Substrate manufacturing device

Abstract

A substrate transfer device (3) is provided with: a first arm (63) for taking out a substrate (W) or a workpiece, which is an annular holder (R) holding the substrate, from a cassette or for housing the workpiece in the cassette; and a second arm (64) for taking out the workpiece from a substrate processing device (5) or delivering the workpiece to the substrate processing device (5). The first arm (63) has basic arms (631, 632, 633) having distal ends movable in at least one axial direction, an I-shaped base (6341) rotatably fixed to the distal ends of the basic arms, and a pair of substrate gripping tools (633, 6342) provided at the front end and the rear end of the base and capable of changing the interval. According to the substrate transfer device, when the workpiece is transferred between the cassette and the processing unit, the transfer can be performed without touching the lower surface of the substrate.

Description

Board manufacturing equipment

[0001] The present invention relates to a substrate manufacturing apparatus, and more particularly to a substrate transport apparatus that transports substrates (semiconductor wafers) between a cassette that stores the substrates and a processing unit that performs a predetermined process on the substrates.

[0002] In the manufacturing process of semiconductor devices, substrates (semiconductor wafers) are subjected to various processes such as circuit formation, cleaning, and cutting. For example, cutting processes include detailed processes such as scribing the substrate and breaking the cut substrate along the cuts to separate the substrates. These processes are each performed in a separate substrate processing apparatus (processing unit). When processing is performed in these multiple processing units, a substrate is removed from a cassette containing multiple substrates, transported to the processing unit that will perform the first process, and then transported to the next processing unit. This process is repeated until all processes are completed and the substrate is returned to the cassette. This process is performed sequentially for all substrates in the cassette.

[0003] In such cases, between the cassette and the first processing unit, an operation is performed to remove the substrate from the cassette and send it to the first processing unit. Also, between the previous processing unit (which has performed processing) and the next processing unit (which will perform processing), an operation is performed to remove the substrate from the previous processing unit and send it to the next processing unit. And between the last processing unit (which has performed processing) and the cassette, an operation is performed to remove the substrate from the last processing unit and store it in the cassette.

[0004] In a processing unit, substrates are generally placed on a table, while in a cassette, they are placed on multiple shelves with only both ends supported. Therefore, the manner of the hand holding the cassette is different when removing a substrate from the cassette and when sending the removed substrate to the processing unit. The same is true when removing a substrate from a processing unit and when storing a substrate in a cassette. For this reason, in the past, separate devices were used for removing substrates from a cassette and storing them in the cassette, and for sending the removed substrate to a processing unit and removing it from the processing unit.

[0005] This has the problem of complicating the overall structure of the substrate manufacturing apparatus and increasing the size of the apparatus. To address this problem, a processing apparatus has been developed that performs the operations of loading and unloading substrates into and from a cassette and the operations of loading and unloading substrates into and from a processing unit in a single apparatus (Patent Document 1).

[0006] The processing apparatus described in Patent Document 1 includes a transport device having tweezers as first transfer means for transferring substrates to and from a plurality of cassettes that store substrates, and an arm as second transfer means for transferring substrates to and from a plurality of processing units that perform predetermined processing on the substrates. At least one of the tweezers and the arm is configured to be movable up and down relative to the other in order to transfer substrates between them.

[0007] Each cassette has an open side for inserting and removing substrates, and multiple cassettes are arranged so that their open sides face the same direction. The processing units are arranged facing the cassettes across the transport device or in the same row as the cassettes. The transport device is configured to be movable on a transport path that runs along the direction in which the cassettes and processing units are arranged, so that it can access each cassette and each processing unit. When the processing units are arranged facing the cassettes, the transport device is configured to be rotatable so that it can face either the cassettes or the processing units.

[0008] With this configuration, unprocessed substrates in the cassette are transported to the processing unit via the tweezers and arms of the transport device, and substrates processed in the processing unit are transported and stored in the cassette via the arms and tweezers of the transport device.

[0009] Japanese Patent Application Publication No. 6-127609

[0010] In the processing apparatus described in Patent Document 1, the first transfer means (tweezers) for removing a substrate from a cassette or storing a substrate in a cassette is a rectangular plate having a width that can be inserted into the cassette and is provided with an adsorption mechanism, onto which the substrate (wafer) is adsorbed.

[0011] However, such a transfer means for placing a substrate on the substrate comes into contact with the underside of the substrate, and may not be suitable for some substrates.

[0012] An object of the present invention is to provide a substrate manufacturing apparatus that can transfer a substrate between a cassette and a processing unit without touching the surface of the substrate.

[0013] A first aspect of the substrate manufacturing apparatus according to the present invention, which has been made to solve the above-mentioned problems, comprises a first arm for taking out a workpiece, which is a substrate or an annular holder holding a substrate, from a cassette or storing the workpiece in the cassette, and a second arm for taking out a workpiece from a substrate processing apparatus or sending the workpiece to a substrate processing apparatus, wherein the first arm comprises a substrate transport device having: a basic arm whose tip is movable in at least one axial direction; an I-shaped base rotatably fixed to the tip of the basic arm; and a pair of workpiece grippers provided at the front and rear ends of the base, the distance between which can be changed.

[0014] A second aspect of the substrate manufacturing apparatus according to the present invention comprises a first arm for taking out a workpiece, which is a substrate or a ring-shaped holder holding a substrate, from a cassette or storing the workpiece in the cassette, and a second arm for taking out the workpiece from the substrate processing apparatus or sending the workpiece to the substrate processing apparatus, wherein the first arm comprises a substrate transport device having: a basic arm whose tip is movable in at least one axial direction; and a workpiece gripper attached to the basic arm for gripping an end of the workpiece.

[0015] In the present invention, the phrase "rotatably fixed" to the tip of the basic arm means that the base can rotate relative to the basic arm without coming off the tip of the basic arm.

[0016] In a first aspect of the substrate manufacturing apparatus, a first arm of the substrate transport device removes substrates from a cassette or stores them in a cassette, and a second arm removes substrates from a substrate processing apparatus or sends substrates to a substrate processing apparatus. This first arm has a basic arm whose tip is movable in at least one axial direction, so that when removing a substrate from a cassette, an I-shaped base rotatably fixed to the tip can be inserted into the cassette. After the basic arm inserts the base into the cassette, a pair of substrate grippers provided at the front and rear ends of the base clamp the front and rear sides of the substrate to secure it to the base. The basic arm is then pulled out of the cassette to remove the substrate. The reverse operation is performed when storing a substrate in the cassette.

