Magnetic shield components and semiconductor manufacturing equipment

Abstract

The present invention provides a magnetic shield component and semiconductor manufacturing equipment, the magnetic shield component comprises: a magnetic source, a communication device and a magnetic shield; the magnetic shield is detachably arranged between the magnetic source and the communication device; the distance between the magnetic source and the communication device is within a first preset range, and the magnetic shield at least covers a part of the communication device; the distance between the magnetic source and the communication device is within a second preset range, and the magnetic shield is located between the magnetic source and the communication device and is arranged close to the communication device; the magnetic shield is made of a material with a relative magnetic permeability of not less than 80000. In this configuration, the magnetic shield is made of a high magnetic permeability material, the magnetic shield is detachably arranged between the magnetic source and the communication device, and a suitable arrangement of the magnetic shield is selected according to the distance between the magnetic source and the communication device, so that the magnetic shield completely blocks the influence of the magnetic field on the transmission signal of the communication device without changing the original layout, and maintains the accuracy and effectiveness of the transmission signal.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, in particular to a magnetic shield component and semiconductor manufacturing equipment. Background Art

[0002] In the semiconductor manufacturing process, some processes need to be carried out in a strong magnetic environment. For example, in the process of using PEVCD (Plasma Enhance Chemical Vapour Deposition) to deposit thin films, a plasma source is required to generate plasma. In this process, the strong magnetic environment formed in the surroundings will affect the transmission signals of MFC (Mass Flow Controller).

[0003] In the prior art, aluminum foil is often used to wrap the signal line of the MFC, and a shielding ring is placed on the outside of the aluminum foil to shield the influence of the magnetic field on the transmission signal. However, since the installation position of the MFC is too close to the plasma source, the shielding ring and the aluminum foil cannot prevent the MFC signal from being interfered with in a strong magnetic environment, causing the MFC transmission signal to have invalid values ​​such as negative values, affecting its control over the pipeline flow.

[0004] Based on this, how to prevent the transmission signal from being interfered in a strong magnetic environment has become a technical problem that needs to be solved by those skilled in the art. Summary of the invention

[0005] The purpose of the present invention is to provide a magnetic shield assembly and semiconductor manufacturing equipment to solve the problem that the existing signal transmission equipment is easily disturbed in a strong magnetic environment, resulting in abnormal values ​​of the transmission signal.

[0006] In order to achieve the above object, the present invention provides a magnetic shield assembly, comprising: a magnetic source, a communication device and a magnetic shield;

[0007] The magnetic shield is detachably arranged between the magnetic source and the communication device;

[0008] The distance between the magnetic source and the communication device is within a first preset range, and the magnetic shield at least covers a portion of the communication device;

[0009] The distance between the magnetic source and the communication device is within a second preset range, and the magnetic shield is located between the magnetic source and the communication device and is arranged close to the communication device;

[0010] The magnetic shield is made of a material with a relative magnetic permeability of not less than 80,000.

[0011] Optionally, the distance between the communication device and the magnetic source within the first preset range is smaller than the distance between the communication device and the magnetic source within the second preset range.

[0012] Optionally, the communication device is located within the first preset range, and the magnetic shield at least covers a side of the communication device close to the magnetic source.

[0013] Optionally, the distance between the magnetic source and the communication device is within a third preset range, and the magnetic shield completely covers the communication device.

[0014] Optionally, the distance between the communication device and the magnetic source within the third preset range is smaller than the distance between the communication device and the magnetic source within the first preset range.

[0015] Optionally, the magnetic shield assembly further includes a mounting bracket, the communication device is located within the second preset range, the magnetic shield is detachably connected to the mounting bracket, and the mounting bracket is located between the magnetic source and the communication device and is arranged close to the communication device.

[0016] Optionally, the magnetic shield includes a plane segment and a curved segment, the curved segment is arranged at two ends of the plane segment, and the curved segment is arranged towards a direction close to the communication device.

[0017] Optionally, the magnetic shielding component includes: a metal plate, and / or a woven metal mesh.

[0018] In order to achieve the above object, the present invention further provides a semiconductor manufacturing equipment, comprising: a semiconductor machine and the magnetic shield assembly as described above:

[0019] The magnetic source is used to provide the semiconductor machine with materials required for production;

[0020] The communication device is connected to the semiconductor machine for communication and is arranged near the magnetic source for information exchange with the semiconductor machine;

[0021] The magnetic shield is detachably disposed between the magnetic source and the communication device to isolate the influence of the magnetic source on the transmission signal of the communication device.

