Cutting method, device, computer equipment, readable storage medium and program product

By obtaining and adjusting the positioning points and reference points of the cutting object, the target cutting trajectory is generated, which solves the cutting error problem caused by deformation, and realizes efficient and accurate laser cutting, which is suitable for a variety of application scenarios.

CN118875535BActive Publication Date: 2024-12-13MAXWELL TECH (ZHUHAI) CO LTD
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Patent Information

Application Number
CN202411397327.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-09
Publication Date
2024-12-13
Estimated Expiration
2044-10-09

AI Technical Summary

Technical Problem

During laser cutting, flexible material products such as display panels are deformed due to heat treatment steps such as glue coating, resulting in a shift in cutting position and cutting errors. The prior art is difficult to effectively solve, and manual adjustment of graphics is time-consuming and inefficient.

Method used

By obtaining the actual positioning point and reference positioning point of the object to be cut, determining the position deviation, adjusting the preset cutting breakpoint, generating the target cutting trajectory, and ensuring cutting accuracy.

Benefits of technology

It realizes efficient and accurate cutting, reduces manual adjustment workload, improves cutting efficiency, is suitable for different deformation scenarios, and reduces cutting errors.

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Abstract

The present application relates to a cutting method, device, computer equipment, computer-readable storage medium and computer program product. The method comprises: obtaining an actual positioning point, a reference positioning point and a preset cutting breakpoint matching the reference positioning point of the object to be cut, wherein the preset cutting breakpoint divides the reference cutting trajectory of the object to be cut into at least one local cutting trajectory; determining a deviation cutting breakpoint from the preset cutting breakpoints according to the position deviation between the actual positioning point and the reference positioning point; adjusting the local cutting trajectory corresponding to the deviation cutting breakpoint according to the position deviation to obtain a target cutting trajectory, and cutting the object to be cut according to the target cutting trajectory. The use of this method can improve cutting accuracy.
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Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a cutting method, device, computer equipment, computer-readable storage medium and computer program product. Background Art

[0002] In some laser processing scenarios, the product processing process chain includes heat treatment steps such as gluing, laser cutting, etc. Usually, the laser cutting step is cut according to a fixed pattern. For flexible material products such as display panels, heat treatment steps such as gluing will cause local deformation of the product, causing the local cutting position to shift. When cutting according to a fixed pattern, cutting errors will occur and the cutting accuracy is poor.

[0003] In the related art, the cutting fixed pattern corresponding to the same batch of products can be manually modified before cutting. However, the precision control of heat treatment steps such as gluing is difficult to guarantee, and the deformation of different products in the same batch will also be different. This method of adjustment requires a lot of manual work, is inefficient, and still has large cutting errors. Summary of the invention

[0004] Based on this, it is necessary to provide a cutting method, device, computer equipment, computer-readable storage medium and computer program product that can improve cutting accuracy in response to the above technical problems.

[0005] In a first aspect, the present application provides a cutting method, the method comprising:

[0006] Acquire an actual positioning point of the object to be cut, a reference positioning point, and a preset cutting breakpoint matching the reference positioning point, wherein the preset cutting breakpoint divides the reference cutting trajectory of the object to be cut into at least one local cutting trajectory;

[0007] Determining a deviation cutting breakpoint from the preset cutting breakpoints according to a position deviation between the actual positioning point and the reference positioning point;

[0008] According to the position deviation, the local cutting trajectory corresponding to the deviation cutting breakpoint is adjusted to obtain a target cutting trajectory, and the object to be cut is cut according to the target cutting trajectory.

[0009] In one embodiment, adjusting the local cutting trajectory corresponding to the deviation cutting breakpoint according to the position deviation includes:

[0010] Determining a deviation parameter according to a position deviation between the actual positioning point and the reference positioning point;

[0011] The local cutting trajectory corresponding to the deviation cutting breakpoint is adjusted according to the deviation parameter.

[0012] In one embodiment, determining the deviation parameter according to the position deviation between the actual positioning point and the reference positioning point includes:

[0013] Determine, from the actual positioning points, a first positioning point which has a position deviation from a corresponding reference positioning point;

[0014] Determine a reference positioning point that matches the first positioning point as a second positioning point, and determine an actual positioning point adjacent to the first positioning point as a third positioning point;

[0015] The deviation parameter is determined according to the first relative position information between the first positioning point and the third positioning point and the second relative position information between the second positioning point and the third positioning point.

[0016] In one embodiment, obtaining the actual positioning point of the object to be cut includes:

[0017] Acquire an image of the object to be cut;

[0018] The actual positioning point of the object to be cut is determined according to the image and the target coordinate conversion parameters.

[0019] In one embodiment, cutting the object to be cut includes:

[0020] Controlling the laser cutting module to cut the object to be cut;

[0021] The object to be cut is placed on a cutting platform, and the target coordinate conversion parameters are determined in the following manner:

[0022] Acquire a reference image of a feature plate placed on the cutting platform, wherein a plurality of feature points are arranged on the feature plate;

[0023] According to the position information of the plurality of feature points on the reference image, target coordinate conversion parameters between the coordinate system of the feature plate and the coordinate system of the laser cutting module are determined.

