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This invention relates to the field of laser cutting technology, and provides a laser cutting device for processing laptop casings, including an operating table and a laser cutting head mounted on its top; a movable frame is installed inside the operating table, and clamping structures are provided on both sides of the movable frame; a longitudinal plate is installed inside the movable frame, and a transverse plate is installed at the bottom of the longitudinal plate. This invention, through the clamping structure, incorporates a gear and rack mechanism between the outer support bar and the inner support block. When the outer support bar is in operation, the second rack meshes with the gear, driving the inner support block to move horizontally towards the inner wall of the casing sidewall, forming an adaptive inner support that extends into the sidewall. When laser cutting the top of the sidewall, this provides reliable back support for the thin-walled sidewall, effectively avoiding vibration, tool deflection, or deformation caused by lack of support. Simultaneously, the narrow edge design of the inner support block avoids the rounded transition section at the corner of the sidewall, ensuring the fit of the support and the integrity of the processing.