Circuit board

Abstract

Provided in the embodiments of the present disclosure is a circuit board. A quantum dot light-emitting device comprises a device bracket, a light-emitting chip, an encapsulation adhesive layer, a first molecular deposition layer and a quantum dot layer, wherein a mounting cavity is provided in the device bracket, the light-emitting chip is arranged at the bottom of the mounting cavity, the encapsulation adhesive layer, the first molecular deposition layer and the quantum dot layer are stacked and filled in the mounting cavity in sequence, and the encapsulation adhesive layer covers the surface of the light-emitting chip.

Description

circuit board

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on March 29, 2024, with application number 202420669554.X and invention name “Circuit Board”, the entire contents of which are incorporated by reference into this disclosure. Technical Field

[0002] The present disclosure relates to the technical field of circuit boards, and in particular to a circuit board. Background Art

[0003] In the related art, the heat dissipation performance and working performance of a circuit board assembly are closely related. Technical issues

[0004] Circuit board components generate significant heat during use. If this heat cannot be dissipated promptly, the temperature of the components will rise rapidly, reducing their performance. This heat generation issue is particularly prominent with double-layer or multi-layer circuit boards. Technical Solutions

[0005] The embodiments of the present disclosure provide a circuit board, which can improve the heat dissipation performance and working performance of the circuit board.

[0006] The circuit board provided by the embodiment of the present disclosure includes: a metal substrate; a circuit construction layer, which is arranged on one side surface of the metal substrate, and the circuit construction layer includes a thermally conductive insulating sublayer, an insulating medium sublayer and a conductive circuit. The thermally conductive insulating sublayer is arranged on one side surface of the metal substrate or on a side surface of another circuit construction layer away from the metal substrate, and the insulating medium sublayer is arranged on a side surface of the thermally conductive insulating sublayer away from the metal substrate. The insulating medium sublayer is provided with a hollow portion, and the conductive circuit is formed in the hollow portion and abuts against the thermally conductive insulating sublayer.

[0007] In some embodiments, two or more circuit construction layers are provided on the same side surface of the metal substrate, and the multiple circuit construction layers are stacked in sequence along the thickness direction of the metal substrate.

[0008] In some embodiments, the circuit board is provided with a connecting electrode, and the conductive circuits of two adjacent circuit structure layers are electrically connected through the connecting electrode, and the connecting electrode is provided through the thermally conductive insulating sublayer located between the two adjacent conductive circuits.

[0009] In some embodiments, the two or more circuit construction layers include a first circuit construction layer and at least one second circuit construction layer, the first circuit construction layer is arranged on one side surface of the metal substrate, and the at least one second circuit construction layer is arranged on the side surface of the first circuit construction layer away from the metal substrate. The thermally conductive insulating sublayer in the second circuit construction layer is provided with a first via hole, and the first via hole is connected to the hollow portion in the circuit construction layer where it is located, and the connecting electrode passes through the first via hole and is electrically connected to the conductive circuits of the two adjacent circuit construction layers respectively.

[0010] In some embodiments, two adjacent circuit structure layers are bonded together by a thermally conductive adhesive layer, the thermally conductive adhesive layer is provided with a second via hole, and the connecting electrode is provided through the second via hole.

[0011] In some embodiments, at least one circuit structure layer is respectively provided on two opposite surfaces of the metal substrate.

[0012] In some embodiments, the circuit board further includes a solder resist ink layer; when only one circuit construction layer is provided on the same side surface of the metal substrate, the solder resist ink layer is provided on the side surface of the circuit construction layer away from the metal substrate; when multiple circuit construction layers are stacked in sequence on the same side surface of the metal substrate, the multiple circuit construction layers form a stacked structure, and the solder resist ink layer is provided on the side surface of the multiple stacked structures away from the metal substrate.

[0013] In some embodiments, the reflectivity of the solder resist ink layer to light in a preset wavelength band is not less than 90%.

[0014] In some embodiments, the insulating dielectric sublayer is an imprinted glue sublayer.

[0015] In some embodiments, the metal substrate is an aluminum substrate.

[0016] In some embodiments, the circuit board is a flexible circuit board. Beneficial effects

[0017] The disclosed embodiment provides a metal substrate and a circuit construction layer including a thermally conductive insulating sublayer, an insulating medium sublayer, and a conductive circuit. When the circuit board is powered on, the heat generated by the conductive circuit can be conducted to the metal substrate through the thermally conductive insulating sublayer, and then promptly dissipated to the air environment or other heat sink through the metal substrate, thereby preventing heat accumulation in the circuit board that affects the normal operation of the circuit board, thereby improving the heat dissipation and operating performance of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0019] FIG1 is a cross-sectional structural diagram of a circuit board provided in some embodiments of the present application;

[0020] FIG2 is another cross-sectional structural diagram of a circuit board provided in some embodiments of the present application;

[0021] FIG3 is another cross-sectional structural diagram of a circuit board provided in some embodiments of the present application;

[0022] FIG4 is another cross-sectional structural diagram of a circuit board provided in some embodiments of the present application.

