Heat sink for application- specific integrated circuits transducers

Abstract

A medical device can include a transducer assembly configured to capture ultrasound images during a medical procedure. The device can include a thermal management system designed to dissipate heat generated by the transducer assembly. The thermal management system can include a thermal paste disposed within the transducer assembly and a heat sink that can at least partially surround the transducer assembly to draw heat away from it. Additionally, a thermally conductive outer surface can be thermally coupled to the heat sink, allowing the heat sink to transfer heat to the outer surface to dissipate heat from the transducer assembly.

Description

HEAT SINK FOR APPLICATION- SPECIFIC INTEGRATED CIRCUITS TRANSDUCERSCLAIM OF PRIORITY

[0001] This patent application claims the benefit of priority, under 35 U.S.C. Section 119(e), to Anthony Florindi U.S. Patent Application Serial Number 63 / 632,440, entitled “HEAT SINK FOR ULTRASOUND TRANSDUCERS UTILIZING APPLICATION-SPECIFIC INTEGRATED CIRCUITS,” filed on April 10, 2024 (Attorney Docket No. 5409.850PRV) and to Anthony Florindi U.S. Patent Application Serial Number 63 / 738,885, entitled “HEAT SINK FOR ULTRASOUND TRANSDUCERS UTILIZING APPLICATION-SPECIFIC INTEGRATED CIRCUITS,” filed on December 26, 2024 (Attorney Docket No. 5409.850PV2), each of which is hereby incorporated by reference herein in its entirety.TECHNICAL FIELD

[0002] Examples described herein generally relate to ultrasound transducers and, more specifically, to a heat sink for an ultrasound transducer utilizing applicationspecific integrated circuits.BACKGROUND

[0003] Ultrasound transducers are used for medical diagnostic imaging. With increasing miniaturization of devices, ultrasound transducers may utilize one or more application-specific integrated circuits (ASICs) for multiplexing of transducer elements to limit the physical volume of connections (e.g., to decrease the number of wires) within the given device size. In such an ultrasound transducer, the ASICs are the primary sources of heat generation. When used in vivo (e.g., for endobronchial ultrasound), the heat must be dissipated efficiently so that the heat that is generated during operation of the device does not excessively build up beyond temperatures that are acceptable for tissue contact.SUMMARY

[0004] In examples, a medical device can include a transducer assembly configured to capture ultrasound images during a medical procedure. The device can include a thermal management system designed to dissipate heat generated by the transducer assembly. The thermal management system can include a thermal paste disposed within the transducer assembly and a heat sink that can at least partiallysurround the transducer assembly to draw heat away from it. Additionally, a thermally conductive outer surface can be thermally coupled to the heat sink, allowing the heat sink to transfer heat to the outer surface to dissipate heat from the transducer assembly.

[0005] In examples, the medical device can be configured for delivery into a patient anatomy via an endoscope including a lumen. The medical device can be configured to be inserted through the lumen and out a distal end of the endoscope. The medical device can include a transducer assembly that can capture ultrasound images during a medical procedure. The medical device can also include a thermal management system designed to dissipate heat generated by the transducer assembly. The thermal management system can include a thermal paste disposed within the transducer assembly and a heat sink that can at least partially surround the transducer assembly to draw heat away from the transducer. A thermally conductive outer surface can be thermally coupled to the heat sink, allowing the heat sink to transfer heat to the outer surface to dissipate heat from the transducer assembly.

[0006] In examples, a method for managing a temperature of a medical device can include detecting a temperature of the medical device using a thermal sensor disposed adjacent to a transducer assembly. The method can also include generating a temperature signal indicative of the detected temperature. Monitoring the temperature signal with a controller including processing circuitry. The method can also include adjusting one or more operations of the medical device based on the temperature signal being above or below a threshold.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Various examples are illustrated in the figures of the accompanying drawings. Such examples are demonstrative and not intended to be exhaustive or exclusive examples of the present subject matter.

[0008] FIG. l is a schematic diagram of an example of a medical device system.

[0009] FIG. 2 is a schematic diagram of an example of an imaging and control system of a medical device system.

[0010] FIG. 3 is a perspective view of a portion of an example of a medical device.

[0011] FIG. 4 is a schematic diagram of an example of a thermal management system for use with an example of a medical device.

[0012] FIG. 5 is a perspective view of a portion of a medical device.

[0013] FIG. 6 is a partially cutaway perspective view of an example of a medical device.

[0014] FIG. 7 is a cutaway side view of an example of a medical device.

[0015] FIG. 8 is a cross-sectional front view of an example of a medical device.

[0016] FIG. 9 is a partially cutaway perspective view of an example of a medical device.

[0017] FIG. 10 is a cutaway side view of an example of a medical device.

[0018] FIG. 11 is a cross-sectional front view of an example of a medical device.

[0019] FIG. 12 is an example of a method for monitoring a temperature within an example of a medical device.

[0020] FIG. 13 is a block diagram of an example machine upon which any techniques or methodologies discussed herein can be performed.DETAILED DESCRIPTION

[0021] Existing ultrasound transducers, for example, on endobronchial ultrasonic (EBUS) scopes, do not utilize multiplexing application-specific integrated circuits (ASICs) and, therefore, do not face the same thermal challenges as an ultrasound transducer with ASICs. The present disclosure relates to thermal management for a device that includes an ultrasound transducer with one or more ASICs. An example ultrasonic transducer with thermal management for an ultrasonic imaging device with one or more ASICs can utilize a conductive metal component that functions as a heat sink located beneath the multiplexer ASICs of the ultrasound transducer.

[0022] The heat sink can be bonded to the transducer via a thermal paste or epoxy. The heat sink can also contact the outermost component of the device. The heat sink can be configured to conduct heat from the ASICs to the outermost component (e.g., an exterior surface) of the device to dissipate the heat generated from the transducer. The outer surface of the device, also a conductive metal and having a larger surface area than the heat-generating ASICs, can dissipate the heat. The heat dissipation prevents the ASICs and surrounding components of the ultrasonic imagingdevice from retaining heat, which can prevent damage to the internal components of the ultrasonic imaging device. The combination of the heat sink, thermal paste / epoxy, and device outer surface can work in concert to dissipate the temperature increase to the surrounding tissue as compared to an ultrasonic imaging device that does not have the heat sink, thermal paste / epoxy, and an outer surface that is thermally conductive.

[0023] The above discussion is intended to provide an overview of the subject matter of the present patent application. It is not intended to provide an exclusive or exhaustive explanation of the invention. The description below is included to provide further information about the present patent application.

[0024] FIG. 1 is a schematic diagram of an endoscopy system 100 that can include a control system 102 and an endobronchial ultrasound sampling arrangement including an endoscope 104 and a medical device 108 that is attachable to the endoscope 104 and which includes a distal end 110 that extends from the distal end of the endoscope 104 via a distal working channel port (e.g., working channel port 112). The system of FIG. 1 is an illustrative example of an endoscopy system suitable for use with the systems, devices, and methods described herein.

