Printed circuit board quality inspection method, system and device

Abstract

The present application is applicable to the technical field of printed circuit board quality inspection, and particularly relates to a printed circuit board quality inspection method, system and device. The method comprises: acquiring structural data of a printed circuit board; acquiring orientation data and position data of components on the printed circuit board; determining first performance detection information on the basis of the structural data; determining second performance detection information on the basis of the orientation data and the position data; and obtaining a printed circuit board quality inspection result on the basis of the first performance detection information and the second performance detection information. The printed circuit board quality inspection method provided by the present application can solve the problem of low inspection efficiency caused by reliance on manual inspection and proneness to human factors during printed circuit board inspection.

Description

Circuit board quality detection method, system and device TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit board quality detection, and particularly relates to a circuit board quality detection method, system and device. BACKGROUND

[0002] A circuit board is a basic electronic component used to support and connect electronic components, and can provide a conductive path. The circuit board is usually made of a thin sheet of insulating material, which is covered with one or more layers of conductive copper foil, and has circuit connection designs printed thereon. Traditional circuit board quality detection usually relies on manual operation, such as visual inspection and manual measurement to determine whether there are defects or damage, and is thus easily affected by human factors, resulting in low detection efficiency. SUMMARY

[0003] The application provides a circuit board quality detection method, system and device, which can solve the problem that manual detection of the circuit board is relied on in the circuit board detection process, and thus is easily affected by human factors, resulting in low detection efficiency.

[0004] In a first aspect, the application provides a circuit board quality detection method, which comprises: acquiring structure data of a circuit board; wherein the structure data is used to reflect the connection state of a welding point of the circuit board and the defect condition of a surface of the circuit board; acquiring direction data and position data of components on the circuit board; wherein the direction data is used to reflect the positive and negative pole orientation of polar components, and the position data comprises position distribution data of the components on the circuit board; determining first performance detection information according to the structure data;

[0005] determining second performance detection information according to the direction data and the position data;

[0006] obtaining a circuit board quality detection result according to the first performance detection information and the second performance detection information.

[0007] The technical solution described above in the application has at least the following technical effects:

[0008] The circuit board quality detection method provided in the application first obtains structure data including the connection state of the circuit board welding point and the defect condition of the circuit board surface, so that the basic condition of the circuit board (such as whether there is oil stain on the circuit board) can be obtained without relying on manual work, the labor cost and time cost can be reduced, the influence of human factors is also reduced, and the detection accuracy is improved. Secondly, the direction data including the positive and negative pole orientation of the polar component and the position distribution data of the component on the circuit board are obtained, so that the positive and negative pole orientation of the polar component can be accurately determined, and the problem area on the circuit board that may exist can be quickly located, thereby the quality problem can be found in time in the subsequent process, and the detection accuracy is improved. Then, the first performance detection information is determined according to the structure data, so that the problem of the circuit board can be analyzed, for example, the structure data such as the connection state of the welding point and the crack inside the circuit board can be analyzed to obtain the problem such as poor welding quality or unqualified circuit board quality, so that the problem can be found and corrected in time, the detection efficiency is improved, the circuit board is ensured to meet the requirements in the basic function, and the detection accuracy is improved. Then, the second performance detection information is determined according to the direction data and the position data, so that the quality of the component on the circuit board can be evaluated, for example, the information such as the position offset, rotation angle and spacing of the component can be analyzed to find out whether the component is offset and whether the component is missing, so that the problem can be found and corrected in time, and the detection efficiency is improved. Finally, the circuit board quality detection result is obtained according to the first performance detection information and the second performance detection information, so that the multiple performance indexes of the circuit board can be comprehensively evaluated, which is helpful to comprehensively understand the quality condition of the circuit board, including its reliability, stability and resistance, and is helpful to improve the detection efficiency.

[0009] In a second aspect, the embodiments of the application provide a circuit board quality detection system, comprising: a first acquisition unit configured to acquire the structure data of a circuit board; wherein the structure data is used to reflect the connection state of the welding point of the circuit board and the defect condition of the surface of the circuit board;

[0010] a second acquisition unit configured to acquire the direction data and the position data of the component on the circuit board; wherein the direction data is used to reflect the positive and negative pole orientation of the polar component, and the position data comprises the position distribution data of the component on the circuit board;

[0011] a first processing unit configured to determine the first performance detection information according to the structure data;

[0012] a second processing unit configured to determine the second performance detection information according to the direction data and the position data;

[0013] The management unit is configured to obtain a circuit board quality detection result according to the first performance detection information and the second performance detection information.

[0014] In a third aspect, the embodiments of the present application provide a circuit board quality detection device, comprising a circuit board quality detection apparatus and a control apparatus electrically connected to the circuit board quality detection apparatus. The control apparatus comprises a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the circuit board quality detection method in any one of the first aspect is implemented.

[0015] It can be understood that the beneficial effects of the second aspect to the third aspect can be referred to the related description in the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0017] FIG. 1 is a flowchart of the circuit board quality detection method provided by the embodiments;

[0018] FIG. 2 is a flowchart of the implementation of step S200 in the circuit board quality detection method provided by the embodiments;

[0019] FIG. 3 is a flowchart of the implementation of step S230 in the circuit board quality detection method provided by the embodiments;

[0020] FIG. 4 is a flowchart of the implementation of step S300 in the circuit board quality detection method provided by the embodiments;

[0021] FIG. 5 is a flowchart of the implementation of step S300 in the circuit board quality detection method provided by the embodiments;

[0022] FIG. 6 is a flowchart of the implementation of step S500 in the circuit board quality detection method provided by the embodiments;

[0023] FIG. 7 is a flowchart of the implementation of step S500 in the circuit board quality detection method provided by the embodiments;

[0024] FIG. 8 is a flowchart of the implementation of step S500 in the circuit board quality detection method provided by the embodiments;

[0025] FIG. 9 is a structural diagram of the circuit board quality detection system provided by the embodiments;

[0026] Fig. 10 provides a schematic diagram of a control device of a circuit board quality detection device. DETAILED DESCRIPTION

[0027] To better understand the circuit board quality detection method provided by the embodiments of the present application, the specific implementation process of the circuit board quality detection method provided by the embodiments of the present application will be exemplarily introduced below.

[0028] Fig. 1 shows a schematic flowchart of the circuit board quality detection method provided by the embodiments of the present application, which comprises:

[0029] S100, obtaining structure data of the circuit board. The structure data is used to reflect the connection state of the soldering points of the circuit board and the defect condition of the surface of the circuit board.

