Presentation device and method for presenting warm / cold stimulus

Abstract

[Problem] To more effectively present a warm / cold stimulus to a user. [Solution] A presentation device comprising: a presentation unit that presents a warm / cold stimulus to a user; a thermal buffer unit in which heat is transferred between the presentation unit and itself; and a drive unit that moves the presentation unit to a first position at which heat can be transferred from the presentation unit to the thermal buffer unit, and a second position at which the temperature / cold stimulus can be presented to the user from the presentation unit.

Description

Presentation device and method for presenting warm and cold stimuli

[0001] The present disclosure relates to a presentation device and a method for presenting a hot and cold stimulus.

[0002] In recent years, tactile presentation devices that present various tactile sensations to a user in an extended reality (XR) space that combines real space and virtual space have become known.

[0003] For example, Patent Document 1 listed below discloses a tactile sensation presentation device capable of presenting pressure stimuli such as pressure or hard / soft sensations, and hot / cold stimuli.

[0004] International Publication No. 2022 / 209111

[0005] However, the human body senses warmth or coldness based on the difference between the temperature of the stimulated area and the temperature of the stimulus, so the tactile sensation presentation device disclosed in Patent Document 1, which gradually heats or cools the presentation unit that comes into contact with the user's skin, has difficulty effectively presenting warm and cold stimuli to the user.

[0006] Therefore, the present disclosure proposes a new and improved presentation device and method for presenting a hot and cold stimulus that can more effectively present a hot and cold stimulus to a user.

[0007] According to the present disclosure, there is provided a presentation device comprising: a presentation unit that presents a hot / cold stimulus to a user; a thermal buffer unit that transfers heat between the presentation unit and the thermal buffer unit; and a drive unit that moves the presentation unit to a first position where heat can be transferred from the presentation unit to the thermal buffer unit and to a second position where the hot / cold stimulus can be presented from the presentation unit to the user.

[0008] Furthermore, according to the present disclosure, there is provided a method for presenting a warm / cold stimulus, which includes moving a presentation unit that presents a warm / cold stimulus to a user to a first position where heat can be transferred to a thermal buffer unit, transferring heat from the presentation unit to the thermal buffer unit so that the temperature of the presentation unit becomes a temperature corresponding to the warm / cold stimulus, and moving the presentation unit, which has reached a temperature corresponding to the warm / cold stimulus, to a second position where the warm / cold stimulus can be presented to the user.

[0009] 1 is a cross-sectional view showing a structure of a presentation device according to a first embodiment of the present disclosure. FIG. 2 is a cross-sectional view showing the structure of a presentation device according to a first embodiment of the present disclosure. FIG. 3 is an exploded perspective view of a presentation device according to the first embodiment. FIG. 4 is a schematic view showing a configuration of an information processing system including a presentation device according to the first embodiment. FIG. 5 is a block diagram showing a functional configuration of the information processing system. FIG. 6 is a flowchart showing a control flow of an information processing system. FIG. 7 is a cross-sectional view showing the structure of a presentation device according to a first modified example of the first embodiment. FIG. 8 is a cross-sectional view showing the structure of a presentation device according to a first modified example of the first embodiment. FIG. 9 is a cross-sectional view showing the structure of a presentation device according to a second modified example of the first embodiment. FIG. 10 is a cross-sectional view showing the structure of a presentation device according to a third modified example of the first embodiment. FIG. 11 is a graph showing an example of temperature control of a thermal buffer unit by a presentation device according to a fourth modified example of the first embodiment. FIG. 12 is a graph showing the relationship between a torque pressing a movable unit against the thermal buffer unit and a contact area between the movable unit and the thermal buffer unit. FIG. 13 is a graph showing the relationship between a contact area between the movable unit and the thermal buffer unit and heat transfer efficiency between the movable unit and the thermal buffer unit. FIG. 14 is a cross-sectional view showing the structure of a presentation device according to a sixth modified example of the first embodiment. FIG. 15 is a cross-sectional view showing the structure of a presentation device according to a second embodiment of the present disclosure. FIG. 1 is a cross-sectional view showing the structure of a presentation device according to a first modified example of the second embodiment. FIG. 2 is a cross-sectional view showing the structure of a presentation device according to a first modified example of the second embodiment. FIG. 3 is a cross-sectional view showing the structure of a presentation device according to a second modified example of the second embodiment. FIG. 4 is a cross-sectional view showing the structure of a presentation device according to a second modified example of the second embodiment. FIG. 5 is a graph showing an example of temperature control of a thermal buffer unit by an air-cooling unit. FIG. 6 is a cross-sectional view showing the structure of a presentation device according to a third modified example of the second embodiment.

[0010] Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0011] The description will be given in the following order: 1. First embodiment 1.1. Structure of presentation device 1.2. Control of presentation device 1.3. Modification 2. Second embodiment 2.1. Structure of presentation device 2.2. Modification

[0012] 1. First Embodiment (1.1. Structure of Presentation Device) First, the structure of a presentation device according to a first embodiment of the present disclosure will be described with reference to FIGS. 1 to 3. FIG. 1 is a cross-sectional view showing the structure of the presentation device 100 when the presentation unit 110 is in a first position. FIG. 2 is a cross-sectional view showing the structure of the presentation device 100 when the presentation unit 110 is in a second position. FIG. 3 is an exploded perspective view of the presentation device 100.

[0013] As shown in Figures 1 to 3, the presentation device 100 according to this embodiment includes a presentation unit 110, a sensing unit 111, a heat transfer unit 120, adhesive sheets 121 and 122, a movable unit 130, a drive unit 140, a heat conduction sheet 151, a heat buffer unit 150, and an upper housing 160.

[0014] The presentation unit 110 is a component that presents a warm / cold stimulus to the user's body U. Specifically, the presentation unit 110 is heated or cooled at a first position shown in FIG. 1 to a temperature corresponding to the warm / cold stimulus, and then contacts the user's body U at a second position shown in FIG. 2 to present the warm / cold stimulus to the user's body U. To facilitate contact with the user's body U at the second position shown in FIG. 2, the presentation unit 110 may be provided in a three-dimensional shape having a spherical or curved surface that is convex toward the outside. The presentation unit 110 may be made of a material with high thermal conductivity, such as copper (400 W / (m·K)) or aluminum (200 W / (m·K)). However, any material with a thermal conductivity of 10 W / (m·K) or higher can be used as the constituent material of the presentation unit 110 without particular limitations.

