Semiconductor radiation air-conditioning system of vehicle

Abstract

The invention provides a semiconductor radiation air conditioning system of a vehicle, and belongs to the technical field of heating ventilation air conditioning. Temperature control treatment is conducted on the cold end and the hot end of the semiconductor, the semiconductor cold end and the semiconductor hot end can form a whole with a vehicle body top plate, the vehicle body load is reduced, the internal space of a vehicle is more reasonably utilized, and more intelligent calculation modules and arrangement space of other convenient tools are provided for new energy vehicles under intelligent development; compared with the dependence of a traditional air conditioning system on engine operation, the semiconductor refrigeration and heating effect is rapid, rapid response can be achieved only through electrification, the development direction of new energy vehicles is met, the vehicle body load is relieved, and the energy utilization effect is improved; the air conditioner is mainly radiated, so that the comfort of the internal environment of the vehicle is improved, and the air conditioner can cope with the load change in the vehicle and the individual requirements of passengers under various external environment conditions under the assistance of a convection running mode.

Description

Technical Field

[0001] The invention belongs to the technical field of heating, ventilation and air conditioning, and in particular relates to a semiconductor radiation air conditioning system for a vehicle. Background Art

[0002] Current vehicles still use traditional refrigeration and heat pump air conditioning systems to achieve cooling, heating, dehumidification and other operations in the car. However, the components of this traditional convection air conditioning system occupy a large space, are expensive, and have poor regulation of thermal comfort in the car environment.

[0003] By utilizing the Peltier effect of semiconductors, connecting a P-type semiconductor and an N-type semiconductor in series and then energizing them, hot and cold surfaces can be formed on the upper and lower surfaces of the semiconductor. When the current flows from P level to N level or from N level to P level, the alternation of hot and cold surfaces on the upper and lower surfaces of the semiconductor can be realized, so that the same surface can provide cooling or heating. The semiconductor radiation air-conditioning system designed for vehicles with this semiconductor component as the core element can be combined with the inner surface of the vehicle structure to form cold and hot radiation surfaces in the vehicle, thereby improving space utilization. At the same time, it can replace the traditional convection air-conditioning system components of vehicles, improve the energy utilization of new energy electric vehicles, and provide more available space for intelligent vehicle-mounted devices. The radiation air-conditioning system can quickly and effectively increase or decrease the inner surface temperature of the vehicle in winter or summer, process the radiation in the vehicle more quickly, and provide a more comfortable vehicle environment without blowing wind and noise.

[0004] After searching related technologies, patents CN105109304B and CN114103590A both designed a semiconductor air-conditioning system for automobiles. However, they still use air convection to provide cooling and heating, which cannot effectively improve the comfort inside the vehicle. In addition, the design structure does not take into account the temperature control of the cold and hot ends of the semiconductors, and the energy utilization efficiency is not optimal. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor radiation air conditioning system for use in transportation vehicles, so as to improve the utilization efficiency of energy of new energy electric vehicles, the utilization rate of the space inside the vehicle, and the comfort of the passengers.

[0006] The main technical solutions of the present invention to achieve the above purpose are as follows:

[0007] A semiconductor radiation air conditioning system for a vehicle comprises an air supply channel A1, an inner surface radiation material layer A2, an outer surface radiation material layer A3, a semiconductor component A4, a connecting wire A5, an air supply port A6, a temperature and humidity sensor A7, a surface temperature measuring meter A10, an inner fresh air channel B1, an air filter device B2, an inner air circulation channel B3, a blower B4, a water receiving tray B5, a condensate pipe B6, a fin heat conduction structure B7, an exhaust fan B8 and an exhaust channel B9.

[0008] The air supply channel A1 is tightly fixed to the center line of the inner surface radiation material layer A2. A temperature and humidity sensor A7 is placed on the outside of the air supply channel A1, and there are multiple spaced air supply ports A6 on the side where the air supply channel A1 and the inner surface radiation material layer A2 are closely connected. The air supply ports A6 are directly excavated on the side of the pipe body of the air supply channel A1. The inner surface radiation material layer A2 corresponds to the inner side of the vehicle, and the outer surface radiation material layer A3 corresponds to the outer side of the vehicle. The two are tightly connected to the vehicle body on the inner and outer sides respectively, and are tightly attached to multiple semiconductor components A4 in the internal space of the two. Multiple semiconductor components A4 are connected in series through connecting wires A5. The starting and ending points of the connecting wires A5 connecting the semiconductor components A4 in series are the wire connector A end A8 and the wire connector B end A9. A surface temperature measuring meter A10 is attached to the inner surface of the inner surface radiation material layer A2 (i.e., the surface connected to the semiconductor component A4).

