Single integrated substrate package for high performance computing

Abstract

The present invention relates to a single integrated substrate package for high performance computing (HPC), in which a plurality of integrated circuits (ICs) such as a memory, a signal processing device, and an optical engine chip can be packaged as one chip. The single integrated substrate package is a package on which a memory chip, a logic semiconductor integrated circuit chip, and an optical engine are mounted, the single integrated substrate package comprising: an electrical-routing component for inputting and outputting an electrical signal for the package; an optical-routing component for processing input and output of an optical signal for the optical engine; a mold body surrounding the electrical-routing component and the optical-routing component; and a first redistribution layer having a wiring line for performing interconnection between mounted components, wherein the optical engine includes a photonic integrated circuit (IC) and an electronic integrated circuit (IC) molded inside the mold body.

Description

Single integrated board package for high-performance computing

[0001] The present invention relates to a single integrated board package for high-performance computing, and more specifically, to a single integrated board package for high-performance computing (HPC) in which a plurality of integrated circuits (ICs), such as memory, a signal processing device, and an optical engine chip, are mounted and integrated using a single integrated board to enable packaging into a single chip.

[0002] Semiconductor chips can not only perform the role of logic or driver ICs but also be used to manufacture photodetectors that respond to light or light-emitting devices that emit light. Optical devices containing such photodetectors and light-emitting devices are used in various fields, for example, in optical transceivers responsible for optical connections between servers, or in optical modules that transmit video data between a TV and a set-top box, or between VR (virtual reality) glasses and a graphics processing unit (GPU).

[0003] In all of the above applications, conventionally, multiple chips are mounted using PCBs (Printed Circuit Boards) with wiring patterns formed on their surfaces and interconnected via wire bonding. This is typically a Chip-on-Board (CoB) package.

[0004] In addition, instead of using the aforementioned PCB (Printed Circuit Board) package, a semiconductor packaging method based on the FOWLP (Fan Out Wafer Level Package) method, which does not use a PCB, can be used to package an optical module containing optical / electrical devices at the wafer level; this is a technology that can enhance performance by using a high-precision redistribution layer (RDL) while fabricating an ultra-thin package.

[0005] Meanwhile, Chip-on-Wafer-on-Substrate (CoWoS) technology has been proposed to more closely connect logic semiconductors, such as Graphics Processing Units (GPUs), with memory in fields such as High Performance Computing (HPC), Artificial Intelligence (AI) applications, and Machine Learning. CoWoS is a packaging technology that combines multiple HBM memories and logic semiconductors stacked vertically on a silicon-based interposer substrate.

[0006] The above CoWoS process reduces the mounting area and improves the connection speed between chips, and as a technology required for high-performance computing (HPC), it can contribute to increasing processing power and reducing power consumption.

[0007] The process of forming the above chip-on-wafer-on-substrate (CoWoS) package includes the steps of bonding a device die onto an interposer wafer, encapsulating the device die, and sawing the resulting reconstructed wafer into individual chip-on-wafer (CoW) packages.

[0008] Korean Registered Patent Publication No. 10-2459551 (Patent Document 1) discloses an integrated circuit device using an interposer.

[0009] The above COWOS package consists of a three-layer structure from top to bottom of a semiconductor integrated circuit (IC) chip, a silicon-based interposer, and a package substrate, and two or more semiconductor chips, such as memory and logic semiconductors, are interconnected on the silicon interposer substrate and then mounted on the package substrate through C4 (Controlled Collapse Chip Connection) Cu bumps.

[0010] The above COWOS package is typically mounted on a main printed circuit board (PCB) via a ball grid array (BGA) to receive signals and power. An optical engine (OE engine) having electric-optical and / or optical-electrical conversion functions is mounted on the silicon interposer substrate to enable optical communication with other devices.

[0011] The recent trend in technology is to simplify the structure of modules from three layers to two layers in order to minimize connection points for high-speed electrical signals. To this end, instead of a three-layer structure consisting of a semiconductor integrated circuit (IC) chip, a silicon-based interposer, and a package substrate, the interposer is omitted and the structure is simplified to a two-layer structure consisting of an IC chip and a package substrate. In other words, a concept is being attempted to simplify the interposer and the package substrate into a single package substrate (One Substrate).

[0012] In addition, the aforementioned silicon-based interposer and package substrate are integrated into a single package and mounted on a main printed circuit board (PCB) to form a single processing system; however, recently, a concept has been proposed to include the main printed circuit board (PCB) in a single integrated package.

[0013] Generally, when constituting a system, semiconductor integrated circuits (ICs) are mounted on a substrate while including passive components such as capacitors, inductors, and multi-layer ceramic capacitors (MLCCs) outside the IC, which are difficult to implement inside the IC.

[0014] Furthermore, while it is essential for a system to be equipped with an electric-optical and / or optical-electrical conversion module (engine) for high-speed data communication with another system, it is not easy to integrally include the optical connector used to transmit optical signals generated from such electric-optical and / or optical-electrical conversion modules (engines) to optical fibers (optical cables) or to receive optical signals from optical fibers within an integrated circuit (IC) or a single package.

[0015] The present invention was devised to solve the above-mentioned problems, and its purpose is to provide a single integrated substrate package for High-performance Computing (HPC) that integrates a silicon-based interposer and a package substrate into a single integrated substrate, and mounts and integrates multiple integrated circuits (ICs), such as various memory, logic semiconductor integrated circuit chips used for signal processing, and chips for optical engines, as well as passive components such as MLCCs (Multi Layer Ceramic Capacitors), into a single integrated substrate, thereby enabling packaging into one substrate.

[0016] Another objective of the present invention is to provide a single integrated board package for high-performance computing in which an electrical-routing part (E-Routing Part) responsible for the input and output of electrical signals and an optical-routing part (O-Routing Part) for processing the input and output of optical signals are integrally embedded within a single integrated board, thereby enabling the package size to be miniaturized and slimmed down.

[0017] Another objective of the present invention is to provide a single integrated board package for high-performance computing that minimizes the length of signal wiring between devices by minimizing the number of stacked layers during packaging, thereby enabling the implementation of short signal lines and a miniaturized and integrated structure using a wafer level packaging (WLP) process that does not use a thick film printed circuit board (PCB).

[0018] Another objective of the present invention is to provide a single integrated board package in which the optical engine can be detachably coupled when mounted on the main printed circuit board, wherein an optical engine is prepared separately from a single integrated board package excluding the optical engine, and the optical engine is prepared separately, when using an OPCB (Optical Printed Circuit Board) designed to simultaneously transmit electrical and optical signals by integrating an electrical wiring layer provided on the upper surface and a waveguide provided within the substrate into a single substrate as the main printed circuit board.

[0019] To achieve the above-mentioned purpose, a package in which a memory chip, a logic semiconductor integrated circuit chip, and an optical engine are mounted according to one embodiment of the present invention comprises: an electrical routing part (E-Routing Part) having a plurality of vertical conductive TMVs (Through Mold Via) inside and responsible for the input and output of electrical signals to said package; an optical routing part (O-Routing Part) for processing the input and output of optical signals to said optical engine provided in said package; and a mold body having a first surface and a second surface, which surrounds said electrical routing part and optical routing part with an encapsulating material to protect said electrical routing part and optical routing part. and a first rewiring layer formed on at least one of a first surface and a second surface of the mold body and having a wiring line for performing an interconnection between at least one of the memory chip, a logic semiconductor integrated circuit chip, and an optical engine and the electric-routing component and the optical-routing component; wherein the optical engine includes a photonic integrated circuit (IC) that generates or receives an optical signal and an electronic integrated circuit (IC) that drives or interfaces with the photonic integrated circuit, and the electronic integrated circuit (IC) provides a single integrated board package for high-performance computing that is molded inside the mold body.

[0020] In addition, in a single integrated substrate package for high-performance computing according to the present invention, the photonic integrated circuit is mounted on a first redistribution layer formed on a first surface of the mold body and is electrically connected to the first redistribution layer to operate in multi-mode, and may further include an optical path converter mechanism formed inside the first redistribution layer capable of converting the path of the optical signal by 90 degrees; and a waveguide formed inside the first redistribution layer in the same direction as the first redistribution layer to transmit the optical signal incident from the optical path converter mechanism in the same direction as the first redistribution layer.

[0021] Furthermore, in a single integrated substrate package for high-performance computing according to the present invention, the photonic integrated circuit may further include: a photonic path converter mechanism formed inside the optical-routing component and capable of converting the path of the optical signal by 90 degrees, wherein the photonic integrated circuit is mounted on the first redistribution layer formed on the first surface of the mold body and is electrically connected to the first redistribution layer to operate in multi-mode; and a waveguide formed inside the optical-routing component and transmitting the optical signal incident from the photonic path converter mechanism.

[0022] In a single integrated board package for high-performance computing according to the present invention, the photonic integrated circuit is mounted on a first redistribution layer formed on a first surface of the mold body and is electrically connected to the first redistribution layer to operate in multi-mode; a through hole formed vertically inside the mold body to allow an optical signal to pass through; an optical path converter mechanism capable of converting the path of the optical signal by 90 degrees; and a main printed circuit board (OPCB) having an electrical wiring layer provided on an outer surface and a waveguide provided inside the board to transmit the optical signal incident from the optical path converter mechanism, wherein the single integrated board package is mounted on one surface and the optical path converter mechanism is installed in a trench-shaped groove corresponding to the through hole.

[0023] In addition, in a single integrated substrate package for high-performance computing according to the present invention, the photonic integrated circuit is mounted on the first redistribution layer formed on the first surface of the mold body and is electrically connected to the first redistribution layer to operate in a single mode, and an optical connector having a single-mode optical fiber may be coupled to one side of the single integrated substrate package to transmit or receive an optical signal for the photonic integrated circuit.

[0024] Furthermore, in a single integrated substrate package for high-performance computing according to the present invention, the photonic integrated circuit may further include: an optical path converter mechanism formed inside the first redistribution layer and capable of converting the path of the optical signal by 90 degrees, which is disposed adjacent to the optical-routing component inside the mold body and operates in multi-mode; and a waveguide formed inside the first redistribution layer in the same direction as the first redistribution layer and transmitting the optical signal incident from the optical path converter mechanism in the same direction as the first redistribution layer.

[0025] In a single integrated substrate package for high-performance computing according to the present invention, the photonic integrated circuit is disposed adjacent to the optical-routing component inside the mold body and operates in a single mode, and may further include: an optical path converter mechanism formed inside the optical-routing component that converts the path of the optical signal incident from the photonic integrated circuit by 90 degrees and diverges it to the outside of the package; and a waveguide formed inside the optical-routing component that transmits the optical signal incident from the photonic integrated circuit to the outside of the package.

