Adapter board and battery assembly

Abstract

The present invention provides an adapter plate and a battery assembly, which relate to the field of battery technology. Among them, the adapter plate includes: a substrate and a conductive sheet; a plurality of vias are provided on the substrate; two or more conductive sheets are provided on the first surface of the substrate, and a via is provided at each of the opposite ends of each conductive sheet; the conductive sheet includes a main body, and a bending portion located at both ends of the length direction of the main body, and the two bending portions are respectively inserted into the vias at both ends of the conductive sheet and connected to the substrate; and plug holes are provided on the substrate at both sides along the width direction of the main body. By forming bending portions at both ends of the conductive sheet, the bending portions are inserted into the vias provided on the substrate and fixed on the substrate, so that there is no need to fix the conductive sheet and the substrate by means of solder paste, thereby effectively avoiding the risk of short circuit caused by the melting of solder paste between the conductive sheet and the substrate during the process of laser welding the pole ear, thereby improving the yield rate.

Description

Technical Field

[0001] The present invention relates to the field of battery technology, and in particular to an adapter plate and a battery assembly. Background Art

[0002] With the popularity of smart terminals such as electric motorcycles, the application of lithium batteries formed by multiple cells connected in series is becoming more and more widespread. In the manufacturing process of lithium batteries, multiple cells are usually connected in series through conductive sheets using an adapter plate. Specifically, the positive and negative pole tabs of different cells are welded together with the same conductive sheet on the adapter plate, so that multiple cells are connected in series to form a lithium battery.

[0003] The existing adapter board includes a substrate, on which a plurality of staggered conductive sheets are mounted by solder paste. The positive electrode tabs and the negative electrode tabs of two adjacent battery cells are welded on a conductive sheet to achieve series conduction. Specifically, the positive electrode tab of one battery cell and the negative electrode tab of the other battery cell are sequentially stacked on the same conductive sheet, and then the three are welded together by laser welding to achieve series conduction between the two adjacent battery cells.

[0004] However, this method of using laser welding to connect the conductive sheet to the tabs of two adjacent battery cells with opposite polarities can easily cause the solder paste used to fasten the conductive sheet and the substrate to melt, and even cause a short circuit. Summary of the invention

[0005] The object of the present invention is to provide an adapter plate and a battery assembly to solve the above-mentioned defects in the prior art, avoid the fastening method of fixing the conductive sheet and the substrate by solder paste in the prior art, and thus effectively avoid the short circuit risk caused by the melting of solder paste during the laser welding of the pole ear.

[0006] In one aspect, the present invention provides a transfer board, characterized in that it comprises: a substrate and a conductive sheet;

[0007] The substrate is provided with a plurality of via holes;

[0008] Two or more conductive sheets are arranged on the first surface of the substrate, and two opposite ends of each conductive sheet are respectively provided with a via hole;

[0009] The conductive sheet includes a main body and bent portions located at two ends of the main body in a length direction, and the two bent portions are respectively inserted into the via holes at two ends of the conductive sheet and connected to the substrate;

[0010] Insertion holes are arranged on the substrate at both sides along the width direction of the main body.

[0011] Optionally, the main body includes a welding area, and the welding area occupies 20%-80% of the area of ​​the main body;

[0012] There is a gap between the welding area and the substrate, and no solder paste is provided on the welding area.

[0013] Optionally, a bottom plate is connected to a second surface of the substrate opposite to the first surface, and a plurality of through slots are provided on the bottom plate; the orthographic projections of each of the conductive sheets and the jacks on both sides thereof on the bottom plate are located in the same through slot.

[0014] Optionally, a terminal end of the bent portion extends out from the via hole and is welded to the substrate by wave soldering, and a welding protrusion is formed at the terminal end of the bent portion.

[0015] Optionally, the through groove is configured to prevent a welding protrusion formed at the end of the bent portion from extending to a side of the bottom plate away from the base plate.

[0016] Optionally, a signal acquisition socket is provided on the first surface of the substrate, and the signal acquisition socket includes a plurality of detection pins, and each of the detection pins is electrically connected to one of the conductive sheets.

[0017] Optionally, a transfer conductive sheet is provided on the first surface of the substrate.

[0018] Optionally, the bottom plate is provided with a conductive sheet avoidance hole and a signal acquisition socket avoidance hole.

[0019] Optionally, the substrate is a PCB board, and the bottom plate is an insulating plate;

[0020] The thickness of the substrate is 1.6-2 mm, and the thickness of the bottom plate is 1.4-2 mm.

[0021] Another aspect of the present invention provides a battery assembly, comprising: a battery assembly composed of a plurality of battery cells and the above-mentioned adapter plate, wherein the tabs of the battery cells pass through the insertion holes on the substrate and are welded to the main body of the conductive sheet.