[0030] The optical camera (such as a high-resolution camera or a microscope) of the AOI detection device can be used to take pictures of the circuit board. Through image processing and analysis technology, the structure information of the circuit board can be extracted, including the connection state of the soldering points and the defect condition of the surface of the circuit board. For example, the quality of the soldering connection can be evaluated by detecting the shape of the solder pad, the position of the soldering point, etc., and the defects on the surface of the circuit board, such as scratches, oxidation, and depressions, can be detected by visual detection technology.

[0031] By obtaining the structure data including the connection state of the soldering points of the circuit board and the defect condition of the surface of the circuit board, the basic condition of the circuit board (such as whether there is oil stain on the circuit board) can be obtained without relying on manual work, which can reduce the labor cost and time cost, and also reduce the influence of human factors, thereby helping to improve the accuracy of detection.

[0032] S200, obtaining direction data and position data of the components on the circuit board. The direction data is used to reflect the positive and negative pole orientation of the polar components, and the position data includes the position distribution data of the components on the circuit board.

[0033] The optical camera of the AOI detection device can be used to take pictures of the circuit board. Through image processing and analysis technology, the direction data and position data of the components can be extracted. For example, by detecting the markings, pin shapes or other characteristic information of the components, the positive and negative pole orientation of the polar components can be determined, and the position distribution data of the components on the circuit board can be obtained.

[0034] By obtaining the direction data including the positive and negative pole orientation of the polar components and the position distribution data of the components on the circuit board, the positive and negative pole orientation of the polar components can be accurately determined, and it is helpful to quickly locate the possible problem areas on the circuit board, thereby helping to timely find quality problems in the subsequent process, so as to improve the accuracy of detection.

[0035] In a possible implementation, referring to FIG. 2, S200, the direction data and the position data of the components on the circuit board are acquired, including: S210, detecting a first operation of an operator. The first operation is used to instruct the circuit board quality detection device to perform component quality detection on the first circuit board. The component quality detection refers to detecting the quality of the components on the circuit board.

[0036] A detection device is arranged in the control device, which is used to detect a first operation of an operator on the display interface of the control device. The first operation can be clicking or touching the display interface, or can be completed by the user through buttons, sliders, text input boxes or other interactive elements on the display interface.

[0037] By detecting the first operation of the operator, a key control point can be ensured, which ensures that the operator has made corresponding preparation work before the circuit board quality detection, so as to ensure that the quality detection device operates according to the parameters set by the operator, which helps to ensure the stability of the subsequent detection process, and further improves the detection efficiency.

[0038] S220, determining whether the component quality detection on the second circuit board is being performed at present. The second circuit board is the circuit board on which the surface defect detection is completed.

[0039] A real-time monitoring function can be arranged on the circuit board quality detection device, which is used to confirm whether the component quality detection on the second circuit board is being performed at present. The detection progress of the circuit board quality detection device or the detection record of the monitoring function can be viewed through the control device, or the detection time and sequence can be viewed to determine whether the component quality detection on the second circuit board is being performed at present.

[0040] By determining whether the component quality detection on the second circuit board is being performed at present, the detection sequence or the priority of the detection can be understood, which helps to reasonably utilize the detection resources and improve the quality detection process, thereby improving the detection efficiency.

[0041] S230, in the case that the component quality detection on the second circuit board is being performed, determining whether the first circuit board is a primary detection circuit board.

[0042] In the quality detection process, a unique identifier or serial number is assigned to each tested circuit board, and their detection order is recorded. By checking the recorded detection order, it can be determined whether the second circuit board is currently being detected. In the case of determining that the second circuit board is currently being detected for component quality, it is determined whether the first circuit board is a primary detection circuit board. The primary detection circuit board can be a circuit board that needs to be rechecked according to the special requirements of the product or the needs of the operator (preferential detection of circuit boards with key functions or carrying important components), and the quality of the circuit board is detected, for example, the circuit board required by the operator is preferentially detected.

[0043] In the case of the second circuit board being detected for component quality, it is determined whether the first circuit board is a primary detection circuit board, which can more targetedly put the quality detection resources into the detection of the primary detection circuit board, ensure that its quality meets the requirements, and help improve the detection efficiency.

[0044] In a possible implementation, please refer to FIG. 3, S230, in the case of the second circuit board being detected for component quality, it is determined whether the first circuit board is a primary detection circuit board, including: S231, obtaining the detection stage data of the first circuit board to determine whether the first circuit board is in a detectable and assembled state. Wherein, the assembled state is used to indicate that the components on the circuit board have been correctly installed and connected.

[0045] Exemplarily, a sensor (for example, a position sensor can detect the position or stage of the circuit board in the detection process, such as the position sensor can be installed on the circuit board quality detection device or the detection pipeline, so as to monitor the position change of the circuit board in real time, by recording the position information of the circuit board, the detection stage of the circuit board can be determined) can be arranged to monitor which stage of the first circuit board in the detection process is in. The detection stage data obtained by the sensor can reflect which stage of the first circuit board in the detection process, so as to determine whether it is in a detectable state. For example, the first circuit board can be detected by the AOI detection device, but not detected by the X-ray detection device, or it can be detected by the AOI detection device and the function test device, but not detected by the X-ray detection device, so as to determine that the first circuit board needs to be detected by the X-ray detection device, that is, the first circuit board is in a detectable state. For another example, when the detection stage data reflects that the first circuit board is in a to-be-detected position (for example, a specific test signal can be sent to the test point on the first circuit board, and it is verified whether the expected response signal can be correctly received to determine whether the circuit board is in a detectable state), the high-definition camera and / or image technology are used to scan the components on the circuit board to confirm whether they are correctly installed and connected, for example, the visual detection technology is used to identify the components by image, check their position, orientation and welding state, to determine whether the components on the circuit board are correctly installed and connected, and then determine whether the circuit board is in an assembled state.

[0046] By obtaining the detection stage data of the first circuit board, it can be determined whether the first circuit board is in a detectable and assembled state, so as to avoid detecting the first circuit board which does not meet the conditions, thereby saving the resources and time required for detection.

[0047] S232, in the case that the first circuit board is in a detectable and assembled state, the first circuit board is determined as a primary detection circuit board. In the case that the first circuit board is in an undetectable and / or unassembled state, the first circuit board is determined as a non-primary detection circuit board.

[0048] A judgment rule can be made, in the case that the first circuit board is in a detectable and assembled state, the first circuit board is determined as a primary detection circuit board. In the case that the first circuit board is in an undetectable and unassembled state, the first circuit board is determined as a non-primary detection circuit board. In the case that the first circuit board is in an undetectable and assembled state, the first circuit board is determined as a non-primary detection circuit board. In the case that the first circuit board is in a detectable and unassembled state, the first circuit board is determined as a non-primary detection circuit board.

[0049] The first circuit board to be detected is focused on the first circuit board meeting the detectable and assembled state, which can quickly detect and confirm the quality status, improve the efficiency of quality detection, and reduce unnecessary waiting time.

