Molded base, camera module and electronic equipment

By designing a molded base for differentiated connections in the imaging module and setting the lens module and the photosensitive chip on the same base, the problems of assembly inclination and poor molding are solved, imaging quality and production efficiency are improved, and costs are reduced.

CN118803407BActive Publication Date: 2024-12-17NINGBO SUNNY OPOTECH CO LTD
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Patent Information

Application Number
CN202411284015.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-13
Publication Date
2024-12-17
Estimated Expiration
2044-09-13

AI Technical Summary

Technical Problem

During the assembly process, the lens module and the photosensitive chip are prone to inclination due to the parts processing tolerance and the adhesive filling tolerance during the assembly process, which affects the imaging quality, and the poor molding of the molded base affects the production efficiency.

Method used

Design a molding base, by providing the first and second mounting parts on the base, respectively, for the installation of the lens and the photosensitive chip, and through the differentiated connection parts, the molding liquid can be quickly achieved during the molding process. Flow to the second mounting part area to reduce flow resistance and improve molding yield. At the same time, the lens module and the photosensitive chip are arranged on the same base in the camera module to reduce assembly inclination.

Benefits of technology

It effectively reduces the assembly inclination of the camera module, improves the imaging quality, and improves production efficiency through easy molding and molding, reducing costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to a molding base, a camera module and an electronic device. The molding base includes: a first mounting portion having a lens mounting surface, the first mounting portion including a first part and a second part; a second mounting portion having a first side wall and a second side wall opposite to each other along a first direction, the first part and the first side wall being spaced apart in the first direction, the second part and the second side wall being spaced apart in the first direction, and the second mounting portion also having a chip mounting surface located between the first side wall and the second side wall; a first connecting portion connected to the first part of the first mounting portion and the first side wall of the second mounting portion; a second connecting portion connected to the second part of the first mounting portion and the second side wall of the second mounting portion, and the cross-sectional area of ​​the first connecting portion perpendicular to the first direction is greater than the cross-sectional area of ​​the second connecting portion perpendicular to the first direction. The molding base of the present application facilitates the molding liquid to flow quickly to the area where the second mounting portion is located in the mold, thereby improving the molding yield of the molding base.
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Description

Technical Field

[0001] The present application relates to the field of imaging devices, and in particular to a molded base, a camera module and an electronic device. Background Art

[0002] The camera module is equipped with a photosensitive chip and a lens module. Usually, the photosensitive chip is mounted on a circuit board, and the lens module is mounted on a lens holder or a molded base. Since components such as circuit boards, lens holders, and molded bases have processing tolerances, and the photosensitive chip and circuit board, and the lens module and lens holder or molded base are bonded by adhesives, and the filling amount of the adhesives also has tolerances, after the tolerances are accumulated, the lens module and the photosensitive chip are prone to tilt, affecting the image quality.

[0003] In order to improve the assembly accuracy of the camera module, the photosensitive chip and the lens module can be set on the same base. Among them, the base is formed by molding, which has a low cost. However, the molded base is prone to problems such as poor exhaust during injection molding, resulting in poor molding of the molded base and affecting production efficiency. Summary of the invention

[0004] Based on the above problems, the present application provides a molding base, a camera module and an electronic device, which can not only reduce the assembly tilt of the camera module but also facilitate molding of the molding base.

[0005] In a first aspect, the present application provides a molded base, comprising:

[0006] A first mounting portion having a lens mounting surface, wherein the first mounting portion includes a first portion and a second portion;

[0007] A second mounting portion, having a first side wall and a second side wall opposite to each other along a first direction, a first portion of the first mounting portion and a first side wall of the second mounting portion being spaced apart in the first direction, a second portion of the first mounting portion and a second side wall of the second mounting portion being spaced apart in the first direction, and the second mounting portion further having a chip mounting surface located between the first side wall and the second side wall;

[0008] a first connecting portion connected to a first portion of the first mounting portion and a first side wall of the second mounting portion;

[0009] The second connecting portion is connected to the second part of the first mounting portion and the second side wall of the second mounting portion, and the cross-sectional area of ​​the first connecting portion perpendicular to the first direction is greater than the cross-sectional area of ​​the second connecting portion perpendicular to the first direction.

[0010] According to some embodiments of the present application, the first mounting portion includes:

[0011] The mounting portion body has an inner side wall adjacent to the second mounting portion and an outer side wall away from the second mounting portion;

[0012] A lug is arranged on the outer side wall of the mounting body, and the lens mounting surface is located on the lug.

[0013] According to some embodiments of the present application, a top surface of the lug is lower than a top surface of the mounting portion body.

[0014] According to some embodiments of the present application, the mounting portion body is in a frame shape surrounding the second mounting portion, and the mounting portion body has at least three corners, wherein the lugs are provided at at least three corners.

[0015] According to some embodiments of the present application, the chip mounting surface is substantially rectangular, and the first direction is a width direction of the chip mounting surface.

[0016] According to some embodiments of the present application, a cross-sectional area of ​​the first connecting portion gradually decreases from the first mounting portion to the second mounting portion.

