Device and method for detecting solidification capacity of coating of diamond wire
A detection device, diamond wire technology, applied in the direction of measuring device, mechanical device, wear resistance test, etc., can solve the problem of cracking and peeling of the coating
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Embodiment 1
[0058] A method for detecting the consolidation ability of a diamond wire coating, comprising the following steps:
[0059] On the working platform 1, a driving wheel 2 and a driven wheel 6 are relatively arranged, and a diamond wire 3 is arranged between the driving wheel 2 and the driven wheel 6. The diameter of the diamond wire 3 is 70 μm, and the tension of the diamond wire 3 is 40% of its breaking force, at this time the diamond wire 3 is in a state of tension, which is consistent with the real cutting state; the diamond wire 3 is clamped by the pneumatic clamp 4, and maintains a constant clamping force; the pneumatic clamp 4 Sandpaper 7 is arranged on the clamping surface of the cutting process, and what the sandpaper simulates is the abrasion of the silicon crystal line in the cutting process. The sandpaper 7 adopts silicon carbide sandpaper, and the mesh number is 800 mesh; the pneumatic clamp 4 is arranged on the mobile platform 5, and the The moving direction of the ...
Embodiment 2
[0064] A method for detecting the consolidation ability of a diamond wire coating, comprising the following steps:
[0065] On the working platform 1, a driving wheel 2 and a driven wheel 6 are relatively arranged, and a diamond wire 3 is arranged between the driving wheel 2 and the driven wheel 6. The diameter of the diamond wire 3 is 160 μm, and the tension of the diamond wire 3 is 50% of its breaking force, at this time the diamond wire 3 is in a state of tension, which is consistent with the real cutting state; the diamond wire 3 is clamped by the pneumatic clamp 4, and maintains a constant clamping force; the pneumatic clamp 4 Sandpaper 7 is arranged on the clamping surface of the cutting process, and what the sandpaper simulates is the abrasion of the silicon crystal line in the cutting process. The sandpaper 7 adopts silicon carbide sandpaper, and the mesh number is 800 mesh; the pneumatic clamp 4 is arranged on the mobile platform 5, and the The moving direction of the...
Embodiment 3
[0070] A method for detecting the consolidation ability of a diamond wire coating, comprising the following steps:
[0071] On the working platform 1, a driving wheel 2 and a driven wheel 6 are oppositely arranged, and a diamond wire 3 is arranged between the driving wheel 2 and the driven wheel 6. The diameter of the diamond wire 3 is 250 μm, and the tension of the diamond wire 3 is 60% of its breaking force, at this time the diamond wire 3 is in a state of tension, which is consistent with the real cutting state; the diamond wire 3 is clamped by the pneumatic clamp 4, and maintains a constant clamping force; the pneumatic clamp 4 Sandpaper 7 is arranged on the clamping surface of the cutting process, and what the sandpaper simulates is the abrasion of the silicon crystal line in the cutting process. The sandpaper 7 adopts silicon carbide sandpaper, and the mesh number is 800 mesh; the pneumatic clamp 4 is arranged on the mobile platform 5, and the The moving direction of the...
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