Optical amplification assembly

Abstract

An optical amplification assembly is disclosed. The optical amplification assembly includes a submount that includes an input optical interface that receives an input optical signal at a perpendicular angle of the submount. A curved optical waveguide receives the input optical signal from the input optical interface and transmit the received input optical signal. An amplification chip receives the input optical signal at an angle of the amplification chip and emit, based on the input optical signal, an amplified optical signal at another angle of the amplification chip. Another curved optical waveguide receives the amplified optical signal from the amplification chip. An output optical interface of the submount receives the amplified signal from the other curved optical waveguide and emit the amplified optical signal at a perpendicular angle of the submount.

Description

OPTICAL AMPLIFICATION ASSEMBLYCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This Patent Application makes reference to, claims priority to, and claims the benefit of US provisional application 63 / 615,054 filed December 27, 2023, the contents of which is hereby incorporated herein by reference in its entirety.FIELD

[0002] Various embodiments of the disclosure relate generally to optical circuits. More particularly, various embodiments of the disclosure relate to an optical amplification assembly.BACKGROUND

[0003] Semiconductor Optical Amplifiers (SOAs) are critical components in optical systems, particularly in applications where power amplification of optical signals is required. One prominent use case for SOAs is in sensing applications, where a high optical power is necessary to achieve an enhanced signal-to-noise ratio. This is particularly relevant in optical systems that experience high insertion loss. For instance, integration of optical systems with micro-optic components and silicon- based photonics platforms often results in high insertion losses, where the use of an SOA can offset these losses and maintain system performance.

[0004] SOAs are highly sensitive to back reflection, especially from amplified light traversing through the SOA device. Back-reflected light can significantly degrade the performance of the SOA. To mitigate this, SOA devices typically include high-quality cleaved facets, anti-reflection coatings on the input and output ports, and angled optical facets-typically ranging from 5 to 12 degrees to suppress unwanted reflections. The geometrical layout of the SOA chip on a submount is also designed to align the input and output light paths at non-normal orientations, with the chip often being angled up to 42 degrees from the submount edge to ensure proper light coupling and reflection suppression.

[0005] The angled orientation of the SOA chip requires a physical clearance between the coupling interfaces of the SOA facet and the optical fibers or micro-lenses. This results in a design that does not allow for direct butt-coupling of the SOA chip to external optical circuits, preventing efficient optical contact through direct alignment. In the case of an array of SOA channels integrated on a single chip, coupling micro-optics must be precisely aligned with the input and output ports of the SOAs. This requires a fixed working distance and orientation for each optical path. The angled configuration of the SOA chip makes it difficult to use a planar lens array for efficient alignment, as the staggered arrangement required for each SOA channel is not compatible with a flat opticallens array. This misalignment increases the complexity of integrating SOA arrays in muiu-cnanner optical systems.

[0006] In light of the foregoing, there is a need for a technical solution that overcomes the above-mentioned problems.SUMMARY

[0007] In an embodiment of the present disclosure, an optical amplification assembly is disclosed. The optical amplification assembly includes a submount. The submount includes an input optical interface configured to receive an input optical signal at a first perpendicular angle of the submount. The submount further includes a first curved optical waveguide coupled to the input optical interface. The first curved optical waveguide is configured to receive the input optical signal from the input optical interface and transmit the received input optical signal. The submount further includes an amplification chip coupled to the first curved optical waveguide. The amplification chip is configured to receive the transmitted input optical signal at a first angle of the amplification chip and emit, based on the input optical signal received at the first angle, an amplified optical signal at a second angle of the amplification chip. The submount further includes a second curved optical waveguide coupled to the amplification chip. The second curved optical waveguide is configured to receive the amplified optical signal and transmit the received amplified optical signal. The submount further includes an output optical interface coupled to the second curved optical waveguide. The output optical interface is configured to receive the transmitted amplified optical signal from the second curved optical waveguide and emit the amplified optical signal received from the second curved optical waveguide at a second perpendicular angle of the submount.

