Rough polishing process applied to diamond substrate

Abstract

The invention belongs to the technical field of semiconductors, and discloses a rough polishing process applied to diamond substrates, which comprises the following steps of: S1, sequentially placing nine 4-inch or 6-inch diamond substrates on a wandering star wheel of grinding equipment, S2, installing a pre-selected grinding pad, and selecting a multi-layer slotting mode according to the required rough polishing precision; s3, in the rough polishing process, initial pressure is applied to the diamond substrate for rough polishing, and the surface response of the diamond substrate is monitored in real time, and S4, cooling liquid circulation flow of 5000ml / min is adopted, so that the cooling liquid fully covers the whole grinding surface, and the flow in the rough polishing process is monitored and adjusted; s5, the rotating speed of the upper disc and the rotating speed of the lower disc are adjusted in an independent control mode; according to the process, through accurate control and real-time adjustment of grinding parameters, efficient, uniform and high-quality rough polishing machining of the diamond substrate is achieved, the surface flatness and consistency of a product are remarkably improved, and the machining efficiency and the product quality are improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing, and in particular to a rough polishing process applied to a diamond substrate. Background Art

[0002] With the rapid development of the semiconductor and optoelectronic industries, diamond substrates, as a material with great potential, are widely used in the manufacture of high-performance electronic devices and optical components due to their excellent thermal conductivity, hardness and chemical stability. In the preparation process of diamond substrates, rough polishing is a very important step, which directly affects the subsequent fine polishing and the efficiency and product quality of the entire manufacturing process. In order to obtain a high-quality diamond substrate surface, the rough polishing process needs to remove the irregular parts of the surface while ensuring the integrity of the substrate structure to achieve high-precision flatness requirements. Therefore, the accuracy and efficiency of the grinding and polishing process are crucial to the development of the entire industry chain.

[0003] However, there are still many technical problems in the existing rough polishing process of diamond substrates. One of the core problems is the lack of precise control of processing parameters, especially in the coordination of pressure, rotation speed and cooling system. Due to the hardness and processing complexity of diamond, the rough polishing process often faces the problem of difficulty in controlling surface flatness while ensuring efficiency. In the prior art, the pressure applied during the rough polishing process cannot be adaptively adjusted according to the actual surface state of the substrate, resulting in uneven polishing effect on the processed surface, and even causing microcracks or surface damage, which ultimately affects the performance of the substrate.

[0004] In view of this, it is necessary to improve the rough polishing process of diamond substrate in the prior art to solve the technical problem of limited control accuracy of processing parameters. Summary of the invention

[0005] The purpose of the present invention is to provide a rough polishing process applied to diamond substrates to solve the above technical problems.

[0006] To achieve this object, the present invention adopts the following technical solutions: A rough polishing process applied to a diamond substrate, comprising: Step S1: placing nine 4-inch or 6-inch diamond substrates on the planetary wheel of the grinding equipment in sequence, fixing the diamond substrates on the polishing disc at equal intervals, and performing a preliminary inspection; Step S2: installing a pre-selected grinding pad, and selecting a multi-level grooving method according to the required rough polishing accuracy, and performing rough polishing layer by layer starting from the initial grinding to form a smooth and uniform grinding surface; Step S3: During the rough polishing process, an initial pressure is applied to the diamond substrate for rough polishing, and the surface response of the diamond substrate is monitored in real time, and the pressure is kept within an optimal range by using an adaptive adjustment technology; wherein the optimal range is 50 g / cm² to 300 g / cm²; Step S4: using a coolant circulation flow rate of 5000 ml / min to allow the coolant to fully cover the entire grinding surface, and using an intelligent flow control system to monitor and adjust the flow rate during the rough polishing process; Step S5: The rotation speeds of the upper and lower discs are adjusted by independent control, and the initial settings are 35 rpm for the lower disc and 11.65 rpm for the upper disc, and the ring gear and the center gear are controlled at 5.25 rpm and 8.5 rpm respectively; Step S6: After the rough polishing process is completed, an optical flatness detection device is used to evaluate the uniformity of the diamond substrate.

