Broadband high-integration integrated Ku wave band microwave transmit-receive assembly

Abstract

The invention provides a broadband high-integration integrated Ku wave band microwave transmit-receive assembly, which comprises a shell, a frequency source module, a transmitter module and a receiver module, and is characterized in that the frequency source module is installed in the shell, and the frequency source module comprises a transmission intermediate frequency circuit, a first transmission local oscillator circuit and a second transmission local oscillator circuit; the transmitter module is mounted in the shell, and the transmitter module is configured to perform up-conversion on the output frequency of the transmitting intermediate frequency circuit and the output of the transmitting local oscillator circuit I and perform up-conversion on the obtained mixed frequency output and the output of the transmitting local oscillator circuit II to obtain a Ku-band transmitting signal; the receiver module is installed in the shell, and the receiver module is configured to mix a received Ku wave band receiving signal with a receiving local oscillator signal of the transmitter module to obtain an intermediate frequency signal, so that the technical problem that the size, the performance, the reliability and the like of an existing radio frequency front-end transceiving assembly cannot be considered at the same time is solved.

Description

Technical Field

[0001] The present application relates to the technical field of microwave transceiver components, and in particular to a broadband, highly integrated, Ku-band microwave transceiver component. Background Art

[0002] Radar systems are usually composed of four parts: RF front-end transceiver components, antennas, digital signal processing modules, and display and control terminals. With the continuous development of radar technology, it has not only improved military effectiveness, but also provided great convenience for daily life. Various types of radars have been widely used in civil fields such as security monitoring, car collision avoidance, and weather warning, and have broad application prospects.

[0003] As a key component of the radar system, the RF front-end component is responsible for signal synthesis, transmission and reception. Its performance directly affects the radar indicators. The current market has put forward higher requirements on the size, performance and reliability of the RF front-end transceiver components. Summary of the invention

[0004] The present application provides a broadband, highly integrated, integrated Ku-band microwave transceiver component to solve the technical problems that current RF front-end transceiver components cannot balance in terms of volume, performance, reliability, etc.

[0005] The present application provides a broadband, highly integrated, integrated Ku-band microwave transceiver assembly, comprising a housing, a frequency source module, a transmitter module and a receiver module, wherein the frequency source module is installed in the housing, and the frequency source module comprises a transmitting intermediate frequency circuit, a transmitting local oscillator circuit and a transmitting second local oscillator circuit; the transmitter module is installed in the housing, and the transmitter module is configured to up-convert the output frequency of the transmitting intermediate frequency circuit and the output of the transmitting local oscillator circuit, and up-convert the obtained mixed output and the output of the transmitting second local oscillator circuit to obtain a Ku-band transmitting signal; the receiver module is installed in the housing, and the receiver module is configured to mix a received Ku-band receiving signal with a receiving local oscillator signal of the transmitter module to obtain an intermediate frequency signal.

[0006] Optionally, the frequency source module also includes a constant temperature crystal oscillator, a first power divider and a second power divider, the constant temperature crystal oscillator is configured to provide a reference clock; the input end of the first power divider is electrically connected to the output end of the constant temperature crystal oscillator, and the output end of the first power divider is electrically connected to the transmitting intermediate frequency circuit; the input end of the second power divider is electrically connected to the first power divider, and the output end of the second power divider is electrically connected to the transmitting local oscillator circuit and the transmitting second local oscillator circuit.

[0007] Optionally, the transmitting intermediate frequency circuit includes a first attenuator, a first amplifier, a first phase-locked loop, a second amplifier, a clock driver, a DDS chip, and a balun electrically connected in sequence; the input end of the first attenuator is electrically connected to the output end of the first power divider.

[0008] Optionally, the transmitting intermediate frequency circuit also includes a second attenuator, a third attenuator, a first filter and a second filter, the second attenuator is electrically connected between the first phase-locked loop and the second amplifier; the third attenuator is electrically connected to the output end of the second amplifier; the first filter is electrically connected between the third attenuator and the clock driver; and the second filter is electrically connected to the output end of the balun.