[0009] The in-vehicle fresh air passage B1 is connected to the air supply passage A1, and an air filter B2 and a blower B4 are installed in the in-vehicle fresh air passage B1, and the in-vehicle fresh air passage B1 is connected to the exhaust passage B9 through the upper and lower surfaces of the semiconductor component A4, and an exhaust fan B8 is installed in the exhaust passage B9. There is a water receiving tray B5 below the surface of the semiconductor component A4 on the in-vehicle fresh air passage B1 side, and the outlet of the water receiving tray B5 is connected to the condensate pipe B6. The surfaces of the semiconductor component A4 on the in-vehicle fresh air passage B1 side and the exhaust passage B9 side are equipped with fin heat conduction structures B7. The in-vehicle air circulation passage B3 is connected to the in-vehicle fresh air passage B1 between the air filter B2 and the blower B4.

[0010] The semiconductor component A4 includes a heat-conducting insulating material A11, a conductive metal material A12, and a PN node A13. The PN node A13 is interconnected through the conductive metal material A12, and the outer surfaces of the heat-conducting insulating material A11 and the conductive metal material A12 connected to the upper and lower parts of the PN node A13 are closely connected to form a semiconductor component A4. The heat-conducting insulating material A11 is closely attached to the inner surfaces of the inner surface radiation material layer A2 and the outer surface radiation material layer A3 of the vehicle, so as to form a whole, or closely attached to the inner surface of the fin heat-conducting structure B7.

[0011] The semiconductor radiation air conditioning system can form an integral body with the roof of the vehicle body, and is driven only by electricity, without a heavy and complicated structure. The radiation air conditioning system has multiple operation modes such as in-vehicle cooling operation, in-vehicle heating operation, radiation cooling and heating operation, and radiation convection cooling and heating operation.

[0012] The cooling and heating of the semiconductor radiation air conditioning system is realized by the semiconductor component A4. The semiconductor component A4 is divided into a cold end and a hot end, and the distribution of the cold end and the hot end is affected by the direction of current movement. When the A end A8 of the wire connector is connected to the positive pole, the B end A9 of the wire connector is connected to the negative pole, and the current flow direction is from level P to level N, the upper part of the semiconductor component A4 is the hot end and the lower part is the cold end, that is, the radiation material layer A2 on the inner surface of the vehicle can be used as a cold surface, and the radiation material layer A3 on the outer surface of the vehicle can be used as a hot surface. In this operating condition, the semiconductor radiation air conditioning system can cool the interior of the vehicle and release heat to the outside, corresponding to the cooling condition in the vehicle. When the A end A8 of the wire connector is connected to the negative pole, the B end A9 of the wire connector is connected to the positive pole, and the current flow direction is from level N to level P, the upper part of the semiconductor component A4 is the cold end and the lower part is the hot end, that is, the radiation material layer A2 on the inner surface of the vehicle can be used as a hot surface, and the radiation material layer A3 on the outer surface of the vehicle can be used as a cold surface. In this operating condition, the semiconductor radiation air conditioning system can supply heat to the interior of the vehicle and release cold air to the outside, corresponding to the heating condition in the vehicle. When the cooling and heating conditions in the vehicle are running, the temperature change of the radiation material layer A2 on the surface of the vehicle can be monitored by the surface temperature measuring meter A10.

[0013] The dehumidification and fresh air of the semiconductor radiation air conditioning system are realized by the fresh air passage B1 in the vehicle, the air circulation passage B3 in the vehicle, the blower B4, the semiconductor component A4 in the fresh air passage B1 in the vehicle, and the fin heat conduction structure B7. When the blower B4 is turned on, the fresh air and the circulating air in the vehicle will be combined and then pass through the semiconductor component A4, and the semiconductor component A4 is energized, so that the surface on the fresh air passage side is used as the cold end and the exhaust passage side is used as the hot end, so that the air in the fresh air passage can be cooled and dehumidified.