[0022] The adapter board and battery assembly proposed by the present invention, wherein the adapter board includes: a substrate and a conductive sheet; a plurality of vias are provided on the substrate; two or more conductive sheets are provided on the first surface of the substrate, and a via is provided at each of the opposite ends of each conductive sheet; the conductive sheet includes a main body, and a bending portion located at both ends of the length direction of the main body, and the two bending portions are respectively inserted into the vias at both ends of the conductive sheet and connected to the substrate; and plug holes are provided on the substrate at both sides along the width direction of the main body, and the plug holes are used to insert the battery cell pole ears on both sides of the width direction of the main body. By forming bending portions at both ends of the conductive sheet, the bending portions are inserted into the vias provided on the substrate and fixed on the substrate, so that there is no need to fix the conductive sheet and the substrate by means of solder paste, thereby effectively avoiding the risk of short circuit caused by the melting of solder paste between the conductive sheet and the substrate in the process of welding the pole ears by laser welding, and improving the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0024] Figure 1 is a schematic structural diagram of an adapter board provided in Embodiment 1;

[0025] Figure 2 is a structural schematic diagram of a substrate provided in Example 1;

[0026] Figure 3 is a schematic structural diagram of a conductive sheet provided in Example 1;

[0027] Figure 4 This is a schematic diagram of the structure of an adapter board in a disassembled state provided in Embodiment 1;

[0028] Figure 5 is a front view of a battery cell provided in Example 1;

[0029] Figure 6 is a side view of a battery cell provided in Example 1;

[0030] Figure 7 This is a schematic diagram of the distribution of the cell tabs on the adapter board provided in the first embodiment;

[0031] Figure 8 is a structural schematic diagram of a base plate provided in Example 1;

[0032] Fig. 9 is an exploded view of an adapter plate provided in Embodiment 2;

[0033] Fig.10 A schematic diagram of the structure of a base plate provided in Example 2;

[0034] Fig.11 A front view of an adapter plate provided in Example 2;

[0035] Fig.12 A right side view of an adapter plate provided in Embodiment 2;

[0036] Fig.13 This is a rear view of an adapter plate provided in Example 2.

[0037] Reference numerals:

[0038] 10: adapter plate; 100: substrate; 200: conductive sheet;

[0039] 101: via hole; 201: main body; 202: bending part;

[0040] 102: socket; 300: battery cell; 301: battery cell body;

[0041] 302: battery cell tab; 400: bottom plate; 500: signal acquisition socket;

[0042] 401: perforation; 402: avoidance portion; 403: signal collection socket avoidance hole;

[0043] 404: avoidance hole for transfer conductive sheet; 600: transfer conductive sheet; 2011: welding area.

[0044] The above drawings show clear embodiments of the present disclosure, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present disclosure in any way, but to illustrate the concepts of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0045] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0046] The following specific embodiments are used to describe in detail the technical solution of the present invention and how the technical solution of the present application solves the above technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0047] It should be noted that the terms "first", "second", "front", "back", "up", "down", "bottom", "top", "bottom surface", "top surface", "front", "back", "left" and "right" in the specification, claims and drawings of the present invention indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0048] In the related art, solder paste has always been arranged between the conductive sheet and the substrate to achieve the fixation of the two. However, since the conductive sheet and the electrode of the battery cell need to be connected by laser welding, the temperature of laser welding can easily cause the solder paste to melt, and then flow to the outside of the conductive sheet, and even cause a short circuit. The present solution generally adopts a bending portion arranged at both ends of the conductive sheet, and a via corresponding to the bending portion is arranged on the substrate. During assembly, the bending portion is inserted into the via hole, and then fixed by welding the bending portion and the substrate. In this way, there is no need to arrange solder paste between the conductive sheet and the substrate to fix the conductive sheet on the substrate, which avoids the problem of solder paste melting and flowing out between the conductive sheet and the substrate, and of course avoids the risk of short circuit of the battery, thereby improving the yield rate.

[0049] Embodiment 1

[0050] Figure 1 It is a structural schematic diagram of an adapter board provided in this embodiment. Figure 2 It is a structural schematic diagram of a substrate provided in this embodiment. Figure 3 It is a schematic diagram of the structure of a conductive sheet provided in this embodiment. Figure 4 It is a schematic diagram of the structure of an adapter board in a disassembled state provided in this embodiment. Figure 5 A front view of a battery cell provided in this embodiment. Figure 6 It is a side view of a battery cell provided in this embodiment. Figure 7 This is a schematic diagram of the distribution of battery cell tabs on a transfer board provided in this embodiment. Figure 8 It is a structural schematic diagram of a base plate provided in this embodiment.

[0051] Please refer to Figure 1-Figure 8The adapter board 10 provided in this embodiment includes: a substrate 100 and a conductive sheet 200; a plurality of via holes 101 are arranged on the substrate 100; two or more conductive sheets 200 are arranged on the first surface of the substrate 100, and each of the two opposite ends of the conductive sheet 200 is respectively provided with a via hole 101; the conductive sheet 200 includes a main body 201, and bending portions 202 located at both ends of the main body 201 in the length direction, and the two bending portions 202 are respectively inserted into the via holes 101 at both ends of the conductive sheet 200 and connected to the substrate 100.

