Circuit board assembly and electronic device

Abstract

The present application relates to the technical field of heat sinks. Provided are a circuit board assembly and an electronic device, used for solving the problem of how to improve the application reliability of the circuit board assembly. The circuit board assembly comprises a circuit board, a chip packaging structure, a heat sink, a support plate, a connection structure, and a first buffer structure. The chip packaging structure is arranged on the circuit board; the heat sink is arranged on the side of the chip packaging structure away from the circuit board; the support plate is arranged on the side of the circuit board away from the heat sink; the connection structure passes through the heat sink and the circuit board and is connected to the support plate; the first buffer structure is arranged between the circuit board and the support plate; and the support plate supports the circuit board by means of the first buffer structure. The circuit board assembly is used for improving the ability of a chip to resist loads such as impact and vibration.

Description

Circuit board assembly and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411389416.7, filed on September 30, 2024, and entitled "Circuit board assembly and electronic device", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat sinks, in particular to a circuit board assembly and an electronic device. BACKGROUND

[0003] At present, the chip power consumption and power density of electronic devices are continuously increasing, and the heat dissipation capacity of the chip packaging structure is facing greater challenges. At present, the mainstream heat dissipation scheme is to sequentially stack the chip packaging structure, the heat sink and the like on the circuit board to form a circuit board assembly, and to increase the heat dissipation capacity of the chip packaging structure through the heat sink.

[0004] However, as the heat dissipation capacity requirement of the chip packaging structure becomes higher and higher, the size and weight of the heat sink also become larger and larger. In addition, as the integration of the circuit board assembly is continuously improved and the internal microstructure of the circuit board assembly is more complex, the system stress allowance is smaller and smaller. In the assembly, transit transportation and other scenarios, the circuit board assembly is more easily affected by impact, vibration and other loads, causing the heat sink to deform, the chip to crack and other problems, and generating failure risks. Therefore, it is necessary to redesign a more effective shock absorption structure to ensure the application reliability of the circuit board assembly. SUMMARY

[0005] The present application provides a circuit board assembly and an electronic device to solve the problem of how to improve the application reliability of the circuit board assembly.

[0006] To achieve the above-mentioned purpose, the technical solutions adopted by the embodiments of the present application are as follows:

[0007] In a first aspect, the present application provides a circuit board assembly, which comprises a circuit board, a chip packaging structure, a heat sink, a support plate, a connecting structure and a first buffer structure. The chip packaging structure is arranged on the circuit board; the heat sink is arranged on the side of the chip packaging structure away from the circuit board; the support plate is arranged on the side of the circuit board away from the heat sink; the connecting structure is connected with the support plate through the heat sink and the circuit board; the first buffer structure is arranged between the circuit board and the support plate; and the support plate supports the circuit board through the first buffer structure.

[0008] Therefore, in the scenarios of assembly, circulation transportation, etc., the impact, vibration and other loads suffered by the support plate of the circuit board assembly are first transmitted to the first buffering structure and then to the circuit board, the chip packaging structure and the heat sink. Thus, the loads suffered by the support plate of the circuit board assembly are partially absorbed by the first buffering structure and are not directly transmitted to the circuit board, the chip packaging structure and the heat sink, so that the loads suffered by the circuit board, the chip packaging structure and the heat sink can be reduced, and problems such as breakage of the chip packaging structure, failure of the chip packaging structure due to delamination, deformation of the heat sink, etc. can be avoided, so that the performance of the circuit board assembly against impact, vibration and other loads is improved, and the application reliability of the circuit board assembly is ensured. In addition, when the heat-conducting layer is arranged between the chip packaging structure and the heat sink, the impact, vibration and other loads suffered by the chip packaging structure and the heat sink can be reduced by the first buffering structure, so that the heat-conducting layer can be prevented from being broken due to impact, vibration and other loads, and the reliability of the heat dissipation capability of the chip packaging structure is improved.

[0009] In a possible implementation of the first aspect, the first buffering structure is arranged around the connecting structure, and one end of the first buffering structure is in contact with the support plate and the other end is in contact with the circuit board. Since one end of the first buffering structure is in contact with the support plate and the other end is in contact with the circuit board, the impact, vibration and other loads suffered by the support plate are transmitted to the circuit board through the first buffering structure. Thus, the impact, vibration and other loads suffered by the circuit board and other components on the circuit board can be reduced.

[0010] In a possible implementation of the first aspect, the first buffering structure comprises a shock-absorbing seat, the shock-absorbing seat comprises a support base, a buffering part and a first fixing part, the support base is connected with the support plate, and the first fixing part is connected with the connecting structure; in the direction perpendicular to the support plate, the support base and the first fixing part have a spacing therebetween, and the buffering part is arranged between the support base and the first fixing part and is connected with the support base and the first fixing part respectively. Thus, when the support plate suffers impact, vibration and other loads, the impact, vibration and other loads need to be transmitted to the circuit board through the buffering part of the shock-absorbing seat, so that the impact, vibration and other loads suffered by the circuit board can be reduced. In addition, since the first fixing part is abutted on the circuit board after being connected with the connecting structure, the loads suffered by the support plate can be transmitted to the circuit board through the buffering part of the shock-absorbing seat, so that the impact of the loads suffered by the circuit board can also be reduced.

[0011] In a possible implementation of the first aspect, the first fixing part comprises a flange nut, and the connecting structure is connected with the flange nut. Thus, the connecting structure can be connected with the support plate through the threaded connection with the flange nut.

[0012] In a possible implementation of the first aspect, the buffer portion includes a first through hole, the support base includes a second through hole, and the threaded hole of the flange nut, the first through hole and the second through hole are in communication; the first through hole and the second through hole each have a larger diameter than the diameter of the threaded hole. In this way, when the connecting structure is connected to the threaded hole of the flange nut, the first through hole and the second through hole provide more mounting space for the connecting structure, and the connecting structure does not interfere with other components even after penetrating the flange nut, thereby facilitating installation.

[0013] In a possible implementation of the first aspect, the support plate is provided with a second fixing portion, the second fixing portion is connected to the connecting structure, and the second fixing portion and the circuit board have a spacing in a direction perpendicular to the support plate; the first buffer structure is arranged around the second fixing portion. In this way, the circuit board is pressed towards the support plate by the connecting structure, and the first buffer structure is arranged around the second fixing portion (and also around the connecting structure), so that the first buffer structure can uniformly apply force to the circuit board to balance the force applied to the circuit board by the connecting structure, thereby reducing deformation of the circuit board caused by being supported by the first buffer structure.

[0014] In a possible implementation of the first aspect, the first buffer structure includes an impact-reducing ring, and the impact-reducing ring is provided with a plurality of openings, the depth of the openings extends in the radial direction of the impact-reducing ring, and the length of the openings extends in the circumferential direction of the impact-reducing ring; at least two openings are arranged at intervals in the circumferential direction of the impact-reducing ring. In this way, the part between the two openings arranged at intervals in the circumferential direction of the impact-reducing ring and the part above the two openings form a cantilever beam structure, and deformation of the cantilever beam can absorb part of the impact, vibration and other loads received by the support plate. The openings also form a cross section in the transmission path of the impact, and the cross section can reflect the impact, vibration and other loads. Therefore, the impact-reducing ring can also reduce the impact, vibration and other loads received by the circuit board from the support plate.