[0014] The radiation and convection of the semiconductor radiation air conditioning system are realized by the air supply channel A1, the semiconductor component A4, the air supply port A6 and the vehicle interior surface radiation material layer A2. When heating, the vehicle interior surface radiation material layer A2 will dissipate the heat of the higher temperature surface to the vehicle interior space in the form of radiation, and when cooling, it will absorb the radiation heat of the vehicle interior surface and the passengers through the lower temperature surface. When the air supply channel A1 is ventilated, it can exchange heat with the surface of the vehicle interior surface radiation material layer A2 through the side air supply port A6, and then send the cold and heat into the vehicle interior through convection.

[0015] Beneficial effects of the present invention:

[0016] ① It can replace the traditional air-conditioning system used in vehicles, reduce the load on the vehicle body, make more rational use of the internal space of the vehicle, and provide more space for the layout of intelligent computing modules and other convenient tools for new energy vehicles under intelligent development;

[0017] ② Compared with the traditional air-conditioning system's reliance on engine operation, semiconductor cooling and heating have a rapid effect and can respond quickly as long as it is powered on. This is in line with the development direction of new energy vehicles, reduces vehicle body load, and improves energy utilization;

[0018] ③ The air conditioning mainly uses radiation to improve the internal environment comfort of the vehicle, and is supplemented by convection operation mode, which can cope with the changes in vehicle load under various external environmental conditions and the personalized needs of passengers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described below in conjunction with the accompanying drawings and specific implementations.

[0020] Figure 1 It is a structural principle diagram of a semiconductor radiation air conditioning system for a vehicle of the present invention.

[0021] Figure 2 It is a diagram of the inner surface of the in-vehicle radiation terminal of a semiconductor radiation air-conditioning system for a vehicle of the present invention.

[0022] Figure 3 This is a cross-sectional view a of the in-vehicle radiation end of a semiconductor radiation air-conditioning system for a vehicle of the present invention.

[0023] Figure 4 It is a structural diagram of a semiconductor component of a semiconductor radiation air conditioning system for a vehicle according to the present invention.

[0024] Among them: A1. air supply duct, A2. radiation material layer on the inner surface of the vehicle, A3. radiation material layer on the outer surface of the vehicle, A4. semiconductor components, A5. connecting wires, A6. air supply vents, A7. temperature and humidity sensors, A8. A end of the wire connector, A9. B end of the wire connector, A10. surface temperature measuring meter, A11. thermally conductive insulating material, A12. conductive metal material, A13. PN node, B1. fresh air duct in the vehicle, B2. air filter device, B3. air circulation duct in the vehicle, B4. air blower, B5. water tray, B6. condensate pipe, B7. fin heat conduction structure, B8. exhaust fan, B9. exhaust duct. DETAILED DESCRIPTION

[0025] like Figure 1 As shown, the air supply channel A1 is tightly welded to the center line of the radiation material layer A2 on the inner surface of the vehicle. As the in-vehicle use side of the radiation air conditioner, the air supply channel A1 is connected to the ambient air inside the vehicle to realize internal heat circulation. Figure 2As shown, a temperature and humidity sensor A7 is placed outside the air supply channel A1, and the temperature and humidity sensor A7 is mainly used to detect the temperature and humidity of the ambient air inside the vehicle. There are multiple spaced air supply ports A6 on the side where the air supply channel A1 is closely connected to the inner surface radiation material layer A2 of the vehicle. The air supply ports A6 are directly excavated on the pipe body of the air supply duct A1. The air supply direction and the exhaust direction of each exhaust port are as shown in FIG. Figure 2 As shown by the arrow in the middle. An air filter device B2 and a blower B4 are installed in the in-vehicle fresh air duct B1, and are connected to the exhaust duct B9 through the upper and lower surfaces of the semiconductor component A4. An exhaust fan B8 is installed in the exhaust duct B9. There is a water receiving tray B5 below the surface of the semiconductor component A4 on the fresh air duct B1 side, and the outlet of the water receiving tray B5 is connected to the condensate pipe B6. The surfaces of the semiconductor component A4 on the fresh air duct B1 side and the exhaust duct B9 side are equipped with fin heat conduction structures B7. The in-vehicle air circulation duct B3 is connected to the in-vehicle fresh air duct B1 between the air filter device B2 and the blower B4.