[0017] In the substrate manufacturing apparatus of the second aspect, when a substrate is removed from a cassette, the basic arm is moved so that its tip moves in the one axial direction, causing the workpiece gripper attached to the basic arm to enter the cassette, and then the workpiece gripper grips an edge of the workpiece. The basic arm is then pulled out of the cassette, removing the substrate from the cassette. When the substrate is to be stored in the cassette, the reverse operation is performed.

[0018] In this manner, in the substrate manufacturing apparatus according to the present invention, when the substrate transport device takes a workpiece out of a cassette or stores a substrate in a cassette, the pair of workpiece grippers mounted on the base grip the substrate by pinching its front and rear ends, or the workpiece grippers mounted on the main arm grip the edge of the substrate, so the substrate transport device does not come into contact with the underside of the substrate, thereby preventing contamination or damage to the substrate.

[0019] The substrate manufacturing apparatus according to the present invention can be configured to include, in addition to the substrate transport device, a cassette table for placing multiple cassettes in an arc shape with the open side of each cassette facing the center, and the substrate transport device is arranged at the center of the cassette table.

[0020] By configuring the substrate manufacturing apparatus according to the present invention in this manner, it is no longer necessary to move the substrate transport device in order to access each cassette.

[0021] The substrate manufacturing apparatus according to the present invention may be configured to include, in addition to the substrate transport device, a mounting table on which multiple cassettes can be placed, and the mounting table is movable so that the open side of each cassette on the mounting table faces the substrate transport device.

[0022] By configuring the substrate manufacturing apparatus according to the present invention in this manner, it is no longer necessary to move the substrate transport device in order to access each cassette.

[0023] The substrate manufacturing apparatus according to the present invention may have an aspect in which the substrate transport device has a traveling device.

[0024] By configuring the substrate manufacturing apparatus according to the present invention in this manner, it becomes possible to send out substrates taken out of a cassette to substrate processing apparatuses placed at various positions.

[0025] In the substrate manufacturing apparatus according to the present invention, the second arm may be of a type that supports at least three points around the periphery of the lower surface of the object to be processed.

[0026] In the substrate manufacturing apparatus according to the present invention, the second arm may be of a type that grips the object to be processed at least at two points around the periphery thereof.

[0027] Alternatively, the second arm may be of a type that holds the object by suction.

[0028] In the substrate manufacturing apparatus according to the present invention, the substrate processing apparatus may include a scribing processing apparatus and a breaking processing apparatus.

[0029] In the substrate manufacturing apparatus of the present invention, the substrate transport device can further include a base and a lifting and lowering rotation shaft made of a rod-shaped member, erected on the base so as to be able to lift and lower and rotate around its axis, and supporting the first arm and the second arm at its upper end.

[0030] By configuring the substrate transport device in the substrate manufacturing apparatus of the present invention in this manner, the height and orientation of the first arm and the second arm can be changed simply by raising and lowering and rotating a single lifting and rotating shaft, thereby simplifying the configuration of the movement mechanism for those arms.

[0031] According to the substrate manufacturing apparatus of the present invention, when transferring a workpiece (substrate or annular holder holding a substrate) between a cassette and a processing unit, the transfer can be carried out without touching the surface of the substrate, thereby preventing contamination or damage to the substrate surface.

[0032] 1 is a schematic configuration diagram showing a first embodiment of a substrate manufacturing apparatus according to the present invention; a perspective view showing a cassette for accommodating substrates; a side view showing a substrate transport device provided in the substrate manufacturing apparatus of the first embodiment; a perspective view showing a first arm of the substrate transport device provided in the substrate manufacturing apparatus of the first embodiment; (a) a diagram showing the operation of the first arm, and (b) a diagram showing a modified example thereof; a perspective view showing a second arm of the substrate transport device provided in the substrate manufacturing apparatus of the first embodiment; and (c) diagrams for explaining the operation of the substrate transport device to remove substrates from a cassette and store substrates in the cassette in the substrate manufacturing apparatus of the first embodiment, showing a state in which the first hand is positioned opposite the cassette (A), a state in which the first hand is inserted into the cassette (B), and a state in which the first hand is retracted from the cassette (C). 1A is a diagram for explaining the operation of the substrate transport device transferring a substrate between the first arm and the second arm, the operation of the substrate transport device sending a substrate to a processing unit, and the operation of the substrate transport device removing a substrate from a processing unit in the substrate manufacturing apparatus of the first embodiment, and shows a state in which the second hand is positioned above the first hand (A); a state in which the second hand is inserted into the processing unit (B); a state in which the substrate is placed on a platform in the processing unit and the second hand is withdrawn from the processing unit (C); a state in which the substrate placed on the platform is sucked onto the second hand and the second hand is withdrawn from the processing unit (D); and a state in which the second hand is inserted into another processing unit (E). A schematic configuration diagram showing a second embodiment of the substrate manufacturing apparatus according to the present invention. A schematic configuration diagram showing a third embodiment of the substrate manufacturing apparatus according to the present invention. A perspective view showing a transport mechanism included in a fourth embodiment of the substrate manufacturing apparatus according to the present invention. A top view showing the first arm etc. (a) and the second arm etc. (b) of the transport mechanism included in the substrate manufacturing apparatus of the fourth embodiment. 10A is a perspective view showing a transport device of a substrate manufacturing apparatus according to a fifth embodiment of the present invention; FIG. 10B is a partially enlarged top view showing the vicinity of the tip of a basic arm including a workpiece gripper in a substrate manufacturing apparatus according to the fifth embodiment; FIG. 10C is a perspective view showing a state in which a substrate is supported by a wafer ring, and FIG. 10B is a perspective view showing a state in which a protective film is attached to the surface of the substrate; FIG. 10D is a top view showing an example in which a plurality of processing units with different functions are arranged in a substrate manufacturing apparatus according to the present invention; FIG. 10E is a perspective view showing another embodiment of a second arm; FIG. 10F is a perspective view showing yet another embodiment of a second arm;

[0033] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0034] 1 is a schematic diagram showing a first embodiment of a substrate manufacturing apparatus according to the present invention. The substrate manufacturing apparatus 100 is mainly composed of an accommodation unit 1 for accommodating substrates W, a treatment unit 2 for performing various treatments on the substrates W, and a transport unit (substrate transport device) 3 for transporting the substrates W between the accommodation unit 1 and the treatment unit 2.

[0035] The accommodation unit 1 includes a plurality of cassettes C, which are containers for accommodating unprocessed or processed substrates W, and a plurality of cassette stands 4 (4a, 4b) on which the cassettes C are placed. FIG. 2 is a perspective view showing the cassette C. The cassette C includes a box-shaped container body C1 having an internal space for accommodating substrates W. The container body C1 has an open side for inserting and removing substrates W. Furthermore, on the inner side surfaces adjacent to both sides of the open side of the container body C1, multiple stages of substrate support members C2 are provided facing each other to support the peripheral portions of the lower surfaces of the substrates W from below. The substrates W are accommodated in the cassette C with their peripheral portions supported in a horizontal position from below by a pair of opposing substrate support members C2. The multiple cassette stands 4a, 4b are arranged on an arc of a circle so that the open sides of the multiple cassettes C placed thereon face the center of the circle.

