Display panel and display device

Abstract

The present application discloses a display panel and a display device, wherein the display panel comprises a display area and a non-display area, and the display panel further comprises a substrate, a light-emitting unit layer, a packaging barrier layer and a packaging layer, wherein the light-emitting unit layer is arranged on the substrate and is located in the display area; the packaging barrier layer is arranged around the light-emitting unit layer and is located in the non-display area; and the packaging layer extends from the display area to the non-display area, at least covering the light-emitting unit layer and the packaging barrier layer; wherein the packaging layer comprises a first inorganic layer, a porous ceramic film layer and a second inorganic layer arranged on the packaging barrier layer; the porous ceramic film layer is arranged between the first inorganic layer and the second inorganic layer; a plurality of nanopores are arranged on the porous ceramic film layer, and the porous ceramic film layer is used to buffer the stress between the first inorganic layer and the second inorganic layer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Organic light emitting diodes (OLEDs) have the advantages of surface light source, cold light, energy saving, fast response, flexibility, ultra-thinness and low cost, and their mass production technology is becoming increasingly mature. Since OLEDs have poor stability and are extremely sensitive to water and oxygen, encapsulation technology is particularly critical. The purpose of encapsulation is mainly to prevent water vapor and oxygen from entering the OLED, and cracks are easily generated during the production process of the encapsulation layer. When cracks appear on the display screen or water vapor enters from the outside, the aging speed of the OLED organic light-emitting layer device will be accelerated. Therefore, strict encapsulation must be performed to extend the life and improve stability.

[0003] In the encapsulation layer, due to the setting of the encapsulation barrier layer, there will be greater stress in the two inorganic encapsulation layers in the non-display area, which will cause the inorganic encapsulation layer to easily crack and produce water and oxygen channels, resulting in failure of the light-emitting unit in the display area. In this regard, technical personnel in this field are in urgent need of a solution. Summary of the invention

[0004] The purpose of the present application is to provide a display panel and a display device, which reduce the possibility of cracks due to stress through a porous ceramic film layer and improve the sealing reliability of the packaging layer of the display panel.

[0005] The present application discloses a display panel, which includes a display area and a non-display area. The display panel also includes a substrate, a light-emitting unit layer, an encapsulation barrier layer and an encapsulation layer, wherein the light-emitting unit layer is arranged on the substrate and is located in the display area; the encapsulation barrier layer is arranged around the light-emitting unit layer and is located in the non-display area; and the encapsulation layer extends from the display area to the non-display area, at least covering the light-emitting unit layer and the encapsulation barrier layer; wherein the encapsulation layer includes a first inorganic layer, a porous ceramic film layer and a second inorganic layer stacked in sequence on the encapsulation barrier layer; the porous ceramic film layer is arranged between the first inorganic layer and the second inorganic layer; a plurality of nanopores are arranged on the porous ceramic film layer, and the porous ceramic film layer is used to buffer the stress between the first inorganic layer and the second inorganic layer.

[0006] Optionally, the porous ceramic film layer includes one or more of metal oxides, nitrides, carbides and metal compounds as raw materials, and one or more layers of nanoporous porous ceramic film materials are prepared on the surface of the raw materials.

[0007] Optionally, the porous ceramic film layer includes a first porous film layer, a second porous film layer and a third porous film layer, the second porous film layer is arranged between the first porous film layer and the third porous film layer; the first porous film layer is formed of a porous silicon carbide material, the third porous film layer is formed of a porous silicon carbide material; the second porous film layer is formed of a porous boron carbide material.

[0008] Optionally, the thickness of the first porous film layer and the thickness of the third porous film layer are respectively less than or equal to the thickness of the second porous film layer.

[0009] Optionally, the thickness of the first porous film layer and the thickness of the third porous film layer are respectively greater than or equal to 0.5um and less than or equal to 1um; the thickness of the second porous film layer is greater than or equal to 1um and less than or equal to 2um; the pore size of the nanopores of the first porous film layer is greater than or equal to 1nm and less than or equal to 10nm; the pore size of the nanopores of the third porous film layer is greater than or equal to 1nm and less than or equal to 10nm.

