A high CRI and high light efficiency package

Abstract

The present invention relates to a high-rendering index and high-light-efficiency package, comprising a support member, on which a first LED chip and a second LED chip are arranged; a red phosphor colloid layer is arranged on at least the top surface of the surface of the second LED chip to form a package A; a short-wavelength phosphor colloid layer that does not contain red phosphor is arranged outside the first LED chip and the package A to form an overall package. The advantages of the present invention are that the high-rendering index and high-light-efficiency package of the present invention can take into account the excitation wavelengths of different phosphors by using multiple chips with different wavelengths for excitation.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor optoelectronics and optics, and in particular relates to a high-cdr and high-light-efficiency package. Background Art

[0002] Current white light LEDs generally come in the following forms: Figure 1 As shown in curve (1), blue light is used to excite a single yellow phosphor. In this case, the luminous efficiency is generally high, but the display index is only about 70, and it is not suitable for low color temperature applications. When medium and low color temperature applications are required, red phosphor is generally added. If the color rendering index needs to be further increased to above 80, red and green phosphors need to be added at the same time. Figure 1 As shown in curve (2), the color rendering index can reach 80 when red and green phosphors are used simultaneously. Figure 1 It can be seen from curve (2) that in full spectrum applications, the blue and cyan parts of the spectrum between 460-510nm are still missing, so it is often necessary to add cyan phosphors with peak wavelengths between 470-505nm in full spectrum applications. For conventional technical solutions to achieve full spectrum, blue light chips are basically used to excite mixed phosphors, but the color rendering index and light efficiency brought about by this are far from meeting the requirements of high light efficiency and high color rendering index. In order to further improve the color rendering index and light efficiency of the light source, the industry has also proposed several solutions, such as: using purple light chips to excite phosphors, which can make up for the spectral defects caused by blue light chip excitation to a certain extent.

[0003] Seoul Semiconductor has launched the SunLike full-spectrum light source, which combines Seoul Semiconductor's patented LED chip technology and Toshiba Materials TRI-R phosphor technology to produce a natural light spectrum. Sunlike full-spectrum realization technology: It uses all purple LED chips to excite the various colors of phosphors mixed in the overall packaging layer. Specific implementation methods, such as Figure 2 As shown. The disadvantage of this solution is that all mixed phosphors are excited by violet light, and the excitation efficiency of violet light is very low, which cannot achieve high-efficiency excitation of mixed phosphors, resulting in a waste of violet light. In addition, this solution also has the problem of secondary excitation of other long-wavelength phosphors by the blue light produced by the violet light exciting the blue phosphors, thus affecting the overall display quality and failing to further improve the light efficiency and color rendering of the light source.

[0004] Xinda Optoelectronics' patented technology for full spectrum implementation: (patent number 201810067979.2) uses a purple chip, two blue chips with different main wavelength ranges, and a light conversion layer coated on the purple chip and the blue chip. The light conversion layer is prepared by phosphor and encapsulation glue. In other words, the cyan powder with an emission wavelength of 490-505nm, the green powder with an emission wavelength of 520-540nm, and the crimson powder with an emission wavelength of 640-660nm are mixed with the encapsulation glue to form the light conversion layer. Specific implementation methods, such as Figure 3 As shown. This solution still uses mixed excitation of phosphors, the difference is that part of the chip is purple light and part is blue light, which improves the quality of the full spectrum to a certain extent, but there are still problems of secondary excitation of phosphors and low excitation efficiency. The use of blue light chips with relatively high quantum efficiency improves the overall luminous efficiency, but there will be problems of purple light being unnecessarily wasted in exciting phosphors other than 470-505 wavelengths, and there is also the problem of blue light phosphors secondary exciting long-wavelength phosphors, resulting in low overall excitation efficiency. And if this solution is to achieve different color temperatures, it is necessary to change the concentration of red phosphors in the encapsulation layer to achieve this. Especially at low color temperatures, due to the presence of high concentrations of red phosphors, the entire package will be very turbid and darker in color, so that the overall luminous efficiency and color rendering index of the light source are subject to certain restrictions.

[0005] Combining the above solutions, we can conclude that there are several common problems:

[0006] First, from Figure 4-Figure 9 It can be seen from the spectra of the six phosphors in that different phosphors have different optimal excitation wavelengths. Using a single wavelength of light to excite the mixed phosphor cannot take into account the optimal excitation wavelength of each phosphor, so the excitation efficiency for a certain phosphor is low. Therefore, although the use of mixed phosphors can also improve the color rendering index, its energy loss is large and the luminous efficiency is low. For example, for cyan phosphors, since its luminous wavelength is close to the excitation wavelength, the excitation efficiency is very low, and shorter wavelength blue or purple light should be used for excitation. However, using shorter wavelength blue or purple light to excite the mixed phosphor can improve the excitation efficiency of the cyan phosphor, but it increases the photon energy consumption of short-wavelength photons when exciting the yellow and red phosphors.

[0007] Second, there is the problem of secondary absorption for mixed phosphors. Figure 8 and Fig. 9It can be seen from the excitation spectra of the 655 and 660nm phosphors that there is still a relative absorption of up to 40% for the light emitted by the 495nm phosphor, which will not only reduce the component of cyan light, but also cause secondary energy loss. Assuming that the quantum efficiency of cyan phosphor and red phosphor are both 90%, the quantum efficiency of stimulating cyan phosphor by blue light and then stimulating red phosphor is 81%, which is about 10% lower than the quantum efficiency of directly stimulating red phosphor by blue light. Therefore, secondary absorption has a great influence on color rendering and luminous efficiency.

[0008] Third, for phosphors excited by blue light, one blue light photon can only excite one photon of another color at most, and the energy difference between the two photons is called Stocks shift. Figure 8 and Fig. 9 It can be seen that when a single short-wavelength blue light is used to simultaneously excite the mixed phosphor, the energy difference between the red light and the blue light is large, and the photon energy loss is large. The excess energy is absorbed by the lattice vibration, which not only causes the waste of photon energy, but also generates heat energy, which puts high demands on the heat dissipation of the device.