[0015] In a possible implementation of the first aspect, the plurality of openings are arranged in a plurality of circles, each circle of openings includes at least two openings arranged at intervals in the circumferential direction of the impact-reducing ring; the plurality of circles of openings are arranged in the direction of the central axis of the impact-reducing ring, and adjacent two circles of openings are arranged at intervals in the circumferential direction of the impact-reducing ring. In this way, a plurality of cross sections can be formed in the transmission path of the impact and vibration, the transmission path of the impact and vibration is lengthened, and the impact, vibration and other loads received by the circuit board from the support plate are further reduced.

[0016] In a possible implementation of the first aspect, the two openings respectively located in adjacent two circles of openings and adjacent in the circumferential direction of the impact-reducing ring are respectively a first opening and a second opening, and the end portions of the first opening and the second opening close to each other overlap in the direction of the central axis of the impact-reducing ring. In this way, a cross section is formed in the transmission path of all impact, vibration and other loads, the transmission path of the impact and vibration is further lengthened, and the impact, vibration and other loads received by the circuit board from the support plate are reduced.

[0017] In a possible implementation of the first aspect, the first buffering structure comprises a laminated structure, the laminated structure comprises a plurality of annular gaskets arranged in layers, and wave impedances of at least two gaskets are different. Interfaces between adjacent layers of the laminated structure can generate reflected stress waves, and the reflected stress waves can reduce the impact, vibration, or the like, and reduce the impact, vibration, or the like of the circuit board from the support plate.

[0018] In a possible implementation of the first aspect, the first buffering structure comprises a buffering gasket, and the buffering gasket comprises a non-Newtonian fluid characteristic material. In this way, when the buffering gasket is installed in the circuit board assembly, the buffering gasket is subjected to static load, and the force of the buffering gasket on the support plate and the circuit board can be small, thereby reducing the influence of the system stress on the circuit board assembly. When the support plate is subjected to impact, vibration, or the like, the buffering gasket can quickly become hard to absorb energy, thereby reducing the transmission of the impact, vibration, or the like.

[0019] In a possible implementation of the first aspect, a normal projection of the chip packaging structure on the buffering gasket is located within a range of the buffering gasket. In this way, the area of the buffering gasket in the transmission path of the impact, vibration, or the like is increased, the impact, vibration, or the like is ensured to be transmitted through the buffering gasket, and the buffering effect of the buffering gasket is increased. Meanwhile, when the support plate is subjected to impact, vibration, or the like, the buffering gasket can quickly become hard, thereby providing good support for the circuit board on which the chip packaging structure is arranged, preventing the dynamic inertial load of the heat sink, the chip packaging structure, or the like arranged on the circuit board from causing the circuit board to bend and deform, and avoiding affecting the connection between the chip packaging structure and the circuit board.

[0020] In a possible implementation of the first aspect, the circuit board assembly further comprises a lower supporting plate, the lower supporting plate is arranged between the circuit board and the buffering gasket, two opposite surfaces of the buffering gasket in a direction perpendicular to the support plate are in contact with the support plate and the lower supporting plate respectively, and the connecting structure comprises a first connecting member and a second connecting member. The first connecting member passes through the heat sink and the circuit board, and is connected with the lower supporting plate. The second connecting member is arranged at the periphery of the lower supporting plate, passes through the circuit board, and is connected with the support plate. In this way, the lower supporting plate can make the circuit board bear force uniformly, and avoid deformation of the circuit board. Meanwhile, the connecting structure comprises the first connecting member and the second connecting member, the heat sink, the circuit board, and the lower supporting plate are connected through the first connecting member, and the second connecting member passes through the circuit board and is connected with the support plate, thereby achieving that the heat sink and the circuit board are connected with the support plate through the connecting structure, and the lower supporting plate and the circuit board are connected together, and the stability of the installation of the lower supporting plate is improved.

[0021] In a possible implementation of the first aspect, the support plate is provided with a second fixing portion, and the second fixing portion is connected with the connecting structure; the first buffer structure further comprises an impact-reducing ring or a laminated structure arranged around the second fixing portion; or, the first buffer structure further comprises a shock-absorbing seat, and the shock-absorbing seat comprises a support base, a buffer portion and a first fixing portion, the support base is connected with the support plate, and the first fixing portion is connected with the connecting structure; in a direction perpendicular to the support plate, the support base and the first fixing portion have a spacing therebetween, the buffer portion is arranged between the support base and the first fixing portion, and is connected with the support base and the first fixing portion, respectively. In this way, the first buffer structure can simultaneously comprise one of the shock-absorbing seat, the impact-reducing ring and the laminated structure and the buffer pad, and further reduce the impact, vibration and other loads received by the circuit board.

[0022] In a possible implementation of the first aspect, the circuit board assembly further comprises a second buffer structure arranged between the circuit board and the heat sink and supporting the heat sink; and the second buffer structure comprises a non-Newtonian fluid characteristic material. In this way, the second buffer structure comprises the non-Newtonian fluid characteristic material, and in a working scenario (static), the counterforce generated by the second buffer structure is small, and the load acting on the heat conduction layer and the chip packaging structure by the heat sink has little effect, and does not affect the working characteristics of the chip; and in a turnover transportation scenario, the second buffer structure can quickly harden to absorb energy, and at the same time, after hardening, the second buffer structure can shunt the dynamic inertial load of the heat sink, reduce the dynamic impact on the heat conduction layer and the chip packaging structure, and improve the application reliability of the circuit board assembly. Therefore, the second buffer structure can not only adapt to a static scenario, but also reduce the impact, vibration and other loads generated by the heat sink in a dynamic scenario.

[0023] In a possible implementation of the first aspect, the circuit board assembly further comprises a support arranged on a side of the circuit board close to the heat sink; and the second buffer structure is arranged on a side of the support away from the circuit board. In this way, the second buffer structure is arranged on the support, and the second buffer structure can still play a role in reducing the load, and at the same time, the size of the second buffer structure in a direction perpendicular to the circuit board can be reduced. In addition, because the distance between the circuit board and the heat sink of different circuit board assemblies is different, different thicknesses of the second buffer structure are required. In the case of arranging the support, the size of the support can be selected to adapt to a specific size of the second buffer structure, so that the number of types of the second buffer structure required in production can be reduced.

[0024] In a possible implementation of the first aspect, the chip packaging structure comprises a substrate, a chip and an anti-deformation ring, the anti-deformation ring and the chip are arranged on a side of the substrate close to the heat sink, and the anti-deformation ring is arranged around the chip; and the second buffer structure is arranged on a side of the anti-deformation ring away from the substrate. In this way, the second buffer structure is arranged on a side of the anti-deformation ring away from the substrate, and can directly contact the heat sink to buffer the dynamic inertial load of the heat sink.