[0007] Optionally, the step S1 specifically includes: Step S11: The planetary wheel and polishing disc of the grinding equipment are thoroughly cleaned, and the flatness and thickness of the polishing disc are calibrated using a measuring instrument to make the disc surface runout less than 0.1 mm and the TTV less than 10 μm; Step S12: ultrasonically cleaning nine 4-inch or 6-inch diamond substrates to remove tiny particles and contaminants attached to the surface; Step S13: Calculate the equally spaced positions of the substrate on the polishing disc according to the size of the polishing disc and the structure of the planetary wheel, mark the placement position of the substrate on the polishing disc, and fix the diamond substrate at the marked position of the planetary wheel using a vacuum suction cup.

[0008] Optionally, the step S1 further includes: Step S14: Preliminary inspection of the entire grinding equipment, including: Check the stability of the diamond substrate fixation; Verify the rotation stability of the planetary wheel and the operating status of the polishing disc; Confirm the normal operation of the sensor components; Carry out a short test run to confirm that there is no abnormal vibration or noise; And according to the trial operation results, fine-tune the parameters of the grinding equipment.

[0009] Optionally, the step S2 specifically includes: Step S21: installing a preselected polishing pad, wherein the polishing pad includes a polyurethane pad or a honeycomb resin pad; Make the surface of the grinding pad smooth without wrinkles or bubbles, and fit tightly with the polishing disc; Use a pressure roller or vacuum adsorption device to fix the polishing pad; Step S22: According to the rough polishing accuracy requirements of the diamond substrate, an appropriate groove profile is selected, wherein the groove profile includes square, diamond or concentric circle grooves; Step S23: performing a multi-level grooving process on the polishing pad, wherein the multi-level grooving process specifically includes: The initial layer of notching is performed first, with deeper notches machined to achieve a fast removal rate for rough grinding; Then the groove depth and width are reduced layer by layer to form a gradient groove structure; The last layer of slotting is done with shallow notches to improve surface accuracy and finish; Ensure that the size and spacing of each layer of slots are uniform to form a multi-layered three-dimensional slot structure; Step S24: After each layer of the multi-level grooving process is roughly polished, a surface measuring instrument is used to detect the surface quality of the diamond substrate.

[0010] Optionally, the step S3 specifically includes: Step S31: Before rough polishing, preset the optimal range of the grinding equipment pressure according to the size and material characteristics of the diamond substrate; Step S32: During the grinding process, the pressure sensor installed on the equipment will monitor the stress conditions of each point on the surface of the diamond substrate in real time; Step S33: When the pressure monitoring system detects that the pressure at the corresponding point deviates from the set optimal range, the adaptive adjustment system automatically intervenes to adjust the pressure of the corresponding support leg; Optionally, step S3 further includes: Step S34: The adaptive regulation system provides a closed-loop control technology to feedback and compare the pressure adjustment data with the real-time surface pressure monitoring results to continuously optimize the pressure distribution.

[0011] Optionally, step S4 includes: Step S41: setting the coolant in the coolant circulation system to be able to circulate continuously at a flow rate of 5000 ml / min; Step S42: installing a flow control system in the coolant circulation pipeline, wherein the flow control system includes a flow sensor, a temperature sensor and a flow control valve; Connect the sensor to the central control unit, set the target flow rate to 5000ml / min, and set the allowable flow fluctuation range to ±5%.

[0012] Optionally, step S4 further includes: Step S43: before starting the grinding equipment, start the coolant circulation system first, so that the coolant starts to circulate at a set flow rate; Step S44: During the rough polishing process, the flow control system continuously monitors the coolant flow and temperature in the grinding area; when it is detected that the flow deviates from the set value or the temperature exceeds the preset range, the flow control system automatically adjusts the flow control valve to adjust the coolant flow in real time; Step S45: regularly collect temperature data of the grinding area and the substrate surface temperature, evaluate the cooling effect of the coolant, and optimize the flow rate of the coolant according to the evaluation results.

