A novel heat dissipation system and heat dissipation method thereof

Abstract

The present invention discloses a novel heat dissipation system and heat dissipation method thereof, including a temperature equalizing plate, the temperature equalizing plate including an upper cover plate, a lower cover plate and a support column, the upper cover plate and the lower cover plate are sealed and joined to form a chamber, the support column is located in the chamber to support the upper cover plate; a liquid storage tube, the liquid storage tube is filled with a cooling medium, the liquid storage tube is located on one side of the temperature equalizing plate; a liquid spraying tube, the liquid spraying tube is located in the chamber, the liquid spraying tube is connected to the liquid storage tube through a micro pump, and the liquid spraying tube sprays the cooling medium into the chamber; an energy supply group, the energy supply group includes a P-type semiconductor and an N-type semiconductor, the P-type semiconductor, the N-type semiconductor and the temperature equalizing plate are connected by a temperature sensing line to form a series circuit, and the micro pump is located on the series circuit. The present invention uses a micro pump to drive the cooling medium to perform high-speed jet cooling near the lower cover plate, which greatly increases the heat dissipation cooling capacity.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation systems, and in particular relates to a novel heat dissipation system and a heat dissipation method thereof. Background Art

[0002] With the rapid development of information technology, especially the improvement of chip manufacturing capabilities, the heat dissipation of the current system host is increasingly becoming a bottleneck blocking the development of technology. The chip packaging is becoming more and more compact, the corresponding power consumption is increasing, and the heat flux density of the chip is getting higher and higher.

[0003] In order to solve the heat dissipation risks faced by the host, there are currently two main solutions:

[0004] 1. Further increase the heat dissipation area of ​​the host, that is, increase the heat dissipation volume of the main radiator. This method will make the host bulky and occupy a large area. Under the current reality of land intensive development, the construction of computer room land will be greatly restricted. Therefore, increasing the heat dissipation area is less feasible;

[0005] 2. Use a special heat sink with a temperature equalizer. Using a special heat sink with a temperature equalizer still faces the problem of the internal working fluid drying up under high heat flux density. Once the drying up occurs, the thermal control system will fail and the system will shut down and lose power. Summary of the invention

[0006] The present invention overcomes the deficiencies of the prior art and provides a novel heat dissipation system and a heat dissipation method thereof to solve the problems existing in the prior art.

[0007] To achieve the above purpose, the technical solution adopted by the present invention is: a new type of heat dissipation system, installed at the heat dissipation end of the chip, including

[0008] A temperature averaging plate, the temperature averaging plate comprising an upper cover plate, a lower cover plate and a support column, the upper cover plate and the lower cover plate are sealed and joined to form a chamber, the support column is located in the chamber to support the upper cover plate;

[0009] A liquid storage tube, wherein a cooling medium is contained in the liquid storage tube, and the liquid storage tube is located on one side of the temperature averaging plate;

[0010] A liquid spray pipe, the liquid spray pipe is located in the chamber, the liquid spray pipe is connected to the liquid storage pipe through a micro pump, and the liquid spray pipe sprays the cooling medium into the chamber;

[0011] The energy supply group includes a P-type semiconductor and an N-type semiconductor. The P-type semiconductor, the N-type semiconductor and the temperature averaging plate are connected by a temperature sensing line to form a series circuit. The micro pump is located on the series circuit.

[0012] In a preferred embodiment of the present invention, a liquid outlet is provided on the side of the temperature equalizing plate, and the liquid outlet introduces the cooling medium into the liquid storage tube. The number of the micro pumps is multiple and spaced apart along the length direction of the liquid storage tube.

[0013] In a preferred embodiment of the present invention, a liquid return port is provided on the liquid spray pipe, and a liquid gathering mechanism is provided at the position of the liquid return port, and the liquid gathering mechanism gathers the gasified cooling medium and returns it to the liquid spray pipe.

[0014] In a preferred embodiment of the present invention, the liquid collecting mechanism includes a first fin group and a second fin group, the first fin group is installed on the liquid spray pipe, and the second fin group corresponds to the first fin group in position.

[0015] In a preferred embodiment of the present invention, the first fin group and the second fin group are alternately arranged from bottom to top along the length direction of the liquid spray pipe.

[0016] In a preferred embodiment of the present invention, the P-type semiconductor and the N-type semiconductor are a combination of one or more of the following alloy materials: Bi2Te3, PbTe, SiGe.

