilling.

[0101] Fig. 13 is a cross-sectional view schematically showing a step of filling the through holes of the constraining layer sheet shown in Fig. 12 with a conductive paste. Next, as shown in Fig. 13, the through holes 180 are filled with a conductive paste 131. This results in a laminated sheet 100C in which the conductive paste 131 is filled so as to penetrate the constraining layer sheet 130 in the thickness direction. The conductive paste 131 filled in the through holes 180 becomes the first connection terminals by sintering.

[0102] The conductive paste is filled into the through holes by a known method such as screen printing.

[0103] Figure 14 is a cross-sectional view schematically showing a step of forming a through hole in the surface of the constraining layer sheet shown in Figure 10. As shown in Figure 14, a through hole 181 is formed in the constraining layer sheet 130 shown in Figure 10. The size of the through hole 181 formed at this time is larger than the through hole 180 formed in the step shown in Figure 12. The method of forming the through hole is the same as the step shown in Figure 12.

[0104] Fig. 15 is a cross-sectional view schematically showing a step of filling the through holes of the constraining layer sheet shown in Fig. 14 with conductive paste. Next, as shown in Fig. 15, the through holes 181 are filled with conductive paste 133. This results in a laminate sheet 100D in which the conductive paste 133 is filled so as to penetrate the constraining layer sheet 130 in the thickness direction. The conductive paste 133 filled in the through holes 181 becomes the second connection terminals by sintering.

[0105] 16 is a cross-sectional view showing a schematic example of a ceramic green sheet used in manufacturing a circuit module, in which a carrier film 90 and a ceramic green sheet 110 are laminated together as shown in FIG.

[0106] The ceramic green sheet can be obtained by, for example, mixing low-temperature co-fired ceramic material, an organic binder, and a plasticizer in any desired amounts to prepare a slurry, which is then applied to the surface of a carrier film and formed into a sheet, thereby obtaining a laminate of a ceramic green sheet and a carrier film as shown in FIG. 16 .

[0107] Fig. 17 is a cross-sectional view schematically showing a step of printing a conductive paste on the surface of the ceramic green sheet shown in Fig. 16. Subsequently, as shown in Fig. 17, a conductive paste 142 is printed by printing on the surface of the ceramic green sheet 110 shown in Fig. 16. This results in a laminate sheet 100E in which the conductive paste 142 is printed on the surface of the ceramic green sheet 110. Note that in Fig. 22, which will be described later, two types of laminate sheets 100E are used, in which the printed conductive paste 142 is printed at different positions.

[0108] Fig. 18 is a cross-sectional view schematically showing a step of forming a through hole in the surface of the ceramic green sheet shown in Fig. 16. As shown in Fig. 18, a through hole 182 is formed in the ceramic green sheet 110 shown in Fig. 16. The method of forming the through hole is the same as the step shown in Fig. 12.

[0109] Fig. 19 is a cross-sectional view schematically showing a step of filling the through holes of the ceramic green sheet shown in Fig. 18 with a conductive paste. Subsequently, as shown in Fig. 19, the through holes 182 are filled with the conductive paste 140. This results in a laminated sheet 100F in which the conductive paste 140 is filled so as to penetrate the ceramic green sheet 110 in the thickness direction.

[0110] Fig. 20 is a cross-sectional view schematically showing a step of printing a conductive paste on the surface of the ceramic green sheet shown in Fig. 19. Subsequently, as shown in Fig. 20, a conductive paste 142 is printed on the surface of the ceramic green sheet 110. As a result, the conductive paste 140 is filled so as to penetrate the ceramic green sheet 110 in the thickness direction, and a laminate sheet 100G is obtained in which the conductive paste 142 is printed on the surface so as to contact the conductive paste 140 filled in the through holes.

