Heat dissipation type multi-chip integrated circuit package structure

Abstract

The invention discloses a heat dissipation type multi-chip integrated circuit package structure. The structure comprises a substrate and a rectangular frame molded on the substrate, multiple steps are molded on the inner wall of the frame, upper heat dissipation mechanisms used for conducting heat dissipation on the obverse sides of IC chips and lower heat dissipation mechanisms used for conducting heat dissipation on the reverse sides of the IC chips are arranged on the steps, and the IC chips are located between the upper heat dissipation mechanisms and the lower heat dissipation mechanisms; each upper heat dissipation mechanism comprises long-strip-shaped inserting grooves formed in the front side wall and the back side wall of the corresponding step, multiple compression springs arranged in the inserting grooves, heat dissipation tubes of which the two ends abut against the compression springs and arc-shaped guide grooves formed in the bottom wall of the corresponding step; each lower heat dissipation mechanism comprises fixing plates which are detachably arranged on the side walls of the steps under the inserting grooves, obliquely-arranged connecting plates molded at one ends of the fixing plates and multiple fans arranged on the connecting plates. According to the heat dissipation type multi-chip integrated circuit package structure, quick heat dissipation can be achieved, and the service life of multiple chips can be prolonged.

Description

Technical field: [0001] The invention relates to the technical field of integrated circuits, in particular to a heat dissipation multi-chip integrated circuit package. Background technique: [0002] The electronics industry continues to reduce the size of electronic components and continue to increase functions on electronic components, which makes the functions and complexity of integrated circuits continue to increase. This trend also drives the packaging technology of integrated circuit components to develop in the direction of small size, high pin count and high electrical / thermal performance, and conforms to predetermined industrial standards. Since high-performance integrated circuit components generate higher heat, and the current small package technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on its small package structure to facilitate heat dissipation and prolong the service life of in...

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