Composite of cooling system and electrical and / or electronic component

Abstract

The invention relates to a composite consisting of a cooling system and the housing and / or a surface of an electrical and / or electronic component, wherein the cooling system has a novel and improved connection to the surface to be cooled. By using a thermally conductive material which can be processed in the additive manufacturing method and can be cross-linked in a radiation-induced manner, the invention opens up completely new possibilities for the dissipation of heat from a housing and / or from a printed circuit board of an electrical and / or electronic component.

Description

[0001] 202414577 Foreign version

[0002] 1

[0003] Description

[0004] Combination of cooling system and electrical and / or electronic component

[0005] The invention relates to a combination of a cooling system and the housing and / or surface of an electrical and / or electronic component, wherein the cooling system has a novel and improved connection to the surface to be cooled.

[0006] Despite years of optimization efforts, electrical and electronic components such as circuit breakers and motors generate waste heat ranging from 1 to 5% of their power consumption. If this heat is not dissipated, their efficiency, lifespan, and / or reliability decrease.

[0007] Cooling systems for heat dissipation are currently implemented, for example, as prefabricated heat sinks mounted onto the areas to be cooled using various mounting methods. For instance, heat sinks are glued on, with the adhesives ideally optimized for thermal conductivity – for example, by incorporating thermally conductive particles. Alternatively, thermal pastes are used for mounting, but this carries the risk of requiring regular replacement.

[0008] Technical background

[0009] Thermal connections produced via sintering processes offer the best heat dissipation. However, a disadvantage is that process temperatures of around 250°C and higher are required to form the thermal contact. Few electrical and / or electronic components can withstand these stresses, especially since the heat sink or cooling system connected to the surface to be cooled typically retains this high temperature for a certain period. Nevertheless, ceramic cooling systems are now used on power electronic circuits because they promise reduced thermal resistance in combination with a modified overall system design. However, these cooling systems entail increased manufacturing costs, for example, €30 to €40 in total costs per cooling system in electronic power switches. 202414577 Foreign version

[0010] 2

[0011] With increasing integration density and component miniaturization, the demands on the heat dissipation of cooling systems also increase. These demands are only inadequately met by simply sizing the cooling systems and / or improving thermal coupling by reducing the number of material transitions in the overall system.

[0012] Furthermore, the heat dissipation requirements also depend on the environmental conditions. For example, if an inverter is operated in the desert, more elaborate cooling measures are necessary than for the same electrical and / or electronic component in Central Europe.

[0013] Summary of the invention

[0014] Therefore, there is a need for a mass-producible cooling system for a combination of cooling system and electrical and / or electronic component that is also easily modifiable and / or adaptable despite mass production.

[0015] This problem is solved by the subject matter of the present application as disclosed in the claims and the description.

[0016] Accordingly, the present invention relates to a combination of a cooling system and a surface to be cooled and / or a housing to be cooled of an electrical and / or electronic component, wherein the surface to be cooled and / or the housing to be cooled serves as a substrate and / or support for the cooling system, which can be manufactured by an additive manufacturing process with a hybrid material composition that is radiation-induced crosslinkable.

[0017] The surprising finding of the invention is that a cooling structure without intermediate layers, and thus without transitions from one material to another that impede heat transfer, can be produced from this hybrid material using 3D printing on an electronic component as a substrate. The hybrid material composition according to the invention adheres to different surfaces, or rather to the chemical groups located thereon, because it can react and chemically bond not only via acrylate and epoxy groups, but also via silanol groups through condensation reactions. Thus, figuratively speaking, the hybrid material composition contains a whole multitude of different "chemical hooks."

[0018] 3 which can "hook" onto a whole variety of different "chemical loops" on the substrate surface via very different chemical reactions. Therefore, the present hybrid material composition makes it possible, quite surprisingly, to build a heat sink and cooling structure directly via 3D printing on almost all component surfaces, on populated circuit boards and / or on all types of housings.