[0052] In this embodiment, the plurality of conductive sheets 200 disposed on the substrate 100 are formed as follows: Figure 1 Of course, it should be noted that the plurality of conductive sheets 200 can also be arranged in any other suitable manner to meet the series circuit requirements of the plurality of battery cells, and the plurality of conductive sheets are not limited to Figure 1 The staggered arrangement shown.

[0053] For example, Figure 3 As shown, the conductive sheet 200 includes a main body 201 and a bent portion 202. In this embodiment, the main body 201 is a long strip of conductive sheet, and a bent portion 202 is connected to each of the two ends along the length direction of the long strip of conductive sheet. Exemplarily, the bent portion 202 and the main body 201 may be an integrated structure. For example, in this embodiment, the two ends of the long strip of conductive sheet are bent to the same side at a certain angle to form two bent portions at the two ends of the long strip of conductive sheet. The molding method is simple and the production cost is reduced.

[0054] In one example of the present invention, please continue to refer to Figure 3 The main body 201 is provided with a connection hole, which is used to connect with the clamp. Thus, the clamp is connected to the conductive sheet through the connection hole to clamp the conductive sheet for rack plating, and then nickel is plated on the surface of the conductive sheet to prevent oxidation of the conductive sheet. Moreover, compared with the related art of clamping the conductive sheet with a clamping manipulator, it can avoid the conductive sheet being damaged due to excessive clamping force of the clamping manipulator.

[0055] The shape of the connection hole is not limited to regular shapes such as circle, square, triangle, etc., and can also be an irregular shape as long as it matches the clamp.

[0056] It can be understood that when there is one connection hole, the clamp is inserted into the connection hole to achieve the purpose of taking the conductive sheet; when there are two connection holes, a part of the clamp is inserted into one of the connection holes, and another part of the clamp is inserted into the other connection hole, so that the connection between the clamp and the conductive sheet is more reliable. Of course, in the present invention, there can be more than two connection holes to further improve the reliability of the connection with the clamp.

[0057] Specifically, in this embodiment, the end of the bending portion can extend from the via hole 101 on the substrate and be welded to the substrate 100 by wave soldering, that is, the end of the bending portion passes through the substrate and is welded to the substrate by wave soldering on the back of the substrate. Of course, those skilled in the art can also use other suitable welding methods. This embodiment does not limit the specific welding method for connecting the end of the bending portion with the substrate. The following description takes the welding method of wave soldering as an example to illustrate the connection method between the end of the bending portion and the substrate.

[0058] Specifically, Figure 2 As shown, a plurality of via holes 101 are provided on the substrate 100 at positions for mounting the conductive sheet 200, and the plurality of via holes 101 are used for inserting the plurality of conductive sheets 200; for example, Figure 1 Schematic diagram showing a plurality of conductive sheets on the left and right sides being interlaced and inserted on the substrate 100 along the longitudinal center line.

[0059] For the specific fixing method of the conductive sheet and the substrate, please continue to refer to Figure 2 , each conductive sheet on the substrate 100 is provided with a via 101 at both opposite ends along the length direction, and the bending portions 202 at both ends of the conductive sheet 200 are plugged into the two vias 101 at the corresponding positions of each conductive sheet on the substrate 100 from the front side of the substrate 100, and the ends of the bending portions 202 extend out of the vias at the back side of the substrate 100, so that one conductive sheet 200 is plugged into the substrate 100. Similarly, after the other conductive sheets 200 are plugged into the vias 101 at the corresponding positions on the substrate 100, the ends of the bending portions of the conductive sheets are reliably fixed to the substrate by wave soldering from the back side of the substrate 100. It should be pointed out that this embodiment does not specifically limit the shape of the via 101, and the shape of the via 101 can be adapted to the shape of the bending portion 202 on the conductive sheet 200. At the same time, it is not limited to plugging all the conductive sheets into the vias before performing wave soldering.

[0060] In some possible implementations, such as Figure 4 As shown, the bending portion 202 is perpendicular to the main body 201 . When the bending portions 202 at both ends of the conductive sheet 200 are vertically plugged into the substrate 100 , the main body 201 of the conductive sheet is arranged parallel to the substrate, so that the conductive sheet 200 can be reliably plugged into the substrate 100 .

[0061] Of course, in some other embodiments, the bending portion 202 may be arranged at an obtuse angle or an acute angle with the main body 201 , and those skilled in the art may arrange it according to actual usage requirements.

[0062] The adapter board provided in this embodiment forms bending portions 202 at both ends of the conductive sheet 200, and the bending portions 202 are inserted into the via holes 101 provided on the substrate 100, and then the conductive sheet is fixed to the substrate by wave soldering, and then the adapter board is used to connect multiple cells in series through multiple conductive sheets provided on the substrate. Specifically, the positive and negative tabs of different cells are welded together with the same conductive sheet on the adapter board, so that multiple cells are connected in series to form a battery.

