Substrate module, and electronic component module including same

Abstract

A substrate module according to the present invention comprises: a substrate having a plurality of first holes and a plurality of first sensing holes; a bus bar disposed on one surface of the substrate and having a plurality of second holes and a plurality of protrusions; and an insulating sheet provided between the substrate and the bus bar, wherein the plurality of first holes correspond to positions of the plurality of second holes, and the protrusions may be inserted into the first sensing holes and soldered to the substrate.

Description

Substrate module and electronic component module including the same

[0001] The present invention relates to a substrate module and an electronic component module including the same.

[0002] Recently, the use of electric vehicles, which rely on batteries to power their vehicles, is on the rise. Accordingly, electric vehicles are equipped with battery packs to store electricity, along with junction boxes and battery management systems (BMS) to distribute and manage the electricity generated by the battery pack according to its intended use.

[0003] Junction boxes for these electric vehicles must be capable of transmitting power exceeding hundreds of amperes (A). To achieve this, the busbars used within the junction boxes typically have increased thickness, width, and length, and often take on complex shapes. Furthermore, a large number of wire harnesses are used to transmit signals between internal components within the junction box and to connect peripheral devices such as the battery management system (BMS).

[0004] This can result in larger junction boxes, cluttered interiors and exteriors, making assembly and repairs difficult and reducing productivity. Furthermore, wire harnesses can become improperly connected or disconnected.

[0005] One of the technical tasks of the present invention is to provide a high-power transmission substrate module with improved productivity.

[0006] In addition, another technical task of the present invention is to provide a high-power transmission substrate module with improved reliability of electrical connection and signal transmission.

[0007] The technical problems of the present invention are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0008] A substrate module according to the present invention comprises: a substrate having a plurality of first holes and a plurality of first sensing holes; a bus bar disposed on one surface of the substrate and having a plurality of second holes and a plurality of protrusions; and an insulating sheet provided between the substrate and the bus bar; wherein the plurality of first holes correspond to positions of the plurality of second holes, and the protrusions can be inserted into the first sensing holes and soldered to the substrate.

[0009] Additionally, the height of the upper surface of the protrusion may be greater than the height of the upper surface of the substrate.

[0010] In addition, the protrusion and the first sensing hole are soldered to form a sensor unit, and at least one of voltage, current, and temperature of the bus bar can be sensed through the sensor unit.

[0011] Additionally, the thickness of the protrusion may be equal to or greater than the sum of the thickness of the substrate and the thickness of the insulating sheet.

[0012] Additionally, the diameter of the first hole of the substrate may be larger than the diameter of the second hole of the bus bar.

[0013] Additionally, the insulating sheet includes a second sensing hole, and the protrusion can penetrate the second sensing hole.

[0014] Additionally, the bus bar may include a first region that vertically overlaps the substrate and a second region that does not overlap the substrate.

[0015] Additionally, the second region may be positioned higher or lower than the substrate.

[0016] Additionally, the second region can be folded from the first region.

[0017] Additionally, the second region includes a plurality of extensions, some of which may have different heights.

[0018] Additionally, the busbar may include a plurality of copper plates spaced apart from each other and arranged adjacent to each other.

[0019] Additionally, at least two of the plurality of copper plates may have a surface formed with a bridge cut therein that connects them to each other on the surfaces facing each other.

[0020] Additionally, the roughness of the surface on which the bridge is cut may be greater than the roughness of other parts of the copper plate.

[0021] In addition, slits are formed in corresponding positions in the substrate and the insulating sheet, and the slits can lead to a space between the plurality of copper plates.

[0022] Additionally, a relay may be placed in the first hole and the slit.

[0023] Additionally, the insulating sheet may further include an adhesive on the surface facing the bus bar.

[0024] Additionally, the second hole is located within a joint portion protruding from the bus bar by a predetermined height, and the joint portion can be arranged within the first hole.

[0025] In addition, a method for manufacturing a substrate module according to the present invention includes a step of preparing a bus bar in which a plurality of copper plates are connected via a bridge; a step of attaching an insulating sheet to the bus bar; and a step of settling a substrate on the insulating sheet; and may further include a step of cutting the bridge after the insulating sheet is attached to the bus bar.

