Electronic assembly for a motor vehicle

Abstract

The invention relates to an electronic assembly 1 for a motor vehicle 2, which enables a small gap tolerance for a heat conducting material (15). The electronic assembly (1) comprises: - a housing (3), - a printed circuit board (4) which is fixed to the housing (3) and which is equipped with at least one electronic component (6) on its mounting side (5), - a cooling plate (7) for cooling the at least one electronic component (6), and -a pedestal plate (8), which is connected to the cooling plate (7) and is arranged between the mounting side (5) of the printed circuit board (4) and the cooling plate (7). The pedestal plate is fixed to the housing (3). The invention also relates to a motor vehicle (2) with an electronic assembly (1).

Description

[0001] Electronic assembly for a motor vehicle

[0002] The present invention relates to an electronic assembly for a motor vehicle, having a housing and a printed circuit board which is fixed to the housing and which is equipped with at least one electronic component on its mounting side, and having a cooling plate for cooling the at least one electronic component, and having a pedestal plate which is connected to the cooling plate and is arranged between the mounting side of the printed circuit board and the cooling plate. The invention further relates to an associated motor vehicle.

[0003] Technological progress in motor vehicles, especially in autonomous vehicles, depends heavily on the development of electronic components, especially control units. The exponential increase in the power requirements of electronic components in automotive engineering poses a major challenge for cooling solutions. The electronic components can generate enormous waste heat during operation, which must be dissipated so that the electronic component does not overheat and, in particular, is not damaged.

[0004] Accordingly, electronic assemblies which have at least one printed circuit board with one or more electronic components can additionally already have cooling plates for cooling the electronic components. For this purpose, it may be provided in the prior art that the printed circuit board and the cooling plate are each fixed to or borne on the housing of the electronic assemblies and are arranged so closely together that the cooling plate can absorb and dissipate the waste heat from the electronic assemblies as effectively as possible. In particular, a gap between the electronic component and a cooling surface of the cooling plate or a pedestal plate connected to the cooling plate should have a certain width with a small gap width tolerance, in particular in a tolerance range of micrometers to tenths of millimeters. The gap and its tolerance should be designed in particular so that a heat conducting material can be applied between the electronic component and the cooling plate or pedestal plate and can connect them in a heat conducting manner.

[0005] However, the cooling plates, which can be complex components to manufacture, can have a corresponding component tolerance in their thickness as well as in their flatness, for example of respectively 0.3 millimeters. Consequently, the tolerance for the width of the gap between the pedestal plate and the electronic component cannot be designed or achieved small enough, as the tolerance of the thickness and the flatness of the cooling plate has a cumulative effect on the tolerance of the gap.

[0006] The object of the present invention is to propose an improved concept for an electronic assembly in which a tolerance for the width of a gap between an electronic component and a cooling surface can be designed to be as small as possible.

[0007] The object is solved by the subject matters of the independent patent claims. Advantageous further embodiments of the invention are described by the dependent patent claims, the following description and the figures.

[0008] A first aspect of the invention relates to an electronic assembly for a motor vehicle. The electronic assembly comprises, in particular, a housing. The electronic assembly further comprises, in particular, a printed circuit board which is fixed to the housing and which is equipped with at least one electronic component on its mounting side. The electronic assembly further comprises, in particular, a cooling plate for cooling the at least one electronic component. The electronic assembly further comprises, in particular, a pedestal plate which is connected to the cooling plate and is arranged between the mounting side of the printed circuit board and the cooling plate. In particular, the pedestal plate is fixed to the housing.

[0009] In comparison to known solutions, it is not the cooling plate that is fixed to the housing, but rather the pedestal plate. Such a fixation can comprise various advantages. Because the pedestal plate is adjacent to the electronic component and the pedestal plate as well as the printed circuit board with the electronic component are fixed to the housing, a gap between the electronic component and the pedestal plate, in particular a width and a tolerance for the width of the gap, can be designed to be small, so that a cooling capacity can be increased and / or the introduction of a heat conducting material into the gap can be favored or made possible at all. In particular, it can be made possible and ensured that a heat conducting material introduced into the gap contacts both the electronic component and the pedestal plate and thus the waste heat can be effectively dissipated.