[0023] Explanation of the main component symbols: 10-metal base, 20-circuit structure layer, 21-thermal conductive insulation sublayer, 211-first via, 22-insulating dielectric sublayer, 221-hollow portion, 23-conductive circuit, 20a-first circuit structure layer, 20b-second circuit structure layer, 30-connecting electrode, 40-thermal conductive adhesive layer, 41-second via, 50-solder mask ink layer. Modes for Carrying Out the Invention

[0024] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0025] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present disclosure. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present disclosure, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0026] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0027] The use of "suitable for" or "configured to" in this disclosure is intended to be open and inclusive language, and does not exclude devices that are adapted or configured to perform additional tasks or steps. In addition, the use of "based on" is intended to be open and inclusive, as a process, step, calculation, or other action that is "based on" one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0028] In this disclosure, the word "exemplary" is used to mean "serving as an example, illustration, or illustration." Any embodiment described in this disclosure as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is given to enable any person skilled in the art to implement and use the present disclosure. In the following description, details are listed for the purpose of explanation. It should be understood that one of ordinary skill in the art will recognize that the present disclosure can be implemented without these specific details. In other instances, well-known structures and processes are not elaborated in detail to avoid obscuring the description of the present disclosure with unnecessary details. Therefore, the present disclosure is not intended to be limited to the embodiments shown, but is to be consistent with the widest scope consistent with the principles and features disclosed herein.

[0029] As shown in Figures 1 to 4, embodiments of the present application provide a circuit board comprising a metal substrate 10 and at least one circuit structure layer 20. This circuit board improves the heat dissipation performance of the circuit board, allowing heat generated by the circuit board during use to be promptly dissipated, thereby improving the operating performance of the circuit board. The type of circuit board can be determined based on actual needs, and may include, for example, a rigid printed circuit board (PCB), a flexible printed circuit board (FPC), or other types, and is not limited in this embodiment of the present application.

[0030] The metal substrate 10 has excellent thermal conductivity and flexibility, allowing it to dissipate heat promptly. Furthermore, the metal substrate 10 is also highly flexible, allowing for easy bending, winding, and folding, enabling the circuit board to be flexible and effectively meet the needs of various applications. The material type of the metal substrate 10 can be determined based on actual needs and is not limited in this embodiment. In some embodiments, the metal substrate 10 can be an aluminum substrate.

[0031] The circuit construction layer 20 is disposed on one side surface of the metal substrate 10 and specifically includes a thermally conductive insulating sublayer 21, an insulating dielectric sublayer 22, and a conductive circuit 23. The thermally conductive insulating sublayer 21 is made of a thermally conductive insulating material such as epoxy resin, and thus has a better thermal conductivity. Here, for the circuit construction layer 20 directly disposed on the surface of the metal substrate 10, the thermally conductive insulating sublayer 21 of the circuit construction layer 20 can be disposed on one side surface of the metal substrate 10, so that the thermally conductive insulating sublayer 21 and the metal substrate 10 are in direct contact. For the circuit construction layer 20 indirectly disposed on the surface of the metal substrate 10 through several other circuit construction layers 20, the thermally conductive insulating sublayer 21 of the circuit construction layer 20 can be disposed on another circuit construction layer 20 located between the circuit construction layer 20 and the metal substrate 10, specifically on a side surface of the other circuit construction layer 20 away from the metal substrate 10, so that the thermally conductive insulating sublayer 21 of the circuit construction layer 20 and the insulating dielectric sublayer 22 of the other circuit construction layer 20 are in direct contact.

[0032] The insulating dielectric sublayer 22 is disposed on a surface of the thermally conductive insulating sublayer 21 that is distal from the metal substrate 10. The insulating dielectric sublayer 22 includes a hollow portion 221. The hollow portion 221 may penetrate the insulating dielectric sublayer 22, thereby connecting two opposing surfaces of the insulating dielectric sublayer 22 along its thickness. The hollow portion 221 can be formed in the insulating dielectric sublayer 22 using various patterning processes, which are not limited in this embodiment of the present application. A conductive trace 23 is formed within the hollow portion 221 and abuts the thermally conductive insulating sublayer 21.

