1results about How to "Good dimensional stability at high temperature" patented technology

The application belongs to the technical field of thermoplastic polyester imides, and particularly relates to a biphenyl-bridged thermoplastic polyester imide, a preparation method thereof, a biphenyl-bridged thermoplastic polyester imide film and application. The biphenyl-bridged thermoplastic polyester imide is polymerized from biphenyl diphenylate-3,3',4,4'-tetracarboxylic dianhydride, 3,3',4,4',-biphenyl tetracarboxylic dianhydride and 2-(4-aminobenzoate)-5-aminobiphenyl. The biphenyl-bridged thermoplastic polyester imide provided by the application has a linear thermal expansion coefficient close to that of copper foil, and excellent thermoplasticity, high-temperature dimensional stability and dielectric properties.