RF components comprising printed circuit boards

Abstract

RF components and methods of constructing RF components are disclosed. The RF components comprise a printed circuit board (PCB) base and at least one transmission line PCB containing at least one transmission line connected to the PCB base, wherein the at least one transmission line PCB comprises at least two parallel metallizations.

Description

[0001]

[0002] RF COMPONENTS COMPRISING PRINTED CIRCUIT BOARDS

[0003] TECHNICAL FIELD

[0004] The present disclosure relates to RF (radio-frequency) components such as RF transformers, transmission line transformers (TLTs), RF couplers, and RF baluns.

[0005] DESCRIPTION

[0006] In an RF circuit, there is commonly the need for impedance transformation, in particular in RF amplifiers. Here the RF load needs to be matched to the impedance required by the active device to maximize the achievable RF power within the device’s voltage and current limits. The driving source and the device input impedances also need matching. A variety of configurations exist and include BALUNs for push-pull amplifiers, virtual RF ground points for DC supply, RF current summing devices for power combiners and many more. To achieve a very wideband frequency response, all these configurations typically arrange coaxial transmission lines around some ferrite or other ferro-magnetic material in order to increase the common-mode impedance between the two transmission line ends. Furthermore, in all applications the transmission line impedance must be tightly controlled to a case-specific value, which is often different from those available from standard off-the-shelf items. In addition, the transmission line length plays a fundamental role and requires tight control. Contemporary cable-based assembly procedures require many steps and skilled workers, and moreover rely on commercial coaxial cable with limited impedance and size availability.

[0007] SUMMARY

[0008] In one example described herein there is an RF component comprising: a printed circuit board (PCB) base; and at least one transmission line PCB containing at least one transmission line connected to the PCB base, wherein the at least one transmission line PCB comprises at least two parallel metallizations.

[0009] In one example described herein there is a method of constructing an RF component comprising: controlling a pick-and-place machine to: place at least one transmission line PCB onto a printed circuit board (PCB) base such that at least one transmission line of the at least one transmission line PCB connects to the PCB base, wherein the at least one PCB transmission line comprises two parallel metallizations.

[0010] BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention will be described further, by way of example only, with reference to embodiments thereof as illustrated in the accompanying drawings, in which:

[0012] Figure 1 illustrates in perspective view an RF transformer having transmission line PCBs connected to a PCB base and constructed in accordance with some examples;

[0013] Figure 2 illustrates in plan view an RF transformer having transmission line PCBs connected to a PCB base and constructed in accordance with some examples;

[0014] Figure 3 illustrates in plan view an RF transformer having first and second groups of transmission line PCBs, in which the groups have differing numbers of transmission line PCBs connected to a PCB base and constructed in accordance with some examples;

[0015] Figures 4A and 4B illustrate transmission line PCBs constructed in accordance with some examples;

[0016] Figures 5A and 5B illustrate transmission line PCBs with differing lengths and widths constructed in accordance with some examples;

[0017] Figures 6A and 6B illustrate in an end-on view transmission line PCBs with differing cross-sections constructed in accordance with some examples;

[0018] Figure 7 illustrates the mounting of a transmission line PCB on a PCB base in accordance with some examples;

[0019] Figure 8 illustrates slots in a PCB base configured to accept the mounting of a transmission line PCB in accordance with some examples;

[0020] Figure 9 is a flow diagram showing a sequence of steps which are taken when constructing an RF transformer comprising transmission line PCBs connected to a PCB base in accordance with some examples; (P81)

[0021] Figure 10A is a flow diagram showing a sequence of steps which are taken when constructing an RF transformer comprising transmission line PCBs connected to a PCB base in accordance with some examples;

[0022] Figure 1 OB is a flow diagram showing a sequence of steps which are taken when constructing an RF transformer comprising transmission line PCBs connected to a PCB base in accordance with some examples;

[0023] Figure 11 illustrates in cross section a transmission line PCB in accordance with some examples;

[0024] Figure 12 illustrates a transmission line PCB where each end is adapted to engage with a PCB base in accordance with some examples;

[0025] Figure 13 illustrates a transmission line PCB comprising metallizations that follow a non-direct path in accordance with some examples;

[0026] Figure 14 illustrates a transmission line PCB comprising a further component coupled along its length in accordance with some examples; and

[0027] Figure 15 is a flow diagram showing a sequence of steps which are taken when constructing an RF transformer comprising transmission line PCBs connected to a PCB base in accordance with some examples.

