40results about "Dielectric characteristics" patented technology

A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 10×10−6 / ° C. to 16×10−6 / ° C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point.

Disclosed is a flexible ultrasonic transducer in which a single layer serves dual function as both a matching layer and a flexible circuit for making electrical connections, and there is no separate matching layer. Also disclosed is a method of assembling the flexible transducer.

To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate.An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm.

A display device includes a substrate on which a plurality of pixels are arranged and a circuit for displaying images with respect to each pixel is formed, a substrate terminal as a terminal formed on the substrate, and an electronic component terminal as a terminal of an electronic component electrically connected to the terminal via an anisotropic conductive film. A conductive region that conducts to the anisotropic conductive film in the substrate terminal has a light transmissive part in which a material having light transmissivity penetrates the substrate surface in a perpendicular direction.

This present disclosure generally relates to systems and methods of electrophoretic deposition (EPD) techniques for use in insulation systems at least partially encapsulating a semiconductor device, a conductive component and a substrate, such as insulation systems of semiconductor devices, busbars, or the like. Insulation systems formed using EPD processes may be designed to have a dielectric constant that decreases in a direction away from a substrate of the insulation system. This may improve insulation technologies since depositing coatings with sequentially arranged dielectric constants may improve resistance of the insulation system to high temperature, high electric fields, or the like.

The invention relates to a power semiconductor module. According to one example of the invention, the power semiconductor module has a circuit board with a structured first metal structure and at least one second metal structure arranged on the upper side of the circuit board. At least one housingless semiconductor chip is arranged on the top side of the circuit board, the semiconductor chip has a plurality of contact electrodes, which in turn are connected to corresponding contact pads of the first metal structure on the top side of the circuit board via bonding wires connect. During operation, the contact electrodes and the corresponding first part of the contact lugs are connected to a high voltage. All high-voltage-connected contact lugs are electrically conductively connected to the second metal structure via inner-layer connections. The insulating layer completely covers the chip and the separation area of ​​the circuit board surrounding the chip, wherein all contact pads and inner layer connections for high-voltage switching are completely covered by the insulating layer. The plurality of contact electrodes and the corresponding second portion of the contact pads are at a low voltage during operation.