Computing node and computing device

Abstract

The present application relates to the technical field of computing devices, and provides a computing node and a computing device. The computing node comprises a power consumption apparatus, a radiator and a liquid guide pipe. The radiator is arranged corresponding to and connected to the power consumption apparatus. The liquid guide pipe is connected to the radiator. An input end of the liquid guide pipe is used for introducing cooling liquid to dissipate heat of the power consumption apparatus, and an output end of the liquid guide pipe is connected to the radiator. The liquid guide pipe comprises a narrow throat, a gap is formed between the narrow throat and the input end, the area of the cross section of the liquid guide pipe at the narrow throat is minimum, and the cross section is perpendicular to a first direction of the liquid guide pipe. A heat dissipation apparatus provided by embodiments of the present application can solve the problem of poor heat dissipation effect of the computing device.

Description

Compute nodes and computing devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on April 3, 2024, with application number 202410405531.2 and application name “Computing Node and Computing Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of computing devices, and in particular to a computing node and a computing device. Background Art

[0003] Internet service providers, enterprise platforms, and research institutions all require massive computing resources. The platforms that handle storage, computing, and networking requirements are called data centers. The information and communication technology (ICT) equipment within data centers generates heat during operation, necessitating the use of liquid cooling technology to ensure the proper operation of these ICT devices.

[0004] However, with the increasing demand for information and communication technology in modern society, ICT equipment in data centers has gradually developed from low density to high density. High-density ICT equipment generates a large amount of heat during operation, and the liquid cooling capacity of related technologies is difficult to meet the heat dissipation needs of ICT equipment. Summary of the Invention

[0005] The embodiments of the present application provide a computing node and a computing device, which can solve the problem of poor heat dissipation of computing devices.

[0006] In a first aspect, embodiments of the present application provide a heat dissipation device comprising a heat sink and a liquid conduit. The heat sink is disposed in correspondence with and connected to a power-consuming device. The liquid conduit has an input end for introducing coolant, and an output end connected to the heat sink. The liquid conduit includes a narrow throat, with a gap between the narrow throat and the input end of the liquid conduit. The cross-sectional area of ​​the liquid conduit is minimized at the narrow throat, and the cross-section is perpendicular to a first direction of the liquid conduit.

[0007] The heat dissipation device provided in the embodiment of the present application has a liquid conduit provided with a narrow throat. The coolant can enter the liquid conduit under the action of a certain pressure, and when it reaches the narrow throat, the pressure of the coolant accumulates in the narrow throat. The coolant in the narrow throat can convert the pressure energy of the coolant into kinetic energy, so that the coolant obtains acceleration and is released in the direction of the radiator, thereby increasing the flow rate of the coolant in the radiator. Therefore, the heat dissipation efficiency of the power consumption device can be effectively improved by the heat dissipation device of the embodiment of the present application, and while meeting the heat dissipation requirements of the computing device, there is no need to configure an active auxiliary heat dissipation structure such as a fan at the radiator, which is beneficial to improving the heat dissipation reliability and reducing the cost of the heat dissipation device.

[0008] In a second aspect, embodiments of the present application provide a computing node comprising a power consumption device, a heat sink disposed and connected to the power consumption device, and a liquid conduit. The liquid conduit is connected to the heat sink, an input end of the liquid conduit is used to introduce coolant to dissipate heat from the power consumption device, and an output end of the liquid conduit is connected to the heat sink. The liquid conduit includes a narrow throat, a gap is formed between the narrow throat and the input end, and the cross-sectional area of ​​the liquid conduit is minimized at the narrow throat, with the cross-section being perpendicular to a first direction of the liquid conduit.

[0009] In some possible implementations, the present application provides a computing node including a power consumption device and the heat dissipation device of the first aspect. The heat dissipation device has a radiator disposed on the power consumption device, and the heat dissipation device is used to dissipate heat from the power consumption device.

[0010] In a possible embodiment, the catheter may further include a contraction tube connected to the narrow throat. Along the first direction, the input end of the catheter is located at an end of the contraction tube away from the narrow throat.

[0011] In the implementation manner of the embodiment of the present application, by providing a shrink tube, the coolant can be gathered at the narrow throat, so that the pressure energy of the coolant can be accumulated at the narrow throat through the shrink tube.

[0012] In a possible implementation, the cross-sectional area of ​​the contraction tube gradually decreases along the direction from the input end of the catheter toward the narrow throat.

[0013] In the implementation of the embodiment of the present application, by setting the cross-sectional area of ​​the contraction tube to gradually decrease, the pressure energy of the coolant in the contraction tube can be kept in a gradually increasing state until it enters the narrow throat, so as to reduce the pressure loss of the coolant caused by the inner wall of the contraction tube. The coolant passing through the contraction tube and the narrow throat can provide sufficient release kinetic energy for the coolant to be output to the radiator, which is beneficial to increase the output flow rate of the coolant, and further beneficial to improve the heat dissipation efficiency of the power-consuming devices.

[0014] In one possible embodiment, the liquid conduit may further include an expansion tube. One end of the expansion tube is connected to the narrow throat, and the other end of the expansion tube is connected to the radiator. Along the first direction, the expansion tube and the contraction tube are located on either side of the narrow throat, with the narrow throat being located at the intersection of the contraction tube and the expansion tube. The output end of the liquid conduit is located at the end of the expansion tube away from the narrow throat.

[0015] In the embodiments of the present application, the coolant can convert its pressure energy into kinetic energy through the contracting tube and the narrow throat. The coolant can continue to convert pressure energy into kinetic energy within the expanding tube. When the coolant pressure at the output end of the liquid guide tube drops to the same level as the coolant pressure within the closed cavity, the coolant at the output end of the liquid guide tube can achieve a higher flow rate, thereby improving the heat dissipation efficiency of the radiator surface.

[0016] In a possible embodiment, the cross-sectional area of ​​the expansion tube gradually increases along the direction from the narrow throat to the output end of the catheter.

[0017] In the implementation of the embodiment of the present application, by setting the cross-sectional area of ​​the expansion tube to gradually increase, the loss of flow pressure of the coolant caused by the inner wall of the expansion tube blocking the flow of coolant can be reduced, so that the coolant passing through the contraction tube, narrow throat and expansion tube in sequence can provide sufficient release kinetic energy for the coolant to be output to the radiator, thereby increasing the output flow rate of the coolant, which is beneficial to improving the heat dissipation efficiency of the power consumption device.

