Split-type medical apparatus and preparation method for electronic assembly thereof

Abstract

A split-type medical apparatus (10) and a preparation method for an electronic assembly (100) thereof. The split-type medical apparatus (10) comprises a first housing (110), an electronic module (120) and an isolation member (130) arranged in the first housing, a second housing (200) detachably assembled with the first housing, and a sensor (12) arranged in the second housing. The second housing comprises a mounting base (210) for the sensor that can be arranged subcutaneously. The isolation member is provided with a groove-shaped part (131) matched with the mounting base, and a functional surface facing away from an electronic module. A protrusion (133) surrounding the groove-shaped part is arranged on the functional surface. The electronic module comprises a connection region (121) used for being electrically connected to the sensor. The isolation member is attached to the first housing and covers the electronic module in a manner of exposing the connection region in the groove-shaped part. When the first housing is assembled on the second housing, the isolation member is located between the second housing and the first housing, and the protrusion deforms in a direction in which the second housing faces the first housing. Provided are a split-type medical apparatus with an improved sealing effect and a preparation method for an electronic assembly thereof.

Description

Split medical device and method for preparing electronic components thereof Technical Field

[0001] The present disclosure relates to the field of biomedical engineering industry, and in particular to a method for preparing a split-type medical device and an electronic component thereof. Background Art

[0002] Diabetes has become one of the major diseases affecting public health. For diabetic patients, real-time monitoring of blood sugar levels helps them control the progression of diabetes and provide treatment. Currently, continuous glucose monitoring (CGM) is commonly used to continuously monitor blood sugar levels. To reuse the electronic modules of CGMs, existing CGMs typically use a split assembly method.

[0003] Generally speaking, to maintain normal operating performance of a continuous glucose monitor (CGM), the electronic module needs to be sealed. In the prior art, split-assembly CGMs typically include an upper housing, a lower housing, and the electronic module disposed between the upper and lower housings. The electronic module is typically sealed by providing a sealing ring at the junction of the upper and lower housings.

[0004] However, during use of the above-mentioned prior art continuous blood glucose monitor, the sealing ring may be at risk of loosening, thereby resulting in poor sealing effect on the electronic module, thereby affecting the working performance of the continuous blood glucose monitor. Summary of the Invention

[0005] The present disclosure is proposed in view of the above situation, and its purpose is to provide a split medical device and a method for preparing an electronic component thereof that can improve the sealing effect.

[0006] To this end, a first aspect of the present disclosure provides a split medical device, which includes a first shell, an electronic module and an isolation member arranged on the first shell, a second shell detachably assembled with the first shell, and a sensor arranged on the second shell, the second shell including a mounting seat for setting a sensor that can be placed subcutaneously; the isolation member has a groove-shaped portion matching the mounting seat, and a functional surface facing away from the electronic module, and a protrusion surrounding the groove-shaped portion is provided on the functional surface; the electronic module includes a connection area for electrically connecting to the sensor, and the isolation member is configured to fit onto the first shell and cover the electronic module in such a way that the groove-shaped portion exposes the connection area; when the first shell is assembled to the second shell, the isolation member is located between the second shell and the first shell and the protrusion is deformed in the direction in which the second shell points to the first shell, and the mounting seat is located in the groove-shaped portion and the sensor is electrically connected to the electronic module through the connection area.

[0007] In the split medical device involved in the first aspect of the present disclosure, the isolator is attached to the first shell and partially covers the electronic module, which can preliminarily seal the electronic module. Moreover, since the isolator has a groove-shaped portion for exposing the connection area and matching the mounting seat for setting the sensor, when the first shell is assembled to the second shell, the sensor can be electrically connected to the connection area, thereby enabling the split medical device to obtain the target's physiological information. In addition, since the isolator has a protrusion surrounding the groove-shaped portion, when the first shell is assembled to the second shell, the protrusion surrounding the groove-shaped portion will be squeezed by the second shell and deformed, so that the isolator can be more closely attached to the second shell when the first shell is assembled to the second shell, thereby achieving a sealing effect on the groove-shaped portion, that is, the connection area can be sealed, which can further improve the sealing effect on the electronic module.

[0008] In addition, in the split medical device involved in the first aspect of the present disclosure, optionally, the protrusion surrounding the groove-shaped portion is a first protrusion, and the groove-shaped portion has a second protrusion surrounding the connection area. When the first shell is assembled with the second shell, the second protrusion is deformed in the direction from the second shell to the first shell. In this case, when the first shell is assembled with the second shell, the second protrusion is squeezed by the mounting seat and deformed, so that the second protrusion can fit more closely to the mounting seat, and the connection area can be placed in a sealed space. That is, the mutual cooperation between the second protrusion and the mounting seat can improve the sealing effect of the connection area, thereby improving the sealing effect of the electronic module.

[0009] In addition, in the split medical device involved in the first aspect of the present disclosure, optionally, the split medical device includes a power module configured to provide energy to the electronic module, and the groove portion matching the mounting seat is a first groove portion, the isolating member has a second groove portion configured to accommodate the power module, and the protrusion surrounds the first groove portion and the second groove portion. In this case, the protrusion surrounds the first groove portion and the second groove portion. When the first shell is assembled to the second shell, the protrusion surrounding the first groove portion and the second groove portion will be squeezed by the second shell and deformed, so that the isolating member can fit more closely to the second shell when the first shell is assembled to the second shell, and can seal the connection area located in the first groove portion and the power module located in the second groove portion, thereby improving the sealing effect of the split medical device.