[0008] In some embodiments, the input optical interface has an angled etched facet to receive the input optical signal at the first perpendicular angle of the submount.

[0009] In some embodiments, the output optical interface has an angled etched facet to receive the amplified optical signal from the second curved optical waveguide and emit the amplified optical signal at the second perpendicular angle of the submount.

[0010] In some embodiments, the first curved optical waveguide is divided into a first curved section and a second curved section. The first curved section is configured to receive the input optical signal from the input optical interface and direct the input optical signal received from the input optical interface to the second curved section.

[0011] In some embodiments, the submount further comprises a first intermediate interface between the first curved optical waveguide and the amplification chip.

[0012] In some embodiments, the second curved section is configured to receive me input optical signal from the first curved section and transmit the input optical signal received from the first curved section at a third angle of the first intermediate interface.

[0013] In some embodiments, the first intermediate interface is configured to receive the transmitted input optical signal at the third angle of the first intermediate interface from the second curved section. The first intermediate interface is further configured to direct the input optical signal received from the second curved section at the first angle to the amplification chip.

[0014] In some embodiments, the input optical interface, the first curved optical waveguide, and the first intermediate interface correspond to one continuous waveguide.

[0015] In some embodiments, the submount further comprises a second intermediate interface between the amplification chip and the second curved optical waveguide. The second intermediate interface is configured to receive the amplified optical signal at a fourth angle of the second intermediate interface from the amplification chip. The second intermediate interface is further configured to direct the amplified optical signal received from the amplification chip to the second curved optical waveguide.

[0016] In some embodiments, the second curved optical waveguide is divided into a third curved section and a fourth curved section. The third curved section is configured to receive the amplified optical signal from the second intermediate interface. The third curved section is further configured to direct the amplified optical signal received from the second intermediate interface to the fourth curved section.

[0017] In some embodiments, the fourth curved section is configured to receive the amplified optical signal from the third curved section. The fourth curved section is further configured to direct the amplified optical signal received from the third curved section to the output optical interface.

[0018] In some embodiments, the second intermediate interface, the second curved optical waveguide, and the output optical interface correspond to one continuous waveguide.

[0019] In some embodiments, the first angle of the amplification chip equals the second angle of the amplification chip.

[0020] In some embodiments, the submount further comprises a first structure configured to vertically align the amplification chip on the submount

[0021] In some embodiments, the submount further comprises a second structure comigurea to laterally align the amplification chip on the submount.

[0022] In some embodiments, the amplification chip is a semiconductor optical amplifier.

[0023] In some embodiments, the input optical interface and the output optical interface is a fiber edge coupler. The input optical interface and the output optical interface are positioned vertically with respect to the submount.

[0024] In some embodiments, the first curved optical waveguide and the second curved optical waveguide have an S-shaped structure.

[0025] In some embodiments, the submount further comprises a first diode edge coupler and a second diode edge coupler. The first curved optical waveguide is coupled to the amplification chip via the first diode edge coupler, and the second curved optical waveguide is coupled to the amplification chip via the second diode edge coupler.

[0026] In some embodiments, an optical axis of the first diode edge coupler matches an input optical axis of the amplification chip. Further, an optical axis of the second diode edge coupler matches an output optical axis of the amplification chip. The reception of the input optical signal at the first angle of the amplification chip is based on the match between the optical axis of the first diode edge coupler and the input optical axis. Additionally, the emission of the amplified optical signal at the second angle of the amplification chip is based on the match between the optical axis of the second diode edge coupler and the output optical axis of the amplification chip.

[0027] These and other features and advantages of the present disclosure may be appreciated from a review of the following detailed description of the present disclosure, along with the accompanying drawings in which like reference numerals refer to like parts throughout.BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings illustrate the various embodiments of devices, methods, and other aspects of the disclosure by way of example. As such, the embodiments herein are not limited to the specific components, structures, and methods disclosed herein. Further, the terms “first”, “second”, and “third” are used herein for descriptive purposes only and are not to be construed to indicate or imply relative importance.