[0025] In a possible implementation of the first aspect, the number of the second buffering structures is multiple, and the multiple second buffering structures are arranged around the chip in the chip package structure; or, the second buffering structure is a ring structure, and the ring structure is arranged around the chip in the chip package structure. In this way, the number of the second buffering structures is multiple or one. When the number of the second buffering structures is multiple, the second buffering structures can be arranged around the chip package structure; when the number of the second buffering structures is one, the second buffering structure is arranged around the chip package structure.

[0026] In the second aspect, the present application provides an electronic device, which can include any possible circuit board assembly in the first aspect. Since the circuit board assembly has strong anti-impact and anti-vibration capability, the electronic device also has strong anti-impact and anti-vibration capability. BRIEF DESCRIPTION OF DRAWINGS

[0027] FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application;

[0028] FIG. 2 is a schematic diagram of a circuit board assembly according to an embodiment of the present application;

[0029] FIG. 3 is a schematic diagram of another circuit board assembly according to an embodiment of the present application;

[0030] FIG. 4 is a schematic diagram of impact and vibration transmission in the circuit board assembly in FIG. 3;

[0031] FIG. 5 is a schematic diagram of another circuit board assembly according to an embodiment of the present application;

[0032] FIG. 6 is a possible enlarged view of region P in FIG. 5;

[0033] FIG. 7 is a schematic diagram of a shock-absorbing seat according to an embodiment of the present application;

[0034] FIG. 8 is a schematic diagram of a cross-sectional structure of the shock-absorbing seat in FIG. 7 along line A1-A2;

[0035] FIG. 9 is another possible enlarged view of region P in FIG. 5;

[0036] FIG. 10 is a schematic diagram of a shock-absorbing ring according to an embodiment of the present application;

[0037] FIG. 11 is a schematic diagram of a cross-sectional structure of the shock-absorbing ring in FIG. 10 along line B1-B2;

[0038] FIG. 12 is also a schematic diagram of a cross-sectional structure of the shock-absorbing ring in FIG. 10 along line B1-B2;

[0039] FIG. 13 is another possible enlarged view of region P in FIG. 5;

[0040] FIG. 14 is a schematic diagram of stress wave transmission in two laminated pads;

[0041] FIG. 15 is a schematic diagram of another circuit board assembly according to embodiments of the present application;

[0042] FIG. 16 is a stress-strain curve of a non-Newtonian fluid according to embodiments of the present application;

[0043] FIG. 17 is a schematic diagram of another circuit board assembly according to embodiments of the present application. DETAILED DESCRIPTION

[0044] Unless otherwise defined, technical and scientific terms used herein should have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein and the claims section of the instant application should not be interpreted in accordance with the rules of grammar, but instead should be interpreted consistent with the principles of etymology and the dictionary. The terms "first", "second", "third", and similar terms are not intended to denote any order, quantity, or importance, but are used to distinguish different components. Thus, features defined with "first", "second", "third" can explicitly or implicitly include one or more of the features. In the description of embodiments of the present application, "a plurality of" means two or more, unless otherwise specified.

[0045] The terms "left", "right", "top", and "bottom", and similar terms are defined with respect to the orientation of the devices shown in the drawings. It should be understood that these directional terms are relative concepts, and are used for description and clarification, which can change accordingly depending on the orientation of the chip or semiconductor package structure.

[0046] Referring to FIG. 1, FIG. 1 is a schematic diagram of an electronic device 10 according to embodiments of the present application. The electronic device 10 can include a circuit board assembly 100. The electronic device 10 can be different types of user equipment or terminal equipment, such as personal computing devices, unmanned aerial vehicles, aerospace devices, and vehicle-mounted devices, and commercial devices such as communication devices, server devices, data centers, mobile data centers (MDC), etc. The specific type of electronic device is not particularly limited in the present application.

[0047] Referring to FIG. 2, FIG. 2 is a schematic diagram of a circuit board assembly 100 according to embodiments of the present application. The circuit board assembly 100 can include a chip package structure 110, a circuit board 120, a heat sink 130, and a connecting structure 150. The chip package structure 110 can be disposed on the circuit board 120 and electrically connected to the circuit board 120. The heat sink 130 is disposed on the side of the chip package structure 110 away from the circuit board 120. The connecting structure 150 assembles the chip package structure 110, the circuit board 120, and the heat sink 130 together.

[0048] The circuit board assembly 100 can further include a thermal interface material (TIM) 140 disposed between the chip package structure 110 and the heat sink 130. The TIM 140 can be in contact with both the chip package structure 110 and the heat sink 130. Illustratively, the connecting structure 150 can exert a pressure on the heat sink 130, which presses the TIM 140 against a surface of the chip package structure 110. The TIM 140 can be used to increase the heat dissipation capability of the heat sink 130 on the chip package structure 110.

[0049] Currently, the power consumption and power density of various electronic devices 10 are increasing, and the size and mass of the heat sink 130 are increasing, and the circuit board assembly 100 is more precise and more compact. Since the heat sink 130 has a large mass, the heat sink 130 has a large moment of inertia. As such, in scenarios such as assembly, transit, and the like, the heat sink 130 can impact the chip package structure 110 or the TIM 140. This can damage the TIM 140, cause the TIM 140 to collapse, and affect the heat dissipation of the chip package structure 110. In some cases where the force is large, it can also cause the chips in the chip package structure 110 to break, causing the electronic device 10 to be unable to work. In addition, since the size of the heat sink 130 is also increasing, the heat sink 130 is also more likely to deform.

[0050] Please continue to refer to FIG. 2, the chip package structure 110 includes a chip 111 and a substrate 113. The chip 111 is disposed on the substrate 113. For example, the chip 111 is disposed on a side of the substrate 113 that is away from the circuit board 120. In order to increase heat dissipation, the chip 111 can be a die, so that the TIM 140 is in direct contact with the chip 111, which can increase the heat dissipation performance of the chip 111. In this case, the force of the heat sink 130 can act directly on the chip 111 through the TIM 140, thereby more easily causing the chip 111 to break.

[0051] In some embodiments, please refer to FIG. 3, the circuit board assembly 100 can further include a support plate 160 disposed on a side of the circuit board 120 that is away from the chip package structure 110. The circuit board assembly 100 can be mounted in an electronic device through the support plate 160.

[0052] Exemplarily, the connecting structure 150 can include a bolt 151 and an elastic element 152. The heat spreader 130 and the circuit board 120 are provided with through holes, and the bolt 151 passes through the through holes of the heat spreader 130 and the through holes of the circuit board 120 in sequence and is fixedly connected with the support plate 160. Understandably, the elastic element 152 can be a spring, the bolt 151 can pass through the spring, the head of the bolt 151 abuts against one end of the spring, and the screw end of the bolt 151 can be connected with a threaded hole on the support plate 160. In this way, the other end of the spring abuts against the heat spreader 130, so that in the assembled circuit board assembly 100, the spring can achieve a predetermined compression amount and press the heat spreader 130 against the heat conduction layer 140. The bolt 151 can further include a flange, which is located on the screw rod. When the bolt 151 is connected with the threaded hole on the support plate 160, the flange presses the circuit board 120 against the support plate 160.