[0025] The endoscope 104 can be insertable into an anatomical region for imaging or attachment to (e.g., via tethering) one or more sampling devices for biopsies or therapeutic devices for treating a disease state associated with the anatomical region. The endoscope 104 can interface or connect to the control system 102. The endoscope 104 is described in the present example as a bronchoscope, though other types of endoscopes are contemplated for use with the features and teachings of the present disclosure. The control system 102 can include a control unit 114, a display unit 116, an input unit 118, a light source 120, a fluid source 122, and a suction pump 124.

[0026] The control system 102 can include various ports for coupling with the endoscopy system 100. For example, the control unit 114 can include a data input / output port for receiving data from and communicating data to the endoscope 104. The light source 120 can include an output port for transmitting light to the endoscope 104, such as via a fiber optic link. The fluid source 122 can include a port for transmitting fluid to the endoscope 104. The fluid source 122 can include, for example, a pump and a fluid tank or can be connected to an external tank, vessel, or storage unit. The suction pump 124 can include a port to draw a vacuum from the endoscope 104 to generate suction, such as for withdrawing fluid from the anatomicalregion into which the endoscope 104 is inserted. The display unit 116 and the input unit 118 can be used by an operator of the endoscopy system 100 to control functions of the endoscopy system 100 and view the output of the endoscope 104. The control unit 114 can also generate signals or other outputs from treating the anatomical region into which the endoscope 104 is inserted. In examples, the control unit 114 can generate electrical output, acoustic output, fluid output, or the like for treating the anatomical region with, for example, cauterizing, cutting, freezing, or the like.

[0027] The endoscope 104 can include an insertion section 126, a functional section 128, and a handle section 130, which can be coupled to a cable section 132 and a coupler section 134. The insertion section 126 can extend distally from the handle section 130, and the cable section 132 can extend proximally from the handle section 130. The insertion section 126 can be elongated and include a bending section and a distal end to which the functional section 128 can be attached. The bending section can be controllable (e.g., by a steering control 136 on the handle section 130) to maneuver the distal end through tortuous anatomical passageways (e.g., stomach, duodenum, kidney, ureter, trachea, lungs, or the like). The insertion section 126 can also include one or more working channels (e.g., an internal lumen) that can be elongated and can support the insertion of one or more therapeutic tools of the functional section 128, such as a bronchoscope. The working channel can extend between the handle section 130 and the functional section 128. Additional functionalities, such as fluid passages, guide wires, and pull wires, can also be provided by the insertion section 126 (e.g., via suction or irrigation passageways, or the like).

[0028] A coupler section 134 can be connected to the control unit 114 to connect to the endoscope 104 to multiple features of the control unit 114, such as the input unit 118, the light source 120, the fluid source 122, and the suction pump 124.

[0029] The handle section 130 can include the steering control 136 as well as a cable attachment portion 138, which may include a stress relief boot to shield the endoscope cable from mechanical stress (e.g., bending and / or twisting).. The steering control 136 can be a knob, lever, or other actuation mechanism or the like, which can be used to navigate the endoscope 104 within the patient. The steering control 136 can be connected to a pull wire or other actuation mechanisms, extending through the insertion section 126. The port 140 can be configured to couple various electrical cables, guide wires, auxiliary scopes, tissue collection devices, fluid tubes, and the like to the handle section 130, such as for coupling with the insertion section 126.

[0030] According to examples, the control system 102 can be provided on a mobile platform (e.g., a cart 142) with shelves for housing the light source 120, the suction pump 124, an image processing unit 202 (FIG. 2), or the like. Alternatively, components of the control system 102, shown in FIG. 1 and FIG. 2, can be provided directly on the endoscope 104 to make the endoscope “self-contained.”

[0031] The functional section 128 can include components for treating and diagnosing the anatomy of a patient. The functional section 128 can include an imaging device 144 (e.g., a complementary metal oxide semiconductor (CMOS) based, Chip-on-the-Tip image sensors), an illumination device 146 (e.g., a light emitting diode), and the working channel port 112 at a distal face of the functional section 128.

[0032] As shown in FIG. 1, a medical device 108 can extend from the working channel port 112 at the distal face of the functional section 128 of the endoscope 104. The medical device 108 can be configured to be attached to the port 140 such that the medical device 108 extends through a working channel (e.g., the extending through the insertion section 126 to the working channel port 112) of the endoscope 104 and out the distal end of the endoscope 104. The medical device 108 can include a sheath extension mechanism 148 for advancing or retracting the insertion section 126 within the working channel so as to control how far distally from the working channel port 112 the distal end of the medical device 108 extends, an instrument actuator 150 (e.g., for actuating a biopsy needle from a side exit port of the medical device 108), and a distal end 110. The instrument actuator 150 can be configured to extend the medical device 108 beyond a distal end of the endoscope 104, such as to navigate the medical device 108 to the target area within the patient. The instrument actuator 150 can slide along a housing 152 of the medical device 108. The housing 152 can include indicia, which can indicate an amount of extension of the medical device 108 beyond a distal end of the endoscope 104 (e.g., beyond the working channel port 112). The instrument actuator 150 can be configured to extend an instrument from the medical device 108 to obtain a tissue sample from the patient. A distal end 110 of the medical device 108 can include a transducer (or other imaging device) and a side exit port located proximal from the transducer for directing an instrument configured to obtain a tissue sample from the patient into the field of view of the transducer. The medical device 108 will be discussed in more detail herein.

[0033] The medical device 108 can include a transducer 154 to capture images (e.g., ultrasonic images) around the medical device 108. The transducer 154 caninclude a Piezoelectric micro-machined ultrasonic transducer (PMUT), a capacitive micro-machined ultrasonic transducer (CMUT), a bulk Piezoelectric transducer, a Polyvinylidene Fluoride (PVDF) transducer, an aluminum nitride (AIN) transducer, any combination thereof, or the like. The transducer 154 can include an applicationspecific integrated circuit 602 (FIG. 6). Application-specific integrated circuits can help reduce the number (and overall diameter) of wires running through the medical device 108 to the transducer 154, which can help maintain the small diameter of the distal end 110 of the medical device 108. However, application-specific integrated circuits can generate heat, which can collect in the distal end 110 of the medical device 108. To help dissipate heat generated by the transducer 154 (and the applicationspecific integrated circuits), the medical device 108 can include a thermal management system 156. The thermal management system 156 can reduce or minimize heat within the medical device 108 and prevent heat collection within the distal end 110 of the medical device 108.

[0034] As also shown in FIG. 1, the medical device 108 can include an instrument 158 configured to be extended and retracted from the distal end 110 of the medical device 108 via the instrument actuator 150. The instrument 158 can include a sampling needle, a scalpel, a forceps, an ablation device or probe, a snare, a balloon dilator, a cryotherapy probe, or the like. As shown in FIG. 1, the medical device 108 can be configured to direct the instrument 158 adjacent to the transducer 154 such that the instrument 158 extends into a field of view of the transducer 154. As such, the thermal management system 156 can be disposed below the transducer 154 at a distal portion of the medical device 108 where the instrument 158 is extended into a field of view of the transducer 154.