[0111] 21 is a cross-sectional view schematically illustrating a step of printing a conductive paste on the surface of the ceramic green sheet shown in FIG. 19 . As shown in FIG. 21 , a conductive paste 142 is printed on the surface of the ceramic green sheet 110 shown in FIG. 19 . As a result, the conductive paste 140 is filled so as to penetrate the ceramic green sheet 110 in the thickness direction, and a laminated sheet 100H is obtained having conductive paste 142 printed so as to contact the conductive paste 140 filled in the through holes and conductive paste 142 printed so as not to contact the conductive paste 140 filled in the through holes. Note that a portion of the conductive paste 142 printed on the surface of the ceramic green sheet 110 in FIG. 21 overlaps with the conductive paste 142 printed on the surface of the ceramic green sheet 110 in FIG. 20 .

[0112] 22 is a diagram schematically illustrating an example of a process for stacking prepared laminate sheets. As shown in FIG. 22, laminate sheets 100A to 100H prepared in the above process are stacked in a predetermined order. In FIG. 22, from the top, laminate sheet 100D, laminate sheet 100C, laminate sheet 100H, laminate sheet 100E, laminate sheet 100G, laminate sheet 100B, and laminate sheet 100A are stacked in this order to form laminate body 200.

[0113] 23 is a diagram schematically illustrating an example of a process for compressing a laminate 200. As shown in FIG. 23, a compressed body 210 is obtained by compressing the laminate 200.

[0114] The pressure and temperature when the laminate is pressed together can be set arbitrarily according to the design.

[0115] 24 is a diagram schematically illustrating an example of a process for firing a pressure-bonded body. As shown in FIG. 24 , firing a pressure-bonded body 210 sinters the conductive paste filled in the through holes and the printed conductive paste, and the sintering of the ceramic green sheets progresses, resulting in a fired body 220. At this time, the ceramic green sheets are sintered to form a substrate 10, and the conductive paste filled in the constraining layer sheets is sintered to form a first connection terminal 31 and a second connection terminal 33. Furthermore, the conductive paste filled or printed on the ceramic green sheets is sintered to form a first electrode 11, a second electrode 13, a via conductor 15, wiring 17, and a third electrode 19.

[0116] The firing can be performed using a firing furnace such as a batch furnace, a belt furnace, etc. The firing temperature is not particularly limited, but is preferably 800°C or higher and 1000°C or lower.

[0117] 25 is a diagram schematically illustrating an example of a step of removing the constraining layer. Next, as shown in FIG. 25, the constraining layer (residue of the constraining layer sheet) 190 is removed by cleaning. By removing the constraining layer, the substrate 10 (object to be cleaned 230) is obtained, in which the connection terminals 30 consisting of the first connection terminal 31 and the second connection terminal 33 are exposed on one main surface 10a.

[0118] The method for removing the constraining layer is not particularly limited, but a known method such as sandblasting can be used.

[0119] 26 is a diagram schematically illustrating an example of a process for forming a plating film on the substrate 10. Next, as shown in Fig. 26, a plating film 23 is formed on the surface of the substrate 10. As a result, the plating film 23 is formed on the side surface of the first connection terminal 31, the side surface and upper surface of the second connection terminal 33, the surface of the second electrode 13, and the surface of the third electrode 19.

[0120] 27 is a diagram schematically illustrating an example of a process for mounting an electronic component on one main surface of a substrate. Subsequently, as shown in FIG. 27 , electronic component 40 is mounted on one main surface 10 a of substrate 10 using second electrodes 13. Solder 50 is provided between second electrodes 13 and electronic component 40.

[0121] 28 is a cross-sectional view schematically showing an example of a step of encapsulating an electronic component. Subsequently, as shown in FIG. 28, encapsulation resin 26 is applied onto one main surface 10a of the substrate. As a result, electronic component 40 is encapsulated by encapsulation resin 26.

[0122] Fig. 29 is a cross-sectional view schematically showing one example of a step of grinding the surface of the sealing resin. Next, as shown in Fig. 29, the surface of the sealing resin 26 is ground to expose the connection terminals 30. In Fig. 29, the top surface of the electronic component 40 is also exposed, but the top surface of the electronic component 40 does not have to be exposed. Through the above steps, the circuit module 1 according to the first embodiment of the present invention described in Fig. 2 is obtained.