[0015] The sensing unit 111 is a sensor that senses the temperature of the presentation unit 110. Specifically, the sensing unit 111 is provided below the presentation unit 110, and senses the temperature of the presentation unit 110. The sensing unit 111 may be, for example, a thermistor or a thermocouple.

[0016] The heat transfer unit 120 is an element that transfers heat between the display unit 110 and the movable unit 130. Specifically, the heat transfer unit 120 may be a Peltier element having the display unit 110 provided on one side via an adhesive sheet 121 and the movable unit 130 provided on another side (e.g., the other side opposite the first side) via an adhesive sheet 122. When the heat transfer unit 120 is a Peltier element, the heat transfer unit 120 can transfer heat from the display unit 110 to the movable unit 130 (i.e., cool the display unit 110) by, for example, passing a direct current of a first polarity through the heat transfer unit 120. Furthermore, the heat transfer unit 120 can transfer heat from the movable unit 130 to the display unit 110 (i.e., heat the display unit 110) by passing a direct current of a second polarity opposite to the first polarity through the heat transfer unit 120.

[0017] The adhesive sheets 121 and 122 are thermally conductive adhesive sheets that have high thermal conductivity and bond the components provided on both sides to each other. Specifically, the adhesive sheet 121 is provided between the presentation unit 110 and the heat transfer unit 120 to bond the presentation unit 110 and the heat transfer unit 120 to each other. The adhesive sheet 122 is provided between the heat transfer unit 120 and the movable unit 130 to bond the heat transfer unit 120 and the movable unit 130 to each other.

[0018] The movable unit 130 is a member that is swung by the drive unit 140. When the movable unit 130 is swung by the drive unit 140, the presenting unit 110, which is provided on the movable unit 130 via the thermal transfer unit 120, can be moved to a first position shown in Fig. 1 and a second position shown in Fig. 2.

[0019] Specifically, by swinging the movable unit 130 downward as shown in Fig. 1, the movable unit 130 can come into contact with the thermal buffer unit 150 via the thermal conduction sheet 151. As a result, the movable unit 130 can thermally connect the presentation unit 110 and the thermal buffer unit 150, and heat can be transferred between the presentation unit 110 and the thermal buffer unit 150 by the heat transfer unit 120. Furthermore, by swinging the movable unit 130 upward as shown in Fig. 2, the movable unit 130 can move the presentation unit 110 to a first position protruding from the upper housing 160. As a result, the movable unit 130 can bring the presentation unit 110 into contact with the user's body U.

[0020] The movable part 130 serves as a heat passage between the presentation part 110 and the thermal buffer part 150, and may therefore be made of a material with high thermal conductivity such as copper (400 W / (m·K)) or aluminum (200 W / (m·K)).

[0021] The size or shape of the movable unit 130 is not particularly limited as long as it can move the presentation unit 110 to the first position and the second position. However, if the movable unit 130 functions as a destination or source of heat from the presentation unit 110, similar to the thermal buffer unit 150, the movable unit 130 may be made larger to increase its heat capacity. On the other hand, if the movable unit 130 does not function as a destination or source of heat from the presentation unit 110, the movable unit 130 may be made smaller to reduce the load on the drive unit 140.

[0022] The driving unit 140 is an actuator that swings the movable unit 130. By swinging the movable unit 130, the driving unit 140 can move the presentation unit 110 to a first position shown in Fig. 1 and a second position shown in Fig. 2. The driving unit 140 may be a motor that rotates, or may be a voice coil motor, a linear actuator, a linear resonant actuator, or the like that moves linearly, as long as it can swing the movable unit 130.

[0023] The thermally conductive sheet 151 is a sheet member that is attached to the thermal buffer portion 150. When the movable portion 130 is swung downward as shown in Fig. 1 , the thermally conductive sheet 151 is sandwiched between the movable portion 130 and the thermal buffer portion 150, thereby improving the adhesion between the movable portion 130 and the thermal buffer portion 150. The thermally conductive sheet 151 may be made of, for example, silicone rubber or acrylic rubber.

[0024] The thermal buffer unit 150 is a member through which heat is transferred between the thermal buffer unit 150 and the presentation unit 110 by the thermal transfer unit 120. Specifically, as shown in FIG. 1 , the thermal buffer unit 150 comes into contact with the movable unit 130 via the thermal conduction sheet 151 when the movable unit 130 is swung downward, thereby being thermally connected to the presentation unit 110. This allows the thermal buffer unit 150 to serve as a destination of heat transfer from the presentation unit 110 or a source of heat transfer to the presentation unit 110. The thermal buffer unit 150 may be made of, for example, aluminum.

[0025] It is desirable that the thermal buffer unit 150 be exposed to the outside. In this case, the presentation device 100 becomes a system that is thermally open to the outside, and therefore can release heat to the outside or absorb heat from the outside to prevent heat or cold from accumulating in the thermal buffer unit 150. For example, the thermal buffer unit 150 may be a part of the housing of the presentation device 100 that is exposed to the outside. In this case, the thermal buffer unit 150 can be fitted into the upper housing 160 to form the housing of the presentation device 100.

[0026] The upper housing 160 is a part or the whole of the housing of the presentation device 100. The upper housing 160 is provided with an opening H that allows the presentation unit 110 to protrude from the presentation device 100 when the presentation unit 110 moves to the second position shown in Fig. 2. When the thermal buffer unit 150 is a part of the housing of the presentation device 100, the upper housing 160 can constitute the housing of the presentation device 100 together with the thermal buffer unit 150. On the other hand, when the thermal buffer unit 150 is provided separately from the housing of the presentation device 100, the upper housing 160 can constitute the housing of the presentation device 100 that houses the thermal buffer unit 150 inside.