[0019] Due to the diversity of available surface-active chemical coupling groups, i.e., the chemical groups that are capable of coupling with chemical groups on the surface of the substrate, within the hybrid material composition described here, many types of composites of this hybrid material composition with electrical and electronic components, circuit boards, printed circuit boards, conductor tracks on conductor tracks can be easily manufactured via 3D printing.

[0020] Not only is the manufacturing process surprisingly simple, because the hybrid material composition wets the respective surfaces in its uncrosslinked state, but the curing process via irradiation to create the composite is also gentle. Finally, and this is probably the greatest advantage of the direct bonding of an electronic component or populated circuit board and the hybrid material composition described here for the first time, heat dissipation is enormously increased by this direct connection of a highly thermally conductive material to the surface heated by operation. This is particularly true because the heat transfer from the heated surface to the thermal conductivity paste and finally to the heat sink—as was previously the case—involves several heat transfers, which are reduced to two. Thus, the heat dissipation can be increased exponentially through the formation of the composite.

[0021] For example, the hybrid material composition described here achieves an adhesive effect on substrates such as polyamide in transistors or Is, polyamide-imides in wire enamel – for example, on wound wires in coils and chokes, on glass in diodes, on tinned and untinned metal in conductor tracks, and on ceramic surfaces, such as MELF structures as implemented in capacitors and / or resistors, with adhesive forces in the range of 10 to 30 MPa, which is comparable to that of adhesives. Furthermore, the hybrid material composition exhibits sufficient wetting and adhesion on all surfaces.

[0022] 4

[0023] Circuit boards have components such as solder mask, conductive tracks – including nickel-plated conductive tracks – as well as epoxy resin.

[0024] It is well known that the multitude of surfaces on printed circuit boards (PCBs) poses the biggest challenge when selecting a suitable protective coating. A PCB protective coating, also known as a protective lacquer, traditionally serves primarily to protect the PCB from corrosion. It therefore provides a suitable barrier against moisture, chemicals, and other corrosive influences. Furthermore, a protective coating electrically insulates the conductor tracks and components from one another, preventing leakage currents and short circuits from impairing the board's functionality.

[0025] Furthermore, the protective coating protects the circuit board or printed circuit board from mechanical stress, abrasion and damage.

[0026] Conventional protective coatings are based on acrylic, polyurethane, and / or epoxy resins, all of which cure at elevated temperatures of at least 40°C, provided the coating can be produced within economically viable processing times. However, these well-known protective coatings suffer not only from the disadvantage of relatively high curing temperatures but also from poor thermal conductivity. Therefore, these coatings cannot be used to create cooling structures because they dissipate heat too poorly.

[0027] Thus, a composite with the hybrid material composition according to an embodiment of the invention overcomes at least two problems of circuit board manufacturing: firstly, the electrical insulation and protection of the assembled circuit board from environmental influences, i.e., the classic protective coating function, and secondly, the function of thermal paste and cooling structure together, whereby - as already explained - the efficiency of heat dissipation is enormously increased by a composite according to an embodiment of the invention.

[0028] Thanks to UV-induced curing, the hybrid material composition can be processed quickly and at moderate temperatures, making it universally applicable as a protective coating for circuit boards and printed circuit boards. This is because, thanks to the numerous reactive groups present, it wets and adheres to all circuit board surfaces and can be cured without damage. 202414577 Foreign version

[0029] 5

[0030] The cured protective and thermally conductive coating exhibits the required barrier properties while maintaining sufficiently high thermal conductivity.

[0031] Because it is radiation-induced, the manufacturing process requires no production temperature above room temperature, thanks to its short curing time. The use of the hybrid material composition serves to increase the flexibility and / or elasticity of the hybrid material without simultaneously reducing the crosslinking density and thus the overall thermal conductivity of the system in combination with thermally conductive particles.

[0032] The hybrid material composition discussed here, which is suitable for use as a starting material in the additive manufacturing process for producing the protective coating with cooling function on circuit boards and printed circuit boards, comprises at least a first material consisting of an organofunctional silane-based component with a ceramic-forming alkoxide component, as well as a second material containing an organic-based photopolymer.