[0018] In one possible embodiment, the cross-sectional area of ​​the output end of the catheter tube may be larger than the cross-sectional area of ​​the input end of the catheter tube, and / or the length of the expansion tube may be greater than or equal to the length of the contraction tube.

[0019] In the embodiments of the present application, the output end of the liquid conduit corresponds to the radiator. By providing a larger cross-sectional area at the output end of the liquid conduit, the output end of the liquid conduit can be in full contact with the heat dissipation surface of the radiator. Furthermore, because the coolant released from the output end of the liquid conduit has a relatively high flow rate, the high-flow, high-velocity coolant output by the liquid conduit can quickly remove heat from the radiator and move heat from the power-consuming components and the enclosed cavity outside the computing node.

[0020] In a possible embodiment, the cross-sectional shape of the expansion tube may be circular, elliptical, or polygonal. And / or the cross-sectional shape of the contraction tube may also be circular, elliptical, or polygonal.

[0021] In a possible implementation, the liquid guide tube may be a Laval nozzle.

[0022] In the implementation of the embodiment of the present application, according to the flow direction of the coolant in the liquid cooling pipe, the size of the contraction tube gradually contracts to a narrow throat, and the size of the expansion tube gradually expands to the radiator after the narrow throat. The coolant entering from the liquid inlet first enters the contraction tube under the action of pressure, passes through the narrow throat and is output from the expansion tube. The flow rate of the coolant in the Laval nozzle can be changed according to the size of the cross-sectional area of ​​the Laval nozzle through which it flows. The arrangement of the contraction tube and the expansion tube can increase the flow rate of the coolant released by the Laval nozzle, which is used to increase the flow rate of the coolant on the surface of the radiator, thereby improving the heat dissipation efficiency of the power consumption device.

[0023] In one possible embodiment, the heat sink includes fins extending in a second direction perpendicular to the first direction, the fins being spaced apart to form a plurality of heat dissipation gaps, and the output end of the liquid conduit being connected to the fins so that the liquid conduit communicates with the heat dissipation gaps.

[0024] In the implementation of the embodiment of the present application, the coolant flowing through the heat dissipation gap can fully contact the heat dissipation surface of the heat sink to remove the heat on the heat sink, thereby achieving heat dissipation treatment for the power consumption device.

[0025] In a possible implementation, the computing node may further include a valve connected to an input end of the liquid conduit, and the valve is used to control the flow of the cooling liquid introduced into the liquid conduit.

[0026] In the embodiments of the present application, a valve can be used to control the flow of coolant. Specifically, when the temperature of the power-consuming device reaches a preset temperature, the valve can be used to reduce the flow of coolant entering the sealed cavity. When the temperature of the power-consuming device exceeds the preset temperature, the valve can be used to increase the flow of coolant.

[0027] In one possible implementation, the computing node may further include a connecting tube. The connecting tube is disposed at the input end of the liquid guide tube and may be used to connect to a valve.

[0028] In the embodiment of the present application, the cooling liquid passing through the valve can be transferred to the liquid guide tube through a connecting pipe. The valve and the input end of the liquid guide tube can be connected through a connecting pipe.

[0029] In one possible implementation, the computing node may further include a housing. The housing may form a sealed cavity for containing coolant, with the power-consuming components located within the sealed cavity. The housing may include a liquid inlet connected to the input end of a liquid conduit of the heat dissipation device. Coolant enters the sealed cavity through the liquid inlet to submerge the power-consuming components.

[0030] In a third aspect, embodiments of the present application further provide a computing device comprising a housing body and the computing nodes described in the above embodiments. The housing body has a storage space. The number of computing nodes may be multiple, with the multiple computing nodes linearly distributed in the storage space.

[0031] In one possible embodiment, the computing device further includes a liquid cooling pipe fixed to a side wall of the computing node housing. One end of the liquid cooling pipe can be used to input cooling liquid, and the other end is connected to the input end of the liquid guide tube.

[0032] In some examples, the valve is located at the other end of the liquid cooling pipe, and the valve is connected to the input end of the liquid conduit.

[0033] In the embodiment of the present application, one end of the liquid guide tube can be directly connected to the liquid cooling pipe. By arranging a valve between the liquid cooling pipe and the liquid guide tube, the valve can control the flow rate of the coolant output from the liquid cooling pipe to the liquid guide tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0035] FIG1 is a schematic diagram of a computing node structure provided by an embodiment of the present application;

[0036] FIG2 is a schematic diagram of the structure of another computing node provided in an embodiment of the present application;

[0037] FIG3 is a schematic diagram of a partial exploded structure of a heat dissipation device provided in an embodiment of the present application;

[0038] FIG4 is a schematic diagram of the structure of another computing node provided in an embodiment of the present application;

[0039] FIG5 is a schematic diagram of the three-dimensional structure of another computing device provided in an embodiment of the present application;

[0040] FIG6 is a schematic diagram of the main structure of a computing device provided in FIG5;

[0041] FIG7 is a schematic diagram of the three-dimensional structure of another computing device provided by the present application;

[0042] FIG8 is a schematic diagram of the main structural view of the computing device provided in FIG7 .

[0043] Explanation of the accompanying symbols: 10. Computing device; 100. Computing node; 200. Container body; 300. Liquid cooling box; 400. Liquid cooling pipe; 410. Main pipe; 420. Branch pipe; 110. Heat dissipation device; 120. Power consumption device; 130. Circuit board; 111. Housing; 111a. Enclosed cavity; 101. Liquid inlet; 102. Liquid outlet; 112. Radiator; 112a. Heat dissipation gap; 1121. Base plate; 1122. Heat sink; 113. Liquid guide tube; 113a. Input end; 113b. Output end; 1131. Narrow throat; 1132. Contraction tube; 1133. Expansion tube; 114. Valve; 115. Connecting pipe; 116. Quick connector; M, first direction; N, second direction; X, horizontal direction; Y, vertical direction.

[0044] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0045] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0046] The computing nodes provided in the embodiments of the present application can be applied to data centers. Internet service providers, enterprise platforms, research institutions, etc. all require a large amount of computing power, and the operating platform that carries storage, computing, and network requirements is called a data center. A data center may include a computer room. The computer room may be provided with at least one computing device. The computing device may be used to provide services. It may be a server or a hyperterminal that can establish a communication connection with other devices and provide computing and / or storage functions for other devices. For example, the computing device may be a cabinet-type computing device (such as a whole cabinet server) or a tank-type computing device. This is not limited in this application. The computing device may include computing nodes. The number of computing nodes may be multiple. For example, the computing device may include 10-50 computing nodes. A cooling system is also provided in the computer room. The cooling system may dissipate heat from the internal environment of the computer room to ensure the normal operation of the computing device. In the embodiments of the present application, the specific structure and working principle of the cooling system in the computer room are not described in detail.