[0029] Various embodiments of the present disclosure are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which:

[0030] FIG. 1 illustrates a top view of an optical amplification assembly, in accordance wim an embodiment of the present disclosure;

[0031] FIG. 2 illustrates the optical amplification assembly 100, in accordance with a further embodiment of the present disclosure; and

[0032] FIG 3 illustrates the optical amplification assembly 100 as a pluggable receptacle, in accordance with an embodiment of the present disclosure.DETAILED DESCRIPTION

[0033] The present disclosure is best understood with reference to the detailed figures and descriptions set forth herein. Various embodiments are discussed below with reference to the figures. However, those skilled in the art will readily appreciate that the detailed descriptions provided herein with respect to the figures are merely for explanatory purposes as the devices and methods may extend beyond the described embodiments. In one example, the teachings presented and the needs of a particular application may yield multiple alternate and suitable approaches to implement the functionality of any detail described herein. Therefore, any approach may extend beyond the particular implementation choices in the following embodiments that are described and shown.

[0034] Various embodiments of the present disclosure disclose an optical amplification assembly that enables easy coupling of an amplification chip to external optical circuits. The optical amplification assembly includes a submount that includes an input optical interface configured to receive an input optical signal at a first perpendicular angle of the submount. The submount further includes a first curved optical waveguide configured to receive the input optical signal from the input optical interface and transmit the received input optical signal. The submount further includes an amplification chip configured to receive the transmitted input optical signal at a first angle of the amplification chip and emit, based on the input optical signal received at the first angle, an amplified optical signal at a second angle of the amplification chip. Further, a second curved optical waveguide is configured to receive the amplified optical signal. An output optical interface of the submount is configured to receive the amplified signal from the second curved optical waveguide and emit the amplified optical signal received from the second curved optical waveguide at a second perpendicular angle of the submount. The disclosed optical amplification assembly allows for direct butt-coupling of the amplification chip into external optical circuits. Additionally, back-reflection in the disclosed optical amplification assembly is lower in comparison to back-reflection in conventional optical amplification assembly. Further, low optical insertion losses are observed inthe disclosed optical amplification assembly in comparison to conventional optical ampuncation assembly.

[0035] FIG. 1 illustrates a top view of an optical amplification assembly 100, in accordance with an embodiment of the present disclosure. The optical amplification assembly 100 may be configured to amplify power of optical signals. The optical amplification assembly 100 may include a submount 102. In an example, the submount 102 may be made of Silicon.

[0036] The submount 102 may include an input optical interface 104. The input optical interface 104 may be disposed in the submount 102. The input optical interface 104 may be configured to receive an input optical signal 106 at a first perpendicular angle 107 of the submount 102. The input optical signal 106 may be received at the first perpendicular angle 107 of an edge of the submount 102. Additionally, the input optical signal 106 may be received from an optical source (not shown).

[0037] The input optical interface 104 has an angled etched facet to receive the input optical signal 106 at the first perpendicular angle 107 of the submount 102. Further, the input optical interface 104 is a fiber edge coupler. A fiber edge coupler is designed to couple optical signals from an optical fiber into or out of another medium or device, such as another fiber, waveguide, or photonic circuit. The fiber edge coupler is used to efficiently transfer optical signals between different components, such as from a fiber to a planar waveguide, an integrated photonic chip, or another fiber with minimal loss or distortion. Additionally, the input optical interface 104 may be positioned vertically with respect to the submount 102.

[0038] The submount 102 may further include a first curved optical waveguide 108 and an amplification chip 110. Further, the first curved optical waveguide 108 may be disposed in the submount 102 and coupled to the input optical interface 104 and the amplification chip 110. The first curved optical waveguide 108 may be configured to receive the input optical signal 106 from the input optical interface 104 and transmit the received input optical signal 106. The first curved optical waveguide 108 may have an S-shaped structure. The first curved optical waveguide 108 may be formed in the submount 102 using Silicon-on-Insulator or Silicon Nitride.