[0017] According to some embodiments of the present application, the first direction is parallel to the chip mounting surface, a direction perpendicular to the first direction and parallel to the chip mounting surface is a second direction, and a direction orthogonal to the first direction and the second direction is a third direction.

[0018] In the second direction, the width of the first connection portion is greater than the width of the second connection portion, and / or, in the third direction, the thickness of the first connection portion is greater than the thickness of the second connection portion.

[0019] In a second aspect, the present application provides a camera module, comprising:

[0020] Circuit board;

[0021] The molded base as described above is arranged on the circuit board;

[0022] A photosensitive chip, arranged on the chip mounting surface of the second mounting portion;

[0023] The lens module is arranged on the lens mounting surface of the first mounting portion and is located in the light sensing path of the light sensing chip.

[0024] According to some embodiments of the present application, a groove is provided on the bottom surface of the lens module, and the lug of the first mounting portion is inserted into the groove.

[0025] According to some embodiments of the present application, a first gap is formed between the bottom of the groove and the lens mounting surface, and a second gap is formed between the groove wall and the lug, the gap value of the first gap is smaller than the gap value of the second gap, and the first gap and the second gap are both filled with adhesive.

[0026] According to some embodiments of the present application, a third gap is formed between the bottom surface of the lens module and the circuit board, a gap value of the third gap is greater than a gap value of the first gap, and the third gap is filled with adhesive.

[0027] According to some embodiments of the present application, a gap value of the third gap is smaller than a gap value of the second gap.

[0028] According to some embodiments of the present application, a filter mounting surface is provided on the top of the first mounting portion, a filter is provided on the filter mounting surface, and, in the optical path, the filter is located between the lens module and the photosensitive chip.

[0029] According to some embodiments of the present application, a glue overflow groove is provided on the top of the first mounting portion, and the glue overflow groove is connected to the outer edge of the filter mounting surface.

[0030] According to some embodiments of the present application, a filter seat is provided on the top of the first mounting portion, and the filter is mounted on the filter seat.

[0031] According to some embodiments of the present application, the filter holder is molded on the molded base, and the filter holder covers a portion of the photosensitive chip.

[0032] In a third aspect, the present application provides an electronic device, including:

[0033] Electronic device body;

[0034] The camera module as described above is arranged on the electronic device body.

[0035] The molding base of the present application has a differentiated design of the first connecting part and the second connecting part. The cross-sectional area of ​​the first connecting part perpendicular to the first direction is larger than the cross-sectional area of ​​the second connecting part perpendicular to the first direction. When the molding base is molded and the molding liquid enters the mold from the adjacent first part, the molding liquid can form a flow path of the first connecting part-the second mounting part-the second connecting part inside the mold, which facilitates the molding liquid to flow quickly to the area where the second mounting part is located in the mold, avoiding the molding liquid from being difficult to fill the area where the second mounting part is located due to excessive flow resistance, thereby improving the molding yield of the molding base. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without exceeding the scope of protection required by the present application.

[0037] Figure 1 A cross-sectional view of a camera module showing an exemplary embodiment of the present application;

[0038] Figure 2 A schematic diagram showing a molded base according to an exemplary embodiment of the present application;

[0039] Figure 3 A schematic diagram showing a motor according to an exemplary embodiment of the present application being arranged on a molded base;

[0040] Figure 4 A schematic diagram showing that a photosensitive chip according to an exemplary embodiment of the present application is arranged on a chip mounting surface;

[0041] Figure 5 A schematic diagram showing the flow path of the molding liquid according to an exemplary embodiment of the present application;

[0042] Figure 6 A schematic diagram showing the shoulder height of a camera module according to an exemplary embodiment of the present application;

[0043] Figure 7 A schematic diagram showing a first connecting portion of an exemplary embodiment of the present application;

[0044] Figure 8 A schematic diagram showing a camera module according to an exemplary embodiment of the present application;

[0045] Fig. 9 A schematic diagram showing a motor according to an exemplary embodiment of the present application bonded to a molded base;

[0046] Fig.10 An enlarged view of part A of an exemplary embodiment of the present application is shown;

[0047] Fig.11 A schematic diagram showing that an optical filter according to an exemplary embodiment of the present application is disposed on a molded base;

[0048] Fig.12 A schematic diagram showing that the filter holder of the exemplary embodiment of the present application is arranged on a molded base;

[0049] Fig.13 A schematic diagram of a filter holder according to an exemplary embodiment of the present application is shown;

[0050] Fig.14 A schematic diagram showing a molded base according to an exemplary embodiment of the present application being molded on a circuit board;

[0051] Fig.15 A schematic diagram showing an example embodiment of the present application in which the filter holder is molded on a molded base;

[0052] Fig.16 A cross-sectional view showing a circuit board, a molded base, and an optical filter holder according to an exemplary embodiment of the present application;

[0053] Fig.17 A schematic diagram showing a molded base according to an exemplary embodiment of the present application;

[0054] Fig.18A and Fig.18B A schematic diagram of an electronic device according to an exemplary embodiment of the present application is shown.