[0047] As computing devices become more integrated, the power consumption of core components within computing nodes continues to increase, generating increasing amounts of heat during operation. For example, high-power components may include central processing units (CPUs) and graphics processing units (GPUs). If excessive heat is generated by these power-consuming components within a computing node and cannot be dissipated promptly, the operational performance of the computing device will be affected. Therefore, heat dissipation of these power-consuming components within the computing node is particularly important during the design process.

[0048] It's easy to understand that liquids have much higher heat dissipation parameters, such as density and specific heat capacity, than air. Therefore, liquid cooling is often used to dissipate heat from the system. Currently, the application of liquid cooling solutions in equipment heat dissipation is gradually increasing. Specifically, liquid cooling methods can include cold plate liquid cooling, immersion liquid cooling, and spray liquid cooling. Immersion liquid cooling involves immersing power-consuming devices in an insulating coolant, which then removes the heat generated by the devices through a circulation device. For example, the coolant can be, but is not limited to, fluorinated liquid, mineral oil, etc.

[0049] The liquid cooling method in the related art includes injecting coolant into the computing node. The coolant can flow in from one end of the computing node and then flow out from the other end of the computing node. The heat generated in the computing node can be removed by the coolant flowing in the computing node and discharged to the outside of the computing node to achieve the purpose of heat dissipation. However, with the increasing demand for information and communication technology in modern society, the computing equipment in data centers has gradually developed from low density to high density, and high-density computing equipment will generate a large amount of heat during operation. The liquid cooling method in the related art is difficult to meet the heat dissipation needs of the computing equipment. If power components such as fans are added, it is necessary to add a matching power source. The fans and power sources are likely to increase the power consumption of the computing node, occupy the internal space of the computing node, and increase the heat dissipation cost.

[0050] In an embodiment of the present application, the liquid conduit can guide the coolant to the radiator, and the heat generated by the power consumption device corresponding to the radiator can be transferred to the radiator. The liquid conduit is provided with a narrow throat. The narrow throat refers to the point where the cross-sectional area of ​​the liquid conduit is the smallest. Under the action of a certain pressure, the coolant enters the liquid conduit, and when it reaches the narrow throat, the pressure of the coolant accumulates at the narrow throat. The coolant at the narrow throat can convert the pressure energy of the coolant into kinetic energy, so that the coolant obtains acceleration and is released in the direction of the radiator, thereby increasing the flow rate of the coolant at the radiator. Therefore, the heat dissipation efficiency of the power consumption device can be effectively improved by the heat dissipation device of the embodiment of the present application, and while meeting the heat dissipation requirements of the computing node, there is no need to configure an active auxiliary heat dissipation structure such as a fan at the radiator, which is beneficial to improving the heat dissipation reliability and reducing the cost of the heat dissipation device.

[0051] The heat dissipation device 110, computing node 100, and computing device 10 provided in the embodiments of the present application are described in detail below through specific implementation methods.

[0052] Figure 1 is a schematic diagram of the structure of a computing node 100 provided in an embodiment of the present application. Figure 2 is a schematic diagram of the structure of another computing node 100 provided in an embodiment of the present application. Figure 3 is a schematic diagram of the partial exploded structure of a heat dissipation device 110 provided in an embodiment of the present application. Figure 4 is a schematic diagram of the partial structure of yet another computing node 100 provided in an embodiment of the present application.

[0053] The embodiment of the present application provides a computing node 100. As shown in FIG1 , the computing node 100 may include a power consumption device 120 and a heat dissipation device 110. The heat dissipation device 110 is used to dissipate heat for the power consumption device 120.

[0054] It is understandable that the power consumption device 120 may be a device with high power consumption during the operation of the computing node, such as but not limited to a central processing unit (CPU), a graphics processing unit (GPU), etc.

[0055] The present application also provides a heat dissipation device 110, as shown in Figures 1 to 4. Heat dissipation device 110 can be applied to a computing node 100. Specifically, heat dissipation device 110 can be used to dissipate heat from a power consumption device 120 within computing node 100. Heat dissipation device 110 can include a heat sink 112 and a liquid conduit 113. Heat sink 112 and power consumption device 120 can be provided in correspondence.

[0056] In some examples, the heat sink 110 is used in an immersion liquid-cooled computing node. In other examples, the heat sink 110 is used in a computing node using immersion liquid cooling or spray liquid cooling, which is not limited in this embodiment of the present application.

[0057] The liquid conduit 113 may have an input end 113a and an output end 113b. The input end 113a of the liquid conduit 113 may be used to introduce cooling liquid. The output end 113b of the liquid conduit 113 may be connected to the radiator 112. The cooling liquid may flow through the liquid conduit 113 to the radiator 112 to submerge the power consumption device 120 and the radiator 112. The liquid conduit 113 may include a narrow throat 1131. There may be a gap between the narrow throat 1131 and the input end 113a. The cross-sectional area of ​​the liquid conduit 113 is smallest at the narrow throat 1131. This cross-sectional area may be perpendicular to the first direction of the liquid conduit 113.

[0058] It should be noted that the coolant can flow in the liquid conduit 113. The first direction in the embodiment of the present application, such as the M direction shown in Figure 1, can refer to the flow direction of the coolant in the liquid conduit 113. The direction of the coolant flow in the liquid conduit 113 can be the same as the extension direction of the liquid conduit 113. For example, when the liquid conduit 113 is placed horizontally, the flow direction (M) of the coolant can be the horizontal direction X, and when the liquid conduit 113 is set vertically, the flow direction (M) of the coolant can be the vertical direction Y.

[0059] In the embodiment of the present application, the heat sink 112 can be provided on the power consumption device 120 of the computing node 100. The heat sink 112 can have a large heat dissipation surface to distribute the heat generated by the power consumption device 120 over the large heat dissipation surface. Because the heat generated by the power consumption device 120 can easily cause the local temperature of the computing node 100 to be too high, the coolant introduced through the liquid conduit 113 can first be directed to the heat sink 112 to remove the high heat generated by the power consumption device 120, thereby preventing the local temperature of the computing node 100 from being too high and affecting the performance of the computing node 100.