[0024] In one embodiment, the method for determining the preset cutting breakpoint includes:

[0025] Acquire coordinate data of preset track points in a reference cutting track of the object to be cut;

[0026] For the preset track points, the preset cutting breakpoints are determined according to the value change information of the coordinate data of the adjacent preset track points.

[0027] In a second aspect, the present application further provides a cutting device, the device comprising:

[0028] An acquisition module, used to acquire an actual positioning point of the object to be cut, a reference positioning point, and a preset cutting breakpoint matching the reference positioning point, wherein the preset cutting breakpoint divides the reference cutting trajectory of the object to be cut into at least one local cutting trajectory;

[0029] A determination module, configured to determine a deviation cutting breakpoint from the preset cutting breakpoints according to a position deviation between the actual positioning point and the reference positioning point;

[0030] The cutting module is used to adjust the local cutting trajectory corresponding to the deviation cutting breakpoint according to the position deviation to obtain a target cutting trajectory, and cut the object to be cut according to the target cutting trajectory.

[0031] In one embodiment, the cutting module comprises:

[0032] A first determination submodule, configured to determine a deviation parameter according to a position deviation between the actual positioning point and the reference positioning point;

[0033] The adjustment submodule is used to adjust the local cutting trajectory corresponding to the deviation cutting breakpoint according to the deviation parameter.

[0034] In one embodiment, the first determining submodule includes:

[0035] A first determining unit, configured to determine, from the actual positioning points, a first positioning point having a position deviation from a corresponding reference positioning point;

[0036] A second determining unit, configured to determine a reference positioning point matching the first positioning point as a second positioning point, and determine an actual positioning point adjacent to the first positioning point as a third positioning point;

[0037] The third determining unit is used to determine the deviation parameter according to the first relative position information between the first positioning point and the third positioning point and the second relative position information between the second positioning point and the third positioning point.

[0038] In one embodiment, the acquisition module includes:

[0039] An acquisition submodule, used to acquire an image of the object to be cut;

[0040] The second determination submodule is used to determine the actual positioning point of the object to be cut according to the image and the target coordinate conversion parameters.

[0041] In one embodiment, the cutting module comprises:

[0042] A cutting submodule, used for controlling the laser cutting module to cut the object to be cut;

[0043] The object to be cut is placed on a cutting platform, and the device further comprises a module for determining the target coordinate conversion parameters, wherein the module for determining the target coordinate conversion parameters is used to:

[0044] Acquire a reference image of a feature plate placed on the cutting platform, wherein a plurality of feature points are arranged on the feature plate;

[0045] According to the position information of the plurality of feature points on the reference image, target coordinate conversion parameters between the coordinate system of the feature plate and the coordinate system of the laser cutting module are determined.

[0046] In one embodiment, the device further comprises a module for determining the preset cutting breakpoint, and the module for determining the preset cutting breakpoint is used to:

[0047] Acquire coordinate data of preset track points in a reference cutting track of the object to be cut;

[0048] For the preset track points, the preset cutting breakpoints are determined according to the value change information of the coordinate data of the adjacent preset track points.

[0049] In a third aspect, an embodiment of the present disclosure further provides a computer device, wherein the computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of any one of the methods in the embodiments of the present disclosure are implemented.

[0050] In a fourth aspect, the embodiments of the present disclosure further provide a computer-readable storage medium, wherein a computer program is stored thereon, and when the computer program is executed by a processor, the steps of any one of the methods in the embodiments of the present disclosure are implemented.

[0051] In a fifth aspect, the embodiments of the present disclosure further provide a computer program product, wherein the computer program product includes a computer program, and when the computer program is executed by a processor, the steps of any one of the methods in the embodiments of the present disclosure are implemented.

[0052] The above-mentioned cutting method, device, computer equipment, computer-readable storage medium and computer program product, when cutting the object to be cut, obtain the actual positioning point, reference positioning point and preset cutting breakpoint matching the reference positioning point of the object to be cut, determine the deviation cutting breakpoint from the preset cutting breakpoints according to the position deviation between the actual positioning point and the reference positioning point, and can determine the breakpoint corresponding to the position deviation and make deviation adjustment; adjust the local cutting trajectory corresponding to the deviation cutting breakpoint according to the position deviation to obtain the target cutting trajectory, so that the cutting trajectory can be adjusted according to the position deviation of the positioning point to avoid the problem of cutting error caused by deformation of the object to be cut, etc., for different objects to be cut and different deformation scenes, the cutting trajectory can be adjusted in a targeted manner through the actual positioning point and the reference positioning point to obtain an accurate target cutting trajectory; the object to be cut is cut according to the target cutting trajectory, so as to ensure the accuracy of the cutting, without the need for manual batch adjustment, thereby reducing the manual workload and artificial measurement errors, and improving the cutting efficiency. In the case of irregular local deformation of the object to be cut, efficient and accurate cutting can be achieved, which is suitable for more application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0054] Figure 1 A schematic diagram of a cutting method according to an embodiment;