[0013] Optionally, step S5 includes: Step S51: setting up independent drive systems for respectively controlling the speed of the upper plate, the lower plate, the ring gear and the center gear, and connecting each drive system to the control system; Step S52: According to the process requirements, input the initial speed setting in the control system: The lower plate speed was set to 35 rpm; The upper plate speed was set to 11.65 rpm; The ring gear speed is set to 5.25 rpm; The center gear speed is set to 8.5 rpm; Step S53: synchronously start the drive system of the upper plate, the lower plate, the ring gear and the center gear, so that each component starts to operate according to the set initial speed; Step S54, using a speed sensor to monitor the actual speed of each component in real time, comparing it with the set initial speed, and setting the allowable error range to ±0.5rpm; Step S55: During the grinding process, the rotation speed of each component is adjusted according to the grinding state and grinding effect of the diamond substrate.

[0014] Compared with the prior art, the present invention has the following beneficial effects: nine 4-inch or 6-inch diamond substrates are sequentially placed on the planetary wheel of the grinding equipment, fixed on the polishing disc at equal intervals, and pre-inspected, and the pre-selected grinding pad is installed, and a multi-level grooving method is selected according to the required rough polishing accuracy, starting from the initial grinding, the diamond substrate is rough polished layer by layer, and an initial pressure is applied to the diamond substrate for rough polishing, and the pressure range is between 50g / cm² and 300g / cm². During the entire process, an appropriate initial pressure is applied, and the self-adaptive adjustment technology is used in real time. Monitor and regulate the pressure to ensure that it is always within the optimal range. At the same time, a high-flow coolant circulation system is used to fully cool the grinding surface to maintain a stable temperature. Independent control of the rotation speed ensures that the rotation speeds of the upper and lower discs are accurately matched, thereby achieving uniformity during the grinding process. Finally, the substrate quality is evaluated using an optical flatness detection device. This process achieves efficient, uniform and high-quality rough polishing of diamond substrates through precise control and real-time adjustment of grinding parameters, significantly improving the surface flatness and consistency of the product, and improving processing efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0017] Figure 1 This is one of the schematic flow charts of the rough polishing process applied to a diamond substrate in this embodiment; Figure 2 This is the second flow chart of the rough polishing process applied to the diamond substrate of this embodiment; Figure 3 This is the third flow chart of the rough polishing process applied to the diamond substrate of this embodiment. DETAILED DESCRIPTION

[0018] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0020] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0021] Combination Figures 1 to 3 As shown, an embodiment of the present invention provides a rough polishing process applied to a diamond substrate, comprising: Step S1: placing nine 4-inch or 6-inch diamond substrates on the planetary wheel of the grinding equipment in sequence, fixing the diamond substrates on the polishing disc at equal intervals, and performing a preliminary inspection; Ensure that the substrate is fixed at equal intervals on the stainless steel or ceramic polishing disc, and perform a pre-inspection to ensure that the disc surface jump is less than 0.1mm and the TTV (total thickness variation) is less than 10μm, so as to ensure the initial flatness of the diamond substrate and the stability of the polishing disc; Step S2: installing a pre-selected grinding pad, and selecting a multi-level grooving method according to the required rough polishing accuracy, and performing rough polishing layer by layer starting from the initial grinding to form a smooth and uniform grinding surface; The cushion layer material of the polishing pad is polyurethane or medium-machine honeycomb resin, preferably a polyurethane rough polishing pad; at this stage, a rough polishing pad that can provide moderate elasticity and effectively cushion the diamond substrate is selected to ensure that the diamond will not be damaged on the surface during the rough polishing process.

[0022] The groove method is selected according to the required rough polishing accuracy; preferably, a square groove of 10×10 cm is used for initial grinding to form a smooth and uniform grinding surface. The groove depth and shape here can be based on the hardness characteristics of the diamond, and a multi-level groove method is used to perform rough polishing layer by layer to achieve the effect of removing irregularities on the surface.