[0055] in,

[0056] 100- Camera module;

[0057] 10-molded base; 20-circuit board; 30-photosensitive chip; 40-lens module; 50-filter; 60-filter holder; 70-steel plate;

[0058] 1-first mounting part; 11-mounting part body; 12-lug; 13-lens mounting surface; 14-accommodating cavity; 15-filter mounting surface; 16-glue overflow groove; first part 1a; second part 1b;

[0059] 2-second mounting portion; 21-chip mounting surface; first side wall 2a; second side wall 2b;

[0060] 3-first connecting portion; 3a-one end of the first connecting portion; 3b-the other end of the first connecting portion;

[0061] 4- second connecting portion;

[0062] 410-motor; 420-groove;

[0063] 61 - first light-through hole; 62 - filter mounting slot; 63 - second light-through hole. DETAILED DESCRIPTION

[0064] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0065] The described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of these specific details, or other modes, components, materials, devices or the like may be adopted. In these cases, known structures, methods, devices, implementations, materials or operations will not be shown or described in detail.

[0066] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0067] The technical solution of the present application will be described in detail below with reference to the accompanying drawings.

[0068] Figure 1 A cross-sectional view of a camera module according to an exemplary embodiment of the present application is shown, Figure 2 A schematic diagram of a molded base according to an exemplary embodiment of the present application is shown. Figure 1 and Figure 2 As shown, the embodiment of the present application provides a mold base 10, which is molded on a circuit board 20. The photosensitive chip 30 and the lens module 40 are both mounted on the mold base 10. The mold base 10 includes a first mounting portion 1, a second mounting portion 2, a first connecting portion 3 and a second connecting portion 4.

[0069] Figure 3 The schematic diagram showing the motor of the exemplary embodiment of the present application is arranged on the molded base. Figure 2 and Figure 3 As shown, the first mounting portion 1 has a lens mounting surface 13, and the lens mounting surface 13 is used to mount the lens module 40, and the lens mounting surface 13 is perpendicular to the optical axis of the lens module 40. For example, the lens module 40 includes a motor 410, and the motor 410 is located at the bottom end of the lens module 40, and the motor 410 is mounted on the first mounting portion 1.

[0070] Figure 4 A schematic diagram showing a photosensitive chip of an exemplary embodiment of the present application being arranged on a chip mounting surface. Figure 4As shown, the top surface of the second mounting portion 2 is a chip mounting surface 21, and the chip mounting surface 21 is used to mount a photosensitive chip 30. The chip mounting surface 21 is substantially parallel to the lens mounting surface 13. The chip mounting surface 21 is rectangular, which matches the shape of a conventional photosensitive chip.

[0071] By molding the lens mounting surface 13 and the chip mounting surface 21 on the mold base 10, the tolerance accumulation of the lens mounting surface 13 and the chip mounting surface 21 located in different parts can be reduced, so that the lens module 40 and the photosensitive chip 30 are not easily tilted during assembly. In addition, compared with molding the lens mounting surface 13 and the chip mounting surface 21 simultaneously using metal such as stainless steel, in order to achieve a higher flatness of the stainless steel plate, high-cost processes such as acid corrosion and etching are required, and the mold base 10 has a lower processing cost.

[0072] Optionally, with the chip mounting surface 21 as a reference surface, the parallelism of the lens mounting surface 13 is 10-20 μm, so that the chip mounting surface 21 and the lens mounting surface 13 remain roughly parallel. The higher the parallelism between the chip mounting surface 21 and the lens mounting surface 13, the better the optical axis of the lens module 40 can be perpendicular to the photosensitive surface of the photosensitive chip 30.

[0073] For the convenience of description, the width direction of the chip mounting surface 21 is referred to as the first direction. Figure 2 The X direction in the figure, the length direction of the chip mounting surface 21 is the second direction, that is Figure 2 The Y direction in the figure, the height direction of the molding base 10 is the third direction, that is, Figure 2 The Z direction in .

[0074] The first mounting portion 1 includes a first portion 1a and a second portion 1b in the first direction. The second mounting portion 2 has a first side wall 2a and a second side wall 2b in the first direction, and the chip mounting surface 21 is between the first side wall 2a and the second side wall 2b of the second mounting portion 2. The first portion 1a is spaced apart from the first side wall 2a of the second mounting portion 2 in the first direction, and the second portion 1b is spaced apart from the second side wall 2b of the second mounting portion 2 in the first direction.

[0075] The first connection portion 3 is connected between the first portion 1a of the first mounting portion 1 and the first side wall 2a of the second mounting portion 2. The second connection portion 4 is connected between the second portion 1b of the first mounting portion 1 and the second side wall 2b of the second mounting portion 2, so that the first portion 1a, the first connection portion 3, the second mounting portion 2, the second connection portion 4 and the second portion 1b are sequentially connected in the width direction of the chip mounting surface 21, thereby allowing the first connection portion 3 and the second connection portion 4 to extend in the length direction of the chip mounting surface 21, allowing enough space to design the first connection portion 3 and the second connection portion 4, so as to improve the supporting performance of the mold base 10.