[0036] The treating section 2 is configured by a plurality of treating units 5 (5a to 5c) that perform predetermined treatments on substrates W, which are arranged on the same horizontal plane around the transport section 3. The treating units 5a to 5c each include a platform 51a to 51c on which the substrate W is placed.

[0037] The transport section 3 includes a transport device 6 arranged at the center of a circle including the arc of the cassette tables 4a, 4b arranged in an arc shape. The transport device 6 includes a first arm 63 for taking out substrates W from a cassette C or storing substrates W in the cassette C, and a second arm 64 for taking out substrates W from or sending out substrates W to the processing units 5a to 5c.

[0038] 3 is a side view of the conveyor 6. The first arm 63 is supported by an upper portion of a first lifting and lowering rotation shaft 61 that stands on a lower upper surface 601 of a base 60 having a stepped upper surface. The second arm 64 is supported by an upper portion of a second lifting and lowering rotation shaft 62 that stands on a higher upper surface 602 of the base 60. The first lifting and lowering rotation shaft 61 and the second lifting and lowering rotation shaft 62 are each configured to be movable up and down by an elevator drive mechanism (not shown) built into the base 60. The first lifting and lowering rotation shaft 61 and the second lifting and lowering rotation shaft 62 are each configured to be rotatable about virtual rotation axes S1 and S2 by an elevator drive mechanism (not shown) built into the base 60.

[0039] 4 is a perspective view of the first arm 63. The first arm 63 is a horizontal articulated arm and includes a first link member 631 rotatably connected to the first lifting rotation shaft 61, a second link member 632 rotatably connected to the first link member 631, and a first hand 634 rotatably connected (fixed) to the front end of the second link member 632. The first arm 63 is configured so that the first hand 634 can advance and retreat in a predetermined direction on the horizontal plane while maintaining its posture by rotating the first link member 631 and the second link member 632 along the horizontal plane using an advance / retract drive mechanism (not shown) built into the base 60. The first link member 631 and the second link member 632 correspond to the "basic arm" in this invention.

[0040] The first hand 634 is configured to grip the substrate W by its edge surface and includes a rectangular, plate-shaped gripper support member 6341, a first substrate gripper 6342 provided at one end (front end) of the gripper support member 6341 in the long side direction, and a second substrate gripper 6343 provided at the other end (rear end) of the gripper support member 6341. The second substrate gripper 6343 also serves as an attachment device that rotatably attaches the first hand 634 to the front end of the second link member 632. The first substrate gripper 6342 is configured to be displaceable in the direction in which the gripper support member 6341 extends by a displacement drive mechanism (not shown) built into the second substrate gripper 6343. This allows the distance between the first substrate gripper 6342 and the second substrate gripper 6343 to be changed, making it possible to grip the substrate W between the first substrate gripper 6342 and the second substrate gripper 6343 (FIG. 5(a)). The gripper support member 6341, the first substrate gripper 6342 and the second substrate gripper 6343 correspond to the "I-shaped base" in this invention.

[0041] Instead of making the first substrate gripper 6342 displaceable, the first substrate gripper 6342 may be fixed to the tip of the gripper support member 6341, and the gripper support member 6341 may be displaced relative to the second substrate gripper 6343 (FIG. 5(b)). In this case, when the gripper support member 6341 is displaced toward the second substrate gripper 6343, a portion of the gripper support member 6341 near its rear end is housed within the second substrate gripper 6343. Alternatively, both the gripper support member 6341 and the first substrate gripper 6342 may be displaceable. Alternatively, the rear end of the gripper support member 6341 may be rotatably connected directly (without going through the second substrate gripper 6343) to the front end of the second link member 632, and the first substrate gripper 6342 and / or the second substrate gripper 6343 may then be displaced relative to the gripper support member 6341.

[0042] 6 is a perspective view of the second arm 64. The second arm 64 is a horizontal articulated arm and includes a first link member 641 rotatably connected to the second lifting rotation shaft 62, a second link member 642 rotatably connected to the first link member 641, a second hand attachment portion 643 rotatably connected to the second link member 642, and a second hand 644 suspended from the tip of the second hand attachment portion 643 via a suspension support portion 645. The second arm 64 is configured to be able to advance and retreat in a predetermined direction on the horizontal plane while maintaining its posture by rotating the first link member 641 and the second link member 642 along the horizontal plane using an advance and retreat drive mechanism (not shown) built into the base 60.

[0043] The second hand 644 is formed in a cross shape and sucks and holds the peripheral edge of the upper surface of the substrate W. Suction sections 6441 with suction ports facing downward are provided on the underside of each end of the cross of the second hand 644. The second hand 644 is configured to be able to move up and down by extending and contracting the hanging support section 645 or by raising and lowering the second lifting rotation shaft 62 using an elevation drive mechanism (not shown) built into the second hand attachment section 643.

[0044] Next, the operation of the transport device 6 in the substrate manufacturing apparatus 100 according to this embodiment will be described with reference to Figures 7 and 8. Note that in Figure 7, the second arm 64 is omitted to make it easier to understand the movement of the first arm 63.

[0045] 1, the first arm 63 and the second arm 64 are folded, and the first hand 634 and the second hand 644 are waiting in a predetermined position not facing the open side of the cassette C placed on the cassette tables 4a and 4b. The distance between the first substrate gripper 6342 and the second substrate gripper 6343 is also assumed to be greater than the diameter of the substrate W. Furthermore, an unprocessed substrate W is removed from the cassette C placed on the cassette table 4a, and a processed substrate W is stored in the original position of the cassette C.

[0046] First, the first lifting and lowering rotation shaft 61 is rotated about the rotation axis S1 to orient the first hand 634 of the first arm 63 toward the cassette table 4a, and then the first arm 63 is extended toward the cassette C placed on the cassette table 4a, and the first hand 634 is positioned opposite the cassette C ( FIG. 7A ). Next, the first lifting and lowering rotation shaft 61 is raised and lowered to adjust the height of the first hand 634, and the first arm 63 is further extended toward the cassette C, and the first hand 634 is inserted between the substrate W to be removed and another substrate W stored below it ( FIG. 7B ). After insertion, the first lifting and lowering rotation shaft 61 is raised to position the substrate W between the first substrate gripper 6342 and the second substrate gripper 6343. At this time, the underside of the substrate W should not come into contact with the gripper support member 6341. In this state, the first substrate gripper 6342 is moved toward the second substrate gripper 6343 to narrow the gap between the first and second substrate grippers 6342, 6343, and the substrate W is gripped by the first and second substrate grippers 6342, 6343. Once the substrate W has been gripped, the first arm 63 is retracted to cause the first hand 634 to retract from the cassette C (FIG. 7C). In this manner, the substrate W is removed from the cassette C. When the substrate W is gripped by the first and second substrate grippers 6342 and 6343, alignment may be performed using an orientation flat provided on the substrate W, or an orientation flat R1 or notch R2 provided on the wafer ring R, which will be described later.