[0009] Optionally, the transmitting local oscillator circuit includes a fourth attenuator, a third amplifier, a second phase-locked loop, and a fourth amplifier electrically connected in sequence; the input end of the fourth attenuator is connected to the output end of the second power divider.

[0010] Optionally, the transmitting local oscillator circuit also includes a fifth attenuator, a third filter and a sixth attenuator, the fifth attenuator is electrically connected between the second phase-locked loop and the fourth amplifier; the input end of the third filter is electrically connected to the output end of the fourth amplifier; the input end of the sixth attenuator is electrically connected to the output end of the third filter.

[0011] Optionally, the transmitting second circuit includes a seventh attenuator, a fifth amplifier, an eighth attenuator, a third phase-locked loop, and a fourth filter which are electrically connected in sequence; the input end of the seventh attenuator is connected to the output end of the second power divider.

[0012] Optionally, the transmitter module includes a first mixing circuit, a second mixing circuit and a coupling circuit electrically connected in sequence,

[0013] The first frequency mixing circuit comprises a sixth amplifier, a ninth attenuator, a fifth filter, a tenth attenuator and a first frequency mixer which are electrically connected in sequence; the input end of the sixth amplifier is electrically connected to the output end of the second filter in the transmitting intermediate frequency circuit; the first input end and the second input end of the first frequency mixer are electrically connected to the tenth attenuator and the output end of the sixth attenuator in the transmitting local oscillator circuit respectively, and the output end of the first frequency mixer is electrically connected to the second frequency mixing circuit;

[0014] The second frequency mixing circuit comprises an eleventh attenuator, a sixth filter, a twelfth attenuator, a seventh amplifier, a first temperature compensation attenuator, a seventh filter, a thirteenth attenuator, and a second frequency mixer which are electrically connected in sequence; the input end of the eleventh attenuator is electrically connected to the output end of the first frequency mixer, the first input end and the second input end of the second frequency mixer are electrically connected to the thirteenth attenuator and the output end of the fourth filter in the second transmitting local oscillator circuit, respectively, and the output end of the second frequency mixer is electrically connected to the coupling circuit;

[0015] The coupling circuit comprises a fourteenth attenuator, an eighth filter, an eighth amplifier, a fifteenth attenuator, a ninth filter, a ninth amplifier, a sixteenth attenuator, a third power divider, a seventeenth attenuator, a first switch, a first equalizer, a second switch, a seventeenth attenuator, a tenth amplifier, an eighteenth attenuator, a power amplifier, a coupler, and an isolator which are electrically connected in sequence; the input end of the fourteenth attenuator is electrically connected to the output end of the second mixer;

[0016] The second output end of the coupler is electrically connected to the detector and the comparator in sequence.

[0017] Optionally, the receiver module includes a first receiving circuit and a second receiving circuit electrically connected in sequence, the first receiving circuit is configured to receive the Ku-band receiving signal, and the second receiving circuit is configured to receive the intermediate frequency signal;

[0018] The first receiving circuit includes a limiter, a first low noise amplifier, a digitally controlled attenuator, a tenth filter, a nineteenth attenuator, a second low noise amplifier, an eleventh filter, a twentieth attenuator, a third mixer, a twenty-first attenuator, a twelfth filter, an eleventh amplifier, a twenty-second attenuator, a second temperature compensation attenuator, a twelfth amplifier, a twenty-third attenuator, and a thirteenth filter, which are electrically connected in sequence;

[0019] The second receiving circuit includes a twenty-fourth attenuator, a thirteenth amplifier, and a fourteenth filter electrically connected in sequence, the input end of the twenty-fourth attenuator is electrically connected to the second output end of the third power divider, and the output end of the twenty-fourth attenuator is electrically connected to the second input end of the third mixer.