[0026] In addition, the bus bar may include a plurality of protrusions, the substrate may include a plurality of first sensing holes into which the plurality of protrusions are inserted, and the step of soldering the protrusions inserted into the first sensing holes of the substrate to the substrate may be further included.

[0027] Additionally, the bridge can be cut after the substrate is mounted on the insulating sheet.

[0028] Additionally, the bridge can be cut after the protrusion and the substrate are soldered.

[0029] The substrate module according to the present invention can simplify the configuration of high-power transmission electronic product modules for electric vehicles and contribute to miniaturization and improved productivity of electronic product modules. Furthermore, the substrate module of the present invention can eliminate and replace a large number of wire harnesses and related components, thereby enhancing the reliability of signal transmission between internal components of the electronic product module and connection with external peripheral devices.

[0030] In addition, the substrate module and electronic product module according to the present invention are easy to assemble and repair, so that manufacturing costs can be reduced and service costs can be reduced.

[0031] Figures 1a and 1b are drawings illustrating an electronic component module according to the present invention.

[0032] Figure 2 is a drawing showing a substrate module according to the first embodiment.

[0033] Fig. 3 is a cross-sectional view showing a cross-section of line AA' of Fig. 2.

[0034] Figures 4a to 4c are drawings showing the manufacturing process of a substrate module according to the first embodiment.

[0035] Figure 5 is a drawing showing a substrate module according to the second embodiment.

[0036] Fig. 6 is a drawing showing a bus bar used in the embodiment.

[0037] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. The suffixes "module" and "part" used in the following description for components are given or used interchangeably for the sake of ease of writing the specification, and do not in themselves have distinct meanings or roles. In addition, the attached drawings are intended to facilitate easy understanding of the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing "on" another element, this includes that it may be directly on the other element, or that other intermediate elements may exist therebetween.

[0038]

[0039] Figure 1 is a drawing showing an electronic component module (10) according to the present invention.

[0040] The above electronic product module (10) may include a substrate module (100) and a plurality of relays (not shown). Here, the electronic product module (10) may be a BEM (Battery Energy Management), or alternatively, may be called a BJB (Battery Junction Box) or BDU (Battery Disconnect Unit). In addition, the electronic product module (10) may be a product integrated with a BMS (Battery Management System).

[0041] In detail, the electronic product module (10) may include a substrate module (100), a management module (not shown), a plurality of relays, a connector (not shown), a frame (not shown), and a case (200). At this time, the substrate module (100) is provided in a form in which a bus bar (120) including a plurality of copper plates is attached to one surface of the substrate, and the plurality of copper plates are connected through a connection terminal provided in the relay to transmit, branch, or cut off power from one side to the other side.

[0042] The above management module is connected to the substrate module (100) by a relay or connector and can control the power flow of the substrate module (100). Here, the management module may be a BMS (Battery Management System).

[0043]

[0044] FIG. 2 is a drawing showing a substrate module (100) according to the first embodiment of the present invention, and FIG. 3 is a cross-sectional view showing a cross-section taken along line A-A' of FIG. 2.

[0045] Referring to FIGS. 2 and 3, the substrate module (100) according to the first embodiment may include a substrate (110), a bus bar (120), and an insulating sheet (125) interposed between the substrate (110) and the bus bar (120).

[0046] The above substrate module (100) may be in the form of a combination of the substrate (110), bus bar (120), and insulating sheet (125).

[0047] The above substrate (110) may include a plurality of insulating layers (not shown) and a circuit pattern (not shown). Any one of the plurality of insulating layers may be a core layer including a reinforcing member such as glass fiber, but is not limited thereto.

[0048] An adhesive (not shown) may be provided between the insulating sheet (125) and the bus bar (120). The adhesive may strengthen the bond between the insulating sheet (125) and the bus bar (120), thereby improving bonding reliability.

[0049] The substrate module (100) may include a plurality of connecting portions (150). For example, the plurality of connecting portions (150) may include a first connecting portion (150a) and a second connecting portion (150b) that are provided to form a pair. In addition, a slit (135) may be formed between the first connecting portion (150a) and the second connecting portion (150b).

[0050] The above-described relay can be electrically connected by making contact with the bus bar (120) through the above-described connection portion (150).

