Electronic device

Abstract

The present disclosure relates to an electronic device. The electronic device comprises: a shell, a vapor chamber and a circuit board, wherein the shell comprises an upper shell and a lower shell; the lower shell, the vapor chamber, the circuit board and the upper shell are arranged in sequence in a first direction; and a projection of the vapor chamber in the first direction covers at least a target area of the circuit board. Heat dissipation of the circuit board can be realized, and manufacturing costs can be reduced.

Description

Electronic device

[0001] Related applications

[0002] The present disclosure claims priority to the Chinese patent application No. 2024107840899, filed on June 17, 2024, and entitled “Electronic device”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of hardware heat dissipation, in particular to an electronic device. BACKGROUND

[0004] A power converter can convert DC power into AC power. The DC input of the power converter is connected to a DC source (a photovoltaic module), and the AC output of the power converter can be connected to an AC power grid and a load. In the power converter, the devices on the circuit board generate a large amount of heat when working. If the heat cannot be dissipated in time, the devices on the circuit board will be damaged, thereby causing the entire power converter to malfunction.

[0005] SUMMARY

[0006] Therefore, it is necessary to provide an electronic device capable of dissipating heat for the circuit board.

[0007] An electronic device, comprising:

[0008] a housing, a vapor chamber, and a circuit board;

[0009] The housing comprises an upper housing and a lower housing. The lower housing, the vapor chamber, the circuit board, and the upper housing are sequentially arranged along a first direction.

[0010] The projection of the vapor chamber along the first direction covers at least a target region of the circuit board.

[0011] In one embodiment, the target region comprises a first region on the circuit board, in which the power consumption of the devices is greater than a first preset threshold.

[0012] In one embodiment, the target region comprises a primary side region on the circuit board, and a second region in a secondary side region, in which the power consumption of the devices is greater than a second preset threshold.

[0013] In one embodiment, the target region does not include an EMI filter circuit region in the secondary side region on the circuit board.

[0014] In one embodiment, the target region is provided with a transformer, and the transformer is connected across the primary side region and the secondary side region.

[0015] In one of the embodiments, the first group of through holes are provided on the hot plate, and a projection of the first group of through holes along the first direction is located in the primary side region, and the first group of through holes are used for insulation.

[0016] In one of the embodiments, the first group of through holes comprises at least one of a first type of through hole, a second type of through hole, a third type of through hole, a fourth type of through hole, and a fifth type of through hole.

[0017] The projection of the first type of through hole along the first direction corresponds to a power line communication (PLC) communication transformer pin.

[0018] The projection of the second type of through hole along the first direction corresponds to a capacitor pin.

[0019] The projection of the third type of through hole along the first direction corresponds to a connector.

[0020] The projection of the fourth type of through hole along the first direction corresponds to a primary side region pin of a transformer.

[0021] The projection of the fifth type of through hole along the first direction corresponds to a current transformer (CT) sampling pin.

[0022] In one of the embodiments, a second group of through holes are provided on the hot plate, and a projection of the second group of through holes along the first direction is located in the secondary side region, and the second group of through holes correspond to device pins in the secondary side region.

[0023] In one of the embodiments, the second group of through holes comprises a sixth type of through hole, and the projection of the sixth type of through hole along the first direction corresponds to a secondary side region pin of a transformer.

[0024] In one of the embodiments, the hot plate comprises a thermally conductive adhesive application region, and a projection of the thermally conductive adhesive application region along the first direction coincides with a high-power device region.

[0025] In one of the embodiments, the thermally conductive adhesive application region comprises a first application region and a second application region.

[0026] The projection of the first application region along the first direction coincides with a high-power device region in the primary side region.

[0027] The projection of the second application region along the first direction coincides with a high-power device region in the secondary side region.

[0028] In one of the embodiments, the hot plate is provided with a first protrusion and a second protrusion, the first application region is arranged on the first protrusion, and the second application region is arranged on the second protrusion.

[0029] In one of the embodiments, the vapor chamber is provided with a protrusion, a projection of the protrusion along the first direction coincides with a high-power device area.

[0030] In one of the embodiments, the thickness of the vapor chamber is greater than or equal to 2 mm.