[0063] The substrate is a PCB board. Figure 2 As shown, the substrate 100 may be a rectangular PCB board. Of course, the shape of the PCB board is not limited to a rectangle.

[0064] The substrate 100 includes a first surface and a second surface arranged relative to the first surface (the first surface is set as the front side of the substrate, and the second surface is set as the back side of the substrate). Figure 3 As shown, a plurality of insertion holes 102 for passing the battery cell tabs are arranged on both sides along the width direction of the main body of the substrate 100, and the plurality of insertion holes 102 are all through holes. Specifically, the battery cell tabs are inserted from the back side of the substrate 100 and passed through from the front side of the substrate 100 to realize the insertion of the battery cell tabs on the substrate 100.

[0065] like Figure 5 and Figure 6 As shown, the battery cell 300 provided in this embodiment includes a battery cell body 301 and a battery cell tab 302. The battery cell tab 302 of a battery cell 300 includes a positive electrode tab and a negative electrode tab. Figure 5 and Figure 6 The positive electrode tab and the negative electrode tab of the battery cell 300 may have the same shape and structure, and are symmetrically arranged on the top of the battery cell body 301 about the center of the battery cell body 301. It should be noted that this embodiment is only an exemplary display of the structure of a battery cell 300, and the layout of the positive electrode tab and the negative electrode tab may also be different.

[0066] Figure 2 is a front view of the substrate 100, as shown Figure 2 As shown, the plurality of plug holes 102 provided on the substrate 100 are all long strip through holes, and the plurality of long strip through holes are arranged in an array on the substrate 100. For example, Figure 2FIG. 4 schematically shows that seven rows of long strip through holes are distributed along the short sides of the rectangular substrate, and two columns of long strip through holes are distributed along the long sides of the rectangular substrate.

[0067] Please continue to refer to Figure 1 , Figure 2 , Figure 5 and Figure 6 , for example, the battery cell 300 as a whole can be a plate-shaped structure. When inserting the battery cell 300 on the substrate 100, the battery cell 300 is first placed on the back of the substrate 100, and then the two battery cell tabs 302 on the battery cell 300 are respectively inserted into the two long strip-shaped through holes arranged in parallel along the horizontal direction on the substrate 100, and the two battery cell tabs 302 extend from the front of the substrate 100, so that one battery cell 300 is inserted on the substrate 100. The insertion method of other battery cells is similar to the above and will not be repeated.

[0068] Specifically, the multiple battery cells 300 inserted on the substrate 100 are connected in series through multiple conductive sheets arranged on the substrate 100. For example, in this embodiment, Figure 1 As shown, a plurality of conductive sheets 200 are staggered on the front side of the substrate 100, each conductive sheet serves as a conductive element on the adapter plate for electrically connecting two adjacent battery cells, and the plurality of conductive sheets 200 staggered on the substrate 100 are used for series electrical connection of a plurality of battery cells.

[0069] For example, Figure 1 It is shown that the conductive sheets on the left and right sides are staggered along the longitudinal center line of the substrate, and holes 102 are set on the substrate at both sides along the width direction of each conductive sheet. The multiple holes 102 are used to insert the pole ears of multiple battery cells from the back side of the substrate. The specific insertion method of the battery cells is to insert the two battery cell pole ears with opposite polarities in two adjacent battery cells on both sides of the same conductive sheet, and stack the positive pole ear of one battery cell and the negative pole ear of the other battery cell in sequence on the same conductive sheet, and then weld the three together by laser welding to achieve series conduction between the two adjacent battery cells, thereby achieving series conduction of multiple battery cells.

[0070] According to the principle of circuit series connection, it is exemplified here that the state of multiple battery cells connected in series is: the negative pole ear of the first battery cell is connected to the positive pole ear of the second battery cell, the negative pole ear of the second battery cell is connected to the positive pole ear of the third battery cell, and so on. Assuming that the total number of battery cells is N, then the negative pole ear of the N-1th battery cell is connected to the positive pole ear of the Nth battery cell. When the N battery cells are connected in series, the positive pole ear of the first battery cell and the negative pole ear of the Nth battery cell serve as the positive terminal and negative terminal after the N battery cells are connected in series. It should be noted here that the total number of battery cells can be two or more than two. This embodiment does not specifically limit the total number of battery cells, and those skilled in the art can set it according to actual needs.

[0071] For example, according to the above circuit series connection principle, the position of the battery cell tabs inserted on the adapter board is described as follows: for example, Figure 7 Schematically shows that three rows of plug holes 102 are distributed along the short side of the rectangular substrate, and two columns of plug holes 102 are distributed along the long side of the rectangular substrate. The two plug holes 102 arranged in each row on the substrate 100 are used to plug in two battery cell tabs of a battery cell. For example, in some embodiments, Figure 7 As shown, assuming that the sockets on the substrate 100 from top to bottom are respectively the first row of sockets, the second row of sockets and the third row of sockets, and are respectively used to insert the first battery cell, the second battery cell and the third battery cell, the positions of the two tabs of each battery cell are distributed as follows: the left side socket of the first row of sockets is used to insert the positive tab of the first battery cell ( Figure 7 The right side jack of the first row of jacks is used to insert the negative electrode tab of the first battery cell ( Figure 7 - is used as a symbol in the middle); the left side of the second row of sockets is used to insert the negative electrode tab of the second battery cell, and the right side of the second row of sockets is used to insert the positive electrode tab of the second battery cell; the left side of the third row of sockets is used to insert the positive electrode tab of the third battery cell, and the right side of the third row of sockets is used to insert the negative electrode socket of the third battery cell. In this way, three battery cells are inserted on the substrate.