[0026] In this case, the optical-routing component may include a body made of an insulator; at least one through hole formed inside the body in one of a vertical, horizontal, and diagonal direction so as to allow input or output of an optical signal from the photonic integrated circuit (IC); and at least one waveguide for transmitting an optical signal to an optical fiber or receiving an optical signal from an optical fiber in one of the vertical, horizontal, and diagonal directions of the body.

[0027] Additionally, the optical routing component may further include a second redistribution layer connected to the first redistribution layer inside the body; and a vertical conductive TGV (Through Glass Via) connected to the second redistribution layer and formed penetrating the body in a vertical direction.

[0028] A single integrated substrate package for high-performance computing according to the present invention further comprises an optical mate that performs an optical interface by being disposed between a photonic integrated circuit (IC) of the optical engine and a fiber optic array unit (FAU) that is coupled to one side of the package and supports a fiber optic cable, wherein the optical mate may have a plurality of optical elements for changing the optical path of light output from a waveguide disposed on the upper surface of the photonic integrated circuit (IC) to an intermediate portion where the fiber optic cable of the fiber optic array unit (FAU) is located.

[0029] In addition, the optical mate may be positioned on the side of the photonic integrated circuit (IC) and molded inside the mold body.

[0030] A single integrated substrate package for high-performance computing according to the present invention further comprises: an optical mate having a first optical lens disposed on a side opposite to a waveguide disposed on the upper surface of the photonic integrated circuit (IC) to emit incident light and changing the path of the incident light to the top of the package; a first lens block having a second optical lens formed at a leading end to collect the emitted light transmitted from the optical mate and make it into parallel light; and a second lens block having a mirror surface formed of a third optical lens capable of focusing parallel light incident on a front surface opposite to the second optical lens and a 45-degree inclined surface that bends the path of the light focused by the third optical lens by 90 degrees; wherein the light reflected from the mirror surface and bent by 90 degrees can be focused into the core of an optical fiber coupled to the second lens block.

[0031] The single integrated substrate package for high-performance computing according to the present invention may further include a pair of guide pins coupled between the first and second lens blocks to guide mutual precise positioning.

[0032] A single integrated substrate package for high-performance computing according to another embodiment of the present invention is a package in which a memory chip, a logic semiconductor integrated circuit chip, and passive components are mounted internally and externally, comprising: an electrical routing part (E-Routing Part) having a plurality of vertical conductive TMVs (Through Mold Vias) internally and responsible for the input and output of electrical signals to said package; an optical routing part (O-Routing Part) for processing the input and output of optical signals to said optical engine provided in said package; a mold body having a first surface and a second surface, which surrounds said electrical routing part and optical routing part with an encapsulating material to protect said electrical routing part and optical routing part; and a first redistribution layer formed on at least one of the first surface and the second surface of said mold body and having a wiring line for performing an interconnection between at least one of said memory chip, logic semiconductor integrated circuit chip, and optical engine and said electrical routing part and optical routing part; comprising a first package; An optical engine packaged in the form of an Optical System-In-Package, wherein a photonic integrated circuit (IC) for generating or receiving an optical signal and an electronic integrated circuit (IC) for driving or interfacing the photonic integrated circuit are provided inside a mold body, and a second rewiring layer is formed outside the mold body, having wiring lines for interconnecting the photonic integrated circuit and the electronic integrated circuit (IC); an optical mate mounted on the lower surface of the optical engine and having an optical lens for controlling the path of light emitted from the light input / output portion of an optical element provided in the photonic integrated circuit (IC); and a main printed circuit board comprising an OPCB on which the first package is mounted on one side, having a through hole at a position where incident light incident through the optical lens is introduced, an electrical wiring layer provided on the outer surface, and a waveguide provided inside the substrate for transmitting the incident optical signal.A lens block having an optical member having a tip portion coupled to the through hole and having an optical member that bends the path of light by 90 degrees and focuses it into the waveguide when incident light entering through the optical lens is introduced; and a socket pin array mounted on the upper surface of the main printed circuit board and electrically connected to an optical engine pad provided in the second redistribution layer of the optical engine; wherein the optical engine is detachably coupled to the main printed circuit board.

[0033] A single integrated substrate package for high-performance computing according to another embodiment of the present invention may further include a mating structure formed on the lower part of the optical mate (O-mate) to provide a self-aligning effect that automatically aligns the optical axis when assembling the optical mate (O-mate) and the lens block.

[0034] As described above, in the present invention, a silicon-based interposer and a package substrate are integrated into a single integrated substrate, and multiple integrated circuits (ICs), such as various memory, logic semiconductor integrated circuit chips used for signal processing, and chips for optical engines, as well as passive components such as MLCCs (Multi Layer Ceramic Capacitors), are mounted and integrated using a single integrated substrate to enable packaging into a single chip.

[0035] In addition, the present invention provides a single integrated board package for high-performance computing in which an electrical-routing part (E-Routing Part) responsible for the input and output of electrical signals and an optical-routing part (O-Routing Part) for processing the input and output of optical signals are integrally embedded within a single integrated board, thereby enabling the package size to be miniaturized and slimmed down.

[0036] As a result, in the present invention, by packaging all of the above-mentioned electric-routing parts (E-Routing Part), optical-routing parts (O-Routing Part), passive components such as MLCCs and heat dissipation parts into a single integrated substrate package structure, the length of signal wiring between the components is minimized, thereby enabling the implementation of short signal lines and a miniaturized and integrated structure using a wafer-level packaging process.

[0037] When using an OPCB (Optical Printed Circuit Board) as the main printed circuit board, there are issues regarding fine alignment errors between the optical engine and the waveguides on the OPCB; if a defect occurs in a part of the optical engine after assembly is complete, it is difficult to replace the corresponding component individually, necessitating the disposal of the entire system; and since optical components have greater thermal limits and reliability degradation than general electronic components, a structure is required that allows for simple replacement when specific components experience performance degradation or damage during long-term use.

[0038] In consideration of the above-mentioned problems, the present invention provides a single integrated substrate package in which a separately manufactured optical engine is detachably coupled to a main printed circuit board, instead of including the optical engine in the single integrated substrate package to integrate it into a single package.

[0039] In this case, the present invention allows for the precise assembly of the optical engine on the main printed circuit board by combining an electrical connection structure using a socket pin array and an optical alignment structure including an optical mate (O-mate) and a lens block between the optical engine and the main printed circuit board.

[0040] FIG. 1 is a wafer showing a single integrated substrate package for high-performance computing according to one embodiment of the present invention, packaged at the wafer level.

[0041] FIG. 2 is a plan view showing a single integrated substrate package for high-performance computing according to a first embodiment of the present invention.

[0042] FIGS. 3a and FIGS. 3b are longitudinal cross-sectional views of a single integrated substrate package for high-performance computing according to a first embodiment of the present invention, each equipped with a PIC external optical engine.

[0043] FIG. 4 is a schematic cross-sectional view illustrating the configuration of an optical engine (OE engine) provided in a single integrated substrate package for high-performance computing as illustrated in FIG. 3b.

[0044] FIG. 5 is a cross-sectional view showing a specific example of an optical routing component used in combination with an optical engine (OE engine) according to the present invention.

[0045] FIG. 6 is a cross-sectional view showing a structure in which a single integrated board package for high-performance computing according to the first embodiment of the present invention is mounted on a main printed circuit board (PCB).

[0046] FIG. 7 is a cross-sectional view showing a single integrated board package for high-performance computing having an external connection terminal in the form of a conductive strip according to a first embodiment of the present invention.

[0047] FIGS. 8a to 8d are cross-sectional views showing preferred embodiments of the “X” portion (PIC and optical-routing component) illustrated in FIG. 3b, each equipped with an external PIC optical engine.

[0048] FIG. 9 is a longitudinal cross-sectional view of a single integrated substrate package for high-performance computing according to a second embodiment of the present invention equipped with a PIC-embedded optical engine.

[0049] FIGS. 10a to 10c are cross-sectional views showing preferred embodiments of the “Y” portion (PIC and optical-routing component) illustrated in FIG. 9, each equipped with a PIC-embedded optical engine.

[0050] FIGS. 11 and FIGS. 12 are longitudinal cross-sectional views of a single integrated substrate package for high-performance computing according to a third embodiment of the present invention, in which an optical mate (O-mate) is combined with a PIC embedded optical engine.

[0051] FIG. 13 is a longitudinal cross-sectional view of a single integrated board package for high-performance computing according to the fourth embodiment of the present invention, which uses an OPCB as the main printed circuit board (PCB) and is equipped with a detachable optical engine.

[0052] Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings. In this process, the size or shape of the components shown in the drawings may be exaggerated for clarity and convenience of explanation.

[0053] In the present invention, when packaging a plurality of semiconductor integrated circuits (ICs) in a stacked structure, the length of signal wiring between the devices is minimized to achieve short signal lines and miniaturization, and the integrated structure can be implemented using a wafer-level packaging method.

[0054] FIG. 1 attached is a wafer showing a single integrated substrate package for high-performance computing according to one embodiment of the present invention packaged at the wafer level, FIG. 2 is a plan view showing a single integrated substrate package for high-performance computing according to a first embodiment of the present invention, and FIG. 3a and FIG. 3b are longitudinal cross-sectional views of a single integrated substrate package for high-performance computing according to a first embodiment of the present invention equipped with a PIC external optical engine.

[0055] A single integrated substrate package for high-performance computing (HPC) according to a first embodiment of the present invention will be described below with reference to FIGS. 1 to 3b.

[0056] A single integrated substrate package (100) for high-performance computing (HPC) according to the first embodiment of the present invention can be packaged as a single integrated substrate at the wafer level or panel level, as shown in FIG. 1.

[0057] In the following description, the single integrated substrate package (100) is packaged using Fan Out Wafer Level Package (FOWLP) without using a separate thick film printed circuit board (PCB).

[0058] When the above Fan Out Wafer Level Package (FOWLP) is completed, the wafer (200) can be separated into a plurality of single integrated substrate package dies (101) through dicing.

[0059] As shown in FIGS. 2 and 3, the single integrated substrate package (100) composed of the above-mentioned single die (101) can be packaged using a flip chip package technology to integrate without wire bonding and simultaneously integrate components without using a separate printed circuit board (PCB) in a Fan Out Wafer Level Package (FOWLP) manner, thereby enabling the realization of a slim package while completely resolving height tolerances caused by wiring between components.

