Method and system for assessing blind mate interconnection reliability of phased array antenna

Abstract

The present invention relates to the technical field of digital design, and provides a method and system for assessing the blind mate interconnection reliability of a phased array antenna. In the method for assessing the blind mate interconnection reliability provided by the present invention, various load factors of a phased array antenna are comprehensively considered in a design stage, the mechanical reliability of blind mate connection of the phased array antenna is comprehensively assessed, and the electrical reliability of blind mate connection of the phased array antenna is assessed on the basis of electrical performance indexes of the phased array antenna, thereby providing a convenient, fast and effective method for assessing and optimizing blind mate connection of the phased array antenna, greatly shortening a design iteration period of the phased array antenna, and greatly reducing development costs.

Description

Phased array antenna blind mating interconnection reliability evaluation method and system TECHNICAL FIELD

[0001] The present application relates to the technical field of digital design, in particular to a phased array antenna blind mating interconnection reliability evaluation method and system. BACKGROUND

[0002] A phased array antenna is usually composed of array antennas, transceiver components, power division networks and other functional units, and has a wide range of applications in the field of aerospace, and can realize important functions such as earth observation, interstellar communication and early warning detection. A phased array antenna usually contains hundreds or even thousands of antenna elements, and each element needs to be interconnected with the corresponding transceiver component RF channel to realize RF feeding. In order to adapt to the characteristics of low profile, high integration and multiple connection paths of phased array antennas in the field of aerospace, blind mating connection is usually used instead of cable connection in the antenna structure design process to realize multi-level RF or low-frequency interconnection between the antenna elements and the transceiver components or between the transceiver components and other functional units such as power division networks.

[0003] The phased array antenna based on blind mating interconnection has many blind mating levels, small volume, light weight and compact structure, but has higher requirements for the mating gap. Excessive deformation of the structure will cause the blind mating to be out of place, the blind mating gap to increase, and the RF transmission channel performance of the antenna element to deteriorate or even disconnect, thereby affecting the overall performance of the phased array antenna. In the field of aerospace, the phased array antenna also needs to face harsh external loads such as large temperature changes and strong vibrations during service, which puts higher requirements on the reliability of blind mating interconnection.

[0004] At present, the method for evaluating the reliability of the blind mating interconnection of the phased array antenna applied in the field of aerospace mainly uses the whole machine vibration test in the initial sample stage of the product, and the reliability of the blind mating connection is inferred by monitoring the performance of the RF channel signal transmission. Once it is found that the blind mating connection is unreliable, the structure needs to be redesigned, which is time-consuming and laborious. Therefore, it is urgent to develop a method for evaluating the reliability of the blind mating interconnection of the phased array antenna at the scheme design stage.

[0005] SUMMARY

[0006] (I) Technical problems solved

[0007] In view of the deficiencies of the prior art, the present application provides a phased array antenna blind mating interconnection reliability evaluation method and system, which solves the technical problem that the existing method cannot evaluate the reliability of the blind mating interconnection of the phased array antenna at the scheme design stage.

[0008] (II) Technical solutions

[0009] In order to achieve the above purpose, the present application is realized by the following technical solutions:

[0010] In a first aspect, a method for evaluating the reliability of blind-mating interconnection of a phased array antenna, comprising:

[0011] obtaining a CAD mathematical model of the phased array antenna, extracting a closed dimension chain between the blind-mating interconnection structure at each level and the assembly datum in the CAD mathematical model, and calculating the blind-mating tolerance of the blind-mating gap at each level according to the tolerance of the dimensions in the closed dimension chain;

[0012] simplifying the non-load-bearing structure in the CAD mathematical model, and establishing a finite element model of the phased array antenna structure;

[0013] adding a plurality of load cases to the finite element model of the phased array antenna respectively, and performing structural deformation analysis to obtain a plurality of blind-mating gap changes of the blind-mating connection structure at each level;

[0014] calculating the sum of the plurality of blind-mating gap changes and the blind-mating tolerance for the blind-mating connection structure at each level to obtain the blind-mating gap extreme value of the blind-mating connection structure at each level; if the blind-mating gap extreme value of the blind-mating connection structure at each level is greater than the blind-mating gap threshold value, the mechanical reliability of the blind-mating connection of the phased array antenna is unqualified, the evaluation is ended, otherwise, the next step is performed;

[0015] calculating the sum of the blind-mating gap changes caused by temperature, acceleration overload and random vibration load to obtain the blind-mating electrical gap, calculating the actual electrical performance indicators of the phased array antenna according to the blind-mating electrical gap and the insertion loss, calculating the difference between the actual electrical performance indicators and the ideal electrical performance indicators, and if each difference is less than the corresponding index threshold value, the electrical reliability of the blind-mating connection of the phased array antenna is qualified.