[0035] FIG. 2 is a schematic diagram of the endoscopy system 100 of FIG. 1 including the control system 102 and the endobronchial ultrasound arrangement, which includes an endoscope 104 and a medical device 108 extendable via a distal working channel port of the endoscope 104. FIG. 2 schematically illustrates components of the control system 102 coupled to the endoscope 104. The control system 102 can include the control unit 114, which can include or be coupled to an image processing unit 202, a treatment generator 204, and a drive unit 206, as well as the light source 120, the input unit 118, and the display unit 116. The control unit 114 can include, or can be in communication with, an endoscope, a surgical instrument, and an endoscopy system, which can include a device configured to engage tissue and collect and store a portionof that tissue and through which imaging equipment (e.g., a camera) can view target tissue via the inclusion of optically enhanced materials and components. The control unit 114 can be configured to activate a camera to view patient anatomy such as lumens and / or target tissues that are distal of the endoscopy system. Likewise, the control unit 114 can be configured to activate the light source 120 to illuminate the region being imaged via the camera.

[0036] The coupler section 134 can be connected to the control unit 114 to connect to the endoscope 104 to multiple features of the control unit 114, such as the image processing unit 202, the treatment generator 204, or the like. In examples, the port 140 can be used to insert another instrument or device into a patient through the endoscope 104, such as a daughter scope or auxiliary scope, or a sampling needle, biopsy needle, ablation instrument, scalpel, or the like, into the endoscope 104. Such instruments and devices can be independently connected to the control unit 114 via the cable section 132.

[0037] The image processing unit 202, the ultrasound image processing unit 208, and the light source 120 can each interface with the endoscope 104 (e.g., at the functional section 128) or the medical device 108 by wired or wireless electrical connections. The control system 102 can accordingly illuminate an anatomical region, collect signals representing the anatomical region, process signals representing the anatomical region, and display images representing the anatomical region on the display unit 116. The ultrasound image processing unit 208 can be configured to receive ultrasonic signals from either of the endoscope 104 or the medical device 108, which can be converted into ultrasonic images and transmitted to the display unit 116 or any other component of the endoscopy system 100. The control system 102 can include the light source 120 to illuminate the anatomical region using light of a desired spectrum (e.g., broadband white light, narrow-band imaging using electromagnetic wavelengths, and the like). The control system 102 can connect (e.g., via an endoscope connector) to the endoscope 104 for signal transmission (e.g., light output from the light source, video signals from the imaging system in the distal end, diagnostic and sensor signals from a diagnostic device, and the like).

[0038] The fluid source 122 (shown in FIG. 1) can be in communication with the control unit 114 and can include one or more sources of air, saline, or other fluids, as well as associated fluid pathways (e.g., air channels, irrigation channels, suction channels, and the like) and connectors (barb fittings, fluid seals, valves, and the like).The control system 102 can also include a drive unit 206, which can include a motorized drive for advancing a distal section of endoscope 104.

[0039] FIG. 3 illustrates a distal portion of an example medical device 108. The medical device 108 can extend into a patient and form a distal-most end of the endoscopy system 100 (FIG. 1) when inserted through an insertion section 126 of an endoscope 104. As discussed herein, the medical device 108 can be configured to be directly inserted into a patient (e.g., inserted without the use of an endoscope 104). The distal end 110 of the medical device 108 can include a transducer 154. The medical device 108 can extend an instrument 158 into a field of view of a transducer 154 to enable “real-time” sampling. As such, the instrument 158 and the biopsy target can both be visualized via the ultrasound image in real time as the biopsy is being obtained. As partially shown in FIG. 3, a ramp can be included in the medical device 108 to guide the instrument 158 out the side of the medical device 108 and into the field of view of the transducer 154.

[0040] In examples, such as the example shown in FIG. 6 - FIG. 11, the transducer 154 can be connected to one or more application-specific integrated circuits (e.g., application-specific integrated circuit 602 (first shown in FIG. 6). As discussed herein, the application-specific integrated circuit 602 can generate heat during the use of the transducer 154, and the medical device 108 can include a thermal management system 156 to help manage and dissipate the heat generated by the application-specific integrated circuits 602 and other components of the medical device 108 or the transducer 154. The thermal management system 156 (first shown in FIG. 1) will be discussed in more detail in relation to FIG. 4 - FIG. 11.

[0041] FIG. 4 is a schematic diagram of an example of a thermal management system 156 for use with a medical device 108 (FIG. 1) or an endoscopy system 100 (FIG. 1). In examples, the medical device 108 may include a transducer assembly having a transducer (e.g., a pMUT) electrically connected to one or more application specific integrated circuits (ASICs) (e.g., application-specific integrated circuit 602, see FIG. 6), and each of the transducer and ASICs may generate heat during operation. The thermal management system 156 can utilize a thermally conductive material to provide a heat sink and draw heat away from components of the transducer assembly such as the pMUT and the ASICs. The heat sink and the ultrasound transducer assembly (e.g., the transducer 154, see FIG. 3) can be bonded together via a thermal paste or epoxy. The thermal management system 156 can also include an outer surfaceof the device (e.g., the medical device 108) that is thermally conductive such as to dissipate heat from the medical device 108 as it is drawn away from the ASICs and to the outer surface of the device. As such, the thermal management system 156 can include a thermal epoxy or thermal paste 402, a heat sink 404, and a thermally conductive outer surface 406.

[0042] The thermal epoxy or thermal paste 402 can be configured to hold the ultrasound transducer within the medical device 108 and encourage heat transfer from the ASICs below the transducer toward the heat sink 404. The thermal epoxy or thermal paste 402 can also be configured to fill small gaps (e.g., air gaps on a micro scale) between the ASICs (e.g., the application-specific integrated circuit 602, see FIG. 6), the transducer (e.g., the transducer 154, see FIG. 3), and other components of the medical device 108 to encourage heat transfer through the thermal epoxy or thermal paste 402 and away from the ASICs and other heat-generating components of the medical device 108.

[0043] In examples, the thermal epoxy or thermal paste 402 can be made from a paste or epoxy including high thermal conductivity. For example, thermal pastes (e.g., thermal grease, thermal interface material, thermal compound, thermal gel, or heat sink compound) can be thermally conductive substances applied between the transducer, the ASICs, and the heat sink 404 to improve heat transfer from the ASICs and the transducer to the heat sink 404. Examples of thermal paste versions of the thermal epoxy or thermal paste 402 can include metal -based and liquid-metal -based pastes, ceramic-based pastes, carbon-based pastes, diamond-carbon-based pastes, silicone-based pastes, or the like.

[0044] Thermal epoxies (e.g., thermoset adhesives) can be curable, two-part (or more) systems used to couple the transducer and ASICs to the heat sink 404 while providing thermal conductivity to draw heat away from the transducer and the ASICs and toward the heat sink 404 and the thermally conductive outer surface 406. Thermal epoxies can be more permanent than thermal pastes, so they can be used when the heat sink will not need to be separated from the transducer or the ASICs, such as for a single-use medical device. Thermal epoxy examples of the thermal epoxy or thermal paste 402 can include general purpose epoxies or high-temperature epoxies. For example, the thermal epoxy or thermal paste 402 can include a glass transition temperature above eight degrees Celsius. The thermal epoxy (or paste) can include a glass transition temperature between fifty and one hundred degrees Celsius. Thethermal epoxy or thermal paste 402 can include a service temperature range between - 50 degrees Celsius and 205 degrees Celsius. The thermal epoxy or thermal paste 402 can include a service temperature range between -60 degrees Celsius and 250 degrees Celsius. The thermal epoxy or thermal paste 402 can include an operating temperature of less than 300 degrees Celsius. The thermal epoxy or thermal paste 402 can include an operating temperature of less than 350 degrees Celsius.