[0031] In one of the embodiments, the vapor chamber is made of metal.

[0032] In one of the embodiments, the lower shell is provided with a first positioning post extending along the first direction near a side of the vapor chamber, the vapor chamber is provided with a first positioning hole, and the circuit board is provided with a limiting hole, the first positioning post passes through the first positioning hole and the limiting hole in sequence.

[0033] In one of the embodiments, the first positioning post includes a support table, the circuit board is carried on the support table, and the height of the support table is greater than the thickness of the vapor chamber.

[0034] In one of the embodiments, the lower shell is provided with a second positioning post, the vapor chamber is provided with a second positioning hole, the second positioning post is arranged in the second positioning hole, and the height of the second positioning post is the same as the thickness of the vapor chamber.

[0035] The electronic device includes a shell, a vapor chamber, and an assembled printed circuit board. The shell includes an upper shell and a lower shell, the lower shell, the vapor chamber, the circuit board, and the upper shell are arranged in sequence along a first direction, and a projection of the vapor chamber along the first direction covers at least a target area of the circuit board. In this scheme, a vapor chamber is arranged in the electronic device, and the projection of the vapor chamber along the first direction covers at least the target area of the circuit board. Thus, the vapor chamber can dissipate heat from the circuit board, and compared with the scheme of arranging multiple vapor chambers, the manufacturing cost can be reduced and the manufacturing process can be simplified.

[0036] In the above embodiments, the projection of the vapor chamber along the first direction covers at least the target area of the circuit board. At this time, the vapor chamber can serve as a shielding cover for electromagnetic interference (EMI) generated by the circuit board, and has an EMI shielding effect.

[0037] In the above embodiments, the vapor chamber, the circuit board, and the parasitic capacitance between the vapor chamber and the circuit board constitute a loop, the electromagnetic interference generated by the circuit board is limited in the loop, the electromagnetic wave emitted outward can be reduced, and thus the electromagnetic interference is suppressed.

[0038] In the above embodiments, the heat plate is a continuous whole heat plate, and in the plane formed by the heat plate, the EMI generated by the circuit board can circulate in the plane, reducing the electromagnetic waves emitted outward, thereby suppressing electromagnetic interference. BRIEF DESCRIPTION OF DRAWINGS

[0039] Fig. 1 is a structural schematic diagram of an electronic device;

[0040] Fig. 2A is a schematic diagram of a circuit board 12 and a heat plate 11;

[0041] Fig. 2B is a schematic diagram of a setting mode between a heat plate 11 and an EMI filter circuit;

[0042] Fig. 3 is a schematic diagram of a circuit board 12 and a heat plate 11;

[0043] Fig. 4 is a structural schematic diagram of part of an electronic device;

[0044] Fig. 5A is a schematic diagram of a fixing structure between a lower shell 14 and a heat plate 11;

[0045] Fig. 5B is an enlarged view of part M in Fig. 5A;

[0046] Fig. 5C is an enlarged view of part N in Fig. 5A;

[0047] Fig. 5D is an enlarged view of part S in Fig. 5A;

[0048] Fig. 6 is a structural schematic diagram of a positioning member 56.

[0049] In the above drawings, the heat plate 11, the circuit board 12, the upper shell 13, the lower shell 14, the first direction X, the first dotted line area 121, the second dotted line area 122, the third dotted line area 123, the first type through hole 31, the second type through hole 32, the third type through hole 33, the fourth type through hole 34, the sixth type through hole 35, the fifth type through hole 36, the glue leakage hole 37, the first smearing area 421, the second smearing area 422, the high-power device area 431 in the primary edge area, the high-power device area 432 in the secondary edge area, the first protrusion 441, the second protrusion 442, the EMI filter circuit area 45, the first positioning column 51, the first positioning hole 52, the limiting hole 53, the second positioning column 54, the second positioning hole 55, the positioning member 56, the supporting part 561, and the abutting part 562 are included. DETAILED DESCRIPTION

[0050] In order to make the above objectives, features and advantages of the present disclosure more clear and comprehensible, specific embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, the present disclosure can be practiced in many different ways from those described herein without departing from the scope of the present disclosure, and skilled in the art can make similar improvements without departing from the scope of the present disclosure, and therefore the present disclosure is not limited to the specific embodiments disclosed below.