[0010] For example, a tolerance of the width of the gap can be reduced to 0.1 millimeters. This is possible in particular by means of the solution according to the invention, since a thickness or a tolerance of the thickness of the cooling plate can no longer have an effect on the width or on the tolerance of the width of the gap. This is therefore particularly advantageous, as tolerances of the thickness of the cooling plates are comparatively high due to the manufacturing process, in particular up to a few tenths of a millimeter, for example 0.3 millimeters. When fixing the cooling plate on the housing, such a tolerance would have to be taken into account in the design of the gap width, which would result in a significantly larger gap and an increased tolerance for the width. In particular, by fixing the pedestal plate on the housing, the thickness of the cooling plate and also the thicknesses of other components can be excluded from a tolerance chain for the gap or a tolerance chain can be significantly shortened.

[0011] Accordingly, the tolerance of the gap can only be dependent on the tolerances of the housing, the printed circuit board, the at least one electronic component and the pedestal plate, but at least no longer on the tolerance of the cooling plate, which comprises the comparatively largest tolerance.

[0012] The housing can be designed as a rack, within which the components can be arranged on top of each other, for example. The housing can be made of metal, in particular sheet metal, or plastic, for example.

[0013] In particular, the printed circuit board is designed separately from the housing and can be connected to it and, preferably non-destructively, disconnected again.

[0014] By "fixed" it can be understood in particular that the printed circuit board or the pedestal plate is firmly and directly mounted or borne on the housing, in the sense of a fixed bearing.

[0015] The printed circuit board with the at least one electronic component is preferably formed completely within the surrounding housing. In particular, the housing can form bearing points for the printed circuit board, with the help of which movements of the printed circuit board can be restricted and forces can be absorbed. Accordingly, the printed circuit board can form complementary bearing points, for example in an edge area of the printed circuit board, so that the printed circuit board can be directly and firmly borne at the bearing points of the housing within the housing. Preferably, the printed circuit board comprises further fixing elements or fixing elements as bearing points for fixing to the housing. For example, the fixing elements of the printed circuit board comprise screw holes. Accordingly, the housing can comprise internal threads so that the pedestal plate can be screwed to the housing using screws. Preferably, the printed circuit board is firmly and directly mounted on the housing. In particular, "firmly" can be understood to mean that the printed circuit board has no translational or rotational degree of freedom relative to the housing. In other words, the printed circuit board is connected to the housing via fixed bearings. In particular, "direct" can be understood to mean that the printed circuit board is connected directly to the housing or to a housing part of the housing, i.e. without any other component of the electronic assembly being located in between. However, this does not exclude the possibility that a small plate, washer or the like may be provided between the fixing elements of the housing and the printed circuit board.

[0016] The printed circuit board (PCB) can also be referred to as circuit board or printed wiring board.

[0017] In particular, the printed circuit board can have a plate-like design and can comprise a mounting side and an opposite rear or solder side. It is used in particular for the mechanical fastening and electrical connection of the at least one electronic component. The at least one electronic component, preferably a plurality of electronic components, are arranged on the mounting side of the printed circuit board, so that the printed circuit board is equipped with the electronic components.

[0018] In particular, the printed circuit board may have a small thickness, for example between one millimeter and three millimeters, and a length and width spanning the mounting side and the solder side, respectively, of a few centimeters, for example about 425 mm by about 170 mm.

[0019] The electronic component can be any electronic element that generates heat or waste heat during operation, which must be dissipated by a corresponding cooling device so that the electronic component does not overheat. For example, the electronic component can be an electronic control unit (ECU), a computer chip, a processor, an integrated circuit or a system-on-chip (SoC), which can be used in particular for motor vehicle control units.

[0020] In particular, the cooling plate is intended and designed to cool the at least one electronic component or several electronic components so that they do not overheat. In other words, the cooling plate can absorb and dissipate harmful waste heat from the electronic components, for example to a cooling circuit and / or to the environment. In particular, the cooling plate is not fixed to the housing, or not directly fixed to the housing. At most, the cooling plate can be borne indirectly on the housing, in particular via the connection to the pedestal plate. Accordingly, the cooling plate and the housing are not directly connected and preferably do not contact each other.