[0039] The first curved optical waveguide 108 may be divided into a first curved section 112 and a second curved section 114. The first curved section 112 may be configured to receive the input optical signal 106 from the input optical interface 104. The first curved section 112 may be further configured to direct the input optical signal 106 received from the input optical interface 104 to the second curved section 114. The submount 102 may further include a first intermediate interface 116 between the first curved optical waveguide 108 and the amplification chip 110.

[0040] The second curved section 114 may be configured to receive the input optical signal IUO from the first curved section 112. The second curved section 114 may be further configured to transmit the input optical signal 106 received from the first curved section 112 at a first angle 117 of the first intermediate interface 116. The first intermediate interface 116 may correspond to a diode edge coupler. Thus, the first intermediate interface 116 may be alternatively referred to as the “first diode edge coupler 116”.

[0041] A diode edge coupler is designed to couple optical signals between an optical waveguide and an active region of an amplification chip. The diode edge coupler aligns the optical waveguide with an edge of the amplification chip to match the optical properties (e.g., mode size and refractive index) of the optical waveguide and the amplification chip. In some embodiments, the first intermediate interface 116 may be angled with respect to the amplification chip 110. The input optical interface 104, the first curved optical waveguide 108, and the first intermediate interface 116 may correspond to one continuous waveguide. Additionally, the S-shaped structure of the first curved optical waveguide 108 is designed with a large turning radius and short length to align the input optical interface 104 to the first intermediate interface 116.

[0042] The amplification chip 110 may be mounted on the submount 102. In some embodiments, the amplification chip 110 may be passively aligned on the submount 102. In an example, the amplification chip 110 may be mounted on the submount 102 by thermal soldering process. Further, the amplification chip 110 may be configured to receive the transmitted input optical signal 106 at a second angle 118 of the amplification chip 110. The transmitted input optical signal 106 may be received from the first intermediate interface 116. In an example, the second angle 118 may range between 20 degrees to 42 degrees. Further, amplification chip 110 may be configured to emit, based on the input optical signal 106 received at the second angle 118, an amplified optical signal 119 at a third angle 120 of the amplification chip 110. In an example, the third angle 120 may range between 20 degrees to 42 degrees. Also, the second angle 118 of the amplification chip 110 equals the third angle 120 of the amplification chip 110. The amplification chip 110 may include an active region that is configured to amplify the input optical signal 106 prior to emitting the amplified optical signal 119. Thus, an optical power of the amplified optical signal 119 is greater than an optical power of the input optical signal 106. The amplification chip 110 may be a semiconductor optical amplifier. A semiconductor optical amplifier refers to a type of optical amplifier that utilizes a semiconductor material to amplify optical signals.

[0043] An input optical axis of the amplification chip 110 is parallel to an output optical axis of the amplification chip 110 with a definitive lateral separation therebetween. The input optical axis of the amplification chip 110 corresponds to a direction along which the input optical signal106 is received by the amplification chip 110. Further, the output optical axis of the ampuncauon chip 110 corresponds to a direction along which the amplified optical signal 119 is emitted from the amplification chip 110.

[0044] The amplification chip 110 may include an input facet 121 and an output facet 122. The input facet 121 and the output facet 122 may correspond to angled facets. Additionally, the input facet 121 and the output facet 122 may be angled at a same angle in opposite directions. The amplification chip 110 may receive the input optical signal 106 via the input facet 121. Further, the amplification chip 110 may emit the amplified optical signal 119 via the output facet 122. The input facet 121 being an angled facet causes the input optical signal 106 to be received at the second angle 118 of the amplification chip 110. Similarly, the output facet 122 being an angled facet causes the amplified optical signal 119 to be emitted at the third angle 120 of the amplification chip 110. In an example, the input facet 121 and the output facet 122 may be angled in a range of 6 degrees to 12 degrees. In some embodiments, an anti-reflection coating may be applied on the input facet 121 and the output facet 122 to reduce back reflections in the amplification chip 110.

