Package element

Abstract

This package element is provided with: a package having one main surface facing one side in the thickness direction and the other main surface facing the other side in the thickness direction; an internal element provided inside the package; a one-side external electrode that is provided on the one main surface and to which a conductive wire is electrically connected; and an internal electrode that is provided between the internal element and the one-side external electrode inside the package and on which the internal element is mounted. The other main surface is a surface opposite a mounting surface on which the package element is mounted. The internal electrode is electrically connected to the internal element and the one-side external electrode. When viewed along the thickness direction, the one-side external electrode is larger than the internal electrode.

Description

Packaged Elements

[0001] The present disclosure relates to packaged devices in which internal components are contained within the package.

[0002] Patent Document 1 discloses, as an example of a package element, a component-embedded substrate in which circuit components corresponding to internal elements are embedded in a resin layer corresponding to a package. In the component-embedded substrate, a metal plating layer is provided on the lower surface of the resin layer. The metal plating layer has an inner surface facing the interior of the component-embedded substrate and an outer surface exposed to the exterior of the component-embedded substrate. The circuit components provided inside the resin layer are electrically connected to the inner surface of the metal plating layer. The outer surface of the metal plating layer can be connected to an external substrate or the like via solder, silver (Ag), or the like.

[0003] Patent No. 5012896

[0004] When the component-embedded substrate disclosed in Patent Document 1 is mounted on an external substrate, the mounting position of the component-embedded substrate on the external substrate may be restricted by the presence of other electronic components and wiring patterns on the external substrate, the need to ensure sufficient dielectric strength between the component-embedded substrate and the external substrate, etc. For example, although it is necessary to provide lands for mounting the component-embedded substrate on the external substrate, there are cases in which it is not possible to provide such lands due to the presence of other wiring patterns, etc.

[0005] Furthermore, when the component-embedded substrate disclosed in Patent Document 1 is mounted on an external substrate, the resin layer located between the circuit component and the external substrate is thin, which may cause the thin portion of the resin layer to be insufficiently strong against stress acting on the component-embedded substrate due to temperature changes, etc.

[0006] Therefore, an object of the present disclosure is to solve the above-mentioned problems by providing a package element that can reduce restrictions on the mounting position and can suppress a decrease in strength against stress.

[0007] A package element according to one embodiment of the present disclosure is a package element comprising: a package having one main surface facing one side in a thickness direction and another main surface facing the other side in the thickness direction; and an internal element provided inside the package, wherein the package comprises: a one-side external electrode provided on the one main surface and to which a conductive wire is electrically connected; and an internal electrode provided inside the package between the internal element and the one-side external electrode and on which the internal element is mounted; the other main surface is a surface facing a mounting surface on which the package element is mounted; the internal electrode is electrically connected to the internal element and the one-side external electrode; and the one-side external electrode is larger than the internal electrode when viewed along the thickness direction.

[0008] According to the present disclosure, it is possible to provide a packaged element that can reduce restrictions on the mounting position and can suppress a decrease in strength against stress.

[0009] 5 is a side view showing a substrate, a heating element, and a packaged element according to a first embodiment of the present disclosure; a plan view showing a packaged element according to a first embodiment of the present disclosure; a bottom view showing a packaged element according to a first embodiment of the present disclosure; a cross-sectional view showing the IV-IV section of FIG. 2; a plan view showing a packaged element according to a second embodiment of the present disclosure; a cross-sectional view showing the VI-VI section of FIG. 5; a plan view showing a packaged element according to a third embodiment of the present disclosure; a cross-sectional view showing the VIII-VIII section of FIG. 7; a cross-sectional view corresponding to the VIII-VIII section of FIG. 7 of a packaged element according to a fourth embodiment of the present disclosure;

[0010] An example of the present disclosure will now be described with reference to the accompanying drawings. The following description is merely illustrative in nature and is not intended to limit the present disclosure, its applications, or its uses. The drawings are schematic, and the dimensional ratios and the like do not necessarily correspond to reality. In the following description, terms indicating specific directions or positions (e.g., terms including "upper," "lower," "right," "left," "front," and "rear") may be used as necessary. The present specification and drawings define the X, Y, and Z directions. The Z direction is the thickness direction of the packaged element, and the X and Y directions are directions perpendicular to the thickness direction of the packaged element. The X and Y directions intersect each other (orthogonal in the present specification and drawings). The use of the terms indicating specific directions or positions described above is intended to facilitate understanding of the present disclosure with reference to the drawings, and the meanings of these terms do not limit the technical scope of the present disclosure.

[0011] First Embodiment The packaged element is provided in, for example, a power module or the like provided in an electric vehicle, a household electrical appliance, or the like. In each embodiment of this specification, the packaged element is a temperature sensor in which a temperature-sensing element for detecting temperature is built into the package. A temperature sensor is an example of a packaged element, and a temperature-sensing element is an example of an internal element. In other words, the packaged element is not limited to a temperature sensor, and the internal element is not limited to a temperature-sensing element. For example, the packaged element may be a capacitor element, which is an example of an internal element, built into the package, or an inductor element, which is an example of an internal element, built into the package.

[0012] FIG. 1 is a side view showing a substrate, a heating element, and a packaged element according to a first embodiment of the present disclosure. As shown in FIG. 1 , a temperature sensor 10, which is an example of a packaged element, is mounted on a mounting surface 2A of a substrate 2 provided on a power module or the like. A heating element 4 is mounted on the mounting surface 2A of the substrate 2. The heating element 4 is, for example, a semiconductor chip mounted on a power module. The temperature sensor 10 is mounted near the heating element 4. Most of the heat generated by the heating element 4 is transferred to the temperature sensor 10 via the substrate 2. The temperature sensor 10 detects the temperature of the heating element 4. The temperature sensor 10 outputs, for example, information about the temperature that changes in accordance with a change in the temperature of the heating element 4 to the outside via a wire 6 or the like. The information about the temperature of the heating element 4 is, for example, a current value or a voltage value within the temperature sensor 10.