[0021] In particular, the cooling plate is arranged inside the housing of the electronic assembly, preferably completely. In particular, the cooling plate is separate from the housing and separate from the printed circuit board.

[0022] In particular, the cooling plate has a plate-like design, wherein the length and width of the cooling plate can essentially be in the same area as the length and width of the printed circuit board. Preferably, the printed circuit board and the cooling plate can be arranged essentially parallel to each other within the housing.

[0023] In particular, the cooling plate can be in the range of millimeters to a few centimeters thick. Since cooling plates can be quite complex to manufacture, the thickness of the cooling plate can have comparatively high manufacturing tolerances, in particular up to a few tenths of a millimeter, for example 0.3 millimeters. In particular, the surfaces of the cooling plate can be comparatively uneven due to the manufacturing process, especially in comparison to the surfaces of the pedestal plate.

[0024] The pedestal plate is preferably located entirely within the surrounding housing. In particular, the housing can form bearing points for the pedestal plate, with the help of which movements of the pedestal plate can be restricted and forces can be absorbed. Accordingly, the pedestal plate can form complementary bearing points, for example in an edge area of the pedestal plate, so that the pedestal plate can be directly and firmly borne at the bearing points of the housing within the housing.

[0025] Preferably, the pedestal plate is firmly and directly mounted on the housing. By "firmly" it can be understood in particular that the pedestal plate has no translational and rotational degree of freedom in relation to the housing, and thus also not in relation to the printed circuit board. In other words, the pedestal plate is connected to the housing via fixed bearings. In particular, "directly" can be understood to mean that the pedestal plate is connected directly to the housing or to a housing part of the housing, i.e. without any other component of the electronic assembly being located in between. However, this does not exclude the possibility that a small plate, a washer or the like may be provided between the bearing points of the housing and the pedestal plate. In particular, the pedestal plate has a plate-like design, wherein the length and width of the pedestal plate can essentially lie within a range of the length and width of the printed circuit board or the cooling plate. Preferably, the pedestal plate, the printed circuit board and the cooling plate can be arranged essentially parallel to each other within the housing.

[0026] In particular, the pedestal plate is manufactured separately from the cooling plate. These can then be connected to each other, in particular firmly, in a process step. By "firmly" it can be understood in particular that the cooling plate has no translational and rotational degree of freedom in relation to the pedestal plate. In particular, the cooling plate and the pedestal plate are stacked on top of each other. The cooling plate and the pedestal plate are preferably coupled to each other in a thermally conductive manner.

[0027] The pedestal plate connected to the cooling plate is arranged between the printed circuit board and the cooling plate, wherein preferably the at least one electronic element faces the pedestal plate.

[0028] Preferably, the pedestal plate and the printed circuit board or the pedestal plate and the electronic component do not contact each other, or at least not directly. In particular, a gap is provided between the pedestal plate and the printed circuit board or the electronic component. For example, a heat conducting material can be provided within the gap, by means of which the waste heat from the electronic element can be conducted to the pedestal plate. In particular, the pedestal plate can be indirectly connected to the at least one electronic component via the heat conducting material, so that the waste heat can be conducted from the electronic component via the heat conducting material into the pedestal plate, and from this directly or indirectly into the cooling plate.

[0029] In particular, the pedestal plate can act as a thermal bridge between the at least one electronic component and the cooling plate, which is designed in particular such that the gap has a defined width and a defined tolerance of the width. In particular, the pedestal plate can be designed and manufactured for a respective, individual printed circuit board with individual electronic components so that the gap has the defined width and tolerance, whereas the cooling plate can always be designed and manufactured identically for a series of individual printed circuit boards with individual electronic components.