[0047] After the substrate W is removed from the cassette C, the second lifting and lowering rotation shaft 62 is rotated about the rotation axis S2 to orient the second hand 644 of the second arm 64 in the direction of the first hand 634, and the height of the second hand 644 is adjusted by raising and lowering the second lifting and lowering rotation shaft 62 as necessary. Alternatively, the height of the first hand 634 is adjusted by raising and lowering the first lifting and lowering rotation shaft 61. Next, the second arm 64 is extended relative to the first hand 634, and the second hand 644 is positioned above the first hand 634 ( FIG. 8A ). Once the second hand 644 is positioned above the first hand 634, the second hand 644 is lowered until it abuts against the substrate W held by the first hand 634, thereby suctioning the substrate W. Once the substrate W has been sucked, the first hand 634 is released from its grip, and the second hand 644 is raised. In this manner, the substrate W is transferred from the first arm 63 to the second arm 64.

[0048] After the substrate W is transferred to the second arm 64, the second lifting rotation shaft 62 is rotated to orient the second hand 644 toward the processing unit 5a, and the second lifting rotation shaft 62 is raised or lowered as necessary to adjust the height of the second hand 644. The second arm 64 is then extended toward the processing unit 5a, and the second hand 644 is positioned above the stage 51a of the processing unit 5a ( FIG. 8B ). Once the second hand 644 is positioned above the stage 51a of the processing unit 5a, the second hand 644 is lowered to bring the substrate W into contact with the stage 51a. The second hand 644 is then released from its suction state, and the second hand 644 is raised to place the substrate W on the stage 51a. The second arm 64 is then retracted, and the second hand 644 is withdrawn from the processing unit 5a ( FIG. 8C ). In this manner, the substrate W is sent to the processing unit 5a.

[0049] After the substrate W is sent to the processing unit 5a and the predetermined processing is performed on the substrate W, the second arm 64 is again extended toward the processing unit 5a, and the second hand 644 is positioned above the stage 51a of the processing unit 5a (FIG. 8B). The second hand 644 is then lowered to suck and hold the substrate W. Thereafter, the second hand 644 is raised and withdrawn from the processing unit 5a (FIG. 8D). In this way, the substrate W that has been processed in the processing unit 5a is removed from the processing unit 5a.

[0050] Next, the second arm 64 is extended toward the processing unit 5b, and the second hand 644 is positioned above the stage 51b of the processing unit 5b (FIG. 8E). Once the second hand 644 is positioned above the stage 51b of the processing unit 5b, the second hand 644 is lowered to bring the substrate W into contact with the stage 51b. The suction state of the second hand 644 is then released, and the second hand 644 is raised to place the substrate W on the stage 51b. Thereafter, the second arm 64 is retracted, causing the second hand 644 to withdraw from the processing unit 5b. In this manner, the substrate W is transported from the processing unit 5a to the processing unit 5b, where it is subjected to a predetermined processing. After the processing in the processing unit 5b is completed, the substrate W is transported from the processing unit 5b to the processing unit 5c for final processing, using the same operation as when it was transported from the processing unit 5a to the processing unit 5b.

[0051] After the processing in the processing unit 5c is completed, the substrate W is removed from the processing unit 5c using the second hand 644 in a manner similar to the operation for removing the substrate W from the processing unit 5a described above (FIGS. 8B and 8D). After the substrate W is removed from the processing unit 5c, the second lifting rotation shaft 62 is rotated to orient the second hand 644 in the direction of the first hand 634, and the second lifting rotation shaft 62 is raised and lowered as necessary to adjust the height of the second hand 644. Alternatively, the first lifting rotation shaft 61 is raised and lowered to adjust the height of the first hand 634. Next, the second arm 64 is extended relative to the first hand 634, and the second hand 644 is positioned above the first hand 634 (FIG. 8A). Once the second hand 644 is positioned above the first hand 634, the second hand 644 is lowered, and the substrate W suction-held by the second hand 644 is positioned between the first substrate gripper 6342 and the second substrate gripper 6343. In this state, the first substrate gripper 6342 is moved toward the second substrate gripper 6343, and the substrate W is gripped by the first substrate gripper 6342 and the second substrate gripper 6343. Once the substrate W is gripped, the suction state of the second hand 644 is released, and the second hand 644 is raised. In this way, the processed substrate W is transferred from the second arm 64 to the first arm 63 ( FIG. 7C ).

[0052] After the processed substrate W has been transferred to the first arm 63, the first lifting and rotating shaft 61 is raised and lowered as necessary to adjust the height of the first hand 634, and then the first arm 63 is extended toward the cassette C placed on the cassette stand 4a, and the first hand 634 is inserted into the cassette C to place the substrate W on the corresponding substrate support C2 (FIG. 7B). Thereafter, the first hand 634 is released from its grip, the first lifting and rotating shaft 61 is lowered, and the first arm 63 is retracted to remove the first hand 634 from the cassette C (FIG. 7A). In this way, the processed substrate W is stored back into the cassette C.

[0053] Substrates can also be taken out and stored in a cassette C placed on the cassette table 4b by operations similar to those described in paragraphs 0039 and 0044. In the above description, substrates taken out from a cassette C are stored in the same cassette C, but, for example, unprocessed substrates W may be stored in a cassette C placed on the cassette table 4a, and processed substrates W may be stored in a cassette C placed on the cassette table 4b. In that case, in the operation described in paragraph 0044, once the processed substrate W is transferred from the second arm 64 to the first arm 63, the first lifting rotation shaft 61 may be rotated to orient the first hand 634 toward the cassette table 4b, and the first arm 63 may be extended toward the cassette C placed on the cassette table 4b.

[0054] In the above example, the substrate W is transported through the processing units 5a, 5b, and 5c in that order, and each processing unit performs a predetermined process on the substrate W. However, the processes performed by the processing units 5a to 5c are different from one another. Alternatively, some (two of the three processing units, as in the above example) or all (three) of the multiple processing units may perform the same type of process. For example, it is preferable to provide multiple processing units that perform processes that require more time than other processes. In this case, when some or all of the processing units perform the same type of process, the transporter 6 operates to send the substrate W from a cassette or a different type of processing unit to one of the same type of processing units, and then transport the processed substrate W removed from that processing unit to a different type of processing unit or store it in a cassette.