[0013] Fig. 2 is a plan view showing the packaged element according to the first embodiment of the present disclosure, Fig. 3 is a bottom view showing the packaged element according to the first embodiment of the present disclosure, and Fig. 4 is a cross-sectional view showing the cross section IV-IV of Fig. 2.

[0014] As shown in FIGS. 2 to 4, the temperature sensor 10 includes a package 20, a temperature sensitive element 30, one external electrode 40, the other external electrode 50, and an internal electrode 60.

[0015] In the first embodiment, the package 20 is made of an insulating material such as ceramic, glass filler, or epoxy resin. Examples of ceramic include alumina, silicon nitride, and aluminum nitride. Silicon dioxide, magnesium oxide, or the like may be added to alumina. Silica or the like is used as the glass filler. Note that the materials constituting the package 20 are not limited to the ceramic, glass filler, and epoxy resin described above.

[0016] The package 20 has one main surface 20A facing one side in the Z direction and another main surface 20B facing the other side in the Z direction. As shown in FIGS. 2 and 4 , a one-side external electrode 40 is provided on the one main surface 20A. As shown in FIGS. 3 and 4 , a other-side external electrode 50 is provided on the other main surface 20B. As shown in FIGS. 2 and 4 , a temperature sensing element 30 and an internal electrode 60 are provided inside the package 20. As shown in FIG. 4 , a portion of the internal electrode 60 is exposed on the surface of the package 20, and this exposed portion is in contact with the one-side external electrode 40 in the Z direction. Note that in FIG. 2 and FIGS. 5 and 7 described below, portions (e.g., the temperature sensing element 30) provided inside the package 20 and not visible from the outside are indicated by dashed lines.

[0017] The one-side external electrode 40, the other-side external electrode 50, and the internal electrode 60 are formed by, for example, baking, plating, or sputtering a conductive material. Examples of conductive materials include silver (Ag), molybdenum (Mo), copper (Cu), and titanium (Ti). For example, first, the internal electrode 60 is formed on one main surface 20A of the package 20, and then the one-side external electrode 40 is formed on the one main surface 20A of the package 20 so as to cover the internal electrode 60. The other-side external electrode 50 is formed on the other main surface 20B of the package 20.

[0018] An electrode surface layer may be formed to cover the conductive material. The electrode surface layer may have, for example, a three-layer structure of nickel (Ni), palladium (Pd), and gold (Au), or a single-layer structure of tin (Sn). The one-side external electrode 40, the other-side external electrode 50, and the internal electrode 60 may be formed by various known methods, not limited to the above-mentioned methods.

[0019] In the first embodiment, the size of the package 20 is 2 mm in the X direction, 1.25 mm in the Y direction, and 0.85 mm in the Z direction, but is not limited to these sizes.

[0020] 2 and 4 is an electrode for extracting the characteristics of the temperature sensitive element 30. The characteristics of the temperature sensitive element 30 are, for example, a current value that varies depending on the temperature of the temperature sensitive element 30. The characteristics of the temperature sensitive element 30 correspond to information related to temperature that changes with the temperature change of the heating element 4.

[0021] As shown in Figures 2 and 4, in the first embodiment, the temperature sensor 10 has two one-side external electrodes 40. The two one-side external electrodes 40 are a first one-side external electrode 41 and a second one-side external electrode 42. The first one-side external electrode 41 and the second one-side external electrode 42 are arranged side by side in the X direction. The number of one-side external electrodes 40 is not limited to two. The position, size, and shape of the one-side external electrode 40 are not limited to those shown in Figures 2 and 4.

[0022] Each of the first one-side external electrode 41 and the second one-side external electrode 42 is electrically connected to the outside of the temperature sensor 10 via a conductive wire 6 (see FIG. 1 ) made of aluminum or the like. Although one wire 6 is shown in FIG. 1 , in reality, a different wire 6 is connected to each of the first one-side external electrode 41 and the second one-side external electrode 42. In other words, two wires 6 are connected to the temperature sensor 10. In the first embodiment, the diameter of the wire 6 is 300 μm, but the diameter of the wire 6 is not limited to 300 μm.

[0023] When viewed along the Z direction, the outer edge 40A of the one-side external electrode 40 is located inside the outer edge 20C of the package 20.

[0024] In the first embodiment, the size of the one external electrode 40 is, but is not limited to, 0.8 mm or more in the X direction, 1.0 mm or more in the Y direction, and 0.02 mm in the Z direction. Furthermore, the surface roughness of the one external electrode 40 is, but is not limited to, a maximum height (Sz), which is the sum of the maximum peak height (Sp) and the maximum valley depth (Sv), of 15 μm or less.

[0025] 3 and 4 is for mounting the temperature sensor 10 on the substrate 2 (see FIG. 1) by solder reflow. In the first embodiment, the other main surface 20B of the temperature sensor 10 is joined to the substrate 2 via the other external electrode 50. The other main surface 20B is a surface that faces in the Z direction relative to the mounting surface 2A of the substrate 2 on which the temperature sensor 10 is mounted.