[0060] The above single integrated substrate package (100) is formed by attaching various chip-shaped components to be integrated inside the single integrated substrate package (100) to preset positions on the molding tape using a wafer-shaped molding tape having an adhesive layer (or release tape) formed on one side of the molding frame via a flip chip process, and then forming an EMC mold (70) by packaging using an encapsulating material such as an epoxy mold compound (EMC) or epoxy resin to fix the chip (die).

[0061] As a result, the adhesive layer of the molding tape may have attached, for example, a heat transfer metal piece (Heat Part) (20) for heat dissipation to be embedded inside the EMC mold (70), a passive component (30) such as a capacitor, inductor, or MLCC that is not easy to implement inside the integrated circuit (IC), an electronic IC (EIC) (140) that can be manufactured as a CMOS chip that can be embedded inside the EMC mold (70), an electrical routing part (E-Routing Part) (50) that is responsible for the input and output of electrical signals and has a plurality of vertical conductive TMVs (Through Mold Via) (51) inside, and an optical routing part (O-Routing Part) (60) required to receive an optical signal to be transmitted to the outside from the photonic IC (130) of the optical engine (OE engine) (110) or an optical signal received from the outside.

[0062] In the present invention, among the photonic IC (130) and electronic IC (EIC) (140) forming the optical engine (OE engine) (110), the electronic IC (EIC) (140) is packaged simultaneously with various chips and components when packaging them inside the EMC mold (70) using the FOWLP (Fan Out Wafer Level Package) method.

[0063] In this case, the photonic IC (130) is mounted outside the EMC mold (70) in the first embodiment, and in the second embodiment, when packaging is performed using the FOWLP (Fan Out Wafer Level Package) method, it is simultaneously packaged inside the EMC mold (70) along with other components.

[0064] After that, when the EMC molding is completed, the molding tape is removed and a first fine redistribution layer (Fine RDL; Fine Redistribution Layer) (80) is formed on the first surface (upper surface) (71) of the EMC mold (70).

[0065] In the description of the illustrated embodiment, the first fine redistribution layer (Fine RDL) (80) is exemplified as being formed on the first surface (71) of the EMC mold (70), but the present invention is not limited thereto.

[0066] The first fine redistribution layer (Fine RD) (80) can be formed on at least one of the first surface (71) and the second surface (72) of the EMC mold (70).

[0067] To form an insulating film for the first fine redistribution layer (Fine RDL) (80), various materials such as polyimide, PMMA (poly(methylmethacrylate)), benzocyclobutene (BCB), silicon oxide (SiO2), acrylic, and epoxy can be used, and a photolithography process can be used to form the wiring layer pattern.

[0068] In this case, the material of the wiring layer itself can act as a developable photoresist (PR), and the wiring layer can be etched after an additional PR coating is applied. After the insulating film is formed, a metal deposition process is performed, and the metal used in the redistribution layer can be formed from various metal materials such as Cu, Al, Au, and Ag, or alloys thereof.

[0069] The first fine redistribution layer (Fine RDL) (80) is responsible for interconnecting terminals between various integrated circuit (IC) chips mounted on its upper surface in a subsequent process, and for connecting output terminals of various components embedded inside the EMC mold (70) to circuits of various integrated circuit (IC) chips mounted outside the first fine redistribution layer (Fine RDL) (80).

[0070] On the upper part of the first micro-rewiring layer (80), for example, a multilayer structure HBM DRAM memory (200) and a base die (210), a logic semiconductor integrated circuit (IC) chip (230) such as a graphics processing unit (GPU) for performing high-speed large-capacity signal processing in fields such as high-performance computing and AI (Artificial Intelligence) applications and machine learning, a micro control unit (MCU) capable of acting as a digital signal processor (DSP), an application-specific integrated circuit (ASIC) chip (240), and a photonic IC (130) used when forming an optical engine (OE engine) (110) can be mounted using a micro bump (260).

[0071] In this case, if necessary, a dual in-line memory module may be provided on the upper part of the first fine redistribution layer (80), for example.

[0072] In the embodiment illustrated in FIG. 3b, a multilayer HBM DRAM memory (200) and a base die (210) are each manufactured separately as DRAM memory required for a logic semiconductor integrated circuit (IC) to signal process data, and are interconnected using microbumps and integrated in a 3D structure on top of the first micro-rewiring layer (80).

[0073] However, the base die (210) acting as an interposer can be integrated into a single integrated substrate package (100) used as a package substrate, so as shown in FIG. 3a, to achieve integration.

[0074] In the following description of the embodiments of the present invention, an example is provided in which a multilayer structure HBM DRAM memory (200) and a base die (210) are integrated in a 3D structure on top of the first fine redistribution layer (80). However, as shown in FIG. 3a, the present invention may apply a structure in which the base die (210) is integrated into a single integrated substrate package (100) used as a package substrate.

[0075] The above optical engine (OE engine) (110) may be composed of a photonic IC (130) and an electronic IC (EIC) (140) as described below.

[0076] The EMC mold (70) or single integrated substrate package (100) has electrical and optical connection means for data communication with an external system. The optical connection means can be connected to the outside in a vertical or horizontal direction.

[0077] On one outer side of the EMC mold (70) or single integrated board package (100), as shown in FIG. 3, a first external connection terminal (82) satisfying one of various data transmission standard specifications can be formed in the form of a conductive strip to transmit an electrical signal to the outside as an electrical connection means, and the first external connection terminal (82) can be implemented to satisfy, for example, the data transmission standard specification of a High Definition Multimedia Interface (HDMI). A first connector socket (92) can be coupled to the conductive strip.

[0078] Furthermore, the first external connection terminal (82) in the form of a conductive strip for transmitting the above electrical signal to the outside can, of course, be formed on the second surface (72) of the EMC mold (70) as shown in FIG. 7.

[0079] Referring to FIG. 2, the single integrated substrate package (100) may have a first connector socket (92) coupled to one side as an electrical connection means to the first external connection terminal (82) of the conductive strip for data communication with an external system, and an optical socket (94) coupled to the other side as an optical connection means to the photonic IC (130) of the optical engine (OE engine) (110).

[0080] Additionally, the first external connection terminal (82) may be modified in various ways according to the data transmission standard specifications, such as a conductive strip shape, and may be formed as a solder ball or a metal bump shape as shown in FIG. 3 and formed on the second surface (72) of the EMC mold (70).

[0081] In the first embodiment illustrated in FIG. 3, a first fine redistribution layer (Fine RDL) (80) is formed on the first surface (71) of the EMC mold (70), and a Ball Grid Array (BGA) (90) made of solder balls is arranged as an external connection terminal on the opposite surface, the second surface (72).

[0082] A BGA (Ball Grid Array) (90) made of solder balls formed on the second surface (72) of the EMC mold (70) can be usefully used when mounting the single integrated substrate package (100) on a main printed circuit board (PCB), for example, as in the embodiment shown in FIG. 6.

[0083] The EMC mold (70) may be formed using a plurality of vertical conductive TMVs (Through Mold Via) (51) or Cu fillers for electrical connection with a BGA (Ball Grid Array) (90) formed on a second surface (72) from a first fine redistribution layer (Fine RDL) (80), and the plurality of vertical conductive TMVs (Through Mold Via) (51) may be placed inside an electrical-routing part (E-Routing Part) (50) embedded in the EMC mold (70) to handle the input and output of electrical signals, or may be directly embedded in the EMC mold (70).

[0084] The above electric-routing part (E-Routing Part) (50) may be made of, for example, glass or silicon (Si).

[0085] Additionally, on the other side of the EMC mold (70), a configuration for transmitting an optical signal processed from a single integrated substrate package (100) to another system through an optical fiber (optic cable) may be arranged.

[0086] To this end, the single integrated substrate package (100) is equipped with an optical engine (OE engine) (110) having an electric-optical and / or optical-electrical conversion function to change an electrical signal processed within the system into an optical signal or to convert a received optical signal into an electrical signal.

[0087] In this case, an optical connector is required to transmit an optical signal from the photonic IC (130) of the optical engine (OE engine) (110) to the optical fiber (optical cable). In the present invention, when packaging the single integrated substrate package (100) using Fan Out Wafer Level Package (FOWLP), the packaging process is performed in such a way that an optical routing part (O-Routing Part) (60) is included inside the EMC mold (70) in advance.

[0088] The above optical-routing part (O-Routing Part) (60) can be implemented using a piece of glass so as to effectively handle the function of receiving an optical signal to be transmitted to the outside or an optical signal received from the outside from the photonic IC (130) of the optical engine (OE engine) (110), as shown in FIG. 5.

[0089] The optical routing component (60) has a glass body (61) embedded in the lower part of a first fine redistribution layer (Fine RDL) (80) on which a photonic IC (130) of the optical engine (OE engine) (110) is mounted. Inside the glass body (61), there is a through hole (62, 63) formed in at least one of a vertical direction, a horizontal direction, and a diagonal direction so that an optical signal can be input or output from the photonic IC (130) of the optical engine (OE engine) (110).

[0090] Additionally, the glass body (61) may include a waveguide (64) for transmitting an optical signal to an optical fiber or receiving an optical signal from an optical fiber in at least one of a vertical direction, a horizontal direction, and a diagonal direction.

[0091] In this case, an optical connector (coupling device) (not shown) to which an optical fiber (optic cable) is connected may be coupled to the through hole (62.63) or coupled to the waveguide (64).

[0092] Additionally, the optical routing part (O-Routing Part) (60) may have an optical path changing structure embedded inside the glass body (61) to change the optical path by bending it, for example, 90 degrees or any preset angle.

[0093] Furthermore, the optical-routing part (60) made of the glass piece may have a second fine redistribution layer (Fine RDL) (81) and a vertical conductive TGV (Through Glass Via) (52) inside the glass piece, as shown in FIG. 5.

[0094] In this case, the second fine redistribution layer (Fine RDL) (81) formed inside the glass piece can be implemented with a finer line width (pitch) compared to the first fine redistribution layer (Fine RDL) (80) formed on the first surface (71) of the EMC mold (70).

[0095] The first surface (71) of the EMC mold (70) on which the first fine redistribution layer (Fine RDL) (80) is formed has a higher surface roughness than the flat surface provided in the glass piece on which the second fine redistribution layer (Fine RDL) (81) is formed. Therefore, the metal wiring line provided in the second fine redistribution layer (Fine RDL) (81) can be implemented with a finer line width (pitch) than the metal wiring line (80a) of the first fine redistribution layer (Fine RDL) (80), thereby enabling high-speed optical communication.