[0027] The presentation device 100 according to this embodiment controls the temperature of the presentation unit 110 located at a first position to a temperature corresponding to a hot / cold stimulus by heat transfer using the heat transfer unit 120, and then moves the presentation unit 110 to a second position, thereby presenting a hot / cold stimulus to the user's body U. In this manner, the presentation device 100 heats or cools the presentation unit 110 so as to increase the temperature difference between the user's body U and the presentation unit 110, and then brings the presentation unit 110 into contact with the user's body U, thereby making it possible to more efficiently present a hot / cold stimulus to the user.

[0028] Furthermore, the presentation device 100 can separate the thermal buffer unit 150, which tends to become large in size in order to increase the heat capacity, from the presentation unit 110, thereby reducing the load on the drive unit 140, which moves the presentation unit 110 via the movable unit 130.

[0029] (1.2. Control of Presentation Device) Next, control of the presentation device 100 according to this embodiment will be described with reference to Figs. 4 to 6. Fig. 4 is a schematic diagram showing the configuration of an information processing system 1 including the presentation device 100 according to this embodiment. Fig. 5 is a block diagram showing the functional configuration of the information processing system 1. Fig. 6 is a flowchart showing the flow of control of the information processing system 1.

[0030] 4 , an information processing system 1 including the presentation device 100 according to this embodiment includes the presentation device 100, an information processing device 400, and a display device 300. The presentation device 100, the information processing device 400, and the display device 300 are connected to each other by wire or wirelessly. The information processing system 1 is a system that provides a user with an experience in an XR space that combines real space and virtual space, for example, using their visual and tactile senses.

[0031] The presentation device 100 may be integrated with either the information processing device 400 or the display device 300. For example, the presentation device 100 may be integrated with the information processing device 400, may be integrated with the display device 300, or may be integrated with the information processing device 400 and the display device 300.

[0032] The display device 300 presents an image in the XR space to the user. The display device 300 may be, for example, a head-mounted display, various display devices, or a smartphone.

[0033] The presentation device 100 has the configuration described with reference to Figures 1 to 3 and presents a warm / cold stimulus in an XR space to a user. The presentation device 100 may be, for example, a glove-type controller, a game controller, a smartphone, or the like. The presentation device 100 may also be headphones or earphones that are worn on the user's body U.

[0034] The information processing device 400 is a control device that controls the overall operation of the information processing system 1. The information processing device 400 may control the presentation of hot and cold stimuli to the user from the presentation device 100 and the presentation of images to the user from the display device 300. For example, the information processing device 400 may cause the display device 300 to present an image of an object present in the XR space to the user, and may cause the presentation device 100 to present a hot and cold stimuli corresponding to the material or temperature of the object present in the XR space to the user. In this way, the information processing device 400 can cause the user to virtually perceive the texture of the material of the object present in the XR space or the temperature of the environment of the XR space through the hot and cold stimuli. Therefore, the information processing device 400 can further improve the sense of realism of the XR space.

[0035] 5, the presentation device 100 may present a warm / cold stimulus to the user by operating the drive unit 140 and the heat transfer unit 120 under control of the control unit 10. The control unit 10 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The control unit 10 may generate control commands to the drive unit 140 and the heat transfer unit 120 using an arithmetic processing device such as the CPU. Programs and calculation parameters used by the CPU are stored in the ROM, and parameters used when executing the programs are temporarily stored in the RAM.

[0036] Specifically, the control unit 10 first controls the driving of the drive unit 140 to move the presentation unit 110 to a first position. As a result, the presentation unit 110 and the thermal buffer unit 150 are thermally connected via the heat transfer unit 120 and the movable unit 130. Next, the control unit 10 controls the temperature of the presentation unit 110 to a temperature corresponding to a hot / cold stimulus by transferring heat using the heat transfer unit 120 based on the temperature of the presentation unit 110 sensed by the sensing unit 111. Subsequently, the control unit 10 controls the driving of the drive unit 140 to move the presentation unit 110 to a second position. As a result, the presentation unit 110 protrudes from the upper housing 160 of the presentation device 100, allowing the presentation device 100 to present a hot / cold stimulus to the user's body U.

[0037] Next, the overall control flow of the information processing system 1 will be described with reference to Fig. 6. First, it is assumed that the information processing system 1 is presenting an image of an object existing in the XR space to the user using the display device 300.

[0038] 6, the information processing device 400 first determines whether the distance between the object in the XR space and the user is within a threshold (S101). If the distance between the object and the user is greater than the threshold (S101 / NO), the information processing device 400 repeats the determination in step S101.

[0039] If the distance between the object and the user is within the threshold (S101 / YES), the information processing device 400 instructs the presentation device 100 to prepare for presentation of a hot / cold stimulus. As a result, the presentation device 100 controls the driving of the driving unit 140 to move the presentation unit 110 to a first position (S103). Next, the presentation device 100 transfers heat using the heat transfer unit 120 so that the temperature of the presentation unit 110 reaches a predetermined temperature (i.e., a temperature corresponding to the hot / cold stimulus) (S105).

[0040] On the other hand, the information processing device 400 determines whether or not the user has come into contact with an object present in the XR space (S107). If the object and the user have not come into contact with each other (S107 / NO), the information processing device 400 repeats the determination of step S107.

[0041] When the object and the user come into contact (S107 / YES), the information processing device 400 instructs the presentation device 100 to present a hot / cold stimulus. As a result, the control unit 10 of the presentation device 100 controls the driving of the drive unit 140 to move the presentation unit 110 to the second position (S109). As a result, the presentation device 100 can present a hot / cold stimulus to the body U of the user with the presentation unit 110.

[0042] Thereafter, the information processing device 400 determines whether or not the object in the XR space has moved away from the user (S111). If the object and the user have not moved away from each other (S111 / NO), the information processing device 400 repeats the determination in step S111.

[0043] When the object and the user are separated (S111 / YES), the information processing device 400 instructs the presentation device 100 to end the presentation of the hot and cold stimulus. As a result, the control unit 10 of the presentation device 100 controls the driving of the drive unit 140 to move the presentation unit 110 to the first position (S113). As a result, the presentation device 100 can stop the presentation of the hot and cold stimulus by separating the presentation unit 110 from the user's body U.