[0016] Preferably, the blind-mating tolerance includes an extreme value tolerance.

[0017] Preferably, the tolerance of the dimensions in the dimension chain includes a part dimension tolerance and an assembly dimension tolerance.

[0018] Preferably, the load includes a static analysis load and a dynamic analysis load.

[0019] The static analysis load is an assembly stress generated in the assembly process of the phased array antenna, a temperature borne in the service process, and an acceleration overload borne in the service process.

[0020] The dynamic analysis load includes a random vibration load borne in the service stage of the phased array antenna, and the random vibration load is expressed in a power density spectrum and obeys a normal distribution.

[0021] Preferably, the adding a plurality of load cases to the finite element model of the phased array antenna respectively, and performing structural deformation analysis to obtain a plurality of blind-mating gap changes of the blind-mating connection structure at each level, comprises:

[0022] Adding static analysis load condition in the phased array antenna finite element model, carrying out structure static deformation analysis to obtain the blind gap change of each level of blind connection;

[0023] Adding dynamic analysis load condition in the phased array antenna finite element model, carrying out structure dynamic deformation analysis to obtain the blind gap change of each level of blind connection structure, including:

[0024] a. Carrying out modal analysis on the phased array antenna structure to obtain each order mode shape and corresponding equivalent mass ratio of the structure;

[0025] b. Carrying out random vibration analysis on the structure by modal truncation method to obtain 3σ deformation of the whole phased array antenna, and extracting the 3σ change of the blind gap of the i-th level j-th blind connection structure as the blind gap change of the i-th level j-th blind connection structure obtained by dynamic deformation analysis; wherein the modal truncation method refers to taking the modes with the total equivalent mass accounting for more than 90% of the total mass of the structure to carry out modal superposition calculation.

[0026] Preferably, the calculation of the actual electrical performance indicators of the phased array antenna according to the blind electrical gap and the insertion loss includes:

[0027] Wherein, E is the directional diagram of the phased array antenna, through which the electrical performance indicators of the phased array antenna are obtained, S ij (ΔGe ij ) is the insertion loss of the i-th level j-th blind connection structure when the blind gap is ΔGe j , is the excitation current loaded to the antenna unit, f j is the directional diagram of the antenna unit, k=2π / λ0 represents the wave constant, and λ0 is the wavelength, is the unit polarization vector, is the position vector of the radiating unit, n represents the total number of blind levels, and m represents the total number of blind connection structures in the current blind level.

[0028] Preferably, the electrical performance indicators include the gain, sidelobe level and pointing angle deviation of the phased array antenna.

[0029] In the second aspect, the application provides a phased array antenna blind connection reliability evaluation system, comprising:

[0030] A blind tolerance analysis module is configured to obtain a CAD mathematical model of the phased array antenna, a closed dimension chain between each level of blind interconnection structure and an assembly reference in the CAD mathematical model, and calculate blind tolerances of each level of blind gap according to tolerances of dimensions in the closed dimension chain.

[0031] A finite element modeling module is configured to simplify non-load-bearing structures in a CAD mathematical model and establish a finite element model of the phased array antenna structure;

[0032] A deformation analysis module is configured to add a plurality of load conditions to the finite element model of the phased array antenna respectively, and perform structural deformation analysis to obtain a plurality of blind-mating gap changes of the blind-mating connection structure at each level.

[0033] A mechanical reliability evaluation module is configured to calculate the sum of the plurality of blind-mating gap changes and the blind-mating tolerance of the blind-mating connection structure at each level to obtain a blind-mating gap extreme value of the blind-mating connection structure at each level.

[0034] An electrical reliability evaluation module is configured to calculate the sum of the blind-mating gap changes caused by temperature, acceleration overload and random vibration load to obtain a blind-mating electrical gap, calculate actual electrical performance indicators of the phased array antenna according to the blind-mating electrical gap and the insertion loss, calculate the difference between the actual electrical performance indicators and ideal electrical performance indicators, and if each difference is less than a corresponding indicator threshold, the blind-mating connection electrical reliability of the phased array antenna is qualified.

[0035] In a third aspect, the present application provides a computer readable storage medium storing a computer program for a phased array antenna blind-mating interconnection reliability evaluation method, wherein the computer program causes a computer to execute the phased array antenna blind-mating interconnection reliability evaluation method as described above.

[0036] In a fourth aspect, the present application provides an electronic device comprising:

[0037] One or more processors, a memory, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the programs comprise a program for executing the phased array antenna blind-mating interconnection reliability evaluation method as described above.