[0010] In addition, in the split medical device involved in the first aspect of the present disclosure, optionally, the protrusion surrounding the groove-shaped portion is a first protrusion, and a third protrusion connected to the first protrusion and configured to isolate the first groove-shaped portion and the second groove-shaped portion is provided on the functional surface, and in the direction from the first shell to the second shell, the extension length of the third protrusion is the same as the extension length of the first protrusion. In this case, when the first shell is assembled to the second shell, since the extension length of the first protrusion is the same as the extension length of the third protrusion, the second shell can simultaneously exert an extrusion effect on the first protrusion and the third protrusion, so that the first protrusion and the third protrusion can both fit tightly to the second shell, and through the mutual cooperation of the first protrusion, the third protrusion and the second shell, two independent sealed spaces including the first groove-shaped portion and the second groove-shaped portion respectively can be formed, thereby enabling the connection area and the mounting seat located in the first groove-shaped portion, and the power module located in the second groove-shaped portion to be sealed respectively.

[0011] In addition, in the split medical device involved in the first aspect of the present disclosure, optionally, the mounting seat includes a positioning seat and a base, the positioning seat has a through hole passing through the second shell and the sensor is positioned in the second shell through the through hole; the base is configured to accommodate a conductive component electrically connected to the sensor, and the sensor is electrically connected to the connection area through the conductive component, when the first shell is assembled to the second shell, the base squeezes the second protrusion, and the base and the second protrusion cooperate to form a sealed space. In this case, when the first shell is assembled to the second shell, the second protrusion can be squeezed by the base, and then the base can fit tightly with the second protrusion to form a sealed space for accommodating the conductive component and the connection area; in addition, the sensor can be set on the mounting seat through the through hole of the positioning seat. When the first shell is assembled to the second shell, the electrical connection between the sensor and the electronic module can be achieved through the electrical connection between the conductive component and the connection area, and the through hole passes through the second shell at the position of the positioning seat. In other words, the through hole is independent of the sealed space. Thus, unwanted substances entering the split medical device through the through hole can be isolated from the sealed space, thereby improving the protection effect of the electrical connection part of the split medical device.

[0012] In addition, in the split medical device involved in the first aspect of the present disclosure, optionally, the second shell has at least one hole for positioning the second shell, and when the first shell is assembled to the second shell, the at least one hole is located on the side of the third protrusion away from the second groove-shaped portion. In this case, before the split medical device is used, the second shell can be positioned on the component for accommodating the second shell through the hole; because the hole is located on the side of the third protrusion away from the second groove-shaped portion, when the first shell is assembled to the second shell, the hole can be independent of the sealed space including the second groove-shaped portion, thereby isolating undesirable substances entering the split medical device through the hole from the sealed space including the second groove-shaped portion, thereby improving the sealing effect of the power module.

[0013] Additionally, in the split-type medical device of the first aspect of the present disclosure, optionally, at least one fourth protrusion is provided on the functional surface, matching the at least one hole. When the first shell is assembled with the second shell, the at least one fourth protrusion deforms in a direction from the second shell toward the first shell. In this case, the fourth protrusion can seal the hole, preventing unwanted substances from entering the split-type medical device through the hole, thereby further improving the sealing effect of the split-type medical device.

[0014] In addition, in the split medical device of the first aspect of the present disclosure, optionally, the spacer is elastic and bonded to the inner contour of the first shell. In this case, after the first shell and the second shell are assembled, the spacer is elastic and will rebound after being squeezed, allowing the spacer and the second shell to fit more tightly, thereby enhancing the sealing effect of the split medical device. Since the spacer is bonded to the first shell, the portion where the spacer and the first shell meet can fit tightly, thereby preventing undesirable substances from penetrating into the electronic module through the aforementioned bordering portion.

[0015] The second aspect of the present disclosure provides a method for preparing an electronic component, the electronic component comprising the electronic module, the isolator and the first shell as described in any one of the first aspects of the present disclosure, the method for preparing the electronic component comprising: preparing the first shell provided with the electronic module; coupling the first shell with a mold having a preset shape, the preset shape matching the shape of the isolator; supplying injection molding material with a preset temperature to the mold; removing the mold after the injection molding material cools to obtain the isolator; and obtaining the electronic component. In the second aspect of the present disclosure, the electronic component obtained by supplying injection molding material to the mold, wherein the isolator can be tightly bonded to the first shell and seal the electronic module provided in the first shell, the preset shape of the mold matches the shape of the isolator, and the injection molding material forms an isolator with a desired structure after cooling, and the structure of the isolator can improve the sealing effect of the electronic component after assembly; at the same time, the isolator can also play a role in stabilizing the various electronic components of the electronic module.

[0016] In the electronic component manufacturing method according to the second aspect of the present disclosure, the injection molding material may optionally include silicone. In this case, the spacer can have high water resistance and elasticity, thereby improving the sealing effect of the electronic module. Furthermore, if the injection molding material includes silicone, the injection molding material can be injected using a low-pressure method. Since the injection pressure of low-pressure injection molding is low, damage to the electronic component during the injection molding process can be reduced.