[0045] The submount 102 may further include a first structure that may be configured to vertically align the amplification chip 110 on the submount 102. The first structure may include a plurality of Z-Stops 124. The plurality of Z-stops 124 may include a first Z-stop 124a, a second Z- Stop 124b, a third Z-stop 124c, and a fourth Z-stop 124d. A Z-Stop may refer to a component utilized to limit or control an axial position of optical elements (e.g., the amplification chip 110) within an assembly (e.g., the optical amplification assembly 100). Additionally, the submount 102 may include a second structure configured to laterally align the amplification chip 110 on the submount 102. The second structure may include a plurality of fiducial markers 126. The plurality of fiducial markers 126 may include a first fiducial marker 126a, a second fiducial marker 126b, a third fiducial marker 126c, and a fourth fiducial marker 126d. A fiducial marker refers to a reference point used to align, position, or calibrate an optical component during assembly.

[0046] The submount 102 may further include a second intermediate interface 128 and a second curved optical waveguide 130. The second intermediate interface 128 may be between the amplification chip 110 and the second curved optical waveguide 130. The second intermediate interface 128 may be configured to receive the amplified optical signal 119 at a fourth angle 131 of the second intermediate interface 128 from the amplification chip 110. The second intermediate interface 128 may be further configured to direct the amplified optical signal 119 received from the amplification chip 110 to the second curved optical waveguide 130. The second intermediate interface 128 may correspond to the diode edge coupler. Thus, the second intermediate interface 128 may be alternatively referred to as the “second diode edge coupler 128”.

[0047] An optical axis of the first diode edge coupler 116 matches the input optical axis oi me amplification chip 110. Further, the reception of the input optical signal 106 at the second angle 118 of the amplification chip 110 is based on the match between the optical axis of the first diode edge coupler 116 and the input optical axis. Additionally, an optical axis of the second diode edge coupler 128 matches the output optical axis of the amplification chip 110. The emission of the amplified optical signal 119 at the third angle 120 of the amplification chip 110 is based on the match between the optical axis of the second diode edge coupler 128 and the output optical axis of the amplification chip 110.

[0048] The second curved optical waveguide 130 may be configured to receive the amplified optical signal 119 from the second intermediate interface 128. The second curved optical waveguide 130 may be further configured to transmit the received amplified optical signal 119.

[0049] The submount 102 may further include an output optical interface 132 coupled to the second curved optical waveguide 130. The second curved optical waveguide 130 may have an S- shaped structure. The S-shaped structure minimizes back reflection associated with the amplified optical signal 119 to the amplification chip 110. The second curved optical waveguide 130 may be formed in the submount 102 using Silicon-on-Insulator or Silicon Nitride.

[0050] The second curved optical waveguide 130 may be divided into a third curved section 134 and a fourth curved section 136. The third curved section 134 may be configured to receive the amplified optical signal 119 from the second intermediate interface 128. Additionally, the third curved section 134 may be further configured to direct the amplified optical signal received from the second intermediate interface 128 to the fourth curved section 136. The fourth curved section 136 may be configured to receive the amplified optical signal 119 from the third curved section 134. Further, the fourth curved section 136 may be configured to direct the amplified optical signal received from the third curved section 134 to the output optical interface 132.

[0051] The output optical interface 132 may be configured to receive the transmitted amplified signal 119 from the second curved optical waveguide 130. Further, the output optical interface 132 may be configured to emit the amplified optical signal 119 received from the second curved optical waveguide 130 at a second perpendicular angle 137 of the submount 102. The output optical interface 132 may couple the optical amplification assembly 100 to an external optical circuit (not shown). Additionally, the S-shaped structure of the second curved optical waveguide 130 is designed with a large turning radius and short length to align the second intermediate interface 128 to the output optical interface 132.