[0038] (III) Beneficial Effects

[0039] The present application provides a phased array antenna blind-mating interconnection reliability evaluation method and system. Compared with the prior art, the present application has the following beneficial effects:

[0040] The blind connection reliability evaluation method provided by the application comprehensively considers various load factors of the phased array antenna in the design stage, comprehensively evaluates the mechanical reliability of the blind connection of the phased array antenna, and evaluates the electrical reliability of the blind connection of the phased array antenna from the perspective of the electrical performance index of the phased array antenna, thereby providing a convenient, fast and effective method for evaluating and optimizing the blind connection of the phased array antenna, and greatly improving the design iteration period of the phased array antenna and greatly reducing the development cost. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0042] Fig. 1 is a block diagram of a blind connection reliability evaluation method of a phased array antenna according to an embodiment of the present application;

[0043] Fig. 2 is a flowchart of a blind connection reliability evaluation method of a phased array antenna according to an embodiment of the present application;

[0044] Fig. 3 is a schematic diagram of a blind connection structure;

[0045] Fig. 4 is a schematic diagram of a phased array antenna structure. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application are described clearly and completely. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0047] The embodiments of the present application provide a blind connection reliability evaluation method and system of a phased array antenna, which solves the technical problem that the existing method cannot evaluate the blind connection reliability of the phased array antenna in the scheme design stage, and comprehensively evaluates the mechanical reliability and electrical reliability of the blind connection of the phased array antenna by comprehensively considering various load factors of the phased array antenna in the design stage and combining the blind connection structure tolerance.

[0048] The technical solutions in the embodiments of the present application are as follows to solve the above technical problems:

[0049] The application embodiment provides a phased array antenna blind connection interconnection reliability evaluation method applied to the field of aerospace, which is based on acceleration overload, vibration and temperature change load during service of the phased array antenna, analyzes the change of the blind connection gap of the multi-stage blind connection interconnection structure in the service state, evaluates the influence on the overall electrical performance of the phased array antenna, realizes the rapid evaluation of the antenna blind connection reliability in the scheme stage, and solves the technical problems in the prior art.

[0050] In order to better understand the above technical solutions, the above technical solutions will be described in detail in the following in combination with the drawings of the specification and specific embodiments.

[0051] The application embodiment provides a phased array antenna blind connection interconnection reliability evaluation method, as shown in Figure 1, which comprises the following steps:

[0052] S1, obtaining the CAD mathematical model of the phased array antenna, extracting the closed dimension chain between the multi-stage blind connection interconnection structure and the assembly datum in the CAD mathematical model, and calculating the blind connection tolerance of the multi-stage blind connection gap according to the tolerance of the dimensions in the closed dimension chain;

[0053] S2, simplifying the non-load-bearing structure in the CAD mathematical model, and establishing the finite element model of the phased array antenna structure;

[0054] S3, adding a plurality of load conditions in the finite element model of the phased array antenna respectively, and performing structural deformation analysis to obtain a plurality of blind connection gap changes of the multi-stage blind connection structure;

[0055] S4, for the multi-stage blind connection structure, calculating the sum of the plurality of blind connection gap changes and the blind connection tolerance to obtain the blind connection gap extreme value of the multi-stage blind connection structure; if the blind connection gap extreme value of the blind connection structure is greater than the blind connection gap threshold value of the corresponding multi-stage blind connection structure, the blind connection mechanical reliability of the phased array antenna is unqualified, the evaluation is ended, otherwise, the next step is executed;

[0056] S5, calculating the sum of the blind connection gap changes caused by the temperature, acceleration overload and random vibration load of each blind connection to obtain the blind connection electrical gap ΔGe ij , calculating the actual electrical performance indicators of the phased array antenna according to the blind connection electrical gap ΔGe ij and the insertion loss, calculating the difference between the actual electrical performance indicators and the ideal electrical performance indicators, and if each difference is less than the corresponding index threshold value, the blind connection electrical reliability of the phased array antenna is qualified.

[0057] The blind connection reliability evaluation method provided by the embodiment of the application comprehensively considers various load factors of the phased array antenna in the design stage, comprehensively evaluates mechanical reliability of the blind connection of the phased array antenna, and evaluates electrical reliability of the blind connection of the phased array antenna from the perspective of an electrical performance index of the phased array antenna, thereby providing a convenient, fast and effective method for evaluation and optimization of the blind connection of the phased array antenna, and greatly improving a design iteration period of the phased array antenna and greatly reducing development cost.