[0017] In addition, in the method for preparing an electronic component according to the second aspect of the present disclosure, optionally, the preset temperature is 150 to 200 degrees Celsius. In this case, during the injection molding process, a molding material having a relatively low temperature can be injected into the mold, thereby further reducing damage to the electronic component during the injection molding process.

[0018] In addition, in the method for preparing an electronic component according to the second aspect of the present disclosure, optionally, the hardness of the injection molding material after curing is 10 to 60 degrees. In this case, the spacer can have high elasticity.

[0019] According to the present disclosure, a method for preparing a split medical device and an electronic component thereof with improved sealing effect can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG1 is a diagram showing an application scenario of a split-type medical device according to an example of the present disclosure.

[0021] FIG. 2 is a front view showing a split-type medical device according to an example of the present disclosure.

[0022] FIG3 is an exploded schematic diagram showing a split-type medical device according to an example of the present disclosure.

[0023] FIG4A is a schematic diagram showing the structure of the second shell involved in the example of the present disclosure at a first viewing angle; FIG4B is a schematic diagram showing the structure of the second shell involved in the example of the present disclosure at a second viewing angle.

[0024] FIG5A is a schematic diagram showing the structure of the electronic component involved in the example of the present disclosure at a first viewing angle; FIG5B is a schematic diagram showing the structure of the electronic component involved in the example of the present disclosure at a second viewing angle.

[0025] FIG6 is a flow chart illustrating a method for preparing an electronic component according to an example of the present disclosure. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. In the following description, identical components are assigned identical reference numerals, and duplicate descriptions are omitted. In addition, the accompanying drawings are merely schematic, and the proportions of the dimensions of the components and the shapes of the components may differ from the actual ones.

[0027] The first aspect of the present disclosure relates to a split medical device. The split medical device involved in the present disclosure can be applied to the surface of a user's skin to obtain the user's analyte information. After processing the analyte information, the user's analyte information is sent to a smart device, thereby enabling monitoring of the user's analyte information. In some examples, the analyte information can also be referred to as physiological information of the target. In the split medical device involved in the present disclosure, by covering the electronic module with an isolation member, the sealing effect of the electronic module can be improved.

[0028] The second aspect of the present disclosure relates to a method for preparing an electronic component. The preparation method involved in the present disclosure obtains the electronic component by supplying injection molding material to a mold. The isolation member in the electronic component can be tightly bonded to the first shell and seal the electronic module arranged in the first shell, and the structure of the isolation member can improve the sealing effect of the electronic component after assembly; at the same time, the isolation member can also play a role in stabilizing the electronic components of each part of the electronic module.

[0029] A third aspect of the present disclosure relates to a medical device kit including the split medical device according to the first aspect of the present disclosure.

[0030] Figure 1 shows an application scenario diagram of the split medical device 10 involved in the example of the present disclosure. Figure 2 shows a front view of the split medical device 10 involved in the example of the present disclosure. Figure 3 shows an exploded schematic diagram of the split medical device 10 involved in the example of the present disclosure.

[0031] In some examples, referring to FIG. 1 , a medical device kit 1 may include a separate medical device 10 and an application device 20. In some examples, the separate medical device 10 is a separate medical device 10 that can be applied to a target skin surface. In some examples, the separate medical device 10 may also be referred to as a separate medical device or an application assembly. In some examples, the target may be a host with physiological functions.

[0032] In some examples, the two-piece medical device 10 can be applied to the host's skin surface with the aid of an application device 20. Thus, the two-piece medical device 10 can be applied to a desired location.

[0033] In some examples, referring to FIG1 , the split medical device 10 can wirelessly transmit data information to the smart device 30 , thereby enabling the smart device 30 to read and monitor the analyte information obtained by the split medical device 10 in real time.

[0034] In some examples, the medical device set 1 may include a cartridge device 40 that matches the application device 20. In some examples, the separate medical device 10 may be assembled with the application device 20 and the cartridge device 40 that matches the application device 20. Thus, the separate medical device 10 can be completely assembled into one piece. In some examples, the medical device set 1 may not include the cartridge device 40, and the separate medical device 10 may be directly accommodated in the application device 20 in a fully assembled form.

[0035] In some examples, referring to FIG2 , a split-type medical device 10 may include a main body 11 and a sensor 12 disposed on the main body 11 . The main body 11 may be applied to the skin surface, and the sensor 12 may be placed subcutaneously. Specifically, the sensor 12 may be placed subcutaneously on the subject. In some examples, the sensor 12 may acquire analyte information, and the main body 11 may receive the analyte information and transmit the analyte information to the smart device 30 . In this case, real-time monitoring of the analyte information is possible.

[0036] In some examples, referring to FIG3 , the main body 11 may include an electronic assembly 100 and a second housing 200 . In some examples, the electronic assembly 100 may include a first housing 110 , an electronic module 120 , and an isolator 130 . In some examples, the electronic module 120 and the isolator 130 may be disposed in the first housing 110 . In some examples, the electronic module 120 may be located between the first housing 110 and the isolator 130 . Thus, the electronic module 120 may be protected. In some examples, when the electronic assembly 100 is assembled in the second housing 200 , the isolator 130 may be located between the second housing 200 and the first housing 110 .