[0033] Mixing experiments revealed that an inorganic, 3D-printable hybrid material, such as water glass, is miscible with various photopolymers without any miscibility gap or phase separation. This led to the concept of a hybrid photopolymer hybrid material. This material can be pre-crosslinked during the printing process using light (UV) (crosslinking of the photopolymer component) and, after printing, post-crosslinked either by storage at room temperature and / or thermal curing, whereby the hybrid-organic component achieves its final strength in the printed geometry.

[0034] The hybrid material composition is formed from two basic components: an inorganic hybrid material on the one hand and a photo-activatable polymer on the other. The result is a homogeneous material that no longer appears as a two-phase system, even microscopically, since a hybrid material forms at the molecular level of a hybrid-hybrid material.

[0035] Additive manufacturing processes within the meaning of the invention include all types of plastic 3D printing. Primarily, for example, Fused Deposition Modeling (FDM) and / or dispensing and liquid bed processes, as well as all types of molding processes. 202414577 Foreign version

[0036] 6

[0037] The hardened hybrid material forms a protective coating and / or a molded body, which is designed, for example, as a cooling structure. The molded body forms, for instance, the cooling structure and simultaneously the encapsulation and / or the protective film to shield the component from environmental influences.

[0038] The molded body can be produced from the hybrid material composition by radiation-induced curing and is suitable for the

[0039] • Absorption of waste heat

[0040] • Transfer of waste heat

[0041] • Release of waste heat to the ambient air and / or other cooling systems.

[0042] A special feature of the molded body according to the invention is that, in addition to good thermal properties (high thermal conductivity and good continuous temperature resistance), it also exhibits advantageous barrier properties. These include both an electrical blocking effect, such as insulation properties and / or dielectric strength, as well as media tightness, e.g., against oxidative environmental influences and / or moisture. Therefore, a molded body formed in this way, for example in the form of a protective lacquer coating, is also suitable as an encapsulation for printed circuit boards and circuit boards.

[0043] Currently, in the assembly and interconnection technology of printed circuit boards, so-called molding compounds, particularly polyamides with melting temperatures between 180°C and 260°C, are used for encapsulating and electrically insulating the semiconductor chips. While these offer sufficient protection against standard environmental conditions, they are very restrictive when it comes to heat dissipation. To optimize the entire electronic system, molding compounds of all kinds can be eliminated in the future. The protection of the sensitive electronics on a printed circuit board, the thermal connection, and also the electrical insulation can be achieved, for example, by printing with the hybrid material composition described in the present invention.

[0044] Depending on the specific application, thermal waste heat volume, and geometric dimensions, a local thin coating up to a full encapsulation with the hybrid material composition is conceivable. 202414577 Foreign version

[0045] 7

[0046] Using the hybrid material composition, it is possible to produce anything from an encapsulation, a small blob of material on the circuit board, to a potted cooling structure with cooling fins, meander structures and / or pins.

[0047] According to an exemplary embodiment of the invention, the hybrid material composition comprises one or more silicon-organic compound(s).

[0048] The term "first material" here refers to a ceramic-forming component that is, or at least primarily comprises, an organofunctional silane compound, preferably having both alkoxides and organofunctional residues as its starting molecules. The organic residues are fully retained during material synthesis and only react during processing. In the presence of water, the alkoxide groups can react to form silanol groups (-OH) by eliminating alcohol, particularly various alcohols such as methanol, ethanol, propanol, etc. These groups, in turn, form the "glass component" Si-O-Si during undesired aging of the material, but especially during thermal post-curing, with the elimination of water.

[0049] The molecular weight of these organofunctional silane compounds is usually in the range of 100g / mol to 400g / mol, especially from 150g / mol to 300g / mol, and most particularly from 200g / mol to 250g / mol.

[0050] The second part of the “first material” under discussion here is the actual ceramic-forming component, a component comprising at least one silicon, aluminum, zirconium, and / or titanium element, particularly as a complex, especially as a complex with a metal oxide, and comprising at least one alkoxide ligand. This component generally contains no or only small amounts of organofunctional groups and preferably has only alkoxide ligands.