[0123] In the above, the ceramic green sheets and the constraining layer sheets are each formed on a carrier film, and then peeled from the carrier film and laminated together. However, instead of the above method, for example, a method may be adopted in which a ceramic green sheet is formed on the surface of a carrier film, and then a constraining layer sheet is formed on the surface of the ceramic green sheet. The method for forming the constraining layer sheet on the surface of the carrier film can be the same as the method for forming the constraining layer sheet on the surface of the carrier film.

[0124] The circuit module according to the fourth embodiment of the present invention can be manufactured by adding the steps shown in FIGS. 30 to 33 to the steps shown in FIGS. 10 to 29 above.

[0125] Fig. 30 is a cross-sectional view schematically showing a step of forming a plating film on the surface of the connection terminal. Subsequently, as shown in Fig. 30, a plating film 24 may be formed on the surface of the connection terminal 30. The plating film 24 can be formed, for example, by performing a plating process on the circuit module shown in Fig. 29. The plating film may be formed of, for example, Ni and / or Sn.

[0126] Figure 31 is a cross-sectional view schematically showing a process of mounting an electronic board on the other main surface of the substrate. Next, as shown in Figure 31, electronic components 41 and 42 are mounted on the other main surface 10b of the substrate 10. Figures 31 to 33 below are shown upside down with respect to Figure 30. Electronic components 41 and 42 are each connected to third electrodes 19 provided on the other main surface 10b of the substrate 10 via solder 50.

[0127] 32 is a cross-sectional view schematically showing an example of a process for sealing the electronic components. Next, as shown in FIG. 32, sealing resin 63 is applied onto the other main surface 10b of substrate 10. As a result, electronic components 41 and 42 are sealed with sealing resin 63.

[0128] 33 is a cross-sectional view schematically showing an example of a step of grinding the surface of the sealing resin. Next, as shown in Fig. 33, the surface of the sealing resin 63 is ground to adjust the shape of the second resin layer 60. Through the above steps, the circuit module 4 according to the fourth embodiment of the present invention described in Fig. 6 is obtained.

[0129] In addition to the above steps, a step of forming a shielding film on the upper surface and side surfaces of the second resin layer 60 and the side surfaces of the substrate 10 may be performed.

[0130] Next, another method for manufacturing the circuit module of the present invention will be described. For example, the circuit module according to the second embodiment of the present invention can be obtained by replacing the laminate sheet 100C with a laminate sheet 100I in the manufacturing process described with reference to Figures 10 to 29. The method for manufacturing the laminate sheet 100I will be described with reference to Figures 34 to 37.

[0131] Figure 34 is a cross-sectional view schematically showing another example of the process of forming a through hole in the surface of the constraining layer sheet shown in Figure 10. As shown in Figure 34, a through hole 183 is formed in the surface of the constraining layer sheet 130 shown in Figure 10. The size of the through hole 183 formed here is one size larger than the size of the through hole 180 formed in Figure 12.

[0132] Fig. 35 is a cross-sectional view that schematically shows an example of a step of filling ceramic paste into the through holes of the constraining layer sheet shown in Fig. 34. Subsequently, as shown in Fig. 35, ceramic paste 150 is filled into through holes 183.

[0133] Fig. 36 is a cross-sectional view schematically showing one example of a step of forming a through hole in the filled ceramic paste shown in Fig. 35. Subsequently, as shown in Fig. 36, a through hole 184 is formed in the ceramic paste 150. The size of the through hole 184 formed here is the same as the size of the through hole 180 formed in Fig. 12. Furthermore, by forming the through hole 184, a portion of the ceramic paste 150 is removed, leaving the ceramic paste 151.

[0134] Fig. 37 is a cross-sectional view schematically showing an example of a process for filling the through holes of the ceramic paste shown in Fig. 36 with conductive paste. Next, as shown in Fig. 37, the through holes 184 are filled with conductive paste 131. Through the above process, a laminated sheet 100I is obtained in which the side surfaces of the conductive paste 131 in the constraining layer sheet 130 are covered with ceramic paste 151.