[0037] Fig. 4A is a schematic diagram showing the structure of the second housing 200 according to an example of the present disclosure at a first viewing angle. Fig. 4B is a schematic diagram showing the structure of the second housing 200 according to an example of the present disclosure at a second viewing angle.

[0038] In some examples, the second housing 200 can be detachably assembled with the electronic assembly 100 , thereby improving the flexibility of the split-type medical device 10 .

[0039] In some examples, the second housing 200 can be applied to the skin surface. In some examples, the second housing 200 can be detachably assembled with the first housing 110. This facilitates the installation and removal of the electronic component 100 from the second housing 200.

[0040] In some examples, the sensor 12 may be disposed in the second housing 200. Specifically, the second housing 200 may include a mounting base 210 for disposing the sensor 12 (see FIG. 4A or FIG. 4B).

[0041] 4A or 4B , the mounting base 210 can include a positioning base 211 . In some examples, the positioning base 211 can be configured to position the sensor 12 .

[0042] In some examples, the positioning seat 211 may have a through hole 2110 that passes through the second housing 200. The sensor 12 may be positioned on the second housing 200 through the through hole 2110. In this way, the sensor 12 may be fixed to the second housing 200.

[0043] In some examples, the through hole 2110 can be used to position the sensor 12 . The sensor 12 can be set on the mounting base 210 through the through hole 2110 , and the sensor 12 can pass through the through hole 2110 .

[0044] In some examples, the mounting base 210 may include a base 212. In some examples, the base 212 may be configured to accommodate a conductive component 2120 electrically connected to the sensor 12. The sensor 12 may be electrically connected to the electronic module 120 via the conductive component 2120. Thus, the electronic module 120 may be able to obtain analyte information collected by the sensor 12.

[0045] In some examples, referring to FIG. 4A or FIG. 4B , the second housing 200 may have at least one hole 220 for positioning the second housing. In some examples, the second housing 200 may be retained in the box device 40 via the hole 220. In other words, the second housing 200 may be positioned in the box device 40 via the hole 220. In this case, before the split medical device 10 is used, the second housing 200 can be positioned in the component for receiving the second housing 200 (i.e., the box device 40) via the hole 220.

[0046] In some examples, the number of holes 220 may be one. In some examples, the number of holes 220 may be multiple. For example, the second housing 200 may have four holes 220 for positioning, and the four holes 220 for positioning may be hole 220a, hole 220b, hole 220c, and hole 220d. Thus, holes 220a, 220b, 220c, and 220d can more stably position the second housing 200. In other words, holes 220a, 220b, 220c, and 220d can more stably position the second housing 200 in the box device 40.

[0047] Figure 5A is a schematic diagram showing the structure of the electronic component 100 involved in the example of the present disclosure at a first viewing angle. Figure 5B is a schematic diagram showing the structure of the electronic component 100 involved in the example of the present disclosure at a second viewing angle.

[0048] In some examples, as shown in FIG. 5A or FIG. 5B , the electronic module 120 can be reused. In other words, the electronic module 120 can be used multiple times. The electronic module 120 can be disposed in the first housing 110 . In this case, the electronic module 120 can be detachably assembled with the second housing 200 along with the first housing 110 .

[0049] In some examples, the electronic module 120 may be adhered to the first housing 110 , thereby improving the stability of the electronic module 120 disposed on the first housing 110 .

[0050] In some examples, the electronic module 120 can receive analyte information from the sensor 12 , process the analyte information, and then send the processed analyte information to the smart device 30 in real time.

[0051] In some examples, the electronic module 120 may include a connection region 121 electrically connected to the sensor 12 (see FIG. 5A or FIG. 5B ). In some examples, when the first housing 110 is assembled with the second housing 200, the sensor 12 may be electrically connected to the connection region 121. This enables the split medical device 10 to obtain analyte information. In some examples, the sensor 12 may be electrically connected to the connection region 121 via a conductive component 2120.

[0052] In some examples, the connection region 121 may have an electrical contact 1210 that can be electrically connected to the conductive component 2120. In this case, when the first housing 110 is assembled to the second housing 200, the electrical connection between the conductive component 2120 and the electrical contact 1210 can achieve electrical connection between the sensor 12 and the electronic module 120.

[0053] As described above, in some examples, the main body 11 may further include an isolator 130 (see FIG. 3 ). In some examples, the isolator 130 may be used to seal the electronic module 120 , thereby preventing and protecting the electronic module 102 from being affected by undesirable substances.

[0054] In some examples, the undesirable substance may be water, sweat, dander, dust, or the like.

[0055] In some examples, the spacer 130 may be attached to the first housing 110. This prevents unwanted substances from entering the electronic module 120 from the interface between the spacer 130 and the first housing 110. In some examples, the spacer 130 may cover the electronic module 120. This seals the electronic module 120.

[0056] In some examples, the spacer 130 may be elastic. In this case, after the first housing 110 and the second housing 200 are assembled, the spacer 130 is elastic and will rebound after being squeezed, allowing the spacer 130 and the second housing 200 to fit more closely, thereby enhancing the sealing effect of the split medical device 10.

[0057] In some examples, the spacer 130 can be adhesive. For example, the spacer 130 can be a viscous adhesive component. In some examples, the spacer 130 can be bonded to the inner contour of the first housing 110. In this case, because the spacer 130 is bonded to the first housing 110, the portion where the spacer 130 and the first housing 110 meet can be tightly fitted, thereby preventing undesirable substances from penetrating into the electronic module 120 through the bordering portion.