[0055] Figure 2 A schematic diagram of a reference cutting trajectory and preset cutting breakpoints in one embodiment;

[0056] Figure 3 is a schematic diagram of a cutting track in one embodiment;

[0057] Figure 4 is a schematic structural diagram of a cutting device in one embodiment;

[0058] Figure 5 is a schematic diagram of a position data conversion process in one embodiment;

[0059] Figure 6 A schematic diagram of a method for determining a preset cutting breakpoint in one embodiment;

[0060] Figure 7 is a schematic flow chart of a cutting method in another embodiment;

[0061] Figure 8 is a structural block diagram of a cutting device in one embodiment;

[0062] Fig. 9 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0064] In one embodiment, Figure 1 As shown, a cutting method is provided. This embodiment uses the method applied to a terminal as an example for illustration. It can be understood that the method can also be applied to a server, and can also be applied to a system including a terminal and a server, and is implemented through the interaction between the terminal and the server. In this embodiment, the method includes the following steps:

[0065] Step S110, obtaining an actual positioning point of the object to be cut, a reference positioning point, and a preset cutting breakpoint matching the reference positioning point, wherein the preset cutting breakpoint divides the reference cutting trajectory of the object to be cut into at least one local cutting trajectory;

[0066] Exemplarily, the object to be cut corresponds to a reference cutting trajectory, and the reference cutting trajectory can be obtained according to the standard drawing corresponding to the object to be cut, that is, the cutting trajectory corresponding to the object to be cut when it is not deformed. The reference cutting trajectory corresponds to preset cutting breakpoints, which are used to divide the reference cutting trajectory into local cutting trajectories, so that the trajectory can be locally adjusted during the subsequent trajectory adjustment process. In a possible implementation, in order to position the object to be cut, a positioning point is set on the object to be cut. In an example, the positioning point can be set in advance at a preset position of the object to be cut according to the actual application scenario. Since the object to be cut may be deformed during the processing, the actual positioning point on the object to be cut may be offset. In this embodiment, the actual positioning point and the reference positioning point are obtained, and the reference positioning point is the position of the positioning point at the standard position of the object to be cut if it is not deformed.

[0067] The objects to be cut may include but are not limited to mechanical parts, electronic components, display panels, etc., which can be determined based on the actual application scenario. In some possible implementations, the actual positioning points of the objects to be cut can be obtained through image acquisition and recognition, sensor recognition, etc.; the reference positioning points, reference cutting trajectories, and preset cutting breakpoints can be determined through the standard drawings corresponding to the objects to be cut.

[0068] Optionally, there is an association relationship between the reference positioning point and the preset cutting breakpoint. In one example, the association relationship between the reference positioning point and the preset cutting breakpoint can be determined based on the positional relationship between the two. For example, the preset cutting breakpoint closest to the reference positioning point is determined as the preset cutting breakpoint that matches the reference positioning point; the preset cutting breakpoint within the preset range of the reference positioning point can also be determined as the preset cutting breakpoint that matches the reference positioning point; specifically, it can be determined based on the actual application scenario. In one example, the preset cutting breakpoint can be manually set on the reference cutting trajectory, or it can be automatically calculated based on the reference cutting trajectory, and specifically, it can be determined based on the actual application scenario.

[0069] Figure 2 is a schematic diagram of a reference cutting trajectory and preset cutting breakpoints according to an exemplary embodiment, Figure 2 As shown, the solid line represents the reference cutting trajectory, the black dot represents the preset cutting breakpoint, and the cutting breakpoints are respectively set at the upper left, upper right, lower left, and lower right positions of the cutting figure.

[0070] Step S120, determining a deviation cutting breakpoint from the preset cutting breakpoints according to a position deviation between the actual positioning point and the reference positioning point;

[0071] Exemplarily, after determining the actual positioning point and the reference positioning point, the deviation cutting breakpoint is determined according to the position deviation between the actual positioning point and the reference positioning point. Since the actual positioning point is the actual positioning point position on the object to be cut, and the reference positioning point is the positioning point position under ideal conditions when the object to be cut is not deformed, the actual positioning point and the reference positioning point correspond one to one, and the position deviation between the actual positioning point and the reference positioning point includes the position deviation between the actual positioning point and the corresponding reference positioning point.

[0072] In one example, an actual positioning point with a deviation or a deviation greater than an allowable error range can be determined based on the position deviation between the actual positioning point and the reference positioning point, and a preset cutting breakpoint that matches the reference positioning point corresponding to the actual positioning point can be determined as the deviation cutting breakpoint.

[0073] Step S130, adjusting the local cutting trajectory corresponding to the deviation cutting breakpoint according to the position deviation to obtain a target cutting trajectory, and cutting the object to be cut according to the target cutting trajectory.