[0026] The means for joining the temperature sensor 10 to the substrate 2 is not limited to solder reflow, and other known means such as sintering may also be used. For example, when the temperature sensor 10 is mounted by sintering, the other-side external electrode 50 is made of silver (Ag). The temperature sensor 10 is joined to the substrate 2 by sintering a sintering paste made of this silver (Ag) at a high temperature. Furthermore, the temperature sensor 10 does not necessarily have to include the other-side external electrode 50. In this case, the temperature sensor 10 can be joined to the substrate 2 by known means such as an adhesive.

[0027] The other external electrode 50 is electrically insulated from the temperature sensing element 30 , the one external electrode 40 , and the internal electrode 60 .

[0028] As shown in Fig. 3 , in the first embodiment, the temperature sensor 10 has four other-side external electrodes 50. The four other-side external electrodes 50 are a first other-side external electrode 51, a second other-side external electrode 52, a third other-side external electrode 53, and a fourth other-side external electrode 54. The first other-side external electrode 51, the second other-side external electrode 52, the third other-side external electrode 53, and the fourth other-side external electrode 54 are arranged two by two in each of the X direction and the Y direction. Note that the number of other-side external electrodes 50 is not limited to four. The position, size, and shape of the other-side external electrodes 50 are not limited to the position, size, and shape shown in Figs. 3 and 4 .

[0029] When viewed along the Z direction, the outer edge 50 A of the other external electrode 50 is located inside the outer edge 20 C of the package 20 .

[0030] As shown in Figures 2 and 4, the internal electrode 60 is provided inside the package 20 as described above. As shown in Figure 4, the internal electrode 60 is provided between the temperature sensing element 30 and the one-side external electrode 40 in the Z direction. In the first embodiment, the thickness T of the internal electrode 60 (in other words, the length of the internal electrode 60 in the Z direction) is 20 µm or more. The thickness T may be less than 20 µm. In the first embodiment, the X-direction gaps G1 and G2 between the X-direction inner edge of the internal electrode 60 and the X-direction inner edge of the one-side external electrode 40 are 10 µm or more. The gaps G1 and G2 may be less than 10 µm. The gaps G1 and G2 may be the same value or different values.

[0031] In the first embodiment, the temperature sensor 10 has two internal electrodes 60. The two internal electrodes 60 are a first internal electrode 61 and a second internal electrode 62. The first internal electrode 61 and the second internal electrode 62 are arranged side by side in the X direction. The number of internal electrodes 60 is not limited to two. The position, size, and shape of the internal electrodes 60 are not limited to those shown in FIGS. 2 and 4 .

[0032] As described above, a portion of the internal electrode 60 is exposed on the surface of the package 20, and this exposed portion is covered by and in contact with the one-side external electrode 40 in the Z direction (see FIG. 4 ). As a result, the internal electrode 60 is electrically connected to the one-side external electrode 40.

[0033] 2 , when viewed along the Z direction, the internal electrode 60 is smaller than the one-side external electrode 40. Furthermore, when viewed along the Z direction, the outer edge 60A of the internal electrode 60 is located more inward than the outer edge 40A of the one-side external electrode 40.

[0034] 2 and 4, the temperature sensing element 30 is provided inside the package 20 as described above. In the first embodiment, the temperature sensing element 30 is a surface-mounted thermistor element. In the first embodiment, the temperature sensing element 30 has two element electrodes. One of the two element electrodes is a positive electrode, and the other of the two element electrodes is a negative electrode.

[0035] The two element electrodes are formed on the surface of the temperature sensing element 30 by baking, plating, sputtering, or the like of a conductive material. Examples of the conductive material include silver (Ag), silver-palladium (AgPd), copper (Cu), etc. Note that, like the conductive material of the internal electrode 60, an electrode surface layer may be formed so as to cover the element electrodes.

[0036] The temperature sensitive element 30 is mounted on an internal electrode 60. More specifically, as shown in Fig. 2, one of the two element electrodes is metal-bonded to a first internal electrode 61 via a bonding material 31 such as solder or a conductive adhesive, and the other of the two element electrodes is metal-bonded to a second internal electrode 62 via a bonding material 32 such as solder or a conductive adhesive. In this way, the temperature sensitive element 30 is electrically connected to the internal electrode 60.

[0037] Therefore, the temperature sensitive element 30 is electrically connected to the first one-side external electrode 41 via the first internal electrode 61 and electrically connected to the second one-side external electrode 42 via the second internal electrode 62 .

[0038] As a result, the current flowing through the temperature sensor 30 is output from the external electrode 40 on one side to the outside of the temperature sensor 10 via the wire 6 (see FIG. 1). The temperature inside the temperature sensor 30 is detected according to the value of this current. For example, if the temperature sensor 30 is an NTC thermistor (negative temperature coefficient thermistor), the resistance of the temperature sensor 30 decreases as the temperature inside the temperature sensor 30 increases, and therefore the current output to the outside increases. When the temperature inside the temperature sensor 30 increases due to the heat generated by the heating element 4 (see FIG. 1) being transferred to the temperature sensor 10, the current output to the outside of the temperature sensor 10 increases.

[0039] When the temperature-sensing element 30 is a thermistor element, the temperature-sensing element 30 is not limited to an NTC thermistor, but may be, for example, a PTC thermistor (positive temperature coefficient thermistor). The temperature-sensing element 30 is not limited to a thermistor element as long as it is an element that can detect temperature by changing its characteristics in response to temperature. For example, the temperature-sensing element 30 may be a platinum-side temperature resistor (a so-called Pt sensor).

