Polyarylethersulfone resin material for electronic equipment / device, electronic equipment / device using same, and method for using polyarylethersulfone in electronic equipment / device

Abstract

The present invention addresses the problem of providing a polyarylethersulfone resin material having both excellent dielectric properties in high frequency bands and excellent heat resistance that can be used suitably as a material used in electronic equipment / devices, especially electronic equipment / devices for high frequency communication. Provided as a solution is a polyarylethersulfone resin material for electronic equipment / devices that has a glass transition temperature of 200°C or higher, has a weight-average molecular weight (Mw) in the range of 2,000-1,000,000, and contains a polyarylethersulfone having a repeating unit represented by general formula (1). (In the formula, R1 and R2 each independently represent a hydrogen atom or a methyl group, at least one of R1 and R2 represents a methyl group, and m represents 0 or 1.)

Description

Polyarylethersulfone resin material for electronic devices and devices, electronic devices and devices using the same, and method for using polyarylethersulfone in electronic devices and devices

[0001] The present invention relates to a polyarylethersulfone resin material obtained by using a specific bisphenol compound as a raw material, suitable for use as a material for electronic devices and electronic devices used therein, and to an electronic device and an electronic device using the same. The present invention also relates to a method for using the polyarylethersulfone obtained by using the specific bisphenol compound as a raw material for electronic devices and electronic devices used therein.

[0002] Polyarylethersulfone (PAES) resin is a thermoplastic plastic that possesses characteristics such as heat resistance, dimensional stability, mechanical properties, and flame retardancy, and is known as a type of super engineering plastic. For this reason, PAES resin is used as a material in the electrical and electronic fields, such as relay parts, coil bobbins, and switches; in office and audiovisual parts such as various parts for copiers and printers; in heat-resistant tableware such as trays for in-flight meals; and in the medical field, such as dental instruments. The use of PAES in these applications tends to become more sophisticated and specialized, and improved heat resistance is also required.

[0003] In recent years, the transmission speed of electrical signals in wireless Internet devices and communication devices has become significantly faster and higher in frequency, and the insulating parts that insulate the metal wiring of these devices are also required to support higher frequencies. In particular, higher frequency radio waves such as centimeter waves (SHF: Super High Frequency) and millimeter waves (EHF: Extremely High Frequency) are used for even faster data communication. The higher the frequency, the greater the dielectric loss in the insulating parts, resulting in attenuation of the electrical signals. Therefore, to support higher frequencies, materials with excellent dielectric properties that can reduce dielectric loss are required. Meanwhile, excellent heat resistance is also required in the manufacture and use of electrical and electronic components, and electronic devices and electronic equipment using these components, and materials with improved heat resistance are also required. Resins that are primarily used for this purpose include liquid crystal polymers (LCPs) and polyaryl ether ketones (PAEKs), and PAES has currently received little attention.

[0004] Polyphenylsulfone (PPSU) obtained using 4,4'-dihydroxybiphenyl is a commonly known PAES polymer having a biphenyl structure. By incorporating monovalent aliphatic hydrocarbon groups as side chains into the biphenyl skeleton, polyethersulfones with extremely high glass transition temperatures are obtained. Specifically, PAES using 4,4'-dihydroxy-2,2',3,3',5,5'-hexamethylbiphenyl is known to have a glass transition temperature (Tg) of 290°C (Patent Document 1). PAES obtained by polycondensation of 4,4'-dihydroxy-3,3'-diphenyl-diphenylsulfone and 4,4'-dihalodiphenylsulfone has superior water absorption and dielectric constant compared to conventional polyethersulfones, as well as superior heat resistance compared to known polysulfones. The dielectric properties of such PAES are known to be a dielectric constant of 3.0 at 1 kHz, which is lower than the 3.5 of polyethersulfone and equivalent to the 3.1 of polysulfone (Patent Document 2).

[0005] JP-A No. 02-233728 JP-A No. 62-253627

[0006] The dielectric properties of PAES in the high frequency band have not been known until now, and it is unclear whether it is suitable as a material for use in electronic devices and electronic devices used therein (hereinafter, collectively referred to as "electronic devices / devices"), particularly electronic devices / devices used for high-speed communications using high-frequency radio waves, which are in demand these days (hereinafter, sometimes referred to as "high-frequency communication electronic devices / devices"). The inventors synthesized PAES (polyphenylsulfone: PPSU) obtained using 4,4'-biphenol as the raw bisphenol, a commonly used PAES, and evaluated its dielectric properties in the high frequency band. They found that the PAES had a high relative permittivity and dielectric loss tangent, resulting in poor dielectric properties for use as a resin material in electronic devices / devices. An object of the present invention is to provide a PAES resin material that combines excellent dielectric properties in the high frequency band with excellent heat resistance, and that can be suitably used as a material for electronic devices / devices, particularly electronic devices / devices for high-frequency communication.

[0007] As a result of intensive research to solve the above-mentioned problems, the present inventors have found that PAES having a biphenyl structure to which a methyl group is bonded has excellent heat resistance as well as excellent dielectric properties in the high frequency band, and is suitable as a material for use in electronic devices and devices, particularly electronic devices and devices for high frequency communication, and have completed the present invention.

[0008] The present invention is as follows: 1. A polyarylethersulfone resin material for electronic devices, which contains polyarylethersulfone having a glass transition temperature of 200°C or higher, a weight average molecular weight (Mw) in the range of 2,000 to 1,000,000, and a repeating unit represented by general formula (1). (In the formula, R １ and R ２ are each independently a hydrogen atom or a methyl group, and R １ and R ２At least one of the repeating units represents a methyl group, and m represents 0 or 1. 2. The polyarylethersulfone resin material for electronic devices and devices according to 1., wherein the repeating unit represented by general formula (1) is at least one selected from the repeating units represented by chemical formulas (1a) to (1c): 3. The polyarylethersulfone resin material for electronic devices and devices according to 1., wherein the polyarylethersulfone further has a dielectric loss tangent of 0.005 or less measured at a frequency of 1 GHz and a relative dielectric constant of 3.5 or less measured at a frequency of 1 GHz. 4. The polyarylethersulfone resin material for electronic devices and devices according to 1., wherein the electronic device or device is an electronic device or device for high-frequency communication in the range of 1 GHz to 300 GHz. 5. An electronic device or device using the polyarylethersulfone resin material for electronic devices and devices according to 1. 6. A circuit board, semiconductor encapsulant, or antenna element member for an electronic device or device using the polyarylethersulfone resin material for electronic devices and devices according to 1. 7. An electronic device or device for high-frequency communication in the range of 1 GHz to 300 GHz using the polyarylethersulfone resin material for electronic devices and devices according to 1. 8. A method for using a polyarylethersulfone having a glass transition temperature of 200°C or higher and a weight average molecular weight (Mw) in the range of 2,000 to 1,000,000, in an electronic device or device. (In the formula, R １ and R ２ are each independently a hydrogen atom or a methyl group, and R １ and R ２ At least one of the repeating units represents a methyl group, and m represents 0 or 1. 9. A method for using the polyarylethersulfone according to 8. in an electronic device or device, wherein the repeating unit represented by general formula (1) is at least one selected from the repeating units represented by chemical formulas (1a) to (1c): 10. A method for using the polyarylethersulfone according to 8. in an electronic device or device, wherein the polyarylethersulfone further has a dielectric loss tangent of 0.005 or less measured at a frequency of 1 GHz and a relative dielectric constant of 3.5 or less measured at a frequency of 1 GHz. 11. A method for using the polyarylethersulfone according to 8. in an electronic device or device, wherein the electronic device or device is an electronic device or device for high-frequency communication in the range of 1 GHz to 300 GHz. 12. A method for using the polyarylethersulfone according to 8. in an electronic device or device, wherein the polyarylethersulfone is used in a circuit board, semiconductor encapsulant, or antenna element member of the electronic device or device.