[0026] like Figure 2 , Figure 3 The vehicle interior surface radiation material layer A2 corresponds to the vehicle interior, and the vehicle exterior surface radiation material layer A3 corresponds to the vehicle exterior. The two are tightly connected to the vehicle interior and exterior, respectively, and are tightly attached to multiple semiconductor components A4 in the internal space of the two. Multiple semiconductor components A4 are connected in series through connecting wires A5, and the beginning and end of the wire A5 connecting the semiconductor components A4 are respectively the wire connector A end A8 and the wire connector B end A9. A surface temperature measuring meter A10 is installed on the inner surface of the vehicle interior surface radiation material layer A2 (i.e., the surface connected to the semiconductor components A4), which is mainly used to measure the surface temperature of the vehicle interior surface radiation material layer A2 to adjust the cooling and heating demand.

[0027] like Figure 4As shown, the semiconductor component A4 is mainly composed of a thermally conductive insulating material A11, a conductive metal material A12, and a PN node A13. The PN node A13 is interconnected through the conductive metal material A12, and the thermally conductive insulating material A11 and the outer surface of the conductive metal material A12 connected to the upper and lower parts of the PN node A13 are closely connected to form a semiconductor component A4. The thermally conductive insulating material A11 also needs to be closely attached to the inner surface of the radiation material layer A2 on the inner surface of the vehicle and the radiation material layer A3 on the outer surface of the vehicle to form a whole. According to the Peltier effect, when the wire connector A end A8 of the semiconductor component A4 is connected to the positive electrode and the wire connector B end A9 is connected to the negative electrode, the current direction is from the P level to the N level, and the upper part of the PN node is used as the hot end, and the lower part is used as the hot end. This effect is reversible. When the A end A8 of the wire connector is connected to the negative electrode and the B end A9 of the wire connector is connected to the positive electrode, the upper and lower cold and hot ends of the PN node 13 are exchanged. The thermally conductive insulating material A11 of the semiconductor component A4 in the fresh air channel needs to be closely attached to the inner surface of the fin thermal conductive structure B7 to ensure good thermal conductivity in the dehumidification and fresh air modes. The in-vehicle air circulation, fresh air and dehumidification of the semiconductor radiation air conditioning system are all achieved by the blower B4. When the in-vehicle air circulation is required, the fresh air valve of the in-vehicle fresh air channel B1 can be closed, and the valve of the in-vehicle air circulation channel B3 can be opened, and the air inside the vehicle can be sent to the air supply channel A1 through the blower B3. When there is a demand for fresh air in the car, the valve of the in-vehicle air circulation channel B3 can be closed, and the fresh air valve of the in-vehicle fresh air channel B1 can be opened. During dehumidification, the semiconductor component A4 in the fresh air channel B1 needs to be turned on to transfer the cold end cold energy to the air in the fresh air channel B1 through the fin heat conduction structure B7 to achieve cooling and dehumidification, and the heat at the hot end is discharged through the exhaust fan B8 and the exhaust channel B9.

[0028] In summer conditions, the current direction of the semiconductor component A4 at the end of the radiation in the vehicle should be ensured to be from the wire connector end A to the wire connector end B. At this time, the vehicle surface radiation material layer A2 attached to the semiconductor component A4 will be used as the cooling side to cool the interior, and the vehicle surface radiation material layer A3 will be used as the heating side to dissipate heat to the outside. In the process of radiation cooling, the dew point temperature in the vehicle should be determined by the measurement results of the temperature and humidity sensor A7, and the radiation surface temperature of the vehicle surface radiation material layer A2 should be measured by the surface temperature measuring meter A10 to avoid condensation caused by the radiation surface temperature being lower than the dew point temperature. When the cooling relying solely on radiation cannot meet the load requirements under overheating conditions, the blower B4 can be started to introduce circulating air into the vehicle into the air supply channel A1, and the parallel airflow discharged through the air supply port A6 can realize forced convection heat exchange with the vehicle surface radiation material layer A2, thereby enhancing the cooling effect of the semiconductor radiation air conditioning system. At this time, the vehicle surface radiation material layer A3 can also accelerate the heat dissipation through the opposite airflow generated during the driving of the vehicle, thereby realizing the stable operation of the semiconductor radiation air conditioning system.

