Epoxy resin composition for electronic material, cured product thereof and electronic member

A technology of epoxy resin curing and epoxy resin, which is applied in the direction of epoxy resin glue, electric solid devices, electrical components, etc., can solve the problems of unspecified physical properties, records, and no thermal conductivity of epoxy resin, etc., and achieve excellent Effects of thermal conductivity, low thermal expansion, and high thermal conductivity

Active Publication Date: 2017-03-01
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, none of these patent documents describe its physical properties in detail, and there is no record focusing on the thermal conductivity of the epoxy resin.

Method used

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  • Epoxy resin composition for electronic material, cured product thereof and electronic member
  • Epoxy resin composition for electronic material, cured product thereof and electronic member
  • Epoxy resin composition for electronic material, cured product thereof and electronic member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0125] The present invention will be described more specifically based on Examples and Comparative Examples. In addition, the melt viscosity at 150° C., melting point, and GPC are measured on the following conditions.

[0126] 1) Melt viscosity at 150° C.: Measured with the following equipment in accordance with ASTM D4287.

[0127] Device name: MODEL CV-1S manufactured by Codex Co., Ltd.

[0128] 2) Melting point: Measured using a differential thermal gravimetric simultaneous measurement device (TG / DTA6200 manufactured by Hitachi High-Tech Science Co., Ltd.).

[0129] Measurement conditions

[0130] Measuring temperature: room temperature ~ 300 ℃

[0131] Measuring atmosphere: nitrogen

[0132] Heating rate: 10°C / min

[0133] 3) GPC: The measurement conditions are as follows.

[0134] Measuring device: "Shodex GPC-104" manufactured by Showa Denko Co., Ltd.,

[0135] Column: "Shodex KF-401HQ" manufactured by Showa Denko Co., Ltd.

[0136] + Manufactured by Showa Denko C...

Synthetic example 1

[0151] (Synthesis of 2,4,4'-Triglycidyloxybiphenyl)

[0152] In the flask equipped with a thermometer, a dropping funnel, a condenser, and a stirrer, nitrogen was purged, and 43 g of 2,4,4'-trihydroxybiphenyl, 295 g of epichlorohydrin, and 103 g of n-butanol were added to dissolve it. After heating up to 40 degreeC, after adding 53 g of 48 mass % sodium hydroxide aqueous solution over 8 hours, it heated up to 50 degreeC and made it react further for 1 hour. After the reaction was completed, 83 g of water was added and allowed to stand, and then the lower layer was discarded. Thereafter, unreacted epichlorohydrin was distilled off under reduced pressure at 150°C. To the crude epoxy resin thus obtained, 118 g of methyl isobutyl ketone was added and dissolved. Furthermore, 67 g of 10 mass % sodium hydroxide aqueous solutions were added to this solution, and it was made to react at 80 degreeC for 2 hours, and after that, washing with water was repeated 3 times until the pH of a ...

Embodiment 1～3 and comparative example 1～2

[0160] As the epoxy resins (A-1, A-2, A-3) of the present invention and comparative epoxy resins obtained in Synthesis Examples 1 to 3, 3,3',5,5'-tetramethyl- 4,4'-Biphenol-type epoxy resin (A-4), using imidazole (2E4MZ (manufactured by Shikoku Chemical Industry Co., Ltd.)) as a curing accelerator, was compounded with the composition shown in Table 1, respectively. The mixture was poured into a mold of 6 cm x 11 cm x 0.8 mm, pre-cured at a temperature of 110° C. for 2 hours, and then the molded product was taken out from the mold, and then cured at a temperature of 250° C. for 2 hours to produce a cured product. In addition, using a naphthalene-type tetrafunctional epoxy resin HP-4700 (manufactured by DIC Corporation) (A-5), and using imidazole (2PHZ-PW (manufactured by Shikoku Chemical Industry Co., Ltd.)) as a curing accelerator, the values ​​listed in Table 1 were used. The composition shown was compounded, and the compounded material was poured into the mold of 6 cm x 11 c...

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Abstract

An epoxy resin composition for an electronic material is provided which contains: a multifunctional biphenyl-type epoxy resin which is a triglycidyloxybiphenyl or a tetraglycidyloxybiphenyl; and a curing agent and / or a curing promoting agent. Further, an epoxy resin composition for an electronic material is provided which also contains a filler, specifically a thermally conductive filler. Further, a cured product formed by curing said epoxy resin composition, and an electronic member containing said cured product are provided.

Description

technical field [0001] The present invention relates to an epoxy resin composition for electronic materials, a cured product thereof, and an electronic member having excellent heat resistance, low thermal expansion, and thermal conductivity of the obtained cured product. Background technique [0002] Epoxy resin compositions containing epoxy resins and curing agents or curing accelerators as essential components are widely used in semi-laminate resin materials, electrical insulating materials, and semiconductors due to their excellent physical properties such as heat resistance and moisture absorption resistance. Sealing materials, fiber-reinforced composite materials, coating materials, molding materials, adhesive materials, etc. In recent years, in the field of electronic components, heat generation density has increased significantly due to miniaturization and high-density mounting, and epoxy resin compositions used for each component are required to further improve heat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/32C08K3/00C08K7/02C08L63/00C09J9/00C09J11/04C09J163/00
CPCC08G59/32C08K3/00C09J9/00C09J11/04C08K7/02C09J163/00C08L63/00C08G59/245C08K3/013C08K3/36C08K2201/001C08G59/3218C08G59/5073C08K3/22C08K9/08C08K2003/2227H01L23/295H01L23/3737H01L24/29H01L2224/2919H01L2924/01006H01L2924/04541H01L2924/0463H01L2924/04642H01L2924/0503H01L2924/05032H01L2924/05042H01L2924/0532H01L2924/0542H01L2924/05432H01L2924/05442H01L2924/0665H01L2924/186H05K1/0203H05K1/0373H05K2201/0104
Inventor 葭本泰代木下宏司
Owner DIC CORP
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