[0135] Fig. 38 is a diagram schematically illustrating another example of a process for stacking prepared laminate sheets. In Fig. 38, laminate sheet 100I is used instead of laminate sheet 100C used in the process shown in Fig. 22. As a result, in laminate 200, the side surfaces of conductive paste 131, which will become first connection terminals after firing, are covered with ceramic paste 151. Therefore, by firing the laminate shown in Fig. 38, the circuit module 2 according to the second embodiment of the present invention shown in Fig. 4 is obtained.

[0136] The circuit module according to the third embodiment of the present invention can be obtained by changing the laminate sheet 100C to the laminate sheet 100I and further changing the laminate sheet 100D to the laminate sheet 100J in the manufacturing process described with reference to Figures 10 to 29. A method for manufacturing the laminate sheet 100J will be described with reference to Figures 39 to 42.

[0137] Figure 39 is a cross-sectional view schematically showing yet another example of the process of forming a through hole in the surface of the constraining layer sheet shown in Figure 10. As shown in Figure 39, a through hole 185 is formed in the surface of the constraining layer sheet 130 shown in Figure 10. Note that the size of the through hole 185 formed here is slightly larger than the size of the through hole 181 formed in Figure 14.

[0138] Fig. 40 is a cross-sectional view schematically showing another example of the step of filling the through holes of the constraining layer sheet shown in Fig. 39 with ceramic paste. Subsequently, as shown in Fig. 40, the through holes 185 are filled with ceramic paste 150.

[0139] Fig. 41 is a cross-sectional view schematically showing another example of the step of forming through holes in the filled ceramic paste shown in Fig. 40. Subsequently, as shown in Fig. 41, through holes 186 are formed in ceramic paste 150. The size of through holes 186 formed here is the same as the size of through holes 181 formed in Fig. 14. Furthermore, by forming through holes 186, a portion of ceramic paste 150 is removed, leaving ceramic paste 153.

[0140] Fig. 42 is a cross-sectional view schematically showing another example of the step of filling the through holes of the ceramic paste shown in Fig. 41 with conductive paste. Subsequently, the through holes 186 are filled with conductive paste 133 by the step shown in Fig. 42. By the above steps, a laminated sheet 100J is obtained in which the side surfaces of the conductive paste 133 in the constraining layer sheet 130 are covered with ceramic paste 153.

[0141] Fig. 43 is a diagram schematically illustrating yet another example of a step of stacking prepared laminate sheets. As shown in Fig. 43, by using laminate sheet 100J instead of laminate sheet 100D and laminate sheet 100I instead of laminate sheet 100C in the lamination step shown in Fig. 22, in the laminate body 200, the side surfaces of conductive paste 131, which will become the first connection terminal after firing, and the side surfaces of conductive paste 133, which will become the second connection terminal after firing, are covered with ceramic pastes 151 and 153. Therefore, by firing the laminate body shown in Fig. 43, the circuit module 3 according to the third embodiment of the present invention shown in Fig. 5 is obtained.

[0142] 22, the centers of gravity of the first and second connection terminals can be offset by adjusting the positions of laminated sheet 100C filled with conductive paste 131 that will become the first connection terminals and laminated sheet 100D filled with conductive paste 133 that will become the second connection terminals. This makes it possible to manufacture the circuit modules according to the fifth to seventh embodiments described with reference to FIGS.

[0143] This specification describes the following:

[0144] The present disclosure (1) is a circuit module comprising: a substrate having one main surface and another main surface; a first resin layer disposed on the one main surface side of the substrate, the first resin layer having a first main surface on the substrate side and a second main surface opposite the substrate; and a connection terminal disposed within the first resin layer, wherein a first electrode is provided on the one main surface of the substrate, and the connection terminal has a first connection terminal connected to the first electrode and a second connection terminal connected to the first connection terminal and exposed on the second main surface of the first resin layer, and wherein the cross-sectional area of ​​the first connection terminal is smaller than the cross-sectional area of ​​the second connection terminal in a direction perpendicular to the thickness direction.

[0145] The present disclosure (2) is the circuit module of the present disclosure (1), wherein a side surface of the first connection terminal is covered with a ceramic material.