[0029] In winter working conditions, the current direction should be ensured to be from the wire connector end B to the wire connector end A. At this time, the inner surface radiation material layer A2 attached to the semiconductor component A4 will be used as the heating side to supply heat to the inside, and the outer surface radiation material layer A3 will be used as the cooling side to discharge cold to the outside. In the process of radiation heating, the air temperature in the car can be judged by the measurement results of the temperature and humidity sensor A7, and the radiation surface temperature of the inner surface radiation material layer A2 can be measured by the surface temperature measuring meter A10 to avoid excessive heating. When the heating based on radiation alone cannot meet the load requirements under supercooling conditions, the blower B4 can be started to introduce circulating air inside the vehicle into the air supply channel A1, and the parallel airflow discharged through the air supply port A6 realizes forced convection heat exchange with the inner surface radiation material layer A2, thereby enhancing the heating effect of the semiconductor radiation air conditioning system. At this time, the outer surface radiation material layer A3 can also accelerate the cooling through the opposite airflow generated during the driving of the vehicle, thereby realizing the stable operation of the semiconductor radiation air conditioning system.

[0030] The cooling and heating capacity of the semiconductor radiation air-conditioning system is controlled by the current and is affected by the connection method of the semiconductor. The present invention adopts a series connection form to achieve a larger temperature difference between the cold end and the hot end of the semiconductor compared to the parallel connection form, thereby meeting a larger load. The cooling and heating capacity of the semiconductor radiation air-conditioning system increases with the increase of current and decreases with the decrease of current. There is a maximum value for cooling and heating capacity, and the corresponding current can be derived through the principle formulas of the Peltier effect, Fourier effect and Joule effect, and calculated according to the number of semiconductor components actually used and the series-parallel connection form, as the control adjustment threshold of the semiconductor radiation air-conditioning system.

[0031] The method described above can realize the cooling and heating of the semiconductor radiation air-conditioning system of the vehicle, and improves the application places of the radiation air-conditioning system. At the same time, compared with the traditional air-conditioning system of the vehicle, it reduces the load of the car on the components of the traditional air-conditioning system, improves the utilization effect of new energy, and is in line with the development direction of new energy vehicles.

[0032] Through the above description, relevant staff can make various changes and modifications without departing from the technical concept of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A semiconductor radiation air conditioning system for a vehicle, characterized in that: It includes an air supply channel (A1), a radiation material layer on the inner surface of the vehicle (A2), a radiation material layer on the outer surface of the vehicle (A3), a semiconductor component (A4), a connecting wire (A5), an air supply port (A6), a temperature and humidity sensor (A7), a surface temperature measuring meter (A10), an inner fresh air channel (B1), an air filter device (B2), an inner air circulation channel (B3), a blower (B4), a water tray (B5), a condensate pipe (B6), a fin heat conduction structure (B7), an exhaust fan (B8) and an exhaust channel (B9); The air supply channel (A1) is tightly fixed to the center line of the vehicle interior surface radiation material layer (A2); a temperature and humidity sensor (A7) is placed on the outside of the air supply channel (A1), and a plurality of spaced air supply ports (A6) are provided on the side where the air supply channel (A1) and the vehicle interior surface radiation material layer (A2) are tightly connected, and the air supply ports (A6) are directly excavated on the side of the pipe body of the air supply channel (A1); the vehicle interior surface radiation material layer (A2) corresponds to the vehicle interior, and the vehicle exterior surface radiation material layer (A3) corresponds to the vehicle exterior, and the two are tightly connected to the vehicle body at the inside and outside, respectively, and are tightly attached to a plurality of semiconductor components (A4) in the internal space of the two; the plurality of semiconductor components (A4) are connected in series via connecting wires (A5), and the starting and ending points of the connecting wires (A5) connecting the semiconductor components (A4) in series are the wire connector A end (A8) and the wire connector B end (A9); a surface temperature measuring meter (A10) is attached to the inner surface of the vehicle interior surface radiation material layer (A2); The in-vehicle fresh air passage (B1) is connected to the air supply passage (A1), an air filter (B2) and a blower (B4) are installed in the in-vehicle fresh air passage (B1), and the in-vehicle fresh air passage (B1) is connected to the exhaust passage (B9) through the upper and lower surfaces of the semiconductor component (A4), and the exhaust passage (B9) is installed with an exhaust fan (B8); a water receiving tray (B5) is provided below the surface of the semiconductor component (A4) on the in-vehicle fresh air passage (B1) side, and the outlet of the water receiving tray (B5) is connected to the condensate pipe (B6); the surfaces of the semiconductor component (A4) on the in-vehicle fresh air passage (B1) side and the exhaust passage (B9) side are both equipped with fin heat conduction structures (B7); the in-vehicle air circulation passage (B3) is connected to the in-vehicle fresh air passage (B1) between the air filter (B2) and the blower (B4); The semiconductor component (A4) includes a thermally conductive insulating material (A11), a conductive metal material (A12), and a PN node (A13); the PN node (A13) is interconnected via the conductive metal material (A12), and the thermally conductive insulating material (A11) and the outer surfaces of the conductive metal material (A12) connected to the upper and lower PN nodes (A13) are tightly connected to form a semiconductor component (A4); wherein the thermally conductive insulating material (A11) is tightly attached to the inner surfaces of the vehicle inner surface radiation material layer (A2) and the vehicle outer surface radiation material layer (A3) to form a whole, or is tightly attached to the inner surface of the fin heat conductive structure (B7).

