Circuit support for an electronic circuit, and method for manufacturing a circuit support of said type

A circuit carrier, electronic circuit technology, applied in printed circuit manufacturing, printed circuit dielectrics, printed circuits, etc., can solve problems such as adverse cost effects, material loss, limited heat dissipation, etc., achieve high power levels, less material transitions, The effect of less structural space

Inactive Publication Date: 2018-03-02
OSRAM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the heat dissipation via the cooling fins produced in this way is relatively limited, it is additionally necessary to dissipate the heat from the conductor tracks 22a, 22b through the insulating layers 16a, 16b, which therefore need to be made of a well-conducting and thus expensive material. to manufacture
Furthermore, in this embodiment there is a significant loss of material due to processing, ie punched out, unnecessary material has a negative impact on costs

Method used

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  • Circuit support for an electronic circuit, and method for manufacturing a circuit support of said type
  • Circuit support for an electronic circuit, and method for manufacturing a circuit support of said type
  • Circuit support for an electronic circuit, and method for manufacturing a circuit support of said type

Examples

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Embodiment Construction

[0044] image 3 A schematic diagram of a first exemplary embodiment of a circuit carrier according to the invention is shown. The circuit carrier has conductor tracks 22 which are designed in particular as lead frames. Perforations and / or gaps 30 are provided in the conductor tracks 22 , which are also injection-molded when the conductor tracks are injection-molded with the first insulating material 17 for producing the insulating base body 16 In this case, in particular, the projection 28 is also formed on the side of the conductor track 22 that is to be coupled to the cooling body 18 . The projection 28 can also extend below the conductor track 22 in order to ensure a better form fit and / or force fit. During the injection molding with the first insulating material 17 , the region 15 provided for mounting the electronic component 14 is thus freed, as well as the region 34 on the underside 32 of the conductor track 22 . This is achieved by designing the injection mold accor...

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PUM

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Abstract

The invention relates to a circuit support for an electronic circuit, comprising: - at least one conductor path (22); - an insulating matrix made of a first insulating material (17) that is injection-molded over the at least one conductor path (22) in such a way as to leave open at least one first region (15) for connecting at least one electronic component (14) of the electronic circuit; - and aheat sink (18); the first insulating material (17) is injection-molded over the at least one conductor path (22) in such a way that the insulating matrix (16) also leaves open at least one second region (34) located between the conductor path (22) and the heat sink (18); the circuit support further comprises a plurality of spacers (28; 36) which are designed and placed in such a way as to adjust aheight (h1) of the second region (34) between the conductor path (22) and the heat sink (18); the circuit support also comprises a second insulating material (24) with which the second region (34) isfilled. The invention further relates to a method for manufacturing said type of circuit support for an electronic circuit.

Description

technical field [0001] The invention relates to a circuit carrier for an electronic circuit, comprising: at least one printed conductor; a first insulating material, in which at least one first region is formed as an insulating matrix and leaves at least one electronic component for connection to the electronic circuit In the case of the at least one conductor track being injection-molded with the first insulating material; and the cooling body. The invention also relates to a method for producing a circuit carrier for an electronic circuit, the method comprising the steps of producing at least one conductor track from a raw material by removing unnecessary material, forming an insulating matrix by means of a first insulating material for at least one The conductor tracks are injection-molded, wherein the injection-molding is performed in such a way that at least one first region of at least one conductor track for connection to at least one electronic component of the electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0203H05K3/0061H05K1/0373H05K3/202H05K3/284H05K2201/0224H05K2201/068H05K2201/10106H05K2201/2036F21S41/192H05K1/0204H05K1/181H05K3/0014H05K3/02H05K3/4644H05K2201/0104H05K2201/10113
Inventor 米夏埃尔·舍威尔彼得·黑尔比希约瑟夫·塞凯伊斯文·塞弗里茨
Owner OSRAM GMBH
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