[0030] According to at least one embodiment, it is provided that the pedestal plate has fixing elements for fixing to the housing. Accordingly, the housing has corresponding fixing elements to which the pedestal plate can be firmly connected to the housing. In particular, the fixing elements of the housing can be provided next to other bearing points of the housing, within which the pedestal plate can be fitted. The pedestal plate can be firmly and directly fixed to and borne on the housing by means of the fixing elements.

[0031] In contrast, the cooling plate has no such fixing elements for fixing to the housing, so the cooling plate is not directly connected to the housing.

[0032] According to at least one embodiment, it is provided that the fixing elements of the pedestal plate have screw holes and the pedestal plate is screwed to the housing. Accordingly, the housing can have complementary internal threads so that the pedestal plate can be screwed to the housing through the screw holes using screws. Screw connections are advantageously suitable for fixed bearings that can be removed easily and non-destructively so that components can be easily removed for maintenance work or replacement, for example. The fixing elements can also have support surfaces by means of which the pedestal plate can be placed on corresponding support surfaces of the housing and through which the screw holes can pass.

[0033] According to at least one embodiment, it is provided that the pedestal plate has a support structure which is designed to support at least the cooling plate. In addition, the support structure can be designed to support other components of the electronic assembly, for example one or more heat accumulators.

[0034] The support structure can be designed in such a way that the cooling plate can be supported by the pedestal plate alone, so that the cooling plate does not have to be additionally supported or borne on the housing.

[0035] For example, the pedestal plate can be thick enough to at least support the cooling plate. For example, the pedestal plate can be edged accordingly so that its surface moment of inertia is increased. For example, the pedestal plate can have integrated support struts or the like.

[0036] According to at least one embodiment, it is provided that a top side of the pedestal plate is designed to be complementary to the mounting side equipped with the at least one electronic component. This has at least the advantage that the pedestal plate can be arranged close to the at least one electronic component, i.e. forming a designable distance or gap with a designable width and designable tolerance, so that heat dissipation is favored.

[0037] The top side faces away from the cooling plate and towards the mounting side. In particular, the mounting side can have a large number of different electronic components, each with different dimensions. Accordingly, the top side of the pedestal plate can be adapted to the different dimensions of the electronic components.

[0038] Preferably, the top side of the pedestal plate can have at least one elevation and / or at least one depression normal to the top side, which can be adapted to the heights of the electronic components. The lengths and widths of the depressions and / or elevations can in turn be adapted to the lengths and widths of the electronic components.

[0039] According to at least one embodiment, it is provided that the pedestal plate is metallic. Preferably, the pedestal plate contains a metal or consists of a metal or a metal alloy. Metallic material is particularly suitable as a heat conducting material and is easy to process. Preferably, the pedestal plate can be made of aluminum or an aluminum alloy, or of another metal such as copper or the like.

[0040] According to at least one embodiment, it is provided that the pedestal plate is a milled part. In particular, a milled part can be manufactured in a highly automated and precise manner, especially with very low manufacturing tolerances, for example tolerances of 0.1 millimeters. As a result, the tolerance for the gap between the pedestal plate and the electronic component, which is influenced by the tolerance of the pedestal plate, can be kept particularly small. This makes it possible and ensures that a heat conducting material introduced into the gap contacts both the electronic component and the pedestal plate and thus the waste heat can be effectively dissipated.

[0041] Milled parts are, in particular, components that have been at least partially manufactured by milling, for example by CNC machining. For example, the pedestal plate may have been milled from a metal block.

[0042] Preferably, the fixing elements of the pedestal plate can be milled so that they can be manufactured particularly precisely with a low manufacturing tolerance.

[0043] According to at least one embodiment, it is provided that the cooling plate is connected to the pedestal plate in a contacting manner, in particular in a direct contacting manner. This allows the waste heat of the electronic component absorbed by the pedestal plate to be conducted directly into the cooling plate.

[0044] Preferably, the pedestal plate and cooling plate are firmly connected to each other. In particular, the pedestal plate and the cooling plate contact each other flatly. This means that the bottom side of the pedestal plate, which is opposite the top side of the pedestal plate, makes complete or at least large-area contact with the top side of the cooling plate, which is essentially spanned by the length and width of the cooling plate. This means that the waste heat can also be conducted over a large area from the pedestal plate to the cooling plate.