[0051] Through a condensation reaction, for example in the sol-gel process, the first and second parts or the first and second components are reacted together, forming a "first material"—see the reaction scheme of Figure 1—which exhibits an oxide bridge between two central atoms, e.g., between one of the following atoms: silicon, aluminum, zirconium, and / or titanium, and / or between several of them in any combinations and mixtures. 202414577 Foreign version

[0052] 8

[0053] This “first material” is an organofunctional silane compound that has reacted, at least partially, with at least one ceramic-forming alkoxide component via condensation. This is subsequently referred to as the “partially reacted silane mixture”.

[0054] Preferably, the organofunctional silane compound and the complex, organometallic component are present in the first material thus formed in a ratio in the range of 99 mol% to 1 mol% to 30 mol% to 70 mol%, or in the range of 1 wt% to 99 wt% to 50 wt% to 50 wt%, wherein, for example, the proportion of organofunctional silane compound predominates in the first material in terms of mol% and / or weight in terms of wt%.

[0055] A "hybrid material" or "hybrid material composition" refers to a mixture of a liquid photopolymer and the "first material," which is a silane mixture reacted with a ceramic-forming component. Surprisingly, it has been found that these two elements—the reacted silane mixture on the one hand and the liquid photopolymer on the other—are practically miscible without limit. Under normal conditions, neither segregation nor phase formation nor any reaction occurs. For example, a reactive diluent is added to this hybrid material composition, at which point the material composition is not yet cured but may be pre-crosslinked and / or in a pre-polymerized state.

[0056] To form the hybrid material composition, at least one photopolymer, which is liquid under normal conditions (i.e., room temperature and 1 atmosphere pressure), is added to the first material. This photopolymer is added in a weight quantity, based on the total substance of the hybrid material composition, of 1 wt% to 50 wt%, in particular of 10 wt% to 40 wt%, and most preferably in a quantity of 20 wt% to 30 wt%.

[0057] A typical hybrid material composition includes, in addition to the photopolymer which is liquid under normal conditions, preferably a photoinitiator, for example a compound from the class of phenones, phosphine oxides, in particular the “BAPO” i.e. phenylbis(2,4,6-trimethylbenzoyl) phosphine oxide and / or “TPO-L” “Diphenyl(2,4,6-trimethylbenzoyl) phosphine oxide.

[0058] For use in additive manufacturing processes, such as 3D printing, metal-organic materials like "water glass" are known, which are combined with suitable organic ligands.

[0059] 9. The ceramic-forming component can consist of acrylate, alkyl acrylate, epoxy, styrene, and / or anhydride ligands under normal conditions. Any combination of zirconium, silicon, titanium, and / or aluminum-oxygen, and / or phosphorus bonds with organic ligands can be present in the ceramic-forming component. The ligands can be bridging or non-bridging.

[0060] A "ligand" is an atom or molecule that coordinates to a metal atom via a so-called "dative" bond. This dative bond typically involves a lone pair of electrons in the valence shell of at least one atom of the ligand being transferred to the central metal atom.

[0061] These materials, which can be filled with particles – especially thermally conductive ones – can be mixed with photopolymers such as acrylates and / or styrenes, especially hydroxylalkyl and / or hydroxyl-bis or multi-alkyl acrylates and / or styrenes, in a storage-stable manner through existing chromophores and / or photoinitiators, so that they only become unstable under suitable, especially UV, irradiation and react irreversibly to form the shaped body.

[0062] The flexibility and / or elasticity of the cured molded part can be adjusted by adding long-chain photopolymers, i.e., those with chains containing 5 to 50, and especially 10 to 30, methylene groups (-CH2-). Successfully tested photopolymers are acrylate compounds or mixtures of acrylate compounds, containing at least one acrylate from the following group: trimethylpropane triacrylate (TMPTA), urethane dimethyl acrylate (UDMA), ethylene glycol dimethacrylate (EGDMA), 1,6-hexadiol diacrylate (HDODA); bisphenol A ethoxydiacrylate (BAEDA) in any combinations and / or mixtures.