[0040] 4, the distance D1 in the Z direction from the other side position of the temperature sensing element 30 closest to the other main surface 20B in the Z direction to the other main surface 20B is longer than the distance D2 in the Z direction from the other side position to the one main surface 20A. In the first embodiment, the other side position of the temperature sensing element 30 is the surface 30A of the temperature sensing element 30 facing the other main surface 20B.

[0041] For example, the distance D1 is designed to be 40 μm or more, and the volume resistivity between the other main surface 20B of the package 20 and the temperature sensitive element 30 is 0.1×10 １１ By combining the design of the distance D1 and the volume resistivity, a dielectric strength of 3.5 KV or more can be obtained.

[0042] The temperature sensor 10 according to the first embodiment can achieve the following effects.

[0043] According to the first embodiment, the other main surface 20B of the temperature sensor 10 is joined to the mounting surface 2A of the substrate 2, thereby making it possible to mount the temperature sensor 10 on the substrate 2. The temperature sensor 10 is also electrically connected to the outside via the wire 6 connected to the one external electrode 40 provided on the one main surface 20A.

[0044] According to the first embodiment, the temperature sensor 10 is electrically connected to the outside via the wire 6, which reduces restrictions on the mounting position of the temperature sensor 10 on the substrate 2 due to the presence of other electronic components and wiring patterns on the substrate 2. For example, it is not necessary to provide a land on the substrate 2 for electrically connecting the temperature sensor 10 to the wiring patterns on the substrate 2. Furthermore, for example, because the temperature sensor 10 is electrically connected via the wire 6, the temperature sensor 10 can be mounted even in a position on the substrate 2 where an excessively large potential is applied.

[0045] In the component-embedded substrate disclosed in Patent Document 1, when electrically connecting to the outside via a wire, an additional configuration is required. Specifically, in addition to the metal plating layer provided on the lower surface of the resin layer, a metal plating layer for connecting a wire needs to be provided on the upper surface of the resin layer, and then via conductors or the like need to be added to electrically connect the upper and lower metal plating layers to each other. However, according to the first embodiment, such an addition is not necessary.

[0046] Furthermore, according to the first embodiment, because there is no electrical connection between the temperature sensor 30 and the other main surface 20B, it is easy to configure the temperature sensor 10 so that the temperature sensor 30 is located near the one main surface 20A and away from the other main surface 20B. This allows the length between the temperature sensor 30 and the substrate 2 in the package 20 to be increased. This long length increases the dielectric strength between the temperature sensor 30 and the substrate 2 when the other main surface 20B of the temperature sensor 10 is bonded to the mounting surface 2A of the substrate 2, and also prevents a decrease in the strength of the package 20 against stress acting on the temperature sensor 10. As a result, restrictions on the mounting position of the temperature sensor 10 due to dielectric strength and stress can be reduced.

[0047] According to the first embodiment, the other external electrode 50 can be used as a mounting electrode when mounting the temperature sensor 10 on the substrate 2, etc. This allows the temperature sensor 10 and the mounting surface 2A, etc. to be joined by various means such as solder reflow or sintering.

[0048] According to the first embodiment, the outer edge 50A of the other-side external electrode 50 is located inside the outer edge 20C of the package 20 when viewed along the Z direction. Therefore, when joining the temperature sensor 10 to the mounting surface 2A or the like by solder reflow, sintering, or the like, it is possible to reduce the amount of solder or paste such as silver (Ag) that is used protruding outside the outer edge 20C of the package 20. Furthermore, when the substrate is cut in the manufacturing process of the temperature sensor 10, it is possible to reduce the occurrence of burrs at the outer edge 50A of the other-side external electrode 50. Furthermore, when the temperature sensor 10 is reflow-mounted on the substrate 2, it is possible to reduce mounting misalignment, rotation, and tilt of the temperature sensor 10 with respect to the substrate 2. Furthermore, because the other-side external electrode 50 is divided into multiple pieces (four in the first embodiment), it is possible to more effectively reduce the occurrence of burrs and mounting misalignment, as described above, compared to a configuration in which the other-side external electrode 50 is not divided.

[0049] According to the first embodiment, the distance D1 in the Z direction from the other side position of the temperature sensing element 30 closest to the other main surface 20B in the Z direction to the other main surface 20B is longer than the distance D2 in the Z direction from the other side position to the one main surface 20A. The longer distance D1 can increase the dielectric strength between the temperature sensing element 30 and the substrate 2 and suppress a decrease in the strength of the package 20 against stress acting on the temperature sensor 10. As a result, restrictions on the mounting position of the temperature sensor 10 due to dielectric strength and stress can be reduced.

[0050] According to the first embodiment, the one external electrode 40 and the internal electrode 60 are in contact with each other in the Z direction. Therefore, the internal electrode 60 and the one external electrode 40 can be electrically connected without adding a via conductor or other configuration. Furthermore, an increase in the thickness of the temperature sensor 10 can be suppressed.

[0051] In a configuration in which the outer edge 60A of the internal electrode 60 is located outside the outer edge 40A of the one-side external electrode 40 as viewed along the Z direction, the internal electrode 60 is provided near the outer edge 20C of the package 20. Therefore, the one-side external electrode 40 cannot be provided near the outer edge 20C of the package 20. On the other hand, in a configuration in which the outer edge 60A of the internal electrode 60 is located inside the outer edge 40A of the one-side external electrode 40 as viewed along the Z direction, as in the first embodiment, the one-side external electrode 40 can be provided near the outer edge 20C of the package 20. Therefore, the ratio of the area of ​​the one-side external electrode 40 to the area of ​​the one main surface 20A can be increased. This allows the one-side external electrode 40 to be enlarged while maintaining the size of the package 20. By enlarging the one-side external electrode 40, a thicker wire 6 can be connected to the one-side external electrode 40.