[0044] According to the above-described operational flow, the presentation device 100 can present a hot and cold stimulus to the body U of the user based on an instruction from the information processing device 400.

[0045] (1.3. Modifications) Next, modifications of the presentation device 100 according to this embodiment will be described with reference to FIGS.

[0046] (First Modification) Fig. 7 is a cross-sectional view showing the structure of presentation device 100A according to a first modification when presentation unit 110 is located at a first position. Fig. 8 is a cross-sectional view showing the structure of presentation device 100A according to the first modification when presentation unit 110 is located at a second position.

[0047] As shown in FIGS. 7 and 8, a presentation device 100A according to a first modified example is provided with a sheet member 152 that thermally connects the movable section 130 and the thermal buffer section 150 regardless of the position of the presentation section 110.

[0048] The sheet member 152 is, for example, a flexible graphite sheet made of graphite. The sheet member 152 is, for example, bent and provided between the movable unit 130 and the thermal buffer unit 150 so as to connect the opposing surfaces of the movable unit 130 and the thermal buffer unit 150. The sheet member 152 may be a graphite-copper foil integrated sheet in which graphite is formed on at least one surface of copper foil, or a graphene-copper foil integrated sheet in which graphene is formed on at least one surface of copper foil.

[0049] The sheet member 152 has extremely high thermal conductivity in the planar direction, and therefore can smoothly transfer heat between the movable section 130 and the thermal buffer section 150. For example, when the presentation section 110 is in the second position shown in FIG. 8 , the sheet member 152 can thermally connect the movable section 130 and the thermal buffer section 150 by transferring heat in the planar direction of the sheet member 152.

[0050] On the other hand, when the presentation unit 110 is in the first position shown in FIG. 7 , the sheet member 152 is bent more between the movable unit 130 and the thermal buffer unit 150. This allows the surfaces of the sheet member 152 provided on the movable unit 130 and the thermal buffer unit 150 to be in direct contact with each other. In this case, the sheet member 152 can thermally connect the movable unit 130 and the thermal buffer unit 150 at a closer distance by transferring heat in the thickness direction of the sheet member 152. Therefore, when the presentation unit 110 is in the first position, the sheet member 152 can transfer heat between the movable unit 130 and the thermal buffer unit 150 more smoothly than when the presentation unit 110 is in the second position.

[0051] In the presentation device 100A according to the first modification, even when the presentation unit 110 is in the second position, the sheet member 152 can transfer heat between the movable unit 130 and the thermal buffer unit 150. Therefore, the presentation device 100A according to the first modification can prevent the movable unit 130 from being excessively heated or cooled.

[0052] (Second Modification) FIG. 9 is a cross-sectional view showing the structure of a presentation device 100B according to a second modification.

[0053] As shown in FIG. 9 , in a presentation device 100B according to the second modification, a heat transfer unit 120B is provided as a heater element that transfers heat generated by consuming power to the presentation unit 110.

[0054] Specifically, the heat transfer unit 120B may be a heater element having the presentation unit 110 provided on one side via an adhesive sheet 121, and the movable unit 130 provided on another side different from the one side (for example, the other side opposite the one side) via an adhesive sheet 122. When the heat transfer unit 120B is a heater element, the heat transfer unit 120B can, for example, transfer heat generated by resistance heating to the presentation unit 110 (i.e., heat the presentation unit 110).

[0055] 9 , which is an intermediate position between the first position and the second position, to a temperature corresponding to the thermal stimulus, and then the presentation device 100B moves the presentation unit 110 to the second position, thereby presenting the thermal stimulus to the user's body U. In this manner, the presentation device 100B heats the presentation unit 110 so as to increase the temperature difference between the user's body U and the presentation unit 110, and then brings the presentation unit 110 into contact with the user's body U, thereby making it possible to more efficiently present the thermal stimulus to the user.

[0056] When the heat transfer unit 120B is a heater element, the presentation device 100B can suppress heat accumulation inside the presentation device 100B by dissipating the heat generated by the heat transfer unit 120B from the presentation unit 110 to the outside of the presentation device 100B. Furthermore, when the heat transfer unit 120B is a heater element, the presentation device 100B can more precisely control the temperature of the presentation unit 110 due to heating.

[0057] (Third Modification) FIG. 10 is a cross-sectional view showing the structure of a presentation device 100C according to a third modification.

[0058] 10 , a presentation device 100C according to the third modification example is further provided with temperature sensors 112A to 112F in addition to a sensing unit 111. Like the sensing unit 111, the temperature sensors 112A to 112F may be, for example, thermistors or thermocouples.

[0059] For example, the temperature sensor 112A may be provided on the surface of the presentation unit 110 and may sense the temperature of the surface of the presentation unit 110 that comes into contact with the user's body U. The temperature sensor 112B may be provided at a position on the lower end of the presentation unit 110 different from the sensing unit 111 and may sense the temperature distribution of the lower part of the presentation unit 110 together with the sensing unit 111. The temperature sensor 112C may be provided between the heat transfer unit 120 and the movable unit 130 and may sense the temperature of the heat transfer unit 120 on the movable unit 130 side. The temperature sensors 112D and 112E may be provided on the front and back surfaces of the thermal conduction sheet 151 and may sense the temperature of the thermal conduction sheet 151. The temperature sensor 112F may be provided on a surface of the thermal buffer unit 150 that is exposed to the outside and may sense the temperature of the thermal buffer unit 150 that is exposed to the outside.

[0060] The presentation device 100C according to the third modification is provided with a plurality of temperature sensors 112A to 112F, and thus is able to control the heat transfer between the presentation unit 110 and the thermal buffer unit 150 with higher precision.

[0061] (Fourth Modification) FIG. 11 is a graph showing an example of temperature control of the thermal buffer unit 150 by the presentation device 100 according to a fourth modification.