[0010] Optionally, the encapsulation barrier layer includes a first blocking structure, which is arranged around the light-emitting unit layer, and on the orthographic projection of the substrate, the first blocking structure does not overlap with the light-emitting unit layer; the encapsulation barrier layer also includes a plurality of corner areas, and the corner areas are areas where the surface of the film layer of the first blocking structure turns; the display panel also includes a buffer structure, which is arranged corresponding to the corner areas, and the buffer structure is arranged on the porous ceramic film layer, and the buffer structure is used to expand when heated.

[0011] Optionally, the buffer structure includes an expansion material, and an expansion coefficient of the expansion material is between that of the first inorganic layer and the second inorganic layer.

[0012] Optionally, the porous ceramic film layer includes a first porous film layer, a second porous film layer and a third porous film layer, the second porous film layer is arranged between the first porous film layer and the third porous film layer; the first porous film layer is formed of a porous silicon carbide material, and the third porous film layer is formed of a porous silicon carbide material; the second porous film layer is formed of a porous boron carbide material; the first porous film layer and the third porous film layer are arranged corresponding to the corner area, and in the orthographic projection of the substrate, the second porous film layer does not overlap with the corner area.

[0013] Optionally, the encapsulation layer also includes an organic layer, the first inorganic layer extends from the non-display area to the display area and covers the light-emitting unit layer, the organic layer is arranged in the display area and on the first inorganic layer; the second inorganic layer extends from the non-display area to the display area and covers the first inorganic layer and the organic layer.

[0014] The present application discloses a display device, comprising a driving circuit and the above-mentioned display panel, wherein the driving circuit is used to drive the display panel to display.

[0015] The present application provides a porous ceramic film layer between the first inorganic layer and the second inorganic layer in the non-display area, and a porous structure is provided on the porous ceramic film layer, and a plurality of nanopores are used to release the stress between the multiple film layers in the encapsulation layer, thereby reducing the possibility of cracks caused by stress in the process of making the encapsulation layer, and improving the sealing reliability of the encapsulation layer of the display panel. Specifically, due to the effect of the encapsulation barrier layer, local stress concentration will occur between the film layers in the encapsulation layer, or the film layer will be deformed to varying degrees under the action of external mechanical forces, which is easy to cause microcracks in the encapsulation layer, forming water and oxygen channels, and then causing the light-emitting unit layer to fail. The important thing about this scheme is to use a film layer with a porous structure between the first inorganic layer and the second inorganic layer to disperse the stress generated at the encapsulation barrier layer, prevent unexpected cracks in the film layers in the encapsulation layer, and then improve the sealing reliability of the encapsulation layer. And on the other hand, the porous ceramic film layer has a certain toughness, which can enhance the overall encapsulation strength of the encapsulation area, prevent damage to the encapsulation layer during assembly or subsequent processes, thereby improving the quality and strength of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0017] Figure 1 is a schematic diagram of a first display panel of the present application;

[0018] Figure 2 is a schematic diagram of a porous ceramic film layer of the present application;

[0019] Figure 3 is a schematic diagram of a display panel according to a second embodiment of the present application;

[0020] Figure 4is a schematic diagram of a display panel according to a third embodiment of the present application;

[0021] Figure 5 is a schematic diagram of a second display panel of the third embodiment of the present application;

[0022] Figure 6 is a schematic diagram of a display device of the present application.

[0023] Among them, 100, display panel; 101, display area; 102, non-display area; 103, substrate; 104, light-emitting unit layer; 110, encapsulation barrier layer; 111, first blocking structure; 112, second blocking structure; 113, corner area; 120, encapsulation layer; 121, first inorganic layer; 122, second inorganic layer; 123, organic encapsulation layer; 130, porous ceramic film layer; 131, first porous film layer; 132, second porous film layer; 133, third porous film layer; 134, buffer structure; 200, display device; 210, drive circuit. DETAILED DESCRIPTION

[0024] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0025] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. In addition, the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. indicating orientation or positional relationships are described based on the orientation or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing the simplified description of the present application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0026] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0027] Figure 1 is a schematic diagram of the first display panel of the present application, see Figure 1As shown, the present application discloses a display panel 100, the display panel 100 includes a display area 101 and a non-display area 102, the display panel 100 also includes a substrate 103, a light-emitting unit layer 104, an encapsulation barrier layer 110 and an encapsulation layer 120, the light-emitting unit layer 104 is arranged on the substrate 103 and is located in the display area 101; the encapsulation barrier layer 110 is arranged around the light-emitting unit layer 104 and is located in the non-display area 102; and the encapsulation layer 120 extends from the display area 101 to the non-display area 102 , at least covering the light-emitting unit layer 104 and the encapsulation barrier layer 110; wherein the encapsulation layer 120 includes a first inorganic layer 121, a porous ceramic film layer 130 and a second inorganic layer 122 stacked in sequence on the encapsulation barrier layer 110; the porous ceramic film layer 130 is arranged on the first inorganic layer 121 and the second inorganic layer 122; a plurality of nanopores are arranged on the porous ceramic film layer 130, and the porous ceramic film layer 130 is used to buffer the stress between the first inorganic layer 121 and the second inorganic layer 122.