[0051] The above bus bar (120) may include a plurality of extension portions (131) protruding outward from the substrate (110), and the extension portions (131) may include, for example, a first extension portion (131a), a second extension portion (131b), and a third extension portion (131c).

[0052] The above extension (131) can be connected to an external terminal, element, or circuit. The above extension (131) can be formed on one side and the other side of the bus bar (120).

[0053] The above bus bar (120) may further include a case connection portion (123) connected to the case (200).

[0054] The above bus bar (120) may be in the form of a plurality of copper plates arranged in a plane, but is not limited thereto.

[0055] The above substrate module (100) may include a plurality of sensing units (140). The sensing units (140) may be formed by soldering the substrate (110) and the bus bar (120).

[0056] In detail, the substrate (110) may have a first sensing hole (140H1), and the insulating sheet (125) may have a second sensing hole (140H2).

[0057] The first sensing hole (140H1) and the second sensing hole (140H2) may be vertically overlapped. In addition, the inner surfaces of the first sensing hole (140H1) and the second sensing hole (140H2) may be positioned on the same vertical line.

[0058] The diameter of the first sensing hole (140H1) may be the same as the diameter of the second sensing hole (140H2), but is not limited thereto.

[0059] Meanwhile, the bus bar (120) may have a protrusion (124) having a protruding shape on one side. In addition, the thickness of the protrusion (124) may be 70% or less of the thickness of the bus bar (120), but is not limited thereto.

[0060] The above protrusion (124) can penetrate the first sensing hole (140H1) of the substrate (110) and the second sensing hole (140H2) of the insulating sheet (125).

[0061] The thickness of the protrusion (124) may be greater than or equal to the sum of the thickness of the substrate (110) and the thickness of the insulating sheet (125). Accordingly, the height of the upper surface of the protrusion (124) may be greater than or equal to the height of the upper surface of the substrate (110), and the protrusion (124) may be fitted into the first sensing hole (140H1) and the second sensing hole (140H2) so that a portion thereof may be exposed.

[0062] The exposed protrusion (124) and the substrate (110) are soldered, and accordingly, the substrate (110) and the bus bar (120) can form a substrate module (100) as an integral unit.

[0063] Not only the upper surface of the protrusion (124), but also the exposed side surface can be soldered to the substrate (110).

[0064] Additionally, the protrusion (124) can be soldered to the substrate (110) and function as a sensing unit (140). The sensing unit (140) can be a sensing spot capable of measuring the temperature, voltage, or current of the bus bar.

[0065] The sensing unit (140) is provided in multiple numbers and may be formed around the connecting unit (150) or the shunt (118), but is not limited thereto.

[0066] In the first embodiment, a separate sensor or management module (200) can measure the temperature of the bus bar (120) through the sensing unit (140) or measure the voltage or current between the copper plates of the bus bar (120) to which the shunt (118) or relay (300) is connected.

[0067]

[0068] Figures 4a to 4c are drawings showing the manufacturing process of a substrate module according to the first embodiment.

[0069] First, referring to FIG. 4a, a bus bar (120) having a plurality of copper plates may include a plurality of second holes (152) and a plurality of protrusions (124).

[0070] The second hole (152) may be formed within a joint portion protruding from the bus bar (120) by a predetermined height. The joint portion may be positioned within the first hole (151) and the third hole (153) described later. The second holes (152) may be provided in each of the adjacent copper plates to form a pair.

[0071] The plurality of copper plates of the above bus bar (120) can be formed integrally through a bridge (145).

[0072] In the first embodiment, the bridge (145) is formed between adjacent second holes (152) and the protrusion (124) is formed adjacent to the second hole (152), but is not limited thereto.

[0073] An insulating sheet (125) may be positioned on the bus bar (120). The insulating sheet (125) may have a plurality of third holes (153) positioned at positions corresponding to the plurality of second holes (152). Each of the plurality of third holes (153) may vertically overlap each of the plurality of second holes (152).

[0074] The above insulating sheet (125) may have a second slit (137) between the plurality of third holes (153). The second slit (137) may be formed at a position corresponding to the bridge (145).