[0053] Please refer to FIG. 4. When the circuit board assembly 100 is installed in an electronic device, in the scenario of the rotation transportation of the electronic device, the impact and vibration received by the electronic device are transmitted upward to the circuit board 120, the chip packaging structure 110 and the heat spreader 130 through the support plate 160, and the transmission path can be as shown by the arrows in FIG. 4. These impacts and loads can generate dynamic loads on the heat conduction layer 140 between the chip packaging structure 110 and the heat spreader 130, the chip 111 of the chip packaging structure 110 and the like.

[0054] Understandably, since the connecting structure 150 is fixedly connected with the support plate 160, the circuit board 120 is pressed against the support plate 160, that is, the circuit board 120 and the support plate 160 abut against each other. Therefore, the impact and vibration received by the support plate 160 are almost not attenuated when transmitted to the circuit board 120, which can further cause the dynamic inertial load of the heat conduction layer 140, the chip 111 and the heat spreader 130 to be too large, resulting in problems such as the rupture of the chip 111, the ulceration of the heat conduction layer 140 and the deformation of the heat spreader 130.

[0055] Please refer to FIG. 5 and FIG. 6. FIG. 5 is a structural schematic diagram of another circuit board assembly 100 provided by an embodiment of the present application, and FIG. 6 is a possible enlarged view of the region P in FIG. 5. The circuit board assembly 100 can include a chip packaging structure 110, a circuit board 120, a heat spreader 130, a support plate 160 and a connecting structure 150.

[0056] The chip packaging structure 110 is arranged on one side of the circuit board 120. The side of the chip packaging structure 110 close to the circuit board 120 can be provided with a solder joint, and the chip packaging structure 110 is connected with the circuit board 120 through the solder joint.

[0057] The chip packaging structure 110 can include a substrate 113 and a chip 111, and the chip 111 can be disposed on a side of the substrate 113 away from the circuit board 120. The chip 111 can be connected to the substrate 113 by bonding. The substrate 113 can be provided with a through-silicon via, and the through-silicon via is provided with a conductive structure, one end of the conductive structure can be connected to the chip 111, and the other end of the conductive structure can be connected to the substrate 113. In this way, the chip 111 can realize the transmission of electrical signals with the circuit board 120 through the conductive structure in the through-silicon via.

[0058] The chip 111 can also include a deformation prevention ring 112. The deformation prevention ring 112 can also be disposed on a side of the substrate 113 away from the circuit board 120 and surround the chip 111. The deformation prevention ring 112 can be disposed on the same surface of the substrate 113 as the chip 111, and a gap can be formed between the deformation prevention ring 112 and the chip 111. The deformation prevention ring 112 is used to prevent the deformation of the substrate 113, and the deformation prevention ring 112 can be made of metal.

[0059] The circuit board 120 can be a printed circuit board (PCB). The area of the circuit board 120 can be larger than the area of the chip packaging structure 110. Other circuit elements such as resistors, capacitors, inductors, etc. can also be disposed on the circuit board 120.

[0060] The heat sink 130 is disposed on a side of the chip packaging structure 110 away from the circuit board 120. The heat sink 130 can include a vapor chamber and a heat dissipation fin, and the heat dissipation fin is disposed on a side of the vapor chamber away from the chip packaging structure 110. The vapor chamber and the heat dissipation fin can be integrally disposed. In this way, the heat sink 130 can dissipate heat from the chip packaging structure 110, and the vapor chamber can make the heat dissipation of the heat sink 130 from the chip packaging structure 110 more uniform.

[0061] The vapor chamber can directly or indirectly contact the chip packaging structure 110, that is, the heat sink 130 can directly or indirectly contact the chip packaging structure 110. In the case where the heat sink 130 indirectly contacts the chip packaging structure 110, the circuit board assembly 100 can further include a heat conduction layer 140. The heat conduction layer 140 can be disposed between and in contact with the heat sink 130 and the chip packaging structure 110. Therefore, the heat conduction layer 140 can increase the heat dissipation performance of the heat sink 130 from the chip packaging structure 110.

[0062] The support plate 160 is disposed on a side of the circuit board 120 away from the chip packaging structure 110, and the connecting structure 150 passes through the heat sink 130 and the circuit board 120 to connect with the support plate 160. In this way, the circuit board assembly 100 can be installed in an electronic device through the support plate 160.

[0063] Exemplarily, the connecting structure 150 can include a bolt 151 and an elastic element 152. The heat sink 130 and the circuit board 120 can be provided with through holes, and the bolt 151 is fixedly connected with the support plate 160 by sequentially penetrating the through hole of the heat sink 130 and the through hole of the circuit board 120. The elastic element 152 can be a spring, the bolt 151 can penetrate the spring, the head of the bolt 151 abuts against one end of the spring, and the screw end of the bolt 151 can be connected with a threaded hole on the support plate 160. Understandably, the number of the connecting structure 150 can be multiple, and the multiple connecting structures 150 are arranged around the chip packaging structure 110 in the plane where the circuit board 120 is located. For example, when the chip packaging structure 110 is rectangular, one connecting structure 150 can be provided corresponding to each side of the chip packaging structure 110, and the connecting structure 150 is located on the middle line of the side corresponding to the connecting structure 150.

[0064] In addition, the circuit board assembly 100 can further include a first buffer structure 170. The first buffer structure 170 is arranged between the circuit board 120 and the support plate 160, and the support plate 160 supports the circuit board 120 through the first buffer structure 170. That is, although the connecting structure 150 is connected with the support plate 160 by penetrating the through hole of the circuit board 120, the circuit board 120 does not directly contact the support plate 160. For example, there is a gap between the support plate 160 and the circuit board 120. Because the first buffer structure 170 is arranged, the first buffer structure 170 can support the circuit board 120 so that the circuit board does not contact the support plate 160.

[0065] In this way, in the scenarios of assembly, transit transportation and the like, the impact, vibration and other loads suffered by the support plate 160 of the circuit board assembly 100 are first transmitted to the first buffer structure 170 and then transmitted to the circuit board 120, the chip packaging structure 110 and the heat sink 130. That is, the load suffered by the support plate 160 of the circuit board assembly 100 is partially absorbed by the first buffer structure 170, and is not directly transmitted to the circuit board 120, the chip packaging structure 110 and the heat sink 130, thereby reducing the load suffered by the circuit board 120, the chip packaging structure 110 and the heat sink 130, improving the structural performance of the circuit board assembly 100, and ensuring the application reliability of the circuit board assembly 100. At the same time, because the load suffered by the chip packaging structure 110 is reduced, the chip 111 in the chip packaging structure 110 can also be prevented from breaking and slipping, and the chip packaging structure 110 can also be prevented from being invalid due to delamination.