[0058] The following set of details for each step is shown in FIG. 2:

[0059] The structure of the blind connector analyzed in the embodiment of the application is shown in FIG. 3, including a male head 301 and a female head 302, and a blind gap 303 between the male head 301 and the female head 302. The structure of the phased array antenna analyzed in the embodiment of the application is shown in FIG. 4, including a power division network 401, a first-level blind connection 402, a transceiver assembly 403, a second-level blind connection 404, an antenna array surface 405, and an antenna array element 406. The antenna array surface is a rectangle, and 12*20 rectangular array distributed antenna units are mounted on the surface. There are 20 12-channel transceiver assemblies on the back surface. The front end transceiver channels of the transceiver assemblies are connected to the antenna units through the blind connection to realize one-to-one interconnection and feeding. There are 12*20 blind connections in total. The transceiver channels of the power division network are connected to the rear end transceiver channels of the transceiver assemblies through the blind connection to realize one-to-one interconnection and feeding. There are 12*20 blind connections in total. The transceiver assemblies and the power division network are fixed to the antenna array surface through bolts at both ends.

[0060] In an embodiment, S1, a CAD mathematical model of the phased array antenna is acquired, a closed dimension chain between a blind connection structure at each level and an assembly reference in the CAD mathematical model is extracted, and a blind connection tolerance of a blind gap at each level is calculated according to a tolerance of a dimension in the closed dimension chain. The method includes the following steps:

[0061] A CAD mathematical model of the phased array antenna is established by using Proe software, a closed dimension chain between a blind connection structure at each level and an assembly reference is extracted, and a blind connection tolerance of a blind gap at each level is calculated according to a tolerance of a dimension in the closed dimension chain. The tolerance of the dimension in the dimension chain includes a part dimension tolerance and an assembly dimension tolerance.

[0062] In this embodiment, an extreme value tolerance is selected as the blind connection tolerance. The calculation formula of the extreme value tolerance is as follows:

[0063] wherein, T ik is the kth dimension tolerance of the ith blind connection, ξ ij is a transfer coefficient, the dimension tolerance is subject to a normal distribution, and K represents a total number of dimension tolerances in the dimension chain at the current level.

[0064] For example, the second level size chain size tolerance is as follows:

[0065] Antenna array interface plug mounting hole size tolerance: 0.02

[0066] Assembly tolerance between female head and antenna array: 0.01

[0067] Transceiver assembly interface plug mounting hole size tolerance: 0.02

[0068] Assembly tolerance between male head and transceiver assembly: 0.01

[0069] Assembly tolerance between transceiver assembly and antenna array: 0.02

[0070] The size tolerances in the size chain are subject to normal distribution, and the extreme value tolerance of the second level blind-mating interconnection blind-mating gap is calculated according to the size tolerances in the size chain:

[0071] Wherein, the ξ k According to the actual situation, for example, when the directions are opposite, ξ k = -1.

[0072] For example, the first level size chain size tolerance is as follows:

[0073] Antenna array interface plug mounting hole size tolerance: 0.01

[0074] Assembly tolerance between female head and antenna array: 0.01

[0075] Transceiver assembly interface plug mounting hole size tolerance: 0.02

[0076] Assembly tolerance between male head and transceiver assembly: 0.01

[0077] Assembly tolerance between transceiver assembly and antenna array: 0.01

[0078] The size tolerances in the size chain are subject to normal distribution, and the extreme value tolerance of the first level blind-mating interconnection blind-mating gap is calculated according to the size tolerances in the size chain:

[0079] In an embodiment, S2, a non-load-bearing structure in the simplified CAD mathematical model, establishes a phased array antenna structure finite element model. Including:

[0080] According to the CAD mathematical model of the phased array antenna, non-load-bearing structures such as cables, bolts, and pipes in the CAD mathematical model are simplified, and a finite element model of the phased array antenna structure is established by using a finite element analysis software. The finite element model includes the definition of a grid, materials, and boundary conditions. The definition of the materials includes properties such as density, Poisson's ratio, and thermal expansion coefficient. The boundary conditions are determined according to the installation and fixing mode of the phased array antenna in a service state. The finite element analysis software includes finite element software such as Hypermesh, Abaqus, and Ansys.

[0081] In an embodiment, S3, a plurality of load conditions are added in the finite element model of the phased array antenna respectively, and structural deformation analysis is performed to obtain a plurality of blind-mating gap changes of the blind-mating connection structure at each level. The blind-mating gap changes include:

[0082] The load includes static analysis load and dynamic analysis load.