[0022] Optionally, the magnetic source comprises a plasma source, and the communication device comprises a mass flow controller;

[0023] The magnetic shield completely covers the mass flow controller.

[0024] Compared with the existing magnetic shield technology, the magnetic shield assembly and semiconductor manufacturing equipment provided by this application have the following advantages:

[0025] The magnetic shield assembly provided by the present application, by detachably arranging the magnetic shield between the magnetic source and the communication equipment, and selecting a suitable arrangement of the magnetic shield according to the distance between the magnetic source and the communication equipment, can enable the magnetic shield to completely isolate the influence of the magnetic field of the magnetic source on the transmission signal of the communication equipment without changing the space occupied by the original layout, thereby maintaining the accuracy and effectiveness of the transmission signal; at the same time, the magnetic shield is made of high magnetic permeability material, which can meet the shielding requirements of the magnetic shield for the magnetic source, thereby ensuring that the transmission signal of the communication equipment is not affected by the magnetic field.

[0026] Furthermore, the magnetic shield can completely cover the communication device when the distance between the magnetic source and the communication device is short, and can completely shield the influence of the magnetic field on the transmission signal without changing the space occupied by the original layout; the magnetic shield can also only cover the side of the communication device close to the magnetic source when the distance between the magnetic source and the communication device is centered, and can further reduce the space occupancy rate of the magnetic shield without affecting the shielding of the magnetic field by the magnetic shield; the magnetic shield can also be installed between the magnetic source and the communication device through the mounting bracket when the distance between the magnetic source and the communication device is far, and be set close to the communication device, so that the magnetic shield does not contact the communication device, further reducing the influence of the magnetic shield on the original layout. The detachable setting of the magnetic shield also improves the practical performance and broadens the use scenarios of the magnetic shield assembly.

[0027] The semiconductor manufacturing equipment provided in the present application, by using the above-mentioned magnetic shield assembly, can completely shield the influence of the magnetic field generated by the magnetic source on the transmission signal of the communication equipment without affecting the original layout, thereby improving the accuracy and effectiveness of data transmission, and ensuring that the product yield of the semiconductor manufacturing equipment is not affected by data transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic structural diagram of a magnetic shield assembly provided in an embodiment of the present invention;

[0029] Figure 2 A schematic diagram of the positional relationship between a magnetic source and a communication device provided in an embodiment of the present invention;

[0030] Figure 3 A schematic diagram of the installation method of the first magnetic shield provided in an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of a second installation method of a magnetic shield provided in an embodiment of the present invention;

[0032] Figure 5 A schematic diagram of a third installation method of a magnetic shield provided in an embodiment of the present invention.

[0033] The description of each reference numeral is as follows:

[0034] 1-magnetic source; 2-communication equipment; 3-magnetic shield; 31-plane segment; 32-arc segment;

[0035] 4-first preset range; 5-second preset range; 6-third preset range. DETAILED DESCRIPTION

[0036] In order to make the purpose, advantages and features of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

[0037] As used in this specification, the singular forms "a", "an" and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the term "at least two" is generally used to include the meaning of "two or more". In addition, the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" and "the proximal end" and "the distal end" generally refer to two corresponding parts, which include not only the endpoints, and the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. In addition, as used in this specification, an element disposed on another element generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements may be direct or indirect through an intermediate element, and it cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element may be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. The terms "upper", "lower", "top" and "bottom" are generally relative position relationships arranged in the direction of gravity; the terms "vertical, vertical direction" generally refer to the direction of gravity, which is generally perpendicular to the ground, and "horizontal, horizontal plane direction" generally refers to the direction parallel to the ground; for ordinary technicians in this field, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0038] The purpose of the present invention is to provide a magnetic shield assembly and semiconductor manufacturing equipment to solve the problem that the existing signal transmission equipment is easily disturbed in a strong magnetic environment, resulting in abnormal values ​​of the transmission signal.