[0062] 11 , the presentation device 100 according to the fourth modification controls the contact between the movable unit 130 and the thermal buffer unit 150 so that the sensed temperature of the thermal buffer unit 150 falls within a predetermined range. Specifically, the presentation device 100 may swing the movable unit 130 by driving the drive unit 140, thereby switching between the presence and absence of thermal connection between the movable unit 130 and the thermal buffer unit 150 so that the temperature of the thermal buffer unit 150 falls within the predetermined range.

[0063] For example, if the heat transfer unit 120 is a Peltier element, the Peltier element has a temperature range in which it can efficiently transfer heat, and therefore the presentation device 100 may control the contact between the movable unit 130 and the heat buffer unit 150 so that the temperature of the heat buffer unit 150 falls within the temperature range in which the Peltier element can efficiently transfer heat.

[0064] For example, as shown in Fig. 11, the temperature range in which heat can be efficiently transferred by the Peltier element is assumed to be y°C to x°C. Note that the above temperature range (y°C to x°C) is determined by the capabilities of the Peltier element and the configuration of the thermal buffer unit 150. These temperature ranges are given to the presentation device 100 in advance as parameters.

[0065] When the temperature of the movable part 130 is higher than the temperature of the thermal buffer part 150, the presentation device 100 may control the drive unit 140 so that the movable part 130 moves away from the thermal buffer part 150 at times t1 and t3 when the temperature of the thermal buffer part 150 exceeds x°C. Furthermore, the presentation device 100 may control the drive unit 140 so that the thermal buffer part 150 and the movable part 130 come into contact with each other at time t2 when the temperature of the thermal buffer part 150 falls below y°C.

[0066] Conversely, when the temperature of the movable part 130 is lower than the temperature of the thermal buffer part 150, the presentation device 100 may control the drive unit 140 so that the thermal buffer part 150 and the movable part 130 come into contact with each other at times t1 and t3 when the temperature of the thermal buffer part 150 exceeds x°C. Furthermore, the presentation device 100 may control the drive unit 140 so that the movable part 130 moves away from the thermal buffer part 150 at time t2 when the temperature of the thermal buffer part 150 falls below y°C.

[0067] The presentation device 100 according to the fourth modification can control the temperature of the thermal buffer unit 150 to a temperature range in which heat transfer is efficient, and can therefore more efficiently transfer heat between the presentation unit 110 and the thermal buffer unit 150. Therefore, the presentation device 100 according to the fourth modification can quickly control the temperature of the presentation unit 110 to a temperature corresponding to a hot or cold stimulus.

[0068] 12 is a graph showing the relationship between the torque pressing the movable part 130 against the thermal buffer part 150 and the contact area between the movable part 130 and the thermal buffer part 150. Fig. 13 is a graph showing the relationship between the contact area between the movable part 130 and the thermal buffer part 150 and the heat transfer efficiency between the movable part 130 and the thermal buffer part 150.

[0069] The presentation device 100 according to the fifth modification further oscillates the movable part 130 downward by the driving part 140 in order to further press the movable part 130 against the thermal buffer part 150. This allows the presentation device 100 to further increase the contact area between the movable part 130 and the thermal buffer part 150.

[0070] 12, the greater the torque pressing the movable part 130 against the thermal buffer part 150, the greater the amount of elastic deformation of the thermal conduction sheet 151 sandwiched between the movable part 130 and the thermal buffer part 150, and the greater the contact area between the movable part 130 and the thermal buffer part 150. Thus, as shown in FIG. 13, the increase in the contact area between the movable part 130 and the thermal buffer part 150 improves the efficiency of heat transfer between the movable part 130 and the thermal buffer part 150.

[0071] The presentation device 100 according to the fifth modification can control the efficiency of heat transfer between the movable unit 130 and the thermal buffer unit 150 by controlling the torque that presses the movable unit 130 against the thermal buffer unit 150. Specifically, the presentation device 100 according to the fifth modification can further increase the heat transfer efficiency by about 20% by controlling the torque that presses the movable unit 130 against the thermal buffer unit 150. Accordingly, the presentation device 100 according to the fifth modification can improve the efficiency of heat transfer between the movable unit 130 and the thermal buffer unit 150 by pressing the movable unit 130 more strongly against the thermal buffer unit 150 when it is desired to rapidly change the temperature of the presentation unit 110, for example.

[0072] However, pressing the movable part 130 against the thermal buffer part 150 with a larger torque will cause the thermal conduction sheet 151 to elastically deform more greatly, accelerating the deterioration over time of the thermal conduction sheet 151. Therefore, the presentation device 100 may control the torque applied from the movable part 130 to the thermal buffer part 150 based on the measurement value of a pressure sensor provided between the thermal conduction sheet 151 and the thermal buffer part 150. Furthermore, the presentation device 100 can detect poor contact between the movable part 130 and the thermal buffer part 150 and deterioration of the thermal conduction sheet 151 by monitoring the measurement value of the pressure sensor provided between the thermal conduction sheet 151 and the thermal buffer part 150.

[0073] (Sixth Modification) FIG. 14 is a cross-sectional view showing the structure of a presentation device 100D according to a sixth modification.

[0074] 14 , a presentation device 100D according to a sixth modification is provided with a plurality of thermal buffer units 150A, 150B, and 150C that are separated from one another. The plurality of thermal buffer units 150A, 150B, and 150C may be housed inside the housing of a presentation device 100C that is configured by fitting an upper housing 160 and a lower housing 161 together.

[0075] When the movable part 130 is swung downward, the thermal buffer parts 150A, 150B, and 150C come into contact with the movable part 130 via the thermally conductive sheets 151A, 151B, and 151C, respectively.

[0076] The temperatures of the thermal buffer units 150A, 150B, and 150C may be measured by temperature sensors. Furthermore, the thermal buffer units 150A, 150B, and 150C may be movable independently of one another. In such a case, the contact of the thermal buffer units 150A, 150B, and 150C with the movable unit 130 can be individually controlled. For example, the thermal buffer units 150A, 150B, and 150C may be brought into contact with the movable unit 130 in order, starting with the thermal buffer unit 150C closest to the presentation unit 110. This allows the thermal buffer units 150A, 150B, and 150C to transfer heat more efficiently between the thermal buffer units 150A, 150B, and 150C and the presentation unit 110.

