The utility model belongs to a gauge for marking bad positions on the back of a
wafer, which relates to the field of
semiconductor integrated circuit manufacture and comprises an upper
handle, a lower
handle and a connecting ring, the upper
handle and the lower handle are symmetrically provided with an upper handle gauge angle and a lower handle gauge angle, the length of the gauge angles is 3 / 4 of the
diameter of a
silicon wafer, and the upper handle gauge angle and the lower handle gauge angle are symmetrical in size. The front end of the upper handle
compass angle and the front end of the lower handle
compass angle are triangular, a marking head used for marking is arranged in the upper handle
compass angle, an upper handle sleeve is arranged below the upper handle, and when the
silicon wafer back
metal defect area clamping device is used, the pressing cap is manually controlled, the upper handle sleeve of the upper handle is moved, the marking head is exposed, and a
silicon wafer back
metal defect area is horizontally clamped. And marking is correspondingly completed on the front surface of the silicon wafer, so that the positions of the bad core particles can be accurately marked, and the problems of inaccurate marking of the bad core particles, influence on production efficiency in the marking process and resource waste in the prior art are solved.