2. A vehicle semiconductor radiation air conditioning system according to claim 1, characterized in that: The semiconductor radiation air-conditioning system forms an integral whole with the vehicle body roof, and is only driven by electricity, without a heavy and complicated structure; the semiconductor radiation air-conditioning system has in-vehicle cooling condition operation, in-vehicle heating condition operation, radiation cooling and heating operation, and radiation convection cooling and heating operation modes.

3. A vehicle semiconductor radiation air conditioning system according to claim 1, characterized in that: The semiconductor radiation air conditioning system provides cooling and heating by means of a semiconductor component (A4); the semiconductor component (A4) is divided into a cold end and a hot end, and the distribution of the cold end and the hot end is affected by the direction of current movement; when the A end (A8) of the wire connector is connected to the positive electrode and the B end (A9) of the wire connector is connected to the negative electrode, and the current flows in the direction from the P level to the N level, the upper part of the semiconductor component (A4) is the hot end and the lower part is the cold end, that is, the radiation material layer (A2) on the inner surface of the vehicle can be used as the cold surface and the radiation material layer (A3) on the outer surface of the vehicle can be used as the hot surface; In this operating condition, the semiconductor radiation air conditioning system can provide cooling to the interior of the vehicle and release heat to the outside, corresponding to the cooling condition inside the vehicle; when the A end (A8) of the wire connector is connected to the negative pole, and the B end (A9) of the wire connector is connected to the positive pole, the current flows in the direction from the N level to the P level. At this time, the upper part of the semiconductor component (A4) is the cold end and the lower part is the hot end, that is, the radiation material layer (A2) on the inner surface of the vehicle can be used as the hot surface, and the radiation material layer (A3) on the outer surface of the vehicle can be used as the cold surface; In this operating condition, the semiconductor radiation air conditioning system can supply heat to the interior of the vehicle and release cold air to the outside, corresponding to the heating condition inside the vehicle; When the vehicle is in cooling and heating operation mode, the temperature change of the radiation material layer (A2) on the vehicle surface can be monitored by a surface temperature measuring meter (A10).

4. A vehicle semiconductor radiation air conditioning system according to claim 1, characterized in that: The dehumidification and fresh air of the semiconductor radiation air conditioning system are achieved by relying on the in-vehicle fresh air passage (B1), the in-vehicle air circulation passage (B3), the blower (B4), the semiconductor component (A4) in the in-vehicle fresh air passage (B1) and the fin heat conduction structure (B7); when the blower (B4) is turned on, the fresh air and the in-vehicle circulating air will be combined and then pass through the semiconductor component (A4), and the semiconductor component (A4) is energized, so that the surface on the fresh air passage side is used as the cold end and the exhaust passage side is used as the hot end, thereby realizing cooling and dehumidification of the air in the fresh air passage.

5. A vehicle semiconductor radiation air conditioning system according to claim 1, characterized in that: The radiation and convection of the semiconductor radiation air conditioning system are realized by the air supply channel (A1), the semiconductor component (A4), the air supply port (A6) and the radiation material layer (A2) on the inner surface of the vehicle; The vehicle interior surface radiation material layer (A2) will radiate heat from the higher temperature surface to the vehicle interior space in the form of radiation when providing heating, and absorb radiation heat from the vehicle interior surface and passengers through the lower temperature surface when providing cooling; when the air supply channel (A1) is ventilated, heat can be exchanged with the surface of the vehicle interior surface radiation material layer (A2) through the side air supply port (A6), and then the cold and heat can be sent into the vehicle interior through convection.

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