[0023] Step S3: During the rough polishing process, initial pressure is applied to the diamond substrate for rough polishing, and the surface response of the diamond substrate is monitored in real time. The pressure is kept within an optimal range using adaptive adjustment technology; wherein the optimal range is 50g / cm²~300g / cm²; in order to improve processing efficiency and avoid damage to the substrate surface caused by excessive pressure.

[0024] Step S4: Use a coolant circulation flow rate of 5000 ml / min to allow the coolant to fully cover the entire grinding surface, and use an intelligent flow control system to monitor and adjust the flow rate during the rough polishing process; to ensure the uniformity of the cooling process and reduce the loss of the diamond substrate under high temperature conditions.

[0025] Step S5: Use independent control to adjust the rotation speed of the upper and lower discs, initially set to 35 rpm for the lower disc and 11.65 rpm for the upper disc, and control the ring gear and center gear at 5.25 rpm and 8.5 rpm respectively; fine-tune the rotation speed according to the grinding state and polishing progress of the diamond, and use real-time data feedback to adjust the grinding cycle to ensure that the expected rough polishing effect is achieved.

[0026] Step S6: After the rough polishing process is completed, the uniformity of the diamond substrate is evaluated using an optical flatness detection device. If necessary, various parameters are fine-tuned until the ideal rough polishing flatness and surface finish are achieved.

[0027] The working principle of the present invention is as follows: 9 4-inch or 6-inch diamond substrates are placed on the planetary wheel of the grinding equipment in sequence, so that they are fixed on the polishing disc at equal intervals, and pre-inspection is performed, and the pre-selected grinding pad is installed. According to the required rough polishing accuracy, a multi-level grooving method is selected, and the diamond substrate is rough polished layer by layer starting from the initial grinding, and the diamond substrate is rough polished by applying an initial pressure, and the pressure range is between 50g / cm² and 300g / cm². During the whole process, an appropriate initial pressure is applied, and the pressure is monitored and regulated in real time through the adaptive adjustment technology to ensure that the pressure is always in the optimal range; at the same time, a high-flow coolant circulation system is used to fully cool the grinding surface to keep the temperature stable; the independent control of the rotation speed ensures that the rotation speed of the upper disc and the lower disc is accurately matched, so as to achieve uniformity in the grinding process; finally, the substrate is quality evaluated by an optical flatness detection device; the process realizes efficient, uniform and high-quality rough polishing of the diamond substrate through precise control and real-time adjustment of the grinding parameters, significantly improves the surface flatness and consistency of the product, and improves the processing efficiency and product quality.

[0028] In this embodiment, it is specifically explained that step S1 specifically includes: Step S11: Clean the planetary wheel and polishing disc of the grinding equipment thoroughly, calibrate the flatness and thickness of the polishing disc using measuring instruments to make the disc surface jump less than 0.1mm and the TTV less than 10μm; check the running status of the planetary wheel to ensure that its rotation axis is accurately aligned with the axis of the polishing disc.

[0029] Step S12: ultrasonically cleaning nine 4-inch or 6-inch diamond substrates to remove tiny particles and contaminants attached to the surface; Use an optical microscope to check the surface quality of each substrate to ensure that there are no scratches, cracks or other defects that affect the grinding effect; qualified substrates are numbered to facilitate subsequent process traceability.

[0030] Step S13: Calculate the equally spaced positions of the substrate on the polishing disc according to the size of the polishing disc and the structure of the planetary wheel, mark the placement position of the substrate on the polishing disc, and fix the diamond substrate at the marked position of the planetary wheel using a vacuum suction cup.

[0031] Step S14: Pre-inspect the entire grinding equipment, including: Check the stability of the diamond substrate fixation; Verify the rotation stability of the planetary wheel and the operating status of the polishing disc; Confirm the normal operation of the sensor components; Carry out a short test run to confirm that there is no abnormal vibration or noise; And according to the trial operation results, fine-tune the parameters of the grinding equipment.