[0050] In a possible implementation, after determining whether the first circuit board is the first circuit board to be detected in the case that the second circuit board is being detected in the component quality detection in step S230, the circuit board quality detection method further includes:

[0051] S233, when it is determined that the first circuit board is the non-first circuit board to be detected, the first circuit board is placed in the detection process of waiting for detection, and the component quality detection of the second circuit board by the circuit board quality detection device is continued to obtain the orientation data and the position data of the second circuit board.

[0052] A flag or a label can be set to identify the first circuit board, which can be completed by an automatic identification system or a manual operation method. Once the first circuit board is identified as the non-first circuit board to be detected, it is moved to the detection process of waiting for detection, for example, the first circuit board can be placed in a waiting area, or the detection flow is adjusted. While moving the first circuit board to the waiting area, it is ensured that the circuit board quality detection device can continue to perform the component quality detection of the second circuit board to obtain the orientation data and the position data of the second circuit board.

[0053] When it is determined that the first circuit board is the non-first circuit board to be detected, the first circuit board is placed in the detection process of waiting for detection, and the component quality detection of the second circuit board by the circuit board quality detection device is continued to obtain the orientation data and the position data of the second circuit board, which can flexibly adjust the detection plan and the sequence, and according to whether the first circuit board is the first circuit board to be detected, it can be determined whether the second circuit board needs to be further operated or adjusted in priority, which is beneficial to save the resources and time required for detection, so that the resources can be concentrated on the circuit board that really needs to be detected, and the accuracy and reliability of quality detection are improved.

[0054] S240, in response to the first operation, when it is determined that the first circuit board is the first circuit board to be detected, the detection of the second circuit board is cancelled, and the component quality detection of the first circuit board by the circuit board quality detection device is controlled to obtain the orientation data and the position data of the first circuit board.

[0055] The judgment rule or instruction can be set to automatically execute the first operation when it is determined that the first circuit board is the primary detection circuit board, or the first operation is executed by manually clicking or touching the interactive interface of the circuit board quality detection device, that is, the detection of the second circuit board is cancelled, and the circuit board quality detection device is controlled to perform component quality detection on the first circuit board. For example, the first operation can be realized by the operator through the display interface, interactive interface, control panel or remote control software on the control device, so as to ensure that the circuit board quality detection device performs component quality detection on the first circuit board according to the parameters or mode set by the first operation.

[0056] In response to the first operation, when it is determined that the first circuit board is the primary detection circuit board, the detection of the second circuit board is cancelled, and the circuit board quality detection device is controlled to perform component quality detection on the first circuit board to obtain orientation data and position data of the first circuit board. The focus of quality detection can be concentrated on the primary detection circuit board, so that the circuit board quality detection device can more focusedly perform component quality detection, improve the accuracy and reliability of detection, and further improve the detection efficiency.

[0057] S300, determining first performance detection information according to the structure data.

[0058] By analyzing the connection state of the welding point, such as the pad shape, welding point position and spacing, etc., first performance detection information can be obtained (for example, if the pad shape is irregular, deformed or incomplete, it indicates that the welding has a problem, such as poor welding or welding defects. If the welding point position deviates from the expected position or the welding point spacing is uneven, it indicates that there is a welding deviation or error), for example, the first performance detection information can be to evaluate the quality of the welding connection. It can also reflect the connection between each circuit on the circuit board. By analyzing the structure information of the circuit board, such as the circuit layout and connection mode, the connectivity of the circuit can be determined to determine the first performance detection information, for example, the first performance detection information can be to evaluate whether there is an open circuit, short circuit or other connection abnormality on the circuit board. The surface defects, scratches, oxidation, etc. of the structure information of the circuit board can also be analyzed to determine the influence of these defects on the performance of the circuit board, for example, if there is pollution on the surface of the circuit board, it is determined whether the pollution has an impact on the circuit board, such as after wiping the pollution, the performance of the circuit board is not affected.

[0059] According to the structure data, the first performance detection information can be determined, which can analyze the problems of the circuit board, such as by analyzing the connection state of the welding point and the structure data such as cracks inside the circuit board, the quality of the welding or the quality of the circuit board can be determined to be poor or unqualified, which helps to discover and correct problems in time, thereby improving the detection efficiency, ensuring that the circuit board meets the requirements in basic functions, and helping to improve the accuracy of detection.

[0060] In a possible implementation, referring to FIG. 4, S300, the first performance detection information is determined according to the structure data, including:

[0061] S310, performance evaluation indexes of each region within a preset region range on the circuit board are determined according to the structure data and preset experience data. The experience data includes performance data of different regions of the circuit board detected in a past period, and the performance data includes at least one of position data and component data of the soldering abnormality of the circuit board, and the component data includes data of component size and data of whether the component is missing.

[0062] The past period can be one month or one year in the past, or a period from before the quality detection of the circuit board is started to after the quality detection of the circuit board is completed. Each day of the past period can be a holiday or a workday, and the holiday includes, for example, Saturday, Sunday and other holiday dates, and the workday includes, for example, Monday to Friday. The performance data of different regions of the circuit board detected in the past period can be obtained from a memory of the control device. According to the experience data, the number of abnormalities of each region where the soldering abnormality, the component missing or the component size mismatch of the circuit board occurs is determined, and then combined with the connection state of the soldering points and the defect condition of the surface of the circuit board reflected by the structure data, a corresponding performance evaluation index can be assigned to each region. For example, according to the experience data, it is determined that the number of soldering abnormalities in the A region of the A circuit board is 10, and the number of times of the defect of the surface of the circuit board in the structure data is 8, and the performance evaluation index is 18. The number of soldering abnormalities in the A region of the B circuit board is 2, and the number of times of the defect of the surface of the circuit board in the structure data is 1, and the performance evaluation index is 3, which indicates that the A region of the B circuit board is less likely to have problems than the A region of the A circuit board, and the A region of the A circuit board has a higher probability of abnormality and needs to be paid more attention to.

[0063] According to the structure data and the preset experience data, the performance evaluation indexes of each region within the preset region range on the circuit board are determined, which can help to understand which region is more likely to have problems and help to develop targeted detection improvement measures.

[0064] S320, when the power consumption of the circuit board is within a preset power consumption range and the performance evaluation index of the current region of the circuit board is higher than a first preset value, a first control instruction is generated. The first control instruction is used to instruct the circuit board quality detection device to recheck the connection state of the soldering points and the defect condition of the surface of the circuit board.