[0096] Furthermore, at least one metal piece (20) for heat transfer required for heat dissipation of electrical / optical components (including semiconductor chips) may be embedded inside the EMC mold (70) or the single integrated substrate package (100).

[0097] Referring to FIG. 4, the EMC mold (70) or the single integrated substrate package (100) may include, for example, an optical engine (OE engine) (110) in a 3D coupling form, including a photonic IC (PIC) (130), an electronic IC (EIC) (140), and an optical signal processing device (150) for optical communication with an external system.

[0098] Among the above-mentioned optical engine (OE engine) (110), the above-mentioned photonic integrated circuit (PIC; Photonic Integrated Circuit) (130) may be a chip that additionally includes a signal processing device as a circuit or integrated circuit (IC) that provides additional functions to the light-emitting element or the light-receiving element or handles signal processing, such as a light-emitting element such as a VCSEL or a laser diode (LD; Laser Diode), a photodiode (PD; Photodiode), an avalanche photodiode (APD; Avalanche Photodiode), a CMOS image sensor (CIS), a CCD image sensor, a Time of Flight (ToF) sensor, and a light-receiving element such as a VCSEL or a laser diode (LD; Laser Diode), and a signal processing device.

[0099] In addition, the light-emitting device may be composed of a laser diode-based VCSEL, a Distributed Feedback Laser (DFB), an Electro-Absorption Modulated Laser (EML), or silicon photonics (SiPh) or thin film lithium niobate (TFLN) including a waveguide structure. When using silicon photonics (SiPh) or TFLN, the direction of light can be directed perpendicular to the chip through a grating structure or an optical direction switching structure integrated into a PIC.

[0100] Furthermore, the light-receiving element may include a photodiode based on silicon photonics (SiPh) in addition to a photodiode (PD).

[0101] Additionally, the above photonic IC (130) may include a PLC (Planar Lightwave Circuit), and is a device that performs functions such as a beam splitter, modulator, and Wavelength Division Multiplexing (WDM) by forming a waveguide on a flat plate-shaped chip.

[0102] Additionally, the electronic IC (EIC) (140) drives or interfaces with the photonic IC (130) and may include an IC that performs functions such as electrical signal processing, receiving and amplifying / converting electrical signals from the photonic IC (130), and may be composed of individual ICs and integrated ICs that perform functions such as a laser diode driver (LD Driver) IC, clock data recovery (CDR), equalizer, transimpedance amplifier (TIA), I2C communication, and digital signal processing (DSP).

[0103] The above optical signal processing device (150) may include a circuit that receives and amplifies an electrical signal from the light receiving element and / or converts it, or silicon photonics (SiPh; Si Photonics) as a device that processes the optical signal.

[0104] Moreover, the above-mentioned optical engine (OE engine) (110) can, of course, be composed solely of silicon photonics (SiPh; Si Photonics) chips.

[0105] In this case, the processing of the optical signal using the silicon photonics (SiPh) may include signal modulation, amplification, splitting, Wavelength Division Multiplexing (WDM), optical path change, and switching.

[0106] In the first embodiment described above, the photonic IC (PIC) (130) of the optical engine (110) is mounted outside the EMC mold (70) or the single integrated substrate package (100), and when manufacturing the single integrated substrate package (100) using the Fan Out Wafer Level Package (FOWLP) method, the electronic IC (EIC) (140) is molded inside the EMC mold (70) to achieve integration.

[0107] FIGS. 8a to 8d are cross-sectional views showing preferred embodiments of the “X” portion (PIC and optical-routing component) illustrated in FIG. 3b, each equipped with an external PIC optical engine.

[0108] Generally, the above photonic IC (PIC) (130) uses a multi-mode vertical-cavity surface-emitting laser (VCSEL) as a light-emitting device used for optical communication over short distances of 300m or less, and in this case, a multi-mode optical fiber with an internal core having a large diameter is used.

[0109] In addition, the above photonic IC (PIC) (130) may use, for example, an edge-type light-emitting laser diode, i.e., a high-power laser diode (LD), which emits light in a single mode on the side of the chip as a light-emitting element for long-distance optical communication of 10 km or more, and may use a single-mode optical fiber and a single-mode waveguide in which the internal core is made of a small diameter.

[0110] The PIC external optical engine (110) illustrated in FIGS. 8a to 8d shows only the remaining parts (PIC and optical-routing components), excluding the electronic IC (EIC) (140) molded inside the EMC mold (70) when manufacturing a single integrated substrate package (100) using the Fan Out Wafer Level Package (FOWLP) method.

[0111] Referring to FIG. 8a, the operation of a single integrated board package (100) equipped with a PIC external optical engine (110) operating in multi-mode is described.

[0112] The above single integrated substrate package (100) is provided with a first fine redistribution layer (Fine RDL) (80) on the upper part of the EMC mold (70), and an optical routing part (O-Routing Part) (60) may be provided inside the EMC mold (70).

[0113] A photonic IC (PIC) (130) constituting a photonic engine (110) is electrically connected to the upper portion of the first fine redistribution layer (Fine RDL) (80), and when the photonic IC (PIC) (130) operates in multi-mode using a vertical resonant surface emitting laser (VCSEL), an upper irradiation that irradiates an optical signal in an upward direction and a lower irradiation that irradiates an optical signal in a downward direction can be performed.

[0114] Additionally, the interior of the first fine redistribution layer (Fine RDL) (80) is equipped with an optical path converter mechanism (160) capable of changing the path of an optical signal by 90 degrees and a waveguide (64) that transmits an optical signal in the same direction as the first fine redistribution layer (Fine RDL) (80).

[0115] Accordingly, when the photonic IC (PIC) (130) operates in multi-mode, the upper irradiation of the optical signal can be performed using a lens block and an optical fiber, and the lower irradiation of the optical signal can be transmitted to the optical fiber of an optical connector coupled to one side of the single integrated substrate package (100) through a waveguide (64) after the path of the optical signal is converted by 90 degrees by an optical path converter mechanism (160) placed inside the first fine redistribution layer (Fine RDL) (80).

[0116] In this case, the optical path converter mechanism (160) may use a prism or optical element having a 45-degree inclined plane.

[0117] Additionally, the EMC mold (70) may be provided with at least one vertical conductive TMV (Through Mold Via) (53) inside, and may be electrically connected to the metal wiring line (80a) of the first fine redistribution layer (Fine RDL) (80).

[0118] Referring to FIG. 8b, the operation of a single integrated board package (100) equipped with a PIC external optical engine (110) operating in multi-mode is described.

[0119] The above single integrated substrate package (100) is provided with a first fine redistribution layer (Fine RDL) (80) on the upper part of the EMC mold (70), and an optical routing part (O-Routing Part) (60) may be provided inside the EMC mold (70).

[0120] A photonic IC (PIC) (130) constituting a photonic engine (110) is electrically connected to the upper portion of the first fine redistribution layer (Fine RDL) (80), and when the photonic IC (PIC) (130) operates in multi-mode using a vertical resonant surface emitting laser (VCSEL), an upper irradiation that irradiates an optical signal in an upward direction and a lower irradiation that irradiates an optical signal in a downward direction can be performed.

[0121] Additionally, the interior of the optical-routing part (60) is equipped with an optical path converter mechanism (161) capable of changing the path of an optical signal by 90 degrees and a waveguide (66) that transmits an optical signal in the same direction as the first fine redistribution layer (Fine RDL) (80).

[0122] Accordingly, when the photonic IC (PIC) (130) operates in multi-mode, the upper irradiation of the optical signal can be performed using a lens block and an optical fiber, and the lower irradiation of the optical signal can be transmitted to the optical fiber of an optical connector coupled to one side of the single integrated substrate package (100) through a waveguide (66) after the path of the optical signal is converted by 90 degrees by an optical path converter mechanism (161) placed inside the optical-routing part (60).

[0123] In this case, the optical path converter mechanism (161) may use a prism having a 45-degree inclined plane.

[0124] With reference to FIG. 8c, the operation of a single integrated board package (100) equipped with a PIC external optical engine (110) operating in multi-mode is described.

[0125] The above single integrated substrate package (100) is provided with a first fine redistribution layer (Fine RDL) (80) on the upper part of the EMC mold (70), and an optical routing part (O-Routing Part) (60) may be provided inside the EMC mold (70).

[0126] A photonic IC (PIC) (130) constituting a photonic engine (110) is electrically connected to the upper portion of the first fine redistribution layer (Fine RDL) (80), and when the photonic IC (PIC) (130) operates in multi-mode using a vertical resonant surface emitting laser (VCSEL), an upper irradiation that irradiates an optical signal in an upward direction and a lower irradiation that irradiates an optical signal in a downward direction can be performed.

[0127] Additionally, a through hole (70a) is formed inside the EMC mold (70) so that an optical signal can pass through in a vertical direction, and a trench-shaped groove (311) is formed in the main printed circuit board (302) on which the single integrated substrate package (100) is mounted, in a portion corresponding to the through hole (70a), and the trench-shaped groove (311) is provided with an optical path converter mechanism (162) capable of converting the path of an optical signal by 90 degrees and a waveguide (66) that transmits the optical signal, whose optical path is bent by 90 degrees by the optical path converter mechanism (162), to the outside of the package.

[0128] In this case, the main printed circuit board (302) may use an OPCB (Optical Printed Circuit Board) designed to simultaneously transmit electrical signals and optical signals by integrating an electrical wiring layer provided on the upper surface and a waveguide (66) provided within the board into a single board.

[0129] Accordingly, when the photonic IC (PIC) (130) operates in multi-mode, the upper irradiation of the optical signal can be performed using a lens block and an optical fiber, and the lower irradiation of the optical signal proceeds downward through a through hole (70a) provided inside the EMC mold (70), and then the optical path is bent 90 degrees by the optical path converter mechanism (162) so that the optical signal enters the waveguide (66), and the optical signal passing through the waveguide (66) can be transmitted to the optical fiber of an optical connector coupled to one side of the single integrated substrate package (100).

[0130] While a standard printed circuit board (PCB) is limited to the transmission of current and voltage signals, the OPCB can directly transmit light through a low-loss waveguide (66) formed inside the board, thereby playing a key role in systems requiring ultra-high-speed and low-power data communication.

[0131] The above waveguide (66) is composed of a core and a cladding structure with different refractive indices and can be formed from a transparent polymer or a silica-based material. Depending on the design, multimode (MM) or single-mode (SM) transmission is possible, and it can be configured with various paths such as straight, curved, or branched paths. Although this waveguide (66) is placed independently of the electrical wiring layer, it provides a structure that can integrally transmit electrical and optical signals by playing a complementary role within the same substrate.