[0051] In the description of the present disclosure, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present disclosure and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present disclosure.

[0052] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present disclosure, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0053] In the present disclosure, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0054] In the present disclosure, unless explicitly specified and limited, if there is a description such as "on" or "under" or the like between a first feature and a second feature, it can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, "over", "above" and "on" of the first feature to the second feature can be that the first feature is directly above or obliquely above the second feature, or only means that the first feature is horizontally higher than the second feature. "Under", "below" and "under" of the first feature to the second feature can be that the first feature is directly below or obliquely below the second feature, or only means that the first feature is horizontally lower than the second feature.

[0055] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present disclosure are only for illustrative purposes and do not represent the only implementation.

[0056] A power converter is a power conversion device for converting electrical energy from one form to another to achieve energy transmission and control under different power requirements. The power converter can be a micro-inverter, an energy storage converter, etc. For example, a micro-inverter can convert DC power into AC power. The DC input of the micro-inverter is connected to a DC source (a photovoltaic module), and the AC output of the power converter can be connected to an AC power grid and an AC device.

[0057] For example, in a micro-inverter, the devices on the circuit board generate a large amount of heat during operation. If the heat cannot be dissipated in time, the devices on the circuit board will be damaged, resulting in failure of the entire micro-inverter.

[0058] In the present disclosure, the electronic device can be the above-mentioned power converter. For example, a micro-inverter, an energy storage converter, etc. In the electronic device of the present disclosure, a heat spreader is provided, so that the heat spreader can dissipate heat from the circuit board in time.

[0059] It should be noted that the heat spreader in the present disclosure can also be applied to any electronic device provided with a circuit board other than the above-mentioned power converter.

[0060] Referring to FIG. 1, FIG. 1 is a structural schematic diagram of an electronic device in an embodiment of the present disclosure, the electronic device comprising: a shell, a vapor chamber 11 and a circuit board 12; the shell comprises an upper shell 13 and a lower shell 14, the lower shell 14, the vapor chamber 11, the circuit board 12 and the upper shell 13 are sequentially arranged along a first direction X (as shown by the dashed arrow in FIG. 1); wherein a projection of the vapor chamber 11 along the first direction X covers at least a target region of the circuit board 12.

[0061] As shown in FIG. 1, the vapor chamber 11 is arranged in the electronic device, and the projection of the vapor chamber 11 along the first direction X covers at least the target region of the circuit board 12, so that the vapor chamber 11 can realize heat dissipation of the circuit board 12, and the manufacturing cost can be reduced compared with the scheme of arranging multiple vapor chambers.

[0062] In some embodiments, the circuit board 12 can be a printed circuit board assembly (PCBA). The target region can be the entire region or a partial region of the circuit board 12. When the target region is a partial region of the circuit board 12, the projection of the vapor chamber 11 along the first direction X can cover the partial region of the circuit board 12, realizing heat dissipation of the partial region of the circuit board, which can reduce the size of the vapor chamber 11, reduce the manufacturing cost and simplify the manufacturing process compared with covering the entire region of the circuit board 12.

[0063] In the above embodiment, the projection of the vapor chamber 11 along the first direction X covers at least the target region of the circuit board 12, the vapor chamber 11, the circuit board 12 and the parasitic capacitance between the circuit board 12 constitute a loop, the electromagnetic interference generated by the circuit board 12 is limited in the loop, which can reduce the electromagnetic wave emitted outward, thereby suppressing the electromagnetic interference. And the vapor chamber 11 is a continuous whole vapor chamber, in the plane formed by the vapor chamber 11, the electromagnetic interference (EMI) generated by the circuit board 12 can be limited in the plane, which can reduce the electromagnetic wave emitted outward, thereby suppressing the electromagnetic interference. At this time, the vapor chamber 11 can be regarded as a shielding cover of the EMI generated by the circuit board 12, which has a shielding effect on the EMI.