[0063] To produce the hybrid material composition, the photopolymers are added to the reacted silane mixture in an amount of 3 to 40% by mass, particularly in an amount of 5 to 30% by mass, and especially preferably in an amount of 10 to 25% by mass. The mass percentages refer to the dry mass.

[0064] In this context, "photoinitiators" and / or "chromophores" are chemical compounds or parts of chemical compounds that decompose in a photolysis reaction upon absorption of UV light, particularly in the form of electromagnetic radiation, thereby forming reactive species that initiate a reaction. The reactive species can be a radical and / or a cation. 202414577 Foreign version

[0065] 10

[0066] A photoinitiator can be a separate component within the hybrid material composition and / or one or more chromophore-active molecular components. The chromophore-active molecular component can also be contained within a metal-organic compound, such as the reacted silane mixture.

[0067] The photoinitiator and / or the chromophore absorb the UV radiation and form either a reactive radical or a reactive cation, or both. This then attacks the otherwise storage-stable hybrid material composition, initiating a chain reaction that directly solidifies the hybrid material to such an extent that a three-dimensional molded body is formed, which can be removed in one piece from an immersion bath and / or a powder bed. This solidified, but usually not yet fully cured, molded body is then fully cured either by the passage of time and / or by further irradiation and / or by heating.

[0068] Commonly used industrial photoinitiators are derived from α-hydroroxy, α-alkoxy, and / or α-amino aryl ketones and / or acylphosphine oxides, particularly bis-acylphosphine oxides. Occasionally, photolabile aliphatic azo compounds, which can decompose both thermally and photochemically, are also used.

[0069] Commonly used industrial cationic photoinitiators are salts of organic acids, such as sulfonium compounds, iodonium, ferrocenium, phenacyltriphenylphosphonium, pyrylium and / or thiapyrilium compounds.

[0070] To produce, in particular, thermally conductive shaped bodies from a material composition according to the invention, filler, in particular thermally conductive metallic and / or ceramic filler, is added to the liquid mixture.

[0071] According to an exemplary embodiment of the invention, the hybrid material composition further comprises a reactive diluent. In this case, this diluent does not serve, as is usual, to increase the viscosity of the material composition, but rather, when using long-chain photopolymers with organofunctional silane compounds—i.e., the silane-based hybrid material compositions under discussion here—to reduce the viscosity of the uncrosslinked material composition. However, during and after curing, the reactive diluent captures any solvent released and makes it evaporable and / or ensures that it is co-polymerized. Only special reactive diluents from the class of ketones and / or acrylates are suitable for this purpose; these are compounds that comprise the structural unit H₂C=C(R)-C(R)=O. R can be represented by [202414577 Foreign version]

[0072] 11 equal or unequal and any monovalent organic residue, for example an aryl or alkyl group or a heteroaryl or heteroeroalkylaryl group.

[0073] In this context, "removable by evaporation" refers to a process that achieves the partial or complete separation of unwanted solvents and / or reaction byproducts from a liquid reaction mixture, which may also include a dispersion of solids, for example, in the form of filler particles. One such extraction process is, for example, classic rotary evaporation, optionally under pressure and heating. In addition to this process, also known as "rotary evaporation," chemical and / or physical sorption processes can also be used to reduce the solvent content.

[0074] In summary, the novel hybrid material concept with photopolymer, compared to conventional 3D printing materials, allows for the retention of thermal properties for heat dissipation. However, due to its significantly increased flexibility and elasticity, it opens up new possibilities in shaping, for example, regarding geometries and / or the complexity of structures. This naturally benefits the design of the cooling system, as well as allowing for extended operating temperatures and temperature fluctuations during operation as a cooling structure. An additional advantage of this material combination is faster processing speed. For example, in layer-by-layer application, the possibility of UV pre-curing allows for greater layer thicknesses and / or the complete shaping and bonding to the substrate to be cooled can be achieved using a molding process.