[0028] DESCRIPTION OF EXAMPLE EMBODIMENTS

[0029] Before discussing the embodiments with reference to the accompanying figures, the following description of embodiments is provided.

[0030] In accordance with one example configuration there is provided an RF component comprising: a printed circuit board (PCB) base; and at least one transmission line PCB containing at least one transmission line connected to the PCB base, wherein the at least one transmission line PCB comprises at least two parallel metallizations.

[0031] According to the present techniques, a transmission line of the RF component, instead of being provided by the usual coaxial transmission line, is provided by a transmission line PCB. That is, not only is the base of the component provided by (P81) printed circuit board (PCB), but also at least one transmission line of the RF component is provided by PCB. Thus, both the transmission line(s) and the base PCB are manufactured with standard printed circuit technology. As a result, the RF component is not a separate component to then be mounted on a PCB base (as in the classic design), but is fully integrated in the PCB design. This in particular allows for tight control of the component’s parameters (e.g. line length and line width), thereby providing flexibility in the RF component’s performance parameters. Moreover, this approach also allows for easy assembly, whereby the transmission line PCB is simply “plugged into” the PCB base, thus avoiding the winding process of coaxial cables. The mechanical rigidity of the component is thereby also improved and the component is also typically more compact than traditional coaxial cable designs.

[0032] There may be any number of transmission line PCBs connected to the PCB base, whereby each transmission line PCBs can have its own characteristics. Hence in some examples, the RF component comprises a plurality of transmission line PCBs connected to the PCB base, wherein a first subset of the plurality of transmission lines on the transmission line PCBs has a first characteristic impedance and a second subset of the plurality of PCB transmission lines has a second characteristic impedance. This arrangement can for example support the provision of an RF transformer. Appropriate selection of the first characteristic impedance and the second characteristic impedance thus allow the transformer characteristics to be precisely defined.

[0033] Although it is not essential to provide a transformer core, that is to say, an aircore transformer may provide suitable transmission properties in some circumstances, in some examples the RF component further comprises a transformer core, wherein the transmission line PCBs each enclose a respective portion of the transformer core. The use of a core, such as a ferrite core, can improve a transformer’ s performance through its high magnetic permeability.

[0034] Any number of transmission lines in the RF component may be provided, and their characteristic impedances may be freely selected. However, when first and second subsets of PCB transmission lines are provided, the number of PCB transmission lines (P81) in those subsets may vary. Accordingly, in some examples a multiplicity of the first subset of the plurality of transmission line PCBs differs from a multiplicity of the second subset of the plurality of transmission line PCBs. Furthermore, in some examples the first characteristic impedance and the second characteristic impedance differ.

[0035] The dimensions of PCB transmission lines can be freely selected in order to provide the desired electrical characteristics of the RF component. In some examples, the first subset of the plurality of PCB transmission lines has a first line length and the second subset of the plurality of PCB transmission lines has a second line length, wherein the first line length and the second line length differ. In some examples, the first subset of the plurality of PCB transmission lines has a first strip width and the second subset of the plurality of PCB transmission lines has a second strip width, wherein the first strip width and the second strip width differ. In some examples, the first subset of the plurality of PCB transmission lines has a first PCB thickness and the second subset of the plurality of PCB transmission lines has a second PCB thickness, wherein the first PCB thickness and the second PCB thickness differ. In some examples, the first subset of the plurality of PCB transmission lines has a first dielectric constant and the second subset of the plurality of PCB transmission lines has a second dielectric constant, wherein the first dielectric constant and the second dielectric constant differ.

[0036] The at least one transmission line PCB may be provided in a wide variety of configurations, depending on the particular requirements of a given implementation of these techniques. However, in some examples the at least one transmission line PCB has a substantially U-shaped configuration. This configuration can facilitate the construction of the RF component, by virtue of the two ends of the U-shape plugging into the base PCB. For example, when a transformer core is provided, a very straightforward construction procedure is enabled, by placing the transformer core onto the PCB base and then placing at least one transmission line PCB that has a substantially U-shaped configuration bridging the transformer core (one leg within the core, one leg outside the core) so that it plugs into the PCB base. (P81)

[0037] When positioning the at least one transmission line PCB relative to the PCB base, the electrical connection between the two is facilitated in examples where the at least two parallel metallizations are arranged to contact corresponding metallizations on the PCB base.