[0045] The heat sink 404 can be installed within the medical device 108 below the multiplexer ASICs of the ultrasound transducer. The heat sink 404 can be thermally connected to the ultrasound transducer and the ASICs via the thermal epoxy or thermal paste 402. The heat sink 404 can include aluminum, copper, silver, gold, ceramics, diamonds, stainless steel, steel, composite materials, alloys or combinations thereof, or the like. In examples, the heat sink 404 can extend between the ASICs of the ultrasound transducer and the thermally conductive outer surface 406 such as to be configured to draw heat away from the ASICs and the ultrasound transducer and toward the thermally conductive outer surface 406.

[0046] The thermally conductive outer surface 406 can have a larger surface area than the ASICs and the ultrasound transducer. The larger surface area of the thermally conductive outer surface 406 relative to the ASICs and the ultrasound transducer can encourage heat transfer from the ASICs and the ultrasound transducer to the thermally conductive outer surface 406. As discussed herein, any space between the ASICs, the ultrasound transducer, the heat sink, and the thermally conductive outer surface can be filled with the thermal epoxy or thermal paste 402 to further facilitate heat transfer away from the ASICs and the ultrasound transducer. In examples, the thermally conductive outer surface 406 can include aluminum, copper, silver, gold, ceramics, diamonds, stainless steel, steel, composite materials, alloys or combinations thereof, or the like. As such, the thermal management system 156, including the thermal epoxy or thermal paste 402, the heat sink 404, and the thermally conductive outer surface 406, can be configured to dissipate the temperature increase to the surrounding tissue in comparison to less thermally conductive constructions of ultrasound devices using ASICs.

[0047] FIG. 5 is a portion of an example thermal management system 156 of an example medical device 108. As discussed herein, and shown in FIG. 5, the thermal management system 156 of the medical device 108 can include a thermal epoxy or thermal paste 402 and a heat sink 404.

[0048] FIG. 6 - FIG. 8 will be discussed together. FIG. 6 is a partially cutaway perspective view of an example medical device 108 including an example thermal management system 156. FIG. 7 is a cutaway side view of an example medical device 108 including an example thermal management system 156. FIG. 8 is a cross-sectional front view of an example medical device 108 including an example thermal management system 156.

[0049] The medical device 108 can include the transducer 154, one or more application-specific integrated circuits 602, one or more capacitors 604, the substrate 606, and the lens 608. The application-specific integrated circuit 602 can be installed between the substrate 606 and the transducer 154. The capacitors 604 can be installed between the application-specific integrated circuit 602 and the transducer 154. The substrate 606 can be foldable such that at least a portion of the substrate 606 wraps around the application-specific integrated circuit 602, the capacitors 604, and the transducer 154 such that the substrate 606 can at least partially surround the transducer 154. The lens 608 can fill the space between the transducer 154 and a periphery of the medical device 108.

[0050] The lens 608 can include a silicon material. For example, the lens 608 can include MS151 MED from Masterbond. In examples, the lens 608 can include a material with a nominal acoustic impedance about 1.4MRayl. The lens 608 can include a material with a nominal acoustic impedance between 1-2 MRayl. In examples, the lens 608 can include material with a thermal conductivity about 0.17 W / (m*K). In examples, the lens 608 can include a material with a thermal conductivity between 0.1 and 0.5 W / (m*K).

[0051] The thermal epoxy or thermal paste 402 can be used to fill in the area between the heat sink 404 and the substrate 606. The thermal epoxy or thermal paste 402 can also be used to fill the area between the application-specific integrated circuits 602 and the substrate 606 The heat sink 404 can also be used between the transducer 154 and the capacitors 604 and the application-specific integrated circuit 602. As such, the thermal epoxy or thermal paste 402 can be configured to secure the substrate 606 in the folded position and to draw heat away from the transducer 154, the applicationspecific integrated circuit 602, the capacitors 604, the substrate 606 and the lens 608. The thermal epoxy or thermal paste 402 and the heat sink 404 can be configured to draw heat away from the transducer 154, the application-specific integrated circuit 602, the capacitors 604, the substrate 606, and the lens 608 and toward the thermallyconductive outer surface 406. As the thermally conductive outer surface 406 has a relatively high thermal conductivity and a large surface area, the thermally conductive outer surface 406 can be configured to encourage heat transfer away from the transducer 154 and the application-specific integrated circuit 602. Moreover, because the thermally conductive outer surface 406 can include high thermal conductivity, as compared to the tissues of a patient, and the thermally conductive outer surface 406 can have a larger surface area, the heat from the thermally conductive outer surface 406 can be dissipated to the tissues of the patient, while only minimally heating the tissues of the patient. As such, heat can be dissipated from the medical device 108 without harm to the tissue of the patient.

[0052] The heat sink 404, the thermally conductive outer surface 406, and other thermally conductive components of the medical device 108 can include a thermal conductivity around 16.2 W / (m*K). In examples, the heat sink 404, the thermally conductive outer surface 406, and other thermal conductive components of the medical device 108 can include a thermal conductivity between 14 and 25 W / (m*K). In examples, the thermal conductivity of the heat sink 404, the thermally conductive outer surface 406, and other high thermal conductive components of the medical device 108 can have a thermal conductivity around 95 times greater than the thermal conductivity of the lens 608 with the MasterSil 151Med material. The thermal conductivity of the heat sink 404, the thermally conductive outer surface 406, and other high thermal conductive components of the medical device 108 can have a thermal conductivity around 70-120 times greater than the thermal conductivity of the lens 608 with the MasterSil 151Med material.

[0053] As shown in FIG. 7, the medical device 108 can include a side ramp 160 to direct the instrument 158 into a field of view of the transducer 154. As such, the medical device 108 can be used for “real-time” sampling of a patient where ultrasonic images can include the instrument 158 and a target tissue of the patient in real time during the sampling process.

[0054] FIG. 9 - FIG. 11 will be discussed together. FIG. 9 is a partially cutaway perspective view of an example of the medical device 108. FIG. 10 is a cutaway side view of an example of the medical device 108. FIG. 11 is a cross- sectional front view of an example of the medical device 108.

[0055] The medical device 108 can include a substrate 902 (e.g., a flat version of the substrate 606, see FIG. 6). With the substrate 902, the application-specificintegrated circuit 602 can be disposed between the heat sink 404 and the substrate 902. The heat sink 404 can be disposed between the thermally conductive outer surface 406 and the application-specific integrated circuit 602. The transducer 154 can be disposed opposite the application-specific integrated circuit 602 from the heat sink 404. The capacitors 604 can extend from the substrate 902 away from the transducer 154. The lens 608 can fill the space between the transducer 154 and the periphery of the medical device 108. The thermal epoxy or thermal paste 402 can be installed between the heat sink 404 and the application-specific integrated circuit 602, the application-specific integrated circuit 602 and the transducer 154, the transducer 154 and the lens 608, and the heat sink 404 and the thermally conductive outer surface 406.

