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Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate

A technology of circuit substrate and boron nitride, which is applied in the direction of circuit substrate material, circuit thermal device, printed circuit dielectric, etc. stress, etc.

Active Publication Date: 2016-03-30
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of boron nitride in the in-plane direction (a-axis direction) is 100 W / (m K), while the thermal conductivity in the thickness direction (c-axis direction) is 2 W / (m K), due to the crystal structure and large anisotropy of the thermal conductivity of the scale shape
Therefore, for example, when manufacturing a thermal interface material, the in-plane direction (a-axis direction) of boron nitride particles becomes perpendicular to the thickness direction of the thermal interface material, and the in-plane direction (a-axis direction) of boron nitride particles cannot be fully utilized. high thermal conductivity
On the other hand, by making the in-plane direction (a-axis direction) of boron nitride particles parallel to the thickness direction of the thermal interface material, high thermal conductivity in the in-plane direction (a-axis direction) of boron nitride particles can be achieved, but List the disadvantages of not being able to withstand stress in the thickness direction

Method used

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  • Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
  • Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
  • Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-11～1-13

[0180] The obtained boron nitride sintered body was impregnated with resin. A mixture of boron nitride sintered body, epoxy resin ("Epikote807" manufactured by Mitsubishi Chemical Corporation) and curing agent ("AkuMexH-84B" manufactured by Nippon Gosei Chemical Co., Ltd.) was degassed in a vacuum at a pressure of 70 Pa for 20 minutes, and then The epoxy resin mixture was injected into the boron nitride sintered body under vacuum and impregnated for 30 minutes. Thereafter, nitrogen gas was used to pressurize at a pressure of 3 MPa and a temperature of 120° C. for 30 minutes to impregnate and cure the resin to obtain a boron nitride-resin composite.

Embodiment 1-14

[0182] The boron nitride sintered body and silicone resin (manufactured by "YE5822" Momentive Performance Materials Inc.) were degassed in vacuum at a pressure of 70 Pa for 20 minutes, and then the silicone resin was injected into the boron nitride sintered body under vacuum for 30 minutes. Seep. Thereafter, nitrogen gas was used to pressurize at a pressure of 3 MPa and a temperature of 20° C. for 30 minutes to impregnate the resin, and to heat in a drier at a temperature of 150° C. for 60 minutes to obtain a boron nitride-resin composite.

[0183] The resulting resin-impregnated boron nitride sintered body was processed using a multi-wire saw. At this time, boron nitride particles are cut out so that the 002 plane (c-axis) is oriented in the thickness direction. The evaluation results of the obtained boron nitride sintered body are shown in Tables 1-5.

[0184] [Table 1-5]

[0185]

[0186]

[0187] On the obtained plate-shaped resin-impregnated boron nitride sintered...

Embodiment 2-1

[0201]

[0202] The obtained boron nitride sintered bodies 2A to 2N were impregnated with resin. A mixture of boron nitride sintered body, epoxy resin, and curing agent (manufactured by "BondE205" Konishi Co., Ltd.) was degassed for 10 minutes in a vacuum at a pressure of 1 mmHg, and then injected into the boron nitride sintered body under vacuum, The impregnation was carried out for 20 minutes. Thereafter, heating was performed at a temperature of 150° C. for 60 minutes under atmospheric pressure to cure the resin, thereby obtaining a resin-impregnated boron nitride sintered body with a thickness of 100 mm.

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Abstract

Provided is a boron nitride / resin composite circuit board which has high heat radiation properties and high reliability. The boron nitride / resin composite circuit board is characterized by comprising: a platy resin-impregnated sintered boron nitride object which has a plate thickness of 0.2-1.5 mm and comprises 30-85 vol% sintered boron nitride object in which boron nitride particles having an average major-axis length of 5-50 [mu]m have been three-dimensionally bonded and 70-15 vol% resin; and a metal circuit constituted of copper or aluminum and bonded to each of both main surfaces of the sintered object. The circuit board is further characterized in that the ratio of the coefficient of thermal linear expansion (CTE1) at 40-150 DEG C in the plane direction of the resin-impregnated sintered boron nitride object to the coefficient of thermal linear expansion (CTE2) at 40-150 DEG C of the metal circuit, CTE1 / CTE2, is 0.5-2.0.

Description

technical field [0001] The present invention relates to a circuit board having both heat dissipation characteristics and excellent heat cycle resistance characteristics. Background technique [0002] In heat-dissipating electronic components such as power devices, double-sided cooling transistors, thyristors, and CPUs, how to effectively dissipate the heat generated during use has become an important issue. Conventionally, such heat dissipation measures have generally been carried out: (1) high thermal conductivity of the insulating layer of the printed circuit board on which the exothermic electronic component is mounted; The printed circuit board of the electronic component is mounted on the heat sink via an electrically insulating thermal interface material (Thermal Interface Materials). As the insulating layer and thermal interface material of the printed circuit board, a heat dissipation member obtained by adding ceramic powder to silicone resin or epoxy resin and curi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03C04B35/583C04B41/83H05K1/02
CPCH05K1/0306H05K1/0353H05K3/022H05K3/38C08K7/00C08K2003/385C08K2201/004H05K1/0203H05K1/0271H05K1/0373H05K1/09H05K2201/0104H05K2201/066
Inventor 广津留秀树野中脩平光永敏胜五十岚厚树宫田浩司西太树井之上纱绪梨小林文弥
Owner DENKA CO LTD
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