[0076] The cross-sectional area of ​​the first connecting portion 3 perpendicular to the first direction is greater than the cross-sectional area of ​​the second connecting portion 4 perpendicular to the first direction. In this embodiment, there is no restriction on the cross-sectional shape of the first connecting portion 3 perpendicular to the first direction and the cross-sectional shape of the second connecting portion 4 perpendicular to the first direction, which can be a regular rectangle, circle, trapezoid, etc., or an irregular shape, but usually, for ease of processing, a regular rectangle is preferred. In this embodiment, there is no restriction on whether the cross-sectional area of ​​the first connecting portion 3 perpendicular to the first direction and the cross-sectional area of ​​the second connecting portion 4 perpendicular to the first direction change. If the extension shape of any one of the first connecting portion 3 and the second connecting portion 4 along the first direction changes, such as gradually shrinking or gradually increasing along the first direction, it only needs to satisfy that the minimum area of ​​the cross-sectional area of ​​the first connecting portion 3 perpendicular to the first direction is greater than or equal to the maximum area of ​​the cross-sectional area of ​​the second connecting portion 4 perpendicular to the first direction.

[0077] Further, in the second direction, the width of the first connection portion 3 is greater than the width of the second connection portion 4, and / or, in the third direction, the thickness of the first connection portion 3 is greater than the thickness of the second connection portion 4. For example, the first connection portion 3 and the second connection portion 4 have the same thickness, the length of the first connection portion 3 along the first direction is the same as the length of the second connection portion 4 along the first direction, and the width of the first connection portion 3 along the second direction (Y direction) is 5 to 8 times the width of the second connection portion 4 along the second direction.

[0078] In other embodiments, the first direction may be the length direction of the chip mounting surface 21, and the second direction may be the width direction of the chip mounting surface 21. In this way, the first portion 1a, the first connection portion 3, the second mounting portion 2, the second connection portion 4, and the second portion 1b are sequentially connected in the length direction of the chip mounting surface 21.

[0079] The first mounting part 1, the second mounting part 2, the first connecting part 3 and the second connecting part 4 are integrally formed by molding, and the chip mounting surface 21 and the lens mounting surface 13 both have a high degree of flatness, which reduces the assembly tilt of the camera module caused by the processing errors of the chip mounting surface 21 and the lens mounting surface 13, and is beneficial to improving the overall assembly accuracy of the camera module.

[0080] The molded base 10 is molded on the circuit board 20 and has high structural strength and heat resistance, and can effectively prevent the photosensitive chip 30 mounted on the chip mounting surface 21 from tilting or warping.

[0081] Figure 5 Schematic diagram showing the flow path of the molding liquid of the exemplary embodiment of the present application. Figure 5 As shown in FIG. 1 , the injection port of the mold is arranged near the first connection part 3, and the injection port of the mold is arranged approximately in a butt connection with the second connection part 4. The flow path of the molding liquid is as follows: Figure 5As shown by the arrow, during the molding process, the resistance of the molding liquid flowing to the first connecting portion 3 is less than that flowing to the second connecting portion 4. A pressure difference can be formed on both sides of the central portion inside the mold, and the molding liquid forms a flow path of the first connecting portion 3 - the second mounting portion 2 - the second connecting portion 4, facilitating the rapid flow of the molding liquid to the area where the second mounting portion 2 of the mold is located and improving the molding yield of the molding base 10.

[0082] Optionally, the photosensitive chip 30 is disposed on the chip mounting surface 21 through an adhesive. A gap is reserved between the first mounting portion 1 and the second mounting portion 2.

[0083] In some embodiments, the circuit board 20 and the photosensitive chip 30 are connected by leads. The leads pass through the gap between the first mounting portion 1 and the second mounting portion 2. One end of the lead is connected to the circuit board 20, and the other end of the lead is connected to the photosensitive chip 30 to electrically connect the circuit board 20 and the photosensitive chip 30. Optionally, the lead is located on the short side of the second mounting portion 2.

[0084] For example, the lead is a gold wire. After the photosensitive chip 30 is bonded to the chip mounting surface 21 of the second mounting portion 2, the photosensitive chip 30 is electrically connected to the circuit board 20 through the gold wire bonding process. The lead can also be other types of leads, such as silver wires, copper wires, etc.

[0085] As Figure 2 shown, in some embodiments, the first mounting portion 1 includes: a mounting portion body 11 and lugs 12. The mounting portion body 11 is generally in a rectangular shape with a hole in the middle, and the mounting portion body 11 has an inner side wall adjacent to the second mounting portion 2 and an outer side wall away from the second mounting portion 2. The lugs 12 are provided on the outer side wall of the mounting portion body 11. Optionally, the number of lugs 12 is multiple. For example, the number of lugs 12 is four, and the four lugs 12 are respectively arranged at the four corners of the mounting portion body 11, which can make the distribution of the lugs 12 more balanced. In other embodiments, the number of lugs 12 can also be three.

[0086] The bottom surface of the lug 12 is flush with the bottom surface of the mounting portion body 11. The size of the lug 12 is set according to requirements. For example, the length of the lug 12 in the first direction is about 1 / 8 of the length of the mounting portion body 11 in the first direction, and the width of the lug 12 in the second direction is about 1 / 15 of the width of the mounting portion body 11 in the second direction. Optionally, at least part of the lugs 12 are in an L shape to improve the structural strength of the lugs 12.