[0056] The thermal epoxy or thermal paste 402 and the heat sink 404 can be configured to draw heat away from the transducer 154, the application-specific integrated circuit 602, the capacitors 604, the substrate 606, and the lens 608 and toward the thermally conductive outer surface 406. As the thermally conductive outer surface 406 has a relatively high thermal conductivity and a large surface area, the thermally conductive outer surface 406 can be configured to encourage heat transfer away from the transducer 154 and the application-specific integrated circuit 602. Moreover, because the thermally conductive outer surface 406 can include high thermal conductivity, as compared to the tissues of a patient, and the thermally conductive outer surface 406 can have a larger surface area, the heat from the thermally conductive outer surface 406 can be dissipated to the tissues of the patient, while only minimally heating the tissues of the patient. As such, heat can be dissipated from the medical device 108 without harm to the tissue of the patient.

[0057] As shown in FIG. 10, the medical device 108 can include a thermal sensor 1002. The thermal sensor 1002 can be configured to detect a temperature of the medical device 108. The thermal sensor 1002 can generate a temperature signal 1004 indicative of the detected temperature of the medical device 108 and transmit the temperature signal 1004 to control system 102 of the endoscopy system 100 (FIG. 1) or the medical device 108. Based on the temperature signal 1004, the control system 102 can alter the operation of the medical device 108. For example, the control system 102 can turn off the transducer 154 or decrease the power supplied to the transducer 154. The control system 102 can also generate an alert to indicate the temperature of the medical device 108 exceeded a temperature threshold.

[0058] As shown in FIG. 11, the heat sink 404 in the medical device 108 including the non-folded substrate 902 can have a larger overall area than the heat sink 404 with the foldable substrate 606. The heat sink 404 with the non-folded substrate 902 can include a larger area because the non-folded substrate 902 can take up less space within the distal end 110 of the medical device 108 than the foldable substrate 606. Thus, the heat sink 404 with the non-foldable substrate 902 can include steps or other profiles to better fill the space between the thermally conductive outer surface 406 and the substrate 902, the application-specific integrated circuit 602, and the capacitors 604.

[0059] FIG. 12 is an example of a method 1200 for monitoring a temperature within an example of the medical device 108. The method 1200 can detect and monitor the temperature of the distal end 110 of the medical device 108 to prevent overheating of the medical device 108. The method 1200 can optionally include one or more of operations 1210-1240.

[0060] At operation 1210, the method 1200 can optionally include detecting a temperature of the medical device 108. As discussed herein, the temperature of the medical device 108 can be detected by a using a thermal sensor (e.g., the thermal sensor 1002, FIG. 10) disposed adjacent to a transducer assembly.

[0061] At operation 1220, the method 1200 can optionally include generating a temperature signal (e.g., the temperature signal 1004, FIG. 10) indicative of the detected temperature. The temperature signal can be transmitted to a control system (e.g., the control system 102, FIG. 1) of the endoscopy system 100 (FIG. 1) or the medical device 108 (FIG. 1).

[0062] At operation 1230, the method 1200 can optionally include monitoring the temperature signal. The temperature signal can be transmitted from the temperature sensor to a controller (e.g., the control system 102, FIG. 1) so that the controller can monitor the temperature signal relative to one or more temperature thresholds.

[0063] At operation 1240, the method 1200 can optionally include adjusting one or more operations of the medical device (e.g., the medical device 108, FIG. 1) based on the temperature signal being above or below a threshold. For example, the controller can terminate or reduce power to the medical device based on the temperature signal being beyond the temperature threshold. The controller can reduce power to the medical device based on the detected temperature being beyond a first temperature threshold and terminate power to the medical device based on thetemperature being beyond a second temperature threshold. The controller can also be configured to generate an alert (e.g., audible, haptic, or visual) to alert a user of the endoscopic system (e.g., the endoscopy system 100, FIG. 1) that the detected temperature of the medical device 108 is beyond one or more of the temperature thresholds. For example, the controller can transmit the alert to the display unit 116 (FIG. 1) to alert the user of the detected temperature being beyond one or more of the temperature thresholds.

[0064] FIG. 13 is a block diagram of an example machine 1300 upon which any techniques (e.g., methodologies) discussed herein can perform. As described herein, examples can include or can operate by, logic or a number of components or mechanisms in machine 1300. Circuitry (e.g., processing circuitry) is a collection of circuits implemented in tangible entities of machine 1300, including hardware (e.g., simple circuits, gates, logic, etc.). Circuitry membership can be flexible over time. Circuitries include members that can, alone or in combination, perform specified operations when operating. Hardware of the circuitry can be immutably designed to carry out a specific operation (e.g., hardwired). In an example, the hardware of the circuitry can include variably connected physical components (e.g., execution units, transistors, simple circuits, etc.), including a machine-readable medium physically modified (e.g., magnetically, electrically, moveable placement of invariant massed particles, etc.) to encode instructions of the specific operation. In connecting the physical components, the underlying electrical properties of a hardware constituent are changed, for example, from an insulator to a conductor or vice versa. The instructions enable embedded hardware (e.g., the execution units or a loading mechanism) to create members of the circuitry in hardware via the variable connections to carry out portions of the specific operation when in operation. Accordingly, in an example, the machine- readable medium elements are part of the circuitry or are communicatively coupled to the other circuitry components when the device is operating. In some examples, any of the physical components can be used in more than one member of more than one circuitry. For example, under operation, execution units can be used in a first circuit of a first circuitry at one point in time and reused by a second circuit in the first circuitry or by a third circuit in a second circuitry at a different time. Additional examples of these components with respect to the machine 1300 follow.

[0065] In alternative examples, the machine 1300 can operate as a standalone device or be connected (e.g., networked) to other machines. In a networkeddeployment, the machine 1300 can operate in the capacity of a server machine, a client machine, or both in server-client network environments. In an example, the machine 1300 can act as a peer machine in peer-to-peer (P2P) (or other distributed) network environment. The machine 1300 can be a personal computer (PC), a tablet PC, a set- top box (STB), a personal digital assistant (PDA), a mobile telephone, a web appliance, a network router, switch, or bridge, or any machine capable of executing instructions (sequential or otherwise) that specify actions to be taken by that machine. Further, while only a single machine is illustrated, the term “machine” shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein, such as cloud computing, software as a service (SaaS), other computer cluster configurations.

[0066] The machine 1300 can include a hardware processor 1302 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 1304, a static memory (e.g., memory or storage for firmware, microcode, a basic-input-output (BIOS), and mass storage 1308 (e.g., hard drives, tape drives, flash storage, or other block devices) some or all of which can communicate with each other via an interlink 1330 (e.g., bus). The machine 1300 can further include a display unit 1310, an alphanumeric input device 1312 (e.g., a keyboard), and a user interface (UI) navigation device 1314 (e.g., a mouse). In examples, the display unit 1310, input device 1312 and UI navigation device 1314 can be a touch screen display. The machine 1300 can include a signal generation device 1318 (e.g., a speaker), a network interface device 1320, and one or more sensors 1316, such as a global positioning system (GPS) sensor, compass, accelerometer, or other sensor. The machine 1300 can include an output controller 1328, such as a serial (e.g., universal serial bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection to communicate or control one or more peripheral devices (e.g., a printer, card reader, etc.).