[0072] At this time, a conductive sheet 200 is installed between the negative electrode tab of the first battery cell and the positive electrode tab of the second battery cell, and the negative electrode tab of the first battery cell and the positive electrode tab of the second battery cell are both folded and pressed on the main body of the conductive sheet located between the two. Figure 1 and Figure 3 As shown, the main body includes a welding area 2011, and the welding area 2011 on the main body is located in the middle of the main body. Specifically, the negative pole ear of the first battery cell and the positive pole ear of the second battery cell are both folded and pressed on the welding area 2011 of the main body of the conductive sheet located between the two, that is, the position of the main body where the negative pole ear of the first battery cell and the positive pole ear of the second battery cell are folded and superimposed on the conductive sheet is the pole ear welding area, and then the three are welded together by laser welding to realize the conduction between the negative pole ear of the first battery cell and the positive pole ear of the second battery cell, that is, to realize the series conduction between the first battery cell and the second battery cell. It should be noted that the welding area on the main body is not provided with solder paste. When the structure after the two pole ears are superimposed is welded by laser welding, the temperature of the welding area 2011 on the main body is increased to melt, so that the negative pole ear of the first battery cell and the positive pole ear of the second battery cell are welded and fixed to conduct. Similarly, the conduction method of other two adjacent battery cells on the substrate is similar to the above and will not be repeated here.

[0073] Of course, in some other possible implementations, there may be a gap between the welding area of ​​the main body and the substrate, that is, when laser welding is performed on the structure in which the two tabs are stacked on the upper tab welding area of ​​the main body, the temperature of the welding area on the main body rises to melting, thereby fixing and connecting the negative tab of the first battery cell and the positive tab of the second battery cell. A gap may be provided between the welding area of ​​the main body and the substrate, thereby avoiding the risk of excess conductive liquid melted in the welding area on the main body flowing onto the substrate, causing other copper circuits on the substrate to be connected, thereby avoiding the risk of short circuit of the battery and improving the yield rate.

[0074] Optionally, the gap value between the welding area of ​​the main body and the substrate is 5-50 mm. For example, in some embodiments, the gap value between the welding area and the substrate can be 5 mm; in some other embodiments, the gap value between the welding area and the substrate can be 20 mm; in some more embodiments, the gap value between the welding area and the substrate can be any one of 5, 8, 10, 12, 16, 18, 25, 30, 35, 40, 45, and 50 mm. This embodiment does not specifically limit the gap value between the welding area and the substrate.

[0075] It should be noted that the welding area on the main body accounts for 20%-80% of the area of ​​the main body, that is, when the size of the tab of the battery cell is large, the area of ​​the welding area on the main body can be increased so that the welding area can have enough conductive liquid under the action of high temperature to ensure that the two tabs to be welded can be fully conductive; similarly, if the tab size of the battery cell is small, the area of ​​the welding area on the main body can be reduced to avoid excessive conductive liquid flowing out due to melting of the welding area when using laser welding. For example, in some embodiments, the welding area can account for 20% of the area of ​​the main body; in other embodiments, the welding area can account for 80% of the area of ​​the main body; for example, in other embodiments, the welding area can account for any ratio of 20%-80% of the area of ​​the main body, such as 25%, 30%, 35%, 40%, 42%, 52%, 60%, 65%, 70%, 75%, and those skilled in the art can set it according to the specific usage.

[0076] Furthermore, the back side of the substrate 100 is fastened with a bottom plate, which is an insulating plate and plays a role in enhancing the overall strength of the adapter plate. Figure 8 As shown, the bottom plate 400 is provided with a plurality of through slots, which may all be rectangular through holes, and the orthographic projections of each conductive sheet arranged on the substrate and the jacks on both sides thereof on the bottom plate are all located in the same through slot.

[0077] Please continue to refer to Figure 8The through groove includes a through hole 401 and an avoidance portion 402, wherein the through hole 401 is used to allow the battery cell tab to pass through. It should be understood that the through hole 401 corresponds to the position of the plug hole 102 opened on the substrate 100 one by one, that is, after the bottom plate and the substrate are fastened together, the through hole 401 coincides with the plug hole 102 on the substrate, and together form a through hole for inserting the battery cell tab, so that the battery cell tab is inserted into the adapter plate composed of the substrate and the bottom plate.