[0087] The lens mounting surface 13 is located on the lug 12, for example, the top surface of the lug 12 is used as the lens mounting surface 13. By setting the lens mounting surface 13 on the lug 12 instead of using the top surface of the mounting body 11 as the lens mounting surface, the total area of ​​the lens mounting surface 13 can be reduced, and the difficulty of processing high parallelism between the lens mounting surfaces 13 can be reduced, thereby reducing the lens assembly tilt caused by processing errors and improving the assembly accuracy of the camera module.

[0088] Figure 6 Schematic diagram of the shoulder height of the camera module of the exemplary embodiment of the present application is shown. In some embodiments, the top surface of the lug 12 is lower than the top surface of the mounting body 11. For example, the bottom surface of the lug 12 is flush with the bottom surface of the mounting body 11, and the thickness of the lug 12 (height in the Z direction) is 1 / 5 of the thickness of the mounting body 11. Figure 6 As shown, the shoulder height H of the camera module is the height from the bottom of the camera module to the step surface of the motor 410. When the camera module is assembled to an electronic device, the shoulder height H of the camera module affects the thickness of the electronic device. The greater the shoulder height H of the camera module, the greater the thickness of the electronic device.

[0089] The existing camera module sets the motor 410 on the filter holder or the top surface of the molded base 10. In this embodiment, the motor 410 is set on the lug 12, and the top surface of the lug 12 is lower than the top surface of the mounting body 11, which can reduce the shoulder height H of the camera module and reduce the thickness of the electronic device.

[0090] In some embodiments, the mounting portion body 11 is in a frame shape surrounding the second mounting portion 2. For example, the mounting portion body 11 is substantially in a U-shaped shape. The mounting portion body 11 has at least three corners, wherein lugs 12 are provided at at least three corners.

[0091] In some embodiments, the interior of the first mounting portion 1 is a through accommodating cavity 14. The second mounting portion 2 is located in the accommodating cavity 14, which is beneficial to reducing the overall height of the molding base 10.

[0092] Optionally, the thickness of the second mounting portion 2 is smaller than the thickness of the mounting portion body 11 , so that the photosensitive chip 30 can be disposed in the accommodating cavity 14 .

[0093] Figure 7 Schematic diagram of the first connecting portion of the exemplary embodiment of the present application is shown. Figure 7As shown, in some embodiments, the width direction of the chip mounting surface 21 is the first direction, and the cross section of the first connecting portion 3 perpendicular to the first direction gradually decreases from the inner wall of the first mounting portion 1 to the first side wall 2a of the second mounting portion 2. The end surface area of ​​the first connecting portion 3 connecting one end 3a of the first mounting portion 1 is greater than the end surface area of ​​the first connecting portion 3 connecting one end 3b of the second mounting portion 2. From the first mounting portion 1 to the second mounting portion 2, the cross section of the first connecting portion 3 perpendicular to the first direction and the thickness gradually decrease.

[0094] According to Bernoulli's principle, the cross-section of the first connecting portion 3 perpendicular to the first direction gradually decreases from the inner wall of the first mounting portion 1 to the first side wall 2a of the second mounting portion 2, which can accelerate the molding liquid to enter the area where the second mounting portion 2 is located from the area where the first connecting portion 3 is located in the mold, thereby improving the molding yield of the second mounting portion 2.

[0095] In some embodiments, Figure 7 As shown, the end surface area of ​​the end portion 3 b of the first connecting portion 3 connected to the second mounting portion 2 is equal to the area of ​​the side wall of the second mounting portion 2 connected to the first connecting portion 3 .

[0096] In another embodiment, the end surface area of ​​the end portion 3b of the first connection portion 3 connected to the second mounting portion 2 is smaller than the area of ​​the side wall of the second mounting portion 2 connected to the first connection portion 3, so as to reduce the material used for the first connection portion 3. The size of the first connection portion 3 is set according to the requirements. If the size of the first connection portion 3 is too small, it may affect the flow of the molding liquid, thereby affecting the molding liquid filling the area where the second mounting portion 2 is located in the mold.

[0097] Figure 8 A schematic diagram of a camera module of an exemplary embodiment of the present application is shown. Figure 1 and Figure 8 As shown, an embodiment of the present application provides a camera module 100, which includes a molded base 10, a circuit board 20, a photosensitive chip 30 and a lens module 40 as described above.

[0098] The molded base 10 is integrally formed on the circuit board 20 by a molding process. The molded base 10 has a lens mounting surface 13 and a chip mounting surface 21. The photosensitive chip 30 is arranged on the chip mounting surface 21 of the second mounting portion 2. The lens module 40 is arranged on the lens mounting surface 13 of the first mounting portion 1. The lens module 40 is located on the light sensing path of the photosensitive chip 30.

[0099] For example, the photosensitive chip 30 is arranged on the chip mounting surface 21 by adhesive. In the process of mounting the photosensitive chip 30 on the chip mounting surface 21, adhesive is applied on the chip mounting surface 21 of the second mounting part 2. The adhesive can be adhesive materials such as glue and solid glue. The photosensitive chip 30 is arranged on the chip mounting surface 21, and the adhesive is cured so that the photosensitive chip 30 is bonded to the chip mounting surface 21.