[0065] The power consumption of the circuit board can be monitored by the functional test device to determine whether the power consumption of the circuit board is within a preset power consumption range. When it is detected that the power consumption of the circuit board is within the preset power consumption range and the performance evaluation index of the current area of the circuit board is higher than the first preset value, it indicates that the power consumption of the circuit board in the normal operation state meets the expectation, but the probability of abnormality of the current area of the circuit board is high. Therefore, this situation can be caused by the failure of the functional test device, calibration problem or algorithm error, which leads to the error or false detection of the functional test device on the circuit board, so that the power consumption of the circuit board is detected within the preset power consumption range, but the probability of failure of the current area of the circuit board is high. Therefore, the first control instruction is generated to recheck the circuit board.

[0066] When it is detected that the power consumption of the circuit board is within the preset power consumption range and the performance evaluation index of the current area of the circuit board is higher than the first preset value, the first control instruction is generated, which can early discover potential defects or problems in the circuit board to improve the detection efficiency.

[0067] S330, based on the first control instruction, the connection state of the welding point of the circuit board is rechecked by the circuit board quality detection device, and the defect condition of the surface of the circuit board is rechecked to determine the first performance detection information.

[0068] Firstly, the quality detection device needs to analyze the first control instruction and perform corresponding operations. The first control instruction can include a command instructing the detection device to start the rechecking operation and related parameters. Secondly, according to the control instruction, the quality detection device rechecks the connection state of the welding point on the circuit board and rechecks the defect condition of the surface of the circuit board to determine the first performance detection information.

[0069] Based on the first control instruction, the connection state of the welding point of the circuit board is rechecked by the circuit board quality detection device, and the defect condition of the surface of the circuit board is rechecked to determine the first performance detection information, which can early discover potential defects or problems in the circuit board to improve the detection efficiency.

[0070] In one possible implementation, please refer to FIG. 5, S300, determining the first performance detection information according to the structure data further includes:

[0071] S340, the first control instruction is continuously sent to the circuit board quality detection device within a preset first time period.

[0072] A loop timer or timing task can be set to continuously send the first control instruction to the circuit board quality detection device at a fixed time interval within the preset first time period.

[0073] The first control instruction is sent to the circuit board quality detection device for a preset first time period, so that the circuit board quality detection device can receive the first control instruction and execute the parameters and settings of the first control instruction within the preset time period, thereby helping to ensure the accuracy and reliability of the detection.

[0074] S350, if the detection response of the connection state re-inspection of the welding point and the defect condition re-inspection of the surface of the circuit board fed back by the circuit board quality detection device is not obtained within a preset second time period, and it is detected that the circuit board quality detection device is detecting other circuit boards, a second control instruction is generated. The second control instruction is used to instruct the circuit board quality detection device to terminate the detection of the next other circuit board after completing the detection of the current other circuit board, and to start the connection state re-inspection of the welding point and the defect condition re-inspection of the surface of the circuit board of the circuit board to be re-inspected.

[0075] The detection response of the connection state re-inspection of the welding point and the defect condition re-inspection of the surface of the circuit board fed back by the circuit board quality detection device is continuously monitored within a preset second time period. If the detection response fed back by the circuit board quality detection device is not obtained within the preset second time period, and it is detected that the circuit board quality detection device is detecting other circuit boards (for example, the circuit board quality detection device is executing the operation of detecting other circuit boards, without executing the first control instruction), a second control instruction is generated.

[0076] If the detection response of the connection state re-inspection of the welding point and the defect condition re-inspection of the surface of the circuit board fed back by the circuit board quality detection device is not obtained within a preset second time period, and it is detected that the circuit board quality detection device is detecting other circuit boards, a second control instruction is generated. The focus of quality detection is concentrated on the re-inspected circuit board, so that the circuit board quality detection device can more focusedly perform re-inspection, improve the accuracy and reliability of detection, and thereby improve the detection efficiency.

[0077] S360, based on the second control instruction, the circuit board quality detection device is controlled to perform the connection state re-inspection of the welding point and the defect condition re-inspection of the surface of the circuit board on the circuit board to determine the first performance detection information.

[0078] Firstly, the quality detection device needs to analyze the second control instruction and execute the corresponding operation. The second control instruction can include a command instructing the detection device to start the re-inspection operation and related parameters. Secondly, according to the control instruction, the quality detection device will perform the connection state re-inspection of the welding point and the defect condition re-inspection of the surface of the circuit board on the circuit board to determine the first performance detection information.

[0079] Based on the second control instruction, the circuit board quality detection device performs re-inspection on the connection state of the soldering points of the circuit board and the defect situation of the surface of the circuit board, to determine the first performance detection information, so as to find potential defects or problems in the circuit board as early as possible, and improve the detection efficiency.

[0080] In a possible implementation, S310, the performance evaluation index of each region within the preset region range on the circuit board is determined according to the structure data and the preset experience data, including:

[0081] S301, input the structure data into a preset prediction model to obtain a performance evaluation index of each region within a preset region range on the circuit board output by the prediction model. The prediction model is trained by experience data.

[0082] First, collect samples of structure data, collect samples of performance data of different regions of the circuit board detected in the past period in the experience data, and collect samples of the performance evaluation index of each region within the preset region range on the circuit board. Then, train the model with these data to obtain a prediction model, which can select machine learning algorithms such as linear regression, decision tree, neural network, etc. to train the model. Finally, input the current structure data into the trained prediction model, and the model will output the performance evaluation index of each region within the preset region range on the circuit board.

[0083] Input the structure data into a preset prediction model to obtain a performance evaluation index of each region within a preset region range on the circuit board output by the prediction model, which can accurately predict the region of the circuit board prone to problems, and help improve the accuracy and reliability of detection, and thus improve the detection efficiency.

[0084] S400, determine second performance detection information according to direction data and position data.

[0085] By analyzing the direction data and the position data, the quality of the components can be obtained to obtain the second performance detection information (for example, the position data of the components can be analyzed to compare the difference between the actual position and the expected position to evaluate the positioning accuracy of the components, and the higher the positioning accuracy, the better the installation quality of the components). For example, the second performance detection information can be information evaluating whether the components are oriented in the correct direction, or information evaluating whether the components are located in the expected position, or information evaluating the connection relationship between the components on the circuit board to determine the topology of the circuit, and thus evaluate the connectivity and correctness of the circuit.

[0086] According to the direction data and the position data, the second performance detection information is determined, the quality of the components on the circuit board can be evaluated, for example, the position offset, rotation angle, spacing and other information of the components are analyzed, whether the components are offset or missing can be found, which helps to find and correct problems in time, thereby improving the detection efficiency.

[0087] S500, according to the first performance detection information and the second performance detection information, the circuit board quality detection result is obtained.