[0032] In this embodiment, it is specifically described that step S2 specifically includes: Step S21: installing a preselected polishing pad, the polishing pad comprising a polyurethane pad or a honeycomb resin pad; Make the surface of the grinding pad smooth, without wrinkles or bubbles, and fit tightly with the polishing disc; Use a pressure roller or vacuum adsorption device to fix the polishing pad; Step S22: According to the rough polishing accuracy requirements of the diamond substrate, select an appropriate groove profile, which includes square, diamond or concentric circle grooves; It is preferred to use a square groove with a size of 10×10 cm to optimize the flow of the grinding liquid and the removal of grinding chips; the depth and width of the groove are determined to meet the needs of multi-level grooves.

[0033] Step S23: performing multi-level grooving processing on the polishing pad, the multi-level grooving processing specifically includes: The initial layer of notching is performed first, with deeper notches machined to achieve a fast removal rate for rough grinding; Then the groove depth and width are reduced layer by layer to form a gradient groove structure; The last layer of slotting is done with shallow notches to improve surface accuracy and finish; Ensure that the size and spacing of each layer of slots are uniform to form a multi-level three-dimensional slot structure.

[0034] Step S24: After each layer of the multi-level grooving process is rough-polished, the surface quality of the diamond substrate is tested using a surface measuring instrument. The surface quality test includes testing parameters such as flatness and roughness.

[0035] In this embodiment, it is specifically described that step S3 specifically includes: Step S31: Before rough polishing, preset the optimal range of the grinding equipment pressure according to the size and material characteristics of the diamond substrate; Step S32: During the grinding process, the pressure sensor installed on the equipment will monitor the stress conditions of each point on the surface of the diamond substrate in real time; The surface pressure of the substrate is collected at multiple points by sensors, and the data is transmitted to the control system in real time through the processor to monitor whether any pressure exceeds the preset range or is unevenly distributed.

[0036] Step S33: When the pressure monitoring system detects that the pressure at the corresponding point deviates from the set optimal range, the adaptive adjustment system automatically intervenes to adjust the pressure of the corresponding support leg; The adaptive system corrects uneven pressure in a timely manner by finely adjusting the pressure applied by each leg to ensure that the pressure on the surface of each diamond substrate is always maintained in the optimal range of 50g / cm² to 300g / cm².

[0037] In this embodiment, it is further explained that after step S33, the following steps are further included: Step S34: The adaptive adjustment system provides closed-loop control technology, which compares the pressure adjustment data with the real-time surface pressure monitoring results, and continuously optimizes the pressure distribution. The adaptive adjustment system dynamically updates the pressure control strategy according to the surface state changes of the substrate during the grinding process, and avoids surface damage or microcracks caused by long-term uneven pressure.

[0038] In this embodiment, it is specifically described that step S4 specifically includes: Step S41: setting the coolant in the coolant circulation system to be able to circulate continuously at a flow rate of 5000 ml / min; Select a coolant suitable for the rough polishing process of diamond substrates, which should have excellent cooling performance, lubrication performance and chemical stability to prevent corrosion or contamination of the diamond substrate; check and clean the coolant storage tank and delivery pipeline to ensure that there are no impurities and pollutants inside to avoid blockage and secondary contamination.

[0039] Step S42: installing a flow control system in the coolant circulation pipeline, the flow control system including a flow sensor, a temperature sensor and a flow control valve; Connect the sensor to the central control unit, set the target flow rate to 5000ml / min, and set the allowable flow fluctuation range to ±5%.

[0040] Step S43: before starting the grinding equipment, start the coolant circulation system first, so that the coolant starts to circulate at a set flow rate; Step S44: During the rough polishing process, the flow control system continuously monitors the coolant flow and temperature in the grinding area; when it is detected that the flow deviates from the set value or the temperature exceeds the preset range, the flow control system automatically adjusts the flow control valve to adjust the coolant flow in real time; Step S45: regularly collect temperature data of the grinding area and the substrate surface temperature, evaluate the cooling effect of the coolant, and optimize the flow rate of the coolant according to the evaluation results.