[0028] The present application provides a porous ceramic film layer 130 between the first inorganic layer 121 and the second inorganic layer 122 in the non-display area 102, and a porous structure is provided on the porous ceramic film layer 130, and a plurality of nanopores are used to release the stress between the multiple film layers in the encapsulation layer 120, thereby reducing the possibility of cracks caused by stress in the process of making the encapsulation layer 120, and improving the sealing reliability of the encapsulation layer 120 of the display panel 100. Specifically, due to the effect of the encapsulation barrier layer 110, local stress concentration will occur between the film layers in the encapsulation layer 120, or the film layers will be deformed to varying degrees under the action of external mechanical forces, which may easily lead to microcracks in the encapsulation layer 120, forming water and oxygen channels, and then causing the light-emitting unit layer 104 to fail. The important thing about this scheme is to use a film layer with a porous structure between the first inorganic layer 121 and the second inorganic layer 122 to disperse the stress generated at the encapsulation barrier layer 110, prevent unexpected cracks from occurring in the film layers in the encapsulation layer 120, and then improve the sealing reliability of the encapsulation layer 120. On the other hand, the porous ceramic film layer 130 has a certain toughness, which can enhance the overall packaging strength of the packaging area and prevent damage to the packaging layer 120 during assembly or subsequent processes, thereby improving the quality and strength of the display panel 100.

[0029] The encapsulation layer 120 generally selects a laminated structure of an inorganic encapsulation layer and an organic encapsulation layer 123, and at least two layers of inorganic encapsulation layers are sandwiched on both sides of the organic encapsulation layer 123 to achieve the encapsulation of the light-emitting unit layer 104. The function of the encapsulation layer 120 is mainly to prevent water vapor and oxygen from entering the light-emitting unit layer 104, and to prevent the organic light-emitting layer in the light-emitting unit layer 104 from failing after being exposed to water and oxygen. Relatively speaking, the sealing effect of the encapsulation layer 120 is very important for the display panel 100, and is also a crucial link in the production process of the OLED display panel 100. Generally, the inorganic encapsulation layer is prepared by vacuum deposition, and the organic encapsulation layer 123 is prepared by inkjet printing. Because there is a gap between the print heads in inkjet printing, the organic encapsulation layer 123 in inkjet printing needs to be completely flattened on the light-emitting unit layer 104 to form a covering encapsulation by static leveling. The structure used to achieve the function of blocking the flow of ink is generally called an encapsulation barrier layer 110, and the encapsulation barrier layer 110 is generally arranged in the non-display area 102, higher than the surface of the light-emitting unit layer 104.

[0030] The encapsulation layer 120 further includes an organic layer, wherein the first inorganic layer 121 extends from the non-display area 102 to the display area 101 and covers the light-emitting unit layer 104, and the organic layer is disposed in the display area 101 and on the first inorganic layer 121; the second inorganic layer 122 extends from the non-display area 102 to the display area 101 and covers the first inorganic layer 121 and the organic layer. The first inorganic layer 121 and the second inorganic layer 122 may be made of silicon nitride material or silicon oxynitride material, and the organic encapsulation layer 123 may be made of acrylic material or epoxy resin material, etc.

[0031] Specifically, the porous ceramic film layer 130 includes one or more of metal oxides, nitrides, carbides and metal compounds as raw materials, and one or more layers of nanoporous porous ceramic film materials are prepared on the surface of the raw materials. Specific examples include aluminum oxide (Al2O3), silicon nitride (SiN), silicon carbide (SiC), zirconium dioxide (ZrO2), boron carbide (BC), etc. These materials have the characteristics of high hardness, low density, high temperature resistance, creep resistance, wear resistance, corrosion resistance and good chemical stability.