[0058] In some examples, the spacer 130 may cover the surface of the electronic module 120 and adhere to the inner contour of the first housing 110. This can enhance the sealing effect of the electronic module 120 and also provide better assembly stability for the electronic module 120.

[0059] In some examples, the isolator 130 may have a groove 131 (see FIG. 5A ). In some examples, the groove 131 may mate with the mount 210. In some examples, the groove 131 mates with the mount 210, which may mean that the mount 210 can be received in the groove 131. In other words, the isolator 130 may have a groove 131 for receiving the mount 210.

[0060] In some examples, when the first housing 110 is assembled to the second housing 200, the mounting base 210 can be located in the groove 131 and the sensor 12 can be electrically connected to the electronic module 120 through the connection area 121. Thus, by positioning the mounting base 210 in the groove 131, a conductive component 2110 (described later) disposed on the mounting base 210 can be electrically connected to the connection area 121 located in the groove 131.

[0061] In some examples, the isolation member 130 may cover the electronic module 120 in a manner such that the groove-shaped portion 131 exposes the connection region 121. In this case, when the first housing 110 is assembled with the second housing 200, the sensor 12 can be electrically connected to the connection region 121 via the conductive component 2120 housed in the base 212, thereby enabling the split medical device 10 to obtain analyte information.

[0062] In some examples, the isolation member 130 may have a functional surface 132 facing away from the electronic module 120 (see FIG. 5A or 5B ). In some examples, a protrusion 133 may be provided on the functional surface 132. In some examples, the protrusion 133 may surround the groove 131. In this case, the protrusion 133 cooperates with the second housing 200 to seal the groove 131, thereby sealing the electronic module 120.

[0063] In some examples, when the first housing 110 is assembled to the second housing 200 , the spacer 130 may be located between the second housing 200 and the first housing 110 .

[0064] In some examples, when the first housing 110 is assembled with the second housing 200, the protrusion 133 may deform in a direction from the second housing 200 to the first housing 110. In this case, the protrusion 133 surrounding the groove portion 131 is squeezed by the second housing 200 and deforms, allowing the spacer 130 to fit more closely to the second housing 200 when the first housing 110 is assembled with the second housing 200. This seals the groove portion 131, and thus the connection area 121, further improving the sealing effect on the electronic module 120.

[0065] Hereinafter, for the convenience of describing the present disclosure, the protrusion 133 surrounding the groove portion 131 is referred to as a first protrusion 133 .

[0066] In some examples, the protrusion 133 surrounding the groove portion 131 is referred to as a first protrusion 133 .

[0067] In some examples, the slot portion 131 may be substantially in the shape of a groove.

[0068] In some examples, the groove portion 131 may include a bottom plate 134 (see FIG5A ). In some examples, the bottom plate 134 may have a through hole 1340 (see FIG5A ) that exposes the connection region 121. In other words, the through hole 1340 may penetrate the bottom plate 134, thereby exposing the connection region 121.

[0069] In some examples, the groove portion 131 may have a second protrusion 1341 surrounding the connection region 121 (see FIG. 5A ). In some examples, when the first housing 110 is assembled with the second housing 200, the second protrusion 1341 may deform in a direction from the second housing 200 toward the first housing 110. In this case, when the first housing 110 is assembled with the second housing 200, the second protrusion 1341 is squeezed by the mounting base 210 and deformed, thereby allowing the second protrusion 1341 to fit more closely against the mounting base 210, thereby enclosing the connection region 121 in a sealed space. In other words, the interaction between the second protrusion 1341 and the mounting base 210 can improve the sealing effect of the connection region 121, thereby improving the sealing effect of the electronic module 120.

[0070] In some examples, the second protrusion 1341 may be formed on the bottom plate 134 in a manner surrounding the connection region 121 .

[0071] In some examples, when the first housing 110 is assembled with the second housing 200, the base 212 can compress the second protrusion 1341, and the base 212 and the second protrusion 1341 can cooperate to form a sealed space. In this case, when the first housing 110 is assembled with the second housing 200, the second protrusion 1341 can be squeezed by the base 212, and the base 212 can be tightly fitted with the second protrusion 1341, forming a sealed space for accommodating the conductive component 2120 and the connection area 121.

[0072] As described above, in some examples, the mounting base 210 may include a positioning base 211 and a base 212, and the positioning base 211 may have a through hole 2110 that penetrates the second housing 200, and the sensor 12 may be positioned on the second housing 200 through the through hole 2110. In this case, the sensor 12 can be set on the mounting base 210 through the through hole 2110 of the positioning base 211. When the first housing 110 is assembled with the second housing 200, the electrical connection between the conductive component 2120 and the connection area 121 can achieve electrical connection between the sensor 12 and the electronic module 120. The through hole 2120 penetrates the second housing 200 at the position of the positioning base 211. In other words, the through hole 2120 is independent of the sealed space. Therefore, undesirable substances that enter the split medical device 10 through the through hole 2120 can be isolated from the sealed space, thereby improving the protection effect of the electrical connection part of the split medical device 10.

[0073] Hereinafter, for the convenience of describing the present disclosure, the groove portion 131 that exposes the connection region 121 is referred to as a first groove portion 131 . In other words, the groove portion 131 that matches the mounting seat 210 can be referred to as the first groove portion 131 .