[0038] The manner in which the at least one transmission line PCB engages with the PCB base may take a variety of forms and the respective metallizations on the PCB base may be variously arranged, but in some examples the at least one transmission line PCB comprises two ends, wherein each of the two ends has a configuration adapted to engage with a corresponding slot in the PCB base, and wherein the respective slots are at least partly metallized to provide the corresponding metallizations on the PCB base.

[0039] In some examples the configuration of each of the two ends comprises a shoulder configured to abut a surface of the PCB base and a narrowed protrusion configured to penetrate the corresponding slot in the PCB base. This facilitates the placement of the at least one transmission line PCB with respect to the PCB base, since the former may be simply plugged into the latter, with the shoulders of the ends providing a well-defined stop, when the shoulder come into abutment with the surface of the PCB base.

[0040] In some examples the corresponding slot in the PCB base is provided with two separate metallizations for conductive contact with the respective parallel metallizations of the at least one transmission line PCB.

[0041] The PCB substrates, i.e. of both the at least one transmission line PCB and the PCB base, may be formed of any suitable material. However, there are deployment contexts in which it is advantageous for the RF component to be “radiation-hard”. Accordingly, in some examples the PCB substrates are made from at least one radiation hard material. Such radiation hardness can be more easily achieved for PCB material, for example using FR4 material, whereas it is not easily achievable for the typical PTFE coaxial cables of the prior art. (P81)

[0042] The at least one transmission line PCB of the RF component may be configured in a variety of ways. In some examples the at least one transmission line PCB has at least one of a multi-layer construction; a varying impedance along its length; and at least one further component coupled along its length.

[0043] Various different RF components may be constructed in accordance with the present techniques, but in some examples the RF component is at least one of an RF transformer; an RF coupler; and an RF balun.

[0044] In accordance with one example configuration there is provided a method of constructing an RF component comprising: controlling a pick-and-place machine to: place at least one transmission line PCB onto a printed circuit board (PCB) base such that at least one transmission line of the at least one transmission line PCB connects to the PCB base, wherein the at least one PCB transmission line comprises two parallel metallizations.

[0045] The arrangement of the present techniques in which an RF component is constructed having at least one transmission line PCB that connects to the PCB base supports an advantageously straightforward construction, whereby many of the complexities of arranging co-axial transmission lines around a core of the prior art are avoided. Indeed, such prior art manufacturing could involve skilled workers in order to ensure that the winding of the co-axial transmission lines around the core is correctly carried out, whereas the PCB constituents of an RF component according to the present techniques allow for a highly automated, pick-and-place construction method, which requires far less skilled worker involvement.

[0046] The method of the present techniques may be automated to a greater or lesser extent as required, and may involve more or fewer components that are also combined by a pick-and-place machine. In some examples, the method further comprises: placing a transformer core onto the PCB base; and placing the at least one transmission line PCB such that it encloses a portion of the transformer core.

[0047] In some examples, the at least one transmission line PCB comprises two ends, wherein each of the two ends has a configuration adapted to engage with a corresponding slot in the PCB base, and wherein placing the at least one transmission line PCB such that the at least one transmission line connects to the PCB base comprises positioning the two ends in engagement with the corresponding slot in the PCB base.

[0048] In some examples, the configuration of each of the two ends comprises a shoulder configured to abut a surface of the PCB base and a narrowed protrusion configured to penetrate the corresponding slot in the PCB base, and placing the at least one transmission line PCB such that the at least one transmission line connects to the PCB base comprises positioning each shoulder to abut the surface of the PCB base.

[0049] In some examples, the method further comprises: controlling a soldering machine to solder the two ends such that they are adhered in and in conductive contact with the corresponding slot in the PCB base.

[0050] Particular embodiments will now be described with reference to the figures.

[0051] Figure 1 illustrates in perspective view an RF transformer 10 having transmission line PCBs 11, 12 connected to a PCB base 13. The transmission line PCBs 11, 12 each enclose a respective portion of a transformer core 14, which itself is adhered to the PCB base 13. The transmission line PCBs 11, 12 are each dimensioned and configured to provide the desired performance characteristics of the RF transformer. Further arbitrary circuit components 15, 16, and 17 are also shown forming part of the circuitry mounted on the PCB base 13. An RF coupler or RF balun can also be similarly constructed.

[0052] Figure 2 illustrates in plan view an RF transformer such as that shown in perspective view in Figure 1. The same transmission line PCBs 11, 12 are connected to the PCB base 13 and the transmission line PCBs 11, 12 each enclose a respective portion of the transformer core 14. Further arbitrary circuit components 15, 16, 17, and 18 are also shown forming part of the circuitry mounted on the PCB base 13.