[0032] Specifically, the ceramic film layer has the properties of wear resistance, corrosion resistance, high temperature resistance and resistance to microbial erosion. It also has high mechanical strength, good thermal conductivity, small thermal expansion coefficient, and the transparent ceramic film is light-transmitting. The deposition process of the ceramic film includes atomic layer deposition, particle deposition and overall coverage. Currently, the more mature chemical methods include chemical vapor deposition, metal organic chemical vapor deposition, plasma enhanced chemical vapor deposition, laser induced chemical vapor deposition, etc. Nanopores of about 10 nm are deposited or prepared on the surface of the raw material through special processes such as sedimentation, in-situ solidification, sintering, hot pressing or laser synthesis.

[0033] In one embodiment, on the orthographic projection of the substrate 103 , the projection range of the porous ceramic film layer 130 overlaps with the projection range of the encapsulation barrier layer 110 .

[0034] In this solution, the porous ceramic film layer 130 is mainly arranged in the area of ​​the encapsulation barrier layer 110. As mentioned above, since the encapsulation barrier layer 110 protrudes from the substrate 103, on the one hand, it is used to block the leveling of the organic encapsulation layer 123, and on the other hand, a tortuous film interface is formed between the substrate 103, so that the path of water vapor invasion is increased. At the same time, due to the tortuous film interface, and the fact that there is no organic encapsulation layer 123 between the two layers of inorganic encapsulation layers in this area for buffering, the stress between the inorganic encapsulation layers is large, which easily leads to cracks between the film layers. Therefore, in this solution, a porous ceramic film layer 130 is only arranged in the area of ​​the encapsulation barrier layer 110 to utilize the porous ceramic film layer 130 to alleviate the occurrence of stress here, and can also improve the problem of film fracture caused by the slope of the encapsulation barrier layer 110. In addition, the organic layer itself has unstable characteristics such as water absorption, and the thickness needs to be very large. The thin organic layer itself has low strength. The ceramic material can achieve strength enhancement and increased toughness in a very thin state.

[0035] It can be understood that, on both sides of the encapsulation barrier layer 110 , the first inorganic layer 121 and the second inorganic layer 122 are in direct contact with each other.

[0036] Among them, the thickness of the porous ceramic film layer 130 is about 2um to 4um, the thickness of the first inorganic layer 121 is about 1um to 2um, the organic encapsulation layer 123 of the display area 101 can be about 10um to 30um, and the thickness of the second inorganic layer 122 is about 2um to 3um.

[0037] Figure 2 is a schematic diagram of a porous ceramic film layer of the present application, see Figure 2As shown, in this embodiment, the porous ceramic film layer 130 includes a first porous film layer 131, a second porous film layer 132 and a third porous film layer 133, and the second porous film layer 132 is arranged between the first porous film layer 131 and the third porous film layer 133; the first porous film layer 131 is in direct contact with the first inorganic layer 121, and the third porous film layer 133 is in direct contact with the second inorganic layer 122.

[0038] The first porous film layer 131 is formed of porous silicon carbide material, the third porous film layer 133 is formed of porous silicon carbide material; the second porous film layer 132 is formed of porous boron carbide material. Among them, the first porous film layer 131 and the third porous film layer 133 are porous film layers formed of silicon carbide material as raw material. The ceramic film layer of silicon carbide has strong crack propagation resistance and excellent damage resistance. At the same time, the porous structure can increase the composite density of the film interface between the first porous film layer 131 and the first inorganic layer 121, and can also increase the composite density of the film interface between the third porous film layer 133 and the second inorganic layer 122. The second porous film layer 132 is a porous film layer formed of boron carbide (B4C) as raw material. The ceramic film layer of boron carbide has high toughness and strength. Being in the middle position, it can well disperse the stress from the first inorganic layer 121 and the second inorganic layer 122.

[0039] Specifically, the thickness of the first porous film layer 131 and the thickness of the third porous film layer 133 are respectively less than or equal to the thickness of the second porous film layer 132. The overall toughness and strength of the encapsulation layer 120 in the encapsulation barrier layer 110 region can be enhanced by setting the thickness of the second porous film layer 132 with higher intermediate toughness to be larger.

[0040] The thickness of the first porous film layer 131 and the thickness of the third porous film layer 133 are respectively greater than or equal to 0.5 um and less than or equal to 1 um; the thickness of the second porous film layer 132 is greater than or equal to 1 um and less than or equal to 2 um.