[0052] Second Embodiment Fig. 5 is a plan view showing a package element according to a second embodiment of the present disclosure. Fig. 6 is a cross-sectional view showing a cross section taken along line VI-VI in Fig. 5. A temperature sensor 10A, which is an example of a package element according to the second embodiment, differs from the temperature sensor 10 according to the first embodiment in that it includes an internal member 70. Differences from the first embodiment will be described below. Components in common with the temperature sensor 10 according to the first embodiment are denoted by the same reference numerals, and their description will be omitted in principle, and will be described only when necessary.

[0053] 5 and 6 , the temperature sensor 10A includes one or more internal members 70. The internal members 70 are provided inside the package 20. The internal members 70 are made of a material that is harder than the package 20. In other words, the internal members 70 are made of a material that has a greater modulus of elasticity than the package 20.

[0054] In the second embodiment, the temperature sensor 10A includes four internal members 70. The four internal members 70 are provided near the temperature sensing element 30 in a direction perpendicular to the Z direction. The four internal members 70 are provided two on each side of the temperature sensing element 30 in the Y direction. The internal members 70 are cylindrical and made of metal such as copper (Cu), copper nitride (Cu3N), a copper-tin alloy (Cu-Sn), phosphor bronze, a copper-magnesium-zinc alloy, a copper-nickel alloy (Cu-Ni), and a copper-iron alloy (Cu-Fe).

[0055] The shape, size, and position of the internal member 70 are not limited to those shown in Figures 5 and 6. Although the four internal members 70 have the same shape and size in Figures 5 and 6, they may have different shapes or sizes. The internal member 70 may be made of metal only, or may contain metal in part. The internal member 70 may also be made of a material other than metal.

[0056] In the second embodiment, the internal member 70 is electrically insulated from the one-side external electrode 40, the other-side external electrode 50, and the internal electrode 60, but may be electrically connected to these electrodes.

[0057] The temperature sensor 10A according to the second embodiment can achieve the following effects.

[0058] According to the second embodiment, the strength of the temperature sensor 10A can be increased compared to a configuration that does not include the internal member 70.

[0059] According to the second embodiment, since the internal member 70 is made of metal, the transfer of heat from the outside of the temperature sensor 10A to the temperature sensitive element 30 can be improved.

[0060] Third Embodiment Fig. 7 is a plan view showing a packaged element according to a third embodiment of the present disclosure. Fig. 8 is a cross-sectional view showing the VIII-VIII cross section of Fig. 7. A temperature sensor 10B, which is an example of a packaged element according to the third embodiment, differs from the temperature sensor 10 according to the first embodiment in that the package 20 includes a first package 21 and a second package 22. Differences from the first embodiment will be described below. Components in common with the temperature sensor 10 according to the first embodiment are denoted by the same reference numerals, and their description will be omitted in principle, and will be described only when necessary.

[0061] 7 and 8, the package 20 includes a first package 21 and a second package 22. The first package 21 and the second package 22 may be in contact with each other, or another member may be interposed between them.

[0062] The first package 21 has an other main surface 20B. The temperature sensing element 30 is provided inside the first package 21. The internal electrode 60 is provided on a surface 21B of the first package 21 opposite the other main surface 20B in the Z direction.

[0063] Each of the two internal electrodes 60, the first internal electrode 61 and the second internal electrode 62, has a first portion 60B, a second portion 60C, and a third portion 60D. The first portion 60B is electrically connected to the temperature sensing element 30. The second portion 60C is electrically connected to a via conductor 221, which will be described later. The third portion 60D connects the first portion 60B and the second portion 60C. In other words, the first portion 60B and the second portion 60C are electrically connected via the third portion 60D.

[0064] The second package 22 is stacked on the opposite surface 21B. That is, the internal electrode 60 is located between the first package 21 and the second package. The second package 22 has one main surface 20A. The one main surface 20A is the surface of the second package 22 opposite to the first package 21 in the Z direction.

[0065] The second package 22 has via conductors 221 that penetrate the second package 22 in the Z direction. The via conductors 221 are holes that penetrate the second package 22 in the Z direction and are filled with a conductive material such as copper or aluminum.

[0066] The via conductor 221 is electrically connected to the one-side external electrode 40 at an end portion on the one main surface 20A side in the Z direction. The via conductor 221 is electrically connected to the second portion 60C of the internal electrode 60 at an end portion on the opposite surface 21B side in the Z direction. In other words, the internal electrode 60 and the one-side external electrode 40 are electrically connected to each other via the via conductor 221.

[0067] In the second embodiment, both the first package 21 and the second package 22 are made of the same insulating material as in the first embodiment. Note that the first package 21 and the second package 22 may be made of the same material or different materials.

[0068] The temperature sensor 10B according to the third embodiment can achieve the following effects.

[0069] According to the third embodiment, the second package 22 is provided between the one main surface 20A and the temperature-sensing element 30, thereby reducing the impact transmitted to the temperature-sensing element 30 from the one main surface 20A side outside the temperature sensor 10B.

[0070] <Fourth Embodiment> Figure 9 is a cross-sectional view of a packaged element according to a fourth embodiment of the present disclosure, corresponding to the cross section VIII-VIII in Figure 7. A temperature sensor 10C, which is an example of a packaged element according to the fourth embodiment, differs from the temperature sensor 10B according to the third embodiment in that the package 20 includes a first package 21A, a second package 22A, and a third package 23A. The differences from the third embodiment will be described below. Components common to the temperature sensor 10B according to the third embodiment are denoted by the same reference numerals, and their description will be omitted in principle, and will be described only when necessary.