[0077] The presentation device 100D according to the sixth modification can control the heat transfer between the movable part 130 and the plurality of thermal buffer parts 150A, 150B, and 150C that are separated from one another with higher precision.

[0078] 2. Second Embodiment (2.1. Structure of Presentation Device) Next, a structure of a presentation device according to a second embodiment of the present disclosure will be described with reference to Fig. 15 and Fig. 16. Fig. 15 is a cross-sectional view showing the structure of the presentation device 200 when the presentation unit 210 is in a first position. Fig. 16 is a cross-sectional view showing the structure of the presentation device 200 when the presentation unit 210 is in a second position.

[0079] As shown in Figures 15 and 16, the presentation device 200 of this embodiment includes a presentation unit 210, a heat transfer unit 220, a movable unit 230, a drive unit 240, a heat conduction sheet 251, a heat buffer unit 250, a housing 260, and a spring unit 270.

[0080] The presentation unit 210 is a part that presents a hot / cold stimulus to the user's body. Specifically, the presentation unit 210 is heated or cooled to a temperature corresponding to the hot / cold stimulus at a first position shown in Fig. 15, and then comes into contact with the user's body at a second position shown in Fig. 16, thereby presenting the hot / cold stimulus to the user's body. In order to make it easier to come into contact with the user's body U at the second position shown in Fig. 16, the presentation unit 210 may be provided in a three-dimensional shape having a spherical or curved surface that is convex outward.

[0081] The heat transfer unit 220 is an element that transfers heat between the display unit 210 and the movable unit 230. Specifically, the heat transfer unit 220 may be a Peltier element that transfers heat between the display unit 210 provided on one surface and the movable unit 230 provided on the other surface opposite the one surface. When the heat transfer unit 220 is a Peltier element, the heat transfer unit 220 can transfer heat from the display unit 210 to the movable unit 230 (i.e., cool the display unit 210) by, for example, passing a direct current of a first polarity through the heat transfer unit 220. Furthermore, the heat transfer unit 220 can transfer heat from the movable unit 230 to the display unit 210 (i.e., heat the display unit 210) by passing a direct current of a second polarity opposite to the first polarity through the heat transfer unit 220.

[0082] The movable unit 230 is a member that is moved up and down by the driving unit 240. When the movable unit 230 is moved up and down by the driving unit 240, the presentation unit 210 provided on the movable unit 230 can be moved to a first position shown in Fig. 15 and a second position shown in Fig. 16 .

[0083] 15 , the movable unit 230 can be moved downward to come into contact with the thermal buffer unit 250 via the thermal conduction sheet 251. This allows the movable unit 230 to thermally connect the presentation unit 210 and the thermal buffer unit 250, thereby allowing the heat transfer unit 220 to transfer heat between the presentation unit 210 and the thermal buffer unit 250. Furthermore, by moving the movable unit 230 upward as shown in FIG. 16 , the movable unit 230 can move the presentation unit 210 to a first position protruding from the housing 260. This allows the movable unit 230 to bring the presentation unit 210 into contact with the user's body.

[0084] The drive unit 240 is a drive mechanism that moves the movable unit 230 up and down. For example, the drive unit 240 may be a cam mechanism that converts the rotational motion of a motor into up and down motion. The drive unit 240 can move the movable unit 230 up and down to a first position shown in FIG. 15 and a second position shown in FIG. 16 by the up and down motion of the cam mechanism.

[0085] The thermally conductive sheet 251 is a sheet member that is attached to the thermal buffer portion 250. When the movable portion 230 is moved downward as shown in FIG. 15 , the thermally conductive sheet 251 is sandwiched between the movable portion 230 and the thermal buffer portion 250, thereby improving the adhesion between the movable portion 230 and the thermal buffer portion 250.

[0086] The thermal buffer unit 250 is a member through which heat is transferred between the thermal buffer unit 250 and the presentation unit 210 by the thermal transfer unit 220. Specifically, as shown in Fig. 15 , the thermal buffer unit 250 comes into contact with the movable unit 230 via the thermal conduction sheet 251 when the movable unit 230 is moved downward, thereby being thermally connected to the presentation unit 210. This allows the thermal buffer unit 250 to be a destination of heat transfer from the presentation unit 210 or a source of heat transfer to the presentation unit 210.

[0087] The housing 260 is an exterior that houses the components of the presentation device 200. The housing 260 is provided with an opening H that allows the presentation unit 210 to protrude from the housing 260 when the presentation unit 210 moves to the second position shown in FIG.

[0088] Spring unit 270 is provided between housing 260 and movable unit 230, and generates a repulsive force that pushes movable unit 230 downward when presentation unit 210 moves to the second position. For example, spring unit 270 may be a helical spring. When the force pushing movable unit 230 upward is no longer applied from drive unit 240, spring unit 270 pushes movable unit 230 downward with the repulsive force of spring unit 270, thereby moving presentation unit 210 to the first position.

[0089] The presentation device 200 according to this embodiment presents a hot / cold stimulus to the user's body by controlling the temperature of the presentation unit 210 located at a first position to a temperature corresponding to the hot / cold stimulus through heat transfer by the heat transfer unit 220, and then moving the presentation unit 210 to a second position. In this manner, the presentation device 200 heats or cools the presentation unit 210 so as to increase the temperature difference between the user's body and the presentation unit 210, and then brings the presentation unit 210 into contact with the user's body, thereby making it possible to more efficiently present a hot / cold stimulus to the user.

[0090] (2.2. Modifications) Furthermore, modifications of the presentation device 200 according to this embodiment will be described with reference to FIGS.

[0091] (First Modification) Fig. 17 is a cross-sectional view showing the structure of a presentation device 200A according to a first modification when the presentation unit 210 is in a first position. Fig. 18 is a cross-sectional view showing the structure of a presentation device 200A according to the first modification when the presentation unit 210 is in a second position.

[0092] As shown in FIGS. 17 and 18, in a presentation device 200A according to a first modified example, a driving unit 240A is configured by a balloon that can repeatedly expand and contract in the vertical direction.