[0053] The performance characteristics of an RF component constructed in accordance with the present techniques can be carefully defined by the selection of transmission line PCBs involved. Relevant parameters for the transmission line PCBs are their multiplicity, as well as the chosen dimensions of the respective transmission line PCBs. Figure 3 illustrates in plan view an RF transformer 20 comprising a transformer core 21 and a number of transmission line PCBs 22, 23. The transmission line PCBs are shown in two subsets, a first subset 22 and a second subset 23.

[0054] As mentioned, the dimensions of the respective transmission line PCBs can also be selected in order to provide the desired parameters of the RF component. Figures 4A and 4B illustrate transmission line PCBs constructed in accordance with some examples and, in particular, where the PCB transmission line 30 of Figure 4A is noticeably smaller than the PCB transmission line 31 of Figure 4B. Importantly, this means that the PCB transmission line 30 of Figure 4A has a line length that is shorter than the line length of the PCB transmission line 31 of Figure 4B. However, it is not only the line length that can be selected but also other dimensions of the respective lines. Figures 5A and 5B illustrate transmission line PCBs with differing lengths and widths constructed in accordance with some examples. Specifically, the PCB transmission line 40 of Figure 5 A is not only smaller than the PCB transmission line 41 of Figure 5B, but also the width of the metallization 42 is less than the width of the metallization 43. Figures 6A and 6B illustrate in an end-on view transmission line PCBs 50, 51 with differing cross-sections. Also the two parallel metallizations 52, 53 and 54, 55 can be seen in this figure. Whilst the metallizations 53, 55 are approximately the same, the cross sections (especially the thicknesses) of the metallizations 52, 54 can be seen to differ. (P81)

[0055] Figure 7 illustrates the mounting of a transmission line PCB 60 on a PCB base 61 in accordance with some examples. This illustrates the ease with which an RF component can be constructed in accordance with the present techniques, whereby the two ends 62, 63 of the transmission line PCB 60 are arranged to be pushed into corresponding slots 64, 65 in the PCB base 61. Note that the respective ends 62, 63 of the transmission line PCB 60 are shaped such that the transmission line PCB 60 can be pushed down until the wider part of the ends of the transmission line PCB 60 comes into contact with the PCB base 61. Figure 8 illustrates slots 71, 72 in a PCB base 70 configured to accept the mounting of a transmission line PCB in accordance with some examples. In particular, each of the slots 71, 72 are at least partly metallized and have respective further connections 73, 74. The at least partial metallizations of the slots 71, 72 support conductive contact with the respective parallel metallizations of a transmission line PCB, which is then electrically connected to further electrical components by means of the further connections 73, 74.

[0056] Figure 9 is a flow diagram showing a sequence of steps which are taken when constructing an RF transformer comprising transmission line PCBs connected to a PCB base in accordance with some examples. The flow begins at step 80 where a transformer core is placed onto a PCB base. Then at step 81, a PCB transmission line is placed enclosing a portion of the transformer core and connecting to the PCB base. At step 82 determined whether there is another PCB transmission line to be placed (with respect to this transformer core). When this is the case, the flow returns to step 81 for that PCB transmission line to be placed. Otherwise, the flow proceeds to step 83 and ends.

[0057] Figure 10A is a flow diagram showing a first example sequence of steps which are taken when constructing an RF transformer comprising transmission line PCBs connected to a PCB base in accordance with some examples. The flow begins at step 90 where a transformer core is placed onto a PCB base. Then at step 91, a PCB transmission line is placed enclosing a portion of the transformer core and connecting to the PCB base. At step 92, the ends of the PCB transmission line are soldered to adhere the PCB transmission line to the PCB base and to connect the metallizations of the PCB transmission line electrically to corresponding conductors on the PCB base. At step 93, (P81) it is determined whether there is another PCB transmission line to be placed (with respect to this transformer core). When this is the case, the flow returns to step 91 for that PCB transmission line to be placed and soldered. Otherwise, the flow proceeds to step 94 and ends.

[0058] Figure 1 OB is a flow diagram showing a second example sequence of steps which are taken when constructing an RF transformer comprising transmission line PCBs connected to a PCB base in accordance with some examples. The flow begins at step 95 where a transformer core is placed onto a PCB base. Then at step 96, a PCB transmission line is placed enclosing a portion of the transformer core and connecting to the PCB base. At step 97, it is determined whether there is another PCB transmission line to be placed (with respect to this transformer core). When this is the case, the flow returns to step 96 for that PCB transmission line to be placed and soldered. Otherwise, the flow proceeds to step 98, at which the ends of the PCB transmission line are soldered to adhere the PCB transmission lines to the PCB base and to connect the metallizations of the PCB transmission line electrically to corresponding conductors on the PCB base. The flow ends at step 99.