[0088] The first performance detection information can include whether there is an open circuit, short circuit or other connection abnormality on the circuit board, or whether there is a defect, scratch, oxidation and the like on the circuit board. The second performance detection information can include whether the components are in the correct direction, or whether the components are in the expected position. The first performance detection information and the second performance detection information are comprehensively evaluated, which can be realized by formulating a set of evaluation criteria or standards. For example, a weight can be assigned to each performance index and detection item, and then the detection results are weighted and summed according to the weight to obtain a comprehensive score. According to the result of comprehensive evaluation, the circuit board quality detection result is obtained. For example, if the electrical performance of the circuit board is good and the assembly quality meets the requirements, the result of good circuit board quality can be obtained.

[0089] According to the first performance detection information and the second performance detection information, the circuit board quality detection result is obtained, which can comprehensively evaluate multiple performance indicators of the circuit board, which helps to fully understand the quality of the circuit board, including its reliability, stability, tolerance and the like, and helps to improve the detection efficiency.

[0090] In one possible implementation, please refer to FIG. 6, S500, according to the first performance detection information and the second performance detection information, the circuit board quality detection result is obtained, including:

[0091] S501, based on the first performance detection information and the second performance detection information, the circuit board electrical simulation is performed to obtain electrical data. The electrical data includes power consumption generated in the simulation conduction process.

[0092] An electrical simulation model of the circuit board can be established, which can be implemented using circuit simulation tools or software, such as SPICE software. In the electrical simulation model, simulation parameters are set, including power supply voltage, load conditions, working conditions, etc. These parameters should be set according to actual conditions and requirements to accurately simulate the electrical behavior of the circuit board under different working conditions. The first performance detection information and the second performance detection information are input, and the electrical behavior of the circuit board is simulated. Through simulation, electrical data such as power consumption generated by the circuit board during the simulation process can be obtained. For example, the electrical data can be the current, voltage, power consumption, etc. information of the circuit board at different nodes or components.

[0093] Based on the first performance detection information and the second performance detection information, the electrical simulation of the circuit board is performed to obtain electrical data, which can obtain the power consumption data generated by the circuit board during the simulation process, which can help to evaluate the energy consumption of the circuit board.

[0094] S502, when the power consumption in the electrical data is the first power consumption, obtaining first data information corresponding to the first power consumption. The first data information includes the first resistance value and the first signal transmission information of the circuit board in the simulation process.

[0095] During the simulation process, when the power consumption in the electrical data is the first power consumption, the first resistance value of the circuit board is recorded, which can be obtained through the tools provided by the simulation software or directly observed in the simulation results. At the same time, the first signal transmission information of the circuit board is recorded, which can include the transmission rate, transmission distance, transmission quality, etc. information of the signal.

[0096] When the power consumption in the electrical data is the first power consumption, the first data information corresponding to the first power consumption is obtained, which is helpful for subsequent discovery of problems in the circuit board, and thus improves the detection efficiency.

[0097] S503, inputting the first resistance value into a preset resistance discrimination model, and judging the first resistance value by the resistance discrimination model to output a first discrimination result corresponding to the first resistance value. The first discrimination result is used to reflect the first electrical performance of the circuit board in the simulation process.

[0098] First, resistance value samples and corresponding discrimination result samples can be collected, and these samples can be used to train a model, which can be a machine learning-based model. Then, the first resistance value is input into the trained resistance discrimination model to obtain the first discrimination result corresponding to the first resistance value. For example, the first electrical performance condition can be the resistance value change of the circuit board under different temperature conditions and the stability performance during temperature change. It can also be the linear or nonlinear relationship of the resistance value of the circuit board with the change of current or voltage, and the performance under different working conditions. It can also be the resistance value change of the circuit board under different frequencies and the response characteristics to frequency change.

[0099] The first resistance value is input into the preset resistance discrimination model, and the first discrimination result corresponding to the first resistance value is output by the resistance discrimination model, which reduces the subjectivity and possible errors of manual judgment and is beneficial to improve the detection efficiency.

[0100] S504, when the first discrimination result indicates that the first resistance value is a stable resistance, and the first signal transmission information indicates that the signal transmission type caused by the current reaching the first resistance value during the circuit board test is a preset first type, a first option box is displayed on the circuit board quality detection device. Wherein, the first type is used to reflect the signal transmission situation that one signal in the circuit board interferes with another signal, and the first option box displays the circuit board cleaning reminder information corresponding to the first resistance value and the first type.

[0101] The judgment logic of the resistance value is defined, such as whether the resistance value is stable or fluctuating. The judgment condition of the signal transmission type is defined, for example, the signal transmission type caused by the current reaching the first resistance value during the circuit board test is a preset first type. According to the judgment logic of the first resistance value and the signal transmission type, it is determined whether the stable resistance and the preset first type condition are met. If the condition is met, a first option box is displayed on the display interface of the circuit board quality detection device, and the circuit board cleaning reminder information corresponding to the first resistance value and the first type is displayed in the option box. The first option box can provide user interaction functions such as confirming the cleaning reminder, setting the reminder frequency, etc.

[0102] When the first discrimination result indicates that the first resistance value is a stable resistance, and the first signal transmission information indicates that the signal transmission type caused by the current reaching the first resistance value during the circuit board test is a preset first type, a first option box is displayed on the circuit board quality detection device, which helps the operator to understand and handle the problem of the circuit board in time, and to take appropriate measures for cleaning and maintenance, so as to improve the reliability and stability of the circuit board.

[0103] S505, in response to the first operation on the first option box, obtaining first operation data. Wherein, the first operation data is used to indicate that the re-inspection is performed after the cleaning of the circuit board.

[0104] In the circuit board quality detection device, a response logic is provided to capture the first operation on the first option box, which can be clicking or touching the touch screen, button or other user interface elements. When the user performs the first operation, the circuit board quality detection device should capture the relevant data, which can include operation time, operation type, state before and after cleaning of the circuit board, and other information. The captured first operation data is stored in the memory, and the re-inspection process is triggered according to the first operation data.

[0105] In response to the first operation on the first option box, the first operation data is obtained, which can verify whether the cleaned circuit board meets the predetermined quality standard, reduces the problem of abandoning the use due to slight pollution, and is beneficial to save cost.

[0106] S506, based on the first operation data, obtaining the first result in the circuit board quality detection result.

[0107] Firstly, the quality detection device needs to analyze the first operation data and perform corresponding operations, and the first operation data can include commands and related parameters indicating that the detection device starts the re-inspection operation. Secondly, according to the first operation data, the quality detection device will re-inspect the circuit board after cleaning to obtain the first result in the circuit board quality detection result.

[0108] Based on the first operation data, the first result in the circuit board quality detection result is obtained, which can timely find the quality problem in the circuit board, and is beneficial to improve the detection efficiency.