[0009] The polyarylethersulfone resin material according to the present invention has excellent dielectric properties in the high-frequency band and is therefore suitable as a resin material for use in electronic devices and devices, particularly electronic devices and devices for high-frequency communication.Furthermore, the polyarylethersulfone resin material according to the present invention has excellent heat resistance and is therefore suitable for use in electronic devices and devices used in high-temperature environments and for applications and components requiring solder heat resistance.

[0010] (Repeating Unit of PAES According to the Present Invention) The PAES according to the present invention has a repeating unit represented by general formula (1). (In the formula, R １ and R ２ are each independently a hydrogen atom or a methyl group, and at least R １ and R ２ One of the groups represents a methyl group, and m represents 0 or 1. In general formula (1), R １ is a hydrogen atom, and R ２ is a methyl group, or R １ and R ２ are preferably both methyl groups, and R １ and R ２ In general formula (1), m is preferably 0 from the viewpoint of availability of raw materials.

[0011] In general formula (1), when m is 0, specific examples of the repeating unit represented by chemical formulae (1a) to (1c) include structures of chemical formulae (1a) to (1c). Among the repeating units represented by general formula (1), it is preferable to have at least one repeating unit selected from the repeating units represented by chemical formulae (1a) to (1c), it is more preferable to have at least one repeating unit selected from the repeating unit represented by chemical formula (1a) and the repeating unit represented by chemical formula (1c), and it is particularly preferable to have a repeating unit represented by chemical formula (1a). In the general formula (1), when m is 1, specific examples of the repeating unit represented by the formula (1) include structures of chemical formulas (1d) to (1i), and it is preferable to have at least one repeating unit selected from the repeating units represented by the formulas (1d) to (1i). From the viewpoint of the heat resistance of the resulting PAES, it is even more preferable to have at least one repeating unit selected from the repeating units represented by the formulas (1d) to (1f).

[0012] The PAES of the present invention may have one structure selected from the repeating units represented by general formula (1), as well as two or more structures selected from the repeating units represented by general formula (1). An embodiment having one structure selected from the repeating units represented by general formula (1) is preferred. The PAES of the present invention may contain other repeating units as long as they contain the repeating units represented by general formula (1), as long as the effects of the present invention are not impaired. However, it is preferred that the content of the repeating units represented by general formula (1) is 100 mol%, i.e., that no other repeating units are contained. When other repeating units are contained, the content of the repeating units represented by general formula (1) is preferably 50 mol% or more of the total PAES, more preferably 70 mol% or more, even more preferably 80 mol% or more, and particularly preferably 90 mol% or more. The repeating units represented by general formula (1) and the other repeating units may be arranged regularly or randomly. A PAES having a repeating unit represented by general formula (1) and other repeating units can be produced by carrying out a polycondensation reaction described later using a biphenol compound represented by general formula (3) described later and an aromatic dihydroxy compound in combination.

[0013] The PAES according to the present invention preferably does not have, in its polymer chain, any one or more of a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a carboxyl group or a salt thereof, an ester-derived group of a sulfonic acid group, a phosphoric acid group or a carboxyl group with an alcohol, an amide-derived group of a sulfonic acid group, a phosphoric acid group or a carboxyl group with an amine, and an ionic group. The chemical structures of the sulfonic acid group, the phosphoric acid group, and the carboxyl group are groups represented by the following formulas, respectively.

[0014] (Structure of Both Terminals of Polymer Chain of PAES According to the Present Invention) The structure of both terminals of the polymer chain of PAES according to the present invention is not particularly limited. The terminal structure may be a halogen atom derived from a dihalogen compound represented by general formula (2) described below, a hydroxy group derived from a biphenol compound represented by general formula (3), or a terminal structure in which this hydroxy group has been modified with a reactive functional group, specifically, for example, a group represented by general formula (4) (specifically, an acryloyloxy group or a methacryloyloxy group) or a group represented by chemical formula (5) (a glycidyl ether group). (In the formula, R ３ represents a hydrogen atom or a methyl group, and * represents a bonding site at the end of the polymer chain.) This reactive functional group is preferably a group represented by general formula (4) (specifically, an acryloyloxy group or a methacryloyloxy group) or a group represented by chemical formula (5) (a glycidyl ether group). When such terminal structures are (i) both halogen atoms, (ii) both hydroxy groups, or (iii) one halogen atom and the other a hydroxy group, the polyarylethersulfone resin material for electronic devices and devices of the present invention can be used as a thermoplastic resin. Conventional molding and processing methods for thermoplastic resins (e.g., melt molding methods such as injection molding, extrusion molding, and compression molding) can be used to produce molded articles for use in electronic devices and devices, thereby enabling the manufacture of electronic devices and devices. Furthermore, when the terminal structures are (i) both reactive functional groups, (ii) one reactive functional group and the other a halogen atom, or (iii) one reactive functional group and the other a hydroxy group, since either one of the terminal structures has the reactive functional group, the polyarylethersulfone resin material for electronic devices and devices of the present invention can be used as a curable resin. By applying a conventional molding or processing method for curable resins (e.g., compression molding or transfer molding), molded articles for use in electronic devices and devices can be produced, and electronic devices and devices can be manufactured.