[0067] Registers of the processor 1302, the main memory 1304, the static memory 1306, or the mass storage 1308 can be, or include, a machine-readable medium 1322 on which is stored one or more sets of data structures or instructions 1324 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein. The instructions 1324 can also reside, completely or at leastpartially, within any of the registers of the processor 1302, the main memory 1304, the static memory 1306, or the mass storage 1308 during execution by the machine 1300. Any combination of the hardware processor 1302, the main memory 1304, the static memory 1306, or the mass storage 1308 can constitute the machine-readable media 1322. While the machine-readable medium 1322 is illustrated as a single medium, “machine-readable medium” can include a single medium or multiple media (e.g., a centralized or distributed database or associated caches and servers) configured to store one or more instructions 1324.

[0068] The term “machine-readable medium” can include any medium that is capable of storing, encoding, or carrying instructions for execution by the machine 1300 and that causes the machine 1300 to perform any one or more of the techniques of the present disclosure, or that is capable of storing, encoding or carrying data structures used by or associated with such instructions. Non-limiting machine-readable medium examples can include solid-state memories, optical media, magnetic media, and signals (e.g., radio frequency signals, other photon-based signals, sound signals, etc.). A non-transitory machine-readable medium comprises a machine-readable medium with a plurality of particles having invariant (e.g., rest) mass and, thus, are compositions of matter. Accordingly, non-transitory machine-readable media are machine-readable media that do not include transitory propagating signals. Specific examples of non-transitory machine-readable media can include non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0069] Information stored or otherwise provided on the machine-readable medium 1322 can represent instructions 1324, such as instructions 1324 themselves or a format from which the instructions 1324 can be derived. This format from which the instructions 1324 can be derived can include source code, encoded instructions (e.g., in compressed or encrypted form), packaged instructions (e.g., split into multiple packages), or the like. The information representative of the instructions 1324 in the machine-readable medium 1322 can be processed by processing circuitry into the instructions to implement any of the operations discussed herein. For example, deriving the instructions 1324 from the information (e.g., processing by the processing circuitry) can include compiling (e.g., from source code, object code, etc.),interpreting, loading, organizing (e.g., dynamically or statically linking), encoding, decoding, encrypting, unencrypting, packaging, unpackaging, or otherwise manipulating the information into the instructions 1324.

[0070] In an example, the derivation of the instructions 1324 can include assembly, compilation, or interpretation of the information (e.g., by the processing circuitry) to create the instructions 1324 from some intermediate or preprocessed format provided by the machine-readable medium 1322. When provided in multiple parts, the information can be combined, unpacked, and modified to create the instructions 1324. For example, the information can be in multiple compressed source code packages (object code, binary executable code, etc.) on one or several remote servers. The source code packages can be encrypted when in transit over a network and decrypted, uncompressed, assembled (e.g., linked) if necessary, and compiled or interpreted (e.g., into a library, stand-alone executable, etc.) at a local machine, and executed by the local machine.

[0071] The instructions 1324 can be further transmitted or received over a communications network 1326 using a transmission medium via the network interface device 1320 utilizing any one of several transfer protocols (e.g., frame relay, internet protocol (IP), transmission control protocol (TCP), user datagram protocol (UDP), hypertext transfer protocol (HTTP), etc.). Example communication networks can include a local area network (LAN), a wide area network (WAN), a packet data network (e.g., the Internet), LoRa / LoRaWAN, or satellite communication networks, mobile telephone networks (e.g., cellular networks such as those complying with 3G, 4G LTE / LTE-A, or 5G standards), Plain Old Telephone (POTS) networks, and wireless data networks (e.g., Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards known as Wi-Fi®, IEEE 802.15.4 family of standards, peer-to-peer (P2P) networks, among others. The network interface device 1320 can include one or more physical jacks (e.g., Ethernet, coaxial, or phonejacks) or one or more antennas to connect to the communications network 1326. The network interface device 1320 can include a plurality of antennas to wirelessly communicate using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) techniques. The term “transmission medium” shall include any intangible medium capable of storing, encoding or carrying instructions for execution by the machine 1300, and includes digital or analogcommunications signals or other intangible medium to facilitate communication of such software. A transmission medium is a machine-readable medium.

[0072] The following, non-limiting examples, detail certain aspects of the present subject matter to solve the challenges and provide the benefits discussed herein, among others.

[0073] Example l is a medical device comprising: a transducer assembly configured to capture ultrasound images during a medical procedure; a thermal management system configured to dissipate heat generated by the transducer assembly, the thermal management system including: a thermal paste disposed within the transducer assembly; and a heat sink configured to at least partially surround the transducer assembly and draw heat away from the transducer assembly; and a thermally conductive outer surface thermally coupled to the heat sink such that the heat sink transfers heat to the thermally conductive outer surface to dissipate heat from the transducer assembly.

[0074] In Example 2, the subject matter of Example 1 optionally includes wherein the transducer assembly comprises: a foldable substrate; an applicationspecific integrated circuit coupled to the foldable substrate; a capacitor coupled to the application-specific integrated circuit away from the foldable substrate; a piezoelectric micro-machined ultrasonic transducer coupled to the foldable substrate on a surface opposite the application-specific integrated circuit such that the piezoelectric micromachined ultrasonic transducer extends from the foldable substrate toward the capacitor when the foldable substrate is in a folded state; and a lens attached to the piezoelectric micro-machined ultrasonic transducer and the foldable substrate, the lens extending from the piezoelectric micro-machined ultrasonic transducer and the foldable substrate to a periphery of the medical device.

[0075] In Example 3, the subject matter of Example 2 optionally includes wherein the thermal paste is disposed between the piezoelectric micro-machined ultrasonic transducer and the application-specific integrated circuit and the cap, and wherein the thermal paste holds the foldable substrate in the folded state.

[0076] In Example 4, the subject matter of any one or more of Examples 2-3 optionally include wherein the thermal paste is disposed between the foldable substrate and the heat sink to facilitate heat transfer between the foldable substrate and the heat sink.

[0077] In Example 5, the subject matter of any one or more of Examples 1-4 optionally include wherein the transducer assembly comprises: a substrate; an application-specific integrated circuit coupled to a first major surface of the substrate; a capacitor coupled to the application-specific integrated circuit and extending through a second major surface of the substrate; a piezoelectric micro-machined ultrasonic transducer coupled to the substrate such that the capacitor is disposed between the application-specific integrated circuit and the piezoelectric micro-machined ultrasonic transducer; and a lens attached to the piezoelectric micro-machined ultrasonic transducer and the substrate, the lens extending from the piezoelectric micro-machined ultrasonic transducer and the substrate to a periphery of the medical device.

[0078] In Example 6, the subject matter of Example 5 optionally includes wherein the thermal paste is disposed between the piezoelectric micro-machined ultrasonic transducer and the application-specific integrated circuit and the cap.

[0079] In Example 7, the subject matter of any one or more of Examples 5-6 optionally include wherein the thermal paste is disposed between the applicationspecific integrated circuit and the heat sink to facilitate heat transfer between the application-specific integrated circuit and the heat sink.