[0071] As shown in FIG. 9, the package 20 of the temperature sensor 10C includes a first package 21A, a second package 22A, and a third package 23A.

[0072] The first package 21A has the other main surface 20B. The second package 22A has one main surface 20A. The third package 23A is located between the first package 21A and the second package 22A in the Z direction. That is, the first package 21A, the third package 23A, and the second package 22A are stacked in this order along the Z direction. Adjacent packages among the first package 21A, the second package 22A, and the third package 23A may be in contact with each other, or another member may be interposed between them.

[0073] The temperature sensing element 30 is provided inside the third package 23A. The internal electrode 60 is provided on a surface 23Aa of the third package 23 that faces the second package 22A in the Z direction. The second package 22A is stacked on the surface 23Aa. In other words, the internal electrode 60 is located between the second package 22A and the third package 23A.

[0074] The second package 22A has via conductors 221 that penetrate the second package 22A in the Z direction. The via conductors 221 are holes that penetrate the second package 22A in the Z direction and are filled with a conductive material such as copper or aluminum. As in the third embodiment, the internal electrode 60 and the one-side external electrode 40 are electrically connected to each other through the via conductors 221.

[0075] The thickness T1 of the first package 21A is substantially the same as the thickness T2 of the second package 22A. "Substantially the same" includes not only a match within an acceptable error range determined by a person skilled in the art, but also a perfect match. The thicknesses of the first package 21A and the second package 22A do not have to be substantially the same.

[0076] The thickness T4 of the temperature sensing element 30 is 60% or less of the sum of the thickness T1 of the first package 21A, the thickness T2 of the second package 22A, and the thickness T3 of the third package 23A. In other words, T4 <= (T1 + T2 + T3) × (60 / 100). The thickness is the length in the Z direction. The thickness T4 may be 40% or less of the sum of the thicknesses T1, T2, and T3. In other words, T4 <= (T1 + T2 + T3) × (40 / 100).

[0077] In the fourth embodiment, the thicknesses T1 and T2 of the first package 21A and the second package 22A are 0.075 mm or more. The thicknesses of the first package 21A and the second package 22A may be less than 0.075 mm.

[0078] The main material of the first package 21A and the main material of the second package 22A are the same type. The main material of the third package 23A is a different type from the main material of the first package 21A and the main material of the second package 22A. When a package contains multiple types of materials, the main material is the material with the largest content. When a package is made of one type of material, the main material is that one type of material.

[0079] The primary material of the first package 21A and the primary material of the second package 22A may be different types, and the primary material of the third package 23A may be the same type as the primary material of the first package 21A or the primary material of the second package 22A.

[0080] In the fourth embodiment, the main material of the first package 21A and the main material of the second package 22A are glass epoxy. The main material of the first package 21A and the main material of the second package 22A may be a material other than glass epoxy.

[0081] In the fourth embodiment, the glass transition temperature of the glass epoxy that is the main material of the first package 21A and the second package 22A is 150°C or higher. The glass transition temperature of the glass epoxy may be 200°C or higher. The thermal expansion coefficient of the glass epoxy is 15 ppm / °C or lower. The glass transition temperature of the glass epoxy may be lower than 150°C, or the thermal expansion coefficient of the glass epoxy may be higher than 15 ppm / °C.

[0082] The primary material of the first package 21A and the primary material of the second package 22A may be ceramic. The primary material of the first package 21A and the primary material of the second package 22A may be a material other than ceramic.

[0083] The ceramic that is the main material of the first package 21A and the second package 22A has a Young's modulus of 70 GPa or more. The Young's modulus of the ceramic may be less than 70 GPa.

[0084] In the fourth embodiment, the main material of the third package 23A is a resin such as an epoxy resin. The glass transition temperature of the resin is 150° C. or higher. The glass transition temperature of the resin may be 200° C. or higher. The main material of the third package 23A may be a material other than resin.

[0085] The temperature sensor 10C according to the fourth embodiment can achieve the following effects.

[0086] For example, when the temperature sensor 10C is bonded to the substrate 2 by sintering, the temperature sensor 10C is pressurized in the Z direction. Specifically, the pressure acts on one main surface 20A of the temperature sensor 10C. In this case, the pressure may be concentrated on a portion of the temperature sensor 10C. If that portion is the location of the temperature sensing element 30, the temperature sensing element 30 may be affected by the pressure.

[0087] According to the fourth embodiment, the first package 21A and the second package 22A sandwich the third package 23A in the Z direction. This increases the symmetry of the temperature sensor 10C in the Z direction. By using the same type of main material for the first package 21A and the second package 22A, the symmetry of the temperature sensor 10C in the Z direction can be further increased. Since the thickness T1 of the first package 21A and the thickness T2 of the second package 22A are substantially the same, the first package 21A and the second package 22A can be substantially symmetrical in the Z direction with respect to a plane (also referred to as a central plane) at the center of the package 20 in the Z direction. "Substantially symmetrical" includes not only agreement within an acceptable error range determined by a person skilled in the art, but also complete symmetry.

[0088] In the Z direction, the first package 21A and the second package 22A are substantially symmetrical with respect to the central plane of the package 20. This allows the pressure to be applied substantially uniformly to the one main surface 20A of the temperature sensor 10C when the temperature sensor 10C is pressurized along the Z direction. "Substantially uniform" includes not only coincidence within an acceptable error range determined by a person skilled in the art, but also complete uniformity. By applying pressure substantially uniformly to the one main surface 20A, the stress acting on the temperature sensing element 30 can be alleviated. In other words, the effect of pressure along the Z direction on the temperature sensing element 30 can be reduced. As a result, the weather resistance of the temperature sensor 10C can be improved.