[0039] This embodiment takes the plasma source and MFC (Mass Flow Controller) in the PECVD (Plasma Enhance Chemical Vapour Deposition) process as an example. Those skilled in the art can understand that the plasma enhanced chemical vapor deposition technology is a method for preparing semiconductor thin film materials and other material thin films by ionizing them in a deposition chamber by glow discharge and then chemically reacting and depositing them on a substrate. It enhances the activity of chemical vapor reaction substances through plasma activation, increases the surface reaction rate, and significantly reduces the film deposition temperature through high-energy ions. Among them, the plasma is generated and maintained by the plasma source. In the process of generating and maintaining the plasma, the required energy is provided by the radio frequency power supply, and the pulses emitted by the radio frequency power supply will generate a corresponding magnetic field, which will affect the transmission signals of some communication equipment (such as MFC). Affected by the spatial layout, the installation position of the MFC is too close to the plasma source. Although the signal line is covered with aluminum foil and a shielding ring, it is still impossible to avoid the transmission signal being affected by the strong magnetic environment, resulting in invalid values ​​such as negative values. Based on this, this embodiment provides a magnetic shield assembly and semiconductor manufacturing equipment. By using a magnetic shield made of high magnetic permeability, it is ensured that the transmission signal of the communication equipment is not affected by the magnetic field. At the same time, the magnetic shield is detachably arranged between the magnetic source and the communication equipment, and different configuration methods can be selected according to different distances, further broadening the application scope of the magnetic shield.

[0040] Please refer to Figure 1 Figure 2The present invention provides a magnetic shield assembly, including: a magnetic source 1, a communication device 2 and a magnetic shield 3; the magnetic shield 3 is detachably arranged between the magnetic source 1 and the communication device 2; the distance between the magnetic source 1 and the communication device 2 is within a first preset range 4, and the magnetic shield 3 at least covers a part of the communication device 2; the distance between the magnetic source 1 and the communication device 2 is within a second preset range 5, and the magnetic shield 3 is located between the magnetic source 1 and the communication device 2, and is arranged close to the communication device 2; the magnetic shield 3 is made of a material with a relative magnetic permeability of not less than 80000. It should be noted that the relative magnetic permeability is the ratio of magnetic permeability to vacuum magnetic permeability. The larger the value, the greater the magnetic flux density passing through the magnetic material under the same conditions, indicating that the material has good magnetic permeability. Common high magnetic permeability materials include ferrite, cobalt-iron alloy, iron-nickel alloy and ferrite. As can be understood by those skilled in the art, the iron-nickel alloy is an alloy material with very high weak magnetic field permeability, and its saturation magnetic induction intensity is between 0.6T and 1T, wherein Mu-metal is a non-oriented nickel-iron soft ferromagnetic alloy, having a higher magnetic permeability than ordinary iron-nickel alloys, and at the same time, Mu-metal has higher ductility and machinability than other iron-nickel alloys, therefore, the magnetic shield 3 in this embodiment is made of Mu-metal. The high magnetic permeability of Mu-metal provides a low magnetic resistance path for the magnetic flux, therefore, it does not achieve the magnetic shielding function by blocking the magnetic field, but by providing a path for the magnetic field lines around the shielding area.

[0041] As an optional embodiment, the magnetic shield 3 can be a metal plate, a woven metal mesh, or a closed cavity formed by splicing metal plates. It can be mounted on the communication device 2, or bonded to the surface of the communication device 2, or installed between the communication device 2 and the magnetic source 1 using a mounting bracket or other mounting equipment. Those skilled in the art can configure the shape, installation method, and molding method of the magnetic shield 3 according to actual conditions, and this embodiment does not limit this. It should be noted that, affected by the performance of Mu-metal itself, the magnetic shield 3 made of Mu-metal is usually a multi-layer structure, the outermost layer of which can be made of ordinary steel and coated with the Mu-metal layer located inside. At the same time, the first preset range 4 and the second preset range 5 can be circular areas formed with the magnetic source 1 as the center and the distance between the magnetic source 1 and the communication device 2 as the radius, or they can be irregular areas divided according to the magnetic field strength of the magnetic source 1. This embodiment does not limit this. For example, when the magnetic field of the magnetic source 1 changes regularly, the first preset range 4 and the second preset range 5 can be areas of regular shape; and when the magnetic field of the magnetic source 1 changes irregularly, or when multiple magnetic sources 1 are arranged in the current area and the magnetic fields of the multiple magnetic sources 1 affect each other, the first preset range 4 and the second preset range 5 can be areas of irregular shape.

