A backplane of a backlight module, a backlight module and a display module

A technology for backlight modules and display modules, applied in optics, nonlinear optics, instruments, etc., can solve problems such as dead lights, and achieve the effect of avoiding burnout

Active Publication Date: 2022-03-01
XIAMEN TIANMA MICRO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a backplane of a backlight module, a backlight module and a display module to solve the problem of dead lights in the existing backlight module

Method used

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  • A backplane of a backlight module, a backlight module and a display module
  • A backplane of a backlight module, a backlight module and a display module
  • A backplane of a backlight module, a backlight module and a display module

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Embodiment Construction

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0039] An embodiment of the present invention provides a backplane of a backlight module. Optionally, the backplane is a backplane of a backlight module in a liquid crystal display device. Of course, the present invention is not limited thereto. In other embodiments, The backplane can also be applied to display devices such as LED or OLED.

[0040] Such as figure 1 as shown, figure 1 It is a schematic cross-sectional structure diagram of a backboard provided...

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Abstract

The present invention provides a backplane of a backlight module, a backlight module and a display module. The backplane includes a bottom plate and a bending part located on at least one side of the bottom plate. The bending part and the bottom plate form a storage space; the bending portion has at least one protruding portion protruding toward the interior of the receiving space; the protruding portion is used to engage and fix the components located in the receiving space. Since the bent portion and the bottom plate form a receiving space, LEDs and the like can be arranged in the receiving space. Moreover, since the bending portion has at least one protruding portion protruding toward the inside of the receiving space, when the LED is arranged in the receiving space, the LED will not move under the engagement and fixation of the protruding portion, that is to say , Even if the light guide plate is heated and expands to push the LED, the LED will not move, thus avoiding the contact between the solder joints on the LED and the backplane, thereby avoiding the problems of LED burnout and dead lights.

Description

technical field [0001] The present invention relates to the field of display technology, more specifically, to a backplane of a backlight module, a backlight module and a display module. Background technique [0002] Liquid Crystal Displays (LCDs) have the advantages of thinness, light weight, low power consumption, and no radiation pollution, and have been widely used in today's display devices. Existing LCDs generally include a liquid crystal display panel and a backlight module, and the backlight module includes a frame, a backplane connected to the frame, a light guide plate, an optical film, and a side-type light source LED (Light Emitting Diode, light emitting diode), etc. . [0003] However, when the temperature test is carried out on the finished backlight module, or when the temperature is too high in the actual application process, the thermal expansion of the light guide plate will cause the LED to move, which will cause the solder joints on the LED to come into ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): G02F1/13357G02F1/1333
CPCG02F1/133308G02F1/133615G02F1/133314
Inventor陈锦
OwnerXIAMEN TIANMA MICRO ELECTRONICS