[0041] In this embodiment, it is specifically explained that step S1 specifically includes: Step S51: Set up independent drive systems, respectively used for speed control of the upper plate, lower plate, ring gear and center gear, and connect each drive system to the control system; ensure that the speed of each component can be accurately and independently adjusted; set the initial parameter interface in the control software to allow input and saving of the target speed value of each component.

[0042] Step S52: According to the process requirements, input the initial speed setting in the control system: The lower plate speed was set to 35 rpm; The upper plate speed was set to 11.65 rpm; The ring gear speed is set to 5.25 rpm; The center gear speed is set to 8.5 rpm; Step S53: synchronously start the drive system of the upper plate, the lower plate, the ring gear and the center gear, so that each component starts to operate according to the set initial speed; Step S54, using a speed sensor to monitor the actual speed of each component in real time, comparing it with the set initial speed, and setting the allowable error range to ±0.5rpm; If a deviation is found, the control system automatically adjusts the drive current or frequency and corrects the speed to keep it at the target value.

[0043] Step S55: During the grinding process, the rotation speed of each component is adjusted according to the grinding state and grinding effect of the diamond substrate.

[0044] If the grinding is found to be uneven or the efficiency is not ideal, the rotation speed of the upper or lower disk can be appropriately increased or decreased; by using the dynamic adjustment function of the control system and inputting new rotation speed parameters, the system will smoothly transition to the new rotation speed to avoid impact on the equipment and substrate; the adjusted rotation speed parameters and the corresponding grinding effect can be recorded to provide data support for subsequent process optimization.

[0045] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A rough polishing process for diamond substrates, characterized in that: include: Step S1: placing nine 4-inch or 6-inch diamond substrates on the planetary wheel of the grinding equipment in sequence, fixing the diamond substrates on the polishing disc at equal intervals, and performing a preliminary inspection; Step S2: installing a pre-selected grinding pad, and selecting a multi-level grooving method according to the required rough polishing accuracy, and performing rough polishing layer by layer starting from the initial grinding to form a smooth and uniform grinding surface; Step S3: During the rough polishing process, an initial pressure is applied to the diamond substrate for rough polishing, and the surface response of the diamond substrate is monitored in real time, and the pressure is kept within an optimal range by using an adaptive adjustment technology; wherein the optimal range is 50 g / cm² to 300 g / cm²; Step S4: using a coolant circulation flow rate of 5000 ml / min to allow the coolant to fully cover the entire grinding surface, and using an intelligent flow control system to monitor and adjust the flow rate during the rough polishing process; Step S5: The rotation speeds of the upper and lower discs are adjusted by independent control, and the initial settings are 35 rpm for the lower disc and 11.65 rpm for the upper disc, and the ring gear and the center gear are controlled at 5.25 rpm and 8.5 rpm respectively; Step S6: After the rough polishing process is completed, an optical flatness detection device is used to evaluate the uniformity of the diamond substrate.

2. The rough polishing process for diamond substrate according to claim 1, characterized in that: The step S1 specifically includes: Step S11: The planetary wheel and polishing disc of the grinding equipment are thoroughly cleaned, and the flatness and thickness of the polishing disc are calibrated using a measuring instrument to make the disc surface runout less than 0.1 mm and the TTV less than 10 μm; Step S12: ultrasonically cleaning nine 4-inch or 6-inch diamond substrates to remove tiny particles and contaminants attached to the surface; Step S13: Calculate the equally spaced positions of the substrate on the polishing disc according to the size of the polishing disc and the structure of the planetary wheel, mark the placement position of the substrate on the polishing disc, and fix the diamond substrate at the marked position of the planetary wheel using a vacuum suction cup.

3. The rough polishing process for diamond substrate according to claim 2, characterized in that: The step S1 further comprises: Step S14: Preliminary inspection of the entire grinding equipment, including: Check the stability of the diamond substrate fixation; Verify the rotation stability of the planetary wheel and the operating status of the polishing disc; Confirm the normal operation of the sensor components; Carry out a short test run to confirm that there is no abnormal vibration or noise; And according to the trial operation results, fine-tune the parameters of the grinding equipment.