[0020] Optionally, the shell includes an upper cavity and a lower cavity that are connected, the transmitting local oscillator circuit, the transmitting second local oscillator circuit, the transmitter module and the receiver module are installed in the upper cavity, and the transmitting intermediate frequency circuit is installed in the lower cavity.

[0021] The present application provides a broadband, highly integrated, integrated Ku-band microwave transceiver component. First, the frequency source module combines the advantages of low spuriousness, high output frequency of the phase-locked loop (PLL) and low phase noise and fast frequency conversion speed of the direct digital frequency synthesis (DDS). The scheme of combining PLL and DDS in series is adopted to realize the synthesis of low phase noise and low spurious transmission intermediate frequency signals, and the intermediate frequency signal waveform is adjustable due to the use of DDS chips. The transmitting local oscillator circuit and the transmitting second local oscillator circuit adopt the PLL scheme of the highly integrated Hittite platform to achieve excellent phase noise and spurious performance and reduce the circuit area.

[0022] The transmitter module adopts a double-mixing local oscillator amplification structure and a customized high-performance filter to suppress mixing spurious signals to the greatest extent. Secondly, the receiver module uses a low-noise amplifier and a digitally controlled attenuator to achieve the low noise figure and high dynamic range of the receiver.

[0023] The transmitter module and the receiver module all use monolithic microwave integrated circuit (MMIC) chips to reduce the circuit area, and a double-layer cavity structure is designed to assemble all modules in one housing, realizing the miniaturization and integration of components. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a schematic diagram of the overall structure of a broadband, highly integrated, integrated Ku-band microwave transceiver assembly provided by the present application;

[0026] Figure 2 It is an exploded schematic diagram of a broadband highly integrated integrated Ku-band microwave transceiver assembly provided by the present application;

[0027] Figure 3 It is a schematic diagram of the structure in the upper cavity of the broadband highly integrated integrated Ku-band microwave transceiver assembly provided by the present application;

[0028] Figure 4 It is a schematic diagram of the structure of the lower cavity in the broadband highly integrated integrated Ku-band microwave transceiver assembly provided by the present application;

[0029] Figure 5 It is a circuit diagram of a frequency source module in a broadband, highly integrated, integrated Ku-band microwave transceiver assembly provided by the present application;

[0030] Figure 6It is a circuit diagram of a transmitter module in a broadband, highly integrated, integrated Ku-band microwave transceiver assembly provided by the present application;

[0031] Figure 7 It is a circuit diagram of a receiver module in a broadband, highly integrated, integrated Ku-band microwave transceiver assembly provided in the present application.

[0032] Description of reference numerals:

[0033] 1. Laser cover; 2. Screw-mounted cover; 3. Metal shell; 4. Lower cover; 101. Transmitting local oscillator circuit one and transmitting local oscillator circuit two; 102. Transmitter module; 103. Receiver module; 104. Transmitting intermediate frequency circuit. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application and are not used to limit the present application. In the present application, unless otherwise stated, the directional words used, such as "up", "down", "left", and "right", generally refer to the up, down, left, and right of the device in actual use or working state, specifically the drawing direction in the accompanying drawings.

[0035] The present application provides a broadband, highly integrated, integrated Ku-band microwave transceiver assembly, which is described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments of the present application. In the following embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a particular embodiment, please refer to the relevant description of other embodiments.

[0036] See also Figure 1-Figure 4The present application provides a broadband, highly integrated, integrated Ku-band microwave transceiver assembly including a housing and a frequency source module, a transmitter module, and a receiver module arranged inside the housing. The Ku-band refers to a band with a lower frequency than the K-band under the IEEE521-2002 standard, and its frequency band is usually from 10.7 to 12.75 GHz for downlink and from 12.75 to 18.1 GHz for uplink. The housing is composed of a laser cover 1, a screw-mounted cover 2, a metal housing 3, and a lower cover 4. The RF input and output are connected through a high-frequency coaxial connector, and the low-frequency input and output are connected through a J30J connector. The screw-mounted cover 2 is separated from the interior of the housing to form a connected upper cavity and a lower cavity, isolating circuits of different modules, reducing crosstalk between circuits, and improving the stability and reliability of the assembly. At the same time, the addition of a laser cover 1 can achieve the airtightness requirements of the upper cavity and ensure the stable operation of the internal MMIC chip.