[0042] With such configuration, by detachably arranging the magnetic shield 3 between the magnetic source 1 and the communication device 2, and selecting a suitable arrangement of the magnetic shield 3 according to the distance between the magnetic source 1 and the communication device 2, the magnetic shield 3 can completely block the influence of the magnetic field of the magnetic source 1 on the transmission signal of the communication device 2 without changing the space occupied by the original layout, thereby maintaining the accuracy and effectiveness of the transmission signal; at the same time, the magnetic shield 3 is made of high magnetic permeability material, which can meet the shielding requirements of the magnetic shield 3 for the magnetic source 1, thereby ensuring that the transmission signal of the communication device 2 is not affected by the magnetic field.

[0043] In an optional embodiment, the magnetic source 1 and the communication device 2 are divided into three preset ranges, and the basis for the division may be the magnetic field strength. For example, the first preset range 4 is a high-intensity magnetic field area, the second preset range 5 is a medium-intensity magnetic field area, and the third preset range 6 is a low-intensity magnetic field area, that is, the magnetic field strength within the first preset range 4 is greater than the magnetic field strength within the second preset range 5, and the magnetic field strength within the second preset range 5 is greater than the magnetic field strength within the third preset range 6; the basis for the division may also be the distance between the magnetic source 1 and the communication device 2. Generally speaking, the closer the distance between the communication device 2 and the magnetic source 1, the greater the transmission of the communication device 2 is affected by the magnetic field of the magnetic source 1. For example, in this embodiment, please refer to Figure 2 , the first preset range 4 is a medium impact area, the second preset range 5 is a low impact area, and the third preset range 6 is a high impact area, that is, the distance between the communication device 2 located in the first preset range 4 and the magnetic source 1 is smaller than the distance between the communication device 2 located in the second preset range 5 and the magnetic source 1; the distance between the communication device 2 located in the third preset range 6 and the magnetic source 1 is smaller than the distance between the communication device 2 located in the first preset range 4 and the magnetic source 1. The specific range parameters require the operator to comprehensively consider and divide them in combination with the spatial dimensions and the magnetic field strength generated by the magnetic source 1, and this embodiment will not be illustrated here. With such a configuration, the detachable arrangement of the magnetic shield 3 improves the practical performance, and can completely shield the influence of the magnetic field on the transmission signal without changing the occupied space of the original layout, thereby broadening the use scenarios of the magnetic shield assembly.

[0044] Combine the following Figures 3 to 5 , further illustrating the installation method of the magnetic shield 3 when the communication device 2 is located in different preset ranges.

[0045] In an alternative embodiment, please refer to Figure 3 , the communication device 2 is located within the first preset range 4, and the magnetic shield 3 at least covers the side of the communication device 2 close to the magnetic source 1. It should be noted that in this embodiment, the first preset range 4 is a medium impact area, and the magnetic shield 3 can only cover the side of the communication device 2 close to the magnetic source 1 to avoid the influence of the magnetic field generated by the magnetic source 1 on the transmission signal of the communication device 2; Figure 3In the illustrated example, the magnetic shield 3 includes a plane segment 31 and an arc segment 32, wherein the plane segment 31 completely covers the side of the communication device 2 close to the magnetic source 1, and the arc segment 32 extends toward the direction close to the communication device 2, and forms a certain coverage for other sides of the communication device 2; in other embodiments, the magnetic shield 3 may also cover two sides, three sides or more of the communication device 2, but it should be noted that the sides covered by the magnetic shield 3 need to include the side of the communication device 2 close to the magnetic source 1. At the same time, the connection between the magnetic shield 3 and the communication device 2 may be a snap-fit ​​connection, or may be bonded, or may be connected through other mounting components, for example, a connection hook (not shown in the figure) may be provided on the side of the communication device 2, and a connection groove (not shown in the figure) may be provided on the magnetic shield 3, and the connection hook may be snapped into the connection groove to achieve the connection.