[0015] (Molecular Weight) The weight-average molecular weight (Mw) of the PAES according to the present invention is in the range of 2,000 to 1,000,000, preferably 10,000 to 500,000, more preferably 20,000 to 200,000, and particularly preferably 30,000 to 150,000. When the end terminal structures of the polymer chain of the PAES according to the present invention are (i) both halogen atoms, (ii) both hydroxy groups, or (iii) one halogen atom and the other hydroxy group, in order to provide sufficient mechanical strength when used as a thermoplastic resin, the weight-average molecular weight (Mw) is more preferably 10,000 to 500,000, even more preferably 20,000 to 200,000, and particularly preferably 30,000 to 150,000. When the terminal structures of the PAES according to the present invention are (i) both reactive functional groups, (ii) one reactive functional group and the other a halogen atom, or (iii) one reactive functional group and the other a hydroxy group, in order to provide good processability when used as a curable resin, the weight average molecular weight (Mw) is preferably in the range of 2,000 to 100,000, more preferably 2,000 to 50,000, even more preferably 2,000 to 30,000, and particularly preferably 2,000 to 10,000. The ratio Mw / Mn of the weight average molecular weight (Mw) to the number average molecular weight (Mn) is preferably in the range of 1.5 to 20, more preferably 2 to 15, even more preferably 2 to 10, and particularly preferably 2 to 8.

[0016] (Glass transition temperature) The glass transition temperature of the PAES according to the present invention is 200°C or higher, preferably 225°C or higher, more preferably 250°C or higher, and particularly preferably 270°C or higher. The higher the glass transition temperature, the better the heat resistance, so the upper limit is not particularly limited, but it may be 300°C or lower. The PAES according to the present invention can be suitably used as a polyarylethersulfone resin material for electronic devices and devices that are exposed to high temperatures during production and in use, particularly for electronic devices and devices for high-frequency communication in the range of 1 GHz to 300 GHz.

[0017] (Dielectric Dissipation Factor) The dielectric dissipation factor of the PAES of the present invention measured at a frequency of 1 GHz is preferably 0.005 or less. If it is 0.005 or less, it can be suitably used as a polyarylethersulfone resin material for electronic devices and devices, particularly for high-frequency communication electronic devices and devices in the range of 1 GHz to 300 GHz. The dielectric dissipation factor is more preferably 0.0045 or less, even more preferably 0.004 or less, and particularly preferably 0.003 or less. Since a lower dielectric dissipation factor is preferable, the lower limit is not particularly limited, but it may be 0.001 or more. Furthermore, the dielectric dissipation factor measured at a frequency of 10 GHz is preferably 0.005 or less, more preferably 0.0045 or less, and particularly preferably 0.0040 or less. Since a lower dielectric dissipation factor is preferable, the lower limit is not particularly limited, but it may be 0.001 or more.

[0018] (Dielectric Constant) The dielectric constant of the PAES according to the present invention measured at a frequency of 1 GHz is preferably 3.5 or less. If it is 3.5 or less, it can be suitably used as a polyarylethersulfone resin material for electronic devices and devices, particularly for high-frequency communication electronic devices and devices in the range of 1 GHz to 300 GHz. The dielectric constant is more preferably 3.0 or less, even more preferably 2.9 or less, and particularly preferably 2.8 or less. Since the lower the dielectric constant, the more preferable, the lower limit is not particularly limited, but it may be 2.0 or more. Furthermore, the dielectric constant measured at a frequency of 10 GHz is preferably 3.5 or less, more preferably 3.0 or less, even more preferably 2.9 or less, and particularly preferably 2.8 or less. Since the lower the dielectric constant, the more preferable, the lower limit is not particularly limited, but it may be 2.0 or more.

[0019] (Method for Producing PAES According to the Present Invention) The method for producing PAES according to the present invention is not particularly limited, and for example, PAES can be produced by subjecting a dihalogen compound represented by general formula (2) and a biphenol compound represented by general formula (3) to a desalination polycondensation reaction in the presence of an alkali metal compound. (In the formula, each X independently represents a halogen atom, and m is defined as in general formula (1).) (In the formula, R １ , and R ２ is defined as in general formula (1).

[0020] As a specific example, when 4,4'-dichlorodiphenyl sulfone (2a) is used as the dihalogen compound represented by general formula (2), 4,4'-dihydroxy-2,2',3,3',5,5'-hexamethylbiphenyl (3a) is used as the biphenol compound represented by general formula (3), and potassium carbonate is used as the alkali metal compound, a polyaryl ether sulfone having a repeating unit represented by chemical formula (1a) can be produced. The reaction formula is shown below.

[0021] (Dihalogen Compound Represented by General Formula (2)) X in General Formula (2) specifically represents a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and among these, a fluorine atom or a chlorine atom is preferred, and a chlorine atom is particularly preferred. In General Formula (2), m is preferably 0 from the viewpoint of availability. Specific examples of the dihalogen compound represented by general formula (2) include 4,4'-difluorodiphenyl sulfone, 4,4'-dichlorodiphenyl sulfone, 4,4'-dibromodiphenyl sulfone, 4,4'-diiododiphenyl sulfone, 1,4-bis[(4-fluorophenyl)sulfonyl]benzene, 1,4-bis[(4-chlorophenyl)sulfonyl]benzene, 1,4-bis[(4-bromophenyl)sulfonyl]benzene, 1,4-bis[(4-iodophenyl)sulfonyl]benzene, 1,3-bis[(4-fluorophenyl)sulfonyl]benzene, 1,3-bis[(4-chlorophenyl)sulfonyl]benzene, 1,3-bis[(4-bromophenyl)sulfonyl]benzene, and 1,3-bis[(4-iodophenyl)sulfonyl]benzene. Of these, 4,4'-difluorodiphenyl sulfone and 4,4'-dichlorodiphenyl sulfone are preferred, with 4,4'-dichlorodiphenyl sulfone being particularly preferred.

[0022] (Biphenol compound represented by general formula (3)) In general formula (3), R １ is a hydrogen atom, and R ２ is a methyl group, or R １ and R ２ are preferably both methyl groups, and R １ and R ２are particularly preferably methyl groups. Specific examples of biphenol compounds represented by general formula (3) include 4,4'-dihydroxy-2,2',3,3',5,5'-hexamethylbiphenyl (3a), 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl (3b), and 4,4'-dihydroxy-2,2',5,5'-tetramethylbiphenyl (3c). Of these, 4,4'-dihydroxy-2,2',3,3',5,5'-hexamethylbiphenyl (3a) is particularly preferred. At least one of these compounds may be used, and it is also possible to use only one type or two or more types in combination.

