Apparatus for supplying solid organometallic compound

Abstract

The present invention relates to an apparatus for supplying a solid organometallic compound, which can measure and monitor a vaporization temperature in real time so that an organometallic compound and a carrier gas can be transferred at a constant temperature, thereby enabling the organometallic compound and the carrier gas to be vaporized at a stable temperature and ensuring stability and accurate supply of the organometallic compound, and which can maintain constant atmospheric pressure and concentration.

Description

Solid organometallic compound supply device

[0001] The present invention relates to a solid organometallic compound supply device, and more specifically, to a solid organometallic compound supply device that maintains a constant vapor pressure and concentration at a constant temperature and allows stable transport of an organometallic compound and a carrier gas.

[0002] The manufacturing of semiconductors and display devices requires the deposition of various thin films. These thin film layers are deposited using processes such as atomic layer deposition (ALD) or chemical vapor deposition (CVD). Organometallic compounds are used as raw materials, and these substances are transported to the reaction chamber of the deposition equipment in a vaporized state.

[0003] In the case of solid organometallic compounds, they are generally vaporized at high temperatures and transferred to the deposition chamber. However, depending on the amount of sample remaining in the canister during use, the vapor pressure changes during vaporization, which causes the film process to become unstable.

[0004] The reason vapor pressure becomes unstable is because the solid's poor fluidity causes channels to form in the area where it is transported and consumed by the carrier gas, resulting in channeling. This reduces the contact area between the carrier gas and the sample, resulting in a decrease in concentration. This results in a decrease in vapor pressure, hindering the stable supply of the sample and reducing productivity.

[0005] Korean Patent Publication No. 10-2011-0008023 discloses an organometallic compound supply device comprising a canister that supplies a solid organometallic compound as a raw material at room temperature and sublimates the organometallic compound by supplying a carrier gas. The canister of the conventional organometallic compound supply device is disclosed to be made of stainless steel in consideration of thermal conductivity. However, a further configuration must be added to improve the thermal conductivity of the canister so that the internal temperature of the canister is maintained uniformly, thereby enabling the stable and accurate supply of the organometallic compound.

[0006] The present invention has been devised to solve the above problems, and more specifically, it aims to provide a solid organometallic compound supply device capable of maintaining thermal conductivity and stable vapor pressure so that the organometallic compound and carrier gas can be stably supplied by vaporization by minimizing the channeling effect that occurs when using a solid organometallic compound and maintaining a constant vapor pressure.

[0007] The organometallic compound supply device of the present invention comprises: a plurality of canisters having a closed bottom to store raw materials therein and an open top to form a receiving space; a fixing cover that closes the tops of the plurality of canisters and fixes the plurality of canisters so that they can be fixed at regular intervals; and an insulating jacket having a receiving space therein to accommodate the plurality of canisters so that a temperature can be maintained.

[0008] According to the present invention, by including an insulating jacket that surrounds the inside and outside of a heat-conducting container, an organometallic compound is vaporized at a constant temperature and transported by a carrier gas, and there is an effect of maintaining a constant vapor pressure.

[0009] In addition, according to the present invention, the temperature of the heat-conducting vessel can be measured and monitored in real time by including a temperature sensor for measuring and detecting the temperature of the heat-conducting vessel, so that the organometallic compound and carrier gas can be vaporized at a stable temperature.

[0010] In addition, according to the present invention, since a plurality of canisters are connected in series and configured to allow continuous vaporization, a stable supply of an organometallic compound is possible, and there is an effect of maintaining a constant vapor pressure.

[0011] Figure 1 is an internal schematic diagram of the connection configuration of the first canister and the second canister of the organometallic compound supply device of the present invention.

[0012] Figure 2 is an internal schematic diagram of the connection configuration of the second canister and the third canister of the organometallic compound supply device of the present invention.

[0013] Figure 3 is an internal schematic diagram of the connection configuration of the third canister and the fourth canister of the organometallic compound supply device of the present invention.