[0041] The diameter of the nanopores of the first porous film layer 131 is greater than or equal to 1 nm and less than or equal to 10 nm; the diameter of the nanopores of the third porous film layer 133 is greater than or equal to 1 nm and less than or equal to 10 nm. The diameter of the nanopores of the second porous film layer 132 is not limited.

[0042] In another embodiment, the porous ceramic film layer 130 may only adopt a first porous film layer 131, which is in contact with the first inorganic layer 121 and the second inorganic layer 122 respectively through a first porous film layer 131 of about 0.5um to 1um, so as to buffer the stress between the first inorganic layer 121 and the second inorganic layer 122.

[0043] Figure 3 is a schematic diagram of a display panel of the second embodiment of the present application, see Figure 3 As shown, the present application also discloses a display panel 100, and the display panel 100 also includes a substrate 103, a light-emitting unit layer 104, an encapsulation barrier layer 110 and an encapsulation layer 120. The other structures may be consistent with the above-mentioned embodiments and will not be repeated here. The difference from the above is that the encapsulation barrier layer 110 includes multiple corner areas 113, and the corner area 113 is the area where the film layer surface of the encapsulation barrier layer 110 turns, which can also be called a film layer mutation area. This area will cause the film layer of the first inorganic layer to turn; the first gap is set corresponding to the corner area 113.

[0044] Among them, the corner area 113 can be understood that the encapsulation barrier layer 110 has at least one first barrier structure 111, the highest position of the first barrier structure 111 is higher than the light-emitting unit layer 104, and the first barrier structure 111 can be formed of organic materials, arranged on the substrate 103, and protruding from the substrate 103 relative to the surface of the substrate 103. The starting point when the film layer rises is a corner area 113, and the end point when the film layer rises is another corner area 113. There is a phenomenon of film layer mutation in the corner area 113, and the corner area 113 is also a stress concentration area.

[0045] Generally speaking, at least two inorganic encapsulation layers are arranged on the encapsulation barrier layer 110. At the corner area 113, due to the external force or the stress between the film layers, the two inorganic encapsulation layers will be subjected to forces of different magnitudes, especially at the sharp corners. The forces of different magnitudes will cause different degrees of deformation of the inorganic encapsulation layers on both sides in a macroscopic manner. When the deformation of the lower inorganic encapsulation layer is greater than the deformation of the upper inorganic encapsulation layer, the lower inorganic encapsulation layer generates local stress on the upper inorganic encapsulation layer, and microcracks are likely to appear between the two inorganic encapsulation layers; on the contrary, when the deformation of the lower layer is small, a gap between the film layers is likely to appear. Both of the above situations will make it easy for microcracks to appear in the inorganic film layers on both sides, forming water and oxygen channels, which will lead to the failure of the light-emitting unit layer 104 and affect the service life of the display panel 100.

[0046] In particular, when the encapsulation barrier layer 110 has two or more first barrier structures 111, there will be two corner regions 113 between the two first barrier structures 111, and a stress concentration region will also be formed. Relatively speaking, the film layer interface where the corner region 113 at one end of the first barrier structure 111 away from the substrate 103 is located is a sharp angle protruding outward, and the film layer interface where the corner region 113 at one end of the first barrier structure 111 close to the substrate 103 is located is an obtuse angle recessed inward, and both have the problem of stress concentration.

[0047] In this embodiment, the display panel 100 further includes a buffer structure 134 . The buffer structure 134 is disposed corresponding to the corner area 113 , and the buffer structure 134 is disposed on the porous ceramic film layer 130 . The buffer structure 134 has elastic deformation capability.

[0048] In this solution, since the stress in the corner area 113 is relatively strong, especially in a high temperature environment, the film layer will be deformed differently after being heated, which will cause the film layer to separate at the corner area 113. Moreover, if the film layer separates at the corner area 113, water vapor will enter through the film layer separation position. In this solution, a buffer structure 134 is provided in each corner area 113. The buffer structure 134 has a certain low expansion coefficient and can expand and fill the film layer separation phenomenon generated in the corner area 113 when heated.

