39results about "Dielectric characteristics" patented technology

An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and a first group of conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first group of one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first group of conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

A wiring substrate includes an insulating layer, a pad, and a solder resist layer. The insulating layer has a first surface formed with a first recess portion. The pad is embedded in the first recess portion. The pad includes a second surface and a third surface. The third surface that is located at a lower position than the first surface so as to expose an inner wall surface of the first recess portion. The pad is formed with a second recess portion in a center portion of the third surface. The solder resist layer is provided on the first surface. An adjacent portion of the first surface to a peripheral portion of the first recess portion is smaller in roughness than a region of the first surface peripheral to the adjacent portion of the first surface.

A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

A boron nitride/resin composite circuit board having high heat dissipation characteristics and high relyability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.

Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O₂, N₂O, NO₂, H₂, NH₃, N₂, SiF₄ and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiO_xH_yC_zF_aN_b. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

The present invention concerns a backplane electronic board (20) having on inner face (142) suitable for bein g connected to electronic board connectors (12) and an outer face (143) suitable for being connected lo an outer connector (15), the backplane board (20) being characterised in that it has blind holes opening on ihe inner face (142) of some, and holes opening on the outer face (143) of same, the holes being suitable for receiving press-fit connection elements and forming therewith an electrical connection point.

Disclosed herein are a printed circuit board and a method of manufacturing the same.

The printed circuit board according to a preferred embodiment of the present invention may include: an insulating layer; a first via depressed from one surface of the insulating layer; a second via depressed from the other surface of the insulating layer; and a circuit pattern formed in the insulating layer and bonded to the first and second vias.

The invention relates to a laser printing method comprising the following steps: (a) providing a receiving substrate (4); (b) providing a target substrate (5) including a transparent substrate (50), one face of which has a coating (51) formed by a solid metal film; (c) locally irradiating the film (51) through the transparent substrate (50) using a first laser (8) in order to reach the melting point of the metal in a target zone of the film that is in liquid form; (d) irradiating the liquid film through the transparent substrate using a second laser on the target zone defined in step (c), in order to form a liquid jet in the target zone and to eject same from the substrate in the form of molten metal; (e) depositing a drop of molten metal on a defined receiving zone of the receiving substrate, the drop solidifying as it cools.

A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition having excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz); and wherein the composition comprises (A) a photopolymerizable prepolymer; (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent.

The invention discloses a preparation method of a PCB and the PCB, and the method comprises the steps: setting a first hole ring in a preset hole opening region of a specified core board; first water-absorbent resin is arranged on the face, away from the designated core plate, of the first hole ring; sequentially stacking the first core board or the first copper layer, the second water-absorbent resin, the second core board and the specified core board and then laminating to form a multi-layer board; a hole is drilled in a preset hole opening area corresponding to the multi-layer board, and through holes are formed in the multi-layer board; performing chemical copper deposition on the multi-layer board so as to enable the first water-absorbent resin and the second water-absorbent resin to absorb water, depositing a conductive layer on the hole wall of the through hole, and drying the multi-layer board; disconnecting the third conductive section from the second conductive section; or disconnecting the third conductive section from the second conductive section, and disconnecting the first conductive section from the second conductive section. The technical scheme of the invention provides the PCB preparation method capable of completely eliminating the influence of the stub on signal transmission.

The invention relates to a circuit support for an electronic circuit, comprising: - at least one conductor path (22); - an insulating matrix made of a first insulating material (17) that is injection-molded over the at least one conductor path (22) in such a way as to leave open at least one first region (15) for connecting at least one electronic component (14) of the electronic circuit; - and aheat sink (18); the first insulating material (17) is injection-molded over the at least one conductor path (22) in such a way that the insulating matrix (16) also leaves open at least one second region (34) located between the conductor path (22) and the heat sink (18); the circuit support further comprises a plurality of spacers (28; 36) which are designed and placed in such a way as to adjust aheight (h1) of the second region (34) between the conductor path (22) and the heat sink (18); the circuit support also comprises a second insulating material (24) with which the second region (34) isfilled. The invention further relates to a method for manufacturing said type of circuit support for an electronic circuit.

Different kinds of printing pastes or inks are utilized in various combinations to develop multiple ceramic dielectric layers on graphitic substrates in order to create effective dielectric ceramic layers that combine good adhesion to both graphitic substrates and printed copper traces, and strong insulating capability. The pastes or inks may comprise a high thermal conductivity powder.