[0009] Fourth, from Fig.10 It can be seen that for the same phosphor, the emission wavelength is different when excited by blue light of different wavelengths. The emission wavelength will move relative to the movement of the excitation wavelength. At present, people are paying more and more attention to healthy lighting, that is, they hope that the emission spectrum will be wider and the color rendering index will be higher. Compared with multi-wavelength excitation, the emission spectrum of single-wavelength excitation light is narrower and the color rendering index is lower, which cannot meet the needs of wide spectrum and high color rendering index. Summary of the invention

[0010] The technical problem to be solved by the present invention is to provide a high color rendering index and high light efficiency package with higher color rendering index and guaranteed light emitting efficiency.

[0011] In order to solve the above technical problems, the technical solution of the present invention is: a high-cdr and high-light-efficiency package, the innovation of which is: comprising a support member, on which a first LED chip and a second LED chip are provided; a red phosphor colloid layer is provided on at least the top surface of the surface of the second LED chip to form a package A; the first LED chip and the package A are integrally encapsulated in a first wavelength phosphor colloid layer that does not contain red phosphor; and L1<L 红 , L1 is the wavelength of the phosphor in the first wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

[0012] Preferably, the wavelength of the first LED chip is denoted as λA, λA=390-460 nm, the wavelength of the second LED chip is denoted as λB, λB=445-550 nm; and 0≤λB-λA≤160 nm.

[0013] Preferably, the phosphor in the first wavelength phosphor colloid layer is one or more of green phosphor, indigo phosphor, cyan phosphor, yellow phosphor and blue phosphor, and L1=470-590 nm.

[0014] Preferably, the support member is one of a substrate with a circuit, a bracket with a circuit, or an adhesive film without a circuit.

[0015] A high-cdr and high-light-efficiency package, the innovation of which is that: it comprises a support member, on which a first LED chip and a second LED chip are arranged; a red phosphor colloid layer is arranged on at least the top surface of the surface of the second LED chip to form a package A; a second wavelength phosphor colloid layer without red phosphor is arranged on at least the top surface of the surface of the first LED chip to form a package B; the package A and the package B are integrally encapsulated in a third wavelength phosphor colloid layer without red phosphor; and L2<L3<L 红 , L2 is the wavelength of the phosphor in the second wavelength phosphor colloid layer, L3 is the wavelength of the phosphor in the third wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

[0016] Preferably, the wavelength of the first LED chip is denoted as λA, λA=390-445 nm, the wavelength of the second LED chip is denoted as λB, λB=445-550 nm; and 5≤λB-λA≤160 nm.

[0017] Preferably, the phosphor in the second wavelength phosphor colloid layer is one or more of green phosphor, indigo phosphor, cyan phosphor, yellow phosphor and blue phosphor, and L2=470~590nm; the phosphor in the third wavelength phosphor colloid layer is any one of green phosphor and yellow phosphor or a mixture of the two, and L3=510~590nm.

[0018] Preferably, the support member is one of a substrate with a circuit, a bracket with a circuit, or an adhesive film without a circuit.

[0019] A high-cdr and high-light-efficiency package, the innovation of which is that: it comprises a support member, on which a first LED chip, a third LED chip and a second LED chip are arranged, a red phosphor colloid layer is arranged on at least the top surface of the surface of the second LED chip, forming a package A; a fifth wavelength phosphor colloid layer without red phosphor is arranged on at least the top surface of the surface of the third LED chip, forming a package C; a fourth wavelength phosphor colloid layer without red phosphor is arranged on at least the top surface of the surface of the first LED chip, forming a package D; the package A, the package C and the package D are integrally encapsulated in a sixth wavelength phosphor colloid layer without red phosphor; and L4<L5<L6<L 红 , L4 is the wavelength of the phosphor in the fourth wavelength phosphor colloid layer, L5 is the wavelength of the phosphor in the fifth wavelength phosphor colloid layer, L6 is the wavelength of the phosphor in the sixth wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

[0020] Preferably, the wavelength of the first LED chip is denoted as λA, λA=390~445nm, the wavelength of the third LED chip is denoted as λC, λC=420~465nm, the wavelength of the second LED chip is denoted as λB, λB=445~550nm; and 0≤λB-λC≤130nm, 15≤λC-λA≤130nm.

[0021] Preferably, a fourth LED chip is arranged on the support member, the wavelength of the fourth LED chip is denoted as λD, λD=420~465nm, and the fourth LED chip, package A, package C and package D are integrally encapsulated in a sixth wavelength phosphor colloid layer without red phosphor.

[0022] Preferably, the phosphor in the fourth wavelength phosphor colloid layer is one or more of indigo phosphor, cyan phosphor and blue phosphor, and L4=470~510nm; the phosphor in the fifth wavelength phosphor colloid layer is green phosphor, and L5=510~540nm; the phosphor in the sixth wavelength phosphor colloid layer is any one of green phosphor and yellow phosphor or a mixture of two, and L6=530~590nm.

[0023] Preferably, the first LED chip is a violet LED chip with a wavelength of 390-430 nm, and the phosphor in the fourth wavelength phosphor colloid layer is a blue phosphor.

[0024] Preferably, the support member is one of a substrate with a circuit, a bracket with a circuit, or an adhesive film without a circuit.