[0146] The present disclosure (3) is the circuit module of the present disclosure (1) or (2), further comprising a side surface of the second connection terminal covered with a ceramic material.

[0147] The present disclosure (4) is a circuit module having a plurality of the connection terminals, wherein, when viewed from the thickness direction, the center of gravity of the first connection terminal, which is located closest to a corner of the circuit module, is located closer to the center of gravity of the circuit module than the center of gravity of the second connection terminal, and is a circuit module in any combination with any of the present disclosures (1) to (3).

[0148] The present disclosure (5) is a circuit module of the present disclosure (4), further wherein, when viewed from the thickness direction, for a connection terminal arranged at a position closest to the midpoint of an edge connecting the corners of the circuit module, the center of gravity of the second connection terminal is arranged at a position closer to the center of gravity of the circuit module than the center of gravity of the first connection terminal.

[0149] The present disclosure (6) is a circuit module in any combination with any of the present disclosures (1) to (5), wherein the first connection terminal and the second connection terminal are substantially cylindrical in shape, and the diameter of the first connection terminal is 75% or less of the diameter of the second connection terminal.

[0150] EXAMPLES Hereinafter, examples will be given that more specifically disclose the present invention, but the present invention is not limited to these examples.

[0151] [Simulation 1] Condition A was a structure in which the first connection terminal had a diameter of 110 μm and a height of 25 μm, and the second connection terminal had a diameter of 220 μm and a height of 45 μm. Condition B was a structure in which the connection terminals had a constant diameter of 220 μm and a height of 70 μm. The maximum principal stress on the substrate at low temperatures (-40°C) was calculated. The maximum principal stress generated under condition A, which satisfied the requirements for the circuit module of the present invention, was 71.2 MPa, while the maximum principal stress generated under condition B, which did not, was 139.9 MPa. For the simulation, stress analysis (multi-stage thermal load analysis based on 25°C) using Femtet (registered trademark) (ver. 2023.2) manufactured by Murata Software Co., Ltd. was used. This indicates that condition A, which satisfied the requirements for the circuit module of the present invention, reduced the maximum principal stress generated in the substrate at low temperatures (-40°C) by approximately half compared to condition B, which did not.

[0152] [Simulation 2] Using the same method as in Simulation 1, the maximum principal stress generated at a temperature of 85°C was determined for a substrate having connection terminals that combined a second connection terminal with a diameter of 220 μm and a height of 45 μm with a first connection terminal with a diameter of 220 μm and a height of 25 μm. Next, a similar simulation was performed while changing the diameter of the first connection terminal to 190 μm, 160 μm, 110 μm, and 70 μm. The results are shown in Figure 44.

[0153] Fig. 44 shows the results of Simulation 2. The vertical axis in Fig. 44 represents the maximum principal stress value generated when the diameter of the first connection terminal is 220 μm, with 100% representing the value. The results in Fig. 44 show that by setting the diameter of the first connection terminal to approximately 75% or less of the diameter of the second connection terminal (approximately 165 μm or less in terms of diameter), the stress applied to the substrate at high temperatures (85°C) can be reduced by 20% or more.

[0154] [Simulation 3] A circuit module with connection terminals arranged in predetermined positions was assumed, and the stress generated in this was measured in the same manner as in Simulation 1. The stress generated in the substrate at low temperature (-40°C) and high temperature (85°C) under Conditions 1 and 2 below was determined. The results are shown in Fig. 45. Fig. 45 shows the results of Simulation 3 (maximum principal stress).

[0155] <Condition 1> First, a substrate measuring 1,350 μm in the vertical direction and 1,350 μm in the horizontal direction was prepared. On this substrate, three connection terminals were arranged vertically and three horizontally so that the centers of gravity were spaced 450 μm apart in both the vertical and horizontal directions, and no connection terminal was located in the center. The connection terminals consisted of a first connection terminal measuring 25 μm in height and 110 μm in diameter and a second connection terminal measuring 45 μm in height and 220 μm in diameter. For all eight arranged connection terminals, the center of gravity of the first connection terminal and the center of gravity of the second connection terminal, which constitute the same connection terminal, overlapped.