[0064] Embodiment one:

[0065] The target region includes a first region on the circuit board 12 where the power consumption of the device is greater than a first preset threshold. The device on the circuit board 12 whose power consumption is greater than the first preset threshold has high power consumption, and thus generates more heat. The temperature of the first region is relatively high, and the heat dissipation demand is also relatively high. The projection of the vapor chamber 11 along the first direction covers the first region, which can make the heat dissipation effect of the first region better, thereby ensuring the normal work of the device in the first region and prolonging the service life of the working device.

[0066] The device on the circuit board 12 whose power consumption is greater than the first preset threshold can be defined as a high-power device, such as a metal oxide semiconductor field effect transistor (MOSFET). The first preset threshold can be set according to the relationship between the power consumption of the device and the generated heat in practice, and the demand for heat dissipation in the embodiments of the present disclosure, which are not limited by the embodiments of the present disclosure.

[0067] It should be noted that the projection of the vapor chamber 11 along the first direction X covering at least the target region of the circuit board 12 can be understood as follows: in the above embodiment one, the projection of the vapor chamber 11 along the first direction X not only covers the first region on the circuit board 12, but also includes some other regions on the circuit board 12.

[0068] Embodiment two:

[0069] The circuit board 12 includes a primary region and a secondary region. The primary region is the region where the DC circuit is located on the circuit board 12, and the secondary region is the region where the AC circuit is located on the circuit board 12.

[0070] For example, FIG. 2A is a schematic diagram of a circuit board 12 and a vapor chamber 11. As shown in FIG. 2A, the region on the circuit board 12 within the first dashed line region 121 is the secondary region, and the region on the circuit board 12 within the second dashed line region 122 is the primary region. The target region includes the primary region on the circuit board 12 and a second region in the secondary region on the circuit board 12 whose power consumption is greater than a second preset threshold. The second region can be the region on the circuit board 12 within the first dashed line region 121 and covered by the projection of the vapor chamber 11 in FIG. 2A.

[0071] It should be noted that the first dashed line region 121 and the second dashed line region 122 are example region divisions. The first dashed line region 121 is not a strict boundary of the secondary region, and the second dashed line region 122 is not a strict boundary of the primary region. The first dashed line region 121 is only an example region where the secondary region can fall into, and the second dashed line region 122 is only an example region where the primary region can fall into.

[0072] In some embodiments, the target region includes a second region in the sub-edge region on the circuit board 12 where the device power consumption is greater than a second preset threshold. The device in the second region on the circuit board 12 where the device power consumption is greater than the second preset threshold has a large power consumption, and thus generates a large amount of heat. The temperature of the second region is relatively high, and the heat dissipation requirement of the second region is also relatively high. The projection of the vapor chamber 11 in the first direction covers the second region, which can make the heat dissipation effect of the second region better, thereby ensuring the normal work of the device in the second region and prolonging the service life of the working device.

[0073] The second preset threshold can be set according to the relationship between the device power consumption and the generated heat in practice, and the heat dissipation requirement in the embodiments of the present disclosure, which is not limited in the embodiments of the present disclosure.

[0074] Embodiment three:

[0075] As shown in FIG. 2A, the target region does not include the EMI filter circuit region in the sub-edge region on the circuit board. The EMI filter circuit region is the region in the first dashed line region 121 on the circuit board 12 in FIG. 2A, which is not covered by the projection of the vapor chamber 11. The EMI filter circuit region can be in the third dashed line region 123 shown in FIG. 2A.

[0076] It should be noted that the third dashed line region 123 is an exemplary region division. The third dashed line region 123 shown is not a strict boundary of the EMI filter circuit region, and the third dashed line region 123 is only an exemplary region where the EMI filter circuit region can fall into.

[0077] In some embodiments, for example, as shown in FIG. 2B, it is a schematic diagram of a setting mode between the vapor chamber 11 and the EMI filter circuit. As shown in FIG. 2B, the vapor chamber 11 covers the circuit in the original edge region and the circuit in the sub-edge region on the circuit board 12, and the vapor chamber 11 does not extend to the region where the EMI filter circuit is located (such as the EMI filter circuit region 45 shown in FIG. 4). In this way, the vapor chamber 11 can avoid bypassing the EMI filter circuit, thereby improving the EMI suppression effect.