[0052] The output optical interface 132 may have an angled etched facet to receive me amplified optical signal 119 from the second curved optical waveguide 130 and emit the amplified optical signal 119 at the second perpendicular angle 137 of the submount 102. Further, the output optical interface 132 is the fiber edge coupler. Additionally, the output optical interface 132 may be positioned vertically with respect to the submount 102. The second intermediate interface 128, the second curved optical waveguide 130, and the output optical interface 132 may correspond to one continuous waveguide.

[0053] The submount 102 may further include an optical interface section 138 and an electronic interface section 140. The optical interface section 138 may accommodate the input optical interface 104, the first curved optical waveguide 108, the first intermediate interface 116, the second intermediate interface 128, the second curved optical waveguide 130, and the output optical interface 132. Additionally, the electronic interface section 140 may include a trench 142 where the amplification chip 110 is mounted. The trench 142 may further include a metal contact pad 144. Further, the amplification chip 110 may include a metal contact pad 146. The metal contact pad 144 and the metal contact pad 146 facilitate electrical and thermal connections between the submount 102 and the amplification chip 110.

[0054] The submount 102 may further include a thermistor 148. The thermistor 148 may be configured to monitor and maintain thermal stability of the optical amplification assembly 100. The submount 102 may additionally include a metal contact pad 150 that is configured to electrically and thermally couple the submount 102 to the thermistor 148. The electronic interface section 140 may further include a trench 152 where the thermistor 148 is mounted.

[0055] FIG. 2 illustrates the optical amplification assembly 100 in accordance with a further embodiment of the present disclosure. The optical amplification assembly 100 is shown to further include an input optical interface 202a and an input optical interface 202b. The input optical interfaces 202a and 202b are structurally and functionally similar to the input optical interface 104. Thus, the input optical interface 202a may be configured to receive an input optical signal 204a and the input optical interface 202b may be configured to receive an input optical signal 204b.

[0056] The submount 102 may further include a first curved optical waveguide 206a and a first curved optical waveguide 206b. The first curved optical waveguides 206a and 206b are structurally and functionally similar to the first curved optical waveguide 108. The submount 102 may further include a first intermediate interface 208a and a first intermediate interface 208b. The first intermediate interfaces 208a and 208b are structurally and functionally similar to the first intermediate interface 116. The first curved optical waveguides 206a and 206b couple the inputoptical interfaces 202a and 202b to the first intermediate interfaces 208a and 208b, respectively. Thus, the first intermediate interfaces 208a and 208b receive the input optical signals 204a and 204b from the input optical interfaces 202a and 202b via the first curved optical waveguides 206a and 206b, respectively.

[0057] The submount 102 may further include an amplification chip 210a and an amplification chip 210b. The amplification chips 210a and 210b are structurally and functionally similar to the amplification chip 110. Thus, the amplification chips 210a and 210b are configured to receive the input optical signals 204a and 204b from the first intermediate interfaces 208a and 208b, respectively. Further, the amplification chips 210a and 210b are configured to emit amplified optical signals 212a and 212b, respectively.

[0058] The submount 102 may further include a second intermediate interface 214a and a second intermediate interface 214b. The second intermediate interfaces 214a and 214b are structurally and functionally similar to the second intermediate interface 128. Thus, the second intermediate interfaces 214a and 214b are configured to receive amplified optical signals 212a and 212b from the amplification chips 210a and 210b, respectively.

[0059] The submount 102 may further include second curved optical waveguides 216a and 216b. The second curved optical waveguides 216a and 216b are structurally and functionally similar to the second curved optical waveguide 130. Thus, the second curved optical waveguides 216a and 216b are configured to receive the amplified optical signals 212a and 212b from the second intermediate interfaces 214a and 214b, respectively. Further, the second curved optical waveguides 216a and 216b are configured to transmit the received amplified optical signals 212a and 212b, respectively.