[0037] The frequency source module includes a transmitting intermediate frequency circuit 104, a transmitting local oscillator circuit and a transmitting second local oscillator circuit 101; at the same time, the upper cavity is divided into three modules by an isolation metal layer, namely, the transmitting local oscillator circuit and the transmitting second local oscillator circuit 101 of the frequency source module, the transmitter module 102 and the receiver module 103. Except for the gaps left for the interconnection between each module, the other parts are completely isolated, so that multiple modules can be installed in one cavity, reducing the size of the components and the complexity of the structural interconnection, while ensuring the isolation between the modules. Insulation gold is also used inside the transmitter module 102 and the receiver module 103 to separate the links to avoid interference between components in the link and generate stray.

[0038] The lower cavity is a whole and is used to install the transmitting intermediate frequency circuit 104 of the frequency source module, so that the transmitting intermediate frequency signal is transferred to the input end of the transmitter module 102 of the upper cavity through the radio frequency insulator.

[0039] See also Figure 5 The frequency source module is provided with a reference clock by a SFN5D-LS4NB-100M constant temperature crystal oscillator, which can provide an excellent phase noise performance of -155dBc / Hz@1KHz to ensure the phase noise requirements of the components.

[0040] At the same time, the first power divider and the second power divider divide the crystal oscillator clock power into three paths, providing reference clocks for transmitting intermediate frequency signals, transmitting one local oscillator and transmitting two local oscillators respectively, and then adding an attenuator and an amplifier to each path, so as to utilize the reverse isolation of the amplifier and the attenuation of the attenuator to improve the isolation between the three circuits.

[0041] The input end of the first power divider is electrically connected to the output end of the oven controlled crystal oscillator, and the output end of the first power divider is electrically connected to the transmitting intermediate frequency circuit 104. The input end of the second power divider is electrically connected to the first power divider, and the output end of the second power divider is electrically connected to the transmitting local oscillator circuit and the transmitting second local oscillator circuit 101.

[0042] according to Figure 5 As shown, the transmitting intermediate frequency circuit 104 of the frequency source module adopts a "PLL+DDS" structure. Combining the advantages of low spurious and high output frequency of PLL and low phase noise and fast frequency conversion speed of DDS, the transmitting intermediate frequency circuit 104 is designed to achieve a transmitting intermediate frequency signal with high phase noise and spurious performance, providing a basis for the subsequent transmitter module 102 and the receiver module 103.

[0043] In this embodiment, the DDS uses the AD9910 chip of ADI Company, which supports a maximum sampling rate of 1GSPS, a maximum output frequency of 400MHz, and a frequency resolution of 0.23Hz. Therefore, the waveform of the transmitting intermediate frequency is programmable, which improves the flexibility of the component.

[0044] See also Figure 5 The transmitting intermediate frequency circuit 104 includes a first attenuator, a first amplifier, a first phase-locked loop, a second amplifier, a clock driver, a DDS chip, and a balun which are electrically connected in sequence; and the input end of the first attenuator is electrically connected to the output end of the first power divider.

[0045] The transmitting intermediate frequency circuit 104 has a high output frequency and a long wiring length. A clock driving chip is used to convert a single-ended signal into a differential signal, which is then converted back into a single-ended signal output through a balun, thereby improving the circuit's anti-interference ability and ensuring the accuracy of the output signal.