[0055] According to the substrate manufacturing apparatus 100 of this embodiment, when a substrate is transferred between the cassette C and the processing units 5a to 5c, the transfer can be performed without touching the surface of the substrate (the surface other than the peripheral edge of the substrate W). Furthermore, there is no need to move the transport device 6 to access each cassette C.

[0056] 9 is a schematic diagram showing a second embodiment of a substrate manufacturing apparatus according to the present invention. Substrate manufacturing apparatus 100A differs from substrate manufacturing apparatus 100 of the first embodiment in that processing section 2 is composed of five processing units 5a to 5e arranged in a U-shape, and transport section 3 includes a transport device 6 and a traveling device 7 for moving transport device 6. However, the rest of the configuration is the same as that of substrate manufacturing apparatus 100 of the first embodiment. Therefore, the same parts are designated by the same reference numerals, and a description thereof will be omitted.

[0057] The traveling device 7 includes guide rails 71 that guide the movement of the conveyor 6, and a conveyor drive control mechanism (not shown) that drives and controls the movement of the conveyor 6. The guide rails 71 are arranged along the direction in which the processing units 5a, 5b and 5d, 5e are aligned. The conveyor drive control mechanism controls the movement of the conveyor 6 so that the conveyor 6 is positioned opposite the processing units 5a, 5e or the processing units 5b to 5d. In Figure 9, the conveyor 6 positioned opposite the processing units 5a, 5e is indicated by a solid line, and the conveyor 6 positioned opposite the processing units 5b to 5d is indicated by a dashed line.

[0058] By configuring the substrate manufacturing apparatus 100A in this manner, substrates can be transferred to and from processing units located away from the cassette tables 4a and 4b. Furthermore, in the substrate manufacturing apparatus 100A, it is not necessary to move the transport device 6 to access each cassette C.

[0059] 10 is a schematic diagram showing a third embodiment of a substrate manufacturing apparatus according to the present invention. The substrate manufacturing apparatus 100B differs from the substrate manufacturing apparatus 100 of the first embodiment in that the accommodation unit 1 includes a mounting table 8 on which a plurality of cassettes C arranged facing the same direction are mounted, and a moving device 9 for moving the mounting table 8. However, the other configuration is substantially the same as that of the substrate manufacturing apparatus 100 of the first embodiment. Therefore, the same or equivalent parts are designated by the same reference numerals, and a description thereof will be omitted.

[0060] The moving device 9 includes a guide rail 91 that guides the movement of the mounting table 8, and a cassette table drive control mechanism (not shown) that drives and controls the movement of the mounting table 8. The guide rail 91 is arranged along the arrangement direction of the cassettes C placed on the mounting table 8. The cassette table drive control mechanism controls the movement of the mounting table 8 so that the open side of a specific cassette C placed on the mounting table 8 is positioned opposite the conveyor 6. Note that in the substrate manufacturing apparatus 100B, because the cassette table drive control mechanism can position a specific cassette C in a position opposite the conveyor 6, there is no need to provide the conveyor 6 with a rotation drive mechanism for rotating the first lifting rotation shaft 61.

[0061] According to the substrate manufacturing apparatus 100B, it is not necessary to move the transport device 6 to access each cassette C. Furthermore, by configuring the substrate manufacturing apparatus 100B in this manner, it is possible to mount more cassettes C than in the substrate manufacturing apparatus of the first or second embodiment in which multiple cassette tables are arranged in an arc shape.

[0062] 3 to 6 are used in each of the embodiments described so far, but a conveyor 6A having a different configuration is used in the fourth embodiment. The configuration other than the conveyor 6A may be any of those in the first to third embodiments (i.e., the conveyor 6 in those embodiments is replaced with the conveyor 6A of this embodiment), and configurations other than those in the first to third embodiments may also be used. The following description focuses on the configuration of the conveyor 6A.

[0063] 11 is a perspective view showing the configuration of the transporter 6A. The transporter 6A includes a first arm 63A for taking out a substrate W from a cassette C or storing a substrate W in the cassette C, and a second arm 64A for taking out a substrate W from a processing unit 5 or sending a substrate W to a processing unit. The first arm 63A and the second arm 64A are supported on the upper part of a common lifting rotation shaft 61A. The lifting rotation shaft 61A can be raised and lowered by an elevator drive mechanism (not shown) built into the base 60A, and can be rotated about virtual rotation axes S1 and S2 by a rotation drive mechanism (not shown) built into the base 60A.

[0064] As shown in Figures 11 and 12(a), the first arm 63A includes a first link member 631A, a second link member 632A, and a first hand 634A. Each component of the first arm 63A has the same configuration as each component of the first arm 63 in the first to third embodiments, except that the first link member 631A is rotatably connected to the same lift rotation shaft 61A as the second arm 64A. The first link member 631A and the second link member 632A correspond to the "basic arm" in this invention. The first hand 634A also includes a gripper support member 6341A, a first substrate gripper 6342A, and a second substrate gripper 6343A, which are I-shaped bases similar to the components of the first hand 634 in the conveyor 6 in the first to third embodiments.

[0065] 11 and 12(b), the second arm 64A includes a first link member 641A rotatably connected to the lifting rotation shaft 61A, a second link member 642A rotatably connected to the first link member 641A, a third link member 643A rotatably connected to the second link member 642A, a second hand attachment portion 645A, and a second hand 644A. The second hand attachment portion 645A is composed of two rectangular plate members (a first plate member 6451A and a second plate member 6452A) and one rod member 6453A. The first plate member 6451A and the second plate member 6452A are arranged so that their long sides are perpendicular to each other, and the lower surface of one end of the long side of the second plate member 6452A is fixed to the upper surface of one end of the long side of the first plate member 6451A. The other end of the first plate member 6451A is rotatably connected to the third link member 643A, and one end of a rod member 6453A is fixed to the other end of the second plate member 6452A. A second hand 644A is suspended from the other end of the rod member 6453A. The second hand 644A has a configuration similar to that of the second hand 644 in the first to third embodiments, and sucks in gas using a suction pump 66 provided on the upper surface of one end of the other plate member to suction and hold the peripheral edge of the upper surface of the substrate W. The second arm 64A is configured to be able to move the second hand attachment portion 645A and the second hand 644A forward and backward in a predetermined direction on the horizontal plane while maintaining their orientation by rotating the first link member 641A to the third link member 643A along the horizontal plane using an advance / retract drive mechanism (not shown) built into the base 60.