[0025] A high-cdr and high-light-efficiency package, the innovation of which is that: it comprises a support member, on which a first LED chip, a third LED chip and a second LED chip are arranged, and a red phosphor colloid layer is arranged on at least the top surface of the surface of the second LED chip, forming a package A; a seventh-wavelength phosphor colloid layer without red phosphor is arranged on at least the top surface of the surface of the first LED chip, forming a package E; the package A, the third LED chip and the package E are integrally encapsulated in the eighth-wavelength phosphor colloid layer without red phosphor; and L7<L8<L 红 , L7 is the wavelength of the phosphor in the seventh wavelength phosphor colloid layer, L8 is the wavelength of the phosphor in the eighth wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

[0026] Preferably, the wavelength of the first LED chip is denoted as λA, λA=390~445nm, the wavelength of the third LED chip is denoted as λC, λC=420~465nm, the wavelength of the second LED chip is denoted as λB, λB=445~550nm; and 0≤λB-λC≤130nm, 15≤λC-λA≤130nm.

[0027] Preferably, the phosphor in the seventh wavelength phosphor colloid layer is one or more of indigo phosphor, cyan phosphor and blue phosphor, and L7=470~510nm; the phosphor in the eighth wavelength phosphor colloid layer is any one of green phosphor and yellow phosphor or a mixture of two, and L8=510~590nm.

[0028] Preferably, the first LED chip is a violet LED chip with a wavelength of 390-430 nm, and the phosphor in the seventh wavelength phosphor colloid layer is a blue phosphor.

[0029] Preferably, the support member is one of a substrate with a circuit, a bracket with a circuit, or an adhesive film without a circuit.

[0030] The advantages of the present invention are:

[0031] (1) The high-CRI and high-light-efficiency package of the present invention can take into account the excitation wavelengths of different phosphors by using multiple chips with different wavelengths for excitation, that is, a short-wavelength chip can excite a short-wavelength phosphor, and a long-wavelength chip can excite a long-wavelength phosphor. At the same time, it can avoid the short-wavelength fluorescence generated by the short-wavelength phosphor from exciting the long-wavelength phosphor again and being reabsorbed; the optimal excitation wavelength achieves the highest quantum efficiency and improves the light efficiency of the light source.

[0032] (2) The high CRI and high light efficiency package of the present invention adopts a packaging structure of multiple chips with different wavelengths. The difference from conventional technology is that the red phosphor is packaged in the local area of ​​the top and side of the chip using CSP or WLP technology, and only a very small amount of short-wavelength and medium-wavelength fluorescence will irradiate the red phosphor, which can effectively avoid the secondary absorption of cyan, blue and green fluorescence by the red phosphor. In particular, the excitation efficiency of cyan fluorescence is low, which can effectively reduce the secondary loss of cyan fluorescence, thereby improving the light efficiency and the color rendering index.

[0033] (3) The high color rendering index and high light efficiency package of the present invention, according to the Stokes shift phenomenon, for the same kind of phosphor, when the wavelength of the excitation light moves, its luminous wavelength will also move relatively in the corresponding wavelength direction; therefore, the long wavelength chip used in the present invention to excite the red phosphor can obtain red fluorescence with a longer wavelength, and the short wavelength chip used to excite the cyan, blue, and green phosphors can obtain cyan, blue, and green fluorescence with a shorter wavelength, so that the fluorescence band spectrum is widened, thereby further improving the color rendering index.

[0034] (4) The light source packaging structure of the present invention can change the color temperature by changing the ratio of blue and red chips in the light source. Conventional technology changes the color temperature of the light source by increasing the amount of red and other phosphors in the overall phosphor layer, which will cause the light-emitting surface of the COB package to be dark and turbid. The present invention uses a full red CSP chip to achieve the change of color temperature by changing the ratio of red light chips to blue light chips in the light source, unlike conventional packaging forms that require precise weighing of phosphors by a high-precision balance and then changing the mixed concentration of red phosphors in the overall packaging layer to achieve the change of color temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0036] Figure 1 This is the emission spectrum of a traditional white light LED.

[0037] Figure 2 Schematic diagram of the Sunlike full spectrum implementation principle.

[0038] Figure 3 This is a schematic diagram of the full-spectrum implementation structure of Xinda Optoelectronics' patented technology.

[0039] Figure 4 This is the excitation and emission spectrum of 495 phosphor.

[0040] Figure 5 This is the excitation and emission spectrum of 518 phosphor.

[0041] Figure 6 This is the excitation and emission spectrum of 530 phosphor.

[0042] Figure 7 This is the excitation and emission spectrum of 535 phosphor.

[0043] Figure 8 This is the excitation and emission spectrum of 655 phosphor.

[0044] Fig. 9 This is the excitation and emission spectrum of 660 phosphor.

[0045] Fig.10 The excitation spectrum and emission spectrum of red phosphor excited by different excitation wavelengths.

[0046] Fig.11 This is a structural schematic diagram of a high-crystal-ratio and high-light-efficiency package according to Example 1.

[0047] Fig.12 This is another structural schematic diagram of the high-crystal-ratio and high-light-efficiency package of Example 1.

[0048] Fig.13 Schematic diagram of the specific excitation method of the light source in Example 1.

[0049] Fig.14 FIG. 1 is a top view of a high-crystal-ratio and high-light-efficiency package according to Example 1.

[0050] Fig.15 This is a structural schematic diagram of a high-crystal-ratio and high-light-efficiency package according to Example 2.

[0051] Fig.16 This is another structural schematic diagram of the high CRI and high light efficiency package of Example 2.

[0052] Fig.17 Schematic diagram of the specific excitation method of the light source in Example 2.

[0053] Fig.18 This is a structural schematic diagram of a high-crystal-ratio and high-light-efficiency package according to Example 3.

[0054] Fig.19 This is a schematic diagram of a preferred structure of a high-crystal-ratio and high-light-efficiency package in Example 3.

[0055] Fig. 20 Schematic diagram of the specific excitation method of the light source in Example 3.

[0056] Fig.21 This is a structural schematic diagram of a high-crystal-ratio and high-light-efficiency package according to Example 4.