[0023] (Other Aromatic Dihydroxy Compounds) In the PAES of the present invention, in order to obtain a PAES having a repeating unit represented by general formula (1) and other repeating units, other aromatic dihydroxy compounds can be used in combination with the bisphenol compound represented by general formula (3). The other repeating units have a structure derived from these aromatic hydroxy compounds and a repeating unit having a structure derived from the dihalogen compound represented by general formula (2). The aromatic dihydroxy compound other than the bisphenol compound represented by general formula (3) is preferably an aromatic dihydroxy compound that does not contain a sulfonic acid group, a phosphoric acid group, or a carboxylic acid group, and more preferably an aromatic hydroxy compound represented by general formula (6). (In the formula, R represents a divalent group represented by general formula (6a) or (6b).) (In the formula, R ４ each independently represents a linear or branched alkyl group having 1 to 6 carbon atoms, a cyclic alkyl group having 5 or 6 carbon atoms, or a phenyl group; each a independently represents an integer of 0 to 4; b represents 0 or 1; c represents 0, 1, or 2; and * represents a bonding position. (In the formula, R ４each independently represents a linear or branched alkyl group having 1 to 6 carbon atoms, a cyclic alkyl group having 5 or 6 carbon atoms, or a phenyl group; Y represents an oxygen atom, a sulfur atom, a sulfonyl group, a carbonyl group, or a divalent group represented by general formula (7a), (7b), or (7c); Z represents an oxygen atom, a sulfur atom, or no crosslink; and * represents each bonding position. (In general formulas (7a), (7b) and (7c), R ５ each independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 10 carbon atoms, a halogenated alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 12 carbon atoms; ５ may be bonded to each other to form a cycloalkylidene group having 5 to 20 carbon atoms as a whole, and R ６ each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms; Ar １Each independently represents an aryl group having 6 to 12 carbon atoms, and * represents the bonding position.) Specific examples of other aromatic dihydroxy compounds that can be used in combination include hydroquinone, resorcinol, 2-phenylhydroquinone, 4,4'-biphenol, 3,3'-biphenol, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,1'-bi-2-naphthol, 2,2'-bi-1-naphthol, 1,3-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,4-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,4-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,5-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,6-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,7-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,8-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,9-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,9-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,1'-bi-2-naphthol, 2,2'-bi-1-naphthol, 1,3-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,4-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,5-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,6-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,7-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,8-bis[1-methyl-1-(4-hydroxyphenyl)ethyl]benzene, 1,9-bis[ phenyl)ethyl]benzene, 1,4-bis(4-hydroxyphenyl)benzene, 1,3-bis(4-hydroxyphenyl)benzene, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dimethylphenyl)methane, 2,2-bis(4-hydroxyphenyl)propane (Bis-A), 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane, 4,4'-dihydroxybenzophenone, bis( 4-hydroxyphenyl) sulfone, 4,4'-dihydroxydiphenyl ether, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(3-phenyl-4-hydroxyphenyl)fluorene, 9,9-bis(3,5-diphenyl-4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3-cyclohexylphenyl)fluorene, 2,2-bis(4-hydroxy-3-phenylphenyl)propane, bisphenol Z (1,1-bis(4-hydroxyphenyl)cyclohexane), bisphenol TMC (1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane), 1,1-bis(4-hydroxyphenyl)cyclododecane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane. These compounds may be used alone or in combination of two or more. The other repeating unit has a structure derived from these aromatic hydroxy compounds and a repeating unit having a structure derived from a dihalogen compound represented by general formula (2).

[0024] (Alkali Metal Compound) Any alkali metal compound can be used as long as it can convert the biphenol compound represented by general formula (3) into an alkali metal salt, but usually, carbonates, hydrogen carbonates, hydroxides, etc. of alkali metals are suitably used, and carbonates are particularly preferred. Examples of the alkali metal include lithium, sodium, potassium, rubidium, and cesium, among which sodium and potassium are preferred, and potassium is particularly preferred.

[0025] (Solvent) A solvent can be used in the polycondensation reaction to obtain PAES, and its use is preferred. The solvent to be used is preferably an aprotic polar solvent such as N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), N-methylpyrrolidone (NMP), dimethylimidazolidinone (DMI), dimethyl sulfoxide (DMSO), sulfolane, or diphenyl sulfone, but any solvent can be used without any problems as long as it dissolves the monomer and polymer. The solvent may be used alone, or two or more types may be used in combination as a mixed solvent.

[0026] (Conditions for Polycondensation Reaction) The amount of the dihalogen compound represented by general formula (2) used depends on the target molecular weight relative to the biphenol compound represented by general formula (3) (when an aromatic dihydroxy compound other than general formula (3) is used in combination, the total of the biphenol compound represented by general formula (3) and the other aromatic dihydroxy compound), but in order to produce a PAES with a high molecular weight (specifically, preferably in the range of 10,000 or more and 500,000 or less, more preferably in the range of 20,000 or more and 200,000 or less, and particularly preferably in the range of 30,000 or more and 150,000 or less), it is usually in the range of 0.9 to 1.1 times by mole, preferably in the range of 0.95 to 1.06 times by mole, and more preferably in the range of 1.0 to 1.04 times by mole. On the other hand, to produce PAES having a small molecular weight (specifically, preferably in the range of 2,000 to 100,000, more preferably in the range of 2,000 to 50,000, even more preferably in the range of 2,000 to 30,000, and particularly preferably in the range of 2,000 to 10,000), the molar ratio is usually in the range of 0.6 to 1.4 times, preferably in the range of 0.7 to 1.3 times, and more preferably in the range of 0.8 to 1.2 times. In the case of PAES in which both terminal structures of the polymer chain of the produced PAES are halogen atoms, the molar ratio is in the range of 1.01 to 1.1 times, preferably in the range of 1.01 to 1.06 times, and more preferably in the range of 1.01 to 1.04 times. In the case of PAES in which both terminal structures of the polymer chain of the PAES to be produced are hydroxy groups, the molar ratio is in the range of 0.9 to 0.99 times by mole for PAES with a large molecular weight, and preferably in the range of 0.95 to 0.99 times by mole, while the molar ratio is usually in the range of 0.6 to 0.95 times by mole, preferably in the range of 0.7 to 0.9 times by mole, and more preferably in the range of 0.8 to 0.9 times by mole for PAES with a small molecular weight. The amount of the alkali metal compound used is usually in the range of 1.0 to 3.0 times by mole, and preferably in the range of 1.01 to 1.3 times by mole, relative to the biphenol compound represented by general formula (3) (when an aromatic dihydroxy compound other than general formula (3) is used in combination, the total amount of the biphenol compound represented by general formula (3) and the other aromatic dihydroxy compound).The reaction temperature is usually in the range of 150 to 350°C, preferably in the range of 150 to 250°C, and the reaction time is usually 1 to 400 hours, preferably 2 to 160 hours. These reactions are preferably carried out in an inert gas atmosphere such as nitrogen or argon. There are no limitations on the reaction pressure, and the reaction may be carried out under reduced pressure, atmospheric pressure, or elevated pressure, but it is usually carried out at atmospheric pressure.