[0066] When the first arm 63A and the second arm 64A are folded, the first hand 634A and the second hand 644A are positioned in the same place on a plane, but the second hand 644A is positioned higher than the first hand 634A in the vertical direction, so the positions of the two do not interfere with each other.

[0067] The operation of the conveyor 6A in the fourth embodiment is the same as the operation of the conveyor 6 in the first to third embodiments, except for the following point. In the conveyors 6 in the first to third embodiments, the first lifting rotation shaft 61 is rotated and raised and lowered when changing the orientation and raising and lowering the first hand 634, and the first lifting rotation shaft 61 is rotated and raised and lowered when changing the orientation and raising and lowering the second hand 644, and the second lifting rotation shaft 62 is rotated and raised and lowered. In contrast, in the conveyor 6A in the fourth embodiment, the same lifting rotation shaft 61A is rotated and raised and lowered both when changing the orientation and raising and lowering the first hand 634A and when changing the orientation and raising and lowering the second hand 644A.

[0068] As described above, the transport device 6A in the fourth embodiment is provided with only one lifting rotation shaft 61A for changing the orientation and height of the first hand 634A and the second hand 644A, and accordingly only one lifting drive mechanism and one rotation drive mechanism for the lifting rotation shaft are required, which simplifies the structure compared to the transport devices 6 in the first to third embodiments and reduces the cost of the device. On the other hand, if the first hand 634 and the second hand 644 are supported on different lifting rotation shafts (first lifting rotation shaft 61, second lifting rotation shaft 62) as in the transport devices 6 in the first to third embodiments, the first hand 634 can remove a substrate W from a cassette C or store it in the cassette C, and the second hand 644 can remove another substrate W from a processing unit or store it in the processing unit, all in parallel, thereby enabling faster processing of the substrates W.

[0069] Fifth Embodiment In the fifth embodiment, a conveyor 6B equipped with a first arm 63B described below is used instead of the first arm 63A of the conveyor 6A in the fourth embodiment. The configuration of the conveyor 6B other than the first arm 63B is the same as that of the conveyor 6A in the fourth embodiment. Furthermore, the configuration other than the conveyor 6B may be any of those in the first to third embodiments, or may be a configuration other than those in the first to third embodiments. The following description will focus on the configuration of the first arm 63B.

[0070] As shown in FIG. 13 , the first arm 63B includes a first link member 631B, a second link member 632B, a third link member 633B, a workpiece gripper 634B, and a workpiece positioning jig 635B. The first link member 631B and the second link member 632B have structures similar to those of the first link member 631A and the second link member 632A in the fourth embodiment, respectively. The third link member 633B is the gripper support member 6341A in the fourth embodiment, except that instead of the first substrate gripper 6342A and the second substrate gripper 6343A, the workpiece gripper 634B is provided at the tip (the end opposite the second link member 632A). In the fifth embodiment, the combination of the first link member 631B, the second link member 632B, and the third link member 633B corresponds to the basic arm.

[0071] As described above, the workpiece gripper 634B is provided at the tip of the third link member 633B (which is also the tip of the entire basic arm) and grips the workpiece by sandwiching the end of the workpiece between a pair of upper and lower gripping members. While only one pair of workpiece grippers 634B is shown in FIG. 13 , in practice, two pairs of workpiece grippers 634B are arranged side by side in the width direction of the third link member 633B (a direction perpendicular to the direction connecting the front and rear ends of the third link member 633B) as shown in FIG. 14 . However, the number of workpiece grippers 634B is not limited to two pairs and may be one pair or three or more pairs. When the workpiece gripper 634B grips the end of the workpiece, a drive mechanism (not shown) moves the pair of gripping members closer to each other. When the gripped end of the workpiece is released, the drive mechanism moves the pair of gripping members apart.

[0072] The workpiece positioning jig 635B is fixed to one end in the width direction of the third link member 633B. The workpiece positioning jig 635B has a corner 6351B. This corner 6351B has a shape that engages with a V-shaped notch R2 (see FIG. 15(a)) provided in a wafer ring (annular holder) R that holds the substrate W.

[0073] The operation of the transport device 6B in the fifth embodiment will be described. When removing a workpiece from a cassette C, the first arm 63B is extended relative to the cassette C until the corner 6351B of the workpiece positioning jig 635B engages with the notch R2 of the wafer ring R of the workpiece in the cassette C, and the workpiece gripper 634B grips the end of the workpiece (or its wafer ring R) at that position. The first arm 63B is then retracted to remove the workpiece from the cassette C. Next, the second hand 644A provided on the second arm 64A is positioned above the workpiece gripped by the workpiece gripper 634B, and the second hand 644A is lowered until it abuts against the workpiece, thereby suction-holding the workpiece. The workpiece gripper 634B then releases the end of the workpiece (or its wafer ring R). After this, while processing is being performed in each processing unit, operations similar to those in steps 1 to 3 are performed. After processing is completed in the last processing unit, a corner 6351B of the object positioning jig 635B is engaged with the notch R2 of the object sucked by the second hand 644A, and the end of the object (the wafer ring R) is gripped by the object gripper 634B, and the first arm 63B is directed toward the cassette C and extended to insert the gripped object into the cassette C. The object gripper 634B then releases the object, and the processed object is accommodated in the cassette C.

[0074] The workpiece positioning jig 635B may be omitted. In addition, in the first to third embodiments, the third link member 633B and workpiece gripper 634B (and further the workpiece positioning jig 635B) used in the fifth embodiment may be used instead of the first hand 634.

[0075] (Processing Unit) The processing unit 5 included in the substrate manufacturing apparatus of each of the above embodiments may perform any type of processing on the substrate W. As an example, the substrate manufacturing apparatus may be an apparatus for cutting (dicing) a substrate W, which is divided into multiple chip regions each having a circuit formed thereon, into individual pieces. In this case, the substrate manufacturing apparatus includes, as a substrate processing apparatus, a processing unit for scribing the substrate (scribing process) and a processing unit for breaking the scribing substrate along the scribing process to separate the substrate into individual pieces (breaking process). The substrate W handled by the substrate manufacturing apparatus may be transported to each processing unit by itself, or may be transported to each processing unit while being held by a wafer ring R, as described above. In this case, as shown in FIG. 15( a), an adhesive tape (also referred to as a "dicing tape" or "substrate holding sheet") T may be attached to the back surface of the wafer ring R, and the substrate W may be supported via the adhesive tape T. The wafer ring R has a linear portion (orientation flat) R1 for alignment on its periphery and the aforementioned V-shaped notch R2. Furthermore, between the scribing process and the breaking process, a process (film bonding process) may be performed in which a protective film F (see FIG. 15(b)) is bonded to the surface of the substrate W on which the circuit is formed (front surface; the surface opposite to the surface that comes into contact with the adhesive tape T). If the protective film F is bonded to the substrate W, a process (film peeling process) is performed in which the protective film F is peeled off from the substrate W after the breaking process. Furthermore, if necessary, a process (substrate inversion process) in which the substrate W is turned upside down may also be performed.