[0080] In Example 8, the subject matter of any one or more of Examples 1-7 optionally include a thermal sensor disposed adjacent to the transducer to detect a temperature of the medical device, the thermal sensor configured to generate a temperature signal indicative of the temperature detected by the thermal sensor.

[0081] In Example 9, the subject matter of Example 8 optionally includes memory including instructions; and a controller including processing circuitry, the instructions, when executed by the processing circuitry, configure the processing circuitry to: monitor the temperature signal generated by the temperature sensor; and adjust one or more operations of the medical device based on the temperature signal being above or below a threshold.

[0082] In Example 10, the subject matter of any one or more of Examples 8-9 optionally include memory including instructions; and a controller including processing circuitry, the instructions, when executed by the processing circuitry, configure the processing circuitry to: monitor the temperature signal generated by the temperature sensor; and terminate or reduce power to the medical device based on the temperature signal being above or below a threshold.

[0083] Example 11 is a medical device for use within an endoscope including a lumen, the medical device configured to be inserted through the lumen and out a distal end of the endoscope, the medical device comprising: a transducer assembly configured to capture ultrasound images during a medical procedure; a thermal management system configured to dissipate heat generated by the transducer assembly, the thermal management system including: a thermal paste disposed within the transducer assembly; and a heat sink configured to at least partially surround the transducer assembly and draw heat away from the transducer assembly; and a thermally conductive outer surface thermally coupled to the heat sink such that the heat sink transfers heat to the thermally conductive outer surface to dissipate heat from the transducer assembly.

[0084] In Example 12, the subject matter of Example 11 optionally includes wherein the transducer assembly comprises: a foldable substrate; an applicationspecific integrated circuit coupled to the foldable substrate; a capacitor coupled to the application-specific integrated circuit away from the foldable substrate; a piezoelectric micro-machined ultrasonic transducer coupled to the foldable substrate on a surface opposite the application-specific integrated circuit such that the piezoelectric micromachined ultrasonic transducer extends from the foldable substrate toward the capacitor when the foldable substrate is in a folded state; and a lens attached to the piezoelectric micro-machined ultrasonic transducer and the foldable substrate, the lens extending from the piezoelectric micro-machined ultrasonic transducer and the foldable substrate to a periphery of the medical device.

[0085] In Example 13, the subject matter of Example 12 optionally includes wherein the thermal paste is disposed between the piezoelectric micro-machined ultrasonic transducer and the application-specific integrated circuit and the cap, and wherein the thermal paste holds the foldable substrate in the folded state.

[0086] In Example 14, the subject matter of any one or more of Examples 12-13 optionally include wherein the thermal paste is disposed between the foldable substrate and the heat sink to facilitate heat transfer between the foldable substrate and the heat sink.

[0087] In Example 15, the subject matter of any one or more of Examples 11-14 optionally include wherein the transducer assembly comprises: a substrate; an application-specific integrated circuit coupled to a first major surface of the substrate; a capacitor coupled to the application-specific integrated circuit and extending through asecond major surface of the substrate; a piezoelectric micro-machined ultrasonic transducer coupled to the substrate such that the capacitor is disposed between the application-specific integrated circuit and the piezoelectric micro-machined ultrasonic transducer; and a lens attached to the piezoelectric micro-machined ultrasonic transducer and the substrate, the lens extending from the piezoelectric micro-machined ultrasonic transducer and the substrate to a periphery of the medical device.

[0088] In Example 16, the subject matter of Example 15 optionally includes wherein the thermal paste is disposed between the piezoelectric micro-machined ultrasonic transducer and the application-specific integrated circuit and the cap.

[0089] In Example 17, the subject matter of any one or more of Examples 15- 16 optionally include wherein the thermal paste is disposed between the applicationspecific integrated circuit and the heat sink to facilitate heat transfer between the application-specific integrated circuit and the heat sink.

[0090] Example 18 is a method for managing a temperature of a medical device, comprising: detecting a temperature of the medical device using a thermal sensor disposed adjacent to a transducer assembly; generating a temperature signal indicative of the detected temperature; monitoring the temperature signal with a controller including processing circuitry; and adjusting one or more operations of the medical device based on the temperature signal being above or below a threshold.

[0091] In Example 19, the subject matter of Example 18 optionally includes terminating or reducing power to the medical device based on the temperature signal being above or below the threshold.

[0092] In Example 20, the subject matter of any one or more of Examples 18- 19 optionally include generating an alert indicative on the temperature signal being above or below the threshold.

[0093] Example 21 can include a method, device, system, or medical device including any element of any of Examples 1-20.

[0094] The above-detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific examples that may be practiced. These embodiments are also referred to herein as “examples.” Such examples may include elements in addition to those shown or described. However, the present inventors also contemplate examples in which only those elements shown or described are provided. Moreover, the present inventors also contemplate examples using any combination or permutation of thoseelements shown or described (or one or more aspects thereof), either with respect to a particular example (or one or more aspects thereof), or with respect to other examples (or one or more aspects thereof) shown or described herein.

[0095] All publications, patents, and patent documents referred to in this document are incorporated by reference herein in their entirety, as though individually incorporated by reference. In the event of inconsistent usages between this document and those documents so incorporated by reference, the usage in the incorporated reference(s) should be considered supplementary to that of this document; for irreconcilable inconsistencies, the usage in this document controls.

[0096] In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of “at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, device, article, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.

[0097] The term “about,” as used herein, means approximately, in the region of, roughly, or around. When the term “about” is used in conjunction with a numerical range, it modifies that range by extending the boundaries above and below the numerical values set forth. In general, the term “about” is used herein to modify a numerical value above and below the stated value by a variance of 10%. In one aspect, the term “about” means plus or minus 10% of the numerical value of the number with which it is being used. Therefore, about 50% means in the range of 45%-55%. Numerical ranges recited herein by endpoints include all numbers and fractions subsumed within that range (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.90, 4, 4.24, and 5). Similarly, numerical ranges recited herein by endpoints include subranges subsumed within that range (e.g., 1 to 5 includes 1-1.5, 1.5-2, 2-2.75, 2.75-3, 3-3.90, 3.90-4, 4- 4.24, 4.24-5, 2-5, 3-5, 1-4, and 2-4). It is also to be understood that all numbers and fractions thereof are presumed to be modified by the term “about.”

[0098] The above description is intended to be illustrative, and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. Other examples may be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is to allow the reader to quickly ascertain the nature of the technical disclosure and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment. The scope of the examples should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

[0099] The devices disclosed herein can be designed to be disposed of after a single use, or they can be designed to be used multiple times. In either case, however, the device can be reconditioned for reuse after at least one use. Reconditioning can include a combination of the steps of disassembly of the device, followed by cleaning or replacement of particular pieces, and subsequent reassembly. In particular, the device can be disassembled, and any number of particular pieces or parts of the device can be selectively replaced or removed in any combination. Upon cleaning and / or replacement of particular parts, the device can be reassembled for subsequent use either at a reconditioning facility, or by a surgical team immediately prior to a surgical procedure. Those of ordinary skill in the art will appreciate that the reconditioning of a device can utilize a variety of different techniques for disassembly, cleaning / replacement, and reassembly. Use of such techniques, and the resulting reconditioned device, are all within the scope of the present application.