[0074] Exemplarily, the local cutting trajectory corresponding to the deviation cutting breakpoint is adjusted according to the position deviation. In one example, the local cutting trajectory adjacent to the deviation cutting breakpoint can be determined as the local cutting trajectory corresponding to the deviation cutting breakpoint. One deviation cutting breakpoint can correspond to one or two local cutting trajectories.

[0075] Optionally, according to the position deviation between the positioning points, the position of the trajectory point on the corresponding local cutting trajectory can be adjusted to obtain the adjusted target local cutting trajectory, and the target cutting trajectory can be determined by combining the reference cutting trajectory before adjustment. In one example, the object to be cut can be cut by a laser cutting module. In one example, the reference cutting trajectory can include multiple local cutting trajectories, the local cutting trajectory corresponding to the deviation cutting breakpoint is the local cutting trajectory to be adjusted, and the remaining local cutting trajectories are local cutting trajectories that do not need to be adjusted. After all the local cutting trajectories to be adjusted are adjusted, the target cutting trajectory is determined by combining the local cutting trajectories that do not need to be adjusted.

[0076] In the disclosed embodiment, when cutting an object to be cut, an actual positioning point, a reference positioning point and a preset cutting breakpoint matching the reference positioning point of the object to be cut are obtained; according to the position deviation between the actual positioning point and the reference positioning point, the deviation cutting breakpoint is determined from the preset cutting breakpoints; the breakpoint corresponding to the position deviation can be determined, and the deviation adjustment is performed; the local cutting trajectory corresponding to the deviation cutting breakpoint is adjusted according to the position deviation to obtain the target cutting trajectory, so that the cutting trajectory can be adjusted according to the position deviation of the positioning point to avoid the problem of cutting error caused by deformation of the object to be cut, etc. For different objects to be cut and different deformation scenes, the cutting trajectory can be adjusted in a targeted manner through the actual positioning point and the reference positioning point to obtain an accurate target cutting trajectory; the object to be cut is cut according to the target cutting trajectory, so that the accuracy of the cutting is guaranteed, and there is no need for manual batch adjustment, which reduces the manual workload and artificial measurement errors, improves the cutting efficiency, and can achieve efficient and accurate cutting in the case of irregular local deformation of the object to be cut, which is suitable for more application scenes.

[0077] In one embodiment, adjusting the local cutting trajectory corresponding to the deviation cutting breakpoint according to the position deviation includes:

[0078] Determining a deviation parameter according to a position deviation between the actual positioning point and the reference positioning point;

[0079] The local cutting trajectory corresponding to the deviation cutting breakpoint is adjusted according to the deviation parameter.

[0080] Exemplarily, according to the position deviation between the actual positioning point and the reference positioning point, the deviation parameter is determined. The deviation parameter may include but is not limited to deviation direction, relative displacement, relative angle, scaling ratio, etc., which can be determined according to the actual application scenario.

[0081] In one example, when making adjustments according to the deviation parameters, a corresponding transformation matrix may be generated according to the deviation parameters, and the trajectory points on the corresponding local cutting trajectory may be transformed using the transformation matrix to obtain an adjusted local cutting trajectory.

[0082] In the embodiments of the present disclosure, a deviation parameter can be calculated based on the position deviation between the actual positioning point and the reference positioning point, and the local cutting trajectory corresponding to the deviation cutting breakpoint can be adjusted based on the deviation parameter, so that the trajectory adjustment can be performed efficiently and accurately, thereby improving the accuracy and efficiency of the trajectory adjustment.

[0083] In one embodiment, determining the deviation parameter according to the position deviation between the actual positioning point and the reference positioning point includes:

[0084] Determine, from the actual positioning points, a first positioning point which has a position deviation from a corresponding reference positioning point;

[0085] Determine a reference positioning point that matches the first positioning point as a second positioning point, and determine an actual positioning point adjacent to the first positioning point as a third positioning point;

[0086] The deviation parameter is determined according to the first relative position information between the first positioning point and the third positioning point and the second relative position information between the second positioning point and the third positioning point.

[0087] Exemplarily, when determining the deviation parameter, a first positioning point having a position deviation with the corresponding reference positioning point is determined from the actual positioning points, that is, the first positioning point is a positioning point with a position deviation. According to the correspondence between the actual positioning point and the reference positioning point, the reference positioning point corresponding to the first positioning point is determined as the second positioning point, and the actual positioning point adjacent to the first positioning point is determined as the third positioning point. The third positioning point may include one or more, which may be determined according to the actual application scenario.

[0088] Optionally, the line between the first positioning point and the third positioning point can be determined based on the first relative position information between the two points; the line between the second positioning point and the third positioning point can be determined based on the second relative position information between the two points; and the deviation parameter can be calculated based on the relationship between the above two lines.