[0076] 16 shows an example of the arrangement of the transfer unit 3, multiple cassettes C, and multiple processing units 5 (five processing units 5A to 5E) that perform different processes in the substrate manufacturing apparatus of this embodiment. In this example, the transfer unit 3, cassettes C, and processing units 5A to 5E are all housed in a rectangular parallelepiped storage container H. The transfer unit 3 is disposed in the center of the storage container H. The cassettes C and processing units 5A to 5E are all disposed radially around the transfer unit 3. As with the first and second embodiments, and as with the examples shown in FIGS. 1 and 9, the cassette C is disposed on an arc of a circle with its opening side facing the center of the circle centered on the transfer unit 3.

[0077] The five processing units 5A to 5E are arranged around the transport section 3, clockwise from the cassette C, in the following order: first scribing processing unit 5A, breaking processing unit 5B, film application processing unit 5C, film peeling / substrate inversion processing unit 5D, and second scribing processing unit 5E. The first scribing processing unit 5A and the second scribing processing unit 5E each have a device for scribing processing with the same configuration. Because the scribing processing requires longer time than the film application processing, substrate inversion processing, breaking processing, and film peeling processing, two units for the scribing processing are provided, as described above. Furthermore, because the substrate inversion device that performs the substrate inversion processing and the film peeling device that performs the film peeling processing are both smaller in height than the devices for other processing, the substrate inversion device and film peeling device are arranged one above the other (the former on the lower side and the latter on the upper side), thereby reducing the overall area occupied by the substrate manufacturing apparatus.

[0078] In a substrate manufacturing apparatus having such a layout, the transport unit 3 transports a substrate W in the following order. First, the transport unit 3 removes an unprocessed substrate W, with its front surface (the same applies hereinafter in this paragraph) facing upward, from one of the multiple cassettes C and transports it into either the first scribing processing unit 5A or the second scribing processing unit 5E. After the scribing processing is performed on the front surface of the substrate W in the unit into which the substrate W was transported, the transport unit 3 removes the substrate W from that unit and transports it into the film bonding processing unit 5C. After the film bonding processing is performed on the front surface of the substrate W in the film bonding processing unit 5C, the transport unit 3 removes the substrate W from the film bonding processing unit 5C and transports it into a substrate reversing device in the film peeling / substrate reversing processing unit 5D. After the substrate reversing device performs a substrate reversal processing so that the back surface of the substrate W faces upward (note that the film peeling processing is not performed at this point), the transport unit 3 removes the substrate W from the film peeling / substrate reversing processing unit 5D and transports it into the break processing unit 5B. After the break processing is performed in the break processing unit 5B, the transport section 3 carries the substrate W from the break processing unit 5B into a substrate inverting device in the film peeling / substrate inverting processing unit 5D. After the substrate inverting device performs a substrate inversion process so that the front surface of the substrate W faces upward again, the transport section 3 transports the substrate W from the substrate inverting device to the film peeling device in the film peeling / substrate inverting processing unit 5D. After the film peeling process is performed in the film peeling device, the transport section 3 transports the substrate W, which has been singulated on the adhesive tape T, to one of a plurality of cassettes C and stores it therein. The above operations complete the series of operations for one substrate W.

[0079] When the above operations are performed successively on a plurality of substrates W, the scribing process, which takes more time than the other processes, is performed alternately in the first scribing process unit 5A and the second scribing process unit 5E. This shortens the standby time of the processing equipment in the units performing processes other than the scribing process, improving the efficiency of substrate processing.

[0080] The above describes specific examples of forms for implementing the present invention, but the substrate manufacturing apparatus according to the present invention is not limited to those shown in the above embodiments, and appropriate modifications are permitted within the scope of the spirit of the present invention.

[0081] For example, in the above embodiment, the first arm 63 and the second arm 64 are horizontal multi-joint arms, but they may be any type as long as their tips are movable in at least one axial direction.

[0082] The shapes of the gripper support members 6341, 6341A, the first substrate grippers 6342, 6342A and the second substrate grippers 6343, 6343A are not limited to those in the above embodiment, and can be modified as appropriate.

[0083] In the above embodiment, the second hand 644 attached to the tip of the second arm 64 holds the substrate W by suction. However, the configuration of the second hand is not limited to this and can be modified as appropriate depending on the substrate holding method in the processing unit. For example, the second hand can support the substrate W at at least three points around the bottom surface of the substrate. An example of a second arm having such a second hand is shown in FIG. 17 . In the second arm 64B, the tip of the second hand 644B is horseshoe-shaped, and a plurality of claws 6442 for supporting the bottom surface of the substrate W are provided at appropriate intervals on the upper surface of the second hand 644B. ​​Although four claws 6442 are provided in the example shown in FIG. 17 , providing at least three claws can stably support the bottom surface of the substrate W. When the second arm supports the bottom surface of the substrate W, the first arm and the second arm are configured to be vertically movable without interfering with each other so that the substrate can be transferred between them.

[0084] Alternatively, the second hand may grip at least two points around the periphery of the substrate W (holding the edge of the substrate W by pressing down on the edge of the substrate W). For example, as shown in Fig. 18, a hand may be used that includes a rectangular plate-shaped gripper support member 6441C, a first substrate gripper 6442C provided at one end (front end) of the gripper support member 6441C in the long side direction, and a second substrate gripper 6443C provided at the other end (rear end) of the gripper support member 6441C, with the second substrate gripper 6443C rotatably connected to a second link member provided on the second hand. This second hand 644C has a configuration similar to the first hand 634 in each of the above embodiments, but differs from the first hand 634 in that the substrate W is gripped below the gripper support member 6441C.

[0085] Aspects It will be apparent to those skilled in the art that the exemplary embodiments described above are examples of the following aspects.

[0086] (Item 1) The substrate manufacturing apparatus according to item 1 comprises a first arm for taking out a workpiece, which is a substrate or an annular holder holding a substrate, from a cassette or storing the workpiece in the cassette, and a second arm for taking out a workpiece from a substrate processing apparatus or sending the workpiece to a substrate processing apparatus, wherein the first arm comprises a substrate transport device having: a basic arm whose tip is movable in at least one axial direction; an I-shaped base rotatably fixed to the tip of the basic arm; and a pair of workpiece grippers provided at the front and rear ends of the base, the distance between which can be changed.