[0100] Preferably, the invention described herein will be processed before surgery. First a new or used instrument is obtained and, if necessary, cleaned. The instrument can then be sterilized. In one sterilization technique, the instrument is placed in a closed and sealed container, such as a plastic or TYVEK® bag. The container and instrument are then placed in a field of radiation that can penetrate the container, such as gamma radiation, x-rays, or higher energy electrons. The radiation kills bacteria on the instrument and in the container. The sterilized instrument can thenbe stored in the sterile container. The sealed container keeps the instrument sterile until it is opened in the medical facility. The device may also be sterilized using any other technique known in the art, including but limited to beta or gamma radiation, ethylene oxide, or steam.

Claims

CLAIMSWhat is claimed is:

1. A medical device comprising: a transducer assembly configured to capture ultrasound images during a medical procedure; a thermal management system configured to dissipate heat generated by the transducer assembly, the thermal management system including: a thermal paste disposed over at least one surface of the transducer assembly; and a heat sink in mechanical contact with the thermal paste and configured to draw heat away from the transducer assembly; and a thermally conductive outer surface thermally coupled to the heat sink such that the heat sink transfers heat to the thermally conductive outer surface to dissipate heat from the transducer assembly.

2. The medical device of claim 1, wherein the transducer assembly comprises: a foldable substrate; an application-specific integrated circuit coupled to the foldable substrate; a capacitor coupled to the application-specific integrated circuit, the capacitor faces away from the foldable substrate; a piezoelectric micro-machined ultrasonic transducer coupled to the foldable substrate on a surface opposite the application-specific integrated circuit such that the piezoelectric micro-machined ultrasonic transducer extends from the foldable substrate toward the capacitor when the foldable substrate is in a folded state; and a lens attached to the piezoelectric micro-machined ultrasonic transducer and the foldable substrate, the lens extending from the piezoelectric micro-machined ultrasonic transducer and the foldable substrate to a periphery of the medical device.

3. The medical device of claim 2, wherein the thermal paste is disposed between the piezoelectric micro-machined ultrasonic transducer and theapplication-specific integrated circuit and the capacitor, and wherein the thermal paste holds the foldable substrate in the folded state.

4. The medical device of claim 2, wherein the thermal paste is disposed between the foldable substrate and the heat sink to facilitate heat transfer between the foldable substrate and the heat sink.

5. The medical device of claim 1, wherein the transducer assembly comprises: a substrate; an application-specific integrated circuit coupled to a first major surface of the substrate; a capacitor coupled to the application-specific integrated circuit and extending through a second major surface of the substrate; a piezoelectric micro-machined ultrasonic transducer coupled to the substrate such that the capacitor is disposed between the applicationspecific integrated circuit and the piezoelectric micro-machined ultrasonic transducer; and a lens attached to the piezoelectric micro-machined ultrasonic transducer and the substrate, the lens extending from the piezoelectric micromachined ultrasonic transducer and the substrate to a periphery of the medical device.

6. The medical device of claim 5, wherein the thermal paste is disposed between the piezoelectric micro-machined ultrasonic transducer and the application-specific integrated circuit and the capacitor.

7. The medical device of claim 5, wherein the thermal paste is disposed between the application-specific integrated circuit and the heat sink to facilitate heat transfer between the application-specific integrated circuit and the heat sink.

8. The medical device of claim 1, comprising: a thermal sensor disposed adjacent to the transducer assembly to detect a temperature of the medical device, the thermal sensor configured togenerate a temperature signal indicative of the temperature detected by the thermal sensor.

9. The medical device of claim 8, comprising: memory including instructions; and a controller including processing circuitry, the instructions, when executed by the processing circuitry, configure the processing circuitry to: monitor the temperature signal generated by the thermal sensor; and adjust one or more operations of the medical device based on the temperature signal being above or below a threshold.

10. The medical device of claim 8, comprising: memory including instructions; and a controller including processing circuitry, the instructions, when executed by the processing circuitry, configure the processing circuitry to: monitor the temperature signal generated by the thermal sensor; and terminate or reduce power to the medical device based on the temperature signal being above or below a threshold.

11. A medical device for use within an endoscope including a lumen, the medical device configured to be inserted through the lumen and out a distal end of the endoscope, the medical device comprising: a transducer assembly configured to capture ultrasound images during a medical procedure; a thermal management system configured to dissipate heat generated by the transducer assembly, the thermal management system including: a thermal paste disposed within the transducer assembly; and a heat sink configured to at least partially surround the transducer assembly and draw heat away from the transducer assembly; and a thermally conductive outer surface thermally coupled to the heat sink such that the heat sink transfers heat to the thermally conductive outer surface to dissipate heat from the transducer assembly.

12. The medical device of claim 11, wherein the transducer assembly comprises: a foldable substrate; an application-specific integrated circuit coupled to the foldable substrate; a capacitor coupled to the application-specific integrated circuit, the capacitor faces away from the foldable substrate; a piezoelectric micro-machined ultrasonic transducer coupled to the foldable substrate on a surface opposite the application-specific integrated circuit such that the piezoelectric micro-machined ultrasonic transducer extends from the foldable substrate toward the capacitor when the foldable substrate is in a folded state; and a lens attached to the piezoelectric micro-machined ultrasonic transducer and the foldable substrate, the lens extending from the piezoelectric micro-machined ultrasonic transducer and the foldable substrate to a periphery of the medical device.

13. The medical device of claim 12, wherein the thermal paste is disposed between the piezoelectric micro-machined ultrasonic transducer and the application-specific integrated circuit and the capacitor, and wherein the thermal paste holds the foldable substrate in the folded state.

14. The medical device of claim 12, wherein the thermal paste is disposed between the foldable substrate and the heat sink to facilitate heat transfer between the foldable substrate and the heat sink.

15. The medical device of claim 11, wherein the transducer assembly comprises: a substrate; an application-specific integrated circuit coupled to a first major surface of the substrate; a capacitor coupled to the application-specific integrated circuit and extending through a second major surface of the substrate; a piezoelectric micro-machined ultrasonic transducer coupled to the substrate such that the capacitor is disposed between the application-specific integrated circuit and the piezoelectric micro-machined ultrasonic transducer; and a lens attached to the piezoelectric micro-machined ultrasonic transducer and the substrate, the lens extending from the piezoelectric micromachined ultrasonic transducer and the substrate to a periphery of the medical device.

16. The medical device of claim 15, wherein the thermal paste is disposed between the piezoelectric micro-machined ultrasonic transducer and the application-specific integrated circuit and the capacitor.

17. The medical device of claim 15, wherein the thermal paste is disposed between the application-specific integrated circuit and the heat sink to facilitate heat transfer between the application-specific integrated circuit and the heat sink.

18. A method for managing a temperature of a medical device, comprising: detecting a temperature of the medical device using a thermal sensor disposed adjacent to a transducer assembly; generating a temperature signal indicative of the detected temperature; monitoring the temperature signal with a controller including processing circuitry; and adjusting one or more operations of the medical device based on the temperature signal being above or below a threshold.

19. The method of claim 18, further comprising: terminating or reducing power to the medical device based on the temperature signal being above or below the threshold.

20. The method of claim 18, further comprising: generating an alert indicative on the temperature signal being above or below the threshold.

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