[0045] According to at least one embodiment, it is provided that the cooling plate is brazed to the pedestal plate. This allows the cooling plate and the pedestal plate to be firmly and permanently connected to each other. Brazing favors, or at least does not hinder, heat conduction between the pedestal plate and the cooling plate. In addition, only a small amount of heat is applied during brazing, so that the corresponding plates are not distorted by the brazing process. As a result the manufacturing tolerances can be kept small.

[0046] Alternatively, the pedestal plate and the cooling plate can also be firmly connected in other ways. For example, they can be glued, welded or mechanically connected.

[0047] According to at least one embodiment, it is provided that a first, plate-shaped heat accumulator is arranged between the cooling plate and the pedestal plate, which is connected to the cooling plate and the pedestal plate in a contacting manner. In particular, the heat accumulator can be designed as a cooling accumulator. In particular, this can advantageously serve as a redundant, short-term cooling device. If, for example, the cooling plate fails, the cooling accumulator can absorb the waste heat so that the electronic component, for example a processor, can be shut down in a controlled manner without overheating.

[0048] In particular, the heat accumulator can be a latent heat accumulator, also known as a phase change accumulator or PCM accumulator, which contains a phase change material (PCM).

[0049] The heat accumulator can preferably be arranged completely within the housing and parallel to the printed circuit board, the pedestal plate and the cooling plate. In particular, the first heat accumulator is firmly connected to the cooling plate and the pedestal plate, wherein these preferably contact each other over a flat surface, in particular in a sandwich-like manner.

[0050] In particular, the first heat accumulator is not fixed to the housing, or not directly fixed to the housing. At most, the first heat accumulator can be borne on the housing indirectly, in particular via the connection to the pedestal plate. Accordingly, the first heat accumulator and the housing are not directly connected and preferably do not contact each other.

[0051] This advantageous arrangement can ensure that a component tolerance of the first heat accumulator does not affect the tolerance of the gap. In particular, the tolerance of the heat accumulator can be excluded from the tolerance chain of the gap.

[0052] According to at least one embodiment, it is provided that a second, plate-shaped heat accumulator is arranged on a side of the cooling plate facing away from the pedestal plate, which is connected to the cooling plate in a contacting manner.

[0053] The second heat accumulator can be designed to correspond to the first heat accumulator. For example, they can be identical to each other.

[0054] The capacity of the first and second heat accumulators can be advantageously increased by combining them.

[0055] According to at least one embodiment, it is provided that the first heat accumulator is brazed to the cooling plate and the pedestal plate. Alternatively or additionally, the second heat accumulator is brazed to the cooling plate.

[0056] Brazing favors, or at least does not hinder, heat conduction between the components. In addition, brazing only introduces a small amount of heat so that the corresponding plates are not distorted during brazing. This means that the manufacturing tolerances can be kept small.

[0057] Preferably, the pedestal plate, the first heat accumulator, the cooling plate and the second heat accumulator are brazed together or on top of each other in this order to form a cooling module, wherein the components of this cooling module, i.e. the pedestal plate, the first heat accumulator, the cooling plate and the second heat accumulator are firmly connected to each other. Alternatively, these components can also be firmly connected in other ways. For example, they can be glued, welded or mechanically connected.

[0058] In particular, only the pedestal plate of this cooling module has the fixing elements for fixing it to the housing. In other words, the cooling module is only firmly borne on the housing via the pedestal plate, in particular via the fixing elements of the pedestal plate.

[0059] According to at least one embodiment, it is provided that a heat conducting material is arranged between the pedestal plate and the at least one electronic component, which connects the pedestal plate to the electronic component in a thermally conductive manner.

[0060] The heat conducting material, also referred to as thermal interface material (TIM) is usually understood to be a material that is used to improve heat transfer between objects of different temperatures, in particular between the electronic component and the pedestal plate. The heat transfer takes place directly in the still medium. The TIM can be in the form of a heat-conducting paste, for example, which can be applied to the electronic component.