[0049] Among them, the expansion coefficient of the buffer structure 134 can be between the expansion coefficients of the first inorganic layer 121 and the second inorganic layer 122, and an expansion amount between the expansion amounts of the first inorganic layer 121 and the second inorganic layer 122 is generated at high temperature, thereby filling the membrane layer gap between the first inorganic layer 121 and the second inorganic layer 122, and serving as a supporting membrane layer to prevent the first inorganic layer 121 and the second inorganic layer 122 from collapsing and breaking at the position of the porous ceramic film layer 130 in a short period of time due to lack of support. The buffer structure 134 is relative to a release membrane layer that generates stress due to high-temperature expansion. After the temperature is restored, the first inorganic layer 121 and the second inorganic layer 122 restore their deformation, and the buffer structure 134 also restores its original state, so as to improve the stability and strength of the package at high temperatures.

[0050] Specifically, the buffer structure 134 includes an expansion material, and the expansion coefficient of the expansion material is between the first inorganic layer and the second inorganic layer. x , for example, if the second inorganic layer is SiO2, SiNx is 2.5~3.6*10^-6 / ℃; SiO2 is -0.03~0.05*10^-6 / ℃. Then the expansion material needs to be between the two, and the expansion material may include; SiC 1.2~4.3*10^-6 / ℃, Li2O, Al2O3 or SiO2 is 0.5*10^-6 / ℃, etc., low expansion alloys (such as 64% Fe and 36% Ni, the expansion is close to 1.8*10^-6 / ℃; or other Fe / Ni / Co alloys are around 1*10^-6 / ℃).

[0051] Figure 4 is a schematic diagram of a display panel of the third embodiment of the present application, see Figure 4As shown, in another embodiment, the buffer structure 134 is not provided in the corner area 113, and the improvement of the thermal expansion problem of the corner area 113 is achieved by redesigning the porous ceramic film layer 130. Specifically, the porous ceramic film layer 130 is provided corresponding to the corner area 113. After the porous ceramic film layer 130 is provided, the film layer at the corner area 113 is easily accumulated during the deposition, resulting in the gradual increase in the slope angle of the encapsulation barrier layer 110 in the corner area 113, thereby reducing the slope angle of the first inorganic layer 121 and the second inorganic layer 122 in the corner area 113, reducing the occurrence of stress, and reducing the risk of film breakage due to a small slope.

[0052] Specifically, the porous ceramic film layer 130 includes a first porous film layer 131, a second porous film layer 132 and a third porous film layer 133, wherein the second porous film layer 132 is disposed between the first porous film layer 131 and the third porous film layer 133. The first porous film layer 131 and the third porous film layer 133 are disposed corresponding to the corner area 113.

[0053] Figure 5 is a schematic diagram of the second display panel of the third embodiment of the present application; in another embodiment, on the orthographic projection of the substrate 103 , the second porous film layer 132 and the corner area 113 do not overlap.

[0054] In this solution, only the first porous film layer 131 and the third porous film layer 133 are provided in the corner area 113, without providing the thicker second porous film layer 132. The first porous film layer 131 and the third porous film layer 133 are used as stress release layers and provided between the first inorganic layer 121 and the second inorganic layer 122 to improve the stability and strength of the package at high temperatures.

[0055] In one embodiment, the first porous film layer 131 includes a plurality of first porous film portions that are spaced apart, the second porous film layer 132 includes a plurality of second porous film portions that are spaced apart, and the third porous film layer 133 includes a plurality of third porous film portions that are spaced apart. In the corner area 113, the first porous film portion and the third porous film portion are arranged corresponding to the corner area 113, and the second porous film portion is not arranged in the corner area 113.

[0056] The first porous film portion and the second porous film portion are arranged alternately, and the first porous film portion and the third porous film portion are arranged at the same position. That is, at least one second porous film layer 132 is arranged at each position, or the first porous film layer 131 and the third porous film layer 133 are arranged in a stacked manner, which can utilize the strong crack propagation resistance and excellent damage resistance of the first porous film layer 131, and the high toughness and strength of the second porous film layer 132.

[0057] Figure 6 is a schematic diagram of the display device of the present application, see Figure 6 As shown, the present application discloses a display device 200, which includes the above-mentioned display panel 100 and a driving circuit 210, wherein the driving circuit 210 is used to drive the display panel 100 to display. The display panel 100 in this embodiment is an organic light emitting display panel 100.