[0057] Fig. 22 This is another structural schematic diagram of the high CRI and high light efficiency package of Example 4.

[0058] Fig.23Schematic diagram of the specific excitation method of the light source in Example 4. DETAILED DESCRIPTION

[0059] The following embodiments can enable those skilled in the art to more fully understand the present invention, but the present invention is not limited to the scope of the embodiments.

[0060] Example 1

[0061] In this embodiment, the high color rendering refers to a high light efficiency package, such as Fig.11 As shown, it includes a substrate 1 with a circuit, and a first LED chip 2 and a second LED chip 3 are also arranged on the substrate 1, and the first LED chip 2 and the second LED chip 3 are arranged on the circuit structure of the substrate; a red phosphor colloid layer 4 is arranged on at least the top surface of the surface of the second LED chip 3 to form a package A; a first wavelength phosphor colloid layer 5 without red phosphor is arranged outside the first LED chip 2 and the package A, so that the first LED chip 2 and the package A are integrally encapsulated in the first wavelength phosphor colloid layer 5 without red phosphor to form an integral package. And L1<L 红 , L1 is the wavelength of the phosphor in the first wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

[0062] As for the chip selection suggestion, the wavelength of the first LED chip is denoted as λA, λA=390~460nm, the wavelength of the second LED chip is denoted as λB, λB=445~550nm; and 0≤λB-λA≤160nm.

[0063] For the phosphor colloid, the phosphor in the first wavelength phosphor colloid layer is one or more of green phosphor, indigo phosphor, cyan phosphor, yellow phosphor and blue phosphor, and L1 is 470-590 nm.

[0064] In addition, the number of the first LED chip 2 and the second LED chip 3 on the bracket 1 is not limited to one, and the number of the first LED chip 2 and the second LED chip 3 can be increased accordingly according to the actual light spectrum requirements, such as Fig.12 shown.

[0065] Schematic diagram of the specific excitation method of the light source in Example 1 of the present invention, see Fig.13 shown.

[0066] like Fig.14 As shown, the specific process is as follows: after the LED chip is die-bonded onto the substrate with the circuit, glue is dispensed inside the dam to form a circular or square shape, and then a phosphor colloid layer is coated on the entire dam to finally form an overall COB packaging structure; in actual applications, SMD packaging, CSP packaging or filament strip packaging can also be used according to actual needs.

[0067] As the preferred solution of this embodiment:

[0068] Taking the COB packaged Haidike series high CRI and high light efficiency package as an example, the test was carried out, and a red phosphor colloid layer 4 was set on the top and side surfaces of the second LED chip 3. The parameters of the three batches of samples were:

[0069] The parameters of HDK-S1-1 are:

[0070] The first LED chip 2 uses an LED chip with a wavelength of 445nm, and the second LED chip 3 uses an LED chip with a wavelength of 450nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the first wavelength phosphor colloid layer 5 that does not contain red phosphor is a mixed phosphor of green phosphor and yellow phosphor, and its phosphor wavelength is 510nm.

[0071] The parameters of HDK-S1-2 are:

[0072] The first LED chip 2 uses an LED chip with a wavelength of 445nm, and the second LED chip 3 uses an LED chip with a wavelength of 445nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the first wavelength phosphor colloid layer 5 that does not contain red phosphor is a mixed phosphor of green phosphor and yellow phosphor, and its phosphor wavelength is 510nm.

[0073] The parameters of HDK-S1-3 are:

[0074] The first LED chip 2 uses an LED chip with a wavelength of 445nm, and the second LED chip 3 uses an LED chip with a wavelength of 420nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the first wavelength phosphor colloid layer 5 that does not contain red phosphor is a mixed phosphor of green phosphor and yellow phosphor, and its phosphor wavelength is 510nm.

[0075] The comparison of the average test data of Example 1 of the present invention and a certain model of samples sold on the market is shown in the following table:

[0076]

[0077] Conclusion: The test results of the samples in Example 1 show that the luminous efficiency of the second LED chip can be further improved on the basis that the wavelength of the second LED chip is not lower than the wavelength of the first LED chip.

[0078] In this embodiment, the substrate 1 with circuit is used as the support, which can also be a bracket with circuit or a sticky film without circuit, which will not be described here. In addition, those skilled in the art should understand that in this embodiment, the wavelengths of the above-mentioned various color phosphors refer to the peak wavelengths.

[0079] Example 2

[0080] In this embodiment, the high color rendering refers to a high light efficiency package, such as Fig.15 As shown, it includes a support member 1, which is a bracket with a circuit, and a first LED chip 2 and a second LED chip 3 are arranged on the support member 1, and the first LED chip 2 and the second LED chip 3 are connected to the circuit through solid crystal welding or eutectic welding; a red phosphor colloid layer 4 is arranged on at least the top surface of the surface of the second LED chip 3 to form a package A;

[0081] A second wavelength phosphor colloid layer 7 without red phosphor is disposed on at least the top surface of the surface of the first LED chip 2 to form a package B; the package A and the package B are integrally encapsulated in a third wavelength phosphor colloid layer 8 without red phosphor;

[0082] And L2<L3<L 红 , L2 is the wavelength of the phosphor in the second wavelength phosphor colloid layer, L3 is the wavelength of the phosphor in the third wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

[0083] In addition, the number of the first LED chip 2 and the second LED chip 3 on the bracket 1 is not limited to one, and the number of the first LED chip 2 and the second LED chip 3 can be increased accordingly according to the actual light spectrum requirements, such as Fig.16 shown.

[0084] Schematic diagram of the specific excitation method of the light source in Example 2 of the present invention, see Fig.17 shown.

[0085] The wavelength selection suggestion for the chip is that the wavelength of the first LED chip is denoted as λA, λA=390~445nm, the wavelength of the second LED chip is denoted as λB, λB=445~550nm; and 5≤λB-λA≤160nm.