[0093] Specifically, the driving unit 240A is configured with a balloon provided in the space between the thermal buffer units 250 and below the movable unit 230. The driving unit 240A can expand or contract in the vertical direction by letting air in and out of the balloon using a pump (not shown). This allows the driving unit 240A to move the presentation unit 210 to the second position by expanding the balloon, and to move the presentation unit 210 to the first position by contracting the balloon.

[0094] The presentation device 200A according to the first modification can move the movable part 230 up and down using a driving part 240A formed of a balloon, without using an actuator such as a motor or a mechanical element such as a cam.

[0095] (Second Modification) Fig. 19 is a cross-sectional view showing the structure of a presentation device 200B according to a second modification when the presentation unit 210 is located at a first position. Fig. 20 is a cross-sectional view showing the structure of a presentation device 200B according to a second modification when the presentation unit 210 is located at a second position. Fig. 21 is a graph showing an example of temperature control of the thermal buffer unit 250 by the air-cooling unit 280.

[0096] 19 and 20 , in a presentation device 200B according to the second modification, an air-cooling unit 280 is further provided near the thermal buffer unit 250. The air-cooling unit 280 cools the thermal buffer unit 250, thereby preventing the temperature of the thermal buffer unit 250 from becoming excessively high and reducing the efficiency of heat transfer from the presentation unit 210.

[0097] Specifically, the air-cooling unit 280 may be an air-cooling fan that cools the thermal buffer unit 250 by blowing air. For example, the air-cooling unit 280 may be a centrifugal fan that rotates an impeller to discharge air in a direction perpendicular to the intake direction, or an axial fan that rotates a shaft to which multiple blades are attached to discharge air in a direction parallel to the shaft. The air-cooling unit 280 may be provided below or to the side of the thermal buffer unit 250 as long as it can blow air toward the thermal buffer unit 250.

[0098] The cooling of the thermal buffer unit 250 by the air-cooling unit 280 may be performed when the presentation unit 210 is in the first position shown in Fig. 19. On the other hand, when the presentation unit 210 is in the second position shown in Fig. 20, it is desirable that the cooling of the thermal buffer unit 250 by the air-cooling unit 280 is not performed so as not to interfere with the hot and cold stimulation to the user's body by the presentation unit 210.

[0099] Furthermore, the presentation device 200B may control the output of the air-cooling unit 280 so that the temperature of the thermal buffer unit 250 falls within a predetermined range. For example, if the heat transfer unit 220 is a Peltier element, the Peltier element has a temperature range in which it can efficiently transfer heat. Therefore, the presentation device 200B may control the output of air blown from the air-cooling unit 280 to the thermal buffer unit 250 so that the temperature of the thermal buffer unit 250 falls within a temperature range in which the Peltier element can efficiently transfer heat.

[0100] For example, as shown in Fig. 21, the temperature range in which heat can be efficiently transferred by the Peltier element is assumed to be y°C to x°C. Note that the above temperature range (y°C to x°C) is determined by the capabilities of the Peltier element and the configuration of the thermal buffer unit 250. These temperature ranges are given to the presentation device 200B in advance as parameters.

[0101] For example, when the temperature of the thermal buffer unit 250 is within a temperature range R3 below y°C, the presentation device 200B may stop blowing air from the air-cooling unit 280 to the thermal buffer unit 250. When the temperature of the thermal buffer unit 250 is within a temperature range R1 of x°C or higher, the presentation device 200B may maximize the output of air blown from the air-cooling unit 280 to the thermal buffer unit 250. When the temperature of the thermal buffer unit 250 is within a temperature range R2 of y°C or higher but lower than x°C, the presentation device 200B may set the output of air blown from the air-cooling unit 280 to the thermal buffer unit 250 to be less than the output in the temperature range R1.

[0102] The presentation device 200B according to the second modification can more efficiently cool the thermal buffer unit 250, and therefore can more efficiently transfer heat from the presentation unit 210 to the thermal buffer unit 250.

[0103] (Third Modification) FIG. 22 is a cross-sectional view showing the structure of a presentation device 200C according to a third modification.

[0104] 22 , in a presentation device 200C according to a third modification, the heat transfer unit 220 is provided in a reversible manner. When the heat transfer unit 220 is a Peltier element, the Peltier element transfers heat from one surface to the other surface on the opposite side. Therefore, the presentation device 200C can reverse the direction of heat transfer by physically reversing the heat transfer unit 220, which is a Peltier element, using an actuator 225.

[0105] For example, a first presentation unit 210A is provided on one side of the heat transfer unit 220, and a second presentation unit 210B is provided on the other side opposite the first side. In this case, the heat transfer unit 220 can transfer heat from the first presentation unit 210A to the second presentation unit 210B. Therefore, the presentation device 200C can present a cold stimulus to the user's body by contacting the first presentation unit 210A, which has been cooled by transferring heat from the first presentation unit 210A to the second presentation unit 210B, with the user's body. Furthermore, the presentation device 200C can present a warm stimulus to the user's body by contacting the second presentation unit 210B, which has been heated by transferring heat from the first presentation unit 210A to the second presentation unit 210B, with the user's body.

[0106] The presentation device 200C according to the third variant example is capable of changing whether a cold stimulus or a warm stimulus is presented to the user's body by physically reversing the heat transfer unit 220 without reversing the polarity of the current flowing through the heat transfer unit 220.

[0107] Although the preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, the technical scope of the present disclosure is not limited to such examples. It is clear that a person skilled in the art of the present disclosure can conceive of various modified or altered examples within the scope of the technical idea described in the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure.