[0132] The above OPCB can directly process the transmission of optical signals at the substrate level, thereby significantly reducing the space occupied by conventional cable-type optical connections and enabling the integration of optical and electronic components on a single platform. This allows for the fundamental alleviation of power loss, electromagnetic interference (EMI), and interconnect bottlenecks between packages that occur during high-speed signal transmission.

[0133] In addition, optical connection using an OPCB refers to a form in which a module containing an optical engine or optical element is combined with a waveguide (66) on the OPCB and directly connected to another substrate or optical communication module. For example, an optical engine on the main printed circuit board (302) can be directly connected to an external optical transceiver or backplane interface through the OPCB. This structure minimizes electrical interfaces and can significantly reduce the overall power consumption of the system while increasing transmission efficiency and integration density.

[0134] Referring to FIG. 8d, the operation of a single integrated board package (100) equipped with a PIC external optical engine (110) operating in single mode is explained.

[0135] The above single integrated substrate package (100) is provided with a first fine redistribution layer (Fine RDL) (80) on the upper part of the EMC mold (70), and an optical routing part (O-Routing Part) (60) may be provided inside the EMC mold (70).

[0136] The above photonic IC (PIC) (130) can be used as a light-emitting device for long-distance optical communication, and can use an edge-type light-emitting laser diode, i.e., a high-power laser diode (LD), which emits light in a single mode on the side of the chip, and can use a single-mode optical fiber and a single-mode waveguide in which the internal core is made of a small diameter.

[0137] A photonic IC (PIC) (130) constituting the optical engine (110) is electrically connected to the upper part of the first fine redistribution layer (Fine RDL) (80), and the photonic IC (PIC) (130) emits light in a single mode from the lateral side of the light-emitting element chip using an edge-type light-emitting laser diode, i.e., a high-power laser diode (LD), and as a result, transmission can be made to the single-mode optical fiber of the optical connector coupled to one side of the single integrated substrate package (100).

[0138] FIG. 9 is a longitudinal cross-sectional view of a single integrated board package for high-performance computing according to a second embodiment of the present invention equipped with a PIC-embedded optical engine, and FIG. 10a to 10c are cross-sectional views showing preferred embodiments of the "Y" portion (PIC and optical-routing component) shown in FIG. 9, each equipped with a PIC-embedded optical engine.

[0139] A single integrated substrate package (101) for high-performance computing according to a second embodiment of the present invention is described with reference to FIG. 9.

[0140] The difference between the first embodiment shown in FIGS. 3a to 8d and the second embodiment shown in FIG. 9 is that the photonic IC (PIC) (130) constituting the optical engine (110) is molded inside the EMC mold (70) together with the electronic IC (EIC) (140).

[0141] In describing the second embodiment below, the same reference numerals are used for components identical to those in the first embodiment, and redundant descriptions thereof are omitted.

[0142] Referring to FIG. 10a, the operation of a single integrated substrate package (100) equipped with a PIC embedded optical engine (110) that operates in multi-mode is described.

[0143] The above single integrated substrate package (100) is provided with a first fine redistribution layer (Fine RDL) (80) on top of an EMC mold (70), and inside the EMC mold (70) may be provided a photonic IC (PIC) (130) that operates in multi-mode using a vertical resonant surface emitting laser (VCSEL) and an optical routing part (O-Routing Part) (60).

[0144] Additionally, the interior of the first fine redistribution layer (Fine RDL) (80) is equipped with an optical path converter mechanism (160) capable of changing the path of an optical signal by 90 degrees and a waveguide (64) that transmits an optical signal in the same direction as the first fine redistribution layer (Fine RDL) (80).

[0145] When the above photonic IC (PIC) (130) operates in multi-mode using a vertical resonant surface emitting laser (VCSEL), upward irradiation can be performed to irradiate an optical signal in an upward direction.

[0146] Accordingly, when the photonic IC (PIC) (130) operates in multi-mode, the upper irradiation of the optical signal is performed using a lens block and an optical fiber, or the path of the optical signal is converted by 90 degrees by an optical path converter mechanism (160) placed inside the first fine redistribution layer (Fine RDL) (80) and then transmitted to the optical fiber of an optical connector coupled to one side of the single integrated substrate package (100) through a waveguide (64).

[0147] Referring to FIG. 10b, the operation of a single integrated substrate package (100) equipped with a PIC embedded optical engine (110) that operates in multi-mode is described.

[0148] The above single integrated substrate package (100) is provided with a first fine redistribution layer (Fine RDL) (80) on top of an EMC mold (70), and inside the EMC mold (70) may be provided a photonic IC (PIC) (130) that operates in multi-mode using a vertical resonant surface emitting laser (VCSEL) and an optical routing part (O-Routing Part) (60).

[0149] When the above photonic IC (PIC) (130) operates in multi-mode using a vertical resonant surface emitting laser (VCSEL), upward irradiation can be performed to irradiate an optical signal in an upward direction.

[0150] Accordingly, when the above photonic IC (PIC) (130) operates in multi-mode, the upper illumination of the optical signal can be performed using a lens block and an optical fiber.

[0151] Referring to FIG. 10c, the operation of a single integrated substrate package (100) equipped with a PIC embedded optical engine (110) operating in single mode is described.

[0152] The above single integrated substrate package (100) is provided with a first fine redistribution layer (Fine RDL) (80) on the upper part of the EMC mold (70), and a photonic IC (PIC) (130) and an optical routing part (O-Routing Part) (60) may be provided inside the EMC mold (70).

[0153] Additionally, the interior of the optical-routing part (60) is equipped with an optical path converter mechanism (161) capable of changing the path of an optical signal by 90 degrees and a waveguide (66) that transmits an optical signal in the same direction as the first fine redistribution layer (Fine RDL) (80).

[0154] The above photonic IC (PIC) (130) can be used as a light-emitting device for long-distance optical communication, and can use an edge-type light-emitting laser diode, i.e., a high-power laser diode (LD), which emits light in a single mode on the side of the chip, and can use a single-mode optical fiber and a single-mode waveguide in which the internal core is made of a small diameter.

[0155] Accordingly, when the photonic IC (PIC) (130) emits light in single mode from the lateral side of the light-emitting element chip using an edge-type light-emitting laser diode, i.e., a high-power laser diode (LD), the optical signal may be directed upward by changing the path of the optical signal by 90 degrees by an optical path converter mechanism (161) placed inside the optical-routing part (60), or transmitted to the optical fiber of an optical connector coupled to one side of the single integrated substrate package (100) through a waveguide (66).

[0156] FIGS. 11 and FIGS. 12 are longitudinal cross-sectional views of a single integrated substrate package for high-performance computing according to a third embodiment of the present invention, in which an optical mate (O-mate) is combined with a PIC embedded optical engine.

[0157] Referring to FIG. 11, the operation of a single integrated board package for high-performance computing according to the third embodiment of the present invention, in which an optical mate (O-mate) is combined with a PIC embedded optical engine, is described.

[0158] In a single integrated substrate package for high-performance computing according to the third embodiment of the present invention, when manufacturing a single integrated substrate package (100) using a Fan Out Wafer Level Package (FOWLP) method, an electronic IC (EIC) (140) and a photonic IC (PIC) (130) constituting a PIC-embedded optical engine (110) are molded inside an EMC mold (70) to achieve integration.

[0159] The single integrated substrate package (100) requires an optical mate (O-mate) (170) for an optical interface between the optical engine (110) and the fiber array unit (FAU) (194). The fiber array unit (194) supports at least one optical fiber (190).

[0160] In this case, the optical mate (O-mate) (170) is required to have at least one of the following two functions.

[0161] First, an optical structure capable of optically connecting an input optical port and an output optical port and changing optical characteristics. The optical characteristics of the optical structure include, for example, changing the optical path, collimation, focusing, mirroring, changing the pitch between optical ports, changing the position of optical ports, changing alignment tolerance, changing the MFD (Mode Field Diameter), etc.

[0162] Second, the ability to easily connect to an external optical fiber (190) or fiber array unit (FAU) (194) through a precise guide structure and a fiducial marker.

[0163] In the third embodiment of the present invention illustrated in FIG. 11, when manufacturing a single integrated substrate package (100) using the optical mate (O-mate) (170) in a fan-out wafer level package (FOWLP) manner, the optical mate can be molded inside an EMC mold (70) together with an electronic IC (EIC) (140) and a photonic IC (PIC) (130) constituting the optical engine (110) to be integrated, or assembled into a package in a separated state for use.

[0164] In this case, a heat-dissipating heat transfer metal piece (21, 22) is laminated on the lower part of each of the electronic IC (EIC) (140) and photonic IC (PIC) (130) to dissipate heat generated from the electronic IC (EIC) (140) and photonic IC (PIC) (130) to the outside.

[0165] In the third embodiment of the present invention illustrated in FIG. 11, the optical mate (O-mate) (170) may be positioned on the side of the photonic IC (PIC) (130).

[0166] In this case, the photonic IC (PIC) (130) has a waveguide formed on its upper surface, and the fiber array unit (FAU) (194) has an optical fiber (190) supported in the middle section.

[0167] Accordingly, the optical mate (O-mate) (170) has a plurality of optical elements for changing the optical path of light output from a waveguide placed on the upper surface of the photonic IC (PIC) (130) to an intermediate part where the optical fiber (190) of the fiber array unit (FAU) (194) is located.

[0168] The above optical mate (O-mate) (170) is equipped with a glass body (170a) as an optical element, first to third concave mirrors (171-173) and a mirror (174) formed of a 45-degree inclined surface.

[0169] The first concave mirror (171) is formed with a curved surface in the part facing the waveguide to bend the path of the incident light by 90 degrees and guide it to focus on the second concave mirror (172).

[0170] The second concave mirror (172), the mirror (174) formed with a 45-degree inclined surface, and the third concave mirror (173) form optical elements that bend the path of incident light by 90 degrees by forming first to third grooves (170b-170d) in the glass body (170a).

[0171] The first to third concave mirrors (171-173) and the mirror (174) formed by a 45-degree inclined surface can bend the path of incident light through total reflection due to the difference in refractive index. The first to third concave mirrors (171-173) and the mirror (174) may have a metal coating added to the mirror surface to further increase reflectivity.

[0172] In the third embodiment of the present invention, light emitted from the photonic IC (PIC) (130) is reflected through a plurality of mirrors in the form of concave mirrors provided in the optical mate (O-mate) (170) and focused on the core (192) of the optical fiber (190).