[0086] Regarding the selection of the phosphor colloid layer, the phosphor in the second wavelength phosphor colloid layer is one or more of green phosphor, indigo phosphor, cyan phosphor, yellow phosphor and blue phosphor, and L2=470~590nm; the phosphor in the third wavelength phosphor colloid layer is any one of green phosphor and yellow phosphor or a mixture of the two, and L3=510~590nm.

[0087] As the preferred solution of this embodiment:

[0088] This embodiment takes the SMD packaged Haidike series high CRI and high light efficiency package as an example for testing, and the top surface and side surface of the second LED chip 3 are both provided with a red phosphor colloid layer 4, and the top surface and side surface of the first LED chip 2 are provided with a second wavelength phosphor colloid layer 7 without red phosphor; the parameters of the three batches of samples are:

[0089] The parameters of HDK-S2-1 are:

[0090] In this embodiment, the first LED chip 2 selects an LED chip with a wavelength of 445nm, and the second LED chip 3 selects an LED chip with a wavelength of 455nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the third wavelength phosphor colloid layer 6 is a mixture of yellow phosphor and green phosphor, and its phosphor wavelength is 520nm; the phosphor in the second wavelength phosphor colloid layer 5 that does not contain red phosphor is blue phosphor, and its phosphor wavelength is 475nm.

[0091] The parameters of HDK-S2-2 are:

[0092] In this embodiment, the first LED chip 2 selects an LED chip with a wavelength of 445nm, and the second LED chip 3 selects an LED chip with a wavelength of 450nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the third wavelength phosphor colloid layer 6 is a mixture of yellow phosphor and green phosphor, and its phosphor wavelength is 520nm; the phosphor in the second wavelength phosphor colloid layer 5 that does not contain red phosphor is blue phosphor, and its phosphor wavelength is 475nm.

[0093] The parameters of HDK-S2-3 are:

[0094] In this embodiment, the first LED chip 2 selects an LED chip with a wavelength of 445nm, and the second LED chip 3 selects an LED chip with a wavelength of 445nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the third wavelength phosphor colloid layer 6 is a mixture of yellow phosphor and green phosphor, and its phosphor wavelength is 520nm; the phosphor in the second wavelength phosphor colloid layer 5 that does not contain red phosphor is blue phosphor, and its phosphor wavelength is 475nm.

[0095] The comparison of the average test data of Example 2 of the present invention and a certain model of samples sold on the market is shown in the following table:

[0096]

[0097] Conclusion: The test results of the samples in this embodiment 2 show that, with the same light source area, the light source of embodiment 2 of the present invention has higher luminous efficiency; and on the basis of satisfying the wavelength difference between the first chip and the second chip in this embodiment, its luminous efficiency can be further improved.

[0098] Those skilled in the art should note that: the high CRI and high light efficiency package in this embodiment takes SMD package as an example, and the first and second LED chips adopt a flip chip structure; but in actual applications, it is not limited to this packaging form, and COB packaging, CSP packaging or filament strip packaging can also be adopted according to actual needs. However, when adopting COB or filament strip packaging, it is preferred that: the first LED chip is a flip chip or a vertical chip structure, and the second LED chip adopts a normal chip structure. In addition, those skilled in the art should understand that in this embodiment, the wavelengths of the above-mentioned various colors of phosphors refer to the peak wavelength.

[0099] Example 3

[0100] In this embodiment, the high color rendering refers to a high light efficiency package, such as Fig.18 As shown,

[0101] The invention comprises a substrate 1 with a circuit, on which a first LED chip 2, a third LED chip 9 and a second LED chip 3 are arranged, and the first LED chip 2, the third LED chip 9 and the second LED chip 3 are arranged on the circuit structure; a red phosphor colloid layer 4 is arranged on at least the top surface of the surface of the second LED chip 3 to form a package A; a fifth wavelength phosphor colloid layer 10 without red phosphor is arranged on at least the top surface of the surface of the third LED chip 9 to form a package C; a fourth wavelength phosphor colloid layer 11 without red phosphor is arranged on at least the top surface of the surface of the first LED chip 2 to form a package D; a sixth wavelength phosphor colloid layer 12 without red phosphor is arranged on the outside of the packages A, C and D, so that the packages A, C and D are encapsulated as a whole in the sixth wavelength phosphor colloid layer without red phosphor.

[0102] And L4<L5<L6<L 红 , L4 is the wavelength of the phosphor in the fourth wavelength phosphor colloid layer, L5 is the wavelength of the phosphor in the fifth wavelength phosphor colloid layer, L6 is the wavelength of the phosphor in the sixth wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

[0103] In addition, if Fig.19 As shown, a fourth LED chip 15 may be further arranged on the substrate 1 , and the fourth LED chip 15 and the packages A, C and D are integrally packaged in a sixth wavelength phosphor colloid layer 12 that does not contain red phosphor.

[0104] For chip selection suggestions, the wavelength of the fourth LED chip is recorded as λD, λD = 420 ~ 465nm, the wavelength of the first LED chip is recorded as λA, λA = 390 ~ 445nm, the wavelength of the third LED chip is recorded as λC, λC = 420 ~ 465nm, and the wavelength of the second LED chip is recorded as λB, λB = 445 ~ 550nm; and 0≤λB-λC≤130nm, 15≤λC-λA≤130nm. The first LED chip can preferably use a purple LED chip with a wavelength of 390 ~ 430nm.

[0105] Regarding the selection of the phosphor colloid layer, the phosphor in the fourth wavelength phosphor colloid layer is one or more of indigo phosphor, cyan phosphor and blue phosphor, and L4=470~510nm; the phosphor in the fifth wavelength phosphor colloid layer is green phosphor, and L5=510~540nm; the phosphor in the sixth wavelength phosphor colloid layer is any one of green phosphor and yellow phosphor or a mixture of two, and L6=530~590nm.