[0075] Detailed description of the exemplary implementations

[0076] The invention will now be explained in more detail using an exemplary embodiment:

[0077] One mole of aluminum sec-butoxide (ASB) was placed in the solution. This was cooled to approximately 10°C using an ice bath. To prevent precipitation of the ASB, it was first protected by forming a chelate complex with ethyl acetoacetate (EAA) in a 1:1 molar ratio. Since the complex formation is exothermic, the temperature during addition was monitored and was not to exceed 13°C. After half a day, the solution was cooled to approximately 10°C.

[0078] 12

[0079] After stirring for one hour, 2 mol each of the silanes 3-trimethoxysilylmethyl methacrylate (MAMTMS) and 3-glycidyloxypropyltrimethoxysilane (GPTMS) were added dropwise over 5 minutes. One hour after the addition of the silanes, the controlled hydrolysis reaction was initiated by adding 15 mol of water dropwise. After twelve hours of stirring, the reaction of the hybrid material to the reacted silane mixture was complete.

[0080] The synthesis of the reacted silane mixture is shown as a scheme on the next page.

[0081] Subsequently, a suitable photopolymer was added, e.g., urethane dimethyl acrylate (IIDMA), ethylene glycol dimethacrylate (EGDMA), 1,6-hexadiol diacrylate (HDODA), bisphenol A ethoxydiacrylate (BAEDA), and / or trimethylpropane triacrylate (TMPTA), as well as any mixtures and combinations of the aforementioned photopolymers. For example, the photopolymer IIDMA is used. 20% by mass of the corresponding photopolymer / photopolymer mixture is added and stirred for a further 6 hours.

[0082] Figure 1 shows the reaction scheme for the preparation of the first material, the "pre-reacted silane mixture." The equilibrium between the keto form I and the enol form II is shown. To a mixture existing at this equilibrium, a complex compound III based on Al-O-aluminum oxide is added, whereby the oxygen atoms of the ligands are replaced by the keto-enol compound. A corresponding compound with a hydroxyl group is released. For example, this represents the complexation 2 with ethyl acetoacetate EAA. In reaction step 3, the silanes MAMTMS IV and GPTMS V are added to this complex. Simultaneously, in reaction step 4 (see arrow at the bottom of Figure 1), water is added for hydrolysis.

[0083] On product page VI, the reaction scheme only shows excerpts of the products obtained, which may, but do not necessarily, form in this way. As those skilled in the art are aware, various products can be formed, sometimes in this and sometimes in a different combination, whereby both [R2Si-O-Si-] and [R2Si-O-Al-O-] units are always detectable. 202414577 Foreign version

[0084] 13

[0085] The reaction scheme clearly shows the formation of the solvents methanol and 2-butanol, which can be trapped and / or polymerized into the molded body by adding a reactive diluent such as an acrylate and / or a ketone.

[0086] For example, the following compounds can be used individually or in any mixture as reactive diluents in a hybrid material composition according to exemplary embodiments of the invention:

[0087] Exo-1,7,7-trimethylbicyclo[2.2.1]hept-2-yl acrylate

[0088] Common name: Isobornyl acrylate

[0089] CAS No.: 5888-33-5;

[0090] Dicyclopentenyloxyethyl methacrylate

[0091] CAS No. 68586-19-6;

[0092] Tetrahydrofurfuryl acrylate

[0093] CAS No. 2399-48-6;

[0094] (5-Ethyl-1,3-dioxan-5-yl)-methyl acrylate

[0095] CAS No. 66492-51-1;

[0096] 2-Phenoxyethyl acrylate

[0097] CAS No. 48145-04-6;

[0098] Iso-decyl acrylate

[0099] CAS No. 1330-61-6;

[0100] Dodecyl acrylate

[0101] CAS No. 2156-97-0;

[0102] Iso-octyl acrylate

[0103] CAS No. 29590-42-9;

[0104] 3-(Trimethoxysilyl)propyl methacrylate 202414577 Foreign version

[0105] 14

[0106] CAS No. 2530-85-0;

[0107] Trimethylolpropanetriacrylate

[0108] CAS No. 15625-89-5;

[0109] 3-Methyl-1,5-pentanediyl diacrylate

[0110] CAS No. 64194-22-5;

[0111] (Octahydro-4,7-methano-1 H-indendiyl)bis(methylene)diacrylate

[0112] CAS No. 42594-17-2;

[0113] Fillers, particularly thermally conductive fillers, include metallic and / or ceramic coated and / or uncoated particles. These particles can be mixtures of several fractions that differ in material, shape, size, etc. Fillers can impart various properties to the material, such as thermal conductivity, electrical conductivity, color, metallic luster, and so on.