[0066] Please continue to refer to FIG. 5, the first buffering structure 170 can be arranged around the connecting structure 150. It can be understood that the first buffering structure 170 can be connected with the connecting structure 150 by means of surrounding the connecting structure 150. There can also be a gap between the first buffering structure 170 and the connecting structure 150, i.e. the connecting structure 150 is not in contact with the connecting structure 150. One end of the first buffering structure 170 can be in contact with the support plate 160, and the other end can be in contact with the circuit board 120, thereby supporting the circuit board 120 between the circuit board 120 and the support plate 160.

[0067] Please refer to FIG. 6, the first buffering structure 170 can include a shock-absorbing seat 171. The shock-absorbing seat 171 includes a support base 1711, a buffering part 1712 and a first fixing part 1713. The first fixing part 1713 is connected with the connecting structure 150, the support base 1711 is connected with the support plate 160, and the support plate 160 has a spacing with the circuit board 120. The connection between the first fixing part 1713 and the connecting structure 150 can include riveting, welding, bolt connection, etc.

[0068] In order to clearly show the shock-absorbing seat 171, please refer to FIG. 7 and FIG. 8, wherein FIG. 7 is a perspective structure schematic diagram of a shock-absorbing seat 171 provided by an embodiment of the present application, and FIG. 8 is a cross-sectional structure schematic diagram of the shock-absorbing seat 171 along the A1-A2 line in FIG. 7. Please combine FIG. 6, along the direction perpendicular to the support plate 160, the support base 1711 and the first fixing part 1713 have a spacing, and the buffering part 1712 is arranged between the support base 1711 and the first fixing part 1713. That is to say, at least part of the buffering part 1712 is arranged in the spacing between the support base 1711 and the first fixing part 1713, and the buffering part 1712 is connected with the support base 1711 and the first fixing part 1713 respectively.

[0069] The buffering part 1712 can be connected with the support base 1711 and the first fixing part 1713 respectively by means of adhesion. The support base 1711 and the first fixing part 1713 can also be placed apart in a mold during preparation, and then a buffering material is injected into the gap between the support base 1711 and the first fixing part 1713 to form the shock-absorbing seat 171, wherein the buffering material forms the buffering part 1712. The support base 1711 and the first fixing part 1713 can include hard materials such as metal materials, and the buffering part 1712 can include rubber materials, high polymer composite materials, etc.

[0070] In this way, when the support plate 160 is subjected to impact, vibration or other loads, the impact, vibration or other loads need to be transmitted to the circuit board 120 through the buffer portion 1712 of the shock-absorbing seat 171, so as to reduce the impact, vibration or other loads on the circuit board 120. In addition, since the first fixing portion 1713 is connected with the connecting structure 150 and abuts on the circuit board 120, the loads on the support plate 160 can be transmitted to the circuit board 120 through the buffer portion 1712 of the shock-absorbing seat 171, so as to reduce the impact of the loads on the circuit board 120.

[0071] The first fixing portion 1713 can include a flange nut, and the connecting structure 150 is connected with the flange nut. It can be understood that the connecting structure 150 can include a bolt 151, and the bolt 151 is threadedly connected with the flange nut. In this way, please refer to FIG. 5, after the connecting structure 150 passes through the heat sink 130 and the circuit board 120, the connecting structure 150 can be connected with the support plate 160 through the threaded connection with the flange nut.

[0072] Please continue to refer to FIGS. 6-8, the buffer portion 1712 includes a first through hole, the support base 1711 includes a second through hole, and the threaded hole of the flange nut, the first through hole and the second through hole are communicated. At the same time, the hole diameter of the first through hole and the hole diameter of the second through hole are both greater than the large diameter of the threaded hole. In this way, when the connecting structure 150 is connected with the threaded hole of the flange nut, the first through hole and the second through hole provide more mounting space for the connecting structure 150, and even if the connecting structure 150 penetrates through the flange nut, the connecting structure 150 will not interfere with other components, so as to facilitate installation.

[0073] In addition, the support base 1711 can include a clamping portion, which can be a flange extending in the radial direction. At the same time, a stepped hole can also be provided on the support plate 160, and the small hole of the stepped hole is closer to the circuit board 120. Therefore, the support base 1711 can be connected with the stepped hole on the support plate 160 through the clamping portion.

[0074] Please refer to FIG. 9, which is another possible enlarged view of the region P in FIG. 5. In order to facilitate the connection between the connecting structure 150 and the support plate 160, a second fixing portion 161 can be provided on the support plate 160. Exemplarily, the second fixing portion 161 can be a nut provided on the support plate 160, and the nut is fixedly provided on the support plate 160, for example, the nut is welded on the support plate 160. It can be understood that the second fixing portion 161 can also be formed integrally with the support plate 160.

[0075] After the second fixing part 161 is connected with the connecting structure 150, there is a space between the second fixing part 161 and the circuit board 120 in a direction perpendicular to the support plate. That is, the second fixing part 161 does not contact the circuit board 120, but there is a gap. At this time, the first buffering structure 170 can be arranged around the second fixing part 161. In this way, the circuit board 120 is pressed towards the support plate 160 by the connecting structure 150, and the first buffering structure 170 surrounds the second fixing part 161 (and also surrounds the connecting structure 150), so the first buffering structure 170 can uniformly apply a force to the circuit board 120 to balance the force applied to the circuit board 120 by the connecting structure 150, and reduce the deformation of the circuit board 120 caused by being supported by the first buffering structure 170.

[0076] Please continue to refer to FIG. 9, and also refer to FIGS. 10-12, wherein FIG. 10 is a perspective view of an impact-reducing ring 172 according to an embodiment of the present application, and FIGS. 11 and 12 are sectional views of the impact-reducing ring 172 along line B1-B2 in FIG. 10. The first buffering structure 170 can include the impact-reducing ring 172, and the impact-reducing ring 172 is provided with a plurality of openings 1721. The depth of the openings 1721 extends in a radial direction of the impact-reducing ring 172, and the length of the openings 1721 extends in a circumferential direction of the impact-reducing ring 172. The annular shape of the impact-reducing ring 172 can be circular, oval, square, etc. The number of the openings 1721 can be multiple, and at least two openings 1721 can be arranged at intervals in the circumferential direction of the impact-reducing ring 172. The shape of the openings 1721 can be circular, oval, square, etc. Exemplarily, the impact-reducing ring 172 can include a side wall, the side wall forms a tube type and extends between the circuit board 120 and the support plate 160, and the side wall of the tube type is provided with a plurality of openings 1721 penetrating the side wall.

[0077] In this way, the part between the two openings 1721 arranged at intervals in the circumferential direction of the impact-reducing ring 172 and the part above the two openings 1721 can form a cantilever beam structure (as shown in the part in the dashed line frame in FIG. 11), and the deformation of the cantilever beam can absorb part of the impact, vibration, etc. load received by the support plate 160. The openings 1721 form a section in the transmission path of the impact, and the section can reflect the impact, vibration, etc. load, wherein the arrows in FIG. 11 represent the reflection of the section formed by the openings 1721 to the impact, vibration, etc. load. Therefore, the impact-reducing ring 172 can reduce the impact, vibration, etc. load received by the circuit board 120 from the support plate 160.