[0078] For example, when a cell is inserted into the adapter board formed by fastening the back of the substrate with the bottom plate, the cell is first placed on the back of the bottom plate, and the two cell tabs on the cell pass through the through hole 401 on the bottom plate and the plug hole 102 on the substrate in sequence, and the ends of the cell tabs extend from the front of the substrate, so that the cell is inserted into the adapter board. The way of inserting other cells into the adapter board is similar to the above, and will not be repeated.

[0079] In some possible implementations, the shape of the bottom plate is consistent with the outer contour of the base plate, and the bottom plate can be made of an epoxy board commonly used in the art, which is economical and reduces costs.

[0080] Furthermore, in this embodiment, the bottom plate can be fixed to the back of the base plate by pasting, and the fixing method is simple and easy to operate. It should be noted that this embodiment does not specifically limit the fixing method between the bottom plate and the base plate, and those skilled in the art can adopt any feasible and standard-compliant fastening method, which will not be described one by one in this embodiment.

[0081] In this embodiment, the bent portions 202 at both ends of the conductive sheet are inserted into the vias 101 from the front side of the substrate, and the ends of the bent portions 202 extend from the back side of the substrate. Wave soldering is used to fix the ends of the bent portions 202 to the substrate on the back side of the substrate. After wave soldering, welding protrusions are formed at multiple locations on the back side of the substrate. The through grooves are configured to prevent the welding protrusions formed at the ends of the bent portions 202 from extending to the side of the bottom plate away from the substrate.

[0082] Specifically, Figure 8 As shown, the soldering protrusion formed on the back of the substrate is avoided by the avoidance portion 402 provided on the through groove on the bottom plate, that is, the soldering protrusion formed on the back of the substrate after wave soldering is accommodated in the avoidance portion 402 in the middle of the through groove on the bottom plate, so that the soldering protrusion formed on the back of the substrate after wave soldering does not extend out of the side of the bottom plate away from the substrate, that is, the soldering protrusion formed on the back of the substrate after wave soldering does not extend out of the bottom surface of the bottom plate. In this way, the planarization of the back of the adapter board is achieved, the structure of the adapter board is standardized, and the use and packaging of the adapter board are facilitated. It should be noted that the accommodating depth of the through groove on the bottom plate must be at least greater than the height of the soldering protrusion formed on the back of the substrate.

[0083] Furthermore, the thickness of the substrate is 1.6-2mm, and the thickness of the bottom plate is 1.4-2mm. For example, in this embodiment, a transfer plate is formed by pasting a substrate with a thickness of 1.6mm and a bottom plate with a thickness of 1.4mm; for another example, in other embodiments, a transfer plate is formed by fixing a substrate with a thickness of 2mm and a bottom plate with a thickness of 2mm; for another example, in some more embodiments, the thickness of the substrate can also be any one of 1.68, 1.7, 1.8, 1.9, and 1.95mm, and the thickness of the bottom plate can be any one of 1.5, 1.6, 1.65, 1.7, 1.8, and 1.9mm. In this embodiment, the thickness of the substrate and the bottom plate is not specifically limited.

[0084] The adapter board 10 proposed in this embodiment includes: a substrate 100 and a conductive sheet 200; a plurality of via holes 101 are arranged on the substrate 100; two or more conductive sheets 200 are arranged on the first surface of the substrate 100, and a via hole 101 is respectively arranged at two opposite ends of each conductive sheet 200; the conductive sheet 200 includes a main body 201, and a bending portion 202 located at both ends of the length direction of the main body 201, and the two bending portions 202 are respectively inserted into the via holes 101 at both ends of the conductive sheet 200 and connected to the substrate 100; plug holes 102 are arranged on the substrate 100 at both sides along the width direction of the main body 201, and the plug holes 102 are used to insert battery cell pole ears on both sides of the width direction of the main body 201. That is to say, by forming a bending portion 202 at both ends of the conductive sheet, the bending portion 202 is inserted into the via 101 set on the substrate, and then the end of the bending portion is welded to the back side of the substrate by wave soldering, thereby eliminating the need to fix the conductive sheet 200 and the substrate 100 by means of solder paste, thereby effectively avoiding the risk of short circuit caused by the melting of solder paste between the conductive sheet and the substrate during the laser welding of the pole ear, thereby improving the yield rate.

[0085] Embodiment 2

[0086] Fig. 9 It is an exploded view of an adapter board provided in this embodiment. Fig.10 A schematic structural diagram of a base plate provided in this embodiment. Fig.11 This is a front view of an adapter plate provided in this embodiment. Fig.12 This is a right side view of an adapter plate provided in this embodiment. Fig.13 This is a rear view of an adapter plate provided in this embodiment. Figure 9-13 In combination with the above embodiments, this embodiment proposes an improved adapter plate.