[0014] Figure 4 is a schematic diagram of an organometallic compound supply device of the present invention.

[0015] Figure 5 is a schematic diagram of the combination of a plurality of canisters and a fixed cover provided inside the organometallic compound supply device of the present invention.

[0016] Figure 6 is a schematic diagram of an organometallic compound supply device to which an insulating jacket of the present invention is attached.

[0017] Figure 7 is an actual photograph of a fixed cover combined with a plurality of canisters provided inside the organometallic compound supply device of the present invention.

[0018] Figure 8 is an actual photograph of the organometallic compound supply device of the present invention.

[0019] Figure 9 is an actual photo of the insulation jacket of the present invention.

[0020] Figure 10 is an actual photograph of an organometallic compound supply device with an insulating jacket of the present invention attached.

[0021] The organometallic compound supply device of the present invention comprises: a plurality of canisters having a closed bottom to store raw materials therein and an open top to form a receiving space; a fixing cover that closes the tops of the plurality of canisters and fixes the plurality of canisters so that they can be fixed at regular intervals; and an insulating jacket having a receiving space therein to accommodate the plurality of canisters so that a temperature can be maintained.

[0022] In addition, in the organometallic compound supply device of the present invention, the insulating jacket further includes a temperature control unit provided in the insulating jacket so as to control the temperature inside the insulating jacket.

[0023] In addition, in the organometallic compound supply device of the present invention, the organometallic compound supply device further includes a flow pipe that is connected in series so that the plurality of canisters are connected to each other.

[0024] In addition, in the organometallic compound supply device of the present invention, the organometallic compound supply device further includes a supply pipe that is connected to a canister located at one end of the plurality of canisters through a flow pipe and supplies a carrier gas, and a discharge pipe that is connected to a canister located at the other end of the plurality of canisters through a flow pipe and discharges a mixed gas generated by transporting a raw material inside the canister with the carrier gas.

[0025] In addition, in the organometallic compound supply device of the present invention, the supply pipe further includes a supply valve for supplying a carrier gas, and the discharge pipe further includes a discharge valve for discharging a mixed gas.

[0026] In addition, in the organometallic compound supply device of the present invention, the supply pipe and the discharge pipe further include an inlet pipe that communicates with the inside of the plurality of canisters, and the inlet pipe further includes a moving pipe so that the carrier gas introduced through the inlet pipe can transport the sample stored inside the canister and the generated mixed gas can be moved to the flow path.

[0027] Additionally, in the organometallic compound supply device of the present invention, the temperature control unit includes a temperature sensor for measuring and detecting the temperature of the heat conducting container.

[0028] In addition, in the organometallic compound supply device of the present invention, the organometallic compound supply device is configured such that the fixed cover and the plurality or more canisters are screw-connected.

[0029] In addition, in the organometallic compound supply device of the present invention, the insulating jacket further includes a heat-conducting container inside the insulating jacket, and is formed to surround the outside and inside of the heat-conducting container.

[0030] Additionally, in the organometallic compound supply device of the present invention, the insulating jacket includes a heating line for heat generation inside.

[0031] The present invention will be described in detail below with reference to the attached drawings. However, these are merely exemplary and the present invention is not limited to the specific embodiments described as examples.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein for purposes of description is merely for the purpose of describing specific embodiments and is not intended to be limiting.

[0033] Additionally, the singular forms used in the specification and the appended claims are intended to include the plural forms, unless the context clearly dictates otherwise. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise specifically stated.

[0034] The present invention relates to an organometallic compound supply device (1000) capable of controlling heat conduction, and is configured to include a plurality of canisters, a fixed cover (500), and an insulating jacket (600).