[0033] In this way, when the circuit board provided in the embodiment of the present application is powered on, the heat generated by the conduction of the conductive circuit 23 can be conducted to the metal base 10 through the thermally conductive insulating sublayer 21, and then dissipated to the air environment or other radiator in a timely manner through the metal base 10, thereby avoiding heat accumulation in the circuit board and affecting the normal operation of the circuit board, thereby improving the heat dissipation performance and working performance of the circuit board.

[0034] The number of circuit construction layers 20 provided on the same side surface of the metal substrate 10 can be determined according to actual needs and can be one or more, and the embodiments of the present application do not limit this. As shown in Figures 2 and 3, in some embodiments, more than two circuit construction layers 20 can be provided on the same side surface of the metal substrate 10, and the above-mentioned more than two circuit construction layers 20 are stacked in sequence along the thickness direction of the metal substrate 10, so that the circuit board has a double-layer or multi-layer circuit board structure. When the circuit board provided in the embodiment of the present application is powered on, the heat generated by the conductive circuits 23 in each circuit construction layer 20 can be directly conducted to the adjacent metal substrate 10, or conducted to the metal substrate 10 through other circuit construction layers 20 located between the circuit construction layer 20 and the metal substrate 10, and then dissipated to the air environment or other radiators in a timely manner through the metal substrate 10, thereby improving the heat dissipation performance and working performance of the circuit board with a double-layer or multi-layer circuit board structure.

[0035] In some examples, a circuit board may be provided with a connecting electrode 30. For two or more stacked circuit structure layers 20, the conductive traces 23 of two adjacent circuit structure layers 20 may be electrically connected via the connecting electrode 30. Here, the connecting electrode 30 is provided through the thermally conductive insulating sublayer 21 located between two adjacent conductive traces 23.

[0036] Illustratively, the two or more circuit construction layers 20 may include a first circuit construction layer 20a and at least one second circuit construction layer 20b. The first circuit construction layer 20a is disposed on one side of the metal substrate 10, while the second circuit construction layer 20b is disposed on a side of the first circuit construction layer 20a that is away from the metal substrate 10. When the plurality of circuit construction layers 20 include a plurality of second circuit construction layers 20b, the plurality of second circuit construction layers 20b are sequentially stacked on the side of the first circuit construction layer 20a that is away from the metal substrate 10. The thermally conductive insulating sublayer 21 in the second circuit construction layer 20b can be provided with a first via 211, which passes through the thermally conductive insulating sublayer 21 in which it is located; at the same time, the first via 211 is connected to the hollow portion 221 in the circuit construction layer 20 in which the thermally conductive insulating layer is located, that is, the hollow portion 221 of the insulating medium sublayer 22 in the circuit construction layer 20, so that the connecting electrode 30 can pass through the first via 211 and be electrically connected to the conductive circuits 23 of the two adjacent circuit construction layers 20 respectively.

[0037] For example, for multiple circuit construction layers 20 stacked in layers, two adjacent circuit construction layers 20 can be bonded together by a thermally conductive adhesive layer 40. The thermally conductive adhesive layer 40 has excellent bonding and thermal conductivity, allowing good heat conduction between the two adjacent circuit construction layers 20 through the thermally conductive adhesive layer 40. The thermally conductive adhesive layer 40 can be provided with a second via 41, which passes through the thermally conductive adhesive layer 40 in which it is located. The connecting electrode 30 can be provided through the second via 41, so that the connecting electrode 30 can electrically connect the conductive circuits 23 of the two adjacent circuit construction layers 20. When the thermally conductive insulating sublayer 21 in the second circuit construction layer 20b is provided with a first via 211 and the thermally conductive adhesive layer 40 is provided with a second via 41, the first via 211 can be provided corresponding to the second via 41 and remain connected, so that the connecting electrode 30 can pass through the first via 211 and the second via 41 in sequence to electrically connect the conductive circuits 23 of the two adjacent circuit construction layers 20.

[0038] The circuit board can be a single-sided circuit board or a double-sided circuit board, which is not limited in the present embodiment. As shown in Figure 4, in some embodiments, the circuit board can be a double-sided circuit board, and at least one circuit construction layer 20 can be provided on each of the two opposing surfaces of the metal substrate 10. In some examples, each of the two opposing surfaces of the metal substrate 10 can have a circuit construction layer 20, making the circuit board a double-sided double-layer circuit board; in other examples, each of the two opposing surfaces of the metal substrate 10 can have a circuit construction layer 20, while the other surface can have multiple circuit construction layers 20, making the circuit board a double-sided multi-layer circuit board; in yet other examples, each of the two opposing surfaces of the metal substrate 10 can have multiple circuit construction layers 20, making the circuit board another type of double-sided multi-layer circuit board.