[0027] <Post-Reaction Treatment> PAES produced by the polycondensation reaction can be recovered by commonly used methods such as coagulation, solidification, washing, granulation, extraction, and solvent distillation. A more detailed example of a method for treating PAES produced by the polycondensation reaction is described below. A liquid containing PAES produced by the polycondensation reaction is optionally diluted with a polymer-containing reaction liquid, and the resulting solution is mixed with a poor solvent to precipitate a precipitate, thereby obtaining powdered PAES. In this process, to remove alkali metal salts, a solvent used for precipitating and re-precipitating the precipitate is preferably water, or acidic water containing low concentrations of hydrochloric acid, formic acid, oxalic acid, or the like may also be used. Next, the resulting PAES precipitate is preferably washed with a solvent to remove raw material monomers and the like. Examples of suitable solvents include methanol, ethanol, acetone, methyl ethyl sulfone, xylene, and toluene. Acetone and methanol are particularly preferred due to their ease of operation and ease of distillation recovery of the reaction solvent after washing. The conditions for the above washing step may be appropriately selected, such as the amount of washing solvent used, the number of washes, and the washing temperature, depending on the amounts of the residual raw material monomer, reaction solvent, and alkali metal salt to be removed. After washing with acetone or methanol, to further remove remaining alkali metal salts, the product may be dissolved in a neutral polar solvent such as N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), N-methylpyrrolidone (NMP), dimethylimidazolidinone (DMI), dimethyl sulfoxide (DMSO), sulfolane, or diphenyl sulfone, followed by precipitation with water or acidic water. The washing apparatus may be a combination of a washing tank and a pressure filter or a centrifuge, or a multi-function filter capable of washing, filtering, and drying in one device.

[0028] A drying step can be carried out to dry the powdery PAES containing water and solvent after completion of washing obtained by the above washing step. The conditions for this drying step may be any conditions that allow removal of water at a temperature below the melting point of the polycondensation reaction product. To minimize contact with air, it is preferable to carry out the drying step under an inert gas (nitrogen, argon, etc.) atmosphere, under an inert gas stream, or under reduced pressure. As the dryer, known devices such as an evaporator, a tray oven, or a tumbler can be used.

[0029] In the case where the structure of both ends of the polymer chain of the polyarylethersulfone (PAES) according to the present invention is an end structure modified with a reactive functional group such as an acryloyloxy group, a methacryloyloxy group, or a glycidyl ether group, the PAES can be obtained by modifying the hydroxy group derived from the biphenol compound represented by general formula (3) with a reactive substituent such as an acryloyloxy group, a methacryloyloxy group, or a glycidyl ether group.

[0030] The PAES of the present invention, whose terminal structure is a group represented by general formula (4) (acryloyl group or methacryloyl group), can be produced by applying a conventionally known method for (meth)acrylation of a hydroxy compound to a polyarylethersulfone having a repeating unit represented by general formula (1) containing a hydroxy group at the end of the polymer chain obtained by the above-mentioned method. For example, a (meth)acrylation method includes reacting the terminal hydroxy group of a polyarylethersulfone having a repeating unit represented by general formula (1) with (meth)acrylic acid or a derivative thereof. When acrylic acid chloride is used as the (meth)acrylic acid derivative, chloride ions are generated in the form of hydrogen chloride, so it is preferable to use a hydrogen chloride scavenger in combination. As the hydrogen chloride scavenger, inorganic or organic basic substances such as alkali metal carbonates or bicarbonates, tertiary amines, etc. can be used. Specific examples of (meth)acrylic acid and its derivatives include acrylic acid, methacrylic acid, acrylic acid chloride, and methacrylic acid chloride. In the acrylation reaction, a solvent such as a halogenated hydrocarbon such as methylene chloride, or tetrahydrofuran, dioxane, chlorobenzene, etc. may be used. During the reaction, a polymerization inhibitor such as hydroquinone, hydroquinone monomethyl ether, phenothiazine, 2,6-di-tert-butyl-4-methylphenol (BHT), etc. may be added.

[0031] The PAES of the present invention, whose terminal structure is a group represented by chemical formula (5) (glycidyl ether group), can be produced by applying a conventionally known method for glycidyl etherifying a hydroxy compound to a polyarylethersulfone having a repeating unit represented by general formula (1) containing a hydroxy group at the end of the polymer chain obtained by the above method. For example, the glycidyl etherification method can be carried out by reacting the terminal hydroxy group of a polyarylethersulfone having a repeating unit represented by general formula (1) with an epihalohydrin in the presence of an alkali metal hydroxide (e.g., sodium hydroxide or potassium hydroxide) or a quaternary ammonium salt (e.g., tetramethylammonium chloride or tetramethylammonium bromide) to produce a glycidyl etherified PAES. Specific examples of the epihalohydrin used include epichlorohydrin and epibromohydrin.

[0032] <Polyarylethersulfone resin composition> Various additives such as flame retardants, heat stabilizers, oxidation stabilizers, weather stabilizers, antistatic agents, lubricants, and plasticizers can be blended into the PAES of the present invention as desired by a conventional method of blending additives into a raw resin, as long as the effects of the present invention are not impaired. A polyarylethersulfone resin composition can be obtained, containing the PAES of the present invention and one or more additives selected from the group consisting of flame retardants, heat stabilizers, oxidation stabilizers, weather stabilizers, antistatic agents, lubricants, and plasticizers. This polyarylethersulfone resin composition can be used in the same manner as the PAES of the present invention, which will be described later.

[0033] <Use of PAES according to the present invention> (High-frequency band radio waves) In the present invention, high-frequency band radio waves refer to radio waves with a frequency in the range of 1 GHz to 300 GHz, and include radio waves such as microwaves, centimeter waves (SHF: Super High Frequency), millimeter waves (EHF: Extremely High Frequency), etc. The frequency range of such high-frequency band radio waves is preferably in the range of 1 GHz to 100 GHz, more preferably in the range of 1 GHz to 80 GHz, and particularly preferably in the range of 1 GHz to 30 GHz.

