The invention provides a packaging structure of a power
semiconductor module, which relates to the technical field of
semiconductor packaging and comprises a shell, a direct
copper-clad
ceramic substrate is fixed on the inner wall of the bottom of the shell, and a power
semiconductor chip, a
signal terminal and a power terminal are welded on the direct
copper-clad
ceramic substrate; insulating baffles are arranged at the connecting positions of the side faces of the shell, and / or insulating parts are arranged on the outer walls of the two sides of the shell in the width direction respectively. The beneficial effects are that on the premise of being compatible with the original installation environment, the electrical safety and the installation convenience are synchronously improved.