[0039] As shown in Figures 1 and 4 , in some embodiments, the circuit board may further include a solder resist ink layer 50. When only one circuit construction layer 20 is provided on the same side surface of the metal substrate 10, the solder resist ink layer 50 may be provided on the side of the circuit construction layer 20 that is away from the metal substrate 10. When multiple circuit construction layers 20 are stacked sequentially on the same side surface of the metal substrate 10, the multiple circuit construction layers 20 form a stacked structure, and the solder resist ink layer 50 may be provided on the side of the stacked structure that is away from the metal substrate 10. In this way, the solder resist ink layer 50 is formed on the side of the circuit board that is away from the metal substrate 10.

[0040] In some examples, the solder resist ink layer 50 has a reflectivity of no less than 90% for light in a predetermined wavelength band. When the circuit board is used to manufacture a display light board, the predetermined wavelength band may include the wavelength band of the light-emitting chip on the light board. This way, when light from the light-emitting chip strikes the solder resist ink layer 50 on the circuit board surface, most of the light is further reflected by the solder resist ink layer 50 before being emitted, increasing the utilization and efficiency of the light emitted by the light-emitting chip.

[0041] The material of the insulating dielectric sublayer 22 can be determined based on actual needs, so as to match the desired patterning process, and is not limited in this embodiment of the present application. In some embodiments, the insulating dielectric sublayer 22 can be an embossed adhesive sublayer made of an embossed adhesive, suitable for patterning by embossing, thereby forming the above-mentioned hollow portion 221 through patterning.

[0042] The circuit board provided in the embodiment of the present disclosure is introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present disclosure. The description of the above embodiments is only used to help understand the method and core idea of ​​the present disclosure. At the same time, for those skilled in the art, according to the idea of ​​the present disclosure, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present disclosure.

Claims

1. A circuit board comprising: Metal substrate; At least one circuit construction layer is arranged on one side surface of the metal substrate, and the circuit construction layer includes a thermally conductive insulating sublayer, an insulating medium sublayer and a conductive circuit. The thermally conductive insulating sublayer is arranged on one side surface of the metal substrate or on a side surface of another circuit construction layer away from the metal substrate, and the insulating medium sublayer is arranged on a side surface of the thermally conductive insulating sublayer away from the metal substrate. The insulating medium sublayer is provided with a hollow portion, and the conductive circuit is formed in the hollow portion and abuts against the thermally conductive insulating sublayer.

2. The circuit board according to claim 1, wherein Two or more circuit construction layers are provided on the same side surface of the metal substrate, and the two or more circuit construction layers are stacked in sequence along the thickness direction of the metal substrate.

3. The circuit board according to claim 2, wherein: The circuit board is provided with a connecting electrode, and the conductive circuits of two adjacent circuit structure layers are electrically connected through the connecting electrode. The connecting electrode is provided through the heat-conducting insulating sublayer located between the two adjacent conductive circuits.

4. The circuit board according to claim 3, wherein: The two or more circuit construction layers include a first circuit construction layer and at least one second circuit construction layer, the first circuit construction layer is arranged on one side surface of the metal substrate, and the at least one second circuit construction layer is arranged on the side surface of the first circuit construction layer away from the metal substrate. The thermally conductive insulating sublayer in the second circuit construction layer is provided with a first via hole, and the first via hole is connected to the hollow portion in the second circuit construction layer where it is located. The connecting electrode passes through the first via hole and is electrically connected to the conductive circuits of the two adjacent circuit construction layers respectively.

5. The circuit board according to claim 3 or 4, wherein: Two adjacent circuit structure layers are bonded together by a heat-conducting adhesive layer. The heat-conducting adhesive layer is provided with a second via hole, and the connecting electrode is arranged through the second via hole.

6. The circuit board according to claim 1, wherein At least one circuit structure layer is respectively provided on two opposite surfaces of the metal substrate.

7. The circuit board according to claim 1, wherein: The circuit board also includes a solder resist ink layer; when only one circuit construction layer is provided on the same side surface of the metal substrate, the solder resist ink layer is arranged on the side surface of the circuit construction layer away from the metal substrate; when multiple circuit construction layers are provided on the same side surface of the metal substrate, the multiple circuit construction layers are stacked in sequence to form a stacked structure, and the solder resist ink layer is arranged on the side surface of the multiple stacked structures away from the metal substrate.

8. The circuit board according to claim 7, wherein: The reflectivity of the solder resist ink layer to light in a preset wavelength band is not less than 90%.

9. The circuit board according to claim 1, wherein: The insulating medium sublayer is an imprinted glue sublayer.

10. The circuit board according to claim 1, wherein The metal substrate is an aluminum substrate.

11. The circuit board according to claim 1, wherein: The circuit board is a flexible circuit board.

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