[0089] Figure 3 is a schematic diagram of a cutting trajectory according to an exemplary embodiment, referring to Figure 3As shown, the solid line represents the reference cutting trajectory, the black dot represents the preset cutting breakpoint, and the four preset cutting breakpoints divide the reference cutting trajectory into four local cutting trajectories, polylinelist_1, polylinelist_2, polylinelist_3, and polylinelist_4. A, B, C, and D represent four reference positioning points, and A', B', C', and D' represent four actual positioning points. Since no deformation occurs at the corresponding positions of A', B', and C', they coincide with the corresponding reference points A, B, and C, and are uniformly described here as A, B, and C. C' is the first positioning point that has a position deviation from the corresponding reference positioning point C, C is the second positioning point, and D is the third positioning point. The local cutting trajectories corresponding to the deviation cutting breakpoints are polylinelist_1 and polylinelist_2.

[0090] CD is obtained according to the relative position of C and D, C'D is obtained according to the relative position of C' and D, and the relationship between DC' and DC is used to calculate the deviation parameters of polylinelist_1. The deviation parameters include relative displacement (Δx1, Δy1), relative angle θ1 and scaling ratio , calculate the points on polylinelist_1 according to the deviation parameter , get the converted polylinelist_1. Similarly, calculate the deviation parameters of polylinelist_2 in the above way. The deviation parameters include relative displacement (Δx2, Δy2), relative angle θ2 and scaling ratio , calculate the points on polylinelist_2 according to the deviation parameter , and get the converted polylinelist_2. The converted polylinelist_1 and polylinelist_2 are shown as dotted lines in the figure, and the target cutting trajectory is obtained by combining polylinelist_3 and polylinelist_4.

[0091] In one example, when the target cutting trajectory is obtained through the local cutting trajectory, the overlapping points at the cutting breakpoints are removed to avoid the problem of repeated cutting at the splicing position that increases the heat impact, so that the splicing position has a natural transition and the cutting process effect is improved.

[0092] In the embodiment of the present disclosure, when determining the deviation parameter, the first positioning point with the position deviation is first found, and then the deviation parameter is determined based on the first relative position information between the first positioning point and the adjacent positioning point, and the second relative position information between the reference positioning point corresponding to the first positioning point and the adjacent positioning point. The deviation parameter can be obtained quickly and accurately based on the positional relationship between the point with the position deviation and the adjacent points and the reference positioning point, thereby ensuring the accuracy and reliability of the trajectory adjustment.

[0093] In one embodiment, obtaining the actual positioning point of the object to be cut includes:

[0094] Acquire an image of the object to be cut;

[0095] The actual positioning point of the object to be cut is determined according to the image and the target coordinate conversion parameters.

[0096] Exemplarily, when obtaining the actual positioning point, a coordinate system conversion process is required. An image of the object to be cut is obtained, wherein the image of the object to be cut can be obtained by an image acquisition device such as an industrial camera. According to the image and the target coordinate conversion parameters, the position data of the object to be cut is converted to the target coordinate system to obtain the actual positioning point of the object to be cut in the target coordinate system. In one example, the target coordinate system can be the coordinate system corresponding to the cutting module.

[0097] Optionally, the target coordinate conversion parameters may be determined in advance according to an actual application scenario.

[0098] In the disclosed embodiment, when determining the actual positioning point, an image of the object to be cut is first acquired, and the actual positioning point of the object to be cut is obtained based on the image and the target coordinate conversion parameters, so that the actual positioning point in the corresponding coordinate system can be determined by the target coordinate conversion parameters. In the subsequent calculation and adjustment of the cutting process, it can be carried out in the same coordinate system, which further ensures the accuracy of the cutting.

[0099] In one embodiment, cutting the object to be cut includes:

[0100] Controlling the laser cutting module to cut the object to be cut;

[0101] The object to be cut is placed on a cutting platform, and the target coordinate conversion parameters are determined in the following manner:

[0102] Acquire a reference image of a feature plate placed on the cutting platform, wherein a plurality of feature points are arranged on the feature plate;

[0103] According to the position information of the plurality of feature points on the reference image, target coordinate conversion parameters between the coordinate system of the feature plate and the coordinate system of the laser cutting module are determined.

[0104] For example, when the object to be cut is cut, the object to be cut can be cut by controlling the laser cutting module. During cutting, the object to be cut is placed on the cutting platform.

[0105] Optionally, coordinate positioning is performed by a feature plate. A plurality of feature points are arranged on the feature plate. In one example, the plurality of feature points can be arranged in different directions, for example, a plurality of feature points are arranged in the horizontal direction and in the vertical direction respectively. In one example, the feature plate is made of a rigid material and will not deform.

[0106] In a possible implementation, a feature plate is placed on a cutting platform, and a reference image of the feature plate is obtained, wherein the reference image can be obtained by an image acquisition device such as an industrial camera. According to the position information of multiple feature points on the reference image, the target coordinate conversion parameters between the coordinate system of the feature plate and the coordinate system of the laser cutting module are determined, and the position data can be converted into the position data in the coordinate system of the laser cutting module through the target coordinate conversion parameters. The target coordinate conversion parameters may include a coordinate conversion matrix, etc., which can be determined according to the actual application scenario.