[0078] If the heat plate 11 in FIG. 2B extends to project to cover the EMI filter circuit region, at this time, due to the parasitic capacitance between the heat plate 11 and the circuit board 12, a low-impedance channel is formed between the parasitic capacitance and the heat plate 11, so that the EMI generated in the secondary side region is directly emitted through the low-impedance channel, and will not pass through the EMI filter circuit, so that the EMI filter circuit cannot achieve the filtering effect, thereby resulting in poor effect of suppressing EMI noise. Based on such consideration, the heat plate 11 in the present disclosure is arranged not to cover the EMI filter circuit region in the secondary side region, so as to improve the effect of suppressing EMI.

[0079] If the heat plate 11 in FIG. 2A extends to project to cover the EMI filter circuit region, as shown in FIG. 2A, it can be seen that there are many device pins 22 in the EMI filter circuit region on the circuit board 12, so that in order to meet the regulatory requirements, a large number of pin openings need to be arranged on the heat plate 11 corresponding to the EMI filter circuit region to avoid a large number of device pins 22, and since these pin openings will bring additional process cost. Therefore, in the present disclosure, the heat plate 11 is arranged not to cover the EMI filter circuit region in the secondary side region, so as to reduce the process cost and also ensure good heat dissipation effect.

[0080] Embodiment Four:

[0081] The target region can also be provided with a transformer, which is connected across the primary side region and the secondary side region.

[0082] In the above embodiment, the heat plate 11 extends to project below the magnetic core of the transformer, and is connected across the primary side pin and the secondary side pin of the transformer, and covers the circuit of the primary side region and the circuit of the secondary side region, so that an electromagnetic shielding layer can be formed inside the electronic device, and the EMC noise can be effectively suppressed.

[0083] It should be noted that the circuit board in the present disclosure is a circuit board assembly formed after various electronic components such as resistors, capacitors, inductors, diodes, transistors, integrated circuits, etc. are mounted on a printed circuit board (PCB) through surface mount technology (SMT) or plug-in technology, and a series of processes such as welding, cleaning, testing, etc. are performed.

[0084] In some embodiments, the heat plate 11 is provided with a first group of through holes, and the projection of the first group of through holes along the first direction X is located in the primary side region, and the first group of through holes are used for insulation.

[0085] In some embodiments, the heat plate 11 is provided with a second group of through holes, and the projection of the second group of through holes along the first direction X is located in the secondary side region, and the second group of through holes correspond to the device pins in the secondary side region.

[0086] In some embodiments, the second set of through holes can be used to meet the safety requirements, and the holes can be used to avoid the pins of the devices in the secondary side region on the circuit board 12.

[0087] In the present disclosure, if the projection of the heat plate 11 along the first direction covers the circuit of the primary side region, the heat plate 11 can be regarded as part of the circuit of the primary side region. The safety standard requires that the devices in the primary side region and the secondary side region on the circuit board 12 must be separated by a certain distance (for example, 6.3 mm). In order to meet the safety requirements, holes are opened on the heat plate 11 corresponding to the pins of the devices in the secondary side region, which can separate the devices in the secondary side region from the devices in the primary side region by a safe distance.

[0088] If the heat plate 11 is regarded as part of the circuit of the secondary side region, in order to meet the requirements, holes need to be opened on the heat plate 11 corresponding to the pins of the devices in the primary side region. If more holes are set in the primary side region, the primary side region cannot form a large continuous area for heat dissipation, which results in poor heat dissipation effect and high manufacturing complexity. Therefore, the present disclosure does not adopt such a setting method, but regards the heat plate 11 as part of the circuit of the primary side region and opens holes on the heat plate 11 corresponding to the pins of the devices in the secondary side region.

[0089] For example, FIG. 3 is a schematic diagram of a circuit board 12 and a heat plate 11. As shown in FIG. 3, the first set of through holes includes at least one of a first type of through hole 31, a second type of through hole 32, a third type of through hole 33, a fourth type of through hole 34, and a fifth type of through hole 36. The projection of the first type of through hole 31 along the first direction X corresponds to the pin of the Power Line Communication (PLC) communication transformer; the projection of the second type of through hole 32 along the first direction X corresponds to the pin of the capacitor; the projection of the third type of through hole 33 along the first direction X corresponds to the connector; the projection of the fourth type of through hole 34 along the first direction X corresponds to the pin of the primary side region of the transformer; and the projection of the fifth type of through hole 36 along the first direction X corresponds to the sampling pin of the current transformer CT.