[0058] The present application provides a porous ceramic film layer 130 between the first inorganic layer 121 and the second inorganic layer 122 in the non-display area 102, and a porous structure is provided on the porous ceramic film layer 130, and a plurality of nanopores are used to release the stress between the multiple film layers in the encapsulation layer 120, thereby reducing the possibility of cracks caused by stress in the process of making the encapsulation layer 120, and improving the sealing reliability of the encapsulation layer 120 of the display panel 100. Specifically, due to the effect of the encapsulation barrier layer 110, local stress concentration will occur between the film layers in the encapsulation layer 120, or the film layers will be deformed to varying degrees under the action of external mechanical forces, which may easily lead to microcracks in the encapsulation layer 120, forming water and oxygen channels, and then causing the light-emitting unit layer 104 to fail. The important thing about this scheme is to use a film layer with a porous structure between the first inorganic layer 121 and the second inorganic layer 122 to disperse the stress generated at the encapsulation barrier layer 110, prevent unexpected cracks from occurring in the film layers in the encapsulation layer 120, and then improve the sealing reliability of the encapsulation layer 120. On the other hand, the porous ceramic film layer 130 has a certain toughness, which can enhance the overall packaging strength of the packaging area and prevent damage to the packaging layer 120 during assembly or subsequent processes, thereby improving the quality and strength of the display panel 100.

[0059] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0060] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A display panel comprising a display area and a non-display area, It is characterized in that The display panel comprises: substrate; A light-emitting unit layer, disposed on the substrate and located in the display area; an encapsulation barrier layer, disposed around the light-emitting unit layer and located in the non-display area; and An encapsulation layer, extending from the display area to the non-display area, and at least covering the light-emitting unit layer and the encapsulation barrier layer; Wherein, the encapsulation layer comprises a first inorganic layer, a porous ceramic film layer and a second inorganic layer on the encapsulation barrier layer; the porous ceramic film layer is arranged between the first inorganic layer and the second inorganic layer; The porous ceramic film layer is provided with a plurality of nanopores, and the porous ceramic film layer buffers the stress between the first inorganic layer and the second inorganic layer; The porous ceramic film layer comprises a first porous film layer, a second porous film layer and a third porous film layer, wherein the second porous film layer is arranged between the first porous film layer and the third porous film layer; the first porous film layer is formed of a porous silicon carbide material, the third porous film layer is formed of a porous silicon carbide material; the second porous film layer is formed of a porous boron carbide material; The thickness of the first porous film layer and the thickness of the third porous film layer are respectively less than or equal to the thickness of the second porous film layer; The encapsulation barrier layer comprises a first barrier structure, the first barrier structure is arranged around the light emitting unit layer, and on the orthographic projection of the substrate, the first barrier structure does not overlap with the light emitting unit layer; The encapsulation barrier layer further comprises a plurality of corner regions, wherein the corner regions are regions where the surface of the film layer of the first barrier structure turns; The first porous film layer and the third porous film layer are arranged corresponding to the corner area, and in the orthographic projection of the substrate, the second porous film layer does not overlap with the corner area.

2. The display panel according to claim 1, It is characterized in that The thickness of the first porous film layer and the thickness of the third porous film layer are respectively greater than or equal to 0.5 um and less than or equal to 1 um; The thickness of the second porous film layer is greater than or equal to 1 um and less than or equal to 2 um; The pore size of the nanopores of the first porous film layer is greater than or equal to 1 nm and less than or equal to 10 nm; The diameter of the nanopores in the third porous film layer is greater than or equal to 1 nm and less than or equal to 10 nm.

3. The display panel according to claim 1, It is characterized in that The encapsulation layer also includes an organic layer, The first inorganic layer extends from the non-display area to the display area and covers the light-emitting unit layer, and the organic layer is disposed in the display area and on the first inorganic layer; The second inorganic layer extends from the non-display area to the display area, and covers the first inorganic layer and the organic layer.

4. The display panel according to claim 1, It is characterized in that The first porous film layer includes a plurality of first porous film portions that are spaced apart, the second porous film layer includes a plurality of second porous film portions that are spaced apart, and the third porous film layer includes a plurality of third porous film portions that are spaced apart. In the corner area, the first porous film portion and the third porous film portion are arranged corresponding to the corner area, and the second porous film portion is not arranged in the corner area.

5. A display device, It is characterized in that It comprises a driving circuit and the display panel according to any one of claims 1 to 4, wherein the driving circuit is used to drive the display panel to display.

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