[0087] For example, in this embodiment, Fig. 9 , Fig.11 and Fig.12 As shown, a signal acquisition socket 500 is also provided on the front of the adapter board. The signal acquisition socket 500 includes a positive pin and a negative pin. The positive pin is electrically connected to the positive end of the multiple battery cells connected in series, and the negative pin is electrically connected to the negative end of the multiple battery cells connected in series, so that the signal acquisition socket is connected in parallel at both ends of the multiple battery cells connected in series. When the multiple battery cells connected in series are powered on, the positive pin and the negative pin of the signal acquisition socket 500 are used to collect the total voltage of the multiple battery cells connected in series. Exemplarily, the signal acquisition socket can also be connected to the power management system for communication, and the total voltage of the multiple battery cells connected in series is displayed and monitored in real time through the power management system. If the total voltage collected on the power management system is within the theoretical normal voltage range of the multiple battery cells connected in series, it is judged that the multiple battery cells connected in series are in a normal charging or discharging state, otherwise it is judged that the working state of the multiple battery cells is abnormal and battery maintenance is required.

[0088] For example, in this embodiment, Fig.11 As shown, the signal acquisition socket 500 can adopt a pin header signal acquisition socket commonly used by those skilled in the art, wherein the pin header signal acquisition socket is fixed on the substrate 100 by a fixing method commonly used by those skilled in the art. For example, in this embodiment, a boss is provided on the bottom surface of the pin header signal acquisition socket, and a mounting hole for mounting the boss is provided on the substrate. The boss is inserted into the mounting hole from the front of the substrate, and the end of the boss extends from the back of the substrate. Wave soldering is used on the back of the substrate to weld the end of the boss at the bottom of the signal acquisition socket to the substrate, so that the pin header signal acquisition socket is reliably fixed on the substrate. Of course, the fixing method of the signal acquisition socket and the substrate is not limited to this.

[0089] Exemplarily, one of the pins on the pin header signal acquisition socket can be used as the positive pin, and the other pin on the pin header signal acquisition socket can be used as the negative pin. By setting a conductive copper sheet on the substrate, the pin header representing the positive pin on the signal acquisition socket is electrically connected to the positive ends of multiple series-connected battery cells, and the pin header representing the negative pin is electrically connected to the negative ends of multiple series-connected battery cells. In this way, the pin header signal acquisition socket is electrically connected to the positive and negative ends of the multiple series-connected battery cells.

[0090] Further, such as Fig.11 As shown, a transfer conductive sheet 600 is also connected to the front side of the substrate. For example, the transfer conductive sheet 600 can be a rectangular conductive sheet. Specifically, in this embodiment, the transfer conductive sheet is fixed to the substrate in the same fixing method as the conductive sheet, which will not be repeated here. Of course, the transfer conductive sheet can also be fixed to the substrate in any other suitable fixing method, which will not be listed here one by one.

[0091] For example, please refer to Fig.11A transfer conductive sheet 600 is respectively provided at both ends of the signal acquisition socket 500. The positive pin and the negative pin of the pin header signal acquisition socket can be electrically connected to the two transfer conductive sheets 600 located at both ends of the pin header signal acquisition socket through the copper sheet laid on the substrate. At the same time, the two transfer conductive sheets 600 can be electrically connected to the positive end and the negative end of the multiple series-connected battery cells through wires. In this way, the positive pin and the negative pin of the signal acquisition socket are respectively connected to the positive end and the negative end of the multiple series-connected battery cells through a transfer conductive sheet.

[0092] Furthermore, the signal acquisition socket 500 may also include a plurality of detection pins, each detection pin being electrically connected to a conductive sheet 200. For example, in the present embodiment, a pin header signal acquisition socket is used as the signal acquisition socket, and a plurality of pin headers of the pin header signal acquisition socket can be used as a plurality of detection pins. At the same time, a plurality of pin headers are respectively connected to a plurality of conductive sheets arranged on the substrate through a copper conductive circuit arranged on the circuit, so that each conductive sheet on the substrate is respectively connected to a plurality of pin headers of the pin header signal acquisition socket, that is, both ends of a single battery cell are electrically connected to the signal acquisition socket. When a plurality of battery cells connected in series are powered on, the signal acquisition socket can collect the voltage of a single battery cell through a pin header representing a plurality of detection pins, and then display the voltage of a single battery cell in real time through a power management system connected to the signal acquisition socket in communication. If the voltage value of a single battery cell collected by the power management system is within the calculated voltage theoretical value range, it is judged that the single battery cell is in a normal charging or discharging state, otherwise it is judged that the working state of the single battery cell is abnormal and battery cell maintenance is required.

[0093] Exemplarily, the adapter conductive sheet and signal acquisition socket on the adapter board can be first inserted into the preset mounting holes on the substrate from the front side of the substrate, and then the adapter conductive sheet, signal acquisition socket and other components can be fixed to the substrate by uniformly using wave soldering on the back side of the substrate. At the same time, multiple welding protrusions are formed on the back side of the substrate.

[0094] Furthermore, in this embodiment, if Fig.10 and Fig.13 As shown, a signal acquisition socket avoidance hole 403 is provided on the base plate 400, and the signal acquisition socket avoidance hole 403 is used to accommodate the welding protrusion formed by the signal acquisition socket on the back side of the substrate. The shape of the signal acquisition socket avoidance hole 403 should be adapted to the structure of the welding protrusion formed by the signal acquisition socket on the back side of the substrate.