[0074] In some examples, the electronic assembly 100 may include a power module 140 (see FIG. 3 ). In other words, the split medical device 10 may include a power module 140 .

[0075] In some examples, the power module 140 may be disposed on the isolation member 130. In some examples, the isolation member 130 may have a second slot 135 for accommodating the power module 140 (see FIG. 5A).

[0076] In some examples, power module 140 may be configured to provide energy to electronics module 120 .

[0077] In some examples, the protrusion 133 can surround the first groove portion 131 and the second groove portion 135. In other words, the first protrusion 133 can surround the first groove portion 131 and the second groove portion 135. In this case, the protrusion 133 surrounds the first groove portion 131 and the second groove portion 135. When the first housing 110 is assembled with the second housing 200, the protrusion 133 surrounding the first groove portion 131 and the second groove portion 135 is squeezed by the second housing 200 and deformed. As a result, the isolation member 130 can be more tightly attached to the second housing 200 when the first housing 110 is assembled with the second housing 200, and the connection area 121 located in the first groove portion 131 and the power module 140 located in the second groove portion 135 can be sealed. As a result, the sealing effect of the split medical device 10 can be improved.

[0078] In some examples, a third protrusion 136 can be provided on the functional surface 132 (see FIG. 5A ). In some examples, the third protrusion 136 can be configured to connect with the first protrusion 133 and separate the first groove 131 from the second groove 135. In this case, when the first housing 110 is assembled with the second housing 200, the first protrusion 133, the third protrusion 136, and the second housing 200 cooperate to form two independent sealed spaces, respectively including the first groove 131 and the second groove 135. This allows the connection area 121 and the mounting seat 310 located in the first groove 131, as well as the power module 140 located in the second groove 135, to be sealed separately.

[0079] In some examples, the third protrusion 136 can be located within the closed shape formed by the first protrusion 133. In some examples, the third protrusion 136 can be connected to the first protrusion 133 to form two closed shapes. In some examples, the first groove 131 and the second groove 135 are respectively located within the two closed shapes. Thus, when the first housing 110 is assembled with the second housing 200, the first groove 131 and the second groove 135 can be located in different sealed spaces.

[0080] In some examples, when the first housing 110 is pointing toward the second housing 200, the extension length of the third protrusion 136 can be the same as the extension length of the first protrusion 133. In this case, when the first housing 110 is assembled with the second housing 200, the second housing 200 can simultaneously exert an extrusion effect on the first protrusion 133 and the third protrusion 136, so that the first protrusion 133 and the third protrusion 136 can both fit tightly against the second housing 200.

[0081] In some examples, the second housing 200 may have at least one hole 220 for positioning the second housing 200. In some examples, when the first housing 110 is assembled with the second housing 200, the at least one hole 220 in the second housing 200 may be located on the side of the third protrusion 136 away from the second groove 135. In this case, because the hole 220 is located on the side of the third protrusion 136 away from the second groove 135, when the first housing 110 is assembled with the second housing 200, the hole 220 can be independent of the sealed space including the second groove 135. This isolates unwanted substances that enter the split medical device 10 through the hole 220 from the sealed space including the second groove 135, thereby improving the sealing effect on the power module 140. It should be noted that the aforementioned at least one hole 220 can be located on the side of the third protrusion 136 away from the second groove 135, which means that all holes 220 used for positioning the second housing 200 are located on the side of the third protrusion 136 away from the second groove 135.

[0082] In some examples, at least one fourth protrusion 137 (see FIG. 5A ) may be provided on the functional surface 132 to match the at least one hole 220. In this case, the fourth protrusion 137 can block the hole 220, preventing unwanted substances from entering the split medical device 10 through the hole 220, thereby further improving the sealing effect of the split medical device 10.

[0083] In some examples, the shape of the fourth protrusion 137 may match the shape of the hole 220 . For example, when the shape of the hole 220 is circular, the shape of the fourth protrusion 137 may also be circular.

[0084] In some examples, the radial dimension of fourth protrusion 137 may be no smaller than the radial dimension of hole 220. In some examples, the circumferential dimension of fourth protrusion 137 may be no smaller than the circumferential dimension of hole 220. Thus, the probability of unwanted substances entering split medical device 10 can be reduced.

[0085] In some examples, the number of fourth protrusions 137 may be the same as the number of holes 220. For example, as described above, when the first housing 110 has holes 220a, 220b, 220c, and 220d, the isolation member 130 may also be provided with fourth protrusions 137a, 137b, 137c, and 137d corresponding to the four holes 220.

[0086] In some examples, when the first housing 110 is assembled with the second housing 200, the at least one fourth protrusion 137 may be squeezed and deformed in the direction from the second housing 200 to the first housing 110. In this case, the fourth protrusion 137 can block the hole 220, preventing unwanted substances from entering the split medical device 10 through the hole 220, thereby further improving the sealing effect of the split medical device 10.

[0087] FIG6 is a flow chart illustrating a method for preparing an electronic component 100 according to an example of the present disclosure.

[0088] In some examples, the electronic assembly 100 may include an electronic module 120 , a spacer 130 , and a first housing 110 .