[0046] according to Figure 5 As shown, the transmitting intermediate frequency circuit 104 also includes a second attenuator, a third attenuator, a first filter and a second filter. The second attenuator is electrically connected between the first phase-locked loop and the second amplifier; the third attenuator is electrically connected to the output end of the second amplifier; the first filter is electrically connected between the third attenuator and the clock driver; and the second filter is electrically connected to the output end of the balun.

[0047] An attenuator and an amplifier are added to the transmitting intermediate frequency circuit 104, so as to improve the isolation between different circuits by utilizing the reverse isolation of the amplifier and the attenuation of the attenuator.

[0048] according to Figure 5 As shown, the transmitting local oscillator circuit includes a fourth attenuator, a third amplifier, a second phase-locked loop, a fifth attenuator, a fourth amplifier, a third filter, and a sixth attenuator which are electrically connected in sequence; the input end of the fourth attenuator is connected to the output end of the second power divider. The fifth attenuator is electrically connected between the second phase-locked loop and the fourth amplifier; the input end of the third filter is electrically connected to the output end of the fourth amplifier; and the input end of the sixth attenuator is electrically connected to the output end of the third filter.

[0049] according to Figure 5As shown, the transmitting circuit includes a seventh attenuator, a fifth amplifier, an eighth attenuator, a third phase-locked loop, and a fourth filter which are electrically connected in sequence; the input end of the seventh attenuator is connected to the output end of the second power divider.

[0050] The transmitting local oscillator circuit and the transmitting second local oscillator circuit of the frequency source module both adopt the PLL solution, and filters are added at the final stage to reduce the far-end spurious caused by the PLL, making the circuit structure simple, small in size and low in cost.

[0051] Since the local oscillator frequency is very high, using ordinary PCB board material will cause greater losses, and the RF routing only occupies one layer, so a four-layer board design is adopted, with the top layer for RF signals, the second layer for ground, the third layer for power and low-frequency signals, and the fourth layer for ground. The ground is used to isolate high-frequency signals from low-frequency signals to avoid interference. The first layer of board is made of ROGERS4350, whose dielectric constant is 3.48, and the remaining boards are made of inexpensive FR4, which can avoid excessive transmission losses and reduce costs at the same time.

[0052] See also Figure 6 The transmitter module 102 adopts a double-mixing structure to up-convert the transmission intermediate frequency and the first and second transmission local oscillators to obtain a Ku-band transmission signal. Specifically, the transmitter module includes a first mixing circuit, a second mixing circuit, and a coupling circuit that are electrically connected in sequence.

[0053] The first frequency mixing circuit includes a sixth amplifier, a ninth attenuator, a fifth filter, a tenth attenuator and a first frequency mixer which are electrically connected in sequence; the input end of the sixth amplifier is electrically connected to the output end of the second filter in the transmitting intermediate frequency circuit; the first input end and the second input end of the first frequency mixer are electrically connected to the tenth attenuator and the output end of the sixth attenuator in the transmitting local oscillator circuit, respectively, and the output end of the first frequency mixer is electrically connected to the second frequency mixing circuit.

[0054] The second mixing circuit includes an eleventh attenuator, a sixth filter, a twelfth attenuator, a seventh amplifier, a first temperature compensation attenuator, a seventh filter, a thirteenth attenuator, and a second mixer which are electrically connected in sequence; the input end of the eleventh attenuator is electrically connected to the output end of the first mixer, the first input end and the second input end of the second mixer are electrically connected to the thirteenth attenuator and the output end of the fourth filter in the second transmitting local oscillator circuit, respectively, and the output end of the second mixer is electrically connected to the coupling circuit.

[0055] The coupling circuit includes a fourteenth attenuator, an eighth filter, an eighth amplifier, a fifteenth attenuator, a ninth filter, a ninth amplifier, a sixteenth attenuator, a third power divider, a seventeenth attenuator, a first switch, a first equalizer, a second switch, a seventeenth attenuator, a tenth amplifier, an eighteenth attenuator, a power amplifier, a coupler, and an isolator, which are electrically connected in sequence; the input end of the fourteenth attenuator is electrically connected to the output end of the second mixer; and the second output end of the coupler is electrically connected to the detector and the comparator in sequence.