[0100] The lens module 40 is set on the lens mounting surface 13 by adhesive. The bonding process of the lens module 40 is the same as the bonding process of the photosensitive chip 30, which will not be repeated. When the first mounting portion 1 is provided with a lug 12, the lens mounting surface 13 is located on the top surface of the lug 12. Optionally, the lens module 40 is bonded to the lug 12 and the circuit board 20 respectively.

[0101] In other examples of the camera module, the number of the lens modules 40 may be more than one, and accordingly, the number of the photosensitive chips 30 may be more than one, so as to form an array camera module. In addition, the type of the lens module 40 may be adjusted accordingly according to the requirements of the camera module, for example, the lens module 40 may be implemented as an integrated optical lens, a split optical lens, a bare lens, or an optical lens including a lens barrel, etc., and the present application does not limit this.

[0102] Fig. 9 Schematic diagram showing the bonding of the motor to the molded base in the exemplary embodiment of the present application. Fig. 9 As shown, in some embodiments, a groove 420 is provided on the bottom surface of the lens module 40, for example, a groove 420 is provided on the bottom surface of the motor 410. The groove 420 corresponds to the lug 12 of the first mounting portion 1, and the lug 12 can be inserted into the groove 420 to mount the lens module 40 to the first mounting portion 1.

[0103] Adhesive is filled between the groove 420 and the lug 12. When the groove 420 is not provided, the lens module 40 is only bonded to the lens mounting surface 13, and the adhesive adhesion surface is small. A groove 420 is provided on the bottom surface of the lens module 40, and adhesive is filled between the side wall of the groove 420 and the side wall of the lug 12 and between the groove bottom of the groove 420 and the lens mounting surface 13 to increase the adhesive adhesion surface and increase the bonding strength. Adhesive can also be provided between the lens module 40 and the circuit board 20 as required.

[0104] Fig.10 An enlarged view of part A of an exemplary embodiment of the present application is shown. Fig.10As shown, in some embodiments, a first gap a is formed between the bottom of the groove 420 and the lens mounting surface 13, and a second gap b is formed between the groove wall of the groove 420 and the lug 12. The first gap a and the second gap b are both filled with adhesive. The gap value of the first gap a is the height of the first gap a along the Z direction. The gap value of the second gap b is the length of the second gap b along the Y direction. The gap value of the first gap a is smaller than the gap value of the second gap b, so that the amount of adhesive filled in the second gap b is greater than the amount of adhesive filled in the first gap a. The adhesive will shrink unevenly during the curing process, which may easily lead to an uneven surface of the adhesive. The more adhesive, the greater the degree of shrinkage of the adhesive, which may easily lead to the tilt of the lens module 40 assembly. By concentrating more adhesive in the second gap b, less adhesive is filled in the first gap a, and reducing the degree of shrinkage of the adhesive filled in the first gap a, it is beneficial to improve the parallelism of the bottom of the groove 420 relative to the lens mounting surface 13, and reduce the possibility of tilting the lens module 40 assembly.

[0105] In some embodiments, a third gap c is formed between the bottom surface of the lens module 40 and the circuit board 20, for example, a third gap c is formed between the bottom surface of the motor 410 and the circuit board 20. The gap value of the third gap c is the height of the third gap c along the Z direction. The third gap c is filled with adhesive. The adhesive is arranged between the lens module 40 and the circuit board 20 to better fix the lens module 40.

[0106] The gap value of the third gap c is greater than the gap value of the first gap a, which is conducive to more reliable bonding of the lens module 40 and the circuit board 20. If the gap value of the third gap c is too small, the bonding reliability between the lens module 40 and the circuit board 20 may be reduced.

[0107] In some embodiments, the gap value of the third gap c is smaller than the gap value of the second gap b. The gap value of the third gap c is between the gap value of the first gap a and the gap value of the second gap b, which is beneficial to reduce the tilt of the lens module 40 caused by assembly.

[0108] Fig.11 Schematic diagram showing that the filter of the exemplary embodiment of the present application is arranged on a molded base. Fig.11 As shown, in some embodiments, the camera module 100 further includes a filter 50, which is disposed on the molded base 10 and is located on the optical axis of the lens module 40 to filter out stray light such as infrared rays and improve the image quality of the camera module. In the optical path, the filter 50 is located between the lens module 40 and the photosensitive chip 30.

[0109] like Figure 2As shown, in some embodiments, a filter mounting surface 15 is provided on the top of the first mounting portion 1, and the filter mounting surface 15 is a plane. A filter 50 is provided on the filter mounting surface 15, and optionally, the filter 50 is connected to the filter mounting surface 15 by adhesive.

[0110] When assembling the filter 50 , the adhesive is applied to the filter mounting surface 15 , and then the filter 50 is mounted on the filter mounting surface 15 . After the adhesive on the filter mounting surface 15 is cured, the filter 50 and the filter mounting surface 15 are bonded.