[0156] <Condition 2> For the four connection terminals arranged closest to the four corners of the substrate under condition 1, the positions of the centers of gravity of the first connection terminals were shifted by 40 μm in the direction approaching the center of gravity of the substrate.

[0157] 45, it was found that <Condition 2>, in which the positions of the centers of gravity of the four first connection terminals arranged closest to the four corners of the board are shifted toward the center of gravity of the board, can reduce the value of the maximum principal stress more than <Condition 1>. From this, it is thought that the value of the maximum principal stress generated in the circuit module can be reduced by shifting the positions of the centers of gravity of the four first connection terminals arranged closest to the four corners of the board toward the center of gravity of the board, using the position of the center of gravity of the second connection terminal as a reference.

[0158] REFERENCE SIGNS LIST 1, 2, 3, 4, 5, 6, 7 Circuit module 10 Substrate 10a One main surface of substrate 10b Other main surface of substrate 11 First electrode 13 Second electrode 15 Via conductor 17 Wiring 19 Third electrode 20 First resin layer 20a First main surface of first resin layer 20b Second main surface of first resin layer 23, 24 Plating film 26 Sealing resin 30, 30A, 30B, 30C Connection terminal 31, 31A, 31B, 31C First connection terminal 31c Side surface of first connection terminal 33, 33A, 33B, 33C Second connection terminal 33c Side surface of second connection terminal 35 Ceramic material covering side surface of connection terminal 40, 41, 42 Electronic component 50 Solder 60 Second resin layer 63 Sealing resin 90 Carrier film 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I Laminated sheet 110 Ceramic green sheet 130 Constraining layer sheet 131, 133, 140 Filled conductive paste 142 Printed conductive paste 150, 151, 153 Ceramic paste 180, 181, 182, 183, 184, 185, 186 Through hole 190 Constraining layer (residue of constraining layer sheet) 200 Laminated body 210 Press-bonded body 220 Fired body 230 Body to be cleaned G Center of gravity of substrate G １ Center of gravity of first connection terminal G ２ Center of gravity of second connection terminal h ３１ Height of first connection terminal h ３３ Height of second connection terminal R ３１ Diameter of the first connection terminal R ３３ Diameter of second connection terminal S ３１ Cross-sectional area of ​​the first connection terminal S ３３ Cross-sectional area of ​​the second connection terminal

Claims

1. A circuit module comprising: a substrate having one main surface and another main surface; a first resin layer disposed on the one main surface side of the substrate, the first resin layer having a first main surface on the substrate side and a second main surface opposite the substrate; and a connection terminal disposed within the first resin layer, wherein a first electrode is provided on the one main surface of the substrate, and the connection terminal has a first connection terminal connected to the first electrode, and a second connection terminal connected to the first connection terminal and exposed on the second main surface of the first resin layer, and wherein a cross-sectional area of ​​the first connection terminal in a direction perpendicular to the thickness direction is smaller than a cross-sectional area of ​​the second connection terminal.

2. The circuit module according to claim 1, wherein a side surface of said first connection terminal is covered with a ceramic material.

3. The circuit module according to claim 1 or 2, further comprising a side surface of the second connection terminal covered with a ceramic material.

4. A circuit module comprising a plurality of said connection terminals, wherein, when viewed from the thickness direction, for a connection terminal among the plurality of said connection terminals that is located closest to a corner of the circuit module, the center of gravity of said first connection terminal is located closer to the center of gravity of said circuit module than the center of gravity of said second connection terminal.

5. A circuit module as described in claim 4, further comprising, when viewed from the thickness direction, for a connection terminal that is located closest to the midpoint of a side connecting the corners of the circuit module, the center of gravity of the second connection terminal is located closer to the center of gravity of the circuit module than the center of gravity of the first connection terminal.

6. A circuit module according to any one of claims 1 to 5, wherein the first connection terminal and the second connection terminal are substantially cylindrical in shape, and the diameter of the first connection terminal is 75% or less of the diameter of the second connection terminal.

Images