[0060] In some examples, the computing node 100 may further include a housing 111 . The housing 111 may be used to contain a cooling liquid. The heat sink 110 and the power consumption device 120 may both be located within the housing 111 .

[0061] The housing 111 may have a liquid inlet 101 and a liquid outlet 102. Cooling liquid may enter the housing 111 through the liquid inlet 101 to submerge the power consumption components 120 and the heat sink 110. After absorbing the heat generated by the power consumption components 120 within the housing 111, the cooling liquid may be discharged through the liquid outlet 102 to dissipate heat from the power consumption components 120. The cooling liquid may first be directed to the heat sink 112 via a liquid conduit 113 to remove the high heat generated by the power consumption components 120. The cooling liquid may then be dispersed to other areas within the housing 111 to dissipate heat for the entire computing node 100.

[0062] Specifically, the coolant can enter the liquid conduit 113 under pressure through the liquid inlet 101 and the input end 113a of the liquid conduit 113. The liquid conduit 113 of the embodiment of the present application has a narrow throat 1131. The narrow throat 1131 can be used to increase the flow rate of the coolant released from the output end 113b of the liquid conduit 113 to the radiator 112. For example, there is a gap between the input end 113a of the liquid conduit 113 and the narrow throat 1131. Therefore, when the coolant flows through the gap between the input end 113a and the narrow throat 1131, the gap can provide space for the accumulation of the pressure energy of the coolant. When the coolant flows to the narrow throat 1131, the coolant has the maximum pressure energy. The pressure energy of the coolant at the narrow throat 1131 can be converted into kinetic energy, so that the coolant obtains acceleration, thereby increasing the flow rate of the coolant flowing through the radiator 112. The rate at which the coolant flows through the power consumption device 120 increases, and the heat generated by the power consumption device 120 can be promptly discharged, which is beneficial to improving the heat dissipation capability of the power consumption device 120 .

[0063] In summary, it is easy to understand that the radiator 112 of the embodiment of the present application can be set corresponding to the high-power power consumption device 120 that generates relatively high heat in the computing node 100, and the output end 113b of the liquid conduit 113 is set corresponding to the radiator 112. Therefore, the cooling liquid output by the output end 113b of the liquid conduit 113 can be first directed to the radiator 112 to first dissipate heat for the high-power power consumption device 120, thereby reducing the possibility of the heat generated by the high-power power consumption device 120 diffusing in the housing 111 and affecting the heat dissipation effect.

[0064] Furthermore, the embodiment of the present application utilizes a liquid conduit 113 having a narrow throat 1131, which can be used to increase the flow rate of coolant released from the output end 113b of the liquid conduit 113 to the radiator 112, thereby more effectively improving heat dissipation efficiency. The heat dissipation device 110 of the embodiment of the present application can meet the heat dissipation requirements of high-density ICT equipment without requiring other active auxiliary heat dissipation structures such as fans at the radiator 112 for auxiliary heat dissipation, thereby improving heat dissipation reliability and reducing heat dissipation costs.

[0065] In some examples, the coolant can immerse the radiator 112. The coolant with a lower temperature absorbs the heat of the power consumption device 120 and other components to form a coolant with a higher temperature, which can be discharged to the outside of the housing 111 through the liquid outlet 102. A device for cooling the coolant with a higher temperature can be provided outside the housing 111 to cool the coolant with a higher temperature and form a coolant with a lower temperature. The coolant with a lower temperature can enter the housing 111 again through the liquid inlet 101, thereby realizing the circulation of the coolant, and continuously dissipating the heat of the power consumption device 120 and other components in the computing node 100 through the circulation of the coolant, so as to reduce the temperature inside the housing 111. It should be noted that in the embodiment of the present application, the specific structure and working principle of the device for cooling the coolant with a higher temperature are not described in detail.

[0066] In some examples, the liquid level of the coolant in the housing 111 may be higher than the height of the liquid outlet 102 , where the height of the liquid outlet 102 may refer to the height of the liquid outlet 102 relative to the bottom wall of the housing 111 .

[0067] For example, the height of the liquid outlet 102 may be higher than the height of the liquid inlet 101, or the height of the liquid outlet 102 may be equal to the height of the liquid inlet 101, which is not limited in this embodiment. The height of the liquid inlet 101 may refer to the height of the liquid inlet 101 relative to the bottom wall of the housing 111.

[0068] 1 schematically shows that the liquid inlet 101 and the liquid outlet 102 are located on two opposite side walls of the housing 111. The liquid inlet 101 and the liquid outlet 102 may also be located on the same side wall of the housing 111, which is not limited in the embodiment of the present application.

[0069] It should be noted that the number of liquid conduits 113 in the embodiment of the present application can be, but is not limited to, one. When there are a large number of high-power power-consuming devices 120, multiple liquid conduits 113 can be provided. Multiple liquid conduits 113 can correspond to multiple high-power power-consuming devices 120, so that heat is first dissipated from the multiple power-consuming devices 120 through the multiple liquid conduits 113, and then from the entire housing 111.

[0070] In some embodiments, as shown in Figures 2 and 3 , the catheter 113 may further include a contraction tube 1132. The contraction tube 1132 is connected to the narrow throat 1131. Along the first direction M, the input end 113a of the catheter 113 may be located at the end of the contraction tube 1132 away from the narrow throat 1131.

[0071] In the embodiment of the present application, coolant enters the contraction tube 1132 through the input end 113a and converges at the narrow throat 1131, thereby concentrating the coolant's pressure energy through the contraction tube 1132 at the narrow throat 1131. It will be readily understood that the contraction tube 1132 may have a large opening end and a small opening end. The input end 113a of the liquid guide tube 113 may refer to the large opening end of the contraction tube 1132. The small opening end of the contraction tube 1132 may be connected to the narrow throat 1131.

[0072] In some possible implementations, as shown in FIG. 2 to FIG. 4 , the cross-sectional area of ​​the contraction tube 1132 decreases along the direction from the input end 113 a of the liquid guiding tube 113 toward the narrow throat 1131 .

[0073] The direction in which the input end 113a of the liquid guide tube 113 points toward the narrow throat 1131 may refer to the direction in which the contraction tube 1132 points from the large opening end to the small opening end. The cross-sectional area of ​​the contraction tube 1132 gradually decreases. The cross-sectional area of ​​the contraction tube 1132 may be perpendicular to the first direction M.