[0109] In one possible implementation, please refer to FIG. 7, S500, according to the first performance detection information and the second performance detection information, obtaining the circuit board quality detection result, further comprising: S510, when the power consumption in the electrical data is the second power consumption, obtaining the second data information corresponding to the second power consumption. Wherein, the second data information includes the second resistance value and the second signal transmission information of the circuit board in the simulation conduction process.

[0110] In the simulation process, when the power consumption in the electrical data is the second power consumption, the second resistance value of the circuit board is recorded, which can be obtained through the tool provided by the simulation software or directly observed in the simulation result. The second signal transmission information of the circuit board is recorded, which includes the transmission rate, transmission distance, transmission quality and other information of the signal.

[0111] When the power consumption in the electrical data is the second power consumption, the second data information corresponding to the second power consumption is obtained, which is helpful to find the problem in the circuit board subsequently, and further improves the detection efficiency.

[0112] S520, input the second resistance value into the resistance discrimination model, judge the second resistance value by the resistance discrimination model, and output a second discrimination result corresponding to the second resistance value. The second discrimination result is used to reflect the second electrical performance of the circuit board in the simulation conduction process.

[0113] The second resistance value is input into the trained resistance discrimination model to obtain a second discrimination result corresponding to the second resistance value. For example, the second electrical performance can be the resistance value change of the circuit board under different temperature conditions, and the stability performance in the temperature change process. It can also be the linear or nonlinear relationship of the resistance value of the circuit board with the change of current or voltage, and the performance under different working conditions. It can also be the resistance value change of the circuit board under different frequencies, and the response characteristics to frequency change.

[0114] The second resistance value is input into the resistance discrimination model, and the second discrimination result corresponding to the second resistance value is output by the resistance discrimination model, which reduces the subjectivity and possible errors of manual judgment, and is beneficial to improve the detection efficiency.

[0115] S530, when the second discrimination result indicates that the second resistance value is a variable resistance, and the second signal transmission information indicates that the signal transmission type caused by the current reaching the second resistance value during the circuit board test is a preset second type, a second option box is displayed on the circuit board quality detection device. The variable resistance is used to indicate that the resistance value changes with the change of the test time due to the poor contact of the welding points of the circuit board, and the second type is used to reflect the signal distortion caused by the change of the signal in the circuit board with the change of the test time. The second option box displays the second resistance value and the circuit board welding reminder information corresponding to the second type.

[0116] The judgment logic of the resistance value is defined, such as whether the resistance value is stable or fluctuating. The judgment condition of the signal transmission type is defined, such as the signal transmission type caused by the current reaching the second resistance value is a preset second type. According to the judgment logic of the second resistance value and the signal transmission type, it is determined whether the variable resistance and the preset second type are met. If the conditions are met, a second option box is displayed on the display interface of the circuit board quality detection device, and the second resistance value and the circuit board welding reminder information corresponding to the second type are displayed in the second option box. The second option box can provide user interaction functions, such as confirming the welding reminder, setting the reminder frequency, etc.

[0117] When the second discrimination result indicates that the second resistance value is a variable resistance, and the second signal transmission information indicates that the signal transmission type caused by the current reaching the second resistance value in the circuit board test is a preset second type, a second option box is displayed on the circuit board quality detection device, which helps the operator to understand and handle the problems of the circuit board in time, and take appropriate measures for welding and maintenance, so as to improve the reliability and stability of the circuit board.

[0118] S540, in response to the second operation on the second option box, obtaining second operation data. Wherein, the second operation data is used to indicate the re-inspection after the virtual solder joint of the circuit board is re-welded.

[0119] In the circuit board quality detection device, a response logic is set to capture the second operation on the second option box, which can be clicking or touching the touch screen, button or other user interface elements. When the user performs the second operation, the circuit board quality detection device should capture the relevant data, which can include operation time, operation type, state of the circuit board before and after welding and other information. The captured second operation data is stored in the memory, and according to the second operation data, the re-inspection process is triggered.

[0120] In response to the second operation on the second option box, the second operation data is obtained to verify whether the welded circuit board meets the predetermined quality standard, which reduces the problem of giving up using due to slight welding looseness, and is beneficial to save cost.

[0121] S550, based on the second operation data, obtaining a second result in the circuit board quality detection result.

[0122] Firstly, the quality detection device needs to analyze the second operation data and perform corresponding operations, and the second operation data can include commands and related parameters indicating that the detection device starts the re-inspection operation. Secondly, according to the second operation data, the quality detection device will re-inspect the circuit board after welding to obtain the second result in the circuit board quality detection result.

[0123] Based on the second operation data, the second result in the circuit board quality detection result is obtained, which can timely find the quality problems in the circuit board, and is beneficial to improve the detection efficiency.

[0124] In one possible implementation, please refer to FIG. 8, S500, according to the first performance detection information and the second performance detection information, obtaining the circuit board quality detection result, including: S561, integrating the first performance detection information and the second performance detection information to obtain physical property data. Wherein, the physical property data is used to reflect the current quality situation of the circuit board.

[0125] The required features can be extracted from the first performance detection information and the second performance detection information, and the target of feature selection is to select relevant performance indicators that can reflect the quality of the circuit board. For example, the first performance detection information can include electrical test data, signal transmission test data, etc., and the second performance detection information can include high temperature test data, corrosion test data, etc. Key features related to the quality of the circuit board are selected from the first performance detection information and the second performance detection information. These features can be material performance, circuit connection quality, durability, etc. The selected feature data is integrated together to construct physical property data, which is used for subsequent understanding of the quality of the circuit board.

[0126] By integrating the first performance detection information and the second performance detection information, the physical property data is obtained, which can comprehensively evaluate the quality of the circuit board. For example, the performance detection information alone can only provide partial quality information, while the integrated processing can comprehensively consider multiple aspects of performance indicators to more comprehensively reflect the quality of the circuit board, thereby improving the detection efficiency.

[0127] S562, obtaining real-time data of simulation conditions and detection process of the circuit board. The simulation conditions are used to reflect different environmental conditions corresponding to different test stages of the circuit board in the detection process.

[0128] Appropriate sensors can be used to measure and record various simulation conditions and environmental parameters of the circuit board during the detection process. For example, temperature sensors, humidity sensors, voltage sensors, etc. can be used to monitor the temperature, humidity and voltage conditions during the simulation process. Real-time data is recorded and stored in a database or data storage device during the simulation process.

[0129] By obtaining the real-time data of the simulation conditions and the detection process of the circuit board, the influence of the environment on the performance and function of the circuit board can be evaluated, which helps to determine the reliability and stability of the circuit board in the actual use environment, as well as the working characteristics under different temperature, humidity, voltage, etc. conditions, thereby improving the detection efficiency.