[0056] The two-stage filters at the output ends of the two mixers of the transmitter module 102 are used to filter out a large amount of mixing spurious and local oscillator leakage caused by up-conversion, thereby improving the spurious suppression performance of the transmitter.

[0057] The temperature compensation attenuator in the middle section of the transmitter link is used to adjust the fluctuation of link gain caused by temperature changes. Its model is STCA0607N9. When the ambient temperature rises from -40℃ to +70℃, its insertion loss is reduced by 7.8dB, thereby compensating for the gain decrease of the amplifier in the link caused by the temperature rise and improving the flatness of the output power.

[0058] The final amplifier uses the power amplifier NC116446C-1418P4, with a power gain of 20dB and a saturated output power of 37dBm. In order to push the power amplifier to a weak saturation state to improve the flatness of the output signal, a high output P -1 Amplifier ECS0513 is used to provide sufficient input power for the power amplifier. The output P-1 of ECS0513 can reach 18.5dBm.

[0059] The switch in the transmitter module 102 can control the on and off of the transmitter. A two-stage switch is used to improve the switch isolation. At the same time, a power modulation circuit is configured in the power amplifier to disconnect the power supply of the power amplifier when the switch is turned off. The last stage of the isolator can effectively isolate the near-end reflection and external interference signals. Its model is HGW6104B, with an insertion loss of only 0.4dB and a reverse isolation of 18dB.

[0060] according to Figure 6 As shown, the coupler couples a part of the energy into the coupling branch, and generates a detection BIT signal through the detector and the comparator. When the transmission power reaches the normal value, the detection BIT is a high level, otherwise, the BIT is a low level, thereby detecting whether the transmitter is working normally.

[0061] according to Figure 7 As shown, the receiver module 103 includes a first receiving circuit and a second receiving circuit which are electrically connected in sequence, the first receiving circuit is configured to receive a Ku-band receiving signal, and the second receiving circuit is configured to receive an intermediate frequency signal.

[0062] The first receiving circuit includes a limiter, a first low-noise amplifier, a digitally controlled attenuator, a tenth filter, a nineteenth attenuator, a second low-noise amplifier, an eleventh filter, a twentieth attenuator, a third mixer, a twenty-first attenuator, a twelfth filter, an eleventh amplifier, a twenty-second attenuator, a second temperature-compensated attenuator, a twelfth amplifier, a twenty-third attenuator, and a thirteenth filter, which are electrically connected in sequence.

[0063] The second receiving circuit includes a twenty-fourth attenuator, a thirteenth amplifier, and a fourteenth filter electrically connected in sequence, the input end of the twenty-fourth attenuator is electrically connected to the second output end of the third power divider, and the output end of the twenty-fourth attenuator is electrically connected to the second input end of the third mixer.

[0064] The receiver module 103 adopts a zero intermediate frequency structure, the receiving local oscillator is at the same frequency as the transmitting signal, and the intermediate frequency signal is obtained by mixing the receiving signal with the receiving local oscillator signal. As a module at the front end of the radar, the noise coefficient index of the receiver directly affects the minimum sensitivity of the system. As the first stage of the receiver, the limiter must ensure that the limiting level will not damage the receiver and reduce the impact on the noise coefficient. Therefore, the limiter uses HG126X7, with an insertion loss of 0.5dB, a maximum input power of 37dBm, and a limiting level of 16dBm. At the same time, the first stage amplifier of the receiver uses a low noise amplifier HGC320H, with a noise coefficient of 1.5dB and a gain of 22.5dB. Its low noise coefficient and high gain are conducive to reducing the overall noise coefficient.