[0111] A glue overflow groove 16 is provided at the top of the first mounting portion 1, and the glue overflow groove 16 corresponds to the optical filter 50. For example, the glue overflow groove 16 is connected to the outer edge of the optical filter mounting surface 15. When the optical filter 50 is mounted on the optical filter mounting surface 15, the optical filter 50 is appropriately pressed so that the adhesive on the optical filter mounting surface 15 fully contacts the optical filter 50. When the optical filter 50 is pressed, the excess adhesive squeezed out flows into the glue overflow groove 16 to prevent the adhesive from contaminating other components.

[0112] Optionally, the top surface of the second mounting portion 2 is lower than the top surface of the mounting portion body 11 , so as to facilitate setting the filter 50 on the molded base 10 to avoid interference between the filter 50 and the photosensitive chip 30 .

[0113] Fig.12 A schematic diagram showing that the filter holder of the exemplary embodiment of the present application is arranged on a molded base, Fig.13 Schematic diagram of the filter holder of the exemplary embodiment of the present application is shown. Fig.12 and Fig.13 As shown, the camera module 100 further includes a filter holder 60. The filter holder 60 is disposed on the top of the molded base 10. The top surface of the filter holder 60 is provided with a first light hole 61 and a filter mounting groove 62 adapted to the filter 50. The filter 50 is mounted in the filter mounting groove 62, and light passes through the filter 50 and the first light hole 61 and is incident on the photosensitive chip 30.

[0114] When preparing the camera module 100, the molded base 10 is first molded on the circuit board 20, then the photosensitive chip 30 is bonded to the chip mounting surface 21, and then the separately molded filter holder 60 is bonded to the top surface of the molded base 10, and the filter 50 is installed in the filter mounting groove 62 of the filter holder 60.

[0115] The photosensitive chip 30 includes a photosensitive area and a non-photosensitive area. The projection of the filter holder 60 in the Z direction at least covers part of the non-photosensitive area of ​​the photosensitive chip 30, which is conducive to reducing the size of the filter 50 and reducing the risk of the filter 50 breaking.

[0116] Fig.14A schematic diagram showing a molded base molded on a circuit board according to an exemplary embodiment of the present application is shown. Fig.15 A schematic diagram showing an exemplary embodiment of the present application in which the filter holder is molded on a molded base, Fig.16 is a cross-sectional view of the circuit board, molded base, and filter holder. Fig.14 , Fig.15 and Fig.16 As shown, in some embodiments, after the mold base 10 is molded on the circuit board 20, the photosensitive chip 30 is bonded to the chip mounting surface 21. The photosensitive chip 30 is electrically connected to the circuit board 20 through leads. Then the filter holder 60 is molded on the top surface of the mold base 10. The filter holder 60 covers at least part of the non-photosensitive area of ​​the photosensitive chip 30. The mold base 10 is first molded on the circuit board 20, and then the filter holder 60 is molded on the mold base 10, so that the photosensitive chip 30 is covered by secondary molding.

[0117] The filter holder 60 is provided with a second light through hole 63, and the filter 50 can be bonded to the top surface of the filter holder 60. Light passes through the filter 50 and the second light through hole 63 and is incident on the photosensitive chip 30. Molding the filter holder 60 on the molding base 10 is also conducive to reducing the size of the filter 50, so as to reduce the risk of the filter 50 breaking.

[0118] Fig.17 A schematic diagram of a molded base according to an exemplary embodiment of the present application is shown. Fig.17 As shown, in some embodiments, the top surface of the lug 12 is flush with the top surface of the mounting body 11, and the top surface of the second mounting portion 2 is flush with the top surface of the mounting body 11. The overall thickness of the molded base 10 is uniform, which is convenient for modeling the molded base 10 and for molding the filter holder 60 on the molded base 10. In other embodiments, the top surface of the lug 12 can be higher than the top surface of the mounting body 11, and the top surface of the second mounting portion 2 is higher than the top surface of the mounting body 11.

[0119] like Figure 1 As shown, optionally, the camera module 100 further includes a steel plate 70, which is disposed on a surface of the circuit board 20 away from the molding base 10, for example, the steel plate 70 is disposed on the bottom surface of the circuit board 20. The steel plate 70 is connected to the circuit board 20 by bonding. Providing the steel plate 70 on the surface of the circuit board 20 away from the molding base 10 can reduce the possibility of warping of the circuit board 20, thereby improving the imaging quality of the camera module 100.

[0120] Optionally, a plurality of electronic components are disposed on the circuit board 20. When the molded base 10 is integrally molded on the circuit board 20, the molded base 10 covers at least a portion of the electronic components on the circuit board 20 to provide protection for the covered electronic components.

[0121] Fig.18A and Fig.18B A schematic diagram of an electronic device according to an exemplary embodiment of the present application is shown. Fig.18A and Fig.18B As shown, according to another aspect of the present application, an embodiment of the present application provides an electronic device, wherein the electronic device includes an electronic device body 200 and at least one camera module 100 as described above. Each camera module 100 is respectively arranged on the electronic device body 200 for acquiring images. It is worth mentioning that the type of the electronic device body 200 is not limited. For example, the electronic device body 200 can be any electronic device that can be configured with a camera module 100, such as a smart phone, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, etc. It can be understood by those skilled in the art that although the attached Fig.18A and attached Fig.18B The electronic device body 200 is implemented as a smart phone as an example, but it does not constitute a limitation on the content and scope of this application.