[0074] In the embodiment of the present application, the cross-sectional area of ​​the contraction tube 1132 can be gradually and evenly decreased, and the pressure energy of the coolant in the contraction tube 1132 can be kept in a gradually increasing state until it enters the narrow throat 1131, so as to reduce the pressure loss of the coolant caused by the inner wall of the contraction tube 1132. The coolant passing through the contraction tube 1132 and the narrow throat 1131 can provide sufficient release kinetic energy for the coolant to be output to the radiator 112, which is beneficial to increase the output flow rate of the coolant, and further beneficial to improve the heat dissipation efficiency of the power consumption device 120.

[0075] In some examples, the shrink tube 1132 is smoothly connected to the narrow throat 1131. The cross-sectional shape of the small opening end of the shrink tube 1132 can match the cross-sectional shape of the narrow throat 1131, and the cross-sectional size of the small opening end of the shrink tube 1132 can match the cross-sectional size of the narrow throat 1131.

[0076] In some implementations, as shown in Figures 2 to 4 , the catheter 113 may further include an expansion tube 1133. One end of the expansion tube 1133 may be connected to the narrow throat 1131, and the other end of the expansion tube 1133 may be connected to the radiator 112. The expansion tube 1133 may connect the narrow throat 1131 and the radiator 112.

[0077] Along the first direction M, the contraction tube 1132 and the expansion tube 1133 can be located on both sides of the narrow throat 1131. The narrow throat 1131 can be provided at the intersection of the contraction tube 1132 and the expansion tube 1133. The output end 113b of the liquid guide tube 113 can be located at the end of the expansion tube 1133 away from the narrow throat 1131.

[0078] It is easy to understand that the expansion tube 1133 can also have a large opening end and a small opening end. The output end 113b of the liquid guide tube 113 can refer to the large opening end of the expansion tube 1133. The small opening end of the expansion tube 1133 can be connected to the narrow throat 1131. The narrow throat 1131 is provided at the intersection of the contraction tube 1132 and the expansion tube 1133.

[0079] In some examples, the intersection of the small opening end of the contraction tube 1132 and the small opening end of the expansion tube 1133 may be the narrow throat 1131. In other words, the narrow throat 1131 of the liquid guide tube 113 in the embodiments of the present application may refer to the transition between the contraction tube 1132 and the expansion tube 1133. Therefore, the coolant passing through the contraction tube 1132 can accumulate the coolant's pressure energy in the narrow throat 1131 and release it instantaneously. The coolant with greater pressure energy can be released through the expansion tube 1133, thereby increasing the coolant flow rate at the heat sink 112, thereby effectively improving the heat dissipation efficiency of the power consumption device 120.

[0080] In other examples, the narrow throat 1131 may also have a length along the first direction M. The length of the narrow throat 1131 may be set to be relatively short to accumulate the pressure of the coolant, thereby reducing the possibility that the pressure of the coolant accumulation is weakened due to the longer length of the narrow throat 1131, thereby affecting the flow rate of the coolant released by the expansion tube 1133.

[0081] In the embodiment of the present application, the coolant can convert its pressure energy into kinetic energy through the contraction tube 1132 and the narrow throat 1131. The coolant can continue to convert pressure energy into kinetic energy within the expansion tube 1133. When the pressure of the coolant at the output end 113b of the liquid conduit 113 drops to the same level as the coolant pressure within the housing 111, the coolant at the output end 113b of the liquid conduit 113 can achieve a higher flow rate, thereby improving the heat dissipation efficiency of the heat sink 112.

[0082] In some possible implementations, as shown in FIG. 2 to FIG. 4 , the cross-sectional area of ​​the expansion tube 1133 increases gradually along the direction from the narrow throat 1131 to the output end 113 b of the catheter 113 .

[0083] The direction from the narrow throat 1131 to the output end 113b of the catheter 113 may be the direction from the small opening end of the expansion tube 1133 to the large opening end of the expansion tube 1133. The cross-sectional area of ​​the expansion tube 1133 gradually increases. The cross-sectional area of ​​the expansion tube 1133 may be perpendicular to the first direction M.

[0084] In the embodiment of the present application, by gradually increasing the cross-sectional area of ​​expansion tube 1133, the loss of coolant flow pressure caused by the inner wall of expansion tube 1133 blocking the flow of coolant can be reduced. The coolant released by expansion tube 1133 provides sufficient kinetic energy for the coolant to be output to radiator 112, thereby increasing the output flow rate of the coolant and improving the heat dissipation efficiency of power consumption device 120.

[0085] Specifically, the coolant with a high flow rate can pass through the contraction tube 1132, and the pressure of the coolant can be accumulated at the narrow throat 1131. The coolant accumulated at the narrow throat 1131 has a relatively high pressure, which can be converted into kinetic energy and enter the expansion tube 1133. Therefore, the coolant in the narrow throat 1131 can be released through the expansion tube 1133 under the action of the relatively high kinetic energy and flow through the heat sink 112 to dissipate heat from the power consumption device 120.

[0086] In some examples, expansion tube 1133 is smoothly connected to narrow throat 1131. The cross-sectional shape of the small opening end of expansion tube 1133 can match the cross-sectional shape of narrow throat 1131, and the cross-sectional size of the small opening end of expansion tube 1133 can match the cross-sectional size of narrow throat 1131.

[0087] In some achievable embodiments, as shown in FIG. 2 to FIG. 4 , the cross-sectional area of ​​the output end 113 b of the catheter 113 may be larger than the cross-sectional area of ​​the input end 113 a of the catheter 113 .

[0088] In the embodiment of the present application, the output end 113b of the liquid conduit 113 corresponds to the radiator 112. The cross-sectional area of ​​the output end 113b of the liquid conduit 113 is large enough to fully contact the heat dissipation surface of the radiator 112. Moreover, because the coolant released from the output end 113b of the liquid conduit 113 has a high flow rate, the high-flow, high-speed coolant output by the liquid conduit 113 can quickly remove heat from the radiator 112 and remove heat from the power consumption device 120 and other components in the housing 111 to outside the computing node 100.

[0089] In some examples, the cross-sectional area of ​​the narrow throat 1131 is smaller than the cross-sectional area of ​​the input end 113a of the catheter 113 (the large open end of the contraction tube 1132) and the cross-sectional area of ​​the output end 113b of the catheter 113 (the large open end of the expansion tube 1133), and the cross-sectional area of ​​the input end 113a of the catheter 113 is smaller than the cross-sectional area of ​​the output end 113b of the catheter 113.