[0017] In a preferred embodiment of the present invention, the temperature sensing line starts from the P-type semiconductor, passes through the lower cover plate, the support column, the upper cover plate and the N-type semiconductor in sequence, and ends at the N-type semiconductor. The P-type semiconductor is connected to the N-type semiconductor.

[0018] The present invention also discloses a heat dissipation method, comprising the following steps:

[0019] S1. When the chip generates heat during operation, a series circuit formed by connecting a P-type semiconductor, an N-type semiconductor and a temperature-averaging plate with a temperature-sensitive wire generates a driving potential according to the Seebeck effect to drive the micro pump.

[0020] S2, pumping out the cooling medium in the liquid storage tube through a micro pump, spraying the cooling medium into the chamber through a liquid spray pipe, and taking out the heat generated by the chip through evaporation of the cooling medium;

[0021] S3. The liquid cooling medium sprayed into the chamber flows back to the liquid storage tube through the liquid outlet hole, and the gasified cooling medium is condensed and refluxed by the liquid gathering mechanism, and the liquefied cooling medium flows back to the liquid spraying tube through the liquid return port, and the cooling medium is continuously sprayed out to form a jet to continuously dissipate heat for the chip.

[0022] The present invention solves the defects existing in the background technology and has the following beneficial effects:

[0023] (1) The present invention provides a novel heat dissipation system and heat dissipation method. The heat dissipation system uses the temperature difference between the upper plate and the lower cover plate on the temperature equalizing plate to drive a micro pump through the electromotive force generated by the thermoelectric effect of the P-type semiconductor and the N-type semiconductor. The micro pump drives the cooling medium to perform high-speed jet cooling near the lower cover plate, thereby greatly increasing the heat dissipation and cooling capacity.

[0024] (2) The existence of the liquid gathering mechanism can make the gaseous cooling medium in the chamber converge and flow back into the liquid spray pipe, further increasing the mass of the jet cooling medium. The design of the present invention can ensure the heat dissipation safety of high heat flux density chips and further improve the heat dissipation reliability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention is further described below in conjunction with the accompanying drawings and embodiments;

[0026] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0027] Figure 2 for Figure 1 Schematic diagram of the structure after removing the upper cover;

[0028] Figure 3 This is a schematic diagram of the structure of the liquid spray pipe and the liquid gathering mechanism in the preferred embodiment of the present invention;

[0029] Figure 4 A flowchart of a preferred embodiment of the present invention;

[0030] In the figure: 10, temperature equalizing plate; 11, upper cover plate; 12, lower cover plate; 13, support column; 14, liquid outlet; 20, liquid storage pipe; 30, liquid spray pipe; 31, liquid return port; 40, micro pump; 50, energy supply group; 51, P-type semiconductor; 52, N-type semiconductor; 60, temperature sensing line; 70, liquid gathering mechanism; 71, first fin group; 72, second fin group. DETAILED DESCRIPTION

[0031] The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these practical details are not necessary. In addition, for the purpose of simplifying the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0032] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] Combination Figures 1 to 3 As shown, this embodiment provides a new type of heat dissipation system, which is installed at the heat dissipation end of the chip to perform heat dissipation treatment on the chip. The heat dissipation system includes

[0034] The temperature averaging plate 10 includes an upper cover plate 11, a lower cover plate 12 and a support column 13. The upper cover plate 11 and the lower cover plate 12 are sealed and joined to form a chamber. The support column 13 is located in the chamber to support the upper cover plate 11. The lower cover plate 12 of the temperature averaging plate 10 is attached to the heat dissipation end of the chip. When the chip generates heat during operation, the temperature of the lower cover plate 12 rises, while the upper cover plate 11 always maintains a normal temperature, so a temperature difference is formed between the lower cover plate 12 and the upper cover plate 11;

[0035] A liquid storage tube 20, in which a cooling medium is installed. The liquid storage tube 20 is located on one side of the temperature balancing plate 10. The liquid storage tube 20 is used to store the cooling medium. The cooling medium used in this embodiment includes water, liquid nitrogen, etc., and the corresponding cooling medium can be selected according to actual needs;

[0036] The liquid spray pipe 30 is located in the chamber and is connected to the liquid storage pipe 20 through a micro pump 40. The liquid spray pipe 30 sprays the cooling medium into the chamber. The micro pump 40 can pump out the cooling medium in the liquid storage pipe 20 and then spray the cooling medium into the chamber of the temperature homogenizing plate 10 through the liquid spray pipe 30 to cool the chip.