[0075] An insulating sheet (125) may be attached to the bus bar (120). The insulating sheet (125) may further include an attachment material (not shown) on the surface facing the bus bar (120). Accordingly, the insulating sheet (125) and the bus bar (120) may be more strongly bonded.

[0076]

[0077] Referring to Fig. 4b, a substrate (110) can be positioned on an insulating sheet (125) attached to the bus bar (120). The substrate (110) can have a first hole (151) formed at a position corresponding to the second hole (152) of the bus bar (120). The diameter of the first hole (151) is larger than the diameter of the second hole.

[0078] Additionally, the substrate (110) may have a first slit (136) formed at a position corresponding to the second slit (137) of the insulating sheet (125).

[0079] The size of the first slit (136) may be the same as the size of the second slit (136), but is not limited thereto.

[0080]

[0081] Next, referring to FIG. 4c, after the substrate (110) is attached to the insulating sheet (125) and the bus bar (120), the protrusion (124) of the bus bar (120) and the substrate (110) can be soldered, thereby forming a sensing unit (140).

[0082] In addition, the first hole (151) of the substrate (110), the second hole (152) of the bus bar (120), and the third hole (153) of the insulating sheet (125) may overlap to form the connecting portion (150).

[0083] After the bus bar (120), the insulating sheet (125), and the substrate (110) are combined, the bridge (145) can be cut and removed. However, this is not limited to this, and the bridge (145) can also be cut and disconnected after the insulating sheet (125) is attached to the bus bar (120).

[0084]

[0085] Figure 5 is a drawing showing a substrate module (101) according to the second embodiment.

[0086] The bus bar (120) according to the second embodiment may include a plurality of extension parts (131). The extension parts (131) may be connected to external terminals, elements, or circuits.

[0087] The above-described plurality of extension parts (131) may be formed to protrude outwardly from the substrate (110). The extension parts (131) may include a first extension part (131a), a second extension part (131b), and a third extension part (131c).

[0088] The above extension (131) may not overlap with the substrate (110).

[0089] The above extension (131) may be formed to have a predetermined height. For example, the extension (131) may be positioned higher or lower than the substrate (110) on the outside of the substrate (110).

[0090] In addition, the extension portion (131) may include a bend portion. In detail, the extension portion (131) may have a bend portion formed in a region extending vertically from the lower surface of the substrate (110) to the side surface of the substrate (110).

[0091] More specifically, it may have a region extending vertically from the side of the substrate (110) and a region extending in a direction parallel to the substrate (110) from a region extending vertically to the substrate (110), and a folded portion may be formed between the two regions.

[0092] Additionally, the heights of each of the plurality of extensions (131) may be the same or different from each other.

[0093] For example, the first extension portion (131a) and the second extension portion (131b) may be positioned higher than the substrate (110), and the first extension portion (131a) may be positioned higher than the second extension portion (131b).

[0094] Additionally, for example, the second extension portion (131b) may be positioned higher than the substrate (110), and the third extension portion (131c) may be positioned lower than the substrate (110).

[0095] Additionally, the first extension portion (131a) and the second extension portion (131b) may have the same height, and the third extension portion (131c) may have a different height.

[0096]

[0097] Fig. 6 is a drawing showing in detail a bus bar (120) used in the embodiment. Referring to Fig. 6, the bus bar (120) may be composed of a plurality of copper plates arranged to be spaced apart from each other and adjacent to each other, and may include, for example, a first plate (120a), a second plate (120b), and a third plate (120c).

[0098] The first plate (120a) and the second plate (120b) may have different shapes, and a space (133) having a constant width may be formed between the first plate (120a) and the second plate (120b).

[0099] The above bus bar (120) may include a first region (121) and a second region (122) surrounding the outer side of the first region (121).

[0100] The second hole (152) formed in the bus bar (120) may include, for example, a 2-1 hole (152a) and a 2-2 hole (152b). The 2-1 hole (152a) may be formed in the first plate (120a), and the 2-2 hole (152b) may be formed in the second plate (120b).

[0101] In the above bus bar (120), the first plate (120a) and the second plate (120b) are connected through a bridge (145, see FIG. 4a), but can be removed during the manufacturing process of the substrate module.