[0078] Please continue to refer to FIG. 10 and combine with FIG. 9, the plurality of openings 1721 are arranged in multiple circles. Each circle of openings 1721 can be parallel to the circuit board 120 or the support plate 160. Each circle of openings 1721 includes at least two openings 1721 arranged in a spaced manner along the circumferential direction of the impact-attenuating ring 172. The multiple circles of openings 1721 are arranged in the direction of the central axis R of the impact-attenuating ring 172, and adjacent two circles of openings 1721 are arranged in a staggered manner in the circumferential direction of the impact-attenuating ring 172. It can be understood that the circumferential direction is the direction around the central axis R. In this way, multiple sections can be formed in the transmission path of the impact and vibration, and the impact and vibration can only be transmitted through the part between adjacent sections of the impact-attenuating ring 172, thereby prolonging the transmission path of the impact and vibration and further reducing the impact, vibration and other loads on the circuit board 120 from the support plate 160.

[0079] Exemplarily, please continue to refer to FIG. 11 and FIG. 12 and combine with FIG. 10, the openings 1721 of adjacent circles can be arranged in a staggered manner in the extension direction of the central axis R. For example, the openings 1721 can include a first opening 1721a and a second opening 1721b, and the first opening 1721a and the second opening 1721b are openings 1721 in adjacent two circles. The ends of the first opening 1721a and the second opening 1721b close to each other overlap in the direction of the central axis of the impact-attenuating ring. That is, the two openings 1721 respectively located in adjacent two circles of openings 1721 and adjacent in the circumferential direction of the impact-attenuating ring 172 are respectively the first opening 1721a and the second opening 1721b, and the ends of the first opening 1721a and the second opening 1721b close to each other overlap in the direction of the central axis R of the impact-attenuating ring 172.

[0080] Please refer to FIG. 13, which is another possible enlarged view of region P in FIG. 5. The first buffer structure 170 includes a laminated structure 173 clamped between the circuit board 120 and the support plate 160. The laminated structure 173 can include a plurality of annular gaskets 1731 arranged in a stacked manner, and the wave impedance of at least two gaskets 1731 is different.

[0081] Please refer to FIG. 14, which is a schematic diagram of the transmission of stress waves in two gaskets 1731 arranged in a stacked manner. When the incident stress wave is transmitted through the first gasket 1731 to the interface between the first gasket 1731 and the second gasket 1731, a part of the reflected stress wave is generated. The reflected stress wave will cancel a part of the incident stress wave, so that the transmitted stress wave will be smaller than the incident stress wave. The greater the difference in wave impedance between the two gaskets 1731, the smaller the ratio of the transmitted stress wave to the incident stress wave, that is, the smaller the impact, vibration and other loads passing through the two gaskets 1731.

[0082] Specifically, in the two pads 1731 arranged in a stack, the stress wave is transmitted from the first pad 1731 to the second pad 1731, and the reflected stress wave can be equal to the incident stress wave multiplied by a reflection coefficient F, where the reflection coefficient can be calculated according to Formula 1.

[0083] where p1 is the density of the first pad 1731, c1 is the propagation speed of the stress wave in the first pad 1731; p2 is the density of the second pad 1731, and c2 is the propagation speed of the stress wave in the second pad 1731.

[0084] At the same time, the reflected stress wave can be equal to the incident stress wave multiplied by a transmission coefficient T, where the transmission coefficient T is equal to 1 minus the reflection coefficient, so the transmission coefficient can be calculated by Formula 2.

[0085] As can be seen, in the case where the wave impedance of the first pad 1731 is greater than the wave impedance of the second pad 1731, the transmission coefficient is less than 1, and the stress wave will attenuate when propagating through the stacked structure 173. Therefore, the stress wave will decrease, that is, the impact, vibration and other loads transmitted to the circuit board through the support plate 160 will decrease.

[0086] It can be understood that the wave impedance of the plurality of pads 1731 of the stacked structure 173 can be related to the transmission direction of the impact, vibration and other loads that need to be buffered. For example, in the case where the impact, vibration and other loads that need to be buffered are transmitted from the support plate 160 to the circuit board 120, the wave impedance closer to the circuit board 120 can be smaller. At this time, the transmission coefficient T is less than 1, that is, the impact, vibration and other loads transmitted from the support plate 160 to the circuit board 120 will decrease, thereby playing a buffering role. In the case where the impact, vibration and other loads that need to be buffered are transmitted from the circuit board 120 to the support plate 160, the wave impedance closer to the support plate 160 can be smaller. In the case where the number of pads 1731 is greater than or equal to 3, in one pair of adjacent two pads 1731, the wave impedance of the pad 1731 closer to the circuit board 120 can be smaller; in another pair of adjacent two pads 1731, the wave impedance of the pad 1731 closer to the circuit board 120 can be larger. Thus, the impact, vibration and other loads in different transmission directions are buffered.

[0087] In some embodiments, please refer to FIG. 15, which is a structural schematic diagram of another circuit board assembly 100 provided by an embodiment of the present application. The first buffering structure 170 can include a buffering pad 174, and the buffering pad 174 includes a non-Newtonian fluid characteristic material. The non-Newtonian fluid characteristic material is a fluid material that does not satisfy the Newtonian viscosity experimental law, and the stress and strain thereof are not in a linear relationship. The non-Newtonian fluid characteristic material can include P4U material, D3O material, etc.

[0088] Please refer to FIG. 16, which is a stress-strain curve of the non-Newtonian fluid material according to an embodiment of the present application. Different curves in FIG. 16 represent the strain of the non-Newtonian fluid material and the pressure reaction force (stress) generated by the non-Newtonian fluid material when the non-Newtonian fluid material corresponds to different strain rates. It can be understood that the pressure reaction force per unit area is proportional to the pressure, so the size of the pressure reaction force is represented by the size of the pressure in FIG. 16. The change rule of the strain and the pressure reaction force of the non-Newtonian fluid material at different strain rates is similar. When the non-Newtonian fluid material is compressed at the same speed, as the strain of the non-Newtonian fluid material gradually increases, the non-Newtonian fluid material can be in three different state intervals, i.e., an elasticity region, a plateau region, and a densification region. In the plateau region, the pressure reaction force generated by the non-Newtonian fluid material in the process of the strain of the non-Newtonian fluid material is almost constant; the greater the strain of the non-Newtonian fluid material in the plateau region, the greater the pressure reaction force generated by the non-Newtonian fluid material.

[0089] According to the characteristics of the non-Newtonian fluid material, when the cushion 174 is installed between the support plate 160 and the circuit board 120, the cushion 174 can be pre-compressed so that the cushion 174 is in the plateau region; in a static state, the force of the cushion 174 on the support plate 160 and the circuit board 120 can be very small, thereby reducing the influence of the system stress on the circuit board assembly, weakening the influence of the load of the heat sink 130 acting on the heat-conductive layer 140 and the chip package structure 110 on the working characteristics of the chip in the chip package structure 110. When the support plate 160 is impacted, the cushion 174 can quickly become hard to absorb energy, thereby reducing the transmission of impact, vibration, and other loads. When the strain of the cushion 174 continues to increase, the cushion 174 can work in the densification region and also play a buffering role. Therefore, the cushion 174 can not only adapt to a static scenario, but also adapt to a scenario including dynamic impact, vibration, and other loads.