[0107] Figure 4 FIG. 1 is a schematic diagram of a cutting device according to an exemplary embodiment. Figure 4 As shown, the device includes an image acquisition device, a cutting platform, and a galvanometer, wherein the galvanometer is a component of the laser cutting module, and is used to adjust the laser position to cut the object to be cut. In one example, the coordinate system of the laser cutting module is the coordinate system of the galvanometer, and the image acquisition device includes an industrial camera. In one example, the cutting platform is a two-dimensional axis system platform. When determining the target coordinate transformation parameters, the feature plate is first fixed on the cutting platform, and on the two-dimensional axis plane range containing all positioning points based on the center of the field of view of the image acquisition device, the image acquisition device uses its field of view center as the positioning basis to form a set of point sets by sampling the two-dimensional array formed by the feature points on the feature plate at intervals, and the feature plate coordinates (Rx, Ry) in the point set correspond to the axis system coordinates (Ax, Ay) one by one; the galvanometer is used to generate 9 regular figures in its coordinate system, such as a cross; the 9-point calibration method is used to establish a rigid transformation relationship between the galvanometer coordinate system (i.e., the coordinate system of the laser cutting module) and the high-precision coordinate system of the feature plate based on the center of the field of view of the image acquisition device: the rotation and translation matrix M (i.e., the target coordinate transformation parameters).

[0108] Figure 5 is a schematic diagram showing a position data conversion process according to an exemplary embodiment, referring to Figure 5As shown, the data is converted from the pixel coordinate system to the cutting platform coordinate system, then to the feature plate coordinate system, and then to the galvanometer coordinate system through the matrix M. In one example, the conversion algorithm from the cutting platform coordinate system to the feature plate coordinate system may include K nearest neighbor search and fitting of the affine transformation matrix, and algorithms such as bilinear interpolation may also be used. The present disclosure does not limit this conversion algorithm. In one example, since the accuracy of the feature plate is higher than the comprehensive accuracy of the equipment system hardware, the positioning accuracy error of the platform axis system within the processing range can be compensated by the feature plate, thereby improving the positioning accuracy.

[0109] In the disclosed embodiment, when cutting is performed using a laser cutting module and the target coordinate conversion parameters are determined, the target coordinate conversion parameters between the coordinate system of the feature plate and the coordinate system of the laser cutting module are determined through a reference image of the feature plate, so that in the subsequent calculation process, the positioning point information and the target cutting trajectory in the coordinate system of the laser cutting module can be obtained, thereby ensuring the accuracy of the cutting process of the laser cutting module; and compared with using the axis for calculation, using the feature plate to calculate the target coordinate conversion parameters reduces the calculation errors caused by axis deviation deformation and the like, and in scenarios such as large-size cutting, the accuracy of the target coordinate conversion parameters can be guaranteed, thereby improving the cutting accuracy, and being suitable for more application scenarios.

[0110] In one embodiment, the method for determining the preset cutting breakpoint includes:

[0111] Acquire coordinate data of preset track points in a reference cutting track of the object to be cut;

[0112] For the preset track points, the preset cutting breakpoints are determined according to the value change information of the coordinate data of the adjacent preset track points.

[0113] Exemplarily, the preset cutting breakpoint is determined based on the reference cutting trajectory. The coordinate data of the preset trajectory point in the reference cutting trajectory of the object to be cut is obtained, wherein the preset trajectory point can be a preset trajectory point determined on the reference cutting trajectory according to a preset sampling method, for example, a point is taken as a preset trajectory point at a certain distance. Optionally, the coordinate data may include a horizontal coordinate and a vertical coordinate. When determining the preset cutting breakpoint, the position of the trajectory inflection point can be determined based on the numerical change information of the coordinate data of adjacent preset trajectory points, and determined as the preset cutting breakpoint.

[0114] In one example, a preset variation range may be set. When the horizontal coordinate (or vertical coordinate) of an adjacent preset trajectory point is within the preset variation range and the vertical coordinate (or horizontal coordinate) is outside the preset variation range, the preset trajectory point may be considered to be a trajectory inflection point, and one of the preset trajectory points may be determined to be a preset cutting breakpoint.

[0115] In one example, the graphic drawing of the image to be cut can be parsed, and the reference cutting trajectory can be converted into polyline data in a fixed order and direction to facilitate subsequent data calculation and processing. The data format is shown in Table 1.

[0116] Table 1

[0117]

[0118] Figure 6 FIG. 1 is a schematic diagram showing a method for determining a preset cutting breakpoint according to an exemplary embodiment, referring to FIG. Figure 6 As shown, when there is an arc connected to a long straight line in the reference cutting trajectory, the point where the arc is connected to the long straight line is used as a preset cutting breakpoint, as shown by the dotted circle in the figure.