[0083] The static analysis load is assembly stress generated in the assembly process of the phased array antenna and load such as temperature and acceleration overload borne by the phased array antenna in a service process. The assembly stress is an internal stress of the structure caused by the insertion force of a blind-mating plug in the structure assembly process, and the blind-mating plug includes a radio frequency connector, a low-frequency connector, a liquid cooling joint, and other quick connectors. The temperature and acceleration overload load condition is determined according to the mission profile of the phased array antenna in the service stage. The temperature load refers to the maximum temperature difference borne by the phased array antenna relative to the room temperature in the service stage. The acceleration overload load refers to the maximum acceleration overload load borne by the phased array antenna in the service stage.

[0084] The dynamic analysis load is random vibration load borne by the phased array antenna in the service stage, which is expressed by a power density spectrum and obeys a normal distribution.

[0085] The static analysis load condition is added in the finite element model of the phased array antenna, and structural static deformation analysis is performed to obtain the blind-mating gap changes of the blind-mating connection at each level. That is, the blind-mating gap deformation of the i th blind-mating connection at the j th level under the action of the assembly stress, temperature, acceleration, and other loads is ΔGp ij , ΔGt ij , and ΔGa ij , respectively.

[0086] The dynamic analysis load condition is added in the finite element model of the phased array antenna, and structural dynamic deformation analysis is performed to obtain the blind-mating gap changes of the blind-mating connection structure at each level. The blind-mating gap changes include:

[0087] a. Modal analysis is performed on the phased array antenna structure to obtain the vibration mode and the corresponding equivalent mass ratio of the structure at each level;

[0088] b. The modal truncation method (i.e. taking the first n modes whose equivalent mass sum accounts for more than 90% of the total mass of the structure to perform modal superposition calculation) is adopted to perform random vibration analysis of the structure, and the 3σ (probability: 99.73%) deformation of the whole phased array antenna is obtained, from which the 3σ (probability: 99.73%) variation ΔGr of the blind-mating gap of the jth blind-mating connection structure of the ith level is extracted. ij .

[0089] In an embodiment, S4, for each level of blind-mating connection structure, the sum of the variation of the blind-mating gap and the blind-mating tolerance is calculated to obtain the extreme value of the blind-mating gap of each level of blind-mating connection structure; if there is an extreme value of the blind-mating gap of the blind-mating connection structure that is greater than the blind-mating gap threshold value of the corresponding level of blind-mating connection structure, the blind-mating connection mechanical reliability of the phased array antenna is unqualified, the evaluation is ended, otherwise, the next step is performed. It includes:

[0090] S401, the sum of the blind-mating tolerance and the blind-mating gap deformation of the blind-mating connection structure under the action of assembly stress, temperature, acceleration overload, vibration and other loads is calculated to obtain the extreme value of the blind-mating gap of each level of blind-mating connection structure, that is: ΔGm ij = ΔGd i + ΔGp ij + ΔGt ij + ΔGa ij + ΔGr ij

[0091] S402, it is judged whether the extreme value of the blind-mating gap of each level of blind-mating connection structure is less than the blind-mating gap threshold value of the corresponding level of blind-mating connection structure, if yes, the next step is performed, otherwise, it is indicated that the blind-mating connection mechanical reliability of the phased array antenna is unqualified, the blind-mating structure of the phased array antenna is optimized and designed, and after the optimization and design, the step S1 is returned.

[0092] Generally, the blind-mating gap threshold values of the blind-mating connection structures of the same level are set to be the same, and the blind-mating connection structures of different levels are set with respective blind-mating gap threshold values, which may be the same or not. The blind-mating gap threshold value is the maximum allowable blind-mating gap of the blind-mating connection structure.

[0093] In an embodiment, if the ΔGm 2,225 of the 225th blind-mating connection structure of the second level of blind-mating interconnection is 2.31 mm, which is greater than the maximum allowable blind-mating gap 2 mm of the blind-mating connection structure, the 225th blind-mating connection is out of failure, the blind-mating connection mechanical reliability of the phased array antenna is unqualified, and the blind-mating structure of the phased array antenna needs to be optimized and designed. The optimization measures that can be taken include thickening the antenna unit mounting plate or adding reinforcing ribs on the surface of the antenna unit mounting plate, etc. After the optimization and design, the steps S1-S4 are repeated, and the calculation result shows that the blind-mating gap ΔGm ijThe blind-mating connection mechanical reliability evaluation is qualified.