[0090] Exemplarily, the orthographic projection of the chip package structure 110 on the cushion 174 is located in the range of the cushion 174. The range of the cushion 174 refers to the area surrounded by the edges of the cushion 174. The shape of the cushion 174 can be polygonal, such as rectangular, square, etc. At this time, the area of the cushion 174 can be greater than or equal to the area of the chip package structure 110, and in the direction perpendicular to the circuit board 120, the chip package structure 110 is located inside the cushion 174 and overlaps with the cushion 174. The cushion 174 can also be annular, such as a ring-shaped shape of a rectangle, a square, a circle, etc. At this time, the orthographic projection of the chip package structure 110 on the cushion 174 can be located inside the annular (cushion 174).

[0091] At this time, when the support plate 160 is subjected to impact, vibration or other load, the cushion pad 174 can be quickly hardened, thereby playing a good supporting role on the circuit board 120 on which the chip packaging structure 110 is arranged, preventing the dynamic inertial load of the structures arranged on the circuit board 120 such as the heat sink 130 and the chip packaging structure 110 from causing the circuit board 120 to bend and deform, and avoiding affecting the connection between the chip packaging structure 110 and the circuit board 120.

[0092] Exemplarily, the circuit board assembly 100 can further include a lower supporting plate 180. The lower supporting plate 180 can be arranged between the circuit board 120 and the cushion pad 174. That is, the cushion pad 174 does not directly contact the circuit board 120, but supports the circuit board 120 through the lower supporting plate 180, that is, the two opposite surfaces of the cushion pad 174 in the direction perpendicular to the support plate 160 are in contact with the support plate 160 and the lower supporting plate 180, respectively. In this way, the lower supporting plate 180 can make the stress on the circuit board 120 uniform. The lower supporting plate 180 can be made of a hard material, such as a metal material.

[0093] In this case, in order to ensure the fastening of the lower supporting plate 180, the connecting structure 150 can also include a first connecting member 153 and a second connecting member 154.

[0094] The first connecting member 153 can pass through the heat sink 130 and the circuit board 120 and be connected with the lower supporting plate 180. Similarly, the first connecting member 153 can also include a bolt 151 and an elastic element 152. For example, the heat sink 130 and the circuit board 120 are provided with through holes, and the bolt 151 passes through the through holes of the heat sink 130 and the through holes of the circuit board 120 in sequence and is connected with the lower supporting plate 180. The bolt 151 can also include a flange, which can press the circuit board 120 tightly on the lower supporting plate 180 when the bolt 151 is connected with the lower supporting plate 180.

[0095] The second connecting member 154 can be arranged at the periphery of the lower supporting plate 180 and pass through the circuit board 120 to be connected with the support plate 160. Since the second connecting member 154 can be arranged at the periphery of the lower supporting plate 180, the second connecting member 154 can not pass through the lower supporting plate 180. In this way, by connecting the first connecting member 153 through the heat sink 130 and the circuit board 120 with the lower supporting plate 180 and connecting the second connecting member 154 through the circuit board 120 with the support plate 160, the connecting structure 150 is also connected through the heat sink 130 and the circuit board 120 with the support plate 160, and the lower supporting plate 180 and the circuit board 120 are connected together, thereby improving the stability of the installation of the lower supporting plate 180.

[0096] It can be understood that the first cushion structure 170 can also simultaneously include one of the shock-absorbing seat 171, the impact-absorbing ring 172 and the laminated structure 173 and the cushion pad 174, which will not be described herein again.

[0097] In some embodiments, referring to FIG. 17, the circuit board assembly 100 can further include a second cushion structure 190, which includes a non-Newtonian fluid characteristic material. The second cushion structure 190 can be disposed between the circuit board 120 and the heat sink 130 and support the heat sink 130. As previously described, the second cushion structure 190 supporting the heat sink 130 can be achieved by pre-compressing the non-Newtonian fluid characteristic material forming the second cushion structure 190 and placing the non-Newtonian fluid characteristic material of the second cushion structure 190 in the flat region.

[0098] At this time, the second cushion structure 190 can generate a counter force to the heat sink 130. In a static state, the force of the second cushion structure 190 to the circuit board 120 and the heat sink 130 can be small, i.e., the load acting on the heat conducting layer 140 and the chip package structure 110 from the heat sink 130 has little effect on the working characteristics of the chip package structure 110. When the support plate 160 is impacted, the heat sink 130 has a large speed due to inertia and compresses the second cushion structure 190, which can quickly become hard to absorb energy, thereby reducing the impact, vibration, and other loads. When the strain of the second cushion structure 190 continues to increase, the second cushion structure 190 can work in the dense region and also play a buffering role. Therefore, the second cushion structure 190 can not only adapt to the static scenario, but also buffer the dynamic inertia load generated by the heat sink 130 in the dynamic scenario. In addition, the second cushion structure 190 can quickly become hard to absorb energy, and after the second cushion structure 190 becomes hard, the second cushion structure 190 can shunt the dynamic inertia load of the heat sink 130, reduce the dynamic impact on the heat conducting layer 140 and the chip package structure 110, and improve the application reliability of the circuit board assembly 100.

[0099] Illustratively, referring to FIG. 17, the circuit board assembly 100 further includes a bracket 122, which can be disposed on a side of the circuit board 120 close to the heat sink 130, and the second cushion structure 190 is disposed on a side of the bracket 122 away from the circuit board 120. The second cushion structure 190 is disposed on the bracket 122, and the second cushion structure 190 can still play a role in reducing the load, while reducing the size of the second cushion structure 190 in the direction perpendicular to the circuit board 120. As can be easily understood, the distance between the circuit board 120 and the heat sink 130 of different circuit board assemblies 100 is different, and therefore different thicknesses of the second cushion structure 190 are required. In the case of disposing the bracket 122, the size of the bracket 122 can be selected to adapt to the second cushion structure 190 of a specific size, thereby reducing the number of types of second cushion structures 190 required in production.

[0100] Exemplarily, the second buffering structure 190 can also be arranged on the chip packaging structure 110 and support the heat sink 130. As mentioned above, the chip packaging structure 110 can include the substrate 113, the chip 111 and the anti-deformation ring 112, the anti-deformation ring 112 and the chip 111 are arranged on the substrate 113 on the side close to the heat sink 130, and the anti-deformation ring 112 is arranged around the chip 111. At this time, the second buffering structure 190 can be arranged on the side of the anti-deformation ring 112 away from the substrate 113. In this way, the second buffering structure 190 can support the heat sink 130 on the chip packaging structure 110, and can buffer the dynamic inertia load of the heat sink 130 when the circuit board assembly 100 is impacted.