[0037] The energy supply group 50 includes a P-type semiconductor 51 and an N-type semiconductor 52. The P-type semiconductor 51, the N-type semiconductor 52 and the temperature equalizing plate 10 are connected by a temperature sensing line 60 to form a series circuit. The micro pump 40 is located on the series circuit. When a temperature difference is formed between the lower cover plate 12 and the upper cover plate 11, the micro pump 40 is driven by the electromotive force generated by the thermoelectric effect of the P-type semiconductor 51 and the N-type semiconductor 52, so that the energy supply group 50 supplies energy to the micro pump 40.

[0038] In this embodiment, a liquid outlet 14 is provided on the side of the temperature equalizing plate 10, and the liquid outlet 14 guides the cooling medium into the liquid storage tube 20. After the cooling medium is sprayed into the chamber of the temperature equalizing plate 10, part of the liquid cooling medium is located on the lower cover plate 12 of the temperature equalizing plate 10, and flows back to the liquid storage tube 20 through the liquid outlet 14, thereby realizing the recycling of the liquid cooling medium. There are multiple micro pumps 40 and they are spaced apart along the length direction of the liquid storage tube 20. The multiple micro pumps 40 can pump out the cooling medium from multiple positions, thereby increasing the pumping amount of the cooling medium and improving the heat dissipation effect.

[0039] Furthermore, in this embodiment, a liquid return port 31 is provided on the liquid spray pipe 30, and a liquid gathering mechanism 70 is provided at the position of the liquid return port 31. The liquid gathering mechanism 70 gathers the vaporized cooling medium and returns it to the liquid spray pipe 30. The existence of the liquid gathering mechanism 70 can make the gaseous cooling medium in the chamber of the temperature equalizing plate 10 gather and flow back into the liquid spray pipe 30, thereby further increasing the quality of the jet cooling medium.

[0040] like Figure 3 As shown, the liquid collecting mechanism 70 includes a first fin group 71 and a second fin group 72. The first fin group 71 is installed on the liquid spraying pipe 30, and the second fin group 72 corresponds to the position of the first fin group 71. The first fin group 71 and the second fin group 72 are alternately arranged from bottom to top along the length direction of the liquid spraying pipe 30. The first fin group 71 and the second fin group 72 cooperate to form a stepped structure. After the gaseous cooling medium is liquefied, it will flow from the top into the stepped structure formed by the first fin group 71 and the second fin group, and finally flow into the liquid spraying pipe 30 from the liquid return port 31, and the cooling medium will be continuously sprayed, thereby increasing the jet flow rate of the cooling medium.

[0041] Specifically, the fins at the bottom of the second fin group 72 are installed at the liquid return port 31 of the liquid spray pipe 30 through a connecting block, so that the cooling medium can smoothly pass through the liquid return port 31 into the liquid spray pipe 30 .

[0042] In this embodiment, the P-type semiconductor 51 and the N-type semiconductor 52 are a combination of one or more of the following alloy materials: Bi2Te3, PbTe, SiGe, to ensure that the P-type semiconductor 51 and the N-type semiconductor 52 can generate an electromotive force through the thermoelectric effect, and then generate current to supply energy to the micro pump 40.

[0043] In this embodiment, the temperature sensing line 60 starts from the P-type semiconductor 51, passes through the lower cover 12, the support column 13, the upper cover 11 and the N-type semiconductor 52 in sequence, and ends at the N-type semiconductor 52. The P-type semiconductor 51 is connected to the N-type semiconductor 52, the P-type semiconductor 51 is connected to the lower cover 12, and the N-type semiconductor 52 is connected to the upper cover 11, and is connected through the support column 13 to form a complete series circuit. When a temperature difference is formed between the lower cover 12 and the upper cover 11, the electromotive force generated by the thermoelectric effect of the P-type semiconductor 51 and the N-type semiconductor 52 drives the micro pump 40.