[0089] By applying pressure substantially uniformly to the one main surface 20A, when the temperature sensor 10C is bonded to the substrate 2, the pressure applied from the other external electrode 50 to the substrate 2 can be made substantially uniform, thereby improving the reliability of the bond.

[0090] The temperature sensing element 30 is disposed in a third package 23A sandwiched between the first package 21A and the second package 22A. This allows the temperature sensing element 30 to be positioned near the center of the temperature sensor 10C in the thickness direction. As a result, the possibility of corrosive gases and moisture coming into contact with the temperature sensing element 30 can be reduced, thereby improving the weather resistance of the temperature sensor 10C.

[0091] By using ceramic or glass epoxy as the main material for the first package 21A and the second package 22A, wiring processes such as via conduction can be facilitated, which means that the processability of the temperature sensor 10C can be improved.

[0092] When the first package 21A and the second package 22A are made primarily of ceramic, the high strength of ceramic can be utilized to improve the pressure resistance of the temperature sensor 10C. By making the Young's modulus of the ceramic 70 GPa or more, the pressure resistance can be further improved.

[0093] When the first package 21A and the second package 22A are made primarily of glass epoxy, the strength of the first package 21A and the second package 22A can be increased by adding glass fiber, thereby improving the mechanical strength of the temperature sensor 10C.

[0094] When at least one of the first package 21A, the second package 22A, and the third package 23A is made primarily of glass epoxy, the glass transition temperature of the glass epoxy can be set to 150°C or higher or 200°C or higher, thereby reducing the penetration of corrosive gases and moisture into the package 20. This can improve the effect of mitigating the stress acting on the temperature sensing element 30. As a result, the weather resistance of the temperature sensor 10C can be improved.

[0095] When at least one of the first package 21A, the second package 22A, and the third package 23A is made primarily of glass epoxy, the thermal expansion coefficient of the glass epoxy is 15 ppm / °C or less, which can improve the effect of alleviating the stress acting on the temperature sensing element 30. As a result, the weather resistance of the temperature sensor 10C can be improved.

[0096] The thickness T4 of the temperature sensing element 30 is 60% or 40% or less of the total thickness T1, T2, T3 of the packages 21A, 22A, 23A, and the thicknesses T1 and T2 are 0.075 mm or more, thereby achieving the following effects: The pressure resistance of the temperature sensor 10C can be improved. The first package 21A and the second package 22A can be ensured to have sufficient thickness relative to the temperature sensing element 30. Furthermore, the intrusion of corrosive gases and moisture into the package 20 can be reduced.

[0097] The temperatures described above can also be expressed as follows:

[0098] (1) A package element according to one aspect of the present disclosure is a package element comprising: a package having one main surface facing one side in a thickness direction and another main surface facing the other side in the thickness direction; and an internal element provided inside the package, wherein the package comprises: a one-side external electrode provided on the one main surface and electrically connected to a conductive wire; and an internal electrode provided inside the package between the internal element and the one-side external electrode and on which the internal element is mounted; the other main surface is a surface facing a mounting surface on which the package element is mounted; the internal electrode is electrically connected to the internal element and the one-side external electrode; and the one-side external electrode is larger than the internal electrode when viewed along the thickness direction.

[0099] (2) The package element of (1) may further include a second external electrode provided on the second main surface and electrically insulated from the first external electrode and the internal electrode.

[0100] (3) In the packaged element of (2), the outer edge of the other external electrode may be located inside the outer edge of the package when viewed along the thickness direction.

[0101] (4) In any one of the package elements (1) to (3), the distance in the thickness direction from the other side position of the internal element that is closest to the other main surface in the thickness direction to the other main surface may be longer than the distance in the thickness direction from the other side position to the one main surface.

[0102] (5) In the packaged element of any one of (1) to (4), the external electrode on one side and the internal electrode may be in contact with each other in the thickness direction.

[0103] (6) In the packaged element of any one of (1) to (5), the outer edge of the internal electrode may be located inside the outer edge of the one-side external electrode when viewed along the thickness direction.

[0104] (7) The package element of any one of (1) to (6) may further include an internal member provided inside the package and made of a material having a greater modulus of elasticity than the package.

[0105] (8) In the packaged element of (7), the internal member may be made of metal.

[0106] (9) In any one of the package elements (1) to (8), the package may include a first package having the other main surface, and a second package having the one main surface and stacked on the opposite side of the first package in the thickness direction from the other main surface, the internal element may be provided inside the first package, the second package may have a via conductor penetrating the second package in the thickness direction, and the internal electrode may be located between the first package and the second package and electrically connected to the one-side external electrode via the via conductor.

[0107] (10) In any one of the package elements (1) to (8), the package may include: a first package having the other main surface; a second package having the one main surface; and a third package located between the first package and the second package in the thickness direction and having the internal element therein; the second package may have a via conductor penetrating the second package in the thickness direction; and the internal electrode may be located between the second package and the third package and electrically connected to the one-side external electrode via the via conductor.

[0108] (11) In the package element of (10), the first package and the second package may be made of the same type of main material.

[0109] (12) In the packaged element of (10) or (11), the thickness of the first package may be substantially the same as the thickness of the second package.

[0110] (13) In the packaged element of any one of (10) to (12), the main material of the first package and the second package may be ceramic or glass epoxy.

[0111] (14) In the packaged element of (13), the first package and the second package may contain, as a main material, glass epoxy having a glass transition temperature of 150° C. or higher.