[0130] S563, performing simulation operation according to the physical property data and the current simulation conditions to obtain performance prediction data of the circuit board. When the performance prediction data reaches a threshold value, high-temperature resistance performance warning and corrosion resistance performance warning are performed, and real-time data of the current time period test process is retrieved. When the real-time data of the test process does not meet the test conditions, the test process warning is performed.

[0131] A performance simulation model of the circuit board can be established, which can be implemented by using specialized simulation software or programming languages. According to the current simulation conditions, set the corresponding environmental parameter values such as temperature, humidity, voltage, etc. These parameter values can be based on real-time sensor data or pre-set test conditions. Using the established simulation model, the current simulation conditions and the physical property data, perform simulation operation to obtain performance prediction data of the circuit board under the current conditions. These data can include changes in electrical properties, signal transmission performance, circuit connection quality, durability, etc. under specific environmental conditions. Set a threshold value for the performance prediction data. When the prediction data reaches or exceeds the threshold value, trigger an early warning. The early warning can be an alarm, a notification to the operator that the circuit board being tested under the set simulation conditions is not qualified in terms of quality (such as high temperature resistance and corrosion resistance), and retrieve real-time data of the test process in the current time period for monitoring and analysis. If the real-time data does not meet the test conditions, for example, the temperature is out of range, the voltage is abnormal, etc., the system can issue a test process warning to prompt the operator that the circuit board being tested under the set simulation conditions is not qualified in terms of electrical performance.

[0132] According to the physical property data and the current simulation conditions, perform simulation operation to obtain performance prediction data of the circuit board. When the performance prediction data reaches the threshold value, perform high-temperature resistance performance early warning and corrosion resistance performance early warning, and retrieve real-time data of the test process in the current time period. When the real-time data of the test process does not meet the test conditions, perform a test process warning to discover potential high-temperature performance, corrosion performance or electrical performance problems, thereby improving test efficiency.

[0133] S564, based on the high-temperature resistance performance early warning, the corrosion resistance performance early warning and the test process warning, obtain third performance detection information.

[0134] Firstly, the high-temperature resistance performance early warning can be analyzed, which indicates that the performance of the circuit board in a high-temperature environment has potential problems, such as insufficient thermal stability of the material or poor welding quality. Secondly, the corrosion resistance performance early warning can be analyzed, which indicates that the corrosion resistance performance of the circuit board in a corrosive medium has potential problems, such as insufficient corrosion resistance of the material or poor surface coating quality. Then, the test process warning can be analyzed, which indicates that the electrical performance of the circuit board in the simulated conditions has certain problems, such as unstable signal transmission. Finally, these data are integrated into the third performance detection information to evaluate the performance and quality status of the circuit board. For example, the high-temperature resistance performance early warning indicates that the thermal stability of the material is insufficient, the corrosion resistance performance early warning indicates that the corrosion resistance performance of the circuit board in a corrosive medium has potential problems, and the test process warning indicates that the electrical performance of the circuit board in the simulated conditions has certain problems, such as unstable signal transmission, which means that the circuit board is not qualified in terms of quality.

[0135] Based on the high-temperature resistance performance early warning, the corrosion resistance performance early warning and the test process early warning, the third performance detection information is obtained, the quality of the circuit board can be comprehensively evaluated, the quality status of the circuit board is more comprehensively reflected, and the detection efficiency is improved.

[0136] In S565, the circuit board quality detection result is obtained according to the first performance detection information, the second performance detection information and the third performance detection information.

[0137] If the first performance detection information shows that the basic performance indicators of the circuit board meet the requirements, and the second performance detection information indicates that the performance stability of the circuit board under specific conditions is good, and the third performance detection information has no early warning or abnormal situation, the detection result of the circuit board quality can be obtained.

[0138] If any one of the performance detection information shows that the circuit board has problems or abnormalities, for example, the first performance detection information shows that the basic performance does not meet the requirements, the second performance detection information shows that the performance of the circuit board under specific conditions is unstable, or the third performance detection information has early warning or abnormal situation, the detection result of the circuit board quality can be obtained.

[0139] According to the first performance detection information, the second performance detection information and the third performance detection information, the circuit board quality detection result is obtained, the multiple performance indicators of the circuit board can be comprehensively evaluated, which is helpful to comprehensively understand the quality situation of the circuit board, including its reliability, stability, resistance, etc., and is helpful to improve the detection efficiency.

[0140] It should be understood that the size of the serial number of each step in the above embodiment does not mean the order of execution, the execution order of each process should be determined according to its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0141] Corresponding to the circuit board quality detection method described in the above embodiment, the present embodiment also provides a circuit board quality detection system, each unit of the system can realize each step of the circuit board quality detection method. FIG. 9 shows a structural block diagram of a circuit board quality detection system provided by an embodiment of the present application. For ease of illustration, only the parts related to the embodiments of the present application are shown.

[0142] Referring to FIG. 9, the circuit board quality detection system comprises a first acquisition unit for acquiring structure data of the circuit board. The structure data is used to reflect the connection state of the soldering points of the circuit board and the defect situation of the surface of the circuit board.

[0143] A second acquisition unit is configured to acquire direction data and position data of components on the circuit board. The direction data is used to reflect the positive and negative polarity of the polar components, and the position data includes position distribution data of the components on the circuit board.

[0144] a first processing unit configured to determine first performance detection information according to the structure data.

[0145] a second processing unit configured to determine second performance detection information according to the direction data and the position data.

[0146] a management unit configured to obtain a quality detection result of the circuit board according to the first performance detection information and the second performance detection information.

[0147] It should be noted that the information interaction, execution process and the like between the above system / unit are based on the same concept as the method embodiments of the present application, and the specific functions and the technical effects brought by the same can be referred to the method embodiment part, which will not be described here again.

Claims

1. A method for inspecting the quality of a circuit board, characterized in that, include: Obtain the structural data of the circuit board; wherein, the structural data is used to reflect the connection status of the solder joints of the circuit board and the defects on the surface of the circuit board; Acquire orientation and position data of components on the circuit board; wherein, the orientation data is used to reflect the positive and negative orientation of polarity components, and the position data includes the position distribution data of components on the circuit board; First performance detection information is determined based on the structural data; The second performance detection information is determined based on the direction data and the position data; Based on the first performance test information and the second performance test information, the circuit board quality test results are obtained.

2. The circuit board quality inspection method as described in claim 1, characterized in that, The acquisition of orientation and position data of components on the circuit board includes: The operator's first operation is detected; wherein the first operation is used to instruct the circuit board quality inspection device to perform component quality inspection on the first circuit board, and the component quality inspection refers to the inspection of the quality of the components on the circuit board; Determine whether component quality inspection is currently being performed on the second circuit board; wherein, the second circuit board is the circuit board for which surface defect inspection has been completed; While the second circuit board is undergoing component quality testing, determine whether the first circuit board is the primary circuit board to be tested. In response to the first operation, when it is determined that the first circuit board is the circuit board to be inspected first, the inspection of the second circuit board is cancelled, and the circuit board quality inspection device is controlled to perform component quality inspection on the first circuit board to obtain the orientation data and the position data of the first circuit board.