[0102] The above bridge (145) may be provided in an adjacent area of ​​the first plate (120a) and the second plate (120b), and may be particularly positioned between the 2-1 hole (152a) and the 2-2 hole (152b), but is not limited thereto.

[0103] The roughness of the surface (134) where the above bridge is cut may be greater than the roughness of other areas of the copper plate.

[0104] A plurality of extension parts (131) may be arranged within the second region (122), and the plurality of extension parts (131) may include, for example, a first extension part (131a), a second extension part (131b), and a third extension part (131c).

[0105] The first extension portion (131a) may be arranged to extend from the first plate (120a). The second extension portion (131b) may be arranged to extend from the second plate (120b). The third extension portion (131c) may be arranged to extend from the third plate (120c).

[0106] The substrate module according to the present invention can be used in electric vehicles, distribution panels, switchboards, industrial equipment, etc., but is not limited thereto.

Claims

1. A substrate having a plurality of first holes and a plurality of first sensing holes; A bus bar disposed on one side of the substrate and having a plurality of second holes and a plurality of protrusions; and Including an insulating sheet provided between the substrate and the bus bar; The plurality of first holes correspond to the positions of the plurality of second holes, A substrate module in which the protrusion is inserted into the first sensing hole and soldered to the substrate.

2. In paragraph 1, A substrate module, wherein the height of the upper surface of the protrusion is greater than the height of the upper surface of the substrate.

3. In paragraph 1, The above protrusion and the first sensing hole are soldered to form a sensor portion, A substrate module that senses at least one of voltage, current, and temperature of a bus bar through the above sensor unit.

4. In paragraph 1, A substrate module in which the thickness of the above protrusion is equal to or greater than the sum of the thickness of the substrate and the thickness of the insulating sheet.

5. In paragraph 1, A substrate module, wherein the diameter of the first hole of the substrate is larger than the diameter of the second hole of the bus bar.

6. In paragraph 1, The above insulating sheet includes a second sensing hole, The above protrusion penetrates the second sensing hole, the substrate module.

7. In paragraph 1, A substrate module, wherein the bus bar includes a first region vertically overlapping the substrate and a second region not overlapping the substrate.

8. In paragraph 7, A substrate module wherein the second region is positioned higher or lower than the substrate.

9. In paragraph 8, The second region is a substrate module that is bent in the first region.

10. In paragraph 8, The second region includes a plurality of extensions, A substrate module, wherein some of the above-described plurality of extensions have different heights.

11. In paragraph 1, The above busbar is a substrate module including a plurality of copper plates spaced apart from each other and arranged adjacently.

12. In paragraph 11, A substrate module in which at least two of the above plurality of copper plates have a cut surface formed on a surface facing each other, which connects the bridges to each other.

13. In paragraph 12, A substrate module having a roughness of the surface on which the above bridge is cut greater than the roughness of other parts of the corresponding copper plate.

14. In paragraph 11, Slits are formed in corresponding positions on the above substrate and insulating sheet, The above slit is a substrate module that leads to a space between the plurality of copper plates.

15. In paragraph 14, A substrate module in which a relay is placed in the first hole and the slit.

16. In paragraph 1, A substrate module, wherein the insulating sheet further includes an adhesive on the surface facing the bus bar.

17. In paragraph 1, The second hole is located within a joint portion protruding from the bus bar by a predetermined height, A substrate module wherein the above-mentioned joint is placed within the first hole.

18. Step of preparing a bus bar in which multiple copper plates are connected through a bridge; A step of attaching an insulating sheet to the above bus bar; and A step of mounting a substrate on the above insulating sheet; A method for manufacturing a substrate module, further comprising a step of cutting the bridge after the insulating sheet is attached to the bus bar.

19. In paragraph 18, The above bus bar includes a plurality of protrusions, The substrate includes a plurality of first sensing holes into which the plurality of protrusions are inserted, A method for manufacturing a substrate module, further comprising the step of soldering the protrusion inserted into the first sensing hole of the substrate to the substrate.

20. In paragraph 18, A method for manufacturing a substrate module, wherein the above bridge is cut after the substrate is mounted on the above insulating sheet.

21. In paragraph 19, A method for manufacturing a substrate module, wherein the above bridge is cut after the above protrusion and the above substrate are soldered.

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