[0094] In an embodiment, S5, the sum of the blind-mating gap changes caused by temperature, acceleration overload and random vibration load of each blind-mating is calculated to obtain the blind-mating electrical gap ΔGe ij , the actual electrical performance indicators of the phased array antenna are calculated according to the blind-mating electrical gap ΔGe ij and the insertion loss, the difference between each actual electrical performance indicator and each ideal electrical performance indicator is calculated, and if each difference is less than the corresponding indicator threshold, the blind-mating connection electrical reliability of the phased array antenna is qualified. Including:

[0095] S501, the sum of the blind-mating gap changes caused by temperature, acceleration overload and random vibration load of each blind-mating is calculated to obtain the blind-mating electrical gap ΔGe ij , the actual electrical performance indicators of the phased array antenna are calculated according to the blind-mating electrical gap ΔGe ij and the insertion loss. Specifically including:

[0096] The electrical performance indicators include phased array antenna gain, sidelobe level and pointing angle deviation, etc.

[0097] According to the blind-mating gap ΔGe ij of the blind-mating connection, the corresponding blind-mating connection insertion loss S ij is analyzed by experiment, and the blind-mating connection insertion loss Sg ij and So ij are considered when the blind-mating connection has a gap and the ideal blind-mating has no gap.

[0098] The electrical performance indicators of the entire phased array antenna are calculated according to the following formula respectively:

[0099] Wherein, E is the directional diagram of the phased array antenna, from which the electrical performance indicators such as phased array antenna gain, sidelobe level and pointing angle deviation are obtained, S ij (ΔGe ij ) is the insertion loss of the i-th j-th blind-mating connection structure when the blind-mating gap is ΔGe ij , that is, Sg ij , is the excitation current loaded to the antenna element, f j is the directional diagram of the antenna element, k=2π / λ0 represents the wave constant, and λ0 is the wavelength, is the unit polarization vector, is the position vector of the radiating element, n represents the total number of levels of the blind-mating level, and m represents the total number of blind-mating connection structures in the current blind-mating level.

[0100] S502, calculate the difference between each actual electrical performance index and each ideal electrical performance index, judge whether each difference is less than the corresponding index threshold, if yes, the blind connection electrical reliability of the phased array antenna is qualified, otherwise, it indicates that the blind connection electrical reliability of the phased array antenna is unqualified, and the blind connection structure of the phased array antenna is optimized and designed, and the optimized design returns to step S1.

[0101] When the ideal blind connection has no gap, the electrical performance index of the entire phased array antenna is calculated by the following formula:

[0102] The electrical performance of the phased array antenna with the blind connection gap is compared with the electrical performance of the phased array antenna without the ideal blind connection gap, when the blind connection gap exists, the pointing angle deviation of the phased array antenna is 0.32°, the gain loss is 2.5dB, and the sidelobe is lifted by 3.2dB, and considering that the design requirement is that the index threshold of the pointing angle deviation of the phased array antenna is 0.2° (i.e. the pointing angle deviation of the phased array antenna is less than 0.2°), the index threshold of the gain loss is 2dB (i.e. the gain loss is less than 2dB), and the index threshold of the sidelobe is 2.5dB (i.e. the sidelobe is less than 2.5dB). It can be seen that the change of the electrical performance index does not meet the design requirement, the blind connection electrical reliability evaluation is unqualified, and the structure of the phased array antenna needs to be optimized. The optimization measures are: thickening the antenna unit mounting plate or increasing the reinforcing ribs on the surface of the antenna unit mounting plate, increasing the connection bolts between the transceiver assembly and the antenna array surface, etc.

[0103] After the optimization design, the above steps S1-S5 are repeated, and the electrical performance of the phased array antenna is recalculated, and the calculation result shows that the pointing angle deviation of the phased array antenna is 0.14°, the gain loss is 1.4dB, and the sidelobe is lifted by 2.1dB, the change of the electrical performance index meets the design requirement, i.e. the blind connection electrical reliability evaluation is qualified.

[0104] The embodiment of the application also provides a phased array antenna blind connection interconnection reliability evaluation system, the system comprises:

[0105] The blind connection tolerance analysis module is used for executing S1, obtaining the CAD mathematical model of the phased array antenna, the closed dimension chain between each level of blind connection interconnection structure and the assembly reference in the CAD mathematical model, and calculating the blind connection tolerance of each level of blind connection gap according to the tolerance of the dimensions in the closed dimension chain.

[0106] The finite element modeling module is used for executing S2, simplifying the non-load-bearing structure in the CAD mathematical model, and establishing the finite element model of the phased array antenna structure.

[0107] The deformation analysis module is used for executing S3, adding a plurality of load conditions in the finite element model of the phased array antenna respectively, and performing structural deformation analysis to obtain a plurality of blind connection gap changes of each level of blind connection structure.