[0090] For example, the ratio of the cross-sectional area of ​​the narrow throat 1131 to the cross-sectional area of ​​the large opening end of the contraction tube 1132 and to the cross-sectional area of ​​the large opening end of the expansion tube 1133 can be approximately 1:2:5. When the cross-sectional shapes of the narrow throat 1131, the contraction tube 1132, and the expansion tube 1133 are circular, the ratio of the diameter of the narrow throat 1131 to the diameter of the large opening end of the contraction tube 1132 and to the diameter of the large opening end of the expansion tube 1133 can be approximately 1:2:5.

[0091] In some examples, the output end 113b of the liquid conduit 113 may be connected to the heat sink 112, and along the first direction M, the orthographic projection of the output end 113b of the liquid conduit 113 may be located inside the orthographic projection of the heat sink 112. For example, the coolant released from the output end 113b of the liquid conduit 113 may preliminarily and completely act on the heat sink 112 to improve the heat dissipation efficiency of the power consumption device 120.

[0092] In some examples, the length of expansion tube 1133 can be greater than or equal to the length of contraction tube 1132 .

[0093] In the embodiment of the present application, the volume within expansion tube 1133 can be greater than the volume within contraction tube 1132. As the coolant passes through contraction tube 1132, the pressure energy of the coolant can be accumulated at narrow throat 1131 (i.e., the small opening end of contraction tube 1132). The pressure energy of the coolant can be converted into kinetic energy at narrow throat 1131, and further converted into kinetic energy within expansion tube 1133. The larger volume within expansion tube 1133 allows the pressure energy of the coolant to be continuously converted into kinetic energy, thereby providing a higher flow rate and flow rate for the coolant to flow to radiator 112, thereby more effectively improving heat dissipation efficiency.

[0094] In some possible implementations, as shown in FIG3 , the cross-sectional shape of the expansion tube 1133 can be circular, elliptical, or polygonal. The cross-sectional shape of the contraction tube 1132 can also be circular, elliptical, or polygonal.

[0095] The intersection of the expansion tube 1133 and the contraction tube 1132 in the embodiment of the present application may have the same cross-sectional shape and cross-sectional size.

[0096] In some examples, both the expansion tube 1133 and the contraction tube 1132 can be tapered tubes. The catheter 113 can be integrally formed by a drawing die.

[0097] In some achievable embodiments, as shown in FIG. 3 , the liquid guide tube 113 of the embodiment of the present application may be a Laval nozzle.

[0098] Among them, the Laval nozzle can be formed by connecting a tapered expansion tube 1133 and a tapered contraction tube 1132. According to the flow direction (M) of the coolant in the liquid cooling pipe 400, the size of the contraction tube 1132 gradually contracts to the narrow throat 1131, and the size of the expansion tube 1133 gradually expands to the radiator 112 after the narrow throat 1131. The coolant entering from the liquid inlet 101 first enters the contraction tube 1132 under the action of pressure, passes through the narrow throat 1131, and is output from the expansion tube 1133. The flow rate of the coolant in the Laval nozzle can vary according to the size of the cross-sectional area of ​​the Laval nozzle it flows through. The arrangement of the contraction tube 1132 and the expansion tube 1133 can increase the flow rate of the coolant released by the Laval nozzle, so as to increase the flow rate of the coolant on the surface of the radiator 112, thereby improving the heat dissipation efficiency of the power consumption device 120.

[0099] In some implementations, as shown in FIG3 , the heat sink 112 of an embodiment of the present application may include a substrate 1121 and heat sinks 1122. The substrate 1121 is connected to the power consumption device 120. The heat sinks 1122 may be located on a side of the substrate 1121 facing away from the power consumption device 120. Along the second direction N of the substrate 1121, a plurality of heat sinks 1122 are spaced apart to form a plurality of heat dissipation gaps 112a. The output end 113b of the liquid conduit 113 may correspond to one or more heat dissipation gaps 112a.

[0100] It should be noted that the output end 113b of the liquid guide tube 113 is the large opening end of the expansion tube 1133. The inner cavity of the expansion tube 1133 is connected to the heat dissipation gap 112a so that the coolant released by the expansion tube 1133 can flow into the heat dissipation gap 112a.

[0101] The substrate 1121 and the power consumption device 120 can be fitted together. The heat generated by the power consumption device 120 can be transferred to the multiple heat sinks 1122 through the substrate 1121. The heat sink 1122 has a large heat dissipation surface, so the heat generated by the power consumption device 120 can be released through the heat dissipation surfaces of the multiple heat sinks 1122. A heat dissipation gap 112a can be provided between two adjacent heat sinks 1122. The coolant flowing through the heat dissipation gap 112a can fully contact the heat dissipation surface of the heat sink 1122 to remove the heat from the heat sink 1122, thereby achieving heat dissipation treatment for the power consumption device 120.

[0102] In some examples, the flow direction of the coolant within the heat dissipation gap 112a can be the same as the first direction M, and the second direction N can be perpendicular to the first direction M. The output end 113b of the liquid conduit 113 can be connected to as many heat dissipation gaps 112a as possible. The high-flow coolant released from the output end 113b of the liquid conduit 113 can directly enter the heat dissipation gap 112a and fully contact the heat dissipation surface to remove heat from the heat sink 1122. The coolant can then enter the entire housing 111 and remove the heat generated by all power consumption devices 120 within the housing 111, thereby achieving heat dissipation for the power consumption devices 120.

[0103] It is easy to understand that when the output end 113b of the liquid conduit 113 is fully connected to the heat sink 1122 of the radiator 112, the output end 113b of the liquid conduit 113 can communicate with all the heat dissipation gaps 112a of the radiator 112. In this case, the coolant released by the liquid conduit 113 can fully contact the heat sink 1122, thereby improving the heat dissipation effect of the radiator 112.

[0104] In some examples, along the first direction M, the orthographic projection of the outer contour of the output end 113b of the liquid conduit 113 can be located inside the orthographic projection of the outer contour of the radiator 112, or the orthographic projection of the outer contour of the output end 113b of the liquid conduit 113 can coincide with the orthographic projection of the outer contour of the radiator 112, so that the coolant output by the liquid conduit 113 can first flow into the heat dissipation gap 112a of the radiator 112.