[0090] For example, as shown in FIG. 3, the heat plate 11 is provided with a second set of through holes, and the second set of through holes includes a sixth type of through hole 35. The projection of the sixth type of through hole 35 along the first direction X corresponds to the pin of the secondary side region of the transformer.

[0091] It should be noted that the through holes shown in FIG. 3 and the pins of the devices are exemplary, and the specific positions and quantities of the through holes provided on the heat plate 11 and the specific positions and quantities of the pins on the circuit board 12 are not limited in the embodiments of the present disclosure, and can be set according to actual needs.

[0092] In the present disclosure, the above-mentioned heat plate 11 can be connected with the above-mentioned circuit board 12 through a heat-conducting glue to fill the gap between the heat plate 11 and the circuit board 12.

[0093] Exemplarily, the material of the above-mentioned heat-conducting glue can be silica gel, which can have good heat-conducting performance to rapidly conduct the heat of the circuit board 12 to the heat plate 11 to achieve good heat dissipation.

[0094] Exemplarily, the heat plate 11 in the electronic device includes a heat-conducting glue application area, and the projection of the heat-conducting glue application area along the first direction X coincides with the high-power device area.

[0095] The above-mentioned high-power device area can be the above-mentioned first area and / or the above-mentioned second area. The high-power device area is provided with a high-power device. Exemplarily, the device in the high-power device area can be a MOSFET.

[0096] Exemplarily, FIG. 4 is a structural schematic diagram of a part of an electronic device. As shown in FIG. 4, the heat plate 11 in the electronic device includes a heat-conducting glue application area, and the heat-conducting glue application area includes a first application area 421 and a second application area 422; the projection of the first application area 421 along the first direction X coincides with a high-power device area 431 in the primary side area; the projection of the second application area 422 along the first direction X coincides with a high-power device area 432 in the secondary side area.

[0097] The above-mentioned high-power device area 431 in the primary side area and the above-mentioned high-power device area 432 in the secondary side area are the main high-heat areas, and the heat-conducting glue is provided in correspondence with the two areas, which can save the amount of heat-conducting glue and avoid the heat of the high-heat areas from being conducted to other low-heat areas to cause damage to the devices in the other low-heat areas.

[0098] In some embodiments, as shown in FIG. 4, the heat plate 11 is provided with a first protrusion 441 and a second protrusion 442, the first application area 421 is arranged on the first protrusion 441, and the second application area 422 is arranged on the second protrusion 442. The above-mentioned first protrusion 441 and the above-mentioned second protrusion 442 are protrusion structures integrally formed on the heat plate 11.

[0099] In some embodiments, the heat spreading plate 11 can not be provided with the coating area, but only provided with the protrusions, and the projections of the protrusions along the first direction X coincide with the high-power device area. For example, the protrusions provided on the heat spreading plate 11 can be the first protrusions 441 and / or the second protrusions 442 shown in FIG. 4, and the high-power device area can be the high-power device area 431 in the primary edge area and / or the high-power device area 432 in the secondary edge area shown in FIG. 4. In the above-mentioned embodiments, the protrusions can not be coated with the thermal conductive glue.

[0100] In the above-mentioned embodiments, the heat spreading plate 11 is provided with the protrusions (such as the first protrusions 441 and / or the second protrusions 442), which can make the protrusions better contact and conduct the heat of the circuit board 12 (or the high-power device area on the circuit board 12, such as the high-power device area 431 in the primary edge area and / or the high-power device area 432 in the secondary edge area), increase the volume of the heat spreading plate 11 for heat conduction, and thus play a better heat dissipation effect.

[0101] In some embodiments, the thickness of the heat spreading plate 11 is greater than or equal to 0.5 mm.

[0102] In the above-mentioned embodiments, the heat spreading plate 11 has a large thickness (i.e., greater than 0.5 mm), which can make the heat spreading plate 11 have a better heat dissipation effect.