[0046] In another optional embodiment, please refer to Figure 4 , the communication device 2 is located within the second preset range 5, the magnetic shield 3 is located between the magnetic source 1 and the communication device 2, and is arranged close to the communication device 2. Furthermore, the magnetic shield assembly also includes a mounting bracket (not shown in the figure), the communication device 2 is located within the second preset range 5, the magnetic shield 3 is detachably connected to the mounting bracket, and the mounting bracket is located between the magnetic source 1 and the communication device 2, and is arranged close to the communication device 2. It should be noted that in this embodiment, the second preset range 5 is a low-impact area, and the magnetic shield 3 does not need to contact the communication device 2, but only needs to be arranged between the magnetic source 1 and the communication device 2 to play a shielding role. Figure 4 In the illustrated example, the magnetic shield 3 includes a plane segment 31 and a curved segment 32, wherein the plane segment 31 is adapted to the side of the communication device 2, and the curved segment 32 extends toward the direction close to the communication device 2. The magnetic shield 3 is disposed between the magnetic source 1 and the communication device 2, and the distance between the magnetic shield 3 and the magnetic source 1 is greater than the distance between the magnetic shield 3 and the communication device 2, so that the magnetic shield 3 can be closer to the communication device 2, thereby better shielding the magnetic field. At the same time, the installation method of the magnetic shield 3 can be connected by snapping the mounting bracket to stand between the magnetic source 1 and the communication device 2; or the processing performance of Mu-metal can be used to form the mounting component and the magnetic shield 3 in one piece, and directly placed between the magnetic source 1 and the communication device 2.

[0047] In another optional embodiment, please refer to Figure 5 , the communication device 2 is located within the third preset range 6, and the magnetic shield 3 completely covers the communication device 2. It should be noted that in this embodiment, the third preset range 6 is a high-impact area, so the magnetic shield 3 needs to completely cover the communication device 2 to completely avoid the influence of the magnetic field generated by the magnetic source 1 on the transmission signal of the communication device 2. Figure 5In the illustrated example, the magnetic shield 3 forms a rectangular enclosed space, and the communication device 2 is accommodated in the enclosed space. Accordingly, a through hole is reserved on the surface of the magnetic shield 3 for the signal line of the communication device 2 to pass through, and one side of the magnetic shield 3 can also be set as a switchable movable surface to facilitate the installation between the magnetic shield 3 and the communication device 2. Of course, in some other embodiments, the magnetic shield 3 can also be set to a cylindrical, prismatic or other irregular shape according to the shape of the communication device 2, and the connection method between the magnetic shield 3 and the communication device 2 can be a sleeve or a snap-on connection. Those skilled in the art can select a suitable shape and connection method according to actual conditions, and this embodiment does not limit this.

[0048] In another embodiment, the present invention also provides a semiconductor manufacturing equipment, including: a semiconductor machine and the magnetic shield assembly as described above: a magnetic source 1 is used to provide the semiconductor machine with materials required for production; a communication device 2 is connected to the semiconductor machine for communication and is arranged near the magnetic source 1 for information exchange with the semiconductor machine; a magnetic shield 3 is detachably arranged between the magnetic source 1 and the communication device 2 to isolate the influence of the magnetic source 1 on the transmission signal of the communication device 2. As an optional embodiment, the magnetic source 1 includes a plasma source, and the communication device 2 includes a mass flow controller; the magnetic shield 3 completely covers the mass flow controller. It should be noted that in the process of semiconductor production and preparation, the magnetic source 1 can be a plasma source, or a radio frequency power source and other machines that can generate a magnetic field; the communication device 2 can be a mass flow controller (MFC), or other sensors or controllers. As long as the distance between the communication device 2 and the magnetic source 1 is within the range of the magnetic field, the above-mentioned magnetic shield assembly can be used. Taking the plasma source and MFC as an example, since the volume of semiconductor machines is usually large, the MFC can only be installed near the plasma source without affecting the original layout, and the distance from the plasma source is relatively close. In this application scenario, the magnetic shield 3 needs to completely cover the MFC setting, and the installation method is as follows: Figure 5 shown.

[0049] With such configuration, by using the above-mentioned magnetic shield assembly, it is possible to completely shield the influence of the magnetic field generated by the magnetic source 1 on the transmission signal of the communication device 2 without affecting the original layout, thereby improving the accuracy and effectiveness of data transmission, and ensuring that the product yield of the semiconductor manufacturing equipment is not affected by data transmission.

[0050] In summary, in the magnetic shield assembly and semiconductor manufacturing equipment provided in the embodiments of the present invention, the magnetic shield assembly includes: a magnetic source, a communication device and a magnetic shield component; the magnetic shield component is detachably arranged between the magnetic source and the communication device; the distance between the magnetic source and the communication device is within a first preset range, and the magnetic shield component at least covers a portion of the communication device; the distance between the magnetic source and the communication device is within a second preset range, and the magnetic shield component is located between the magnetic source and the communication device, and is arranged close to the communication device; the magnetic shield component is made of a material with a relative magnetic permeability of not less than 80,000.