[0173] The optical fiber (190) can be attached to the side of the package (100) using a FAU (194) that includes it. At this time, the end of the optical fiber (190) is aligned with the point where the light is focused. To do this, the side of the optical mate (O-mate) (170) can be diced or the side of the package can be polished so that the side of the optical mate (O-mate) is exposed.

[0174] In the third embodiment of the present invention, in which an optical mate (O-mate) is combined with a PIC-embedded optical engine as shown in FIG. 12, the optical mate (O-mate) (180) is positioned on the side of the photonic IC (PIC) (130).

[0175] In this case, the passivation and metal layers of the first fine redistribution layer (Fine RDL) (80) at the top of the package can be optionally etched out so as not to obstruct the optical path.

[0176] Additionally, the photonic IC (PIC) (130) has a waveguide formed on its upper surface, and the optical fiber (190) is coupled to the second lens block (184) located at the top of a pair of first and second lens blocks (182, 184) installed on the upper surface of the optical mate (O-mate) (180).

[0177] Accordingly, the optical mate (O-mate) (180) serves to change the path of incident light, which is output from a waveguide placed on the upper surface of the photonic IC (PIC) (130) and incident thereon, to the top of the package. To this end, a first optical lens (180a) is formed on the side opposite the waveguide to emit incident light.

[0178] Among the first and second lens blocks (182, 184), a second optical lens (182a) is formed at the leading edge of the first lens block (182) to collect divergent light transmitted from the optical mate (O-mate) (180) and make it into parallel light, and the second lens block (184) facing the second optical lens (182a) includes a third optical lens (184a) capable of focusing incident parallel light and a mirror surface (184b) formed of a 45-degree inclined surface that bends the path of the light focused by the third optical lens (184a) back by 90 degrees.

[0179] As a result, light emitted from the photonic IC (PIC) (130) is output from a waveguide and incident light is emitted by the first optical lens (180a) of the optical mate (O-mate) (180), and then passes through the second optical lens (182a), the third optical lens (184a), and the mirror surface (184b) of the first and second lens blocks (182, 184) and can be inserted into the core (92) of the optical fiber (190) coupled to the second lens block (184).

[0180] In addition, the first and second lens blocks (182, 184) can be joined using a pair of guide pins (186) to enable precise mutual positioning.

[0181] Furthermore, the first lens block (182) can be aligned to a precise position through a fiducial mark (180b) present in the optical mate (O-mate) (180).

[0182] At this time, the first lens block (182) can be aligned at the wafer level, and this alignment / bonding process can be implemented through a standard high-precision die bonder.

[0183] After assembling the first lens block (182) to the upper surface of the optical mate (O-mate) (180) using a fiducial mark (180b), the second lens block (184) can be manually detached using a pair of guide pins (186).

[0184] In this case, since the beam diameter is enlarged through a lens in the present invention, it is possible to efficiently create a structure that allows for easy attachment and detachment while minimizing optical coupling loss.

[0185] FIG. 13 is a longitudinal cross-sectional view of a single integrated board package for high-performance computing according to the fourth embodiment of the present invention, which uses an OPCB as the main printed circuit board (PCB) and is equipped with a detachable optical engine.

[0186] With reference to FIG. 13, the operation of a single integrated substrate package for high-performance computing according to the fourth embodiment of the present invention, equipped with a detachable optical engine, will be explained.

[0187] In the single integrated substrate package (102) for high-performance computing according to the fourth embodiment of the present invention, when manufacturing the single integrated substrate package (100) using a Fan Out Wafer Level Package (FOWLP) method, the electronic IC (EIC) (140) and photonic IC (PIC) (130) constituting the optical engine (110) are not molded inside the EMC mold (70), and the optical engine (110) is packaged in the form of an Optical System In Package (O-SIP) using a separate Fan Out Wafer Level Package (FOWLP) method.

[0188] In the single integrated substrate package (102) for high-performance computing according to the fourth embodiment of the present invention, the packaging of various components by molding them inside an EMC mold (70) using a fan-out wafer level packaging (FOWLP) method, excluding the optical engine (110), is the same as in the first embodiment; therefore, when describing the fourth embodiment, the same reference numerals are used for components identical to those in the first embodiment, and redundant descriptions thereof are omitted.

[0189] In the fourth embodiment of the present invention, an OPCB (Optical Printed Circuit Board) is used, which is designed to simultaneously transmit electrical signals and optical signals by integrating an electrical wiring layer provided on the upper surface of the main printed circuit board (302) and a waveguide (68) provided within the board into a single board.

[0190] The above optical engine (110) is packaged in the form of an optical system-in-package (O-SIP) by molding an electronic IC (EIC) (140) and a photonic IC (PIC) (130) inside an EMC mold (70b) using a separate fan-out wafer level packaging (FOWLP) method.

[0191] After that, the optical engine (110) formed in the form of the optical system-in-package (O-SIP) has a third redistribution layer (RDL) (83) formed on its lower surface to implement electrical connections between each element, and has conductive wiring (83a) inside the third redistribution layer (RDL) (83).

[0192] In the conductive wiring (83a) of the third redistribution layer (RDL) (83), an optical engine pad (320) is formed, which is composed of solder balls or solder bumps, etc., necessary for electrical connection with the socket pin array (310) for electrical connection formed on the main printed circuit board (302).

[0193] The surface finish of the above-mentioned optical engine pad (320) can be selected in various ways depending on the application, and it can be configured to be compatible with SMT processes in the form of LGA or BGA, or it can be configured as a solder-free contact surface by applying hard gold plating or wear-resistant conductive coating without forming solder bumps. This structure can be directly contacted with various socket types such as pogo pins, elastomers, and leaf springs, and can be applied to applications that require repeated attachment or replacement.

[0194] In the present invention, as described below, an electrical connection between the main printed circuit board (302) and the conductive wiring (83a) of the optical engine (110) is implemented through the socket pin array (310) using the socket pin array (310) for electrical connection formed on the main printed circuit board (302).

[0195] In the fourth embodiment, the OPCB (Optical Printed Circuit Board) used as the main printed circuit board (302) can be used when a module containing an optical engine (110) or an optical element is coupled to a waveguide on the OPCB and directly connected to another board or optical communication module. For example, the optical engine on the main printed circuit board can be directly coupled to an external optical transceiver or backplane interface through the OPCB. This structure can significantly reduce the power consumption of the entire system while minimizing electrical interfaces and increasing transmission efficiency and integration density.

[0196] When an OPCB (Optical Printed Circuit Board) is used as the main printed circuit board (302), there is a problem with fine alignment error between the optical engine (110) and the waveguide (68) on the OPCB. Also, if a defect occurs in a part of the optical engine (110) after the assembly of the optical engine (110) is completed, it is difficult to replace the corresponding component individually and the entire system must be discarded. Furthermore, since optical components have greater thermal limits and reliability degradation than general electronic components, a structure is required that allows for simple replacement when performance degradation or damage occurs to a specific component during long-term use.

[0197] In consideration of the above-mentioned problem, the present invention provides a single integrated substrate package (102) in which a separately manufactured optical engine (110) is detachably coupled to a main printed circuit board (302) instead of including the optical engine (110) in the single integrated substrate package (102) to integrate it into a single package.

[0198] In the fourth embodiment according to the present invention, a new method is proposed to precisely assemble the optical engine (110) to the main printed circuit board (302) by combining an electrical connection structure using a socket pin array (310), an optical alignment structure including an optical mate (O-mate) (330) and a lens block (340) between the optical engine (110) and the main printed circuit board (302).

[0199] An optical mate (O-mate) (330) can be fixed to the lower part of the photonic IC (PIC) (130) of the optical engine (110), and an optical lens (331) for changing (controlling) the path of light emitted from the light input / output part (132) of the optical element (VCSEL) provided in the photonic IC (PIC) (130) may be included on the lower surface of the optical mate (O-mate) (330).

[0200] The optical lens (331) can, for example, function as a collimating lens that creates a path close to parallel without scattering light generated from a light element (VCSEL) or a focusing lens that focuses light to a single point, thereby guiding light to be incident on an optical member (350) formed by a 45-degree inclined surface provided in the lens block (340).

[0201] In the fourth embodiment according to the present invention, when mounting the optical engine (110) on the main printed circuit board (302), assembly is made possible without using any Surface Mount Technology (SMT) or soldering process, thereby enabling easy attachment and replacement of the optical engine (110).

[0202] In particular, in the fourth embodiment according to the present invention, optical alignment is mechanically ensured by an optical mate (O-mate) structure (330) coupled to the optical engine (110), so it is not affected by self-alignment effects that occur during SMT reflow or the positional precision limits of the pick and place equipment.

[0203] A reference mark or a structure for mechanical alignment for attaching an optical mate (O-mate) (330) may be provided on the lower surface of the optical engine (110), and an adhesive surface may be formed using UV or thermosetting adhesive after plasma activation. The structure prepared in this way can then be used for precise bonding with the optical mate (O-mate) (330), and stable optical axis alignment can be secured without being affected by SMT or reflow processes.

[0204] Accordingly, the optical engine (110) according to the fourth embodiment can be implemented by integrating optical devices including VCSELs and PDs, namely photonic ICs (PIC) (130) and EICs (140), into a FOWLP structure, and can support various electrical connection methods regardless of the presence or absence of solder. In addition, by including an optical window, low-stress EMC, and alignment reference structure, it can be realized as a structure that can be combined with an optical mate (O-mate) (330) at the wafer level, and can simultaneously achieve high-precision optical alignment and ease of replacement.

[0205] The above-mentioned optical mate (O-mate) (330) is a component for ensuring precise optical alignment and mechanical coupling between the optical engine (110) and the main printed circuit board (302), and can be designed to simultaneously ensure optical coupling efficiency and assembly reliability. The above-mentioned optical mate (O-mate) (330) can be implemented in a form that integrates a mechanical alignment structure and an optical functional structure, and, if necessary, can include optical elements such as lenses, prisms, and diffraction gratings to improve optical path conversion and coupling efficiency.

[0206] The body of the above-mentioned optical mate (O-mate) (330) can be manufactured from an engineering plastic with excellent thermal stability and dimensional accuracy, such as Ultem (PEI), PEEK, LCP, COC, COP, etc. These materials have a low coefficient of thermal expansion and sufficient rigidity, and can be manufactured with tolerances of ± several μm through injection molding, precision cutting, or replication molding techniques. If necessary, metal inserts or reinforcing ribs may be included to increase structural rigidity or prevent deformation during long-term use.