[0035] FIG. 1 is an internal schematic diagram of the connection configuration of the first canister and the second canister of the organometallic compound supply device of the present invention, FIG. 2 is an internal schematic diagram of the connection configuration of the second canister and the third canister of the organometallic compound supply device of the present invention, and FIG. 3 is an internal schematic diagram of the connection configuration of the third canister and the fourth canister of the organometallic compound supply device of the present invention. In addition, FIG. 4 is a schematic diagram of the organometallic compound supply device of the present invention. Referring to FIGS. 1 to 4, the plurality of canisters may be composed of four, namely, a first canister (100), a second canister (200), a third canister (300), and a fourth canister (400). In addition, the plurality of canisters have a closed bottom so that raw materials are stored therein, and a receiving space is formed in an open top shape. At this time, the organometallic compound supply device (1000) further includes a fixed cover (500), and the fixed cover (500) closes the upper portions of the plurality of canisters. Accordingly, it serves to fix the plurality of canisters so that they can be fixed while being spaced apart at regular intervals. Accordingly, the first canister (100), the second canister (200), the third canister (300), and the fourth canister (400) can be fixed while being spaced apart at regular intervals, and the upper portions are closed by the fixed cover (500), so that a stable vapor pressure can be formed, and accordingly, a stable concentration can be maintained inside, so that stable transport can occur.

[0036] FIG. 5 is a schematic diagram illustrating a combination of a plurality of canisters and a fixed cover provided inside an organometallic compound supply device of the present invention. Referring to FIG. 5, the fixed cover (500) and a plurality of or more canisters may be configured by being screw-connected. Accordingly, the first canister (100), the second canister (200), the third canister (300), and the fourth canister (400) may be screw-connected to the fixed cover (500) to be more firmly connected.

[0037] In addition, the organometallic compound supply device of the present invention further includes a flow path that is connected in series so that a plurality of canisters are connected to each other. That is, the first canister (100) is connected to the second canister (200) through the first flow path (40), and the second canister (200) is connected to the third canister (300) through the second flow path (41). In addition, the third canister (300) is connected to the fourth canister (400) through the third flow path (42). In addition, each canister is provided with a first receiving space (110), a second receiving space (210), a third receiving space (310), and a fourth receiving space (410) in each of the first canister (100), the second canister (200), the third canister (300), and the fourth canister (400) so that the carrier gas can be transported, and a raw material provided as a solid organometallic compound is stored in each of the receiving spaces. More specifically, the solid organometallic compound may include, but is not limited to, an indium compound, a zinc compound, an aluminum compound, a gallium compound, a magnesium compound, a hafnium compound, a zirconium compound, a titanium compound, a barium compound, a lanthanum compound, a strontium compound, a tungsten compound, a ruthenium compound, a tantalum compound, and the like.

[0038] By including a plurality of canisters connected in series and connected to each other, it is possible to supply an organometallic compound having a constant concentration and vapor pressure.

[0039] In addition, the organometallic compound supply device (1000) of the present invention includes a supply pipe (10) that is connected to a canister located at one end of a plurality of canisters by a flow pipe and supplies a carrier gas. Specifically, the supply pipe (10) that is connected to the inside of the first canister (100) is configured so that the carrier gas is supplied and vaporized with the raw material stored inside the first canister (100). At this time, the supply pipe (10) further includes a supply valve (50) that supplies the carrier gas. Various types of carrier gases can be supplied to the supply pipe (10) at a constant flow rate by the supply valve (50). In addition, the supply pipe (10) and the discharge pipe (20) further include an inlet pipe (30) that is connected to the inside of the plurality of canisters, and the inlet pipe (30) further includes a movement pipe (31) so that the mixed gas generated by the carrier gas introduced by the inlet pipe (30) vaporizing with the sample stored inside the canister can be moved to the flow pipe section. For a fast and stable reaction, the moving pipe (31) is formed adjacent to the inlet pipe (30), so that the mixed gas discharged from the inlet pipe (30) can be directly introduced into the inlet pipe (30) and moved to the flow path. In addition, the device further includes a discharge pipe (20) that is connected to a canister located at the other end among the plurality of canisters through the flow path, and through which the mixed gas generated by vaporizing the raw material inside the canister with the carrier gas is discharged. In addition, the discharge pipe (20) further includes a discharge valve (60) for discharging the mixed gas. The mixed gas generated inside the canister can be discharged at a constant flow rate by the discharge valve (60).