[0108] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that will be apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0109] Note that the following configurations also fall within the technical scope of the present disclosure. (1) A presentation device comprising: a presentation unit that presents a hot / cold stimulus to a user; a thermal buffer unit that transfers heat between the presentation unit and the presentation unit; and a drive unit that moves the presentation unit to a first position where heat can be transferred from the presentation unit to the thermal buffer unit and to a second position where the hot / cold stimulus can be presented from the presentation unit to the user. (2) The presentation device described in (1) above, further comprising a heat transfer unit that transfers heat from the presentation unit to the thermal buffer unit. (3) The presentation device described in (2) above, in which the heat transfer unit is a Peltier element. (4) The presentation device described in (2) or (3) above, further comprising a movable unit that has the presentation unit and the heat transfer unit on one side and is moved by the drive unit, and in which, when the presentation unit is in the first position, the movable unit is thermally connected to the thermal buffer unit on the other side different from the one side. (5) The presentation device according to (4), wherein, when the presentation unit is in the first position, the heat transfer unit transfers heat from the presentation unit to the thermal buffer unit via the movable unit. (6) The presentation device according to (4) or (5), wherein, when the presentation unit is in the second position, the presentation unit protrudes from a housing of the presentation device so as to be in contact with the body of the user. (7) The presentation device according to any one of (4) to (6), wherein the movable unit is moved in a linear direction or a swinging direction by the drive unit. (8) The presentation device according to any one of (4) to (7), further comprising a sheet member that thermally connects the movable unit and the thermal buffer unit. (9) The presentation device according to any one of (2) to (8), further comprising a control unit that controls operation of the drive unit and the heat transfer unit, wherein, when an instruction to present the hot / cold stimulus to the user is received, the control unit controls operation of the heat transfer unit so that the temperature of the presentation unit in the first position becomes a temperature corresponding to the hot / cold stimulus. (10) The presentation device according to (9), wherein the control unit controls an operation of the drive unit to move the presentation unit, which has reached a temperature corresponding to the hot / cold stimulus, to the second position.(11) The presentation device according to (9) or (10), wherein, when an instruction to present the hot / cold stimulus to the user has not been given, the control unit controls the operation of the drive unit and the heat transfer unit so that the temperature of the thermal buffer unit is within a predetermined range. (12) The presentation device according to any one of (1) to (11), wherein the thermal buffer unit constitutes at least a part of a housing of the presentation device. (13) The presentation device according to any one of (1) to (12), further comprising an air-cooling unit that cools the thermal buffer unit by blowing air. (14) The presentation device according to (13), further comprising a control unit that controls the operation of the air-cooling unit, and the control unit controls the operation of the air-cooling unit based on the temperature of the thermal buffer unit. (15) A method for presenting a warm / cold stimulus, comprising: moving a presentation unit that presents a warm / cold stimulus to a user to a first position where heat can be transferred to a thermal buffer unit; transferring heat from the presentation unit to the thermal buffer unit so that the temperature of the presentation unit becomes a temperature corresponding to the warm / cold stimulus; and moving the presentation unit, which has reached a temperature corresponding to the warm / cold stimulus, to a second position where the warm / cold stimulus can be presented to the user.

[0110] 100, 200 Presentation device 110, 210 Presentation unit 111 Sensing unit 120, 220 Heat transfer unit 121, 122 Adhesive sheet 130, 230 Movable unit 140, 240 Drive unit 150, 250 Heat buffer unit 151, 251 Heat conduction sheet 152 Sheet member 160 Upper housing 260 Housing 270 Spring unit 280 Air cooling unit 1 Information processing system 10 Control unit 300 Display device 400 Information processing device

Claims

1. A presentation device comprising: a presentation unit that presents a hot and cold stimulus to a user; a thermal buffer unit that transfers heat between the presentation unit and the thermal buffer unit; and a drive unit that moves the presentation unit to a first position where heat can be transferred from the presentation unit to the thermal buffer unit, and to a second position where the hot and cold stimulus can be presented from the presentation unit to the user.

2. The presentation device according to claim 1, further comprising a heat transfer section that transfers heat from the presentation section to the thermal buffer section.

3. The presentation device according to claim 2, wherein the heat transfer unit is a Peltier element.

4. The presentation device according to claim 2, further comprising a movable part having the presentation part and the thermal transfer part on one side and moved by the drive part, wherein when the presentation part is in the first position, the movable part is thermally connected to the thermal buffer part on the other side different from the one side.

5. The presentation device according to claim 4, wherein when the presentation unit is in the first position, the heat transfer unit transfers heat from the presentation unit to the thermal buffer unit via the movable unit.

6. The presentation device according to claim 4, wherein when the presentation unit is in the second position, the presentation unit protrudes from a housing of the presentation device so as to be in contact with the body of the user.

7. The presentation device according to claim 4, wherein the movable part is moved in a linear direction or a swinging direction by the drive part.

8. The presentation device according to claim 4, further comprising a sheet member that thermally connects the movable portion and the thermal buffer portion.

9. A presentation device as described in claim 2, further comprising a control unit that controls the operation of the drive unit and the heat transfer unit, wherein when an instruction is given to present the hot / cold stimulus to the user, the control unit controls the operation of the heat transfer unit so that the temperature of the presentation unit located at the first position becomes a temperature corresponding to the hot / cold stimulus.

10. The presentation device according to claim 9, wherein the control unit controls the operation of the drive unit so as to move the presentation unit, which has reached a temperature corresponding to the hot / cold stimulus, to the second position.

11. A presentation device as described in claim 9, wherein, when the presentation of the hot or cold stimulus to the user is not instructed, the control unit controls the operation of the drive unit and the heat transfer unit so that the temperature of the thermal buffer unit is within a predetermined range.

12. The presentation device according to claim 1, wherein the thermal buffer unit forms at least a part of the housing of the presentation device.

13. The presentation device according to claim 1, further comprising an air cooling unit that cools the thermal buffer unit by blowing air.

14. The presentation device according to claim 13, further comprising a control unit that controls the operation of the air cooling unit, wherein the control unit controls the operation of the pre-air cooling unit based on the temperature of the thermal buffer unit.

15. A method for presenting a warm / cold stimulus, comprising: moving a presentation unit that presents a warm / cold stimulus to a user to a first position where heat can be transferred to a thermal buffer unit; transferring heat from the presentation unit to the thermal buffer unit so that the temperature of the presentation unit reaches a temperature corresponding to the warm / cold stimulus; and moving the presentation unit, which has reached a temperature corresponding to the warm / cold stimulus, to a second position where the warm / cold stimulus can be presented to the user.

Images