[0119] In the embodiment of the present disclosure, when determining the preset cutting breakpoint, the coordinate data of the preset trajectory point in the reference cutting trajectory is obtained, and the preset cutting breakpoint is determined according to the numerical change information of the coordinate data of the adjacent preset trajectory points, so that the preset cutting breakpoint can be automatically determined according to the reference cutting trajectory, further reducing the manual workload and improving the cutting efficiency; the preset cutting breakpoint is determined by the numerical change information of the coordinate data, thereby ensuring the accuracy and reliability of the preset cutting breakpoint.

[0120] Figure 7 is a schematic diagram of a cutting method according to an exemplary embodiment, referring to Figure 7 As shown, first, a high-precision coordinate system is established through the feature plate, and the actual positioning points on the object to be cut are identified and unified into the high-precision coordinate system, that is, the coordinate system of the laser cutting module. The drawing graphics of the object to be cut are analyzed, and preset cutting breakpoints are set according to the reference cutting trajectory to obtain multiple local cutting trajectories. The deviation parameters are calculated based on the position deviation between the identified actual positioning points and the reference positioning points obtained by analyzing the drawing graphics, and the local cutting trajectory is adjusted according to the deviation parameters. The adjusted local cutting trajectories are sorted, the overlapping points are removed, and the target cutting trajectory is obtained by recombining, and cutting is performed according to the target cutting trajectory. In this way, the distance between each local cutting trajectory on the target cutting trajectory and the actual positioning point that matches it is guaranteed to be consistent with the distance on the drawing, thereby improving the cutting accuracy.

[0121] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0122] Based on the same inventive concept, the embodiment of the present application also provides a cutting device for implementing the cutting method involved above. The implementation solution provided by the device to solve the problem is similar to the implementation solution recorded in the above method, so the specific limitations in one or more cutting device embodiments provided below can refer to the limitations on the cutting method above, and will not be repeated here.

[0123] In an exemplary embodiment, Figure 8 As shown, a cutting device 800 is provided, comprising:

[0124] An acquisition module 810 is used to acquire an actual positioning point of the object to be cut, a reference positioning point, and a preset cutting breakpoint matching the reference positioning point, wherein the preset cutting breakpoint divides the reference cutting trajectory of the object to be cut into at least one local cutting trajectory;

[0125] A determination module 820, configured to determine a deviation cutting breakpoint from the preset cutting breakpoints according to a position deviation between the actual positioning point and the reference positioning point;

[0126] The cutting module 830 is used to adjust the local cutting trajectory corresponding to the deviation cutting breakpoint according to the position deviation to obtain a target cutting trajectory, and cut the object to be cut according to the target cutting trajectory.

[0127] In one embodiment, the cutting module comprises:

[0128] A first determination submodule, configured to determine a deviation parameter according to a position deviation between the actual positioning point and the reference positioning point;

[0129] The adjustment submodule is used to adjust the local cutting trajectory corresponding to the deviation cutting breakpoint according to the deviation parameter.

[0130] In one embodiment, the first determining submodule includes:

[0131] A first determining unit, configured to determine, from the actual positioning points, a first positioning point having a position deviation from a corresponding reference positioning point;

[0132] A second determining unit, configured to determine a reference positioning point matching the first positioning point as a second positioning point, and determine an actual positioning point adjacent to the first positioning point as a third positioning point;

[0133] The third determining unit is used to determine the deviation parameter according to the first relative position information between the first positioning point and the third positioning point and the second relative position information between the second positioning point and the third positioning point.

[0134] In one embodiment, the acquisition module includes:

[0135] An acquisition submodule, used to acquire an image of the object to be cut;

[0136] The second determination submodule is used to determine the actual positioning point of the object to be cut according to the image and the target coordinate conversion parameters.

[0137] In one embodiment, the cutting module comprises:

[0138] A cutting submodule, used for controlling the laser cutting module to cut the object to be cut;

[0139] The object to be cut is placed on a cutting platform, and the device further comprises a module for determining the target coordinate conversion parameters, wherein the module for determining the target coordinate conversion parameters is used to:

[0140] Acquire a reference image of a feature plate placed on the cutting platform, wherein a plurality of feature points are arranged on the feature plate;

[0141] According to the position information of the plurality of feature points on the reference image, target coordinate conversion parameters between the coordinate system of the feature plate and the coordinate system of the laser cutting module are determined.

[0142] In one embodiment, the device further comprises a module for determining the preset cutting breakpoint, and the module for determining the preset cutting breakpoint is used to:

[0143] Acquire coordinate data of preset track points in a reference cutting track of the object to be cut;

[0144] For the preset track points, the preset cutting breakpoints are determined according to the value change information of the coordinate data of the adjacent preset track points.

[0145] Each module in the above-mentioned cutting device can be implemented in whole or in part by software, hardware or a combination thereof. Each module can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute the operations corresponding to each module above.

[0146] In an exemplary embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in FIG. Fig. 9 As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data involved in the method described in this embodiment, such as a reference cutting trajectory. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a cutting method is implemented.