[0061] According to at least one embodiment, it is provided that the cooling plate is a fluid-cooled cooling plate. These are suitable for dissipating waste heat particularly effectively. The cooling fluid can be air or a cooling liquid, for example water, which can be fed inside the cooling plate.

[0062] According to at least one embodiment, it is provided that the electronic assembly is a control unit, in particular an electronic control unit (ECU), which can preferably be used for motor vehicles. In particular, the electronic module can be a main controller or a zonal controller of the motor vehicle.

[0063] The invention also comprises combinations of the features of the embodiments described.

[0064] Another aspect of the invention relates to a motor vehicle. The motor vehicle comprises at least one electronic assembly according to the invention.

[0065] Embodiments of the invention are described below. In the figures: Fig. 1 shows a schematic representation of a motor vehicle according to the invention with an electronic assembly according to the invention;

[0066] Fig. 2 shows a schematic sectional view of an electronic assembly from the prior art;

[0067] Fig. 3 shows a perspective view of an electronic assembly from the prior art;

[0068] Fig. 4 shows a schematic sectional view of an embodiment of an electronic assembly according to the invention;

[0069] Fig. 5 shows a schematic sectional view of an embodiment of an electronic assembly according to the invention with a heat accumulator;

[0070] Fig. 6 shows a perspective view of an embodiment of an electronic assembly according to the invention;

[0071] Fig. 7 shows a sectional view of the electronic assembly of Fig. 6;

[0072] Fig. 8 shows a perspective sectional view of the electronic assembly of Fig. 6.

[0073] The embodiment explained below is a preferred embodiment of the invention. In the embodiment, the described components of the embodiment each represent individual features of the invention which are to be considered independently of one another, which also each further form the invention independently of one another and are thus also to be regarded as part of the invention individually or in a combination other than that shown. Furthermore, the embodiment described can also be supplemented by other features of the invention already described. In the figures, identical reference signs denote elements with the same function.

[0074] The dimensions and proportions of the components in the schematic figures are to be regarded as purely schematic. Actual dimensions and proportions may deviate significantly from the schematic figures.

[0075] Fig. 1 shows a schematic representation of a motor vehicle 2 according to the invention with an electronic assembly 1 according to the invention. The electronic assembly is explained in more detail in Figs. 4 to 8. Fig. 2 shows a schematic sectional view and Fig. 3 a perspective view of an electronic assembly from the prior art.

[0076] A printed circuit board 4 is directly and firmly fixed to the housing 3 of the prior art assembly. The printed circuit board 4 is equipped with the electronic component 6 on its mounting side 5. Furthermore, a cooling plate 7 is directly and firmly fixed to the housing 3. The cooling plate 7 is moreover firmly connected to a pedestal plate 8.

[0077] The electronic component 6 generates waste heat during operation, wherein it is intended that this waste heat is dissipated by the cooling plate 7.

[0078] The components mentioned are arranged in such a way that a gap 16 is formed between the electronic component 6 and a top side 13 of the pedestal plate 6. This gap 16 should preferably be designed in such a way that a heat conducting material 15 can be provided within the gap 16, which contacts the electronic component 6 and the pedestal plate 8 in a heat conducting manner, so that the waste heat can be conducted via the heat conducting material 16 into the pedestal plate 8, and from there into the cooling plate 7.

[0079] In the prior art, the tolerance of the width of the gap 16 depends on the tolerances of the components mentioned, i.e. in particular the housing 3, the printed circuit board 4, the electronic component 6, the pedestal plate 6 and the cooling plate 7. The cooling plate 7 can have tolerances that are too large compared to the other components, for example of 0.3 millimeters, due to the manufacturing process. As this tolerance also affects the tolerance of the gap 16, it may be too large for the heat conducting material 15 gap to be used effectively.

[0080] Fig. 4 shows a schematic sectional view of an embodiment of an electronic assembly 1 according to the invention, in particular for a motor vehicle 2. The electronic assembly has a housing 3 and a printed circuit board 4 which is fixed to the housing 3 and which is equipped with at least one electronic component 6 on its mounting side 5.