[0060] The submount 102 may further include output optical interfaces 218a and 218b. The output optical interfaces 218a and 218b are structurally and functionally similar to the output optical interface 132. Thus, the output optical interfaces 218a and 218b are configured to receive amplified optical signals 212a and 212b from the second curved optical waveguides 216a and 216b, respectively. Further, the output optical interfaces 218a and 218b are configured to emit the amplified optical signals 212a and 212b at a perpendicular angle of the submount 102.

[0061] The amplification chips 110, 210a, and 210b may constitute a multi-channel array of amplification chips. Although, it is illustrated that the multi-channel array of amplification chips includes three amplification chips, the scope of the present disclosure is not limited to it. In other embodiments, the multi-channel array of amplification chips may include more than or less than three amplification chips.

[0062] The optical amplification assembly 100 described in FIG. 2 enables the ampmication or multiple input optical signals, simultaneously. Such an arrangement is in applications that require parallel processing of optical signals, such as in dense wavelength division multiplexing (DWDM) systems where multiple optical channels are to be amplified concurrently while maintaining signal integrity and minimizing cross-talk between channels.

[0063] FIG. 3 illustrates the optical amplification assembly 100 as a pluggable receptacle in accordance with an embodiment of the present disclosure. The optical amplification assembly 100 illustrated in FIG. 2 is shown in FIG. 3. Further, FIG. 3 is shown to include a first multifiber push- on (MPO) connector 302 and a second MPO connector 304. The MPO connectors 302 and 304 are connected to the optical amplification assembly 100 in a plug-and-play manner.

[0064] The present invention provides the optical amplification assembly 100 that enables easy coupling of the amplification chip 110 to external optical circuits. The disclosed optical amplification assembly 100 allows for direct butt-coupling of the amplification chip 110 into external optical circuits. Additionally, back-reflection in the optical amplification assembly 100 is lower in comparison to back-reflection in conventional optical amplification assembly. Further, low optical insertion losses are observed in the disclosed optical amplification assembly 100 in comparison to conventional optical amplification assembly.

[0065] In the claims, the words ‘comprising’, ‘including’, and ‘having’ do not exclude the presence of other elements or steps than those listed in a claim. The terms “a” or “an,” as used herein, are defined as one or more than one. Unless stated otherwise, terms such as “first” and “second” are used to arbitrarily distinguish between the elements such terms describe. Thus, these terms are not necessarily intended to indicate temporal or other prioritization of such elements. The fact that certain measures are recited in mutually different claims does not indicate that a combination of these measures cannot be used to advantage.

[0066] While various exemplary embodiments of the disclosed system and method have been described above it should be understood that they have been presented for purposes of example only, not limitations. It is not exhaustive and does not limit the disclosure to the precise form disclosed. Numerous modifications, changes, variations, substitutions, and equivalents will be apparent to those skilled in the art, without departing from the spirit and scope of the present disclosure, as described.

Claims

CLAIMSWhat is claimed is:

1. An optical amplification assembly, comprising: a submount that includes: an input optical interface configured to receive an input optical signal at a first perpendicular angle of the submount; a first curved optical waveguide coupled to the input optical interface, wherein the first curved optical waveguide is configured to: receive the input optical signal from the input optical interface; and transmit the received input optical signal; an amplification chip coupled to the first curved optical waveguide, wherein the amplification chip is configured to receive the transmitted input optical signal at a first angle of the amplification chip; and emit, based on the input optical signal received at the first angle, an amplified optical signal at a second angle of the amplification chip; a second curved optical waveguide coupled to the amplification chip, wherein the second curved optical waveguide is configured to: receive the amplified optical signal; and transmit the received amplified optical signal; and an output optical interface coupled to the second curved optical waveguide, wherein the output optical interface is configured to: receive the transmitted amplified optical signal from the second curved optical waveguide; and emit the amplified optical signal received from the second curved optical waveguide at a second perpendicular angle of the submount.