[0122] For example, Fig.18A As shown, the camera module 100 is disposed on the electronic device body 200 and faces the front side of the electronic device body 200 , so that the camera module 100 serves as a front camera of the electronic device for photographing spatial objects in front of the electronic device body 200 .

[0123] In addition, if Fig.18B As shown, the camera module 100 is disposed on the electronic device body 200 and faces the rear side of the electronic device body 200 , so that the camera module 100 serves as a rear camera of the electronic device for photographing spatial objects behind the electronic device body 200 .

[0124] The embodiments of the present application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core ideas of the present application. Therefore, changes or deformations made by those skilled in the art based on the ideas of the present application, the specific implementation methods and the scope of application of the present application, all belong to the scope of protection of the present application. In summary, the contents of this specification should not be construed as limiting the present application.

Claims

1. A molded base, characterized in that: include: A first mounting portion having a lens mounting surface, wherein the first mounting portion includes a first portion and a second portion; A second mounting portion, having a first side wall and a second side wall opposite to each other along a first direction, a first portion of the first mounting portion and a first side wall of the second mounting portion being spaced apart in the first direction, a second portion of the first mounting portion and a second side wall of the second mounting portion being spaced apart in the first direction, and the second mounting portion further having a chip mounting surface located between the first side wall and the second side wall; a first connecting portion connected to a first portion of the first mounting portion and a first side wall of the second mounting portion; The second connecting part is connected to the second part of the first mounting part and the second side wall of the second mounting part, and the cross-sectional area of ​​the first connecting part perpendicular to the first direction is larger than the cross-sectional area of ​​the second connecting part perpendicular to the first direction, so that when preparing the molding base, the injection port of the mold is set on the side close to the first connecting part, and the injection port of the mold is arranged diagonally with the second connecting part, so that the molding liquid forms a flow path from the first connecting part-the second mounting part-the second connecting part.

2. The molded base according to claim 1, characterized in that The first mounting portion comprises: The mounting portion body has an inner side wall adjacent to the second mounting portion and an outer side wall away from the second mounting portion; A lug is arranged on the outer side wall of the mounting body, and the lens mounting surface is located on the lug.

3. The molded base according to claim 2, characterized in that: The top surface of the lug is lower than the top surface of the mounting portion body.

4. The molded base according to claim 2, characterized in that: The mounting portion body is in a frame shape surrounding the second mounting portion, and the mounting portion body has at least three corners, wherein the lugs are disposed at at least three corners.

5. The molded base according to claim 1, characterized in that The chip mounting surface is substantially rectangular, and the first direction is a width direction of the chip mounting surface.

6. The molded base according to claim 1, characterized in that The cross-sectional area of ​​the first connecting portion gradually decreases from the first mounting portion to the second mounting portion.

7. The molded base according to claim 1, characterized in that The first direction is parallel to the chip mounting surface, a direction perpendicular to the first direction and parallel to the chip mounting surface is a second direction, and a direction orthogonal to the first direction and the second direction is a third direction. In the second direction, the width of the first connection portion is greater than the width of the second connection portion, and / or, in the third direction, the thickness of the first connection portion is greater than the thickness of the second connection portion.

8. A camera module, characterized in that: include: Circuit board; The molded base according to any one of claims 1 to 7, arranged on the circuit board; A photosensitive chip, arranged on the chip mounting surface of the second mounting portion; The lens module is arranged on the lens mounting surface of the first mounting portion and is located in the light sensing path of the light sensing chip.

9. The camera module according to claim 8, characterized in that: The bottom surface of the lens module is provided with a groove, and the lug of the first mounting portion is inserted into the groove.

10. The camera module according to claim 9, characterized in that: A first gap is formed between the bottom of the groove and the lens mounting surface, and a second gap is formed between the groove wall and the lug. The gap value of the first gap is smaller than the gap value of the second gap, and both the first gap and the second gap are filled with adhesive.

11. The camera module according to claim 10, characterized in that: A third gap is formed between the bottom surface of the lens module and the circuit board, the gap value of the third gap is greater than the gap value of the first gap, and the third gap is filled with adhesive.

12. The camera module according to claim 11, characterized in that: A gap value of the third gap is smaller than a gap value of the second gap.

13. The camera module according to claim 8, characterized in that: A filter mounting surface is provided on the top of the first mounting portion, a filter is provided on the filter mounting surface, and, on the optical path, the filter is located between the lens module and the photosensitive chip.

14. The camera module according to claim 13, characterized in that: A glue overflow groove is provided on the top of the first mounting portion, and the glue overflow groove is connected to the outer edge of the filter mounting surface.

15. The camera module according to claim 13, characterized in that: A filter seat is provided on the top of the first mounting portion, and the filter is mounted on the filter seat.

16. The camera module according to claim 15, characterized in that: The filter seat is molded on the molded base, and the filter seat covers a portion of the photosensitive chip.

17. An electronic device, characterized in that: include: Electronic device body; The camera module as described in any one of claims 8 to 16 is arranged on the electronic device body.