[0114] Fillers and / or other additives may be present in the hybrid material composition according to the invention in an amount of 20 to 90 wt%, in particular 20 to 80 wt% and preferably 20 to 70 wt%.

[0115] The invention relates to a composite of a cooling system and the housing and / or surface of an electrical and / or electronic component, wherein the cooling system has a novel and improved connection to the surface to be cooled. By using a thermally conductive material that can be processed using additive manufacturing and cross-linked by radiation, the invention opens up entirely new possibilities for heat dissipation from a housing and / or circuit board of an electrical and / or electronic component.

[0116] Explanation of the figures

[0117] Figure 2 shows a comparison with the prior art, with a molded body according to an embodiment of the present invention in the foreground and on the left, manufactured according to 202414577 foreign version.

[0118] Figure 15 was made with photopolymer and is transparent. In comparison, Figure 2, at the rear right, shows a molded body made from the same formulation but without photopolymer, which exhibits cracks and signs of degradation. Figure 3 shows a cooling system made of a hybrid material composition cured by UV irradiation according to an exemplary embodiment of the invention: unfilled and transparent on the left, filled and white on the right.

[0119] The invention opens up for the first time the use of a thermally conductive hybrid material composition that can be processed in additive manufacturing and cross-linked by radiation, thereby creating completely new possibilities for heat dissipation from a housing and / or circuit board of an electrical and / or electronic component.

Claims

202414577 Foreign version 16 Patent claims 1. A composite of a cooling system and a surface to be cooled and / or a housing to be cooled of an electrical and / or electronic component, wherein the surface to be cooled and / or the housing to be cooled serves as a substrate and / or carrier for the cooling system, which can be manufactured by an additive manufacturing process with a hybrid material composition that is radiation-induced crosslinkable.

2. Composite according to claim 1, wherein the hybrid material composition comprises at least a first ceramic-forming material and a second radiation-induced crosslinkable photopolymer material.

3. Compound according to one of claims 1 or 2, wherein the first ceramic-forming material comprises a reactive diluent.

4. Composite according to one of the preceding claims, wherein the first ceramic-forming material comprises an organofunctional silane-based component and a complex metal-organic component.

5. Compound according to claim 4, wherein in the first material the proportions of the organofunctional silane-based component predominate over the other component of the first material.

6. Compound according to claim 4 or 5, wherein in the first material the complex metal-organic component comprises at least an oxide of silicon, titanium, aluminium, boron and / or zirconium.

7. Compound according to claims 4 to 6, wherein in the first material the molecular weight of the organo-functional silane-based component is in the range of 100 g / mol to 400 g / mol.

8. Compound according to one of the preceding claims, wherein the hybrid material composition includes a reactive diluent. 202414577 Foreign version 17 9. Compound according to claim 8, wherein the reactive diluent is selected from the group consisting of the following compounds: acrylates, ketones, phenones and / or phosphine oxides, as well as any combinations and / or mixtures of the aforementioned compounds.

10. Compound according to one of the preceding claims, wherein the second, radiation-induced crosslinkable, photopolymer material is present in an amount of 1 wt% to 50 wt% of the total substance of the hybrid material composition.

11. Composite according to one of the preceding claims, wherein the first ceramic-forming material is present in an amount of 50 wt% to 99 wt% based on the total substance of the hybrid material composition.

12. Composite according to any of the preceding claims, wherein the hybrid material composition comprises fillers.

13. Compound according to claim 12, wherein the fillers are present in several fractions.

14. Composite according to one of claims 12 or 13, wherein at least one fraction consists of thermally conductive fillers.

15. Compound according to one of the preceding claims, which can be manufactured by 3D printing.

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