[0106] The colloid of the phosphor colloid layer is usually selected from one or more of epoxy resin, silica gel or polyimide.

[0107] As a specific solution of this embodiment, Fig.19 Take the HDK-S3 Haidike series package with the same structure as shown in as an example and test it. The test sample adopts a two-color COB package structure:

[0108] The red phosphor colloid layer 4 is only arranged on the top surface of the second LED chip 3, the fifth wavelength phosphor colloid layer 10 without red phosphor is only arranged on the top surface of the third LED chip 9; the fourth wavelength phosphor colloid layer 11 without red phosphor is only arranged on the top surface of the first LED chip 2; the parameters of the three batches of samples are:

[0109] HDK-S3-1 sample parameters:

[0110] The fourth LED chip 15 uses an LED chip with a wavelength of 455nm, the first LED chip 2 uses a purple LED chip with a wavelength of 430nm, the third LED chip 7 uses an LED chip with a wavelength of 455nm, and the second LED chip 3 uses an LED chip with a wavelength of 465nm;

[0111] The phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the fourth wavelength phosphor colloid layer 5 that does not contain red phosphor is blue phosphor, and its emission wavelength is 475nm; the phosphor in the fifth wavelength phosphor colloid layer 6 can be green phosphor, and its emission wavelength is 515nm, and the phosphor in the sixth wavelength phosphor colloid layer 8 that does not contain red phosphor has a light-emitting wavelength of 530nm.

[0112] HDK-S3-2 sample parameters:

[0113] The fourth LED chip 15 uses an LED chip with a wavelength of 455nm, the first LED chip 2 uses a purple LED chip with a wavelength of 430nm, the third LED chip 7 uses an LED chip with a wavelength of 445nm, and the second LED chip 3 uses an LED chip with a wavelength of 445nm;

[0114] The phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the fourth wavelength phosphor colloid layer 5 that does not contain red phosphor is blue phosphor, and its emission wavelength is 475nm; the phosphor in the fifth wavelength phosphor colloid layer 6 can be green phosphor, and its emission wavelength is 515nm, and the phosphor in the sixth wavelength phosphor colloid layer 8 that does not contain red phosphor has a light-emitting wavelength of 530nm.

[0115] HDK-S3-3 sample parameters:

[0116] The fourth LED chip 15 uses an LED chip with a wavelength of 455nm, the first LED chip 2 uses a purple LED chip with a wavelength of 420nm, the third LED chip 7 uses an LED chip with a wavelength of 420nm, and the second LED chip 3 uses an LED chip with a wavelength of 420nm;

[0117] The phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the fourth wavelength phosphor colloid layer 5 that does not contain red phosphor is blue phosphor, and its emission wavelength is 475nm; the phosphor in the fifth wavelength phosphor colloid layer 6 can be green phosphor, and its emission wavelength is 515nm, and the phosphor in the sixth wavelength phosphor colloid layer 8 that does not contain red phosphor has a light-emitting wavelength of 530nm.

[0118] The specific excitation method schematic diagram of this embodiment 3 is as follows Fig. 20 shown.

[0119] The test results of the light efficiency and other parameters of three batches of samples of the light source of this embodiment 3 are shown in the following table:

[0120]

[0121] Conclusion: In this embodiment, the first LED chip 2 uses a violet LED chip with a wavelength of 390-430nm to excite the blue phosphor in the fourth wavelength phosphor colloid layer 5. The blue phosphor in the fourth wavelength phosphor colloid layer 5 is completely covered on the top and around the first LED chip 2. Because only violet light with higher energy than blue light can excite the blue phosphor, the packaging method of this embodiment can greatly improve the excitation efficiency of the violet LED chip to excite the phosphor. At the same time, if the wavelength difference between the first chip, the second chip and the third chip in this embodiment can be met, the light effect can be further improved.

[0122] In addition, the fourth LED chip 15, the first LED chip 2, the third LED chip 7 and the second LED chip 3 on the substrate of this embodiment are not limited to one, nor are they limited to the ratio of the fourth LED chip 15, the first LED chip 2, the third LED chip 7 and the second LED chip 3. The number of each first LED chip 2, the third LED chip 7 and the second LED chip 3 can be adjusted accordingly according to the actual light spectrum requirements. Those skilled in the art should understand that in this embodiment, the wavelengths of the above-mentioned various color phosphors refer to the peak wavelengths.

[0123] Example 4

[0124] In this embodiment, the high color rendering refers to a high light efficiency package, such as Fig.21 As shown, it comprises a support member 1, on which a first LED chip 2, a third LED chip 9 and a second LED chip 3 are arranged, and a red phosphor colloid layer 4 is arranged on at least the top surface of the surface of the second LED chip 3, forming a package body A;

[0125] At least the top surface of the surface of the first LED chip 2 is provided with a seventh wavelength phosphor colloid layer 13 without red phosphor to form a package E; the package A, the third LED chip and the package E are integrally encapsulated in the eighth wavelength phosphor colloid layer 14 without red phosphor; and L7<L8<L 红 , L7 is the wavelength of the phosphor in the seventh wavelength phosphor colloid layer, L8 is the wavelength of the phosphor in the eighth wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

[0126] Those skilled in the art should understand that, generally, the number of the first LED chip 2, the third LED chip 7, and the second LED chip 3 on the substrate is not limited to one, and the number of the first LED chip 2, the third LED chip 7, and the second LED chip 3 can be increased accordingly according to the actual light spectrum requirements, such as Fig. 22 shown.

[0127] For the selection of chip and phosphor colloid layer:

[0128] The wavelength of the first LED chip is λA, λA=390-445nm, the wavelength of the third LED chip is λC, λC=420-465nm, the wavelength of the second LED chip is λB, λB=445-550nm; and 0≤λB-λC≤130nm, 15≤λC-λA≤130nm. Among them, the first LED chip can be a purple LED chip with a wavelength of 390-430nm.