[0040] Accordingly, when carrier gas is supplied through the supply pipe (10) communicating with the inside of the first canister (100), the carrier gas flows into the inlet pipe (30) inside the first canister (100), and the raw material stored inside the first canister (100) vaporizes to generate a mixed gas. Next, the mixed gas generated inside the first canister (100) flows into the transfer pipe (31) provided inside the first canister (100), and flows into the internal inlet pipe (30) of the second canister (200) along the first flow path (40) communicating with the transfer pipe (31). The mixed gas introduced into the second canister (200) is vaporized again with the raw material stored inside the second canister (200) to generate a mixed gas, and the mixed gas generated inside the second canister (200) is introduced into the transfer pipe (31) provided inside the second canister (200) and flows into the internal inlet pipe (30) of the third canister (300) along the second flow path (41) communicated with the transfer pipe (31). The mixed gas introduced into the third canister (300) is vaporized with the raw material stored inside the third canister (300), and thus a mixed gas is generated. The mixed gas generated inside the third canister (300) is introduced into the transfer pipe (31) provided inside the third canister (300) and flows into the internal inlet pipe (30) of the fourth canister (400) along the third flow path (42) communicated with the transfer pipe (31). At this time, since the moving pipe (31) of the fourth canister (400) is connected to the discharge port, the mixed gas is discharged to the outside of the fourth canister (400) through the discharge pipe (20) connected to the fourth canister (400).

[0041] As described above, the organometallic compound supply device (1000) of the present invention is configured such that four canisters are connected in series and continuous vaporization can occur. The organometallic compound inside the canister is generally converted from a solid state to a liquid or gas when used, so the conversion temperature for vaporization of the organometallic compound is very important. In addition, the organometallic compound must be vaporized and transported inside the canister, and this must occur at a constant, fixed temperature, so the temperature inside the canister must be maintained uniformly. Accordingly, stable and accurate supply of the organometallic compound is possible, and a consistent vapor pressure can be maintained.

[0042] Accordingly, the present invention further includes an insulating jacket (600) for a plurality of canisters. The insulating jacket (600) has an internal space formed therein to accommodate a plurality of canisters so as to maintain a reaction temperature. Accordingly, the insulating jacket (600) has an internal space formed therein to accommodate a plurality of canisters, i.e., the first canister (100) to the fourth canister (400).

[0043] In addition, the insulating jacket (600) further includes a temperature control unit (not shown) provided in the insulating jacket (600) to control the internal temperature of the insulating jacket (600). As described above, it is very important in the organometallic compound supply device to maintain a uniform temperature of the canister containing the organometallic compound. Therefore, the internal temperature of the insulating jacket (600) is controlled by the temperature control unit (not shown) so that the organometallic compound can be vaporized at an appropriate temperature.

[0044] In addition, the temperature control unit (not shown) includes a temperature sensor (not shown) for measuring and detecting the temperature of the insulation jacket (600). The temperature sensor (not shown) is configured to be linked with the temperature control unit (not shown) so as to measure and monitor the temperature of the insulation jacket (600) in real time so that the organometallic compound and the carrier gas can react at a stable temperature.

[0045] In addition, FIG. 6 is a schematic diagram illustrating an organometallic compound supply device to which an insulating jacket of the present invention is connected. Referring to FIG. 6, the insulating jacket (600) further includes a heat-conducting container (not shown) inside, and is formed to wrap around the outside and inside of the heat-conducting container (not shown). The insulating jacket (600) is provided with an inner skin and an outer skin, and the insulating jacket (600) includes heating wires for heat generation inside. The heating wires are densely arranged at preset intervals between the inner skin and the outer skin, and at this time, a plurality of fixing clips are provided on the inner skin so that the heating wires can be densely arranged at preset intervals and fixed. The insulating jacket (600) is provided with heating wires, and is configured to wrap around the outside of the heat-conducting container (not shown). At this time, the heat-conducting container (not shown) may be composed of a metal material such as aluminum or copper, or a material such as ceramic for fast and efficient heat conduction. Additionally, the insulation jacket (600) further includes an insulation jacket cover (610) that closes the upper portion of the insulation jacket (600).