[0207] The above-mentioned optical mate (O-mate) (330) can be precisely attached to the optical engine (110), and this attachment process can be performed at the wafer level or the individual die level. When attaching, the key is to directly recognize the reference pattern of the optical element (VCSEL, PD, etc.) included in the optical engine (110) and align the reference structure of the optical mate (O-mate) (330) accordingly. That is, the optical mate (O-mate) (330) is attached by being aligned based on the actual light-emitting and light-receiving positions of the optical element, and is aligned with the optical center coordinates rather than a separate outer mark. This process can be performed using an active or semi-active alignment method, and a low-shrinkage UV or thermosetting adhesive can be used for bonding. By enhancing the surface energy of the bonding surface through plasma activation, long-term bonding reliability can be ensured.

[0208] The lower surface of the above-mentioned optical mate (O-mate) (330) is formed to be in close contact with the optical engine (110), and a fine taper or guide shape may be added to minimize bonding errors. Tilt or fine shrinkage that may occur during bonding is structurally absorbed, and the design may ensure that the optical axis does not deviate even after curing. The attached optical mate (O-mate) (330) provides a reference position when subsequently combined with the lens block (340) mounted on the main printed circuit board (302) and mechanically maintains optical path alignment.

[0209] A mating structure (332), such as a guide pin, alignment groove, tapered pocket, or latch structure, may be provided at the bottom of the above optical mate (330) for connection with the lens block (340). This structure can provide a self-aligning effect that automatically aligns the optical axis during assembly. This structure is not affected by substrate deformation or pad errors that may occur during SMT or reflow, and can maintain consistency of the optical center without a separate fixing device.

[0210] Additionally, if necessary, optical elements such as lenses, prisms, or diffraction gratings may be integrated into the optical mate (O-mate) (330) to provide optical path conversion, focus control, beam focusing, or diffusion functions. An anti-reflective (AR) coating, a protective film, or a refractive index matching layer may be added to these optical parts to minimize reflection loss and light loss.

[0211] The optical mate (330) configured in this manner is attached by being aligned with the actual optical element reference pattern of the optical engine (110), thereby fundamentally ensuring alignment accuracy between the optical active area and the waveguide (68) of the main printed circuit board (302). In addition, the position is stably maintained through the mechanical coupling structure even after assembly, so that optical coupling efficiency can be maintained even in environments with repeated detachment and attachment or temperature changes.

[0212] The above-mentioned optical mate (O-mate) (330) is mechanically coupled to a lens block (340) provided on a main printed circuit board (302) and a mating structure (332) to stably secure optical axis alignment. The structure for assembling the mating structure (332) into a guide hole provided in the lens block (340) can operate with a mechanism similar to the method of alignment using pins in a multi-fiber ferrule, and can extend the alignment tolerance by including optical path control elements such as lenses, prisms, and reflective surfaces as needed.

[0213] The above optical mate (O-mate) (330) is attached after the optical engine is manufactured by aligning it with the actual optical reference pattern of the optical element (VCSEL, PD, etc.) provided in the photonic IC (PIC) (130), and can be aligned and attached to multiple optical engines in batches through a fan-out wafer level packaging (FOWLP) process.

[0214] The optical mate (330) formed in this way allows the optical axis to be automatically aligned through a mechanical interlocking structure when the optical engine (110) and the lens block (340) of the main printed circuit board (302) are assembled, thereby ensuring uniformity of optical coupling efficiency. In addition, if a defect occurs in the optical engine (110), the optical mate (330) can be separated from the lens block (340) and a new optical engine can be reattached, making rework and module replacement easy.

[0215] The main printed circuit board (302) is provided with a through hole (305), and after attaching a lens block (340) to the through hole (305), bonding glue (340a) can be used to secure the main printed circuit board (302) and the lens block (340).

[0216] The input port of the waveguide (68) provided on the main printed circuit board (302) is exposed to the through hole (305), and the lens block (340) coupled to the through hole (305) is provided with an optical member (350) having a 45-degree inclined surface and can guide light incident on the optical member (350) to be incident on the input port of the waveguide (68).

[0217] The lens block (340) can be implemented as a component for controlling the optical path between the optical mate (330) and the main printed circuit board (302) and for precisely coupling a beam emitted or received from the optical engine (100) to a waveguide (68) inside the main printed circuit board (302). The lens block (340) may be integrally molded as a single part, or multiple small lens blocks may be manufactured in an array form to simultaneously form multiple channels of optical paths. This structure can be freely configured according to the number of channels of the system, the package size, and the optical waveguide array type.

[0218] The lens block (340) may be formed from transparent glass or a high-performance polymer (e.g., COC, COP, Zeonex, Ultem, LCP, etc.). These materials can simultaneously provide high light transmittance, low refractive loss, and thermal and humidity stability, thereby providing long-term alignment stability in high-speed optical communication modules or co-packaged optics environments. The lens surface may be processed into a flat or aspherical shape, and, if necessary, an anti-reflective (AR) coating or protective film may be applied to reduce reflection and scattering losses.

[0219] The lens block (340) may include various optical elements (350) for controlling the focus, beam spreading, and coupling angle of the optical path. For example, a 45° reflective surface or prism structure for converting a vertically incident beam into a horizontal waveguide (68), or a diffraction grating coupler for improving coupling efficiency at a specific wavelength may be incorporated. These optical elements (350) may be directly molded within a single material or fabricated as a multilayer composite structure.

[0220] The lower surface of the lens block (340) can be precisely aligned using a waveguide (68) pattern or alignment bump on the main printed circuit board (302). That is, a fine pocket, groove, or protrusion structure defining the position of the lens block (340) can be formed on the main printed circuit board (302), and the lens block (340) can be self-aligned with the center of the waveguide (68) by this structure. When assembled, the lens block (340) is fixed in position by engaging with a reference pattern on the main printed circuit board (302), and alignment accuracy of several μm can be secured without additional active alignment.

[0221] The lens block (340) can be directly attached to the main printed circuit board (302), and an optical adhesive or matching layer with a similar refractive index may be used for bonding. This adhesive layer serves to eliminate optical gaps and reduce beam reflection or interference, and can be cured by UV or thermal curing. During the bonding process, the main printed circuit board (302) is fixed in an alignment jig or vacuum chamber to suppress substrate deformation, and the lens block (340) is attached such that the reference plane of the optical mate (O-mate) (330) aligns with the center of the waveguide (68) of the main printed circuit board (302).

[0222] The assembly of the lens block (340) can generally be performed after the optical mate (O-mate) (330) is attached to the optical engine (110), at which time the lower part of the optical mate (O-mate) (330) and the reference plane of the upper surface of the lens block (340) engage with each other to mechanically ensure optical axis alignment. When multiple lens blocks are used, each block shares the same main printed circuit board (302) surface reference, so optical alignment consistency between all channels can be maintained.

[0223] The electrical connection between the main printed circuit board (302) and the optical engine (110) is implemented through an electrical connection socket pin array (310). The socket pin array (310) is provided with a plurality of socket pins and forms a contact between an optical engine pad provided on the third redistribution layer (RDL) (83) of the optical engine (110) and a socket pin provided on the socket pin array (310) of the main printed circuit board (302).

[0224] The socket pin array (310) generally has a structure in which a number of electrical contact elements are arranged in a specific pattern, and the contact method can be implemented in various forms such as elastomer, pogo pin, leaf spring, micro spiral contact, or conductive film-based contact layer depending on design requirements. Among these, the elastomer method is particularly advantageous in terms of structural simplicity, assembly flexibility, and high connection reliability.

[0225] The elastomer-type socket can be composed of conductive silicone, a polymer composite, or a composite elastomer including a metal core, and fine conductive paths are formed in the vertical direction to transmit current between pads.

[0226] The socket pin array (310) can be pre-mounted on the main printed circuit board (302) and can be mounted on the board through an SMT process, a press fit, or a mechanical fixing structure. Subsequently, when the optical engine (110) is assembled, the socket pins and the optical engine pads come into direct contact with the optical alignment completed through the optical mate (330) and the lens block (340). This non-simultaneous assembly structure increases the freedom of the assembly process by separating optical alignment and electrical connection, and enables both production efficiency and alignment stability to be secured.

[0227] During the assembly process, the socket pin array (310) may have a floating or compliant structure that absorbs the error between the lower pad of the optical engine (110) and the pad of the main printed circuit board (302). It may include an elastic material or a flexible support layer so that contact pressure is evenly distributed when fastened, and damage to the pad due to poor contact or overpressure can be prevented.

[0228] The aforementioned pogo pins, elastomers, or other forms of electrical interconnect technologies may be combined as needed. For example, low-impedance elastomer contacts can be applied to high-speed differential signal lines, while high-durability pogo pin contacts can be applied to power and ground lines. Through this hybrid configuration, electrical paths suitable for each signal characteristic can be secured.

[0229] The socket pin array (310) configured in this manner enables electrical connections that are not affected by thermal or mechanical stress while operating independently of the optical alignment structure. In particular, the elastomer-based structure is excellent in terms of solderless assembly, high repeatability, and fine pitch compatibility, so that stable electrical connections can be maintained even in application environments where replacement or rework of the optical engine (110) module is required.

[0230] In the present invention, when assembling the optical engine (110) to the main printed circuit board (302), contact reliability is ensured by applying a constant pressure using a socket and a socket cover or a clamp structure (not shown), and the position definition within the plane can be precisely determined by an optical mate (O-mate) structure (330).

[0231] That is, the socket can be implemented as a structure to maintain a stable electrical and mechanical connection on the main printed circuit board (302) by integrally fixing the optical engine (110), the optical mate (O-mate) (330), and the socket pin array (310). The socket performs the function of securing electrical contact by pressing the optical engine (110) in the correct position, maintaining connection stability even with external vibrations or temperature changes, and facilitating the removal and replacement (Rework) of the optical engine when necessary.

[0232] In the present invention, by utilizing the above-described socket pin array (310) structure, a stable electrical connection can be secured between the main printed circuit board (302) and the optical engine (110) without a soldering process, and at the same time, uniform contact pressure is maintained by absorbing substrate and package manufacturing tolerances.

[0233] Accordingly, the present invention can simultaneously achieve mechanical optical alignment by the optical mate (O-mate) (330) and non-solder electrical connection by the socket structure, thereby ensuring both stability of optical coupling efficiency and ease of module replacement.

[0234] A single integrated substrate package (102) according to the fourth embodiment of the present invention may provide the following features.

[0235] First, by excluding the SMT and soldering processes, the optical engine (110) can be detached, and rework of defective engines is easy.