[0034] (Polyarylethersulfone Resin Material for Electronic Devices and Devices) The PAES of the present invention not only has heat resistance, one of the properties of PAES, but also has excellent dielectric properties in the high-frequency band. Therefore, a resin material containing the polyarylethersulfone of the present invention is suitable as a polyarylethersulfone resin material (polyarylethersulfone resin material for electronic devices and devices) used in electronic devices and electronic devices (electronic devices and devices) used therein, and is particularly suitable as a polyarylethersulfone resin material (polyarylethersulfone resin material for high-frequency communication electronic devices and devices) used in electronic devices and devices used for high-speed communication using radio waves in the high-frequency band ranging from 1 GHz to 300 GHz. Furthermore, the PAES of the present invention has superior heat resistance compared to general-purpose PAES, such as polyphenylsulfone and polysulfone, and therefore can be suitably used as a material requiring heat resistance capable of withstanding high-temperature processes such as soldering. It can also be suitably used as a resin material exposed to temperatures around 200°C for long periods of time. The polyarylethersulfone resin material for electronic devices and devices containing the polyarylethersulfone of the present invention may be a resin material containing only the polyarylethersulfone of the present invention, depending on the properties required for the electronic device or device to be manufactured, or may be a resin material containing the polyarylethersulfone of the present invention and one or more additives selected from the group consisting of flame retardants, heat stabilizers, oxidation stabilizers, weather stabilizers, antistatic agents, lubricants, and plasticizers. As described above, the polyarylethersulfone resin material for electronic devices and devices of the present invention can be used to manufacture molded products such as films, sheets, tapes, containers, threads, lenses, tubes, pellets, and chips by applying a conventional molding or processing method for thermoplastic resins (e.g., melt molding methods such as injection molding, extrusion molding, and compression molding) or a conventional molding or processing method for curable resins (e.g., compression molding and transfer molding). These can then be used as a resin material for electronic devices and devices to manufacture electronic devices and devices.

[0035] (Electronic Devices and Devices) In the present invention, electronic devices and electronic devices used therein are collectively referred to as electronic devices and devices. In particular, electronic devices and devices used for high-speed communication using radio waves in a high-frequency band ranging from 1 GHz to 300 GHz are collectively referred to as electronic devices and devices for high-frequency communication in the range of from 1 GHz to 300 GHz. The polyarylethersulfone resin material for electronic devices and devices of the present invention has heat resistance, one of the properties of PAES, and also has excellent dielectric properties in the high-frequency band. Therefore, electronic devices and devices using this material are preferred, especially electronic devices and devices for high-frequency communication in the range of from 1 GHz to 300 GHz. Specific examples of the electronic devices include mobile phones, smartphones, personal computers, mobile routers, data center communication equipment, base stations, radar, robots, drones, wearable computers, measurement and measuring instruments used in various industries such as automobiles, aircraft, industry, agriculture, logistics, and civil engineering, high-speed wireless communication equipment, electronic organizers, digital still cameras, video cameras, electronic paper, televisions, players, various audio equipment, in-vehicle displays such as car navigation systems and instrument panels, calculators, printers, scanners, copiers, refrigerators, and washing machines. Among these, electronic devices in the high-speed communication field that require high-frequency compatibility include mobile phones, smartphones, personal computers, mobile routers, data center communication equipment, base stations, radar, robots, drones, and wearable computers, as well as measurement and measuring instruments and communication devices used in various industries such as automobiles, aircraft, industry, agriculture, logistics, and civil engineering. Specific examples of the electronic devices include semiconductors, electronic displays, and electrical and electronic components. Examples of the electrical and electronic components include capacitors, printed circuits, connectors, various sensors, inductors, switches, and housings. These are also used in electronic devices that use high-speed communications using radio waves in the high-frequency band.More specifically, the polyarylethersulfone resin material according to the present invention can be suitably used for, for example, exterior components, structural components, circuit boards, semiconductor encapsulants, or antenna element components of these electronic devices and devices (preferably, electronic devices and devices for high-frequency communication in the range of 1 GHz to 300 GHz). Among these, the polyarylethersulfone resin material can be suitably used for circuit boards, semiconductor encapsulants, or antenna element components of electronic devices and devices, and can be particularly suitably used for circuit boards of electronic devices and devices.

[0036] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0037] The analytical methods used in the present invention are as follows. <Analytical Methods> 1. Measurement of Glass Transition Temperature (Tg) The glass transition temperatures of the PAES obtained in the Examples, Comparative Examples, and Reference Examples were measured using the following apparatus and conditions. Measuring apparatus: DMA850 (manufactured by TA Instruments) Heating rate: 4.0°C / min. Frequency: 1 Hz Atmosphere: Air Measurement mode: Tensile Test piece: 40 mm x 7 mm x thickness 0.02 to 0.05 mm Analysis method: The peak top of tan δ was taken as the glass transition point. 2. Measurement of Relative Dielectric Constant and Dielectric Loss Tangent The relative dielectric constant and dielectric loss tangent of the PAES obtained in the Examples, Comparative Examples, and Reference Examples were measured using the following apparatus and conditions. Measurement equipment: CP431 cavity resonator for 1 GHz (manufactured by Kanto Electronics Application Development Co., Ltd.), CP531 cavity resonator for 10 GHz (manufactured by Kanto Electronics Application Development Co., Ltd.), PNA network analyzer N5222B (manufactured by Keysight Technologies, Inc.), cylindrical cavity resonator (material: copper, internal mirror finish) Test piece: L 80-90 × W 1.4-1.6 × t 0.03-0.06 (mm) Measurement frequency: near 1 GHz, 10 GHz Measurement environment: room temperature (23±1°C / 50±5% RH) Measurement method: conforms to IEC62810 (cavity resonator perturbation method) 3. Measurement of molecular weight The molecular weight of PAES obtained in the examples, comparative examples, and reference examples was measured by dissolving PAES powder in a solvent, passing the solution through a membrane filter with a pore size of 0.45 μm, and subjecting the solution to gel permeation chromatography (GPC) using the following apparatus and conditions. Apparatus: Pump: LC-10ADvp (Shimadzu Corporation) Column: Shodex GPC KF-806L + KF-802 (Showa Denko K.K.) Detector: Shodex RI-71 (Showa Denko K.K.) Temperature: 50°C Mobile phase: N-methyl-2-pyrrolidone Flow rate: 0.8 mL / min. Injection volume: 100 μL Detection: Refractive index Standard substance: Polystyrene