[0044] In actual use of this embodiment, the lower cover plate 12 of the temperature equalizing plate 10 is installed at the heat dissipation end of the chip. When the chip generates heat during operation, the temperature of the lower cover plate 12 rises, while the upper cover plate 11 always maintains a normal temperature. Therefore, a temperature difference is formed between the lower cover plate 12 and the upper cover plate 11. When a temperature difference is formed between the lower cover plate 12 and the upper cover plate 11, an electromotive force (Seebeck effect) generated by the thermoelectric effect of the P-type semiconductor 51 and the N-type semiconductor 52 forms a current, thereby driving the micro pump 40. The micro pump 40 pumps the cooling medium in the liquid storage tube 20 out through the liquid spraying tube 30. The cooling medium is sprayed into the chamber of the temperature equalizing plate 10 through the liquid spray pipe 30 to cool the lower cover plate 12 to achieve heat dissipation for the chip. After heat dissipation, part of the liquid cooling medium flows back to the liquid storage pipe 20 through the liquid outlet 14 to ensure sufficient subsequent liquid supply, while part of the gaseous cooling medium is liquefied and flows back to the liquid spray pipe 30 under the action of the liquid gathering mechanism 70, and the cooling medium is continuously sprayed, further increasing the mass of the jet cooling medium until the heat dissipation operation is completed and the temperature of the lower cover plate 12 returns to normal. At this time, the energy supply group 50 can no longer supply energy to the micro pump 40, and the operation stops.

[0045] like Figure 4 As shown, in this embodiment, a heat dissipation method is also disclosed, comprising the following steps:

[0046] S1. When the chip generates heat during operation, a temperature difference is generated between the lower cover plate 12 and the upper cover plate 11 of the temperature equalizer 10. A series circuit formed by connecting the P-type semiconductor 51, the N-type semiconductor 52 and the temperature equalizer 10 with a temperature sensing line 60 generates a driving potential according to the Seebeck effect, forms a driving current, and drives the micro pump 40.

[0047] S2, the cooling medium in the liquid storage tube 20 is pumped out by the micro pump 40, and the cooling medium is sprayed into the chamber through the liquid spraying pipe 30, and the heat generated by the chip is taken out by evaporating the cooling medium. At this time, the sprayed cooling medium is in gaseous state and liquid state;

[0048] S3, the liquid cooling medium sprayed into the chamber flows back to the liquid storage tube 20 through the liquid outlet 14, and the gasified cooling medium is condensed and refluxed by the liquid collecting mechanism 70, and the liquefied cooling medium flows back to the liquid spraying tube 30 through the liquid return port 31, and the cooling medium is continuously sprayed out to form a jet to continuously dissipate heat for the chip.

[0049] In summary, the present invention provides a novel heat dissipation system and heat dissipation method. The heat dissipation system drives the micro pump 40 by means of the temperature difference between the upper cover plate 11 and the lower cover plate 12 of the temperature equalizing plate 10, and the electromotive force generated by the thermoelectric effect of the P-type semiconductor 51 and the N-type semiconductor 52. The micro pump 40 drives the cooling medium to perform high-speed jet cooling near the lower cover plate 12, which greatly increases the heat dissipation cooling capacity. The presence of the liquid collecting mechanism 70 can make the gaseous cooling medium in the chamber converge and flow back into the spray pipe 30, further increasing the mass of the jet cooling medium. The design of the present invention can ensure the heat dissipation safety of high heat flux density chips, and further improve the heat dissipation reliability of the system.

[0050] Although the present invention has been described above with reference to various embodiments, it should be understood that many changes and modifications may be made without departing from the scope of the present invention. That is, the methods, systems or devices discussed above are all examples. Various configurations may appropriately omit, replace or add various processes or components. For example, in alternative configurations, the method may be performed in an order different from the order described, and / or various stages may be added, omitted and / or combined. Moreover, the features described with respect to certain configurations may be combined in various other configurations. Different aspects and elements of the configurations may be combined in a similar manner. In addition, with the development of technology, many elements are merely examples and do not limit the scope of the present disclosure or claims.

[0051] Specific details are given in the specification to provide a thorough understanding of the exemplary configurations including implementations. However, the configurations can be practiced without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary details to avoid obscuring the configurations. This description provides only example configurations and does not limit the scope, applicability, or configurations of the claims. On the contrary, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes may be made to the functions and arrangements of the elements without departing from the spirit or scope of the present disclosure.

[0052] In addition, although each operation may describe the operation as a sequential process, many operations may be performed in parallel or simultaneously. In addition, the order of the operations may be rearranged. A process may have additional steps. In addition, examples of methods may be implemented by hardware, software, firmware, middleware, code, hardware description language, or any combination thereof. When implemented in software, firmware, middleware, or code, program code or code segments for performing the necessary tasks may be stored in a non-transitory computer-readable medium such as a storage medium, and the described tasks are performed by a processor.