[0236] Second, even if there is a registration error of the main printed circuit board (302) and a position deviation of the optical engine (110) due to the mechanical alignment structure using the optical mate (O-mate) (330), the optical alignment is automatically compensated.

[0237] Third, the socket structure absorbs electrical connection tolerances and maintains a stable electrical connection even during repeated attachment and detachment.

[0238] Accordingly, the present invention enables both precise optical alignment and easy replacement of the optical engine (110), thereby providing high maintainability and reliability in Co-packaged Optics and Near Package Optics (NPO) applications.

[0239] As described above, in the present invention, a silicon-based interposer and a package substrate are integrated into a single integrated substrate package (100), and a plurality of integrated circuits (ICs), such as a logic semiconductor integrated circuit chip (230) used for various memory and signal processing and an optical engine chip (250), can be mounted and integrated using a single integrated substrate to enable packaging into a single substrate or a single chip.

[0240] In addition, the present invention provides a single integrated board package (100) for high-performance computing in which an electric-routing part (E-Routing Part) (50) responsible for the input and output of electrical signals and an optical-routing part (O-Routing Part) (60) for processing the input and output of optical signals are integrally embedded within a single integrated board package (100), thereby enabling the package size to be miniaturized and slimmed down.

[0241] As a result, in the present invention, the electric-routing part (E-Routing Part) (50), optical-routing part (O-Routing Part) (60), passive components (30) such as MLCC, and heat transfer metal pieces (20) for heat dissipation are all packaged into a single integrated substrate package (100), thereby minimizing the length of signal wiring between components and enabling the implementation of short signal lines and a miniaturized and integrated structure using a fan-out wafer level packaging (FOWLP) process.

[0242] Although the present invention has been illustrated and described above with reference to specific preferred embodiments, the present invention is not limited to the embodiments described above, and various changes and modifications may be made by those skilled in the art without departing from the spirit of the invention.

[0243] The present invention can be applied to a single integrated substrate package for High-performance Computing (HPC), in which a silicon-based interposer and a package substrate are integrated into a single integrated substrate, and multiple integrated circuits (ICs), such as memory, signal processing devices, and optical engine chips, are mounted and integrated using a single integrated substrate to enable one-chip packaging.

Claims

1. A package in which a memory chip, a logic semiconductor integrated circuit chip, and an optical engine are mounted, An electrical routing part (E-Routing Part) having a plurality of vertical conductive TMVs (Through Mold Via) inside and responsible for the input and output of electrical signals to the package; An optical routing part for processing the input and output of an optical signal for the optical engine provided in the above package; A mold body having a first surface and a second surface, which surrounds the electric-routing component and the optical-routing component with a sealing material to protect the electric-routing component and the optical-routing component; and A first redistribution layer formed on at least one of the first surface and the second surface of the mold body and having a wiring line for performing an interconnection between at least one of the memory chip, the logic semiconductor integrated circuit chip, and the optical engine and the electric-routing component and the optical-routing component; comprising The above-described optical engine includes a photonic integrated circuit (IC) that generates or receives an optical signal and an electronic integrated circuit (IC) that drives or interfaces with the photonic integrated circuit, and the electronic integrated circuit (IC) is a single integrated substrate package for high-performance computing that is molded inside the mold body.

2. In Paragraph 1, The above photonic integrated circuit is mounted on the first redistribution layer formed on the first surface of the mold body and is electrically connected to the first redistribution layer to operate in multi-mode. An optical path converter mechanism formed inside the first redistribution layer and capable of converting the path of the optical signal by 90 degrees; and A single integrated substrate package for high-performance computing further comprising: a waveguide formed inside the first redistribution layer in the same direction as the first redistribution layer and transmitting the optical signal incident from the optical path converter mechanism in the same direction as the first redistribution layer.

3. In Paragraph 1, The above photonic integrated circuit is mounted on the first redistribution layer formed on the first surface of the mold body and is electrically connected to the first redistribution layer to operate in multi-mode. An optical path converter mechanism formed inside the optical-routing component and capable of converting the path of the optical signal by 90 degrees; and A single integrated board package for high-performance computing further comprising: a waveguide formed inside the optical-routing component and transmitting the optical signal incident from the optical path converter mechanism.

4. In Paragraph 1, The above photonic integrated circuit is mounted on the first redistribution layer formed on the first surface of the mold body and is electrically connected to the first redistribution layer to operate in multi-mode. A through hole formed vertically inside the above-mentioned mold body to allow an optical signal to pass through; An optical path converter capable of converting the path of the above optical signal by 90 degrees; and A single integrated board package for high-performance computing further comprising: a main printed circuit board (OPCB) having an electrical wiring layer provided on an outer surface and a waveguide provided inside the board for transmitting the optical signal incident from the optical path converter, wherein the single integrated board package is mounted on one surface and the optical path converter mechanism is installed in a trench-shaped groove corresponding to the through hole.

5. In Paragraph 1, The above photonic integrated circuit is mounted on the first redistribution layer formed on the first surface of the mold body and is electrically connected to the first redistribution layer to operate in a single mode. A single integrated board package for high-performance computing, wherein an optical connector having a single-mode optical fiber is coupled to one side of the single integrated board package to transmit or receive an optical signal to the photonic integrated circuit.

6. In Paragraph 1, The above photonic integrated circuit is positioned adjacent to the optical-routing component inside the mold body and operates in multi-mode, An optical path converter mechanism formed inside the first redistribution layer and capable of converting the path of the optical signal by 90 degrees; and A single integrated substrate package for high-performance computing further comprising: a waveguide formed inside the first redistribution layer in the same direction as the first redistribution layer and transmitting the optical signal incident from the optical path converter mechanism in the same direction as the first redistribution layer.

7. In Paragraph 1, The above photonic integrated circuit is positioned adjacent to the optical-routing component inside the mold body and operates in single mode, An optical path converter mechanism formed inside the optical-routing component, which converts the path of the optical signal incident from the photonic integrated circuit by 90 degrees and diverges it to the outside of the package; and A single integrated board package for high-performance computing further comprising: a waveguide formed inside the optical-routing component and transmitting the optical signal incident from the photonic integrated circuit to the outside of the package.

8. In Paragraph 1, The above optical-routing component is A body made of an insulator; and A single integrated board package for high-performance computing comprising at least one through hole formed in one of a vertical, horizontal, and diagonal direction within the body so as to allow input or output of an optical signal from the above photonic integrated circuit (IC), and at least one waveguide for transmitting an optical signal to an optical fiber or receiving an optical signal from an optical fiber in one of the vertical, horizontal, and diagonal directions of the body.

9. In Paragraph 8, The above optical-routing component comprises a second redistribution layer connected to the first redistribution layer inside the body; and A single integrated substrate package for high-performance computing further comprising a vertical conductive TGV (Through Glass Via) connected to the second redistribution layer and formed penetrating the body in a vertical direction.

10. In Paragraph 1, It further includes an optical mate that performs an optical interface by being disposed between a photonic integrated circuit (IC) of the optical engine and a fiber optic array unit (FAU) that is coupled to one side of the package and supports a fiber optic cable. The above optical mate is a single integrated substrate package for high-performance computing having a plurality of optical elements for changing the optical path of light output from a waveguide disposed on the upper surface of the photonic integrated circuit (IC) to an intermediate portion where the optical fiber of the optical fiber array unit (FAU) is located.

11. In Paragraph 10, The above optical mate is positioned on the side of the above photonic integrated circuit (IC) and is molded inside the mold body, for a single integrated substrate package for high-performance computing.

12. In Paragraph 1, An optical mate having a first optical lens disposed on a side opposite to a waveguide disposed on the upper surface of the photonic integrated circuit (IC) for emitting incident light and changing the path of the incident light to the top of the package; A first lens block having a second optical lens formed at the tip portion to collect divergent light transmitted from the optical mate and make it into parallel light; and It further includes a second lens block comprising a third optical lens capable of focusing parallel light incident on a front surface facing the second optical lens, and a mirror surface formed by a 45-degree inclined surface that bends the path of light focused by the third optical lens by 90 degrees. A single integrated substrate package for high-performance computing in which light reflected from the mirror surface and bent at 90 degrees is focused into the core of an optical fiber coupled to the second lens block.

13. In Paragraph 12, A single integrated board package for high-performance computing, further comprising a pair of guide pins coupled between the first and second lens blocks to guide mutual precise positioning.

14. A package in which a memory chip, a logic semiconductor integrated circuit chip, and passive components are mounted internally and externally, comprising: an electrical-routing part (E-Routing Part) having a plurality of vertical conductive TMVs (Through Mold Via) internally and responsible for the input and output of electrical signals to said package; an optical-routing part (O-Routing Part) for processing the input and output of optical signals to said optical engine provided in said package; a mold body having a first surface and a second surface, which surrounds said electrical-routing part and optical-routing part with an encapsulating material to protect said electrical-routing part and optical-routing part; and a first redistribution layer formed on at least one of the first surface and the second surface of said mold body and having a wiring line for performing an interconnection between at least one of said memory chip, logic semiconductor integrated circuit chip, and optical engine and said electrical-routing part and optical-routing part; comprising a first package; An optical engine packaged in the form of an Optical System-In-Package, wherein a photonic integrated circuit (IC) for generating or receiving an optical signal and an electronic integrated circuit (IC) for driving or interfacing the photonic integrated circuit are provided inside a mold body, and a second rewiring layer is formed outside the mold body, the second rewiring layer having wiring lines for interconnecting the photonic integrated circuit and the electronic integrated circuit (IC) is formed. An optical mate mounted on the lower surface of the optical engine and equipped with an optical lens for controlling the path of light emitted from the light input / output portion of an optical element provided in the photonic integrated circuit (IC); A main printed circuit board comprising an OPCB (Optical Printed Circuit Board) having an electrical wiring layer provided on an outer surface and a waveguide provided inside the substrate for transmitting the incident optical signal, wherein the first package is mounted on one side and a through hole is provided at a position where incident light incident through the optical lens is introduced; A lens block having an optical member having a tip portion coupled to the through hole and having an optical member inside that bends the path of light by 90 degrees and focuses it into the waveguide when incident light entering through the optical lens is introduced; and It includes a socket pin array mounted on the upper surface of the main printed circuit board and electrically connected to an optical engine pad provided in the second redistribution layer of the optical engine; The above-described optical engine is a single integrated board package detachably coupled to the above-described main printed circuit board.

15. In Paragraph 14, A single integrated substrate package further comprising a mating structure formed on the lower part of the optical mate (O-mate) to provide a self-aligning effect that automatically aligns the optical axis when assembling the optical mate (O-mate) and the lens block.

Images