[0108] The connection mechanical reliability evaluation module is used for performing S4, calculating the sum of the blind-mating gap changes and the blind-mating tolerances of each level of blind-mating connection structure, obtaining the blind-mating gap extreme value of each level of blind-mating connection structure, if the blind-mating gap extreme value of the blind-mating connection structure is greater than the blind-mating gap threshold value of the corresponding each level of blind-mating connection structure, the blind-mating connection mechanical reliability of the phased array antenna is unqualified, the evaluation is ended, otherwise, the process in the electrical reliability evaluation module is performed;

[0109] The electrical reliability evaluation module is used for performing S5, calculating the sum of the blind-mating gap changes caused by temperature, acceleration overload and random vibration load, obtaining the blind-mating electrical gap ΔGe ij , calculating each actual electrical performance index of the phased array antenna according to the blind-mating electrical gap ΔGe ij and the insertion loss, calculating the difference between each actual electrical performance index and each ideal electrical performance index, if each difference is less than the corresponding index threshold value, the blind-mating connection electrical reliability of the phased array antenna is qualified.

[0110] It can be understood that the phased array antenna blind-mating interconnection reliability evaluation system provided by the embodiment of the present application corresponds to the above-mentioned phased array antenna blind-mating interconnection reliability evaluation method, and the explanation, examples, beneficial effects and the like of the related content can refer to the corresponding content in the phased array antenna blind-mating interconnection reliability evaluation method, which will not be repeated here.

[0111] The embodiment of the present application also provides a computer readable storage medium which stores a computer program for phased array antenna blind-mating interconnection reliability evaluation, wherein the computer program makes the computer execute the phased array antenna blind-mating interconnection reliability evaluation method as described above.

[0112] The embodiment of the present application also provides an electronic device, comprising:

[0113] One or more processors;

[0114] Memory; and

[0115] One or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the programs comprise a program for performing the phased array antenna blind-mating interconnection reliability evaluation method as described above.

[0116] Compared with the prior art, the embodiment of the present application has the following beneficial effects:

[0117] The blind connection reliability evaluation method provided by the embodiment of the application comprehensively considers various load factors of the phased array antenna in the design stage, comprehensively evaluates the mechanical reliability of the blind connection of the phased array antenna, and evaluates the electrical reliability of the blind connection of the phased array antenna from the perspective of the electrical performance index of the phased array antenna, thereby providing a convenient, fast and effective method for evaluation and optimization of the blind connection of the phased array antenna, and greatly improving the design iteration period of the phased array antenna and greatly reducing the development cost.

[0118] It should be noted that, in this document, the terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or device. Without more limitations, the element defined by the statement "comprises a" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0119] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for evaluating the reliability of a blind configuration interconnection of a phased array antenna, characterized in that, The method comprises the following steps: obtaining a CAD mathematical model of the phased array antenna, extracting a closed dimension chain between each level of blind-mating interconnection structure and an assembly reference in the CAD mathematical model, and calculating a blind-mating tolerance of each level of blind-mating gap according to a tolerance of a dimension in the closed dimension chain; simplifying a non-load-bearing structure in the CAD mathematical model, and establishing a finite element model of the phased array antenna structure; adding a plurality of load cases in the finite element model of the phased array antenna respectively, and performing structural deformation analysis to obtain a plurality of blind-mating gap changes of each level of blind-mating connection structure; calculating a sum of the plurality of blind-mating gap changes and the blind-mating tolerance of each level of blind-mating connection structure, and obtaining a blind-mating gap extreme value of each level of blind-mating connection structure; if the blind-mating gap extreme value of the blind-mating connection structure is greater than a blind-mating gap threshold value of the corresponding level of blind-mating connection structure, the blind-mating connection mechanical reliability of the phased array antenna is unqualified, the evaluation is ended, otherwise, the next step is performed; calculating a sum of blind-mating gap changes of each blind-mating caused by temperature, acceleration overload and random vibration load, obtaining a blind-mating electrical gap, calculating each actual electrical performance index of the phased array antenna according to the blind-mating electrical gap and the insertion loss, calculating a difference between each actual electrical performance index and each ideal electrical performance index, and if each difference is less than a corresponding index threshold value, the blind-mating connection electrical reliability of the phased array antenna is qualified.

2. The method of claim 1, wherein, The blind-mating tolerance comprises an extreme value tolerance.

3. The method of claim 1, wherein: The tolerance of the dimension in the dimension chain comprises a part dimension tolerance and an assembly dimension tolerance.

4. The method of claim 1, wherein, The load comprises a static analysis load and a dynamic analysis load; The static analysis load is an assembly stress generated in a phased array antenna assembly process, a temperature borne in a service process and an acceleration overload borne in the service process; The dynamic analysis load comprises a random vibration load borne by the phased array antenna in a service stage, and the random vibration load is expressed by a power density spectrum and obeys a normal distribution.