[0095] For example, Fig.10As shown, the bottom plate 400 is also provided with transfer conductive sheet avoidance holes 404 for accommodating the soldering protrusions formed by the transfer conductive sheet on the back of the substrate. The number and position of the transfer conductive sheet avoidance holes 404 correspond to the number and position of the transfer conductive sheet on the circuit board. By providing the signal acquisition socket avoidance holes and the transfer conductive sheet avoidance holes on the bottom plate, the soldering protrusions formed by each electronic component on the back of the substrate are accommodated in the avoidance holes, and the planarization of the back of the transfer board is achieved, so that the structure of the transfer board is standardized, and the use and packaging of the transfer board are facilitated.

[0096] The adapter board 10 proposed in this embodiment includes: a substrate 100 and a plurality of vias 101 provided on the substrate 100, a plurality of conductive sheets 200 are staggeredly inserted on the front surface of the substrate 100 through the plurality of vias 101, each conductive sheet 200 includes a main body 201 and a bending portion 202 located at both ends of the main body 201, the two bending portions 202 are respectively inserted into the vias 101 at both ends of the conductive sheet, and the ends of the bending portions 202 extend from the vias 101 and are connected to the substrate 100. That is to say, by forming bending portions at both ends of the conductive sheet, the bending portions are inserted into the vias provided on the substrate, and then the ends of the bending portions are welded to the back surface of the substrate by wave soldering, so that there is no need to fix the conductive sheet and the substrate by solder paste, thereby effectively avoiding the risk of short circuit caused by melting of solder paste, and improving the yield rate.

[0097] This embodiment also provides a battery assembly, a battery assembly composed of multiple battery cells and the above-mentioned adapter plate 10, wherein the tabs of the battery cells pass through the insertion holes on the substrate and are welded to the main body of the conductive sheet. By inserting multiple battery cells into the adapter plate in the above-mentioned installation method, and then welding the positive tabs and negative tabs of different battery cells to the same conductive sheet on the adapter plate, multiple battery cells are connected in series to form a battery assembly.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An adapter plate (10), It is characterized in that include: A substrate (100) and a conductive sheet (200); The substrate (100) is provided with a plurality of via holes (101); More than two conductive sheets (200) are arranged on the first surface of the substrate (100), and each of the conductive sheets (200) is provided with a via hole (101) at two opposite ends thereof; The conductive sheet (200) comprises a main body (201) and bent portions (202) located at two ends of the main body (201) in a length direction, the two bent portions (202) being respectively inserted into the via holes (101) at two ends of the conductive sheet (200) and connected to the substrate (100); Insertion holes (102) are provided on the substrate at two sides along the width direction of the main body; The main body (201) comprises a welding area (2011), a gap is provided between the welding area (2011) and the substrate (100), and the welding area (2011) is not provided with solder paste, and the value of the gap between the welding area (2011) and the substrate (100) is 5-50 mm; A bottom plate (400) is connected to a second surface of the substrate (100) opposite to the first surface, and a plurality of through slots are provided on the bottom plate (400); the orthographic projections of each conductive sheet (200) and the jacks (102) on both sides thereof on the bottom plate (400) are located in the same through slot; The end of the bent portion (202) extends out from the via hole (101) and is welded to the substrate (100), and a welding protrusion is formed at the end of the bent portion (202); The through groove is configured to prevent the welding protrusion formed at the end of the bent portion (202) from extending to a side of the bottom plate away from the base plate.

2. The adapter plate (10) according to claim 1, It is characterized in that The welding area (2011) accounts for 20%-80% of the area of ​​the main body (201).

3. The adapter plate (10) according to claim 1, It is characterized in that The end of the bent portion (202) extends out from the via hole (101) and is welded to the substrate (100) by wave soldering.

4. The adapter plate (10) according to any one of claims 1 to 3, It is characterized in that A signal acquisition socket (500) is provided on the first surface of the substrate (100), and the signal acquisition socket (500) comprises a plurality of detection pins, each of the detection pins being electrically connected to one of the conductive sheets (200).

5. The adapter plate (10) according to claim 4, It is characterized in that A transfer conductive sheet (600) is provided on the first surface of the substrate (100).

6. The adapter plate (10) according to claim 5, It is characterized in that The bottom plate (400) is provided with a conductive sheet avoidance hole (404) and a signal collection socket avoidance hole (403).

7. The adapter plate (10) according to claim 6, It is characterized in that The substrate (100) is a PCB board, and the bottom plate (400) is an insulating board; The thickness of the substrate (100) is 1.6-2 mm, and the thickness of the bottom plate (400) is 1.4-2 mm.

8. A battery assembly, It is characterized in that include: A battery cell assembly consisting of a plurality of battery cells and the adapter plate (10) according to any one of claims 1 to 7, wherein the tabs of the battery cells pass through the insertion holes on the substrate and are welded to the main body of the conductive sheet.

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