[0081] The electronic component 1 also has a cooling plate 7 for cooling the at least one electronic component 6. The cooling plate 7 is not or not directly fixed to the housing 3 or is not attached to the housing 3 in a contacting manner. In particular, the cooling plate 7 can be a fluid-cooled cooling plate 7 and can be complex to manufacture due to its internal cooling structures. Accordingly, the component tolerance of the cooling plate 7 can be accordingly high.

[0082] Furthermore, the electronic component 1 has a pedestal plate 8, which is fixed to the housing 3 and, in particular, is attached to the housing 3 in a contacting manner. The pedestal plate 7 is arranged between the printed circuit board 4 and the cooling plate 7.

[0083] The pedestal plate 8 can preferably be metallic, for example made of aluminum. In particular, it can be a milled part that has been milled from a block.

[0084] The pedestal plate 8 has fixing elements 9 for fastening to the housing 3. According to the embodiment, the fixing elements 9 can have screw holes 10 so that the pedestal plate 8 can be screwed to the housing 3.

[0085] The cooling plate 7 is arranged on a bottom side 17 of the pedestal plate 8. In particular, these are firmly connected to each other. In this embodiment, the pedestal plate 8 and the cooling plate 7 are connected to each other in a contacting manner, preferably brazed together, so that the waste heat can be effectively conducted from the pedestal plate 8 to the cooling plate 7.

[0086] The pedestal plate 8 can have a support structure which is designed to support at least the cooling plate 7 or to carry it.

[0087] A top side 13 of the pedestal plate 8 opposite the bottom side 17 is arranged in particular at a distance from the printed circuit board 4 and in particular at a distance from the electronic component 6. In particular, a gap 16 is provided between the top side 13 and the electronic component.

[0088] The gap 16 or a width of the gap 16, which corresponds to the distance of the top side 13 from the electronic component 6, should have as small a tolerance as possible, so that a heat conducting material 15, which can be introduced into the gap 16 between the component 6 and the pedestal plate 8, can be provided.

[0089] In this embodiment, the tolerance of the cooling plate 7 has been eliminated from a tolerance chain for the gap 16. This is particularly advantageous, as the tolerance of the cooling plate 7 can be comparatively large. Consequently, the tolerance for the gap 16 is only dependent on the housing 3, the printed circuit board 4, the electronic component 6 and the pedestal plate 8, which each have a comparatively small component tolerance. As a result, the tolerance for the gap 16 can be limited to 0.1 millimeters, for example.

[0090] Fig. 5 shows a schematic sectional view of a further embodiment of an electronic assembly 1 according to the invention. This differs from the embodiment shown in Fig. 4 in that the electronic assembly 1 comprises heat accumulators 11 , 12.

[0091] A first, plate-shaped heat accumulator 1 1 is arranged between the cooling plate 7 and the pedestal plate 8, and is connected, in particular brazed, to the cooling plate 7 and the pedestal plate 8 in a contacting manner. A second, plate-shaped heat accumulator 12 is arranged on a bottom side 14 of the cooling plate 7 facing away from the pedestal plate 8, which is connected to the cooling plate 7 in a contacting manner, in particular brazed. The pedestal plate 8 can have a corresponding support structure in order to additionally carry the heat accumulators 11 , 12.

[0092] The heat accumulators 11 , 12 are designed in particular as latent heat accumulators or PCM accumulators.

[0093] Fig. 6 shows a perspective view of an embodiment of an electronic assembly 1 according to the invention, wherein in particular the pedestal plate 8 and the housing 3 are shown, wherein the housing 3 surrounds the associated components of the assembly 1 .

[0094] The fixing elements 9 can in particular be formed as projections of the pedestal plate 8. The projections 9 can each have a screw hole 10 in order to be screwed to the housing 3. The fixing elements can be manufactured very precisely, in particular milled, so that their manufacturing tolerance is very low.

[0095] It is further shown that the top side 13 of the pedestal plate 8 can be designed to be complementary to the equipped mounting side 5 of the printed circuit board 4 (not shown). Accordingly, the top side 13 can, for example, form elevations 18 in order to be able to establish a gap 16 with the complementary electronic components 6.