5. The method of claim 1-4, wherein, The adding of the plurality of load cases in the finite element model of the phased array antenna respectively, and the performing of the structural deformation analysis to obtain the plurality of blind-mating gap changes of each level of blind-mating connection structure comprises: adding a static analysis load case in the finite element model of the phased array antenna, and performing structural static deformation analysis to obtain blind-mating gap changes of each level of blind-mating connection; adding a dynamic analysis load case in the finite element model of the phased array antenna, and performing structural dynamic deformation analysis to obtain blind-mating gap changes of each level of blind-mating connection structure, which comprises: a, performing modal analysis on the phased array antenna structure to obtain each order mode shape of the structure and a corresponding equivalent mass ratio; b, performing random vibration analysis on the structure by modal truncation method to obtain 3σ deformation of the whole phased array antenna, and extracting a blind-mating gap 3σ change of an i-th blind-mating connection structure as a blind-mating gap change of the i-th blind-mating connection structure obtained by dynamic deformation analysis; wherein the modal truncation method is to take more than 90% of the total equivalent mass of the structure to calculate modal superposition.

6. The method of claim 1-4, wherein, The actual electric performance indexes of the phased array antenna are calculated according to the blind matching electric gap and the insertion loss, including: Wherein, E is the phased array antenna pattern, through which the electrical performance index of the phased array antenna is obtained, S ij (ΔGe ij ) is the insertion loss of the i-th level j-th blind-mating connection structure when the blind-mating gap is ΔGe j ​ for the excitation current loaded to the antenna element, f j for the directional diagram of the antenna element, k = 2π / λ0denotes the wave constant, λ0the wavelength, for the unit polarization vector, is a position vector of a radiating element, n represents a total number of blind-mating levels, and m represents a total number of blind-mating connection structures in a current blind-mating level.

7. The method of claim 6, wherein: The electrical performance index comprises a phased array antenna gain, a sidelobe level and a pointing angle deviation.

8. A system for evaluating the reliability of a blind configuration interconnection of a phased array antenna, characterized in that, The method comprises the following steps: The blind-mating tolerance analysis module is configured to acquire a CAD mathematical model of the phased array antenna, acquire a closed dimension chain between each level of blind-mating interconnection structure and an assembly reference in the CAD mathematical model, and calculate blind-mating tolerances of blind-mating gaps of each level according to tolerances of dimensions in the closed dimension chain. The finite element modeling module is configured to simplify non-load-bearing structures in the CAD mathematical model and establish a finite element model of the phased array antenna structure. The deformation analysis module is configured to add a plurality of load conditions in the finite element model of the phased array antenna respectively, and perform structural deformation analysis to obtain a plurality of blind-mating gap changes of each level of blind-mating interconnection structure. The connection mechanical reliability evaluation module is configured to calculate a sum of the plurality of blind-mating gap changes and the blind-mating tolerances of each level of blind-mating interconnection structure, and obtain a blind-mating gap extreme value of each level of blind-mating interconnection structure. If the blind-mating gap extreme value of the blind-mating interconnection structure is greater than a blind-mating gap threshold value of the corresponding level of blind-mating interconnection structure, the blind-mating connection mechanical reliability of the phased array antenna is unqualified, the evaluation is ended, otherwise, the process in the electrical reliability evaluation module is executed. The electrical reliability evaluation module is configured to calculate a sum of blind-mating gap changes of each blind-mating caused by temperature, acceleration overload and random vibration load, obtain a blind-mating electrical gap, calculate each actual electrical performance index of the phased array antenna according to the blind-mating electrical gap and insertion loss, calculate a difference between each actual electrical performance index and each ideal electrical performance index, and if each difference is less than a corresponding index threshold value, the blind-mating connection electrical reliability of the phased array antenna is qualified.

9. A computer-readable storage medium, characterized in that, The computer program for the phased array antenna blind-mating interconnection reliability evaluation method is stored, wherein the computer program causes a computer to execute the phased array antenna blind-mating interconnection reliability evaluation method according to any one of claims 1-7.

10. An electronic device, comprising: The computer program for the phased array antenna blind-mating interconnection reliability evaluation method is stored, wherein the computer program causes a computer to execute the phased array antenna blind-mating interconnection reliability evaluation method according to any one of claims 1-7. The computer program for the phased array antenna blind-mating interconnection reliability evaluation method is stored, wherein the computer program causes a computer to execute the phased array antenna blind-mating interconnection reliability evaluation method according to any one of claims 1-7.

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