[0089] As described above, the present disclosure also relates to a method for preparing an electronic assembly 100 (hereinafter referred to as the preparation method). In some examples, the electronic assembly 100 obtained by the preparation method of the present disclosure may be the electronic assembly 100 of the split medical device 10 involved in the first aspect of the present disclosure. In other words, the electronic assembly 100 obtained by the preparation method of the present disclosure may include the electronic module 120, the isolation member 130, and the first housing 110 as described above.

[0090] In some examples, see Figure 6, the preparation method may include: preparing a first shell 110 with an electronic module 120 (step S100), coupling the first shell 110 with a mold having a preset shape (step S200), supplying injection molding material with a preset temperature to the mold (step S300), waiting for the injection molding material to cool, removing the mold to obtain the spacer 130 (step S400), and obtaining the electronic assembly (step S500). In this case, the electronic assembly 100 obtained by supplying injection molding material to the mold, wherein the spacer 130 can be tightly bonded to the first shell 110 and seal the electronic module 120 provided in the first shell 110, the preset shape of the mold matches the shape of the spacer 130, so that the injection molding material forms the spacer 130 with a desired structure after cooling, and the structure of the spacer 130 can improve the sealing effect of the electronic assembly 100 after assembly; at the same time, the spacer 130 can also play a role in stabilizing the various electronic components of the electronic module 120.

[0091] As described above, in some examples, in step S100, a first housing 110 provided with an electronic module 120 may be prepared. In some examples, the electronic module 120 may be placed inside the first housing 110. In some examples, the electronic module 120 may be bonded to the inside of the first housing 110.

[0092] In some examples, in step S200, first housing 110 may be coupled to a mold having a preset shape. In some examples, the preset shape matches the shape of spacer 130. In some examples, the inner contour of the mold may match the outer contour of spacer 130. In this case, spacer 130 formed from the injection molded material after cooling can have a desired structure, and the structure of spacer 130 can improve the sealing effect of electronic assembly 100 after assembly.

[0093] In some examples, the mold may have a sprue for supplying the molding material.

[0094] In some examples, in step S300, an injection molding material having a preset temperature may be supplied to the mold. In some examples, the preset temperature may be 150 degrees Celsius to 200 degrees Celsius. For example, the preset temperature may be 150 degrees Celsius, 160 degrees Celsius, 170 degrees Celsius, 180 degrees Celsius, 190 degrees Celsius, or 200 degrees Celsius. In this case, during the injection molding process, the injection molding material having a lower temperature may be injected into the mold, thereby further reducing damage to the electronic component 100 during the injection molding process.

[0095] In some examples, the injection molding material may include silicone. In this case, the spacer 130 formed after the injection molding material cools can have high water resistance and elasticity, thereby improving the sealing effect of the electronic module 120.

[0096] In some examples, the injection molding material may include silicone and a functional agent, and the functional agent may be an active agent for bonding the silicone and the first housing 110. For example, the functional agent may be epoxy resin glue, neoprene glue, acrylic glue, polyurethane glue, etc.

[0097] In some examples, when the molding material includes silicone, the material can be supplied to the mold using low pressure. Low-pressure injection molding is a packaging process that uses a relatively low injection pressure (typically between 0.15 MPa and 4 MPa, with MPa being a unit of pressure) to inject the molding material into the mold. This can reduce damage to the electronic component 100 during the molding process.

[0098] In some examples, in step S400 , the mold may be removed after the injection-molded material cools down to obtain the spacer 130 .

[0099] In some examples, the molded material can be cooled at room temperature. In some examples, the molded material can solidify to form a solid part after cooling. In some examples, the molded material does not adhere to the mold after cooling, thereby allowing for easy removal from the mold.

[0100] In some examples, the spacer 130 may cover the electronic module 120 , thereby enabling the electronic module 120 to be sealed.

[0101] In some examples, the spacer 130 may cover the electronic module 120 in a manner that exposes the connection region 121 where the electronic module 120 needs to be electrically connected to the sensor 12. Thus, the sensor 12 can be electrically connected to the connection region 121, thereby enabling the split medical device 10 to obtain analyte information, and the electronic module 120 can obtain the analyte information through the electrical connection.

[0102] In some examples, the hardness of the injection molding material after curing can be 10 to 60 degrees. For example, the hardness can be 10, 15, 30, 45, or 60 degrees. In this case, the spacer 130 can have a high elasticity.

[0103] Generally speaking, the physical unit of hardness of cured silicone is Shore hardness, which can be used to characterize the hardness or softness of a material. The lower the hardness, the softer the material. Silicone with a hardness of 10 degrees is relatively soft and elastic, easily squeezed and rebounding, providing an effective seal. Silicone with a hardness of 60 degrees is also elastic and can be squeezed and rebounding. Compared to silicones with lower hardness, it is also stronger and less susceptible to wear.

[0104] In some examples, in step S500, the electronic assembly 100 can be obtained. In some examples, the spacer 130 in the obtained electronic assembly 100 can seal the electronic module 120. In some examples, the electronic assembly 100 can be assembled with the second housing 200 and applied to the target.

[0105] In some examples, electronic assembly 100 may further include a power module 140. In some examples, after the injection molding material is cured to form isolation member 130, power module 140 may be installed in second groove 135. In some examples, power module 140 may include a battery compartment 141 and a battery 142 (see FIG. 3 ).