[0065] The digital controlled attenuator IDA-0020-5B-PD can achieve 1dB stepping and 31dB maximum attenuation. By adjusting the attenuation value, the instantaneous dynamic range can be flexibly adjusted. The four-stage amplifier is used to achieve a channel gain of 52dB. At the same time, filters are added before and after the mixing to filter out various interference signals and improve the accuracy of the receiver.

[0066] The receiver module 103 and the transmitter module 102 have high frequencies, so the microstrip board is made of ROGERS5880 board with a dielectric constant of 2.2. In order to reduce the height difference between the microstrip board and the MMIC chip, the thickness of the microstrip board is set to 0.19mm, and ground copper is laid on the back of the microstrip board, so that the microstrip board is directly bonded to the cavity with conductive glue.

[0067] Most of the transmitter module 102 and the receiver module 103 use MMIC chips, among which the final power amplifier in the transmitter is soldered on the molybdenum-copper substrate with gold-tin, and the remaining chips are directly bonded to the cavity with conductive glue. The interconnection between MMIC chips and between MMIC chips and microstrip boards adopts gold wire bonding technology to improve integration and reduce component size.

[0068] The above is a detailed introduction to a broadband, highly integrated, integrated Ku-band microwave transceiver component provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A broadband, highly integrated, Ku-band microwave transceiver component. It is characterized in that include: case; A frequency source module, which is installed in the housing, and includes a transmitting intermediate frequency circuit, a transmitting local oscillator circuit, and a transmitting second local oscillator circuit; A transmitter module installed in the housing, wherein the transmitter module is configured to up-convert the output frequency of the transmitting intermediate frequency circuit and the output of the transmitting local oscillator circuit, and up-convert the obtained mixed output and the output of the transmitting second local oscillator circuit to obtain a Ku-band transmitting signal; A receiver module is installed in the housing, and is configured to obtain an intermediate frequency signal by mixing a received Ku-band reception signal with a reception local oscillator signal of the transmitter module.

2. The broadband highly integrated integrated Ku-band microwave transceiver assembly according to claim 1, It is characterized in that The frequency source module also includes: an oven controlled crystal oscillator configured to provide a reference clock; A first power divider, wherein an input end of the first power divider is electrically connected to an output end of the constant temperature crystal oscillator, and an output end of the first power divider is electrically connected to the transmitting intermediate frequency circuit; A second power divider, wherein an input end of the second power divider is electrically connected to the first power divider, and an output end of the second power divider is electrically connected to the transmitting local oscillator circuit and the transmitting second local oscillator circuit.

3. The broadband highly integrated Ku-band microwave transceiver assembly according to claim 2, It is characterized in that The transmitting intermediate frequency circuit includes a first attenuator, a first amplifier, a first phase-locked loop, a second amplifier, a clock driver, a DDS chip, and a balun which are electrically connected in sequence; The input end of the first attenuator is electrically connected to the output end of the first power divider.

4. The broadband highly integrated integrated Ku-band microwave transceiver assembly according to claim 3, It is characterized in that The transmitting intermediate frequency circuit also includes: a second attenuator electrically connected between the first phase-locked loop and the second amplifier; a third attenuator electrically connected to an output terminal of the second amplifier; a first filter electrically connected between the third attenuator and the clock driver; A second filter is electrically connected to the output terminal of the balun.

5. The broadband highly integrated integrated Ku-band microwave transceiver assembly according to claim 2, It is characterized in that The transmitting local oscillator circuit comprises a fourth attenuator, a third amplifier, a second phase-locked loop, and a fourth amplifier electrically connected in sequence; An input end of the fourth attenuator is connected to an output end of the second power divider.

6. The broadband highly integrated integrated Ku-band microwave transceiver assembly according to claim 5, It is characterized in that The transmitting local oscillator circuit also includes: a fifth attenuator electrically connected between the second phase-locked loop and the fourth amplifier; a third filter, wherein an input terminal of the third filter is electrically connected to an output terminal of the fourth amplifier; A sixth attenuator, wherein an input end of the sixth attenuator is electrically connected to an output end of the third filter.