[0147] Those skilled in the art will understand that Fig. 9 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0148] In one embodiment, a computer device is further provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above method embodiments when executing the computer program.

[0149] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0150] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0151] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0152] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0153] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0154] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A cutting method, characterized in that: The method comprises: Acquire an actual positioning point of the object to be cut, a reference positioning point, and a preset cutting breakpoint matching the reference positioning point, wherein the preset cutting breakpoint divides the reference cutting trajectory of the object to be cut into at least one local cutting trajectory; Determining a deviation cutting breakpoint from the preset cutting breakpoints according to a position deviation between the actual positioning point and the reference positioning point; Determine a deviation parameter according to the position deviation between the actual positioning point and the reference positioning point; adjust the local cutting trajectory corresponding to the deviation cutting breakpoint according to the deviation parameter to obtain a target cutting trajectory, and cut the object to be cut according to the target cutting trajectory; wherein the deviation parameter is determined based on the position of the actual positioning point with position deviation, the position of the reference positioning point matching the actual positioning point with position deviation, and the position of the actual positioning point adjacent to the actual positioning point with position deviation; The step of determining the deviation parameter according to the position deviation between the actual positioning point and the reference positioning point includes: determining a first positioning point having a position deviation from a corresponding reference positioning point from the actual positioning points; determining a reference positioning point matching the first positioning point as a second positioning point, and determining an actual positioning point adjacent to the first positioning point as a third positioning point; and determining the deviation parameter according to first relative position information between the first positioning point and the third positioning point and second relative position information between the second positioning point and the third positioning point; The obtaining of the actual positioning point of the object to be cut comprises: obtaining an image of the object to be cut; determining the actual positioning point of the object to be cut according to the image and the target coordinate conversion parameter; wherein the cutting of the object to be cut comprises: The laser cutting module is controlled to cut the object to be cut; the object to be cut is placed on a cutting platform, and the method for determining the target coordinate conversion parameters includes: obtaining a reference image of a feature plate placed on the cutting platform, wherein a plurality of feature points are arranged on the feature plate; and determining the target coordinate conversion parameters between the coordinate system of the feature plate and the coordinate system of the laser cutting module according to the position information of the plurality of feature points on the reference image; The method for determining the preset cutting breakpoint includes: obtaining coordinate data of a preset track point in a reference cutting track of the object to be cut; and determining the preset cutting breakpoint according to value change information of coordinate data of adjacent preset track points for the preset track point.

2. A cutting device, characterized in that: The device comprises: An acquisition module, used to acquire an actual positioning point of the object to be cut, a reference positioning point, and a preset cutting breakpoint matching the reference positioning point, wherein the preset cutting breakpoint divides the reference cutting trajectory of the object to be cut into at least one local cutting trajectory; A determination module, configured to determine a deviation cutting breakpoint from the preset cutting breakpoints according to a position deviation between the actual positioning point and the reference positioning point; A cutting module, used to determine a deviation parameter according to a position deviation between the actual positioning point and the reference positioning point; adjust the local cutting trajectory corresponding to the deviation cutting breakpoint according to the deviation parameter to obtain a target cutting trajectory, and cut the object to be cut according to the target cutting trajectory; wherein the deviation parameter is determined based on the position of the actual positioning point with a position deviation, the position of the reference positioning point matching the actual positioning point with a position deviation, and the position of the actual positioning point adjacent to the actual positioning point with a position deviation; the cutting module comprises: a first determining unit, used to determine a first positioning point having a position deviation from the corresponding reference positioning point from the actual positioning points; a second determining unit, used to determine the reference positioning point matching the first positioning point as a second positioning point, and determine the actual positioning point adjacent to the first positioning point as a third positioning point; a third determining unit, used to determine a deviation parameter according to first relative position information between the first positioning point and the third positioning point, and second relative position information between the second positioning point and the third positioning point; The acquisition module includes: an acquisition submodule for acquiring an image of the object to be cut; a second determination submodule for determining an actual positioning point of the object to be cut according to the image and the target coordinate conversion parameters; The cutting module comprises: a cutting submodule, which is used to control the laser cutting module to cut the object to be cut; The object to be cut is placed on a cutting platform, and the device further comprises a module for determining the target coordinate conversion parameters, wherein the module for determining the target coordinate conversion parameters is used to: obtain a reference image of a feature plate placed on the cutting platform, wherein a plurality of feature points are arranged on the feature plate; determine the target coordinate conversion parameters between the coordinate system of the feature plate and the coordinate system of the laser cutting module according to the position information of the plurality of feature points on the reference image; The device also includes a module for determining the preset cutting breakpoint, and the module for determining the preset cutting breakpoint is used to: obtain coordinate data of a preset trajectory point in a reference cutting trajectory of the object to be cut; and determine the preset cutting breakpoint for the preset trajectory point according to numerical change information of the coordinate data of adjacent preset trajectory points.

3. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method according to claim 1 are implemented.

4. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to claim 1 are implemented.

5. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to claim 1 are implemented.

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