[0103] In some embodiments, the heat spreading plate 11 is made of metal. The heat spreading plate 11 can be a whole piece of metal material, and the manufacturing process of the whole piece of metal plate is relatively simple, which can save the manufacturing cost. In the above-mentioned embodiments, the heat spreading plate 11 can be an aluminum plate or a copper plate. Since the metal material has good heat conduction performance, the heat spreading plate 11 made of metal material can better dissipate the heat of the circuit board. Since the metal material also has good electrical conductivity, the heat spreading plate 11 made of metal material can make the EMI (electromagnetic wave) form a closed loop on the heat spreading plate 11, reduce the electromagnetic wave emitted outward, and thus improve the EMI effect.

[0104] For example, FIG. 5A is a schematic view of a fixing structure between the lower shell 14 and the heat spreading plate 11. As shown in FIG. 5A, the lower shell 14 is provided with a first positioning column 51 extending along the first direction X near the side of the heat spreading plate 11, the heat spreading plate 11 is provided with a first positioning hole 52, and the circuit board 12 is provided with a limiting hole 53, and the first positioning column 51 passes through the first positioning hole 52 and the limiting hole 53 in sequence.

[0105] In some embodiments, the first positioning column 51 includes a support table 511, and the circuit board 12 is carried on the support table 511, and the height of the support table 511 is greater than the thickness of the heat spreading plate 11.

[0106] Exemplarily, the support table 511 can be cross-shaped, which can be used not only for positioning the vapor chamber 11 but also for positioning the circuit board 12.

[0107] Exemplarily, the height of the support table 511 above the vapor chamber 11 can be 1 mm, so that the distance between the vapor chamber 11 and the circuit board 12 is 1 mm, for coating the thermally conductive glue.

[0108] In the above embodiment, the vapor chamber 11 can be fixed by the first positioning column 51, and the circuit board 12 can be supported and the movement of the circuit board 12 in the lateral direction can be limited.

[0109] In some embodiments, the lower shell 14 is provided with a second positioning column 54, the vapor chamber 11 is provided with a second positioning hole 55, the second positioning column 54 passes through the second positioning hole 55, and the height of the second positioning column 54 is the same as the thickness of the vapor chamber 11.

[0110] In the above embodiment, the second positioning column 54 can be used to limit the movement of the vapor chamber 11 in the lateral direction.

[0111] In some embodiments, as shown in FIG. 5A, the lower shell 14 is further provided with a plurality of positioning members 56 arranged around the edge of the vapor chamber 11.

[0112] FIG. 5B is a partial enlarged view of M in FIG. 5A, FIG. 5C is a partial enlarged view of N in FIG. 5A, and FIG. 5D is a partial enlarged view of S in FIG. 5A. As shown in FIG. 5D, the positioning member 56 can include an abutting portion 562 for abutting the outer side wall of the vapor chamber 11. As can be seen from FIGS. 5A, 5B, 5C and 5D, the fixing structure between the lower shell 14 and the circuit board 11.

[0113] Exemplarily, FIG. 6 is a structural schematic view of the positioning member 56. As shown in FIG. 6, the positioning member 56 can include a support portion 561 and an abutting portion 562 connected with each other, the vapor chamber 11 is carried on the support portion 561, and the outer side wall of the vapor chamber 11 abuts the abutting portion 562.

[0114] The support portion 561 is used to support the vapor chamber 11. The abutting portion 562 is used to abut the edge of the vapor chamber 11 to limit the movement of the vapor chamber 11 in the lateral direction.

[0115] In some embodiments, the height of the abutting portion 562 is greater than the thickness of the vapor chamber 11, so as to limit the movement of the vapor chamber 11 in the lateral direction.

[0116] In some embodiments, the heat plate 11 can be further provided with glue leakage holes 37 as shown in FIG. 3. Six glue leakage holes are shown in the example of FIG. 3, but the number of glue leakage holes 37 can be set according to requirements in practice. The glue leakage holes 37 are used to make the glue flow quickly through the heat plate 11.

[0117] The glue is used to seal all devices between the upper shell 13 and the lower shell 14 to prevent the influence of water vapor on the devices. The glue leakage holes 37 can make the glue flow quickly through the heat plate 11 to ensure that the glue flows to various positions, so that the glue can be more uniform in the shell and no bubbles are generated.