[0129] The phosphor in the seventh wavelength phosphor colloid layer is one or more of indigo phosphor, cyan phosphor and blue phosphor, and L7=470-510nm;

[0130] The phosphor in the eighth wavelength phosphor colloid layer is any one of green phosphor and yellow phosphor or a mixture of the two, and L8=510-590 nm.

[0131] For each of the first, second and third LED chips, a face-up, flip-chip or vertical chip may be used. Preferably, the first LED chip adopts a flip-chip or vertical chip structure, and the second and third LED chips adopt a face-up chip structure.

[0132] As a more specific implementation method: This embodiment takes the filament strip packaged Haidike series high CRI and high light efficiency package as an example for testing, and only the top surface of the second LED chip 3 is provided with a red phosphor colloid layer 4, and only the top surface of the first LED chip 2 is provided with a seventh wavelength phosphor colloid layer 13 without red phosphor. The parameters of the three batches of samples are:

[0133] HDK-S4-1:

[0134] The first LED chip 2 uses an LED chip with a wavelength of 430nm, the third LED chip 7 uses an LED chip with a wavelength of 455nm, and the second LED chip 3 uses an LED chip with a wavelength of 465nm; the phosphor in the red phosphor colloid layer 4 is a red phosphor, and the phosphor in the seventh wavelength phosphor colloid layer 5 is a blue phosphor, and its luminous wavelength is 475nm. The phosphor in the eighth wavelength phosphor colloid layer is a mixed phosphor of green phosphor and yellow phosphor, and its luminous wavelength is 530nm.

[0135] HDK-S4-2:

[0136] The first LED chip 2 uses an LED chip with a wavelength of 430nm, the third LED chip 7 uses an LED chip with a wavelength of 445nm, and the second LED chip 3 uses an LED chip with a wavelength of 445nm; the phosphor in the red phosphor colloid layer 4 is a red phosphor, and the phosphor in the seventh wavelength phosphor colloid layer 5 is a blue phosphor, and its luminous wavelength is 475nm. The phosphor in the eighth wavelength phosphor colloid layer is a mixed phosphor of green phosphor and yellow phosphor, and its luminous wavelength is 530nm.

[0137] HDK-S4-3:

[0138] The first LED chip 2 uses an LED chip with a wavelength of 430nm, the third LED chip 7 uses an LED chip with a wavelength of 430nm, and the second LED chip 3 uses an LED chip with a wavelength of 430nm; the phosphor in the red phosphor colloid layer 4 is a red phosphor, and the phosphor in the seventh wavelength phosphor colloid layer 5 is a blue phosphor, and its luminous wavelength is 475nm. The phosphor in the eighth wavelength phosphor colloid layer is a mixed phosphor of green phosphor and yellow phosphor, and its luminous wavelength is 530nm.

[0139] A schematic diagram of a specific excitation method of the light source in this embodiment is shown in FIG. Fig.23 shown.

[0140] The average values ​​of the test data of the light efficiency and other parameters of the three batches of samples of the light source of Example 4 are as follows:

[0141]

[0142] In this embodiment, the high-cdf high-light-efficiency package adopts a filament strip packaging structure. Of course, in actual applications, the structure of this embodiment can also adopt SMD packaging, COB packaging or CSP packaging according to actual needs. In addition, those skilled in the art should understand that in this embodiment, the wavelengths of the above-mentioned various colors of phosphors refer to the peak wavelengths.

[0143] The high CRI and high light efficiency packages of Examples 1-4 effectively solve the technical problems faced by traditional white light LEDs.

[0144] First, using multiple chips with different wavelengths for excitation can take into account the excitation wavelengths of different phosphors. Figure 4-Figure 9The excitation spectra and emission spectra of different phosphors are given. For 495nm phosphor, when the excitation light wavelength is between 360nm-400nm, the relative excitation efficiency can reach more than 80%. For 518nm, 530nm, and 535nm phosphors, when the excitation light wavelength is between 420nm-470nm, the relative excitation efficiency is more than 80%. For 655 and 660 phosphors, when short-wavelength blue light is used for excitation, although the relative excitation efficiency is high, the Stokes shift is large, and much energy is absorbed by lattice vibration and converted into heat energy. For example: for the same 655nm red light with an excitation photon energy of 1.89eV, when excited by 470nm blue light with a photon energy of 2.61eV, the relative excitation efficiency is 60%, and the photon energy loss is 0.72eV. When excited by 440nm blue light with a photon energy of 2.81eV, the relative excitation efficiency is 70%, and the photon energy loss is 0.92eV. That is, although the excitation efficiency of short wavelength excitation is increased by 10%, the photon energy loss is increased by 28%. Considering that the red light excitation spectrum changes smoothly between 450-500nm, the relative excitation efficiency slowly decreases from 65% to 55%. Therefore, it is more suitable to choose light with a relatively long wavelength of 450-500nm to excite the red phosphor. The unabsorbed excitation light can compensate for the missing blue-green light in the spectrum, and can also be used to excite external yellow or blue-green phosphors to improve the color rendering index.

[0145] Second, the packaging structure of multiple chips with different wavelengths can effectively avoid the secondary absorption of blue-green light by red phosphor, and only a very small amount of blue-green light will irradiate the red phosphor. This is conducive to increasing the blue-green component in the spectrum, thereby improving the color rendering index.