[0112] (15) In the packaged element of (14), the first package and the second package may contain, as a main material, glass epoxy having a glass transition temperature of 200° C. or higher.

[0113] (16) In the packaged element of any one of (13) to (15), the first package and the second package may contain, as a main material, glass epoxy having a thermal expansion coefficient of 15 ppm / ° C. or less.

[0114] (17) In the packaged element of any one of (13) to (16), the first package and the second package may contain, as a main material, a ceramic having a Young's modulus of 70 GPa or more.

[0115] (18) In the packaged element of any one of (10) to (17), the main material of the third package may be resin.

[0116] (19) In the packaged element of (18), the glass transition temperature of the resin contained in the third package may be 150° C. or higher.

[0117] (20) In the packaged element of (19), the glass transition temperature of the resin contained in the third package may be 200° C. or higher.

[0118] (21) In the package element of any one of (10) to (20), the thickness of the internal element may be 60% or less of the total thickness of the first package, the second package, and the third package.

[0119] (22) In the package element of (21), the thickness of the internal element may be 40% or less of the total thickness of the first package, the second package, and the third package.

[0120] (23) In the packaged element of any one of (10) to (22), the thickness of each of the first package and the second package may be 0.075 mm or more.

[0121] Any of the various embodiments described above may be combined appropriately to achieve the effects of each of them.

[0122] While the present invention has been fully described in connection with preferred embodiments, with appropriate reference to the drawings, various changes and modifications will become apparent to those skilled in the art, and it is to be understood that such changes and modifications are included within the scope of the present invention as defined by the appended claims unless they depart therefrom.

[0123] 2A Mounting surface 6 Wire 10 Temperature sensor 20 Package 20A One main surface 20B Other main surface 20C Outer edge 21 First package 22 Second package 23 Third package 221 Via conductor 30 Temperature sensing element 40 One side external electrode 40A Outer edge 50 Other side external electrode 50A Outer edge 60 Internal electrode 60A Outer edge 70 Internal member

Claims

1. A package element comprising: a package having one main surface facing one side in a thickness direction and another main surface facing the other side in the thickness direction; and an internal element provided inside the package, wherein the package comprises: a one-side external electrode provided on the one main surface and to which a conductive wire is electrically connected; and an internal electrode provided inside the package between the internal element and the one-side external electrode and on which the internal element is mounted, the other main surface being a surface facing the mounting surface on which the package element is mounted, the internal electrode being electrically connected to the internal element and the one-side external electrode, and the one-side external electrode being larger than the internal electrode when viewed along the thickness direction.

2. The package element according to claim 1, further comprising an other-side external electrode provided on said other main surface and electrically insulated from said one-side external electrode and said internal electrode.

3. The packaged element according to claim 2, wherein the outer edge of the other external electrode is located inside the outer edge of the package when viewed along the thickness direction.

4. A package element described in any one of claims 1 to 3, wherein the distance in the thickness direction from the other side position of the internal element closest to the other main surface in the thickness direction to the other main surface is longer than the distance in the thickness direction from the other side position to the one main surface.

5. A packaged element according to any one of claims 1 to 4, wherein the one-side external electrode and the internal electrode are in contact with each other in the thickness direction.

6. A packaged element according to any one of claims 1 to 5, wherein, when viewed along the thickness direction, the outer edges of the internal electrodes are positioned more inward than the outer edges of the one-side external electrodes.

7. A packaged element according to any one of claims 1 to 6, further comprising an internal member disposed inside the package and constructed of a material having a greater modulus of elasticity than the package.

8. The packaged element of claim 7, wherein said inner member is constructed of metal.

9. A package element according to any one of claims 1 to 8, wherein the package comprises: a first package having the other main surface; and a second package having the one main surface and stacked on the opposite side of the first package in the thickness direction from the other main surface; the internal element is provided inside the first package; the second package has a via conductor that penetrates the second package in the thickness direction; and the internal electrode is located between the first package and the second package and is electrically connected to the one-side external electrode via the via conductor.

10. A package element as described in any one of claims 1 to 8, wherein the package comprises: a first package having the other main surface; a second package having the one main surface; and a third package located between the first package and the second package in the thickness direction and having the internal element therein; wherein the second package has a via conductor penetrating the second package in the thickness direction; and the internal electrode is located between the second package and the third package and is electrically connected to the one-side external electrode via the via conductor.

11. The package element of claim 10, wherein the first package and the second package are made of the same type of primary material.

12. The package element according to claim 10 or 11, wherein the thickness of the first package is approximately the same as the thickness of the second package.

13. The package element according to any one of claims 10 to 12, wherein the main material of the first package and the second package is ceramic or glass epoxy.

14. The packaged element according to claim 13, wherein the first package and the second package contain, as a main material, glass epoxy having a glass transition temperature of 150°C or higher.

15. The package element according to claim 13 or 14, wherein the first package and the second package contain, as a main material, glass epoxy having a thermal expansion coefficient of 15 ppm / °C or less.

16. The package element according to any one of claims 13 to 15, wherein the first package and the second package contain, as a main material, a ceramic having a Young's modulus of 70 GPa or more.

17. The package element according to any one of claims 10 to 16, wherein the main material of the third package is a resin.

18. The packaged element according to claim 17, wherein the glass transition temperature of the resin contained in the third package is 150°C or higher.

19. A packaged element according to any one of claims 10 to 18, wherein the thickness of the internal element is 60% or less of the sum of the thicknesses of the first package, the second package, and the third package.

20. A package element according to any one of claims 10 to 19, wherein the thickness of each of the first package and the second package is 0.075 mm or greater.

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