[0059] Figure 11 illustrates in cross section a transmission line PCB, showing various dimensions (selectable parameters) of the metallizations and substrate. The two metallizations 102, 103 are isolated from one another by the substrate material 101. As shown, the metallizations have a width a, and a depth c. The substrate has a thickness d. Each of these parameters may be varied to tune the properties of the transmission line PCB and hence of the RF component constructed using the transmission line PCB. It is also illustrated that the substrate 101 may protrude beyond the metallisation by a distance b. This parameter may for example be varied in order to provide a limited width of metallisation (because of the corresponding desired electrical properties), whilst still providing a sufficient width of the substrate (because of the mechanical stability this entails).

[0060] Figure 12 illustrates a transmission line PCB 110 where each end is adapted to engage with a PCB base in accordance with some examples. In particular each of the (P81) ends is provided with a respective shoulder 111, 112 formed in the substrate of the PCB material, thus providing a good mechanical engagement of the transmission line PCB when physically connected to the PCB base. The width of the shoulder e can be varied, in dependence on the mechanical needs of the particular implementation. The protrusion of the metallisation of each of the ends of the transmission line PCB 110 means that a good electrical connection between the transmission line PCB 110 and corresponding connections of the PCB base can be achieved.

[0061] The present techniques may often be implemented using the U-shaped sections of PCB discussed above with reference to the preceding figures, yet are not limited to such shapes of PCB. Figure 13 illustrates a transmission line PCB 120 comprising metallizations that follow a non-direct path in accordance with some examples. Note also that in this illustrated example the substrate of the transmission line PCB substantially covers all of the area traversed by the illustrated metallization, such that it is clear that in this example the transmission line PCB 120 is intended to be a standalone component plugged into a PCB base, i.e. not enclosing a portion of a transformer core.

[0062] It is also to be noted that the metallisation of a transmission line PCB is not required to be continuous between its two ends and Figure 14 illustrates a transmission line PCB 130 comprising a further component 131 coupled along its length (i.e. providing a physical discontinuity in the metallisation, such that two distinct sections 132, 133 of the metallisation can be identified). This further component 131 can be freely selected, such as being a resistive element, a capacitive element, an inductive element, etc.)

[0063] Figure 15 is a flow diagram showing a sequence of steps that are taken when constructing an RF transformer comprising transmission line PCBs connected to a PCB base, such as may be carried out by an automated pick-and-place machine. The flow begins at step 140 where a PCB base is (picked and) placed. Then at step 141, a PCB transmission line is (picked and) placed to connect to the PCB base. At step 142, the ends of the PCB transmission line are soldered to adhere the PCB transmission line to (P81) the PCB base and to connect the metallizations of the PCB transmission lines electrically to corresponding conductors on the PCB base. Note that step 142 is not essential, if the mechanical connection of the PCB transmission line(s) is deemed to be sufficiently robust. At step 143, it is determined whether there is another PCB transmission line to be placed. When this is the case, the flow returns to step 141 for that PCB transmission line to be placed. Otherwise, the flow proceeds to step 144 and ends. Note also that step 142 may be moved to follow the “No” exit from step 143, i.e. multiple transmission line PCBs may be placed before all are then soldered as a final step.

[0064] In brief overall summary, RF components and methods of constructing RF components are disclosed. The RF components comprise a printed circuit board (PCB) base and at least one transmission line PCB containing at least one transmission line connected to the PCB base, wherein the at least one transmission line PCB comprises at least two parallel metallizations.

[0065] In the present application, the words “configured to. ..” are used to mean that an element of an apparatus has a configuration able to carry out the defined operation. In this context, a “configuration” means an arrangement or manner of interconnection of hardware or software. For example, the apparatus may have dedicated hardware which provides the defined operation, or a processor or other processing device may be programmed to perform the function. “Configured to” does not imply that the apparatus element needs to be changed in any way in order to provide the defined operation.

[0066] Although illustrative embodiments of the invention have been described in detail herein with reference to the accompanying drawings, it is to be understood that the invention is not limited to those precise embodiments, and that various changes, additions and modifications can be effected therein by one skilled in the art without departing from the scope of the invention as defined by the appended claims. For example, various combinations of the features of the dependent claims could be made with the features of the independent claims without departing from the scope of the present invention.