[0118] The technical features of the above embodiments can be combined in any manner. To make the description simple, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the disclosure.

[0119] The above embodiments only express several implementation manners of the disclosure, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the disclosure, and these all belong to the protection scope of the disclosure. Therefore, the protection scope of the patent of the disclosure should be subject to the appended claims.

Claims

1. An electronic device, wherein, The electronic device includes: The casing, a heat spreader, and a circuit board; The housing includes an upper housing and a lower housing, and the lower housing, the heat spreader, the circuit board and the upper housing are arranged sequentially along a first direction; The projection of the heat spreader along the first direction at least covers the target area of ​​the circuit board.

2. The electronic device according to claim 1, wherein, The target area includes a first area on the circuit board where the power consumption of the devices is greater than a first preset threshold.

3. The electronic device according to claim 1, wherein, The target area includes: the primary edge area on the circuit board, and the secondary edge area where the power consumption of the device is greater than the second preset threshold.

4. The electronic device according to any one of claims 1-3, wherein, The target area does not include the electromagnetic interference (EMI) filter circuit area in the secondary side area of ​​the circuit board.

5. The electronic device according to any one of claims 1-3, wherein, A transformer is installed in the target area, and the transformer is connected across the primary side area and the secondary side area.

6. The electronic device according to claim 3, wherein, The heat spreader plate is provided with a first set of through holes, the projection of the first set of through holes along the first direction is located in the original edge region, and the first set of through holes is used for insulation.

7. The electronic device according to claim 6, wherein, The first group of through holes includes at least one of the following: a first type of through hole, a second type of through hole, a third type of through hole, a fourth type of through hole, and a fifth type of through hole; The projection of the first type of through hole along the first direction corresponds to the power line communication PLC communication transformer pin. The projection of the second type of through hole along the first direction corresponds to the capacitor pin; The third type of through hole corresponds to the connector along the first direction. The projection of the fourth type of through hole along the first direction corresponds to the primary side region pin of the transformer. The projection of the fifth type of through hole along the first direction corresponds to the current transformer CT sampling pin.

8. The electronic device according to claim 3, wherein, The heat spreader is provided with a second set of through holes. The projection of the second set of through holes along the first direction is located in the secondary side area. The second set of through holes corresponds to the device pins in the secondary side area.

9. The electronic device according to claim 8, wherein, The second group of vias includes a sixth type of via, the projection of which along the first direction corresponds to the secondary side region pin of the transformer.

10. The electronic device according to claim 2 or 3, wherein, The heat spreader includes a thermally conductive adhesive application area, the projection of which along the first direction coincides with the high-power device area.

11. The electronic device according to claim 10, wherein, The thermally conductive adhesive application area includes: a first application area and a second application area; The projection of the first coating area along the first direction coincides with the high-power device area in the original edge area; The projection of the second coating area along the first direction coincides with the high-power device area in the secondary side area.

12. The electronic device according to claim 11, wherein, The heat spreader plate is provided with a first protrusion and a second protrusion, the first coating area is provided on the first protrusion, and the second coating area is provided on the second protrusion.

13. The electronic device according to claim 1, wherein, The heat spreader is provided with protrusions, and the projection of the protrusions along the first direction coincides with the area of ​​the high-power device.

14. The electronic device according to claim 1, wherein, The thickness of the heat spreader is greater than or equal to 2 mm.

15. The electronic device according to claim 1, wherein, The heat spreader is made of metal.

16. The electronic device according to claim 1, wherein, A first positioning post extending along the first direction is provided on the side of the lower housing near the heat spreader plate. A first positioning hole is provided on the heat spreader plate. A limit hole is provided on the circuit board. The first positioning post passes through the first positioning hole and the limit hole in sequence.

17. The electronic device according to claim 16, wherein, The first positioning column includes a support platform, on which the circuit board is supported, and the height of the support platform is greater than the thickness of the heat spreader.

18. The electronic device according to claim 1, wherein, The lower housing is provided with a second positioning post, and the heat spreader is provided with a second positioning hole. The second positioning post passes through the second positioning hole, and the height of the second positioning post is the same as the thickness of the heat spreader.

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