[0087] (Clause 2) The substrate manufacturing apparatus according to clause 2 comprises a first arm for taking out a workpiece, which is a substrate or a ring-shaped holder holding a substrate, from a cassette or storing the workpiece in the cassette, and a second arm for taking out the workpiece from the substrate processing apparatus or sending the workpiece to the substrate processing apparatus, wherein the first arm comprises a substrate transport device having: a basic arm whose tip is movable in at least one axial direction; and a workpiece gripper attached to the basic arm for gripping an end of the workpiece.

[0088] (Clause 3) The substrate manufacturing apparatus according to clause 3 is the substrate manufacturing apparatus according to clause 1 or 2, further comprising, in addition to the substrate transport device, a cassette table for placing a plurality of cassettes in an arc shape with the opening side of each cassette facing the center, and the substrate transport device is disposed at the center of the cassette table.

[0089] (4) The substrate manufacturing apparatus according to paragraph 4 is the substrate manufacturing apparatus according to paragraph 1 or 2, further comprising, in addition to the substrate transport device, a mounting table on which a plurality of cassettes can be placed, and the mounting table is movable so that the open side of each cassette on the mounting table faces the substrate transport device.

[0090] (Item 5) The substrate manufacturing apparatus according to item 5 is the substrate manufacturing apparatus according to any one of items 1 to 4, wherein the substrate transport device has a traveling device.

[0091] (Item 6) According to the substrate manufacturing apparatus of item 6, in the substrate manufacturing apparatus of any one of items 1 to 5, the second arm supports at least three points around the periphery of the lower surface of the substrate.

[0092] (Item 7) The substrate manufacturing apparatus according to item 7 is the substrate manufacturing apparatus according to any one of items 1 to 5, wherein the second arm grips the substrate at at least two points around the periphery.

[0093] (Item 8) The substrate manufacturing apparatus according to item 8 is the substrate manufacturing apparatus according to any one of items 1 to 5, wherein the second arm holds the substrate by suction.

[0094] (Item 9) The substrate manufacturing apparatus according to item 9 is the substrate manufacturing apparatus according to any one of items 1 to 8, wherein the substrate processing apparatus includes a scribing processing apparatus and a breaking processing apparatus.

[0095] (Item 10) The substrate manufacturing apparatus according to item 10 is the substrate manufacturing apparatus according to any one of items 1 to 9, further comprising: a base; and an elevating and rotating shaft made of a rod-shaped member, erected on the base so as to be able to elevate and rotate about its axis, and supporting the first arm and the second arm at its upper end.

[0096] DESCRIPTION OF SYMBOLS 100, 100A, 100B... Substrate manufacturing apparatus 1... Storage section 2... Processing section 3... Transport section (substrate transport device) 4, 4a, 4b... Cassette stage 5, 5a to 5e... Processing unit 5A... First scribing process unit 5B... Breaking process unit 5C... Film bonding process unit 5D... Film peeling / substrate inversion process unit 5E... Second scribing process unit 51a, 51b... Stage 6, 6A... Transporter 60, 60A... Base 601... Lower upper surface of base 602... Higher upper surface of base 61A... Lifting rotation shaft 61... First lifting rotation shaft 62... Second lifting rotation shaft 63, 63A, 63B... First arm 631, 631A, 631B... First link member (part of basic arm) 632, 632A, 632B... Second link member (part of basic arm) 633B... Third link member 634, 634A... First hand 634B... Workpiece gripper 635B... Workpiece positioning jig 6351B... Corner part of workpiece positioning jig 6341, 6341A... Gripper support member (part of base) 6342, 6342A... First substrate gripper (part of base, one of the substrate grippers) 6343, 6343A... Second substrate gripper (part of base, other of the substrate grippers) 64, 64A, 64B... Second arm 641, 641A... First link member of second arm 642, 642A... Second link member of second arm 643A... Third link member of second arm 645A... Second hand attachment part 644, 644A, 644B, 644C... Second hand 6441C... Gripper support member of second hand 6441... Suction part 6442... Claw part 6442C... First substrate gripper of second hand 6443C... Second substrate gripper of second hand 645... Hanging support part 6451A... First plate material 6452A... Second plate material 6453A... Rod material 66... ​​Suction pump 7... Traveling device 71... Guide rail 8... Placement table 9... Moving device 91... Guide rail C... Cassette F... Protective film H... Storage container R... Wafer ring R1... Orientation flat R2... Notch T... Adhesive tape W... Substrate

Claims

1. A substrate manufacturing apparatus equipped with a substrate transport device comprising a first arm for removing a substrate, which is a substrate or an annular holder holding a substrate, from a cassette or storing the substrate in the cassette, and a second arm for removing the substrate from the substrate processing apparatus or sending the substrate to the substrate processing apparatus, the first arm having: a basic arm whose tip is movable in at least one axial direction; an I-shaped base rotatably fixed to the tip of the basic arm; and a pair of substrate grippers provided at the front and rear ends of the base, the distance between which can be changed.

2. A substrate manufacturing device comprising a first arm for taking out a substrate, or a substrate which is a ring-shaped holder holding a substrate, from a cassette or storing the substrate in the cassette, and a second arm for taking out the substrate from the substrate processing apparatus or sending the substrate to the substrate processing apparatus, the first arm comprising a substrate transport device having a basic arm whose tip is movable in at least one axial direction, and a substrate gripper attached to the basic arm for gripping an end of the substrate.

3. A substrate manufacturing apparatus as described in claim 1 or 2, further comprising a cassette table for placing a plurality of cassettes in an arc shape with the open side of each cassette facing the center in addition to the substrate transport device, and the substrate transport device is disposed at the center of the cassette table.

4. A substrate manufacturing apparatus as described in claim 1 or 2, further comprising, in addition to the substrate transport device, a mounting table on which a plurality of cassettes can be placed, the mounting table being movable so that the open side of each cassette on the mounting table faces the substrate transport device.

5. The substrate manufacturing apparatus according to claim 1 or 2, wherein the substrate transport device has a traveling device.

6. The substrate manufacturing apparatus according to claim 1 or 2, wherein the second arm supports at least three points around the periphery of the lower surface of the object to be processed.

7. The substrate manufacturing apparatus according to claim 1 or 2, wherein the second arm grasps at least two points around the periphery of the workpiece.

8. The substrate manufacturing apparatus according to claim 1 or 2, wherein the second arm is adapted to suck and hold the workpiece.

9. The substrate manufacturing apparatus according to claim 1 or 2, wherein the substrate processing apparatus includes a scribing processing apparatus and a breaking processing apparatus.

10. A substrate manufacturing apparatus as described in claim 1 or 2, further comprising: a base; and a lifting and rotating shaft made of a rod-shaped member, erected on said base so as to be liftable and rotatable about its axis, and supporting said first arm and said second arm at its upper end.

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