[0053] In summary, it is intended that the above detailed description is considered to be illustrative rather than restrictive, and it should be understood that the claims (including all equivalents) are intended to limit the spirit and scope of the present invention. The above embodiments should be understood to be only used to illustrate the present invention and not to limit the scope of protection of the present invention. After reading the content of the record of the present invention, the technician can make various changes or modifications to the present invention, and these equivalent changes and modifications also fall into the scope limited by the claims of the present invention.

Claims

1. A new type of heat dissipation system, installed at the heat dissipation end of the chip, characterized in that: include A temperature-averaging plate (10), the temperature-averaging plate (10) comprising an upper cover plate (11), a lower cover plate (12) and a support column (13), the upper cover plate (11) and the lower cover plate (12) being sealed and joined to form a chamber, the support column (13) being located in the chamber to support the upper cover plate (11); A liquid storage pipe (20), wherein a cooling medium is contained in the liquid storage pipe (20), and the liquid storage pipe (20) is located on one side of the temperature equalizing plate (10); A liquid spray pipe (30), the liquid spray pipe (30) is located in the chamber, the liquid spray pipe (30) is connected to the liquid storage pipe (20) via a micro pump (40), and the liquid spray pipe (30) sprays the cooling medium into the chamber; An energy supply group (50), the energy supply group (50) comprising a P-type semiconductor (51) and an N-type semiconductor (52), the P-type semiconductor (51), the N-type semiconductor (52) and the temperature equalizing plate (10) being connected by a temperature sensing wire (60) to form a series circuit, and the micro pump (40) being located on the series circuit; The liquid spray pipe (30) is provided with a liquid return port (31), and a liquid gathering mechanism (70) is provided at the position of the liquid return port (31), and the liquid gathering mechanism (70) gathers the gasified cooling medium and returns it to the liquid spray pipe (30); The liquid collecting mechanism (70) comprises a first fin group (71) and a second fin group (72); the first fin group (71) is mounted on the liquid spraying pipe (30); and the second fin group (72) corresponds to the first fin group (71) in position.

2. The novel heat dissipation system according to claim 1 is characterized in that: The temperature equalizing plate (10) is provided with a liquid outlet hole (14) on the side thereof, and the liquid outlet hole (14) guides the cooling medium into the liquid storage tube (20). The micro pumps (40) are multiple in number and are distributed at intervals along the length direction of the liquid storage tube (20).

3. The novel heat dissipation system according to claim 1 is characterized in that: The first fin group (71) and the second fin group (72) are arranged alternately from bottom to top along the length direction of the liquid spraying pipe (30).

4. The novel heat dissipation system according to claim 1 is characterized in that: The P-type semiconductor (51) and the N-type semiconductor (52) are a combination of one or more of the following alloy materials: Bi2Te3, PbTe, and SiGe.

5. The novel heat dissipation system according to claim 1 is characterized in that: The temperature sensing line (60) starts from the P-type semiconductor (51), passes through the lower cover plate (12), the support column (13), the upper cover plate (11) and the N-type semiconductor (52) in sequence, and ends at the N-type semiconductor (52). The P-type semiconductor (51) is connected to the N-type semiconductor (52).

6. A heat dissipation method, applied to the novel heat dissipation system according to any one of claims 1 to 5, characterized in that: The following steps are involved: S1. When the chip generates heat during operation, a series circuit formed by connecting the P-type semiconductor (51), the N-type semiconductor (52) and the temperature equalizing plate (10) with a temperature sensing wire (60) generates a driving potential according to the Seebeck effect to drive the micro pump (40); S2, pumping out the cooling medium in the liquid storage tube (20) through the micro pump (40), spraying the cooling medium into the chamber through the liquid spraying tube (30), and removing the heat generated by the chip through evaporation of the cooling medium; S3, the liquid cooling medium sprayed into the chamber flows back into the liquid storage pipe (20) through the liquid outlet hole (14), and the gasified cooling medium is condensed and refluxed by the liquid collecting mechanism (70), and the liquefied cooling medium flows back into the liquid spray pipe (30) through the liquid return port (31), and the cooling medium is continuously sprayed out to form a jet to continuously dissipate heat from the chip.

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