[0106] In the split medical device 10 involved in the present disclosure, the isolation member 130 is attached to the first shell 110 and partially covers the electronic module 120, which can initially seal the electronic module 120. Moreover, since the isolation member 130 has a groove portion 131 for exposing the connection area 121 and matching the mounting seat 210 for setting the sensor 12, when the first shell 110 is assembled with the second shell 200, the sensor 12 can be electrically connected to the connection area 121, thereby enabling the split medical device 10 to obtain analyte information; In addition, since the isolation member 130 has a protrusion 133 surrounding the groove portion 131, when the first shell 110 is assembled on the second shell 200, the protrusion 133 surrounding the groove portion 131 will be squeezed by the second shell 200 and deformed, so that the isolation member 130 can fit more closely to the second shell 200 when the first shell 110 is assembled on the second shell 200, thereby achieving the sealing of the groove portion 131, that is, the connection area 121 can be sealed, which can further improve the sealing effect of the electronic module 120.

[0107] In addition, through the preparation method of the electronic component 100 involved, the first shell 110 and the isolation member 130 can be tightly bonded, and the structure of the isolation member 130 can improve the sealing effect of the electronic component 100 after assembly; at the same time, the isolation member 130 can also play a role in stabilizing the various electronic components of the electronic module 120.

[0108] Although the present disclosure has been described in detail above with reference to the accompanying drawings and embodiments, it will be understood that the above description does not limit the present disclosure in any form. Those skilled in the art may modify and change the present disclosure as needed without departing from the spirit and scope of the present disclosure, and such modifications and variations all fall within the scope of the present disclosure.

Claims

1. A split-type medical device, characterized in that, The split-type medical device includes a first housing, an electronic module and a spacer disposed in the first housing, a second housing detachably assembled with the first housing, and a sensor disposed in the second housing. The second housing includes a mounting seat for disposing a sensor that can be placed subcutaneously. The spacer has a groove-shaped portion matching the mounting seat and a functional surface facing away from the electronic module, and a protrusion surrounding the groove-shaped portion is provided on the functional surface. The electronic module includes a connection area for electrically connecting with the sensor, and the spacer is configured to fit on the first housing and cover the electronic module in such a way that the connection area is exposed by the groove-shaped portion. When the first housing is assembled to the second housing, the spacer is located between the second housing and the first housing, and the protrusion deforms in the direction from the second housing to the first housing, and the mounting seat is located in the groove-shaped portion and the sensor is electrically connected to the electronic module through the connection area.

2. The split-type medical device according to claim 1, wherein, Let the protrusion surrounding the groove-shaped portion be the first protrusion, and the groove-shaped portion has a second protrusion surrounding the connection area. When the first housing is assembled to the second housing, the second protrusion deforms in the direction from the second housing to the first housing.

3. The split-type medical device according to claim 1 or 2, characterized in that, The split-type medical device includes a power module configured to supply energy to the electronic module. Let the groove-shaped portion matching the mounting seat be the first groove-shaped portion, and the spacer has a second groove-shaped portion configured to accommodate the power module, and the protrusion surrounds the first groove-shaped portion and the second groove-shaped portion.

4. The split-type medical device according to claim 3, wherein Let the protrusion surrounding the groove-shaped portion be the first protrusion, and a third protrusion connected to the first protrusion and configured to isolate the first groove-shaped portion and the second groove-shaped portion is provided on the functional surface. In the direction from the first housing to the second housing, the extension length of the third protrusion is the same as that of the first protrusion.

5. The split-type medical device according to claim 2, characterized in that The mounting seat includes a positioning seat and a base. The positioning seat has a through hole penetrating the second housing, and the sensor is positioned in the second housing through the through hole. The base is configured to accommodate a conductive component electrically connected to the sensor. The sensor is electrically connected to the connection area through the conductive component. When the first housing is assembled to the second housing, the base presses the second protrusion, and the base and the second protrusion cooperate to form a sealed space.

6. The split-type medical device according to claim 4, wherein The second housing has at least one hole for positioning the second housing. When the first housing is assembled to the second housing, the at least one hole is located on a side of the third protrusion away from the second groove-shaped portion.

7. The split-type medical device according to claim 6, wherein, At least one fourth protrusion matching the at least one hole is provided on the functional surface. When the first housing is assembled to the second housing, the at least one fourth protrusion deforms in the direction from the second housing to the first housing.

8. The split-type medical device according to claim 1, wherein, The spacer is elastic and adhesively bonded to the inner contour of the first housing.

9. A method for preparing an electronic component, characterized in that, The electronic component includes an electronic module, a spacer, and a first housing as described in any one of claims 1 to 8, and the method for manufacturing the electronic component includes: Preparing the first housing provided with the electronic module; Coupling the first housing with a mold having a preset shape, the preset shape matching the shape of the spacer; Supplying an injection molding material having a preset temperature to the mold; Removing the mold after the injection molding material cools to obtain the spacer; and Obtaining the electronic component.

10. The method for preparing an electronic component according to claim 9, wherein, The injection molding material includes silica gel.

11. The method for preparing an electronic component according to claim 9, wherein, The preset temperature is 150 degrees Celsius to 200 degrees Celsius.

12. The method for preparing an electronic component according to claim 9, wherein The hardness of the injection molding material after curing is 10 degrees to 60 degrees.

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