[0096] Fig. 7 shows a sectional view through section A-A of the electronic assembly 1 as shown in Fig. 6. A heat conducting material 15 is inserted between the elevations 19 of the pedestal plate 8 and the associated electronic components 6. In this embodiment, only a first heat accumulator 11 is provided between the pedestal plate 8, which is screwed to the housing 3, and the cooling plate 7.

[0097] Fig. 8 shows a perspective sectional view of the electronic assembly of Fig. 6.

[0098] In all figures, the housing 3 is not drawn completely, but only in sections for better illustration. Preferably, the housing 3 surrounds the components of the electronic assembly 1 and can have corresponding openings so that the components can be coupled to external systems, in particular to systems of the motor vehicle 1 .

Claims

Claims1 . Electronic assembly (1 ) for a motor vehicle (2), comprising- a housing (3),- a printed circuit board (4) which is fixed to the housing (3) and which is equipped with at least one electronic component (6) on its mounting side (5),- a cooling plate (7) for cooling the at least one electronic component (6), and- a pedestal plate (8) which is connected to the cooling plate (7) and is arranged between the mounting side (5) of the printed circuit board (4) and the cooling plate (7), characterized in that- the pedestal plate (8) is fixed to the housing (3).

2. Electronic assembly (1 ) according to claim 1 , characterized in that the pedestal plate (8) comprises fixing elements (9) for fixing to the housing (3).

3. Electronic assembly (1 ) according to claim 2, characterized in that the fixing elements (9) of the pedestal plate (8) comprise screw holes (10), and the pedestal plate (8) is screwed to the housing (3).

4. Electronic assembly (1 ) according to one of the preceding claims, characterized in that the pedestal plate (8) comprises a support structure which is designed to support at least the cooling plate (7).

5. Electronic assembly (1 ) according to one of the preceding claims, characterized in that a top side (13) of the pedestal plate (8) is formed complementary to the mounting side (5) equipped with the at least one electronic component (6).

6. Electronic assembly (1 ) according to one of the preceding claims, characterized in that the pedestal plate (8) is metallic, in particular made of aluminum.

7. Electronic assembly (1 ) according to one of the preceding claims, characterized in that the pedestal plate (8) is a milled part.

8. Electronic assembly (1 ) according to one of the preceding claims, characterized in that the cooling plate (7) is connected to the pedestal plate (8) in a contacting manner.

9. Electronic assembly (1 ) according to claim 8, characterized in that the cooling plate (7) is brazed to the pedestal plate (8).

10. Electronic assembly (1 ) according to any one of claims 1 to 7, characterized in that a first, plate-shaped heat accumulator (1 1 ) is arranged between the cooling plate (7) and the pedestal plate (8), which is connected to the cooling plate (7) and the pedestal plate (8) in a contacting manner.11 . Electronic assembly (1 ) according to one of claims 1 to 7 or 10, characterized in that a second, plate-shaped heat accumulator (12) is arranged on a bottom side (14) of the cooling plate (7) facing away from the pedestal plate (8), which heat accumulator (12) is connected to the cooling plate (7) in a contacting manner.

12. Electronic assembly (1 ) according to claim 10 and / or 1 1 , characterized in that the first heat accumulator (11 ) is brazed to the cooling plate (7) and the pedestal plate (8), and / or the second heat accumulator (12) is brazed to the cooling plate (7).

13. Electronic assembly (1 ) according to one of the preceding claims, characterized in that a heat conducting material (15) is arranged between the pedestal plate (8) and the at least one electronic component (6), which connects the pedestal plate (8) to the electronic component (6) in a heat conducting manner.

14. Electronic assembly (1 ) according to one of the preceding claims, characterized in that the cooling plate (7) is a fluid-cooled cooling plate (7).

15. Electronic assembly (1 ) according to one of the preceding claims, characterized in that the electronic assembly (1) is a control unit.

16. Motor vehicle (2), characterized by an electronic assembly (1) according to any one of the preceding claims.

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