2. The optical amplification assembly of claim 1, wherein the input optical interface has an angled etched facet to receive the input optical signal at the first perpendicular angle of the submount.

3. The optical amplification assembly of claim 1, wherein the output optical interface has an angled etched facet to receive the amplified optical signal from the second curved opticalwaveguide and emit the amplified optical signal at the second perpendicular angle or me submount.

4. The optical amplification assembly of claim 1 , wherein the first curved optical waveguide is divided into a first curved section and a second curved section, and wherein the first curved section is configured to: receive the input optical signal from the input optical interface; and direct the input optical signal received from the input optical interface to the second curved section.

5. The optical amplification assembly of claim 4, wherein the submount further comprises a first intermediate interface between the first curved optical waveguide and the amplification chip.

6. The optical amplification assembly of claim 5, wherein the second curved section is configured to: receive the input optical signal from the first curved section; and transmit the input optical signal received from the first curved section at a third angle of the first intermediate interface.

7. The optical amplification assembly of claim 6, wherein the first intermediate interface is configured to: receive the transmitted input optical signal at the third angle of the first intermediate interface from the second curved section; and direct the input optical signal received from the second curved section at the first angle to the amplification chip.

8. The optical amplification assembly of claim 7, wherein the input optical interface, the first curved optical waveguide, and the first intermediate interface correspond to one continuous waveguide.

9. The optical amplification assembly of claim 1, wherein the submount further comprises a second intermediate interface between the amplification chip and the second curved optical waveguide, and wherein the second intermediate interface is configured to:receive the amplified optical signal at a fourth angle of the second intermediate interface from the amplification chip; and direct the amplified optical signal received from the amplification chip to the second curved optical waveguide.

10. The optical amplification assembly of claim 9, wherein the second curved optical waveguide is divided into a third curved section and a fourth curved section, and wherein the third curved section is configured to: receive the amplified optical signal from the second intermediate interface; and direct the amplified optical signal received from the second intermediate interface to the fourth curved section.

11. The optical amplification assembly of claim 10, wherein the fourth curved section is configured to: receive the amplified optical signal from the third curved section; and direct the amplified optical signal received from the third curved section to the output optical interface.

12. The optical amplification assembly of claim 11, wherein the second intermediate interface, the second curved optical waveguide, and the output optical interface correspond to one continuous waveguide.

13. The optical amplification assembly of claim 1, wherein the first angle of the amplification chip equals the second angle of the amplification chip.

14. The optical amplification assembly of claim 1, wherein the submount further comprises a first structure configured to vertically align the amplification chip on the submount.

15. The optical amplification assembly of claim 14, wherein the submount further comprises a second structure configured to laterally align the amplification chip on the submount.

16. The optical amplification assembly of claim 1, wherein the amplification chip is a semiconductor optical amplifier.

17. The optical amplification assembly of claim 1, wherein the input optical interlace ana me output optical interface is a fiber edge coupler, and wherein the input optical interface and the output optical interface are positioned vertically with respect to the submount.

18. The optical amplification assembly of claim 1, wherein the first curved optical waveguide and the second curved optical waveguide have an S-shaped structure.

19. The optical amplification assembly of claim 1, wherein the submount further comprises a first diode edge coupler and a second diode edge coupler, and wherein the first curved optical waveguide is coupled to the amplification chip via the first diode edge coupler, and the second curved optical waveguide is coupled to the amplification chip via the second diode edge coupler.

20. The optical amplification assembly of claim 19, wherein an optical axis of the first diode edge coupler matches an input optical axis of the amplification chip, an optical axis of the second diode edge coupler matches an output optical axis of the amplification chip, the reception of the input optical signal at the first angle of the amplification chip is based on the match between the optical axis of the first diode edge coupler and the input optical axis, and the emission of the amplified optical signal at the second angle of the amplification chip is based on the match between the optical axis of the second diode edge coupler and the output optical axis of the amplification chip.

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