7. The broadband highly integrated Ku-band microwave transceiver assembly according to claim 2, It is characterized in that The transmitting circuit comprises a seventh attenuator, a fifth amplifier, an eighth attenuator, a third phase-locked loop, and a fourth filter which are electrically connected in sequence; The input end of the seventh attenuator is connected to the output end of the second power divider.

8. The broadband highly integrated Ku-band microwave transceiver assembly according to claim 1, It is characterized in that The transmitter module includes a first mixing circuit, a second mixing circuit and a coupling circuit which are electrically connected in sequence. The first frequency mixing circuit comprises a sixth amplifier, a ninth attenuator, a fifth filter, a tenth attenuator and a first frequency mixer which are electrically connected in sequence; the input end of the sixth amplifier is electrically connected to the output end of the second filter in the transmitting intermediate frequency circuit; the first input end and the second input end of the first frequency mixer are electrically connected to the tenth attenuator and the output end of the sixth attenuator in the transmitting local oscillator circuit respectively, and the output end of the first frequency mixer is electrically connected to the second frequency mixing circuit; The second frequency mixing circuit comprises an eleventh attenuator, a sixth filter, a twelfth attenuator, a seventh amplifier, a first temperature compensation attenuator, a seventh filter, a thirteenth attenuator, and a second frequency mixer which are electrically connected in sequence; the input end of the eleventh attenuator is electrically connected to the output end of the first frequency mixer, the first input end and the second input end of the second frequency mixer are electrically connected to the thirteenth attenuator and the output end of the fourth filter in the second transmitting local oscillator circuit, respectively, and the output end of the second frequency mixer is electrically connected to the coupling circuit; The coupling circuit comprises a fourteenth attenuator, an eighth filter, an eighth amplifier, a fifteenth attenuator, a ninth filter, a ninth amplifier, a sixteenth attenuator, a third power divider, a seventeenth attenuator, a first switch, a first equalizer, a second switch, a seventeenth attenuator, a tenth amplifier, an eighteenth attenuator, a power amplifier, a coupler, and an isolator which are electrically connected in sequence; the input end of the fourteenth attenuator is electrically connected to the output end of the second mixer; The second output end of the coupler is electrically connected to the detector and the comparator in sequence.

9. The broadband highly integrated integrated Ku-band microwave transceiver assembly according to claim 8, It is characterized in that The receiver module comprises a first receiving circuit and a second receiving circuit which are electrically connected in sequence, wherein the first receiving circuit is configured to receive the Ku-band receiving signal, and the second receiving circuit is configured to receive the intermediate frequency signal; The first receiving circuit includes a limiter, a first low noise amplifier, a digitally controlled attenuator, a tenth filter, a nineteenth attenuator, a second low noise amplifier, an eleventh filter, a twentieth attenuator, a third mixer, a twenty-first attenuator, a twelfth filter, an eleventh amplifier, a twenty-second attenuator, a second temperature compensation attenuator, a twelfth amplifier, a twenty-third attenuator, and a thirteenth filter, which are electrically connected in sequence; The second receiving circuit includes a twenty-fourth attenuator, a thirteenth amplifier, and a fourteenth filter electrically connected in sequence, the input end of the twenty-fourth attenuator is electrically connected to the second output end of the third power divider, and the output end of the twenty-fourth attenuator is electrically connected to the second input end of the third mixer.

10. The broadband highly integrated Ku-band microwave transceiver assembly according to claim 1, It is characterized in that The shell includes an upper cavity and a lower cavity that are connected. The transmitting local oscillator circuit, the transmitting second local oscillator circuit, the transmitter module and the receiver module are installed in the upper cavity, and the transmitting intermediate frequency circuit is installed in the lower cavity.

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