[0051] With such a configuration, by detachably arranging the magnetic shield between the magnetic source and the communication equipment and selecting a suitable arrangement of the magnetic shield according to the distance between the magnetic source and the communication equipment, the magnetic shield can completely block the influence of the magnetic field of the magnetic source on the transmission signal of the communication equipment without changing the space occupied by the original layout, thereby maintaining the accuracy and effectiveness of the transmission signal; at the same time, the magnetic shield is made of high magnetic permeability material, which can meet the shielding requirements of the magnetic shield for the magnetic source, thereby ensuring that the transmission signal of the communication equipment is not affected by the magnetic field.

[0052] Furthermore, the magnetic shield can completely cover the communication device when the distance between the magnetic source and the communication device is short, and can completely shield the influence of the magnetic field on the transmission signal without changing the space occupied by the original layout; the magnetic shield can also only cover the side of the communication device close to the magnetic source when the distance between the magnetic source and the communication device is centered, and can further reduce the space occupancy rate of the magnetic shield without affecting the shielding of the magnetic field by the magnetic shield; the magnetic shield can also be installed between the magnetic source and the communication device through the mounting bracket when the distance between the magnetic source and the communication device is far, and be set close to the communication device, so that the magnetic shield does not contact the communication device, further reducing the influence of the magnetic shield on the original layout. The detachable setting of the magnetic shield also improves the practical performance and broadens the use scenarios of the magnetic shield assembly.

[0053] Furthermore, by using the above-mentioned magnetic shield assembly, it is possible to completely shield the influence of the magnetic field generated by the magnetic source on the transmission signal of the communication equipment without affecting the original layout, thereby improving the accuracy and effectiveness of data transmission, and ensuring that the product yield of the semiconductor manufacturing equipment is not affected by data transmission.

[0054] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A magnetic shield assembly, characterized in that: include: Magnetic sources, communication equipment and magnetic shielding components; The magnetic shield is detachably arranged between the magnetic source and the communication device; The distance between the magnetic source and the communication device is within a first preset range, and the magnetic shield at least covers a portion of the communication device; The distance between the magnetic source and the communication device is within a second preset range, and the magnetic shield is located between the magnetic source and the communication device and is arranged close to the communication device; The magnetic shield is made of a material with a relative magnetic permeability of not less than 80,000; The distance between the communication device and the magnetic source within the first preset range is smaller than the distance between the communication device and the magnetic source within the second preset range; The magnetic shield assembly also includes a mounting bracket, the communication device is located within the second preset range, the magnetic shield is detachably connected to the mounting bracket, and the mounting bracket is located between the magnetic source and the communication device and is arranged close to the communication device.

2. The magnetic shield assembly according to claim 1, characterized in that: The communication device is located within the first preset range, and the magnetic shield at least covers a side of the communication device close to the magnetic source.

3. The magnetic shield assembly according to claim 2, characterized in that: The distance between the magnetic source and the communication device is within a third preset range, and the magnetic shield completely covers the communication device.

4. The magnetic shield assembly according to claim 3, characterized in that: The distance between the communication device and the magnetic source within the third preset range is smaller than the distance between the communication device and the magnetic source within the first preset range.

5. The magnetic shield assembly according to claim 1 or 2, characterized in that: The magnetic shield comprises a plane segment and a curved segment. The curved segment is arranged at two ends of the plane segment, and the curved segment is arranged towards a direction close to the communication device.

6. The magnetic shield assembly according to claim 1, characterized in that: The magnetic shielding component includes: a metal plate, and / or a woven metal mesh.

7. A semiconductor manufacturing equipment, characterized in that: include: A semiconductor machine and a magnetic shield assembly as claimed in any one of claims 1 to 6: The magnetic source is used to provide the semiconductor machine with materials required for production; The communication device is connected to the semiconductor machine for communication and is arranged near the magnetic source for information exchange with the semiconductor machine; The magnetic shield is detachably disposed between the magnetic source and the communication device to isolate the influence of the magnetic source on the transmission signal of the communication device.

8. The semiconductor manufacturing equipment according to claim 7, characterized in that The magnetic source comprises a plasma source, and the communication device comprises a mass flow controller; The magnetic shield completely covers the mass flow controller.

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