Claims

1. CLAIMS1. An RF component comprising: a printed circuit board (PCB) base; and at least one transmission line PCB containing at least one transmission line connected to the PCB base, wherein the at least one transmission line PCB comprises at least two parallel metallizations.

2. The RF component of claim 1, comprising a plurality of transmission line PCBs connected to the PCB base, wherein a first subset of the plurality of transmission lines on the transmission line PCBs has a first characteristic impedance and a second subset of the plurality of PCB transmission lines has a second characteristic impedance.

3. The RF component of claim 2, further comprising a transformer core, wherein the transmission line PCBs each enclose a respective portion of the transformer core.

4. The RF component of claim 2 or claim 3, wherein a multiplicity of the first subset of the plurality of transmission line PCBs differs from a multiplicity of the second subset of the plurality of transmission line PCBs.

5. The RF component of any of claims 2-4, wherein the first characteristic impedance and the second characteristic impedance differ.

6. The RF component of any of claims 2-5, wherein the first subset of the plurality of PCB transmission lines has a first line length and the second subset of the plurality of PCB transmission lines has a second line length, wherein the first line length and the second line length differ.

7. The RF component of any of claims 2-6, wherein the first subset of the plurality of PCB transmission lines has a first strip width and the second subset of the pluralityof PCB transmission lines has a second strip width, wherein the first strip width and the second strip width differ.

8. The RF component of any of claims 4-7, wherein the first subset of the plurality of PCB transmission lines has a first PCB thickness and the second subset of the plurality of PCB transmission lines has a second PCB thickness, wherein the first PCB thickness and the second PCB thickness differ.

9. The RF component of any of claims 4-8, wherein the first subset of the plurality of PCB transmission lines has a first dielectric constant and the second subset of the plurality of PCB transmission lines has a second dielectric constant, wherein the first dielectric constant and the second dielectric constant differ.

10. The RF component of any preceding claim, wherein the at least one transmission line PCB has a substantially U-shaped configuration.

11. The RF component of any preceding claim, wherein the at least two parallel metallizations are arranged to contact corresponding metallizations on the PCB base.

12. The RF component of any preceding claim, wherein the at least one transmission line PCB comprises two ends, wherein each of the two ends has a configuration adapted to engage with a corresponding slot in the PCB base, and wherein the respective slots are at least partly metallized to provide the corresponding metallizations on the PCB base.

13. The RF component of claim 12, wherein the configuration of each of the two ends comprises a shoulder configured to abut a surface of the PCB base and a narrowed protrusion configured to penetrate the corresponding slot in the PCB base.

14. The RF component of claim 12 or claim 13, wherein the corresponding slot in the PCB base is provided with two separate metallizations for conductive contact with the respective parallel metallizations of the at least one transmission line PCB.(P81)15. The RF component of any preceding claim, wherein the PCB substrates are made from at least one radiation hard material.

16. The RF component of any preceding claim, wherein the at least one transmission line PCB has at least one of: a multi-layer construction; a varying impedance along its length; and at least one further component coupled along its length.

17. The RF component of any preceding claim, where the RF component is at least one of: an RF transformer; an RF coupler; and an RF balun.

18. A method of constructing an RF component comprising: controlling a pick-and-place machine to: place at least one transmission line PCB onto a printed circuit board (PCB) base such that at least one transmission line of the at least one transmission line PCB connects to the PCB base, wherein the at least one PCB transmission line comprises two parallel metallizations.

19. The method of claim 18, further comprising: placing a transformer core onto the PCB base; and placing the at least one transmission line PCB such that it encloses a portion of the transformer core.

20. The method of claim 18 or claim 19, wherein the at least one transmission line PCB comprises two ends, wherein each of the two ends has a configuration adapted to engage with a corresponding slot in the PCB base, and(P81) wherein placing the at least one transmission line PCB such that the at least one transmission line connects to the PCB base comprises positioning the two ends in engagement with the corresponding slot in the PCB base.

21. The method of claim 20, wherein the configuration of each of the two ends comprises a shoulder configured to abut a surface of the PCB base and a narrowed protrusion configured to penetrate the corresponding slot in the PCB base, and placing the at least one transmission line PCB such that the at least one transmission line connects to the PCB base comprises positioning each shoulder to abut the surface of the PCB base.

22. The method of claim 20 or claim 21, further comprising: controlling a soldering machine to solder the two ends such that they are adhered in and in conductive contact with the corresponding slot in the PCB base.

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