A conveying system based on the circuit board of the Internet of Things and its manufacturing method

A technology for conveying systems and circuit boards, which is applied in geophysical measurement, devices and instruments for coating liquid on the surface, etc., and can solve problems such as low detection efficiency, easy omission of circuit boards, and low efficiency

Active Publication Date: 2022-04-29
常州江苏大学工程技术研究院 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Each circuit board needs to be plugged with several pins, and the place where each pin is connected to the circuit board needs to be fixed by dispensing. Traditionally, manual dispensing is used to dispensing the circuit board, which is inefficient. At the same time, the dispensing part needs to be naturally solidified. , the time period is too long
[0003] Since there is a fixed area on the circuit board that needs to be inserted into the pin, it is easy to miss during the production process of the circuit board, and it needs to be re-inspected manually, and the detection efficiency is low

Method used

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  • A conveying system based on the circuit board of the Internet of Things and its manufacturing method
  • A conveying system based on the circuit board of the Internet of Things and its manufacturing method
  • A conveying system based on the circuit board of the Internet of Things and its manufacturing method

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Embodiment 1

[0036] In this embodiment, as Figure 1 to Figure 5As shown, this embodiment provides a conveying system based on an IoT circuit board, which includes: a first conveying device 1, a second conveying device 2, a first dispensing device 3, a second dispensing device 4, and a detection board 5 and a first drive device 6; wherein the first glue dispensing device 3 and the second glue dispensing device 4 are respectively arranged above the first conveying device 1 and above the second conveying device 2, and the detection board 5 is located on the first Between a conveying device 1 and a second conveying device 2, the movable part of the first driving device 6 is connected to the detection board 5; the circuit board 8 is provided with a plurality of pin holes, and each of the pin holes penetrates corresponding L-shaped holes. Pins 81; the first conveying device 1 conveys the circuit board 8 to the first glue dispensing device 3, and the first glue dispensing device 3 corresponds to...

Embodiment 2

[0062] On the basis of Embodiment 1, this embodiment provides a manufacturing method of a circuit board based on the Internet of Things, which includes: conveying the circuit board 8 through the first conveying device 1 to the first dispensing device 3, and then the first dispensing device 3. The device 3 dispenses glue at the connection between each pin hole on the front side of the circuit board 8 and the corresponding L-shaped pin 81; The hole 51 and the second exposure hole are connected to the cavity to form a conveying channel 52 , an arc-shaped groove 53 is arranged along the upper edge of the first exposure hole 51 , and the first exposure hole 51 is A number of embedding grooves 54 are arranged on the lower edge; the detection board 5 is turned over by the first driving device 6 so that the first exposure hole 51 is aligned with the output position of the first conveying device 1, so that the circuit board 8 conveyed by the first conveying device 1 can be inserted into...

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Abstract

The invention belongs to the technical field of circuit board conveying system, and specifically relates to a conveying system based on the Internet of Things circuit board and a manufacturing method thereof. The conveying system includes: a first conveying device, a second conveying device, a first dispensing device, a second A dispensing device, a detection board and a first driving device; where the first dispensing device performs dispensing; the detection board dries the dispensing place on the circuit board and marks the L-shaped pins through the arc groove and each embedding groove; The detection board is turned over 90° so that the glue on the circuit board is dripped; the detection board is turned over 180° to transport the circuit board and dispense glue; The conveying device cooperates with the detection board, so that the circuit board is stuck into the detection board to dry the dispensing place to accelerate the solidification process, and to mark each pin or the front and back of the circuit board, which is convenient for screening unqualified products and can improve Conveying and screening efficiency.

Description

technical field [0001] The invention belongs to the technical field of circuit board conveying systems, and in particular relates to a conveying system based on an Internet of Things circuit board and a manufacturing method thereof. Background technique [0002] Each circuit board needs to be plugged into several pins, and the place where each pin is connected to the circuit board needs to be glued and fixed. The traditional way of dispensing glue to the circuit board is low in efficiency, and the glue needs to be naturally solidified at the same time. , the time period is too long. [0003] Because the fixed area on the circuit board needs to be inserted, it is easy to be missed in the manufacturing process of the circuit board, and it needs to be re-inspected manually, and the detection efficiency is low. [0004] Therefore, there is an urgent need to develop a new conveying system based on the IoT circuit board and a manufacturing method thereof to solve the above proble...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): B05C13/02B05C5/02B05C9/04B05C9/14B05D3/02G01V9/00
CPCB05C13/02B05C5/0212B05C9/04B05C9/14B05D3/0254G01V9/00
Inventor王浩许涛
Owner常州江苏大学工程技术研究院