[0105] In some examples, the output end 113 b of the liquid conduit 113 and the radiator 112 may be fixedly connected by welding, which is not limited in the embodiments of the present application.

[0106] In some implementations, as shown in FIG2 and FIG4 , the heat dissipation device 110 may further include a valve 114. The valve 114 may be located within the housing 111. The valve 114 may connect the liquid inlet 101 of the housing 111 and the input end 113a of the liquid conduit 113.

[0107] The valve 114 of the embodiment of the present application can be used to control the flow of coolant entering the housing 111. Specifically, when the temperature inside the housing 111 reaches a preset temperature, the flow of coolant entering the housing 111 can be reduced through the valve 114. When the temperature inside the housing 111 exceeds the preset temperature, the flow of coolant entering the housing 111 can be increased through the valve 114.

[0108] In some examples, the valve 114 is connected to the input end 113a of the catheter 113. Specifically, the valve 114 can be screwed, welded, or crimped to the input end 113a of the catheter 113, which is not limited in the embodiments of the present application.

[0109] In some examples, the coolant can be introduced through a liquid cooling pipe 400. The liquid cooling pipe 400 can be fixed to the side wall of the housing 111. One end of the liquid cooling pipe 400 can be used to input the coolant, and the other end of the liquid cooling pipe 400 can be connected to the liquid guide tube 113 through a valve 114.

[0110] In some examples, as shown in FIG2 and FIG4 , the heat dissipation device 110 may further include a connecting tube 115 . The connecting tube 115 is disposed at the input end 113 a of the liquid conduit 113 . The connecting tube 115 may be used to connect to the valve 114 .

[0111] In some examples, the connecting tube 115 can be a hose or a rigid tube, which is not limited in the embodiments of the present application.

[0112] In some examples, the heat sink 110 may further include a quick connector 116. The heat sink 110 may be connected to the liquid cooling pipe 400 via the quick connector 116. The quick connector 116 allows the liquid cooling pipe 400 to be connected or disconnected from the liquid conduit 113 without the use of tools during installation. The quick connector 116 can enhance the ease of operation of the heat sink 110 and improve assembly efficiency.

[0113] Illustratively, the quick connector 116 may be located inside the housing 111 to facilitate connection with the valve 114 , and the other end of the quick connector 116 may be used to connect with the liquid cooling pipe 400 .

[0114] In one implementation, as shown in FIG1 , a computing node 100 may include a power consumption device 120, a housing 111, and a heat sink 110 according to any of the aforementioned embodiments and implementations. The housing 111 may form a sealed cavity 111a for containing cooling liquid. The power consumption device 120 and the heat sink 110 may be located within the housing 111. The heat sink 110 is used to dissipate heat from the power consumption device 120.

[0115] In some examples, the housing 111 can be a square housing. The circuit board 130 can be fixed to the inner wall of the housing 111. The power consumption device 120 is disposed on the circuit board 130. The heat sink 112 of the heat sink 110 can be in contact with the power consumption device 120. The output end 113b of the liquid conduit 113 of the heat sink 110 can be connected to the heat dissipation gap 112a of the heat sink 112 to deliver high-flow coolant to the heat sink 110, thereby dissipating heat from the power consumption device 120.

[0116] Fig. 5 is a schematic diagram of a three-dimensional structure of a computing device 10 provided in an embodiment of the present application. Fig. 6 is a schematic diagram of a front view structure of a computing device 10 provided in Fig. 5 .

[0117] The present application also provides a computing device 10. The computing device 10 may include a housing 200 and a computing node 100. The housing 200 may have a storage space therein. There may be multiple computing nodes 100. Multiple computing nodes 100 may be linearly spaced and distributed within the storage space. The computing node 100 may include a heat sink 110 as described above for dissipating heat from a power-consuming device 120.

[0118] It is understood that linear distribution refers to distribution in a substantially straight line. Linear distribution of multiple computing nodes 100 in the accommodation space refers to the multiple computing nodes 100 being arranged in a substantially straight line in the accommodation space.

[0119] In some examples, as shown in Figures 5 and 6 , a liquid cooling tank 300 for storing coolant can be provided outside the computing device 10. The liquid cooling tank 300 can continuously provide coolant at a relatively low temperature to the computing device. The liquid cooling tank 300 can inject coolant into the housing 111 through a liquid cooling pipe 400.

[0120] The computing device 10 also includes a liquid cooling pipe 400. One end of the liquid cooling pipe 400 can be connected to the liquid cooling box 300. The other end of the liquid cooling pipe 400 can be used to connect to the liquid guide pipe 113. The liquid cooling pipe 400 may include a main pipe 410 and multiple branch pipes 420 that are connected to each other. The branch pipes 420 can be used to introduce cooling liquid into the liquid guide pipe 113, and the multiple branch pipes 420 can respectively correspond to multiple computing nodes 100. Therefore, the cooling liquid in the liquid cooling box 300 can be transported to the multiple branch pipes 420 through the main pipe 410, and the multiple branch pipes 420 can respectively introduce cooling liquid into the liquid guide pipes 113 of multiple computing nodes 100, so as to output cooling liquid to the corresponding computing nodes 100 through the liquid guide pipes 113, thereby dissipating heat.

[0121] In some examples, branch pipe 420 can be connected to valve 114 via quick connector 116, and then connected to liquid conduit 113 via valve 114. During operation of computing node 100, coolant in liquid cooling tank 300 can be sequentially output to radiator 112 via main pipe 410, branch pipe 420, quick connector 116, valve 114, and liquid conduit 113.

[0122] Specifically, the housing body 200 may be a cabinet. Multiple computing nodes 100 may be spaced apart within the housing space along a vertical direction Y. The main conduit 410 and the branch conduits 420 may both be located on the side surfaces of the housing body 200. The side surfaces may refer to the front, rear, left, or right side surfaces of the cabinet. The multiple branch conduits 420 may be spaced apart along the vertical direction Y. The housing 111 of the computing node 100 may have a square structure. The height dimension of the housing 111 of the computing node 100 may be smaller than its length and width dimensions. The height dimension of the housing 111 of the computing node 100 may be the same as the vertical direction Y. The computing node 100 may be inserted into the housing space of the housing body 200 along a horizontal direction X. The circuit board 130 may be disposed on the bottom wall of the housing 111 of the computing node 100. The liquid inlet 101 and the liquid outlet 102 may be disposed on two opposing side walls of the housing 111. The quick connector 116 may be located near the liquid inlet 101.