[0038] Example 1 (Synthesis of PAES) In a 1 L four-neck flask equipped with a Dean-Stark tube filled with toluene and fitted with a Liebig condenser on top, a stirrer, and a nitrogen inlet tube, 26.52 g of 4,4'-dichlorodiphenyl sulfone and 24.48 g of 4,4'-dihydroxy-2,2',3,3',5,5'-hexamethylbiphenyl (3a) were charged as monomers, along with 13.01 g of dried potassium carbonate, 289.02 g of dimethylacetamide (DMAc), and 51.02 g of toluene, and the mixture was stirred and dissolved under a nitrogen atmosphere. The liquid was then heated to 160°C, and the polymerization reaction was carried out for 140 hours while distilling off water produced by the reaction outside the reaction system. After completion of the reaction, DMAc was added to the reaction solution to form an approximately 10 wt% solution, with the total weight of the monomers used being the weight of the solute, and the solution was then cooled to room temperature. The DMAc solution was mixed with approximately 10 times the amount of pure water relative to the DMAc solution to precipitate a polymer. The precipitate was separated by filtration, and then mixed with methanol and separated by filtration again to obtain PAES powder. The obtained PAES has a repeating unit represented by chemical formula (1a). (Forming into PAES film) The obtained PAES powder was dissolved in DMAc to prepare a solution, which was then cast onto a glass substrate and air-dried for 10 minutes, followed by drying at 80°C for 1 hour, 120°C for 1 hour, 160°C for 1 hour, 200°C for 1 hour, and then at 300°C for 0.5 hours under reduced pressure using a vacuum pump to obtain a PAES film.

[0039] Comparative Example 1 (Synthesis of PAES) A 500 mL four-neck flask equipped with a Dean-Stark tube filled with toluene and fitted with a Liebig condenser at the top, a stirrer, and a nitrogen inlet tube was charged with 9.91 g of 4,4'-biphenol as a monomer, 7.80 g of dried potassium carbonate, 144.56 g of dimethylacetamide (DMAc), and 25.54 g of toluene, and these were dissolved at room temperature while flowing nitrogen. Next, the solution was heated to 150°C under a nitrogen atmosphere, and the water in the solution was azeotropically dehydrated overnight while refluxing the toluene. Next, the liquid temperature was cooled to 100°C or below under a nitrogen atmosphere, and 15.59 g of 4,4'-dichlorodiphenyl sulfone as a monomer was added and dissolved. Next, the liquid temperature was heated to 160°C, and a polymerization reaction was carried out for 120 hours while distilling off the water produced by the reaction outside the reaction system. After the reaction was completed, DMAc was added to the reaction solution to form an approximately 10 wt% solution, with the total weight of the monomers used being the weight of the solute, and the solution was then cooled to room temperature. The DMAc solution was mixed with approximately 10 times the amount of pure water relative to the DMAc solution to precipitate a polymer. The precipitate was filtered, then mixed with methanol and filtered again to obtain PAES powder. The resulting PAES had a repeating unit represented by the following formula: (Forming into PAES film) The PAES powder obtained by the synthesis of PAES above was formed into a film in the same manner as in the formation into a PAES film in Example 1, except that the final drying conditions (0.5 hours at 300°C under reduced pressure using a vacuum pump) were changed to 1 hour at 250°C under normal pressure.

[0040] Reference Example 1 (Synthesis of PAES) In a 500 mL four-neck flask equipped with a Dean-Stark tube filled with toluene and fitted with a Liebig condenser on top, a stirrer, and a nitrogen inlet tube, 13.59 g of 4,4'-dichlorodiphenyl sulfone and 11.90 g of bis(4-hydroxy-3,5-dimethylphenyl)methane as monomers, 6.67 g of dried potassium carbonate, 144.51 g of DMAc, and 25.52 g of toluene were charged and stirred under a nitrogen atmosphere to dissolve. The liquid was then heated to 160°C, and the polymerization reaction was carried out for 140 hours while distilling off the water produced by the reaction outside the reaction system. After completion of the reaction, DMAc was added to the reaction solution to give an approximately 10 wt% solution, with the total weight of the monomers used as the solute weight. The solution was then cooled to room temperature. The DMAc solution was mixed with approximately 10 times the amount of pure water relative to the DMAc solution to precipitate a polymer. The precipitate was filtered off, and then mixed with methanol and filtered again to obtain PAES powder. The obtained PAES has a repeating unit represented by the following formula: <Molding Method> (Molding into PAES Film) The PAES powder obtained by the synthesis of the above PAES was molded into a film in the same manner as in the molding into a PAES film in Example 1, except that the final drying conditions (0.5 hours at 300°C under reduced pressure using a vacuum pump) were changed to 1 hour at 240°C under normal pressure.

[0041] Reference Example 2 (Synthesis of PAES) In a 1 L four-neck flask equipped with a Dean-Stark tube filled with toluene and fitted with a Liebig condenser on top, a stirrer, and a nitrogen inlet tube, 27.20 g of 4,4'-dichlorodiphenyl sulfone as monomers, 23.80 g of bis(4-hydroxy-2,5-dimethylphenyl)methane, 13.35 g of dried potassium carbonate, 289.02 g of DMAc, and 51.10 g of toluene were charged and dissolved by stirring. The solution was then heated to 160°C under a nitrogen atmosphere, and the polymerization reaction was carried out for 120 hours while distilling off the water produced by the reaction outside the reaction system. After completion of the reaction, DMAc was added to the reaction solution to give an approximately 10 wt% solution, with the total weight of the monomers used as the solute weight. The solution was then cooled to room temperature. The DMAc solution was mixed with approximately 10 times the amount of pure water relative to the DMAc solution to precipitate a polymer. The precipitate was filtered off, then mixed with methanol and filtered again to obtain PAES powder. Furthermore, for washing, the filtered powder was dissolved in DMAc and then mixed with 1 wt % aqueous hydrochloric acid to precipitate the polymer, followed by filtration. Furthermore, to remove the hydrochloric acid, the filtered powder was poured into pure water and filtered to obtain washed PAES powder. The obtained PAES has a repeating unit represented by the following formula: (Forming into PAES film) The obtained PAES powder was dissolved in DMAc to prepare a solution, which was then cast onto a glass substrate and air-dried for 10 minutes. Thereafter, the solution was dried at 80°C for 1 hour, then at 120°C for 1 hour, 160°C for 1 hour, 200°C for 1 hour, and 240°C for 1 hour under reduced pressure using a vacuum pump to obtain a PAES film.