4. The rough polishing process for diamond substrate according to claim 1, characterized in that: The step S2 specifically includes: Step S21: installing a preselected polishing pad, wherein the polishing pad includes a polyurethane pad or a honeycomb resin pad; Make the surface of the grinding pad smooth without wrinkles or bubbles, and fit tightly with the polishing disc; Use a pressure roller or vacuum adsorption device to fix the polishing pad; Step S22: According to the rough polishing accuracy requirements of the diamond substrate, an appropriate groove profile is selected, wherein the groove profile includes square, diamond or concentric circle grooves; Step S23: performing a multi-level grooving process on the polishing pad, wherein the multi-level grooving process specifically includes: The initial layer of notching is performed first, with deeper notches machined to achieve a fast removal rate for rough grinding; Then the groove depth and width are reduced layer by layer to form a gradient groove structure; The last layer of slotting is done with shallow notches to improve surface accuracy and finish; Ensure that the size and spacing of each layer of slots are uniform to form a multi-layered three-dimensional slot structure; Step S24: After each layer of the multi-level grooving process is roughly polished, a surface measuring instrument is used to detect the surface quality of the diamond substrate.

5. The rough polishing process for diamond substrate according to claim 1, characterized in that: The step S3 specifically includes: Step S31: Before rough polishing, preset the optimal range of the grinding equipment pressure according to the size and material characteristics of the diamond substrate; Step S32: During the grinding process, the pressure sensor installed on the equipment will monitor the stress conditions of each point on the surface of the diamond substrate in real time; Step S33: When the pressure monitoring system detects that the pressure at the corresponding point deviates from the set optimal range, the adaptive adjustment system automatically intervenes to adjust the pressure of the corresponding support leg.

6. The rough polishing process for diamond substrate according to claim 5, characterized in that: The step S3 further comprises: Step S34: The adaptive regulation system provides a closed-loop control technology to feedback and compare the pressure adjustment data with the real-time surface pressure monitoring results to continuously optimize the pressure distribution.

7. The rough polishing process for diamond substrate according to claim 1, characterized in that: The step S4 comprises: Step S41: setting the coolant in the coolant circulation system to be able to circulate continuously at a flow rate of 5000 ml / min; Step S42: installing a flow control system in the coolant circulation pipeline, wherein the flow control system includes a flow sensor, a temperature sensor and a flow control valve; Connect the sensor to the central control unit, set the target flow rate to 5000ml / min, and set the allowable flow fluctuation range to ±5%.

8. The rough polishing process for diamond substrate according to claim 7, characterized in that: The step S4 further comprises: Step S43: before starting the grinding equipment, start the coolant circulation system first, so that the coolant starts to circulate at a set flow rate; Step S44: During the rough polishing process, the flow control system continuously monitors the coolant flow and temperature in the grinding area; when it is detected that the flow deviates from the set value or the temperature exceeds the preset range, the flow control system automatically adjusts the flow control valve to adjust the coolant flow in real time; Step S45: regularly collect temperature data of the grinding area and the substrate surface temperature, evaluate the cooling effect of the coolant, and optimize the flow rate of the coolant according to the evaluation results.

9. The rough polishing process for diamond substrate according to claim 1, characterized in that: The step S5 comprises: Step S51: setting up independent drive systems for respectively controlling the speed of the upper plate, the lower plate, the ring gear and the center gear, and connecting each drive system to the control system; Step S52: According to the process requirements, input the initial speed setting in the control system: The lower plate speed was set to 35 rpm; The upper plate speed was set to 11.65 rpm; The ring gear speed is set to 5.25 rpm; The center gear speed is set to 8.5 rpm; Step S53: synchronously start the drive system of the upper plate, the lower plate, the ring gear and the center gear, so that each component starts to operate according to the set initial speed; Step S54, using a speed sensor to monitor the actual speed of each component in real time, comparing it with the set initial speed, and setting the allowable error range to ±0.5rpm; Step S55: During the grinding process, the rotation speed of each component is adjusted according to the grinding state and grinding effect of the diamond substrate.

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