[0046] Fig. 7 is an actual photograph of a fixed cover combined with a plurality of canisters provided inside the organometallic compound supply device of the present invention, and Fig. 8 is an actual photograph of the organometallic compound supply device of the present invention. In addition, Fig. 9 is an actual photograph of the insulating jacket of the present invention, and Fig. 10 is an actual photograph of the organometallic compound supply device to which the insulating jacket of the present invention is attached. Since the organometallic compound supply device of the present invention is configured as shown in Figs. 7 to 9, more effective heat transfer is possible to each of the first canister (100) to the fourth canister (400), and accordingly, temperature maintenance can be uniformly achieved, so that continuous vaporization of the organometallic compound and the carrier gas can occur at a stable and constant temperature.

[0047] The above description is merely an example of applying the principles of the present invention, and other configurations may be included without departing from the scope of the present invention.

[0048] The solid organometallic compound supply device of the present invention can measure and monitor the vaporization temperature in real time so that the organometallic compound and carrier gas can be transported at a constant temperature, and can maintain a constant pressure and concentration, thereby ensuring the stability of the solid organometallic compound, enabling accurate supply when the solid organometallic compound is vaporized and transported to the deposition chamber, thereby improving the productivity of the deposition process.

Claims

1. A plurality of canisters having a closed bottom and an open top to form a storage space for storing raw materials inside; A fixing cover that closes the upper portion of the plurality of canisters and fixes the plurality of canisters so that they can be fixed at regular intervals; and An insulating jacket in which the plurality of canisters are accommodated so that a space is formed inside to maintain temperature; An organometallic compound supply device comprising:

2. In the first paragraph, the heat conducting vessel, An organometallic compound supply device further comprising a temperature control unit provided in the heat conducting vessel so as to control the temperature inside the heat conducting vessel.

3. In the first paragraph, the organometallic compound supply device, An organometallic compound supply device further comprising a series-connected duct so that the plurality of canisters are connected to each other.

4. In the first paragraph, the organometallic compound supply device, A supply pipe that supplies carrier gas by being connected to a canister located at one end of the above plurality of canisters through a Euro pipe, An organometallic compound supply device further comprising a discharge pipe that is connected to a canister located at the other end of the plurality of canisters through a Euro pipe and discharges a mixed gas generated by vaporizing the raw material inside the canister with the carrier gas.

5. In paragraph 4, The above supply pipe further includes a supply valve for supplying carrier gas, An organometallic compound supply device, wherein the above discharge pipe further includes a discharge valve for discharging a mixed gas.

6. In paragraph 1, the supply pipe and the discharge pipe, An inlet pipe communicating with the inside of the above plurality of canisters, An organometallic compound supply device including a moving pipe so that a mixed gas generated by vaporizing a carrier gas introduced through the above-mentioned inlet pipe with a sample stored inside a canister can be moved to a flow path.

7. In the first paragraph, the temperature control unit, An organometallic compound supply device comprising a temperature sensor for measuring and detecting the temperature of the heat conducting vessel.

8. In the first paragraph, the organometallic compound supply device, An organometallic compound supply device, wherein the above fixed cover and the above multiple or more canisters are screw-connected.

9. In paragraph 1, the insulating jacket, An organometallic compound supply device, wherein the above insulating jacket further comprises a heat-conducting container inside and is formed to surround the outside and inside of the heat-conducting container.

10. In the first paragraph, the insulating jacket, An organometallic compound supply device comprising a heating wire for heating inside.

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