[0123] It should be noted that the liquid cooling tank 300 can deliver coolant to the housing body 200. After the coolant absorbs heat from the power consumption devices 120 of the multiple computing nodes 100 within the housing body 200, its temperature rises. At this point, the high-heat coolant can be discharged to the exterior of the housing body 200, dissipating heat from the multiple computing nodes 100 within the housing body 200.

[0124] Fig. 7 is a schematic diagram of the three-dimensional structure of another computing device 10 provided by the present application. Fig. 8 is a schematic diagram of the front view structure of the computing device 10 provided in Fig. 7 .

[0125] In another possible implementation, an embodiment of the present application further provides a computing node 100. Referring to Figures 4, 7, and 8, computing node 100 may include a power consumption device 120 and a heat sink 110 according to any of the aforementioned embodiments and implementations. Heat sink 110 may be fixed to power consumption device 120. Computing node 100 may be applied to a tank-type computing device. Specifically, computing node 100 may be placed in a tank-type computing device along its length.

[0126] The housing body 200 may be a tank. Multiple computing nodes 100 may be spaced apart within the housing space along a horizontal direction X. The computing nodes 100 may be inserted downwardly into the housing space of the housing body 200 along a vertical direction Y. The coolant flow direction (M) may be the same as the vertical direction Y. The coolant within the housing body 200 may submerge the computing nodes 100.

[0127] One end of the liquid cooling pipe 400 can be connected to the liquid cooling box 300. The other end of the liquid cooling pipe 400 can be used to connect to the liquid guide pipe 113. The liquid cooling pipe 400 can include a main pipe 410 and multiple branch pipes 420 that are connected to each other. The branch pipes 420 can be used to introduce cooling liquid into the liquid guide pipe 113, and the multiple branch pipes 420 can respectively correspond to multiple computing nodes 100. Therefore, the cooling liquid in the liquid cooling box 300 can be transported to the multiple branch pipes 420 through the main pipe 410, and the multiple branch pipes 420 can respectively introduce cooling liquid into the liquid guide pipes 113 of multiple computing nodes 100, so as to output cooling liquid to the corresponding computing nodes 100 through the liquid guide pipes 113, thereby dissipating heat.

[0128] In some examples, branch pipe 420 can be connected to liquid conduit 113 via quick connector 116 and valve 114. During operation of computing node 100, coolant in liquid cooling tank 300 can be sequentially delivered to radiator 112 via main pipe 410, branch pipe 420, quick connector 116, valve 114, and liquid conduit 113.

[0129] It should be noted that the liquid cooling tank 300 can deliver coolant to the housing body 200. After the coolant absorbs heat from the power consumption devices 120 of the multiple computing nodes 100 within the housing body 200, its temperature rises. At this point, the high-heat coolant can be discharged to the exterior of the housing body 200, dissipating heat from the multiple computing nodes 100 within the housing body 200.

[0130] Among them, the high-heat coolant discharged by the accommodating body 200 can be cooled and dissipated outside the accommodating body 200 to form a coolant with a lower temperature and return to the liquid cooling box 300, so that the liquid cooling box 300 can continue to provide the accommodating body 200 with a coolant with a lower temperature.

[0131] In summary, the heat dissipation device 110 of the embodiment of the present application can be applied to the cabinet-type computing device 10 shown in Figures 5 and 6, and can also be applied to the tank-type computing device 10 shown in Figures 7 and 8. The heat dissipation device 110 can be used to dissipate heat from the power consumption devices 120 within the computing nodes 100 within the computing device 10, thereby maintaining the normal operation of the computing device 10 and reducing the possibility of failure of the computing device 10 due to excessive internal temperature.

[0132] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0133] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A computing node, characterized in that: include: Power consumption devices; a heat sink, arranged corresponding to and connected to the power consumption device; A liquid conduit is connected to the radiator, wherein the input end of the liquid conduit is used to introduce coolant to dissipate heat for the power consumption device, and the output end of the liquid conduit is connected to the radiator. The liquid conduit includes a narrow throat, and there is a gap between the narrow throat and the input end. The cross-sectional area of ​​the liquid conduit at the narrow throat is the smallest, and the cross-sectional area is perpendicular to the first direction of the liquid conduit.

2. The computing node according to claim 1, wherein: The catheter further includes a contraction tube connected to the narrow throat. Along the first direction, the input end of the catheter is located at an end of the contraction tube away from the narrow throat.

3. The computing node according to claim 2, characterized in that Along the direction from the input end of the catheter to the narrow throat, the cross-sectional area of ​​the contraction tube gradually decreases.

4. The computing node according to claim 2, wherein: The liquid guide tube further comprises an expansion tube, one end of which is connected to the narrow throat, and the other end of which is connected to the radiator; Along the first direction, the expansion tube and the contraction tube are respectively located on both sides of the narrow throat, and the narrow throat is provided at the intersection of the contraction tube and the expansion tube; The output end of the catheter is located at an end of the expansion tube away from the narrow throat.

5. The computing node according to claim 4, characterized in that Along the direction from the narrow throat to the output end of the catheter, the cross-sectional area of ​​the expansion tube gradually increases.

6. The computing node according to claim 4 or 5, characterized in that: The cross-sectional area of ​​the output end of the catheter is larger than the cross-sectional area of ​​the input end of the catheter; and / or, The length of the expansion tube is greater than or equal to the length of the contraction tube.

7. The computing node according to any one of claims 1 to 6, characterized in that: The liquid guide tube is a Laval nozzle.

8. The computing node according to any one of claims 1 to 7, characterized in that: The radiator includes a heat sink, which extends along a second direction perpendicular to the first direction. A plurality of the heat sinks are spaced apart to form a plurality of heat dissipation gaps. The output end of the liquid conduit is connected to the heat sink so that the liquid conduit is in communication with the heat dissipation gaps.

9. The computing node according to any one of claims 1 to 8, characterized in that: The device further comprises a housing, wherein the housing forms a sealed cavity for receiving the cooling liquid, and the power consumption device is located in the sealed cavity; The shell is provided with a liquid inlet, which is communicated with the input end of the liquid guide tube. The coolant enters the closed cavity through the liquid inlet to immerse the power consumption device.

10. A computing device, characterized in that include: An accommodating body having an accommodating space; According to the computing node described in claims 1 to 9, there are multiple computing nodes, and the multiple computing nodes are linearly distributed in the accommodation space.

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