[0101] Exemplarily, the number of the second buffering structures 190 can be multiple. Each of the second buffering structures 190 can be a columnar structure, and the cross-sectional shape of the columnar structure can be circular, square, rectangular or other shapes, and the other shapes can include irregular shapes. The multiple second buffering structures 190 can be arranged at intervals around the chip 111 in the chip packaging structure 110.

[0102] Understandably, if the second buffering structure 190 is arranged on the support 122, the number of the supports 122 can also be multiple. Each of the supports 122 can also be a columnar structure, and the support 122 and the second buffering structure 190 can be arranged one by one, that is, one support 122 corresponds to support one second buffering structure 190.

[0103] Exemplarily, the second buffering structure 190 can also be a ring-shaped structure, and the ring-shaped structure is arranged around the chip 111 in the chip packaging structure 110. That is, the second buffering structure 190 is arranged to surround the chip packaging structure 110. At this time, if the second buffering structure 190 is arranged on the support 122, the support 122 can also be a ring-shaped structure, so that the support 122 completely supports the second buffering structure 190. If the second buffering structure 190 is arranged on the anti-deformation ring 112 of the chip packaging structure 110, the shape of the second buffering structure 190 can be adapted to the anti-deformation ring 112, so that the second buffering structure 190 can be completely supported by the anti-deformation ring 112.

[0104] Both of the two possible arrangement modes of the second buffering structure 190 are shown in FIG. 17, but only one of the arrangement modes can be arranged. In addition, although only the second buffering structure 190 is shown in FIG. 17, the circuit board assembly 100 can simultaneously include the first buffering structure 170 and the second buffering structure 190, which will not be described herein again.

[0105] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical scope disclosed by the present application, and all the changes or replacements should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A circuit board assembly, characterized by The circuit board assembly comprises: a circuit board; a chip package structure arranged on the circuit board; a heat sink arranged on a side of the chip package structure away from the circuit board; a support plate arranged on a side of the circuit board away from the heat sink; a connecting structure penetrating through the heat sink and the circuit board and connected with the support plate; a first buffer structure arranged between the circuit board and the support plate, and the support plate is supported by the first buffer structure.

2. The circuit board assembly of claim 1, wherein, The first buffer structure is arranged around the connecting structure, and one end of the first buffer structure is in contact with the support plate, and the other end is in contact with the circuit board.

3. The circuit board assembly of claim 2, wherein, The first buffer structure comprises a shock-absorbing seat, the shock-absorbing seat comprises a support base, a buffer part and a first fixing part, the support base is connected with the support plate, and the first fixing part is connected with the connecting structure; In a direction perpendicular to the support plate, there is a space between the support base and the first fixing part, and the buffer part is arranged between the support base and the first fixing part and connected with the support base and the first fixing part respectively.

4. The circuit board assembly of claim 3, wherein, The first fixing part comprises a flange nut, and the connecting structure is connected with the flange nut.

5. The circuit board assembly of claim 4, wherein, The buffer part comprises a first through hole, the support base comprises a second through hole, and the threaded hole of the flange nut, the first through hole and the second through hole are in communication; The hole diameter of the first through hole and the hole diameter of the second through hole are both larger than the large diameter of the threaded hole.

6. The circuit board assembly of claim 2, wherein, The support plate is provided with a second fixing part, the second fixing part is connected with the connecting structure, and there is a space between the second fixing part and the circuit board in a direction perpendicular to the support plate; The first buffer structure is arranged around the second fixing part.

7. The circuit board assembly of claim 6, wherein, The first buffer structure comprises an impact-absorbing ring, the impact-absorbing ring is provided with a plurality of openings, the depth of the opening extends along the radial direction of the impact-absorbing ring, and the length of the opening extends along the circumferential direction of the impact-absorbing ring; At least two openings are arranged at intervals along the circumferential direction of the impact-absorbing ring.

8. The circuit board assembly of claim 7, wherein, The plurality of openings are arranged in multiple circles, and each circle of openings comprises at least two openings arranged at intervals along the circumferential direction of the impact-absorbing ring; The multiple circles of openings are arranged in the direction of the central axis of the impact-absorbing ring, and adjacent two circles of openings are arranged at intervals in the circumferential direction of the impact-absorbing ring.

9. The circuit board assembly of claim 8, wherein, Respectively located in adjacent two circles of openings and adjacent in the circumferential direction of the impact-absorbing ring, the two openings are a first opening and a second opening respectively, and the end portions of the first opening and the second opening close to each other overlap in the direction of the central axis of the impact-absorbing ring.

10. The circuit board assembly of claim 6, wherein, The first buffer structure comprises a laminated structure, the laminated structure comprises a plurality of annular gaskets arranged in layers, and the wave impedance of at least two gaskets is different.

11. The circuit board assembly of claim 1, wherein, The first buffer structure comprises a buffer pad, and the buffer pad comprises a non-Newtonian fluid characteristic material.

12. The circuit board assembly of claim 11, wherein, The orthographic projection of the chip package structure on the buffer pad is located within the range of the buffer pad.

13. The circuit board assembly of claim 11 or 12, wherein, The circuit board assembly further comprises a lower supporting plate arranged between the circuit board and the buffer pad, and the opposite surfaces of the buffer pad in a direction perpendicular to the support plate are in contact with the support plate and the lower supporting plate respectively. The connecting structure comprises a first connecting member and a second connecting member; The first connecting member passes through the heat sink and the circuit board and is connected with the lower supporting plate; The second connecting member is arranged at the periphery of the lower supporting plate, passes through the circuit board and is connected with the supporting plate.

14. The circuit board assembly according to any one of claims 11-13, wherein: The supporting plate is provided with a second fixing part, the second fixing part is connected with the connecting structure; the first buffering structure further comprises a shock-absorbing ring or a laminated structure arranged around the second fixing part; or The first buffering structure further comprises a shock-absorbing seat, a first fixing part in the shock-absorbing seat is connected with the connecting structure.

15. The circuit board assembly of any one of claims 1-14, wherein, Further comprising a second buffering structure arranged between the circuit board and the heat sink and supporting the heat sink; The second buffering structure comprises a non-Newtonian fluid characteristic material.

16. The circuit board assembly of claim 15, wherein, Further comprising a support arranged at the side of the circuit board close to the heat sink; The second buffering structure is arranged at the side of the support away from the circuit board.

17. The circuit board assembly of claim 15, wherein, The chip packaging structure comprises a substrate, a chip and an anti-deformation ring, the anti-deformation ring and the chip are arranged at the side of the substrate close to the heat sink, and the anti-deformation ring is arranged around the chip; The second buffering structure is arranged at the side of the anti-deformation ring away from the substrate.

18. The circuit board assembly according to any one of claims 15-17, wherein: The number of the second buffering structures is multiple, and the multiple second buffering structures are arranged at intervals around the chip in the chip packaging structure; or The second buffering structure is a ring structure, and the ring structure is arranged around the chip in the chip packaging structure.

19. An electronic device, comprising: The circuit board assembly according to any one of claims 1-18.

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