[0146] Third, according to the Stokes shift phenomenon, for the same phosphor, when the wavelength of the excitation light moves, its emission wavelength will also move relatively in the direction of the corresponding wavelength. Therefore, the long-wavelength chip used in the present invention to excite the red phosphor can obtain red light with a longer wavelength, and the short-wavelength chip used to excite the blue-green phosphor can obtain blue-green light with a shorter wavelength, making the spectrum wider, thereby greatly improving the color rendering index. Fig.10 The excitation spectrum and emission spectrum of red phosphors excited by different excitation wavelengths are shown in Figure 2. Fig.10 It can be seen that when short wavelength excitation is used, the luminescence spectrum will also shift to short wavelength. Similarly, when longer wavelength excitation is used, the luminescence spectrum will shift to long wavelength. Therefore, the long wavelength chip used in the present invention to excite the red phosphor will cause the luminescence wavelength to redshift, which is conducive to obtaining a higher color rendering index. The same advantage also exists for blue-green light.

[0147] Fourth, the color temperature is changed by changing the ratio of blue and red chips in the light source. Conventional technology changes the color temperature of the light source by increasing the amount of red and other phosphors in the overall phosphor layer, which will cause the light-emitting surface of the COB package to be dark and turbid. The present invention uses all-red and pink chips to achieve this by changing the number of all-red and pink chips, such as: on the light-emitting surface with a diameter of 12.3mm, a total of 94 LED chips with a size of 14mil×30mil are arranged. When the target light source color temperature is 4000K, the number of all-red and pink chips is 48, and the number of blue chips is 46; when the target light source color temperature is 3000K, the number of all-red and pink chips is 61, and the number of blue chips is 34, that is: the color temperature can be changed by changing the ratio of red chips to blue chips in the light source, unlike the conventional packaging form, which requires the phosphor to be accurately weighed by a high-precision balance, and then the mixed concentration of the red phosphor in the overall packaging layer is changed to achieve the change of color temperature. These two methods of adjusting color temperature can also be observed in appearance. The high color rendering index and high light efficiency light source of the patent of this invention looks clearer, the blue light chip and the red and pink chip are clearly distinguishable, and even the specifications and models of the product can be quickly determined. The color temperature can be changed directly by changing the ratio of the blue and red chips in the light source.

[0148] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A high CRI and high light efficiency package, characterized in that: A support member is provided on which a first LED chip, a third LED chip and a second LED chip are arranged, and a red fluorescent powder colloid layer is provided on at least the top surface of the surface of the second LED chip to form a package body A; A fifth wavelength phosphor colloid layer without red phosphor is disposed on at least the top surface of the surface of the third LED chip to form a package C; a fourth wavelength phosphor colloid layer without red phosphor is disposed on at least the top surface of the surface of the first LED chip to form a package D; the packages A, C and D are integrally encapsulated in a sixth wavelength phosphor colloid layer without red phosphor; And L4<L5<L6<L 红 , L4 is the wavelength of the phosphor in the fourth wavelength phosphor colloid layer, L5 is the wavelength of the phosphor in the fifth wavelength phosphor colloid layer, L6 is the wavelength of the phosphor in the sixth wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

2. The high CRI and high light efficiency package according to claim 1, characterized in that: The wavelength of the first LED chip is denoted as λA, λA=390~445nm, the wavelength of the third LED chip is denoted as λC, λC=420~465nm, and the wavelength of the second LED chip is denoted as λB, λB=445~550nm; and 0≤λB-λC≤130nm, 15≤λC-λA≤130nm.

3. The high CRI and high light efficiency package according to claim 1 or 2, characterized in that: The phosphor in the fourth wavelength phosphor colloid layer is one or more of indigo phosphor, cyan phosphor and blue phosphor, and L4=470-510nm; The phosphor in the fifth wavelength phosphor colloid layer is green phosphor, and L5=510~540nm; The phosphor in the sixth wavelength phosphor colloid layer is any one of green phosphor and yellow phosphor or a mixture of the two, and L6=530-590nm.

4. The high CRI and high light efficiency package according to claim 3, characterized in that: The first LED chip is a violet LED chip with a wavelength of 390-430nm, and the phosphor in the fourth wavelength phosphor colloid layer is a blue phosphor.

5. The high CRI and high light efficiency package according to claim 3, characterized in that: The support member is one of a substrate with a circuit, a bracket with a circuit, or an adhesive film without a circuit.

6. A high CRI and high light efficiency package, characterized in that: A support member is provided on which a first LED chip, a third LED chip and a second LED chip are arranged, and a red fluorescent powder colloid layer is provided on at least the top surface of the surface of the second LED chip to form a package body A; A seventh wavelength phosphor colloid layer without red phosphor is disposed on at least the top surface of the surface of the first LED chip to form a package E; the package A, the third LED chip and the package E are integrally encapsulated in the eighth wavelength phosphor colloid layer without red phosphor; And L7<L8<L 红 , L7 is the wavelength of the phosphor in the seventh wavelength phosphor colloid layer, L8 is the wavelength of the phosphor in the eighth wavelength phosphor colloid layer, L 红 is the wavelength of the red phosphor.

7. The high CRI and high light efficiency package according to claim 6, characterized in that: The wavelength of the first LED chip is denoted as λA, λA=390~445nm, the wavelength of the third LED chip is denoted as λC, λC=420~465nm, and the wavelength of the second LED chip is denoted as λB, λB=445~550nm; and 0≤λB-λC≤130nm, 15≤λC-λA≤130nm.

8. The high CRI and high light efficiency package according to claim 6 or 7, characterized in that: The phosphor in the seventh wavelength phosphor colloid layer is one or more of indigo phosphor, cyan phosphor and blue phosphor, and L7=470-510nm; The phosphor in the eighth wavelength phosphor colloid layer is any one of green phosphor and yellow phosphor or a mixture of the two, and L8=510-590nm.

9. The high CRI and high light efficiency package according to claim 8, characterized in that: The first LED chip is a violet LED chip with a wavelength of 390-430 nm, and the phosphor in the seventh wavelength phosphor colloid layer is a blue phosphor.

10. The high CRI and high light efficiency package according to claim 9, characterized in that: The support member is one of a substrate with a circuit, a bracket with a circuit, or an adhesive film without a circuit.

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