3. The circuit board quality inspection method as described in claim 2, characterized in that, The step of determining whether the first circuit board is the primary circuit board to be inspected while the second circuit board is undergoing component quality testing includes: The detection phase data of the first circuit board is obtained to determine whether the first circuit board is in a detectable and assembled state; wherein, the assembled state is used to indicate that the components on the circuit board have been correctly installed and connected. When the first circuit board is in a detectable and assembled state, the first circuit board is identified as the circuit board to be tested first; when the first circuit board is in an undetectable and / or unassembled state, the first circuit board is identified as the circuit board not to be tested first.

4. The circuit board quality inspection method as described in claim 2, characterized in that, When the second circuit board is undergoing component quality testing, after determining whether the first circuit board is the primary circuit board to be tested, the method further includes: When it is determined that the first circuit board is not a circuit board to be inspected first, the first circuit board is placed in the inspection process waiting for inspection, and the circuit board quality inspection device continues to perform component quality inspection on the second circuit board to obtain the orientation data and the position data of the second circuit board.

5. The circuit board quality inspection method as described in claim 1, characterized in that, The step of determining the first performance detection information based on the structural data includes: Based on the structural data and preset empirical data, the performance evaluation index of each region within a preset area range on the circuit board is determined; wherein, the empirical data includes performance data of different regions of the circuit board detected in the past period, the performance data includes location data and component data of circuit board soldering abnormalities, and the component data includes at least one of component size data and data on whether components are missing; When the power consumption of the circuit board is detected to be within a preset power consumption range, and the performance evaluation index of the current area of ​​the circuit board is higher than a first preset value, a first control instruction is generated; wherein, the first control instruction is used to instruct the circuit board quality inspection device to re-inspect the connection status of the solder joints and the defects on the surface of the circuit board. Based on the first control command, the circuit board quality inspection device is controlled to re-inspect the connection status of the solder joints and the defects on the surface of the circuit board to determine the first performance inspection information.

6. The circuit board quality inspection method as described in claim 5, characterized in that, The step of determining the first performance detection information based on the structural data further includes: The first control command is continuously sent to the circuit board quality detection device during a preset first time period. If no detection response is received from the circuit board quality inspection device within the preset second time period regarding the re-inspection of the connection status of the solder joints and the re-inspection of the defects on the circuit board surface, and if it is detected that the circuit board quality inspection device is inspecting other circuit boards, a second control command is generated; wherein, the second control command is used to instruct the circuit board quality inspection device to terminate the inspection step of the next other circuit board after completing the current inspection of other circuit boards, and to start the re-inspection of the connection status of the solder joints and the re-inspection of the defects on the circuit board surface of the circuit board to be re-inspected; Based on the second control command, the circuit board quality inspection device is controlled to re-inspect the connection status of the solder joints and the defects on the surface of the circuit board to determine the first performance inspection information.

7. The circuit board quality inspection method as described in claim 1, characterized in that, The step of obtaining the circuit board quality test result based on the first performance test information and the second performance test information includes: Based on the first performance detection information and the second performance detection information, an electrical simulation of the circuit board is performed to obtain electrical data; wherein, the electrical data includes the power consumption generated by the circuit board during the simulated conduction process; When the power consumption in the electrical data is a first power consumption, the first data information corresponding to the first power consumption is obtained; wherein, the first data information includes the first resistance value and the first signal transmission information of the circuit board during the simulated conduction process; The first resistance value is input into a preset resistance discrimination model, which judges the first resistance value and outputs a first discrimination result corresponding to the first resistance value; wherein, the first discrimination result is used to reflect the first electrical performance of the circuit board during the simulated conduction process; When the first identification result indicates that the first resistance value is a stable resistance, and the first signal transmission information indicates that the signal transmission type caused by the current tested on the circuit board reaching the level that can detect the first resistance value is a preset first type, a first option box is displayed on the circuit board quality detection device; wherein, the first type is used to reflect the signal transmission situation where one signal on the circuit board interferes with another signal, and the first option box displays the first resistance value and the circuit board cleaning reminder information corresponding to the first type; In response to a first operation on the first option box, first operation data is obtained; wherein, the first operation data is used to indicate that a re-inspection should be performed after cleaning the circuit board; Based on the first operation data, the first result in the circuit board quality inspection result is obtained.

8. The circuit board quality inspection method as described in claim 7, characterized in that, The step of obtaining the circuit board quality test result based on the first performance test information and the second performance test information further includes: When the power consumption in the electrical data is the second power consumption, the second data information corresponding to the second power consumption is obtained; wherein, the second data information includes the second resistance value and the second signal transmission information of the circuit board during the simulated conduction process; The second resistance value is input into the resistance discrimination model, which judges the second resistance value and outputs a second discrimination result corresponding to the second resistance value; wherein, the second discrimination result is used to reflect the second electrical performance of the circuit board during the simulated conduction process; When the second identification result indicates that the second resistance value is a variable resistance, and the second signal transmission information indicates that the signal transmission type caused by the current during circuit board testing reaching the level that can detect the second resistance value is a preset second type, a second option box is displayed on the circuit board quality inspection device; wherein, the variable resistance is used to indicate that the resistance value changes with the test duration due to poor contact at the solder joints of the circuit board, the second type is used to reflect the signal distortion caused by the change in signal in the circuit board with the test duration, and the second option box displays the second resistance value and the circuit board soldering reminder information corresponding to the second type; In response to a second operation on the second option box, second operation data is obtained; wherein the second operation data is used to indicate that a re-inspection should be performed after the poor solder joints on the circuit board are re-soldered; Based on the second operation data, the second result in the circuit board quality inspection result is obtained.

9. A circuit board quality inspection system, characterized in that, include: The first acquisition unit is used to acquire the structural data of the circuit board; wherein, the structural data is used to reflect the connection status of the solder joints of the circuit board and the defects on the surface of the circuit board; The second acquisition unit is used to acquire orientation data and position data of components on the circuit board; wherein, the orientation data is used to reflect the positive and negative orientation of polarity components, and the position data includes the position distribution data of components on the circuit board. The first processing unit is used to determine first performance detection information based on the structural data; The second processing unit is used to determine second performance detection information based on the direction data and the position data; The management unit is used to obtain the circuit board quality test results based on the first performance test information and the second performance test information.

10. A circuit board quality inspection device, characterized in that, The device includes a circuit board quality inspection device and a control device communicatively connected to the circuit board quality inspection device. The control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the method as described in any one of claims 1 to 8.

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