[0042] Reference Example 3 (Synthesis of PAES) In a 1 L four-neck flask equipped with a Dean-Stark tube filled with toluene and fitted with a Liebig condenser on top, a stirrer, and a nitrogen inlet tube, 30.29 g of 4,4'-dichlorodiphenyl sulfone as monomers, 20.71 g of bis(4-hydroxyphenyl)methane, 14.87 g of dried potassium carbonate, 289.06 g of dimethylacetamide (DMAc), and 51.01 g of toluene were charged and dissolved by stirring. The solution was then heated to 160°C under a nitrogen atmosphere, and the polymerization reaction was carried out for 26 hours while distilling off the water produced by the reaction outside the reaction system. After completion of the reaction, DMAc was added to the reaction solution so that the total weight of the monomers used was approximately 10 wt% as the weight of the solute, and the solution was then cooled to room temperature. The DMAc solution was poured into pure water in an amount approximately 10 times the amount of the DMAc solution, and the polymer was precipitated and filtered. The filtered material was then poured into methanol and filtered. For further washing, the filtered powder was dissolved in DMAc and then mixed with 1% by weight of aqueous hydrochloric acid to precipitate the polymer, followed by filtration. For further removal of hydrochloric acid, the filtered material was poured into pure water and filtered to obtain a washed PAES powder. The resulting PAES has a repeating unit represented by the following formula: (Forming method) The obtained PAES powder was dissolved in DMAc to prepare a solution, which was then cast onto a glass substrate and air-dried for 10 minutes, followed by drying at 80°C for 1 hour, then at 120°C for 1 hour, 160°C for 1 hour, 200°C for 1 hour, and 240°C for 1 hour under reduced pressure using a vacuum pump to obtain a PAES film.

[0043] The PAES obtained in the Examples, Comparative Examples, and Reference Examples were measured for molecular weight (weight average molecular weight: Mw and number average molecular weight: Mn), dispersity (Mw / Mn), glass transition temperature, relative dielectric constant, and dielectric loss tangent by the above-mentioned analytical methods. ０．５ The dielectric properties were evaluated based on the value of the dielectric loss tangent × (relative dielectric constant) in the present invention. ０．５ The value of × (dielectric loss tangent) is the dielectric loss of an electrical signal, which is calculated as (proportionality constant) × (frequency) × (relative permittivity) ０．５The results are shown in Table 1.

[0044]

[0045] The PAES obtained in Comparative Example 1 is a PAES having the same repeating unit as a resin generally referred to as polyphenylsulfone (PPSU). On the other hand, the PAES obtained in Example 1, which is a specific example of the present invention, is a PAES obtained using a compound (compound (3a)) having three methyl groups in one phenol moiety as the biphenol monomer. The PAES obtained in Example 1 had a lower relative permittivity and dielectric dissipation factor, and a significantly smaller value for the loss of electrical signals, compared with the PAES obtained in Comparative Example 1. This demonstrates that the PAES according to the present invention has excellent dielectric properties in the high-frequency band and can be suitably used as a PAES resin material for electronic devices and devices, particularly for high-frequency communication electronic devices and devices in the range of 1 GHz to 300 GHz.

[0046] Among the monomers used in the synthesis of PAES, instead of compound (3a), bis(4-hydroxyphenyl)methane was used in Reference Example 3, and bis(4-hydroxy-3,5-dimethylphenyl)methane and bis(4-hydroxy-2,5-dimethylphenyl)methane, each having two methyl groups at one phenol moiety, were used to synthesize PAES in Reference Example 3. Comparing the PAES obtained from the monomer having no methyl group at the phenol moiety in Reference Example 3 with the PAES obtained from the monomer having two methyl groups at the phenol moiety in Reference Examples 1 and 2, the present inventors have found that the PAES obtained from the monomer having two methyl groups has better dielectric properties. From this, it is presumed that a PAES according to the present invention using a compound having two methyl groups in one phenol moiety (for example, 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl (3b) or 4,4'-dihydroxy-2,2',5,5'-tetramethylbiphenyl (3c)) as the biphenol compound used as the monomer has superior dielectric properties to the PAES obtained in Comparative Example 1, and is suitable as a PAES resin material for electronic devices and devices, particularly as a polyarylethersulfone resin material for high-frequency communication electronic devices and devices in the range of 1 GHz to 300 GHz.

Claims

1. A polyarylethersulfone resin material for electronic devices, comprising polyarylethersulfone having a glass transition temperature of 200°C or higher, a weight average molecular weight (Mw) in the range of 2,000 to 1,000,000, and a repeating unit represented by general formula (1). (In the formula, R １ and R ２ are each independently a hydrogen atom or a methyl group, and R １ and R ２ At least one of the groups represents a methyl group, and m represents 0 or 1.

2. The polyarylethersulfone resin material for electronic devices and devices according to claim 1, wherein the repeating unit represented by general formula (1) is at least one selected from the repeating units represented by chemical formulas (1a) to (1c).

3. The polyarylethersulfone resin material for electronic devices and devices according to claim 1, wherein the polyarylethersulfone further has a dielectric loss tangent measured at a frequency of 1 GHz of 0.005 or less and a relative dielectric constant measured at a frequency of 1 GHz of 3.5 or less.

4. The polyarylethersulfone resin material for electronic devices and devices according to claim 1, wherein the electronic devices and devices are electronic devices and devices for high-frequency communication in the range of 1 GHz to 300 GHz.

5. Electronic devices and devices using the polyarylethersulfone resin material for electronic devices and devices described in claim 1.

6. A circuit board, semiconductor sealing material or antenna element member for an electronic device or device, which uses the polyarylethersulfone resin material for electronic devices or devices described in claim 1.

7. Electronic equipment and devices for high frequency communication in the range of 1 GHz to 300 GHz, which use the polyarylethersulfone resin material for electronic equipment and devices according to claim 1.

8. A method for using polyarylethersulfone having a repeating unit represented by general formula (1), which has a glass transition temperature of 200°C or higher and a weight average molecular weight (Mw) in the range of 2,000 to 1,000,000, in an electronic device or device. (In the formula, R １ and R ２ are each independently a hydrogen atom or a methyl group, and R １ and R ２ At least one of the groups represents a methyl group, and m represents 0 or 1.

9. A method for using the polyarylethersulfone according to claim 8 in an electronic device or apparatus, wherein the repeating unit represented by general formula (1) is at least one selected from the repeating units represented by chemical formulas (1a) to (1c).

10. A method for using the polyarylethersulfone according to claim 8 in an electronic device or apparatus, wherein the polyarylethersulfone further has a dielectric loss tangent measured at a frequency of 1 GHz of 0.005 or less and a relative dielectric constant measured at a frequency of 1 GHz of 3.5 or less.

11. A method for using the polyarylethersulfone according to claim 8 in an electronic device or device, wherein the electronic device or device is an electronic device or device for high-frequency communication in the range of 1 GHz or more and 300 GHz or less.

12. A method for using the polyarylethersulfone according to claim 8 in an electronic device or device, wherein the polyarylethersulfone is used in a circuit board, a semiconductor encapsulant, or an antenna element member of the electronic device or device.

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